ABS Chrome Plating MacuPlex Technical Package YWC V2.0

MacuPlex
Plating on Plastic Coatings

MacuPlex (Plating On Plastic Coatings) Technical Package Page 2
Contents
Section Description Pages

1.0 ABS Plastic Materials 5
2.0 Moulding Prior to Plating 6
3.0 Moulding Design Criteria 6
3.1 Nominal Wall Thickness 6
3.2 Ribs 6
3.3 Bosses 7
3.4 Radius 7
3.5 Appearance Design 7
4.0 Part Performance 8
4.1 Thermal Performance Requirements 8
4.2 Electrolytic Distribution 10
5.0 Moulding Design Considerations 11
5.1 Moulding Considerations 12
5.2 Surface Composition Requirements 12
5.3 Internal Moulding Conditions 12
5.4 Water Cooling 13
6.0 Equipment Selection 13
6.1 Drying 14
6.2 Process Controls 14
6.3 Fill Speed/Injection Speed 15
6.4 Handling of Moulded Plastic Parts For Plating 15
6.5 Checking For Moulded in Stress 16
7.0 Moulding For Plating Considerations and Effects 18
8.0 Mould Release Agents and Fillers 19
9.0 Quality Control of Mouldings 20
9.1 Glacial Acetic Acid Test For ABS 21
9.2 Red Dye Stress Test For PC/ABS Mouldings 23
9.3 Test For Trapped Moisture in ABS Mouldings 25
10.0 ABS Plastic Quick Guide 26
11.0 Plating Resist 27
12.0 Electroplating Rack Design 28
12.1 Part Contact 28
12.2 Rack Contacts 30
12.3 Rack Conditioning 31
12.4 Rack Stripping Solutions 31
13.0 MacuPlex The Chemistry 34
13.1 Pre-Treatment Stages 35
14.0 ABS Plating 36
14.1 An Introduction 36
MacDermid plc, Palmer Street, Bordesley, Birmingham B9 4EU

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Contents

15.0 ABS Pre-Treatment 37
15.1 Pre-Etching and Etching 37
15.2 Catalysing or Activating 41
15.3 Metallising 43
15.4 Simple Rules For Plating on Plastic 43
16.0 Rinsing 44
17.0 Agitation 45
18.0 Filtration 46
19.0 ABS and ABS/PC Processing 47
19.1 ABS/PC Pre-Etch (PC>50%) 47
19.2 ABS Pre-Etch 47
20.0 Chromic Acid Etch 48
20.1 Electrolytic Regeneration of MacuPlex Chrome 50
Etchants
20.2 Electrolytic Regeneration Process 50
20.3 Electrolytic Requirements 50
20.4 Equipment 50
20.5 Conversion Data 52
20.6 Sample Calculation 52
20.7 Typical Layout for Single Pot System 53
20.8 Typical Layout for Multi Pot System 54
20.9 Etch Rate Determination on ABS Materials 56
21.0 Neutraliser 57
22.0 Pre-Catalyst Conditioners 58
23.0 Catalyst Pre-Dip and Catalyst 59
24.0 Palladium Catalyst 60
25.0 Accelerator 61
25.1 Contaminant Limitations 62
26.0 Metallisation 63
26.1 Ammoniacal EN Technology 63
26.2 Non-Ammonia EN Technology 64
26.3 Fully Compliant EN Technology 65
26.4 Electroless Copper Technology 67

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Contents

27.0 Troubleshooting Pre-Treatment Systems 69
27.1 Chromic Acid Etchant 69
27.2 Neutralisers 71
27.3 Conditioners 72
27.4 Catalysts 73
27.5 Accelerators 74
27.6 Electroless Nickel 75
27.7 Electroless Copper 76
28.0 Summary of Problem Areas 77
29.0 Locating Roughness on Pre-Treatment System 79
30.0 Test For Airborne Chrome 82
31.0 MacuPlex Infinity 83
31.1 Ionic Activation System 83
31.2 Ionic Activation Process Cycle 84
31.3 Chromic Acid Etch 85
31.4 Palladium Catalyst 87
31.5 Reducer 88
31.6 Electroless Nickel 89
32.0 Rinsing 93
33.0 Air Agitation 93
34.0 Filtration 94
35.0 Ionic Activation Troubleshooting 95
36.0 Ionic Reducer Troubleshooting 96

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1.0 ABS Plastic Materials
Product Manufacturer Material
Cycolac 1000 General Electric Plastics ABS

Triax Montsanto/Bayer ABS
Novodur P2 MC/P3 MC natural Bayer AG ABS
Lustran PG Type Monsanto ABS
Ronfalin CP 55 DSM (Holland) ABS
Stapron DSM (Holland) ABS
Stylac Asahi (Japan) ABS
Starrex Cheil Ind (Germany) ABS
Lucky RP 211 (Coloured) Standard Polymers (USA) ABS
Lucky MP 100 Standard Polymers (Korea) ABS
Lustran 1455 Monsanto / Bayer ABS
MP 211 LG Chemicals ABS
Sincral M 12 G Eni Chem (Italy) ABS
Terluran (Natural & Coloured) BASF (Germany) ABS
LP 299 Shulman (France) ABS
Techno A.S. 15 (Australian) ABS
Polylac 727 Chi Mei Ind (Taiwan) ABS
Martog E.P.C. 350 (Australian) ABS
JSR 21 (Japan) ABS
Cycoloy General Electric Plastics ABS
Bayblend T-45 733 Bayer AG (Germany) ABS/PC
Bayblend T-45 Mn Bayer AG (Germany) ABS/PC
Bayblend KU 235800 Bayer AG (Germany) ABS/PC
Bayblend T-45 natural Bayer AG (Germany) ABS/PC
Faradex DSM (holland) ABS/PC
Novodur P2 MC 719 Bayer AG (Germany) ABS
Lustran PG 299 Monsanto / Bayer AG ABS

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2.0 Moulding Prior To Plating
The quality of mouldings for plating is one of the most important factors of the
process. Poor mouldings give poor results.
ABS is a rigid copolymer containing distinct globules of butadiene. In the

moulding process it is vital that the butadiene is of the correct size and
distribution at the surface of the plastic. This surface should have minimum
moulded in stress. In large scale production at least 50% of all problems
associated with the plating of ABS can be attributed to either design or
operational moulding faults.
3.0 Moulding Design Criteria

3.1 Nominal Wall Thickness
The ideal plastic moulding for electroplating would have all cross sectional
dimensions that are completely uniform. However these mouldings very rarely
exist and the aim of the designer should then be to produce a component with
the minimum of variations.
It is preferable for the nominal wall thickness to be in the range of, 2.3
3.0mm. Because of problems related to uneven cooling in the mould cavity
and the tendency of heavier parts to exhibit sink marks, (dips in the surface of
the moulded parts) maximum wall thicknesses should not exceed 3.8mm.
Large wall thickness changes should be avoided wherever possible, as the

uneven cooling during the moulding process will cause shrinkage and warping
of the parts. If wall thickness changes are unavoidable then the transition
between the two areas should if possible be graduated rather than stepped.
As part of the mould design consideration, where there are to be changes in

mould wall thickness the part should fill in the moulding cycle from the heavier
(thicker) section, to the thinner section. If the mould were to be filled from the
thinner section, stresses and material orientation problems would occur.
3.2 Ribs
In the creation of plastic mouldings, designers sometimes feel that in order to

increase the strength of the component they should increase the whole cross
sectional area of the moulding. These large weight to surface area ratios
should be avoided as denser parts tend to exhibit problems associated with
mould shrinkage leading to thermal cycle failure.

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A successful method of gaining strength and rigidity in mouldings without

drastically increasing the weight of plastic is to introduce ribs into the mould
design. Simple strengthening ribs are generally linear wall projections from
adjacent plane surfaces. Interconnecting ribs are also utilised to prevent
bowing or warping of large plane surfaces.
Ribs are also used extensively in the design of bosses to allow minimum boss
wall thickness, without sacrificing strength.
3.3 Bosses
Bosses are projections from the part surface, which provide some form of
attachment or support for related components. They may be used for screw
attachments, inserts or rivet attachments, for locating two mating parts or
simply to reinforce a hole.
Bosses may be hollow or solid. Sometimes the solid bosses are also referred
to as studs.
3.4 Radius
The radii at both external and internal plane intersections should be as

generous as possible to improve the flow of the moulding material, and to
lessen the chance of serious stress concentration when the part is under load.
A minimum radius of 1mm external and 0.5mm internal is recommended for

all plane intersections. Internal radii are sometimes known as fillets.
3.5 Appearance Design
The aesthetic appearance and therefore saleability of the plated plastic part is
often one of the most important aspects in the designers mind. Bright
chromium electroplate tends to highlight surface defects and therefore efforts
should be made to design parts which avoid these possibilities.
A slight surface crown of 0.010 0.015 cm/cm is recommended over broad

surface areas to reduce the field of focus and hide surface imperfections that
would otherwise be visible. If it is not possible, the designer should consider
whether that area of the part could have a textured surface.
Without the use of these gently curved, convex surfaces, radiused angles, and
a minimum of protuberances, the appearance will suffer. Sharp corners may
cause plate build up and burnt deposits on edges and extreme points. Deep
recesses will not chrome plate without the use of special anodes.

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Gating (injection points), mould part lines and vents should always be located
in non-critical areas so as to avoid visual effects that might detract from the
appearance/quality of the part.
Possible sink marks should be avoided by using properly calculated ribs and
bosses in ratio to the wall thickness.
4.0 Part Performance
It should be remembered that during the electroplating process parts designed

with sharp edges may build up heavily causing them not to fit or mate properly
with other components when assembled. Whenever possible the designer
should make recesses in components twice as wide as they are deep. The
reason for this is that most components require a minimum thickness of
electrodeposit, and in order to achieve that minimum figure in deep recesses
prominent surfaces require extremely thick plated deposits. One of the
consequences of trying to meet this minimum figure is that heavier deposits
tend to be more brittle, which could result in inferior thermal cycle
performance.
This problem is one of those most often encountered and therefore

consideration should always be given to electroplating current densities and
resulting plate thicknesses. If the problem cannot be designed out then the
minimum thickness in recesses may have to be disregarded and other points
used for quality control. The consequence of this action would be that the
bottom of the recess would be underplated and subject to premature corrosion
failure. It should also be noted that in many cases the recess areas trap
moisture and corrosive solutions and therefore provide further potential for
corrosion failure.
It should always be remembered that corrosion performance in accelerated

testing and actual service is a direct function of plate composition and
thickness.
4.1 Thermal Performance Requirements
It is a pre-requisite of automotive finishing for plating on plastics that

components should pass thermo cycling tests. These are typically carried out
over three or more complete cycles at temperatures ranging from +80C
through ambient to -40C. Times, actual temperatures, number of cycles and
failure information is normally specific to each of the manufacturers.

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Apart from the area of electroplate distribution there are several other major
factors which have an effect on the thermal performance of components.
These include part geometry, resin characteristics, moulding techniques, pre-
treatment processing and electrodeposit composition. The latter of which
will also determine how the finished part will respond to severe temperature
extremes.
Part geometry has a very profound effect on thermal performance.

Characteristics that have proven difficult in passing thermal cycle
requirements include:
Solid plastic, extremely thick cross sections or heavy mass-to-surface area

ratios. This is normally overcome by coring out the part and making thinner
walls.
Closed ring design. This method does not allow the plastic to deflect during
thermal expansion. This is more critical on larger parts.
The intersection of ribs on the same plane is not recommended. Lowering

one rib section by as little as 1.6mm greatly reduces turbulence in moulding,
thus reducing stress and improving metal to plastic adhesion.
Resin characteristics have a major effect on thermal performance. As a

generalisation plastics exhibit a much higher coefficient of thermal expansion
than the metals used to plate the plastic. This phenomenon creates very high
stresses at the plastic to metal interface during thermal expansion and
contraction. The higher the stress the greater the thickness of copper is
required to stabilise the expansion/contraction characteristics of the
deposit/substrate. Therefore all aspects of the production of the parts
including cost, have to be taken into consideration when designing for plating.
Moulding techniques affect thermal performance. Gating, runner systems and

venting all have to be correctly designed into the part so as to give favourable
aesthetic and thermal performance. Just as important are the moulding
parameters. The moulding resin must be dry, the melt temperature, pressure
and cycle time must all be optimised to enhance the thermal performance of
the parts.
The use of the correctly controlled pre-treatment system will also have a great
effect on the performance of the plated components. Variations in the
chemistry or methods of application, all have an effect on the adhesion
characteristic of the electrodeposited coating.
The composition of the electroplated deposit and the quality of the deposited
material will also affect the thermal performance of the part. Plastics, as

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stated earlier have a higher coefficient of expansion than the metal deposits.
The most widely used systems today utilise copper, one or more types of
nickel and chromium. When all coatings are applied correctly, the bright acid
copper provides a very ductile deposit to act as a shock absorber, the semi-
bright nickel (if used) is semi-ductile which acts as a lesser buffer to thermal
shock, the bright nickel less ductile than the semi-bright and the chromium
deposit is brittle and highly stressed.
This system is used because the less ductile nickel and chrome deposits
would by themselves perform very poorly in thermal cycle performance. The
application of the ductile acid copper deposit provides a more flexible shock
absorber during thermal expansion and contraction. This is its main function.
4.2 Electroplate Distribution
The main control for electroplate distribution is at the design stage, some of
the design criteria, have already been discussed.
Selective plating is also another means of controlling electroplate distribution.

The simplest method uses the application of an acid resistant paint to areas of
the part that do not need an electroplated coating, prior to the electroplating
process.
The use of a stop-off or resist paint in recessed or low current density areas of
a part is another way eliminating the problems of meeting the minimum plate
thicknesses in those areas. This method is used extensively in the production
of automotive plastic trim.
To meet the protection requirements the stop-off is usually given a top coat of
paint after the electroplating process.
Stop-offs or plating resists are normally applied by conventional spray, dip or

brush techniques.
Care must be taken at the design stage to ensure that the application of a
stop-off is applied in a low current density area at a point where any
electroplate build ups will not interfere from the parts assembly or
appearance.
The use of auxiliary anodes to enhance the thickness of the electrodeposit in

recessed areas can also be used. This allows the designer a little more
freedom but at the expense of fitting the anodes in production.

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5.0 Moulding Design Considerations
z Integral parts should be used to avoid welded joints
z Gates should be put in non-appearance areas and should be 50% larger

than for conventional mouldings
z Ribs and bosses should be designed to eliminate sink marks
z Texturing can be used to break up large flat surfaces and hide any defects
such as scratches
z Draft angles should be at least 1 for easy removal from the mould
(preferably 3)
z Parting lines should be put in non-significant areas if possible
z Close tolerant fits must include the final electroplate thickness

requirement in the part design
z Wall thickness should be as thick as possible for rigidity and adhesion

(minimum 1.5 mm)
z Plate uniformity, as a result of high and low current densities must be

considered in the initial design
z The designer should take into account and be aware of:
V grooves
90 angles
Keep lettering as low profile as possible
Make angles as large as practical
z Consideration should also be given to blind recess rack contact areas

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5.1 Moulding Considerations
The surface of a moulding, which is to be plated in a decorative finish, i.e.

bright chromium must be free of any surface defects. Weld lines, sinks, dull
poorly packed areas, flash, gas burns etc. will all show evidence in bright
reflective plate. Parts to be plated with satin or Velours nickel do not require
the same degree of surface finish.
5.2 Surface Composition Requirements
In order to obtain the required mechanical bond between the ABS and the
electroplated metal, the plastic surface must represent a uniform composition
of the two or more components, which are present in a plating grade plastic.
With ABS, the acrylonitrile-styrene and butadiene-styrene are uniformly mixed
and cross linked in such a way that the surface should always contain a fairly
good mix. ABS however also contains varying amounts of pigments, flow
agents, anti-oxidents and other ingredients which, when the plastic is
subjected to high temperatures and high sheer rates in the moulding
operation, may cause a separation of components in such a way that the
finished moulded surface is not uniformly constituted. This will often result in
hard to etch edges at the last to fill areas of the mould. Correct venting of the
mould is extremely important as well as a slow fill speed as these will help to
reduce some of the surface variations.
ABS is also available in flame retardant grades, and while some are plateable,
they always suffer from lower adhesion values than the non-retardant grades.
Surface problems also occur in moulding from film build up on the mould
faces.
5.3 Internal Moulding Conditions
Whilst visually the surface of a moulding is very important, the inside of the
component also has to perform. Most plated parts must perform some other
function other than being aesthetic. They may have to mate with other parts
and therefore will have to be moulded and plated to tolerances.
When moulds are constructed they may not meet the dimensional
requirements of the component due to shrink rate of the grade of the polymer
used. Therefore the moulding parameters are often adjusted to control the
dimensional variation. This can cause problems when the part is plated. The
reason for this is that when it is necessary to increase the size of a moulding
i.e. minimise the shrink rate, the part will require over packing. This is often
achieved by using a fast fill rate and relatively cool barrel temperatures. This
over packing forces stress into the part and two things happen in and after
plating.

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First, a cold melt and fast fill speed will create a hard glossy surface which will
result in lower plate adhesion, as low as 10% of that achievable with good
moulding practice. Second, the moulded in stress will begin to relax when the
part is being processed through hot process solutions. This relaxation may
cause blisters or loss of adhesion during the plating sequence or in post
plating thermal cycling of the part. If parts are moulded to a smaller size
(under packed) they may not suffer from moulded in stress, but are likely to
suffer from sinks or a non-fill condition.
5.4 Water Cooling
Moulds are manufactured with cores for the circulation of water to provide the
necessary control of mould temperature. Exact mould temperature control is
essential to impart uniform cooling and to minimise stresses within the part.
The size and location of the water lines should be carefully considered. Water
lines set too close to the surface of the mould can result in hot and cold spots
due to the low coefficient of heat transfer. Each of the cores should be
spaced equally with separate inlets and outlets for each cavity and core.
Zone heating and cooling of large areas, have been successfully used to
obtain even flow and reduce moulded in strains. When planning this type of
mould the core lines are drilled vertically with no cross sections.
The sprue area is normally maintained at a higher temperature than the

outside of the part so that the material will remain warm. This will allow the
part to be filled with reduced injection pressure. However, cycle times
become a consideration if this area is kept too warm. Mould temperature can
affect the adhesion on the plated part. Therefore, if adhesion is critical on a
given part, the mould temperature should be optimised by trial and error,
using experience and adhesion or thermal cycle tests as the test criteria.
6.0 Equipment Selection
General purpose ABS resins have been found to be the simplest to mould and
plate and are therefore the most common polymer used. The best type of
moulding equipment for this polymer is the reciprocating screw machine,
which if kept in good repair will achieve mouldings capable of giving about a
60% improvement in the metal to plastic adhesion over that of parts moulded
in the alternative ram machine. Of course these figures take into account the
process solutions being used at optimum conditions for each type of
moulding. It has been noted that the difference in adhesion performance can

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be as great as 170% when screw injection methods are properly developed

over those of the ram machine.
6.1 Drying
ABS and other polymers are well known for their ability to absorb moisture
from the atmosphere. This moisture if not removed before moulding will
cause many problems.
If not removed the moisture is converted into steam, which is compressed and
forced into the part, normally just under the surface of the moulding, forming
as bubbles. At the surface of the moulding these bubbles may form blisters or
teardrop shaped splay marks. The first indication of these phenomena is
usually just after electroplating where heating during processing has
expanded the trapped moisture, forcing it in the only possible direction, to the
surface of the mould. Moisture held a little further under the skin of the
polymer may become evident as blisters during thermal cycle testing. In both
cases it is possible to misinterpret the defects as plating blisters.
Dehumidifying hopper dryers are recommended where the ABS polymer can
be held at 80-85C, for 2-4 hours before being used. Hopper dryers are
available which have sensing devices, which ensure that the hoppers are
maintained full, allowing enough time for the polymer to dry out before use. It
is also recommended that moisture alarms should be fitted to the hopper
dryers.
6.2 Process Controls
Consistent repeatable mouldings require control and precision in monitoring

and maintaining the temperature of the mould. Therefore properly sized
mould heaters and coolers are a prerequisite for quality.
When starting to mould a new polymer, it is advisable to follow the

recommendations of the supplier with regard to the temperatures, pressure
and cycle time, at least as a starting point.
All heating zones on the plating machine should be controlled by pyrometers

and the indicated temperatures of these recorded at regular intervals.
Temperatures should be controlled on both sides of the mould cavity, using
temperature control units with indicating pyrometers.
The temperature of the plastic melt has a very high influence on the metal to
plastic adhesion in the finished plated part. In moulding, the temperature of
the melt should be such that the mould will fill easily under slow injection
speed conditions, producing a stress free part.

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Low melt temperatures demand higher injection moulding pressures together

with high fill speeds and should be avoided. The polymer suppliers
recommendations for the melt temperature for each grade of material should
be consulted before moulding begins. It is normal to use the higher end of the
melt temperature range as a starting point, whilst taking care not to degrade
or burn the resin.
All of the pressure settings, such as clamp, injection, hold and ejection should
be controlled. It is important to control the fill time, which is governed by the
injection pressure, as this is the most important single constant when
moulding for plating. Any variations in the melt temperature or mould
temperature will also affect the fill time. (The fill time is the time measured by
stopwatch, from when the plunger or screw starts to move forward, until it
stops).
6.3 Fill Speed / Injection Speed
As stated previously this is the single most important aspect of moulding high
quality components for plating. Fast fill rates normally induce high stress
levels within the moulded components. These parts when electroplated will
not have satisfactory adhesion and so not meet thermal cycle requirements.
In order to obtain the highest quality mouldings the fill speed should be as
slow as possible in order to produce mouldings with the lowest possible
moulded in stress.
The optimum fill speed will depend on part size and stock temperature being
used. As a general rule, the average fill time required for plating should be
twice that for parts of the same size that do not require plating. Any additional
time for fill speed would be beneficial in obtaining maximum adhesion from the
plated parts.
6.4 Handling of Moulded Plastic Parts For Plating
After moulding the components carry a static charge. It is important that they
are protected from attracting dust particles. The surface if contaminated may
not release these particles even during the pre-treatment process. This in
turn may cause a background haze or speckle to be evident after the
electroplating process.
It is also imperative that the newly moulded components are handled in a

clean and careful way, since any less may create surface damage and
subsequent reject parts. The slightest blemish on the surface of a moulding is

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very often magnified during the electroplating process and so rejected. It is

advisable that operators wear clean cotton gloves whenever handling the
polymer mouldings prior to plating. Fingerprints and machine lubricants leave
films that may still be visible through the electroplated finish, or worse cause
skip plate to occur, especially if there is no pre-cleaning system in the early
process stages.
It is possible that the components may become contaminated by greases or

oils in and around the moulding machines, particularly in moulds that have
moving parts. Mould release agents should never be used when moulding
parts for plating. The importance of avoiding oils and mould release agents,
(especially silicone based sprays) cannot be emphasised too highly when
moulding for plating, even to the possibility of airborne contamination from
sprays used some distance away from the moulding machine.
The degating of parts requires particular attention, especially not to leave

surface defects. With some components it is normal to leave the runners
intact on the component to provide a means of racking during the
electroplating process.
The newly moulded components should on extraction from the mould cavity
be adequately protected from damage by scuffing or scratching. Tissue
paper, cellophane, or polyethylene bags are satisfactory for individual
wrapping. Where polyethylene bags are used, the parts should be adequately
cooled before packing. Compartmented containers each holding an individual
component will ensure safe transportation both to and from the plating shop.
6.5 Checking For Moulded in Stress
There are several chemical immersion tests for moulded in stress. There are
two simple immersion tests that can be used to give a subjective indication of
the degree of moulded in stress.
The glacial acetic acid test is a useful method of testing the quality of ABS
mouldings for stress and surface uniformity. If after testing the ABS
mouldings crack, this is an indication of very high stress levels. Cracking will
often converge on gate areas and through other high stress areas such as
sharp corners and abrupt changes in mould wall thickness. The severity and
location of the cracks can be used by the moulder to improve his
manufacturing techniques.
The second test involves using a dye containing solvent which is absorbed
into the ABS at different rates dependent upon the stress levels at the surface
of the moulding. The variations of colour intensity on the surface of the
moulding after the test indicate the potential levels of stress.

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Parts with high stress levels are more prone to distort during processing
through hot solutions. They are also more likely to fail in thermal cycle testing,
because the moulded in stresses will relax, causing a greater movement in
the plastic, which in turn puts greater stress on the metal to plastic bond.
These tests also give an indication of the distribution of the butadiene over the
surface of the component. Uniform whitening or dyeing of the surface of the
moulding is an indication of a good moulding. Poor mouldings will have heavy
white or dyed areas and dark shiny areas on the same part, these surface
variations can lead to both over and under etched areas on the same
moulding.

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7.0 Moulding For Plating Considerations and Effects
z Use a reciprocating screw moulding machine
z Proper Drying of Resin
ABS pellet must be pre-dried for 2 - 4 Hrs at 80 - 85C immediately

before moulding. Moisture in the resin can cause splay or
delamination on the part that may result in a blister
z Proper Fill Speeds
Small components up to 90gm 5 7 seconds

Larger components up to 25 seconds
Too fast a fill speed can over pack a mould thus making it harder to
etch which will result in poor adhesion of the electrodeposit.
z Proper Melt Temperature 245 - 270C
Too cold a melt temperature causes internal stress to increase and

become incorporated in the part leading to uneven etching of the
substrate and thermal cycling test failure. Too hot a melt may cause
the plastic material to degrade and thus give poor adhesion
z Proper Mould Temperature 65 - 68C
Too cold a mould temperature will cause the plastic to skin, i.e. the
first material to hit the mould wall hardens and the hot material under it
flows creating a surface skin effect that may cause delamination
z Proper Cooling Time
Longer cooling times promote the dissipation of internal stresses
z Highly Polished Mould
Poor mould surfaces can cause defects in the moulded part, such
as pits. These show up in the final plate and cause rejects

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8.0 Mould Release Agents and Fillers
Silicone type mould release agents should not be used. These compounds
are extremely difficult to remove and usually lead to adhesion failures
(blisters) or skip plate. Silicones interfere with the function of the etching
process. Moulders of plastics for plating do not generally use mould release
chemicals, if it is necessary to use a mould release, then a stearate or soap
type material should be used sparingly.
In some cases, fillers are added to plastics for increasing strength such as
glass fibre, fire retardants (antimony trioxide (Sb2O3) or organic phosphate)
or to impart colour (carbon black, titanium dioxide, TiO2). These additives
may require extra process control in the metallization processes and may
result in a poorer grade of surface finish.
For example, glass fibres will usually result in a rougher surface to the finished
part. Some fire retardants can diffuse to the surface during etching leaving a
film that is difficult to wash off and cause adhesion failures. If this non
adherent layer can be recognised and removed good adhesion may be
obtained. When colorants are etched from the plastic substrate they are
normally retained as suspended as particles in the various process solutions.
However once a critical concentration has been reached, shelf roughness i.e.
star dusting will occur on the processed components.
Other fillers such as calcium carbonate (CaCO3) are added for ease of
etching of a difficult plastic. These fillers are preferentially etched out of the
surface to create the bonding sites required for good adhesion. Large
particles or pools of filler can create poor surface appearance. Here the
appearance of the final electroplated coating may take on an orange peel
effect. It is normal when processing these materials that the customer is
willing to accept a slightly lower standard providing the adhesion of the
electrodeposit is satisfactory.

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9.0 Quality Control of Mouldings

Whilst some defects may be obvious, others are not; moulded in strain,
entrapped water and micro-pits are some of the more troublesome, less
obvious defects.
The following tests may give an indication of faults in mouldings prior to

plating
z Acetic Acid Test
Incorrect moulding practise can cause high internal stress which can
seriously affect the moulded component during plating. Glacial acetic acid
testing in accordance with ASEP TP-203 will give an indication as to the
quality of the ABS moulding.
z Red Dye Test for PC/ABS Mouldings
This is an alternative test to evaluate the surface of the moulded

components. As with the glacial acetic acid test the interpretation of the
test results should be taken as an indicator rather than a guarantee that
components will not process satisfactorily.
z Oven Test
Moulded samples may be placed in an oven at a temperature of 905C

for up to one hour. Deformation of the part must be related to plated part
performance.
z Test for Occluded Water
Immersion in boiling water for one hour is a useful test for detecting
entrapped moisture. However the small blisters raised by this test will
never be as severe as water blisters produced during the conditioning and
plating process.

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9.1 Glacial Acetic Acid Test For ABS (ASEP TP-203)
Aim
This test method is for evaluating raw ABS mouldings for surface stress,
rubber dispersion in the surface, and internal stress.
This is not a quantitative test and should be used only for identifying and
correcting potentially serious stress or rubber distribution problems in raw
ABS mouldings.
Apparatus
A glass or plastic container large enough to completely immerse the part to be

tested.
A thermometer for checking temperature of the acid.
Reagents
Anhydrous, reagent grade glacial acetic acid.
The acid should be stored in a sealed container to prevent moisture

absorption from the air.
DO NOT contaminate the acid with water. Do not dip wet parts in the acid.
Once the acid is contaminated with water the test will not work.
Procedure
1. Totally immerse the part to be tested in concentrated glacial acetic acid at

24C + 3C for 30 seconds.
2. Immediately rinse the part in running water to remove the acetic acid, and
allow it to dry at room temperature. Do not wipe or hot air dry!
3. Evaluate the part for surface stress and rubber distribution.
4. After making sure that the part is dry, totally immerse the part again in the
concentrated glacial acetic acid at 24C + 3C for 2 minutes.
5. Immediately rinse the part in running water to remove the acetic acid, and
allow it to dry at room temperature. Again do not wipe or hot air dry!
6. Evaluate the part for internal stress.

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Interpretation
z Surface stress is indicated after the first acid immersion by small dense
patterns appearing on the part surface. The more prevalent and dense the
pattern, the higher the stress.
z Rubber distribution in the surface is indicated by the variation in colour on

the surface of the part. Poor mouldings will have heavy, white areas and
dark, shiny areas on the same part, indicating non-uniform dispersion of
the rubber phase. On an ideal moulding, some surface whitening will
occur uniformly over the part.
z Cracking entirely through the thickness of the plastic after the second
immersion is an indication of very high internal stress in the part. Again,
the severity of the cracking indicates the severity of the stress.
Reporting
z The report should include the manufacturer of the ABS, the grade, the
batch number, and the moulding conditions.
z The report should identify the degree of colour variation and cracking and
the locations of these areas on the part.

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9.2 Red Dye Stress Test For PC/ABS Mouldings
Aim
This test method is for evaluating raw ABS mouldings for surface stress,
rubber dispersion in the surface, and internal stress.
This is not a quantitative test and should be used only for identifying and
correcting potentially serious stress or rubber distribution problems in raw
ABS mouldings.
Equipment
Nalgene tank or other suitably resistant material
Safety equipment , glasses/goggles, gloves
Solution Make Up
Isopropanol 750mL/L
Acetone 250mL/L
Ceres Red 3R Dye 0.08g/L
Procedure
Immerse part in the red dye solution for the appropriate amount of time,
typically between 5 and 10 minutes dependent on material.
Immediately rinse part in running water to remove excess dye and blow part
dry using cool air.
Interpretation
Pink or reddish colouration variations are an indication of surface stress.

If the colour change is minimal the part may not be etched or the test material
may require changing.
If the variation in colour change across the surface of the component is
extensive the degree of etching may also mirror this change and the
subsequent adhesion of the electrodeposit may be compromised due to the
variation in stress of the base material and its ability to be evenly etched.

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Reporting
The report should include the manufacturer of the ABS, the grade, the batch
number, and the moulding conditions.
The report should identify the degree, depth and location of colour variation on
the components.

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9.3 Test For Trapped Moisture in ABS Mouldings
ABS granules should be dried for an absolute minimum of 2 hours at 82 -

85C before moulding. Failure to do so will allow moisture to become trapped
in the moulded components. If moisture is trapped it will normally lie just
beneath the surface of the moulding. The trapped water then erupts as a
blister during the plating process.
When blisters are evident on plated components, there are two courses of
investigation.
Cut and peel back the blister. Examine the underside of the blister to see
where it originates. If at the plastic, check the underside of the coating for
delaminated plastic. Check the surface of the plastic for divots, (depressions
in the moulded components surface, delamination).
If moisture is suspected, take some fresh mouldings and place in boiling water
for one hour. During this time it is normal for most ABS mouldings to deform
with the heat from the boiling water. After one hour, remove the mouldings
from the water and examine the surface of the components for areas of plastic
which have blistered or delaminated from the surface of the components.

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10.0 ABS Plastic Quick Guide
10.1 Resins
ABS - TERPOLYMER
A. Acrylonitrile
B. Butadiene
S. Styrene
EHA - ABS plus polycarbonate (up to 40%)
BAYBLEND - ABS plus polycarbonate (45%)
PC/ABS - Polycarbonate (between 40-80%) remainder ABS
10.2 Defects
z Blisters - Moisture or gas entrapment, heat splay,

contaminant or contaminated regrind, silicon
type mould release.
z Adhesion Failure - Silicon type mould release, stress.
ABS Stress Test - Acetic acid immersion for 1-3 minutes
A. Cracking or breaking - highly stressed area

B. Exfoliation of plastic - indicated skinning or
delamination.
C. White discoloration - improper molecular
alignment which indicates a stressed area.
z Skip Plate - Silicon type mould release.
z Pitting - Surface defect from mould or use of >6% regrind

material. Regrind is the use of scrap or previously
used ABS material.
z Roughness - Surface defect from mould, ABS dust, shop dirt or

impurities in regrind.
z Burning or Treeing - Flashing or poor trim on mouldings.
If a defect is present in a moulding, it will be present and magnified after

plating.

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11.0 Plating Resist
Resist paints are used to mask areas of the moulding which do not require
plating. The reasons for this may be economic e.g. large components where
the backs of the components are not important. It may be design
requirements such as electroplated frames with painted backgrounds. Or it
may be a physical requirement where stresses imparted from the
electrodeposited coatings could cause warping of the components after
processing.
The methods by which these resist paints work are twofold. Both methods rely
on the resist paint holding enough hexavalent chromium in the coating to be
released as a poison during the catalytic/activation process. The first method
is where the resist material contains a certain amount of hexavalent chromium
which is applied as part of the resist process. The second is where the applied
resist material absorbs some of the hexavalent chromium during the etching
process.
The two types of resist paint used in processing plastic are known as:
Active - Has chrome mixed with resin.
Passive - Resin absorbs chrome from etch.
Problems Associated With Both Methods
Overplate - Low paint thickness, neutralised chrome in

the resist
Skips or Voids - Overspray, bleed out, poor quality resist paint with high
absorption of chromium.

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12.0 Electroplating Rack Design

12.1 Part Contact
When designing plating racks several things must be taken into consideration.
First and most importantly the initial current is only carried through the initial
thin surface layer of metal normally using stainless steel rack tips. The tension
required to hold the components may result in the plastic being distorted and
intricate design may be required and customised racking to obtain the best
deposit, hence the number, type and position of rack contacts are very
important. In general, 25% more contacts are required for plating ABS than
for conventional metal plating. This does not take into account those
components that are difficult to secure with evenly spaced contacts. When
processing this type of part extra press or point contacts might be used in
non-critical areas, thicker electroless metal deposition may be required or the
composition of the electroless deposit might have to be modified in order to
avoid burn off.
Sq Decimetres of Component No. of Contacts Required

0 2.32 1
1.55 4.65 2
4.65 9.29 4
6.97 18.28 6
13.94 27.87 8
23.23 37.16 12
27.87 55.74 16
Other general rules for ensuring good contact are as follows:
z Contact should be made in medium to low current density areas.
z The contacts should be sloped back to the frame to prevent dripping onto
parts below.
z The contact tip should be made from stainless steel, titanium, or phosphor
bronze stainless steel or titanium combination.

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z The contacts should not lose tension after repeated loading.
z The contacts should not shade a significant area of the part.
z The contacts should not come out of adjustment after repeated loading.
z The contacts should be relatively easy for the operator to load.
z Use enough contacts to carry the current, even if one is lost as a current
source.
z Spring contacts should be designed with a sufficient radius on bends to

prevent weakening and fracturing of the spring.
z Spring contacts should be designed so that the bend closes when flexing
and should allow for adjustment of contacts whilst in service.
z Orient sharp points and corners of the parts to the centre of the rack.
z Areas of the part where contact is made must be properly supported to

avoid part distortion.
z Avoid placing a contact in a blind hole or deep recess as burn-off or skip

plate may occur.
z Rounded point contacts should be used where possible instead of flat

contacts to avoid skip plating from poor rinsing.
z Contacts should not be placed on high quality surfaces due to the

possibility of misplating or discolouration in the contact area.
z All contacts must be free of plastisol and primer in the area where they will
contact the part. If the contact areas are not clean, bipolar skipping or
chrome bleed out can occur.
After each plating cycle, the build up of electroplated metal on the jig contacts
should be removed to avoid nodular build up, and maintain good electrical
contact.

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12.2 Rack Coatings
The normal rack coating used in the manufacture of plating racks is Plastisol.
This material serves four purposes:
1. To protect the rack members from the corrosive plating solutions.
2. To inhibit plating of the rack by the pre-plate system.
3. To eliminate plating of the rack by electroplating solutions.
4. To insulate the contact tips to prevent robbing of current from the part at
the point of contact.
Improper coating selection will lead to either deterioration of the rack or over
plating of the rack coating, usually resulting in the loss of ability to chromium
plate parts effectively.
Even using Plastisol as a coating, it requires proper application otherwise the

effects will be:
A too hard coating will become brittle and crack in a short period of time
becoming ineffective against cross contamination of process solutions
resulting in potential over plate of the rack coating.
A too soft coating will become porous and drag solutions from one tank to
another.
The manner in which the control of rack plating is carried out involves five
steps in the preplate system. The best combination of time, temperature and
concentration must be determined for each of these steps in order to control
rack plating.
1. Retention of chromium in the rack occurs in the etching process,

hexavalent chromium poisons the electroless reaction, thus preventing
metal deposition.
2. Neutralisation of the excess hexavalent chromium occurs without removal

of the chromic acid absorbed in the rack coating.
3. Immersion in the catalyst (activator) solution must be controlled to ensure

proper absorption in the plastic, without catalytic absorption in the rack
coating.

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4. Immersion in the accelerator must be controlled to remove excess catalytic

material from the plastic and to remove any catalytic material from the
outer skin of the rack coating.
5. The initiation rate of the electroless bath must be carefully controlled.
12.3 Rack Conditioning
If the electroplate rack is to be used in the pre-plate cycle, the rack should be
processed through the nitric acid rack stripping process first to remove some
of the surface plasticizers. This helps to ensure proper chromium retention in
the rack coating for control of rack plating. The same effect can be achieved
by soaking new racks in chromic acid etch solution prior to their use in
production.
Plating racks should be processed through the rack stripping solution after
each plating pass. This will ensure that only clean functional contacts will be
used.
Finally, split or worn jig coatings should be repaired as soon as possible as

they can create rejects due to bleed out through solution retention or worse,
cross contamination of process solutions, shortening the solutions effective
life.
12.4 Rack Stripping Solutions
As already stated it is preferable to strip the plating racks after each pass
through the electroplating system. On some plating plants/installations this is
not possible either due to age of the process plant, the availability of space or
personnel, or production requirements versus the number of plating racks
available.
The reason that it is advisable to strip the rack tips is that normally the final
deposit is chromium. As a deposit chromium is extremely passive and re-
processing chromium plated racks would result in the components failing to
electroplate due to misplate whereby the electroless deposit is burnt away
from the rack tips thus losing electrolytic contact.

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There are three options for stripping the electroplate build up from plating
racks.
1. After each electroplate pass, either with the rack loaded or unloaded of
work the rack can be made anodic in a 100g/l sodium hydroxide
solution to remove the chromium. Normally 6v for 5 minutes is enough
to remove the chromium deposit.
The above does not eliminate the problem as it still leaves the
electroplated nickel and copper on the plating racks.
These deposits if left unstripped for successive sequences will create
misplates by the following means: The deposit thickness will increase
until it interferes with the components being processed shielding some
of the significant surfaces and not allowing them to electroplate
properly. Parts may fall from the process racks during processing as
the electroplated rack contacts may not be able to hold the components
correctly. Roughness may occur due to metal flakes being lost from the
electroplated rack tips as process solutions attack the deposit and
subsequent agitation loosens the flakes of metal. This method
therefore relies on a proper maintenance regime where the rack
contacts are fully stripped after a specific number of passes through the
electroplating system.
2. Chemical Stripping: Nitric acid based rack strippers are available from
many sources. MacDermid supply two products. Metex SS2 which is
a ready made nitric acid based rack stripper that contains additives that
enhance the stripping capability of the acid medium. For those
customers who require more control there is an additive for nitric acid
called Metex SS2A. This is the additive used in the Metex SS2. The
customer has the ability to control both the concentration of the acid
and the additive which may enhance the capability of the nitric acid.
Both types of solution have a finite life which is dependent upon the
concentration of the acid, the operating temperature of the solution and
the metal concentration in the strip solution. Processing times vary on
the age and temperature of the solution together with the thickness of
the electro-deposited metal. The continued use of nitric acid over a
period of time will gradually degrade the plastisol coating. However
this takes a long time and using this solution will guarantee that any
areas of rack plate will be removed.
A second stripping solution that can be used is based upon a mixture of

dilute sulphuric acid, hydrogen peroxide and MacuPrep G5-S where
the MacuPrep material is a stabiliser for the hydrogen peroxide. This
stripping solution is normally used when reprocessing ABS
components but can be used for plating racks where companies wish
to avoid the use of nitric acid.

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3. Electrolytic Stripping: An electrolytic stripper is available called Metex

SS10. It operates at a pH of 6.0-6.5 and at a temperature of 45C
making it a safer product to use. It strips racks consistently at a given
rate, faster than its chemical counterparts. However the customer has
to realise that this is a plating solution and that without the correct
additions of additives it may attack the rack contacts. Properly
maintained it is an effective, neutral pH rack stripper. The negative
aspect of this process is that where rack plate occurs the electrolytic
stripper may not successfully remove it.
Two other points to note are relatively standard when discussing

plating racks. The first is to dissuade operators from using pliers to
remove rack plate build up. The twisting/shearing action alters the
tension and possible orientation of the rack tip. It may also tear the
plastisol coating on the springs. This can lead to the racks having a
shorter working life as either the spring contact may be lost or chromic
acid seepage may cause rejects.
The other point is to persuade the operators not to drag the plating
racks across the floor as the scuffing action wears through the coating,
leading to chromic acid retention in the etch solution that bleeds out
during subsequent processing, contaminating other process solutions.

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13.0 MacuPlex The Chemistry
Plastic Substrates Suitable for Processing using the MacuPlex ABS System
Include:
z ABS
z Bayblend [A.B.S./Polycarbonate alloy]
z Stapron
z Noryl
z Polypropylene (filled)
z Polyamide (Specific Grades)
Plastic substrates which are not suitable for processing by the MacuPlex ABS
system
Include:
z Polycarbonate
z ULTEM 2310
z Kemetal
z Some Polyamides

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13.1 Pre-Treatment Stages
z Etching/Surface Conditioning
These are surface modifiers that create a structure or topography to

promote or enhance adhesion of the metal deposit to the plastic
substrate.
z Neutralisation
This is the removal of harmful process chemistry from the surface of

the substrate. It may also create modification of the substrate by
further adjusting the surface topography of the plastic and making it
more receptive to catalysation.
z Catalysation
Surface adsorption of a catalysing agent that will enhance and

promote electroless deposition.
z Acceleration/Reduction
This refers to the bringing of the catalyst material to an active state

ready for metallization
z Metallization
Is the initial deposition of a metal by chemical means before

subsequent electroplating.
The performance of each stage has a significant effect on the finished

product and should be carried out and controlled within strict limits of
operation.

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14.0 ABS Plating
14.1 An Introduction
The theory of Plating on Plastic substrates is quite simple. A suitable plastic

i.e. an ABS terpolymer is chemically treated to roughen the surface of the
component. After neutralising the initial chemistry, it is then put into an
activator solution, normally containing a palladium tin colloid, which is
attracted to the surface of the plastic. The component is then immersed in an
accelerator to remove the secondary protective metal film (tin) from the
surface of the Palladium. The activated and accelerated component is then
immersed in an electroless metal deposition solution, which deposits a thin
layer of metal over the whole of the plastic substrate. This metal layer then
becomes the conductor for subsequent electroplating.
With all of the MacuPlex pre-treatment products their successful operation

relies upon the basic laws of chemistry i.e.
z Time
z Temperature
z Concentration
By adjusting any combination of 1 to all 3 of these, the characteristics of the

various processes will change
Time
This is relatively difficult to adjust when using some older automatic plating
machines. Manual adjustments can be made but these upset production
schedules. Modern process machines have the capability for change,
however production schedules may still be affected.
Temperature
Can be altered by adjusting the solution thermostat. Changes are not

immediate as time is taken to either warm up or cool the process solution.
This can be a time consuming operation when adjusting the temperature of
solutions by several degrees centigrade, but it is the easiest parameter to vary
up or down.

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Concentration
This is the simplest characteristic to increase, as it is a simple chemical

variation. To reduce the concentration however may require partial dumping
and dilution and this is more difficult to control.
15.0 ABS Pre-Treatment

15.1 Pre-Etching and Etching
As ABS is still the most widely processed plastic material, the following
section has been written with this in mind. Consideration has been given to
those ABS/PC polymers that require some form of pre-etch/surface
conditioning treatment. The system discussed is that of a standard colloidal
type activation system. Other (ionic) activation systems will be discussed
separately. There are other polymers that may use the same method of
etching fillers from the surface of the plastic i.e. polypropylene and so the
same principles will apply. Lesser more difficult to process plastics may rely
on surface conversion chemistry such as a solvent swell; these materials will
require processing according to their individual needs.
Etching is the action whereby the ABS surface is rendered hydrophilic (water
loving) and is chemically roughened to provide a mechanical key for the
deposition process. It is advantageous that where possible moulded ABS
components should be given a pre-etch treatment. The aim of which is to
begin the wetting process of the normally hydrophobic material especially
where the components have difficult moulded in knurled or textured surfaces.
As the component is immersed in the etch solution the strong oxidising acids
dissolve the butadiene particles in the surface of the ABS creating thousands
of microscopic holes, thus providing the bonding sites for the metallic layer.
This is evident by the degree of matted effect on the surface of an etched and
dried plastic substrate, when compared to the gloss surface on a new
component. The conditions of etching are very important as the degree of
metal to plastic adhesion is wholly dependant on this stage, i.e. if the
chemistry is in balance and the temperature is correct then the effect of time
would be the controlling factor to achieve the best adhesion.
On the next page there are SEM pictures of two different ABS materials, both
have been heavily etched to demonstrate the possible variations between
different ABS substrates. The honeycomb etched surface can easily be seen
on both polymers. Although treated in the same etchant material, at the same
time/temp/concentration. the surface topography is quite different. This may
be due to the variation in the constituents of the two ABS materials or to
variations in the way in which the two components were moulded.

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Some considerations based on the SEM pictures are:
Constituent ratios of ABS polymers differ and will give variations in the
moulding process resulting in different etched surface characteristics.
If the ABS materials and moulding parameters are not properly controlled the
electroplating process may not be able to overcome the potential problems.
If the etching time is too short the cavities will not be etched out completely
leading to incomplete coverage and poor adhesion.
Conversely, if the etching time is too long the surface layers of the ABS
material may be undercut weakening the surface structure of the ABS plastic
resulting in poor surface finish and potential poor adhesion of the electro-
deposit.
The above effects might also be seen by varying either the concentration of
the etch chemistry or the temperature of the etch solution.
Modern etch solutions are typically based upon a mixture of chromic and
sulphuric acids together with a proprietary additive to reduce the surface
tension of the process solution.
The ratio of the acids is most important as this governs the chemical
effectiveness of the etch solution. One of the most common questions asked
is What is the correct ratio/concentration for the make up of these acids?
The answer is that etch solutions will work over a very wide range of
concentrations at what is normally referred to as balanced saturation
chemistry. What this means is that if either of the two acid materials are
added to excess some of the chromic acid will be precipitated, causing
blocked agitation coils. Therefore the general rule for the make up of a
chromic acid based etch is:
As the chromic acid is reduced in concentration, so the sulphuric acid is

increased. There are as always some exceptions where customers use a
specific mix that is satisfactory for their use, otherwise consider:
Chromic acid 300 - 450g/l

Sulphuric acid 320 - 420g/l
e.g.
Chromic acid 400g/l

Sulphuric acid 360g/l

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A new etch contains only chromic and sulphuric acids, and is quite aggressive
by nature, it is considered by some that the use of a surface tension reducer
may not be required at this time. This may be true in some circumstances but
for most operations where optimum topography is important additions of a
proprietary surface tension reducer such as MacuPlex STR or MacuPlex
Floenx NF is recommended.
During the etch process some of the hexavalent chromium is reduced to

trivalent chromium. This trivalent chromium initially acts as a buffer, softening
the aggressive nature of the etching action. However, as the trivalent
chromium concentration grows to >20gm/lt, it becomes an etch retardant.
The consequences of this are that variations in the consistency of the surface
topography are reduced so that areas of greater stress may not be etched
sufficiently to guarantee good adhesion of the subsequent electro-deposit. If
this variation occurs failures may be evident such as poor adhesion during
thermal cycling, blistering of the deposit at or around stressed or gate areas or
skip plate, also normally seen around gate areas.
For some years the standard remedy or control of trivalent chromium was to
either dilute or discard the etch solution. Today electrolytic regeneration of the
trivalent chromium back to hexavalent chromium is considered standard
practise.
The ABS materials processed today may be either classed as a natural

terpolymer (pure ABS) or they may contain various additives/colorants that
once removed from the surface of the moulding are inert particulate
substances which over a certain concentration in the etch solution will begin to
cause rejects from a problem known as stardusting. This phenomenon is
caused by the settlement on horizontal flat surfaces of the inert particulate
matter that is not removed by either rinsing or the subsequent process
operations.
In order to combat this problem it is advisable to install a filtration system on

the etch solution. Due to the solution being extremely corrosive this equipment
should be made from a suitably corrosion resistant material such as Kynar
(PVDF). Although the filter units are expensive the need for quality of finish
versus the costs of frequency of etch replacement make them a cost effective
way of maintaining etch quality.
Today it is now possible to effectively close loop the chromic/sulphuric acid

etch solution. This is achieved by a mixture of etch filtration, regeneration and
evaporation. To accomplish this however neither the etch solution or the
following cold water rinses should be allowed to be contaminated by anything
that cannot be easily removed. A final requirement for this closed loop is
periodic high temperature digestion of the etch solution. The reason for this is
that as the butadiene is removed during the etching process some of the

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organics from the plastic are dissolved into the etch solution. These
contaminants gradually build up increasing the density of the etch solution and
affecting its efficiency. The simplest way to remove these organic materials is
to break them down using heat and filtration.
Once the plastic surface has been etched, the hexavalent chromium that is
both on the surface of the ABS and trapped within the etched matrix of
material must be effectively neutralised and rinsed away before the activation
stage can begin.
Neutralisers such as mixtures of MacuPlex 9338 and hydrochloric acid are

materials, which at low concentration chemically reduce damaging hexavalent
chromium quickly and effectively.
Rinsing alone will not be sufficient in removing the hexavalent chromium from
blind holes and recesses either in the component or from the plating racks.
Failure to remove this chemical may result in skip plate due to bleed out
where the hexavalent chromium poisons the surface of the plastic. If this type
of contamination is allowed to continue it will result in the contamination of the
other process solutions rendering them ineffective. There would be no other
alternative other than to discard and remake these solutions.
15.2 Catalysing or Activating
Standard or classical activators or catalysts are materials, which contain a

precious metal i.e. colloidal palladium, together with a protective metal coating
(tin) in a stabilising medium which is normally an acid chloride base.
Their aim is to allow the colloidal palladium to be adsorbed onto the surface of
the ABS plastic, even down into the etched cavities. During processing this
may be the first noticeable change in appearance of the component, where it
will acquire a light tan to brownish colour, which unless the component is
black can easily be seen. Such a visible change in colour is a good indication
that the activator is working properly.
These palladium/tin catalysts which can be used in an acid or acid/salt

(sodium chloride) base are very stable and extremely tolerant to
contamination without breaking down. When a colloidal palladium catalyst is
installed it is normal to use a pre-catalyst dip of the same chloride base and
concentration as that used in the catalyst itself. As most installations use
hydrochloric acid as the base for the catalyst solution, it is advised that a 20 -
25% hydrochloric acid dip is installed directly before the catalyst.

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The pre dip performs two major functions:
It acts as a weak hexavalent chromium neutraliser for any chromic acid, which
may have been carried past the neutraliser stage.
It coats the surface of the ABS plastic with a solution that is completely stable
within the catalyst and will not create any harmful side reactions.
It is very important that the concentrations of the hydrochloric acid and tin are
maintained in the catalyst, as without them the palladium is no longer stable.
The result is that the colloid falls out of solution settling on the bottom of the
tank. It is then not possible to rejuvenate this solution only discard it and very
expensively make up a new solution.
It is inevitable that some contamination of the catalyst process with hexavalent

chromium will occur. Providing that this is only in very small amounts the
resultant breakdown of the colloid will also be small. This breakdown of the
colloid results in a fine particulate or precipitate which requires filtering from
the process solution. Failure to do this will result in a build up of the
particulates showing as a fine speckle roughness on the surface of the
components. When using a filter for the first time some loss of concentration
of the bath can be expected, this loss is generally considered to be <5% of the
colloid make up and is far cheaper than discarding the bath and making up a
new one.
After immersion in a colloidal palladium solution, the layer of activator particles

on the surface of the ABS is completely inactive. One of a number of
accelerators can then be employed to remove the protective tin layer from the
palladium particles which then exposes a mass of active palladium sites. It is
these sites which catalyse in the electroless plating solution allowing metal
deposition to begin.
Most accelerators will also act as a hexavalent chromium reducer in the event
of unreduced chrome being carried through the line. More importantly
however, are the effects of contaminants on accelerators, of which tin can be
included. Some contaminants including tin make the accelerator behave
aggressively, not only removing the tin but also removing the palladium which
may result in misplate (skip). Accelerators such as Ultracel 9369 are
designed to minimise this aggression and will precipitate out some of the
excess contaminants whilst still operating successfully. Because of this
potential precipitation there is a requirement to filter these solutions.

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15.3 Metallising
After thorough rinsing to avoid carry over of palladium the components are
then immersed in an electroless plating solution. These solutions contain
metal salts together with a reducing agent, stabilisers and catalysts. Thus
when the components are immersed in these solutions the palladium on the
ABS surface initiates the deposition of metal. Once deposition has started the
metal deposit acts as its own catalyst for further deposition and the reaction
becomes self sustaining, covering the whole of the plastic material with an
even layer of nickel metal.
15.4 Simple Rules for Plating onto Plastic
1. Follow all make up instructions as set out on the data sheets unless
otherwise instructed. Any deviation from these instructions may result in
adverse results from the process
2. Close chemical control should be maintained over all process solutions.
3. Monitoring of all process solution temperatures/pHs should be carried out

and adjusted as required.
4. Regard must be given as to the position of work in the plating line

especially during breakdowns. (When the plant is stopped for any reason,
the time delay in any of the process solutions may create rejects).
5. Remove all fallen work from process and rinse tanks at regular intervals
i.e. at the end of each shift.
6. When in doubt Take each process in turn and investigate.

Remember that the point in the process sequence where components
exhibit problems may not be the origin of the problem.

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16.0 Rinsing
Rinsing is the next most important part of the process. It is these intermediate
stages that can save or cost money. Poorly rinsed components or highly
contaminated rinses will allow cross contamination of process solutions
leading to short solution life i.e. frequent dumping and remaking of process
solutions.
Effective rinsing will improve the quality of the finished work and allow process
solutions a longer and more effective life.
Even so the quality of the incoming town water or the recycled water still
needs to be monitored. During warm summer months in slow moving rinse
tanks algae begins to grow on the tank walls. After a period of time this algae
dies and breaks free from the tank walls at which point it is a sticky organic
mass with no control over where it will rest. The resting point for this organic
is normally on the most prominent face of the most important piece of work.
The result is that an uneven lump grows on this face causing a reject. These
organics are sometimes very hard to find and the chemist will often spend a
lot of time checking the process solutions for precipitates.
These algae are normally found either in the accelerator rinses or electroless
nickel rinses. The simplest way to check for them is to drag your hand across
the tank wall under the water. If the tank wall feels slimy then there is an
algae growth that should be removed. To do this the rinse tank needs to be
emptied; the tank walls scrubbed and treated with either dilute sodium
hypochlorite or dilute hydrogen peroxide solution. This action needs to be
repeated at regular intervals in order to maintain the quality of the rinse
processes.
If algae is suspected and the tank walls are clean then samples of the suspect
process or rinse solutions should be filtered and the filter paper examined for
debris. If possible two samples should be filtered, one through a white filter
paper the other through a black filter paper. The reason for this is that
sometimes the algae are clear or white in colour and are never seen on white
filter papers. Once the source is located the solution or rinse can be treated,
the tank thoroughly cleaned and the problem controlled.

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17.0 Agitation
All solutions / component surfaces require some form of movement, i.e.
z To remove depleted chemistry and replace with new at the

liquid/component surface interface
z To wash away and dilute process chemistry in rinses
z To avoid chemical layering in rinse tanks
z To aid in solution movement to avoid temperature striation
In most solutions this can be achieved by using air or mechanical agitation or

a mixture of both.
A moderate supply of good clean filtered air will increase the effectiveness of
most solutions, whilst mechanical movement enhances the flow of solution
across shelves and through holes. Therefore a mixture of both is the most
effective.
In the ABS process sequence there are a couple of exceptions.
These are:
The Activator:
Air will oxidise the tin stabiliser in this solution and cause the bath to
break down. Agitation, should therefore be introduced by, mechanical
movement and solution movement e.g. filtration.
Ammoniacal Electroless Nickels:
Air agitation will promote the evaporation of Ammonia, which controls

the pH of the solution. Again filtration and the possible introduction of a
small amount of mechanical agitation will improve the deposit.
The Non-Ammoniated Electroless Nickel:
A small amount of air agitation by the heater coils may be beneficial for
avoiding plate out on the heater. Too much air may over stabilise the
solution. Filtration and a small amount of mechanical agitation will
improve the deposit.

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18.0 Filtration
High quality POP finishing requires that all process solutions should be
filtered. In some cases where necessity is proved, certain rinses should also
be filtered. A simple rule might be that wherever solutions or rinses are
considered as static or almost static the risk of particle build up is increased
and consideration should be given to filtration.
The following solutions should all have filters, which should be used
continuously.
The etch solution should use a filter system manufactured from Kynar (PVDF).
The filter media should be capable of removing 1-5 particles. Cartridge or
paper filters of 1m should be used where required on the other solutions,
except for the activator pre-dip and/or activator solution where cartridge filters
are preferred.
Etch:
On installations where coloured or glass filled components are

processed. Where quality of finish is critical. Filter rate, 1 solution
turnover per hour.
Neutraliser:
To remove airborne contaminants such as pollen and metal flakes from

unstripped plating racks. Filter rate, 1 solution turnover per hour.
Activator:
Filtration to remove large colloid, extend activator life and provide

solution movement. Filter rate, 1 solution turnover per hour.
Accelerator: (Ultracel 9369)
Continuous filtration to remove precipitated hard water products formed

as a by-product of the process, and precipitated contaminants. Filter
rate, 1 solution turnover per hour.
Electroless Nickel:
Continuous filtration to remove particulates, i.e. pollen metal particles

from tank plate etc. Filter rate, 1- 3 solution turnover per hour.

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Redding Up/Strike Bath:
Continuous filtration to remove particulates causing pitting and

roughness in the electrolytic copper process. Filter rate, 1 solution
turnover per hour.
19.0 ABS and ABS/PC Processing
19.1 ABS/PC Pre-Etch (PC >50%)
Solvent Technology
Products: MacuPlex LE
MacuPlex PC/ABS
Function: To condition the surface of the (>50%) PC/ABS
material and render it suitable to achieve a more
uniform etch
Concentration: Refer to individual data sheet
Temperature: Refer to individual data sheet
Time: Refer to individual data sheet
19.2 ABS Pre-Etch
Standard Technology
Products: MacuPlex STR
MacuPlex Floenx NF
Function: To initiate the wetting out of plastic substrates
prior to etching. To initiate absorption of chromic
acid into rack coatings to inhibit metallization
Concentration: Chromic Acid 320 400 g/L
Sulphuric Acid 0.5 %/vol
MacuPlex Product <40 dynes/cm
Temperature: 50 - 55C
Time: 200 400 minutes
Solution Maintenance: Analyse and correct once per shift

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20.0 Chromic Acid Etch
Standard Technology
Products: MacuPlex STR
MacuPlex Floenx NF
Function: To create the surface topography suitable to
ensure adhesion of the deposit by removing the
co-moulded filler or crazing the surface layers of
the plastic material
Concentration: Chromic Acid 320 450 g/L
Sulphuric Acid 420 300 g/L
MacuPlex Product <40 dynes/cm
Temperature: ABS 64 - 68C
PC/ABS 68 - 73C
Time: ABS 1500 700 minutes

PC/ABS 1800 1000 minutes
Potential Contaminants: Trivalent Chromium
Lead Chromate
Titanium Dioxide
Iron
Organics

Equipment Maintenance: Pump out and clean tank once per year. Check
linings for cuts or holes
Note:
Filters and pipe work should be manufactured from suitable materials such as
Kynar (PVDF) plastic.
The air agitation should be left on at all times to prevent precipitation and
blocking of the sparge pipe holes.
The etch solution should not be allowed to cool down to room temperature as
precipitation of chromic acid may occur.

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20.1 Electrolytic Regeneration of MacuPlex Chrome Etchants
The technology of using chromic-sulphuric mixed acids, as etches for the

preparation of plastics for plating, is one for which MacDermid has many
years of experience. These types of etch solutions condition the plastic by
selectively dissolving part of the surface by oxidation. Chromic acid acts as
the oxidising agent in these reactions and is itself reduced from the
hexavalent state (Cr+6), to the trivalent state (Cr+3). As the concentration of
Cr+3 increases in the etch solution, the efficiency of the etching reaction is
reduced. This decrease in efficiency becomes significant when the level of
Cr+3 is greater than 20g/L for ABS/PC alloys and 28g/L, and above for ABS
materials, thus lowering the potential adhesion values of subsequent
electroplated deposits. For plastics which are more difficult to plate, and
where good adhesion is of primary importance, the Cr+3 should be maintained
below 20g/L.
MacDermid strongly recommends the use of Electrolytic Regeneration to

control the concentration of Cr+3 in all chromic-sulphuric acid etch solutions.
20.2 Electrolytic Regeneration Process
Theory
During the etching of plastics the chromic acid oxidises some of the plastic
and is itself reduced:
Cr+6 + 3e- Cr+3
The hexavalent chrome ion loses electrons to become a trivalent chrome ion.
Electrolytic regeneration uses DC current to reverse this reaction:
Cr+3 - 3e- Cr+6
Trivalent chrome ions release electrons at the anode surface to become

hexavalent ions. In this way, the trivalent chrome can be turned back into the
useful hexavalent form, and the efficiency of the etch solution is maintained at
optimum.

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20.3 Electrolytic Requirements
The oxidation of trivalent chrome to hexavalent is an electrochemical reaction.

Such reactions are influenced by the amount of energy (electrical current)
applied and by the nature of the electrode surface at which the reaction takes
place. An inert anode surface is required of which lead is the easiest choice
of material. The cathodes, which are also made from lead, must be separated
from the etch solution itself or trivalent chrome will be created at the cathode
surface.
Porous ceramic pots or inert membranes are used to contain the cathodes
and so separate them from the etch solution. To allow current to flow from
each cathode through the pores in the pot walls or membranes to the etch
solution; the pots are filled with a dilute sulphuric acid solution, (the catholyte).
The etch solution itself is in either a side extension of the etch tank, (in-line
regeneration), or in a separate regeneration tank, (off-line regeneration). The
ratio of anode surface area to cathode surface area should be 2:1
20.4 Equipment
Tank: Chemical lead lined, Titanium, PVDF, the

tank lining must not be used as the anode.
Anodes and cathodes: Antimonial lead, 40 50mm dia.
Cathode current density: 30ASD
Anode and cathode rails: Copper bar of sufficient cross sectional area
to carry the total current and strong enough
to support the electrodes.

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Diameter (mm) Current (amps)

6 50
8 75
10 110
13 200
16 300
20 500
22 600
25 750
30 1000
32 1200
35 1500
Rectifier: Voltage: 15 volts (9 12 volts)

Amperage: 100 150 amps/45cm
cell
Ripple factor <5% at 20% of full load
Ceramic pots: Porous porcelain cylinders, closed at their

base or inert membranes.
Example Porous Pot

Diameter: 15cm
Height: 45cm
Wall Thickness: 5mm
Catholyte: 10 15 % v/v sulphuric acid (H2SO4)

solution (Replaced daily for best
efficiency)
Anolyte: Etching Bath
Temperature: 20 - 60C (optimum for best efficiency: 35 -

45C)
Current: 100 150 amp/45cm cell
Exhaust: Recommended, hydrogen (H2) is evolved at

the cathode.

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20.5 Conversion Data:
1. At 100% efficiency, 1.5 amp hours converts 1 gram of Cr+3 to Cr+6.
2. Each gram of ABS oxidised (lost) results in the reduction of 6gms of Cr+6
toCr+3.
3. Etches containing more than 20g/L Cr+3 have a regeneration efficiency

above 90%. As the Cr+3 level drops, so does the efficiency. At 10g/L Cr+3,
the efficiency is about 50%.
20.6 Sample Calculation:
Based on etching 1000 sqft/hour (93 sq metres/hour) of ABS processed in a

chrome sulphuric etch for 5 minutes at 65C using closed loop recovery.
Usually 1000 sqft (93sq metres/hour) etching of ABS results in 1.1lbs
(500gms) of Cr+6 reduced to Cr+3.
(1.5amphr) x (1.1lbs) x (454gm/lb) = 832 amps req.

(0.9)
(832) = 5.6 cells

(150 amps per cell)

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20.7 Typical Layout for Single-Pot System
cathode
anode
anode
porous pot
anode
anode

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20.8 Typical Layout for Multi-Pot System
A A A
C C cathode
A A A
C C
A A A
anode
porous pot
Note:
The etching of Noryl usually results in a higher generation of Cr+3 (approx 3x).
Therefore usually 50% more electrolytic regeneration is required. The
catholyte solution should be replaced and made up fresh when it becomes
contaminated.

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Warning:
Etching solutions for plastic contain strong mineral and chromic acids and are
corrosive. Protection for eyes, skin and clothing is required. Avoid breathing
vapours. In case of skin contact, flush area immediately with clean, cold water
for at least 30 minutes.
All statements, technical information and recommendations contained herein

are based on tests we believe to be reliable, but the accuracy or
completeness thereof is not guaranteed. No statement or recommendations
shall constitute a representation unless set forth in an agreement signed by
officers of seller and manufacturer. NO WARRANTY OF MERCHANTABILITY
OR WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE IS MADE.
The following warranty is made in lieu of such warranties and all other
warranties, express, implied or statutory.

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20.9 Etch Rate Determination on ABS Materials (By Weight Loss)
Etch Rate normally >0.31mg/cm2 at 71C for 10 mins
1) Take one ABS test plaque.
2) Rinse in DI water using tongs
3) Heat at 82C for 45 minutes
4) Stabilise in a dessicator for 45 minutes
5) Weigh the plaque to 4 decimal places A
6) Process plaque through the etch and neutraliser solutions
7) Remove after neutraliser rinses
8) DI water rinse
9) Repeat stages 3 & 4
10) Reweigh plaque to 4 decimal places B
Calculation:
[(B A)(1000)] = Etch weight loss in mg/cm2

cm2

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21.0 Neutraliser
Standard Technology
MacuPlex 9339
Products: M-Neutralise
MacuPlex ECR
To chemically reduce chrome ions from a
hexavalent state to a less harmful trivalent state.
The operation of this solution must be balanced
Function:
to allow the reduction of chrome ions on the
surface of the plastic substrate, but not from the
surface of the plating rack or plating resist.
Temperature: Ambient to 49C
Particulates such as titanium dioxide which
should be filtered through a 1 micron filter
Contaminants:
Hexavalent chromium the bath should be
discarded before the solution begins to change
to a yellow/brown colour.
Dump the solution and clean out the tank
Solution Maintenance:
regularly.
Check the tank for leaks
Equipment Maintenance:
If using steam or oil heating check coils for leaks
Note:
This process solution requires air agitation to ensure thorough removal of

hexavalent chromium from the surface of components
To maintain quality the solution should be filtered continuously through a 1 5

micron filter.

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22.0 Pre-Catalyst Conditioners
Surface Charge
Technology Film Forming
Orientation
MacuPlex PA3 MacuPlex Neutra-Aid

Products:
MacuPlex Neutraprep
These products are designed to enhance the
adsorption of activator colloid onto difficult to
Function: plate non-conductive surfaces.
Temperature: Ambient to 40C
Dump the solution and clean out the tank
regularly.
Note:
Film forming conditioners require greater control on make up and application

as they will also try to enhance palladium adsorption onto plating racks

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23.0 Catalyst Pre-Dip and Catalyst
LASA (Low Acid Salt

Technology Standard
Activation)
Products: None Metex 9008 Salt
To place a chemical solution onto the surface of
the components and plating racks which will help
Function:
to maintain the chemical stability of the catalyst
solution.
Concentration Standard Hydrochloric Acid 250mL/L
Process:
Concentration LASA Metex 9008 Salt 180 g/L
Process: Hydrochloric Acid 50 100 mL/L
Temperature: Ambient
Time:
030 200 minutes
Hexavalent Chromium
Potential Contaminants: Iron
Other metals
Analyse and correct once per shift.
Hexavalent Chromium: Short term this can be
controlled with periodic additions of MacuPlex
Solution Maintenance: L78 at 0.25 L/1000 L of pre-dip solution.
The solution should be changed on a regular
basis.
Filter continuously through a 1 5 micron filter

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24.0 Palladium Catalyst
Standard LASA (Low Acid

Technology
Salt Activation)
MacuPlex D34-C MacuPlex D34-C
Products: Mactivate 360 Mactivate 360
Metex 9008 Salt
To adsorb a film of a palladium and tin colloid
onto an etched surface of plastic without
affecting the rack coating. Catalysts can be
made up in one of two ways either as the
Function: standard hydrochloric acid base or the low
acid/salt version. The low acid based solutions
are claimed to be a little more active than their
all acid counterparts but have less tolerance to
contamination of hexavalent chromium.
Concentration Standard Hydrochloric Acid 250mL/L

Process: Catalyst Refer to data sheet
Tin as metal 2.0 4.0 g/L
Metex 9008 Salt 180 g/L

Concentration LASA
Hydrochloric Acid 50 100 mL/L
Process:
Catalyst Refer to data sheet
Tin as metal 2.0 4.0 g/L
Temperature: Ambient - 40C
Iron 100mg/L
Zinc 5mg/L
Nitrates 10mg/L
Nickel 10mg/L
Potential Contaminants:
Sulphur <100mg/L
Copper
Chrome 100mg/L
Air

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Analyse and correct once per shift. Maintain the

stannous tin levels in the process solution.
There are no known methods to remove these
contaminant chemicals therefore the rinses prior
Solution Maintenance: to this process are very important. Some of
these contaminants will break the colloidal
suspension precipitating the palladium from
solution.
Filter continuously through a 1 micron filter
Pump and clean out every 6 months.
If using a weir keep the solution fall to a
Equipment Maintenance: minimum to avoid air ingress. Check and
maintain filters and pumps for leaks which may
induce air into the process solution.
25.0 Accelerator
Standard Technology
MacuPlex 9338
MacuPlex 9369
Products: Maccelerator 25
Maccelerator 40
To remove the tin from the colloidal palladium/tin
matrix on the surface of the plastic substrate.
The reaction should be strong enough to remove
Function: the tin but not strong enough to remove the
palladium. The accelerator should also be
capable of removing any residual tin and
palladium from the rack coating.
Temperature: 40 to 55C

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Products such as MacuPlex 9369 will react with

the hardness in the water resulting in a
precipitate which will require filtration from the
Contaminants: process solution.
A list of the tolerance to potential contaminants
for each accelerator is given below.
Analyse and adjust the concentration of the

solution once per shift.
Dump the solution and clean out the tank on a
regular basis.
Filter the solution through a 1 5 micron filter
Check the tank for leaks

25.1 Contaminant Limitations
Cu Ni Fe Cr
Accelerator Make Up
ppm ppm ppm Ppm
MacuPlex 9338 2% 15 1000 8 1000
Ultracel 9369 75g/l 76* 70* 100* 1000
Maccelerator 25 7% 700 500 50 1000
Maccelerator 40 5% 700 600 70 1000
Note:
* Relates to contaminants that form precipitates, but solution continues to

work.
In some of the other accelerators the introduction of iron in excess of 20mg/L

can cause rack plate and skipping.

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As these baths get older, they become more aggressive and will remove both
the palladium and tin which will cause skips.
Temperature is important, maintain with 1C.
26.0 Metallisation
26.1 Ammoniacal EN Technology
Ammoniacal Technology
Products: MacuPlex J64
To deposit by chemical means a conductive metal
layer that will carry the electric current to allow
subsequent deposition of the
Function: protective/decorative copper, nickel and in most
cases chrome.
Nickel Metal 4.3 6.0 g/L

Sodium Hypophosphite 18.0 25 g/L
Concentration:
pH (Ammonia) 8.8 9.2
It is difficult to measure the thickness of the EN
strike deposit as it is normally <0.5m. The
easiest method of control is to measure the
electrical resistance of the coating. Using an
Thickness Control: electricians multimeter check the resistance of
the deposit at a 1cm distance. As a general rule:
Processes with an electrolytic strike <30/cm
Processes without an electrolytic strike <15/cm
Nitrates
Contaminants: Chrome
Tin

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Filter the solution into a holding tank once per
week, clean the process tank and filter the
solution back remembering to correct the solution
parameters before use.
After removing the EN solution strip any tank

plate up using either Nitric acid or a mixture of
Sulphuric acid/Hydrogen peroxide remembering
Equipment to pump the solution through the filter chamber
Maintenance: and pipework. Once cleaned thoroughly rinse and
neutralise any residues.
Check the tank for damage or leaks
26.2 Non Ammonia EN Technology
Non-Ammonia Technology
Products: MacuPlex EN707
cases chrome.

Concentration:
MacuPlex EN707 pH 8.0 9.5

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Nitrates
Tin


26.3 Fully Compliant EN Technology
Fully Compliant EN Technology
Products: MacuPlex M-550
Function: To deposit by chemical means a conductive metal

protective/decorative copper, nickel and in most
cases chrome.

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Sodium Hypophosphite 10.0 18.0 g/L
Concentration:
Nitrates
Tin


Maintenance: and pipe work. Once cleaned thoroughly rinse
and neutralise any residues.

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26.4 Electroless Copper Technology
Electroless Copper Technology

Products: Ultradep 30
cases chrome.
Copper Metal 1.6 2.5 g/L

Sodium Hydroxide 6.0 8.0 g/L
Concentration: Total Chelator 0.08 0.11M
Formaldehyde 2.5 3.0 g/L
It is difficult to measure the thickness of the El/Cu
Thickness: strike deposit as it is normally 0.4 0.8m.
Iron
Contaminants:
Tin

solution once per shift. Where possible consider
the use of automatic dosing of process
ingredients.
Solution Maintenance: solution back remembering to correct the solution
Filter the solution continuously through a 5 micron
filter using filter aid to absorb gelatinous
precipitates

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After removing the El/Cu solution strip any tank


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27.0 Troubleshooting Pre-Treatment Systems
27.1 Chromic Acid Etchant
Problem Caused By Possible Remedy
Skip or misplate Low etch temperature. Low Check etch

chemical concentration parameters. Reduce
High surface tension. High surface tension.
Cr+3. Poor mouldings. Reduce Cr+3 content.
Short processing time Check mouldings.
Adjust process time
Shiny parts after Under etching, high Increase time and/or

electroless deposit Trivalent Chrome (Cr+3) temperature in etch.
and poor adhesion Check chemistry.
Ensure low surface
tension in the etch
solution. Ensure that
the Cr+3 regeneration
system is working
correctly
Dull parts out of Over etching Decrease time and/or

electroless solution. temperature in etch.
Poor surface after Check chemistry.
electroplate. Black
layer between plate
and part with little or
no adhesion.
Stardusting or Titanium dioxide, lead Install spray rinse after

roughness on part chromate or inert particle etch to wash off
build-up in etch. particles. Filter the
etch solution.
Chemistry OK, but Iron contamination. Poorly Decant for iron.

parts not etching moulded part. Mould Check part for stress
properly, low release on part. and contact moulder.
adhesion, shiny after
electroless deposit.

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Metallization of Insufficient Cr+6 absorption Soak the plating racks

plating racks to poison the rack surface in nitric acid to remove
plastizers from the
rack surface or
condition the racks in
etch solution before
use
Parts warping. Etch temperature too hot. Lower temperature.

Too much tension on rack. Use different rack.
Additions of chromic Sulfuric acid is too high. Check chemistry and

acid do not show up Chromic acid is balance bath.
in analysis. precipitating out.
Loss of adhesion at Stressed part at gate. Check with Glacial

gate area after Acetic to confirm and
electroplating. contact moulder.
Rest of part OK. Reduce surface
tension of etch and
adjust etch time and/or
temperature.

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27.2 Neutralisers
Skip or misplate Low temperature or time Adjust temperature

Low chemical and/or concentration.
concentration. Poor air Increase air agitation.
agitation. Poor mouldings. Check mouldings.
Short processing time Adjust process time
Hexavalent Chrome Bath spent. Bleed out of Check bath chemistry.

(Cr+6) seen dripping blind hole or rack tips. Check bath colour, if
off parts out of orangish, dump.
neutraliser. Increase air and/or
temperature. Fix rack
coating around tips.
Stardusting or Titanium dioxide, lead Filter the neutraliser

roughness on part chromate or inert particle solution.
build-up in etch.
Drip skip out of the Bleed out of Hexavalent As above

electroless bath. Chrome (Cr+6)
Metallisation of Over neutralisation of Condition racks in

plating racks parts/rack coatings chromic acid.
Reduce
time/temperature/conc
entration of
neutraliser.
Because neutralisers are low cost to make up, when problems occur they are
usually dumped and made up.

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27.3 Conditioners
Skip or no plate out Bleed out of Cr+6. Increase rinsing and

of the electroless Conditioner out of spec or neutralisation.
solution spent. Time and/or Check conditioner
temperature in concentration and
conditioner too low adjust.
Increase
time/temperature of
conditioner.
Racks metallised Not enough hexavalent . Condition racks in

after electroless chrome in plating rack chromic acid. Reduce
process surface. Over time/temperature
conditioning of the /concentration in
parts/racks neutraliser.
Reduce
time/temperature/
concentration of
conditioner.

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27.4 Catalysts
Silver mirror seen on Low Tin Concentration Add MacuPlex

surface of bath L-50/L-78 after
analysis
Roughness on parts Particulates. Filter the activator

Tin may be low. (expect to lose 2-
3% due to
absorption on the
filter). Use 1-5
micron. Install
spray rinse after
activator.
Raise tin level.
Solution clear or tea Bath fell out probably due Make up new bath
coloured to low tin, sulphur or iron in
the Hydrochloric Acid (HCl)
Added Nitric Acid (HNO3)
instead of HCl.
Rack plate and/or High temperature, and/or Lower temperature,

stop off resist plate concentration too high. check chemistry.
Skip plate Temperature and/or low Raise temperature,

concentration time and check
chemistry.
Blotchy adsorption Stress in part. Check part in

(light and dark areas) Glacial Acetic Acid
Parts very dark Low acid, high temperature Check chemistry,

raise acid to about
>2.8N,
lower temperature.
Parts very light High acid, low Check chemistry,

temperature, allow acid conc. to
Low palladium drop to 2.6N,
concentration raise temperature,
agitate parts.

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27.5 Accelerators
Skip plate on edges Over acceleration Reduce time

of parts High temp. Reduce temp
Poorly moulded part Check chemistry
Check moulding
Conditions
Skip plate in major Under acceleration Increase time

areas on parts or Low temp. Increase temp
slow take off in the Increase agitation
electroless which (air, work)
goes from the edges Check chemistry
inward
No plate in Contamination which When parts come

electroless causes aggressiveness out of accelerator
in accelerator clean, contamination
Low temp. (parts brown) and/or high temp.
High temp. (parts clean) may be the problem.
Lower temp.
Make up new bath.
If parts are brown
out of activator and
accelerator under
acceleration is most
likely the cause.
Increase temp., time,
and/or agitation.
Check chemistry.

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27.6 Electroless Nickel
Skip plating Low Reducer. Check chemistry.

pH out of range. Raise temperature.
NO3- contamination. Analyse for nitrates.
Carry out atomic
Heavy metal
absorption tests for
contamination
Bi. Pb, S, Cr, Sn
Roughness Particles in bath Filter bath.

Install Spray.
Rinse after
electroless nickel.
Agitate work
Burn-off in strike Electroless nickel coating Increase time or

too thin. poor racking temperature.
Check rack contact.
Check rectifier output
and bath loading in
electro - strike
Bath overactive High temperature. Lower temperature.

High reducer. Check chemistry &
Palladium contamination. stabiliser content.
Low stabiliser. Strip Tank
Tank plate-out
Bath sluggish pH out of balance. Check chemistry.

NO3- contamination. Analyse for nitrates.
Check stabiliser on
High stabiliser.
AA.
Low reducer.
Raise temperature.
Too low a temperature.

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27.7 Electroless Copper
Bath slow Low copper Check chemistry

Dark deposits Low sodium hydroxide Check plating rate
Thin deposits Low formaldehyde Increase temperature
Burn off High stabiliser Decrease air
Low temperature
Too much air
Bath overactive High sodium hydroxide Check chemistry

Dark, grainy deposits High formaldehyde Check plating rate
Low stabiliser Add stabiliser
High temperature Lower temperature
High loading factor Decrease workload in
Tank plate out bath
Increase air
Clean and strip tank
Roughness on parts Low complexor Check chemistry

Precipitate forms
when additions are
made
In all cases if auto dosing i.e. a copper controller is being used to analyse and
add the necessary ingredients the first check should be to check the controller
when a chemical imbalance is recognised. Check the pumps are working and
that the replenishment solutions are not used up. When the controller is
operating correctly the only over the side additions should be to correct the
solution after a shutdown period.

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28.0 Summary of Problem Areas
Rack Strip:
Incomplete stripping of electroplated coatings

Damaged jig coatings holding metal/debris particulates
Water quality, re inorganic particulates from mains repairs etc
Etch:
Air borne debris
Fillers/colourants i.e. TiO2
Impurities in chrome salts
Gross over etching
Filter breakdown, not removing all particulates
Neutraliser:
Airborne debris
Water quality, re organic contamination.
Activator Pre-Dip:
Airborne debris
Water quality, re organic contamination drag in from rinse.
Activator:
Airborne debris
Tin concentration low, leading to catalyst precipitation
Filter leaking air, reducing tin, breaking down colloid
Time, temperature, concentration of activator out of balance
Uneven palladium distribution due to poor etching
Contamination with chrome, sulphur, iron or nitric acid will create bath
instability and Pd fallout

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Accelerator:
Airborne debris
Insoluble tin compounds
Build up of contaminant metals leading to precipitates
(not all accelerators)
Hard water reaction to accelerator chemistry
(not all accelerators)
Filter not removing all particulates
Electroless Nickel:
Airborne debris
Damaged Filter pack
Nickel seeding out in filter pipework
High temperature
High reducer
Palladium contamination
Addition of replenishers creating salt out
Rinses:
Airborne debris
Reactions with process chemistry in rinse tanks
Build up of insoluble products from process tanks
Poor rinsing

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29.0 Locating Roughness in Pre-Treatment System

The evidence of roughness on components may range from a background
haze on horizontal flat surfaces of the component through to a satin type
speckle or embedded particles in the deposit. It should be remembered that
fine background speckle evident at the electroless nickel stage is magnified
when an electroplated deposit is applied.
If it is suspected that the problem originates in the pre-treatment system, the

first aim is to locate the source. Some causes are obvious such as electroless
nickel solutions that are starting to break down and precipitate metal particles,
other causes are more difficult. Dependent on the nature and degree of the
problem, the method of finding and confirming suspicions are carried out in
the following way:
1) Identify that the problem is a single one of settlement roughness by

examining reject components and noting the part orientation on the
plating rack.
If the problem occurs on more than one face of the component the
problem may be related to algae in one of the process solutions or
rinse water.
2) Define whether the problem is on one or all parts with settlement areas.
If the problem is only on one part check the parts for moulding faults or
surface contamination.
3) Define whether the problem occurs on any specific area on the flight
bar or across the whole work window.
This will help to eliminate problems that could be filter or air agitation
related.
4) Establish if the problem is intermittent or continuous.
Monday morning starts, filter problems, maintenance additions where

chemistry is added directly over the work may all be a cause or partial
cause.
If the answers to the investigation show that the problem is settlement

roughness, the next step is to choose a component that has at least two good
faces that could show the problem. It is also helpful if the components can be
changed on the plating racks so that each of the faces may be used as a
settlement surface.

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Method of Investigation
Fix seven components onto a plating rack making sure that one of the flat
surfaces will be in the horizontal orientation. The first component will be a
control component that will be left untouched throughout the test. Start the
test with all components having face A uppermost.
Plastic Component
Settlement Surface A
Settlement Surface B
The remainder of the test is:
Component 2 After processing through the etch solution and rinses,

take the second component and remove carefully from
the plating rack. Re-fix it to the rack so that the second
settlement face (B) is now at the position for settlement to
occur.
Component 3 After processing through the neutraliser solution and

rinses, take the third component and remove carefully
from the plating rack. Re-fix it to the rack so that the
second settlement face (B) is now at the position for
settlement to occur.
Component 4 After processing through the catalyst pre-dip solution,

take the fourth component and remove carefully from the
plating rack. Re-fix it to the rack so that the second
occur.
Component 5 After processing through the catalyst solution and rinses,

take the fifth component and remove carefully from the
plating rack. Re-fix it to the rack so that the second
occur.

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Component 6 After processing through the accelerator solution and

rinses, take the sixth component and remove carefully
from the plating rack. Re-fix it to the rack so that the
second settlement face (B) is now at the position for
Component 7 After processing through the electroless nickel solution

and rinses, take the seventh component and remove
carefully from the plating rack. Re-fix it to the rack so that
the second settlement face (B) is now at the position for
After processing through the electroless nickel rinses the plating rack and
parts should be dried. The parts should then be examined without removing
them from the plating racks.
If the problem is only a very fine haze in the final deposit there may not be any
evidence to show the origin of the problem. If the problem is particularly bad
then some degree of speckle may be evident on the electroless nickel.
The electroless nickel deposit should then be re-activated and the parts
processed through to final finish. Once the rack and parts have been dried
the part surfaces should again be examined for defects.
If all of the parts exhibit the problem on the top settlement surface then the
roughness must originate after the electroless nickel. The component (1 7)
at which the problem starts on the under surface i.e. side A will locate the
process as the cause. Once the process solution has been identified its
filtration system can be stripped and checked for broken filter plates or seals
then rebuilt and put back onto the solution. Where the problem occurs in an
electroplating solution check the filtration system, then the level of the solution
should be checked against the level of the anode bags. If the level of the
solution is below that of the anode bag the anodes should be removed and
the bags checked for tears/holes.
If the problem is serious enough take a 1-5 litre sample of the solution for
filtering in the laboratory. If particles can be seen on the filter media/paper the
test can be repeated later to check that the newly cleaned filter is working
properly.

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30.0 Test For Airborne Chrome
Scope
Spot missing down to bare plastic where the spots are small round holes, is
normally attributed to the destruction of the palladium catalyst after its
application to the surface of the plastic. The damage normally occurs between
the catalyst and immersion in the electroless deposition process. The reason
for its destruction is normally due to chrome or nitric acid mist in the
atmosphere. This test is to confirm the presence of chrome in the atmosphere.
Method
Expose a filter paper to the atmosphere in the vicinity of the

catalyst/electroless process whilst the electroplating plant is in operation.
Having exposed the paper for a period of time the paper should be covered
and taken to the laboratory for developing
Test Solution
0.1gm of S-Diphenyl Carbazide dissolved in 5ml of glacial acetic acid and

then diluted to 50ml with ethyl alcohol. Replace the solution when it becomes
darkly coloured.
Procedure
Place the test paper onto a clean chrome free surface. Using an eyedropper
drip some of the test solution onto the surface of the paper and wait for
indications of a reaction. This is evident as pink/red spots on the surface of
the paper. The number of the spots gives an indication of the problem.
Further investigation into the origin of the chrome mist should then take place.

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31.0 MacuPlex Infinity
31.1 Ionic Activation System
Introduction
Ionic activation systems have been available for several years. Their use has
been limited due to their inability to process the wide range of plastic
substrates that have been required during this time. However where the
applicator has only needed to process ABS or ABS/low PC blend materials
their use has been acceptable.
The main advantage of the ionic activation system is that it utilises what could
be termed as short cycle pre-treatment technology. The attention to process
control and general housekeeping is still as great a requirement as for the
standard colloidal systems but with a reduced number of steps. There is no
neutralisation step.
The MacDermid system is promoted under the MacuPlex Infinity product

range.

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31.2 Ionic Activation Process Cycle
Stage Process Chemistry Temp C Time
1 ABS Etch MacuPlex STR 66-68 70-120 min
or 1A ABS/PC Etch MacuPlex STR 68-73 90-120 min

plus 5mg/l
MacuPlex Infinity
Activator
2 CWR Ambient 200
3 CWR Ambient 100
4 Activate MacuPlex Infinity 24-28 40-60 min

Activator
5 CWR Ambient 200
6 CWR Ambient 200
7 CWR Ambient 100
8 Accelerate MacuPlex Infinity 38-42 30-50 min

Reducer
9 Electroless MacuPlex J64 or 28-30 60-90 min

Nickel MacuPlex EN-707 35-40
MacuPlex M-550
10 CWR Ambient 100
11 Nickel Strike Watts Nickel 50-55 40-70 min

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31.3 Chromic Acid Etch
Standard Technology
MacuPlex STR
Products:
MacuPlex Floenx NF
To create the surface topography suitable to
ensure adhesion of the deposit by removing the
Function:
co-moulded filler or crazing the surface layers of
the plastic material
Chromic Acid 320 450 g/L
Concentration: MacuPlex Product <40 dynes/cm
MacuPlex Infinity 5mg/L (2.7 mL/L)
Activator
ABS 64 - 68C
Temperature: PC/ABS 68 - 73C
ABS 1500 700 minutes

Time:
PC/ABS 1800 1000 minutes
Trivalent Chromium
Lead Chromate
Titanium Dioxide
Potential Contaminants:
Iron
Organics

Pump out and clean tank once per year. Check
linings for cuts or holes

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Note:
Filters and pipework should be manufactured from suitable materials such as

Kynar (PVDF) plastic.
The air agitation should be left on at all times to prevent precipitation and
blocking of the sparge pipe holes.
The etch solution should not be allowed to cool down to room temperature as
precipitation of chromic acid may occur.

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31.4 Palladium Catalyst
The activation system used in the ionic activation process differs from the
standard activation chemistry in that the palladium exists in an ionic and not a
colloidal form. The charges on the surface of the plastic polymer are such
that they attract the palladium to their surface where the palladium can be
reduced to accept electroless deposition. The other main chemical difference
is that the activation system contains both chromic and sulphuric acids.
Something that a colloidal activation system cannot accept.
Standard Technology
Products: MacuPlex Infinity Activator
To adsorb a film of ionic palladium onto the
surface of an etched ABS or ABS/PC plastic
Function: material, without being adsorbed onto the
plastisol coating of the plating racks.
Chromic Acid 2 8 g/L

Concentration:
MacuPlex Infinity 12.0 15.0mg/L
Activator (6.6 8.25 mL/L)
Temperature:
25C (24 - 28C)
Time:
400 600 minutes
Trivalent Chromium
Lead Chromate
Potential Contaminants: Titanium Dioxide
Iron

Check linings for cuts or holes when changing
the activator
Filter the solution continuously through a 1 micron filter

Good even air agitation is beneficial to this process solution

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31.5 Reducer
Standard Technology
Products: MacuPlex Infinity Reducer
To reduce the chemical charge on the adsorbed

Function: palladium making it active to electroless plating
solutions.
MacuPlex Infinity Part A 25 mL/L

Concentration:
MacuPlex Infinity Part B 0.2 mL/L
MacuPlex Infinity pH 5.3 5.8
Temperature:
40C (38 - 42C)
Time:
300 500 minutes
Trivalent Chromium
Lead Chromate
Potential Contaminants: Titanium Dioxide
Iron
Check linings for cuts or holes when changing

the activator
Filter the solution continuously through a 1 micron filter

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31.6 Electroless Nickel
Ammoniacal Technology
Products: MacuPlex J64
Function: subsequent deposition of the
cases chrome.
Concentration:
Nitrates
Tin

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Non-Ammonia Technology
Products: MacuPlex EN707

Function:
subsequent deposition of the protective/decorative
copper, nickel and in most cases chrome.
Concentration:
MacuPlex EN707 pH 8.0 9.5
Nitrates
Tin

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Solution Maintenance: week, clean the process tank and filter the
Fully Compliant EN Technology
Products: MacuPlex M-550
Function: To deposit by chemical means a conductive metal

cases chrome.
Concentration: Nickel Metal 2.0 3.25 g/L

Sodium Hypophosphite 10.0 18.0 g/L

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Nitrates
Tin


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32.0 Rinsing
Rinsing is the next most important part of the process. It is these intermediate
stages that can save or cost money. Poorly rinsed components will allow
cross contamination of all process solutions leading to short solution life -
Frequent dumping and remaking of process solutions.
Effective rinsing will improve the quality of the finished work and allow process
solutions a longer and more effective life.
33.0 Air Agitation
All solutions require some form of movement, i.e.
z To remove depleted chemistry and replace with new at the

liquid/component surface interface
z To wash away and dilute process chemistry in rinses
z To aid in solution movement to avoid temperature striation
In most solutions this can be achieved by using air.
A moderate supply of good clean air will increase the effectiveness of most
solutions.
In the ABS process sequence there are a couple of exceptions.
These are:
The Reducer:
Air agitation will deplete the Part B of the reducer solution.
The Electroless Nickel:
Air agitation will promote the evaporation of Ammonia, which controls

the pH of the solution.
Air agitation in non-ammoniated solutions will increase the stability of
the process, and may lead to over stability.

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34.0 Filtration
The following solutions should all have filters, which should be used
continuously. Cartridge filters of 1 where possible.
Etch:
In installations where the costs of replacement, or quality of finish are

critical.
Activator:
Filtration to remove large particles and extend activator life.
Reducer:
Continuous filtration to remove break down products formed as a by-

product of the process, and precipitated contaminants.
Electroless Nickel:
Continuous filtration to remove particulates to avoid roughness.

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35.0 Ionic Activator Troubleshooting
Problem Cause Suggested Remedy

Rack Plate Low Sulphuric acid in activator Add 0.5g/l sulphuric acid
High Palladium content in activator to the activator or first
post activator rinse
High temperature in activator
Reduce time, temperature
or concentration of
activator
Reduce temperature of
activator
Skip Plate Low palladium adsorption Increase palladium
concentration in 2mg/l
increments
Add 2mg/L increments of
palladium to the etch
solution
Increase time or
temperature in activator
Note:
There is no discolouration of the surface of the plastic polymer after

immersion in the Infinity activation solution. It is therefore difficult to identify
whether the palladium has been adsorbed onto the surface of the polymer. It
is only after processing through the electroless nickel stage that potential
problems may become apparent.

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36.0 Ionic Reducer Troubleshooting
Problem Cause Suggested Remedy

Skip plate on edges of parts Over reduction Reduce time Reduce
Too high a temperature.
temperature Check Chemistry
Skip plate in major areas on Under reduction Increase time

parts or slow starting in the Low temperature Increase
electroless solution MACuPlex Infinity temperature.
characterised by the coating Part B low Check chemistry
initiating at the edge and then
spreading inward.

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ABS Chrome Plating MacuPlex Technical Package YWC V2.0

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Plating on Plastic Coatings

Section Description Pages

MacDermid plc, Palmer Street, Bordesley, Birmingham B9 4EU

Section Description Pages

MacDermid plc, Palmer Street, Bordesley, Birmingham B9 4EU

Section Description Pages

MacDermid plc, Palmer Street, Bordesley, Birmingham B9 4EU

1.0 ABS Plastic Materials

Product Manufacturer Material

Cycolac 1000 General Electric Plastics ABS

MacDermid plc, Palmer Street, Bordesley, Birmingham B9 4EU

2.0 Moulding Prior To Plating

ABS is a rigid copolymer containing distinct globules of butadiene. In the

3.0 Moulding Design Criteria

Large wall thickness changes should be avoided wherever possible, as the

As part of the mould design consideration, where there are to be changes in

In the creation of plastic mouldings, designers sometimes feel that in order to

MacDermid plc, Palmer Street, Bordesley, Birmingham B9 4EU

A successful method of gaining strength and rigidity in mouldings without

The radii at both external and internal plane intersections should be as

A minimum radius of 1mm external and 0.5mm internal is recommended for

3.5 Appearance Design

A slight surface crown of 0.010 0.015 cm/cm is recommended over broad

MacDermid plc, Palmer Street, Bordesley, Birmingham B9 4EU

4.0 Part Performance

It should be remembered that during the electroplating process parts designed

This problem is one of those most often encountered and therefore

It should always be remembered that corrosion performance in accelerated

4.1 Thermal Performance Requirements

It is a pre-requisite of automotive finishing for plating on plastics that

MacDermid plc, Palmer Street, Bordesley, Birmingham B9 4EU

Part geometry has a very profound effect on thermal performance.

Solid plastic, extremely thick cross sections or heavy mass-to-surface area

The intersection of ribs on the same plane is not recommended. Lowering

Resin characteristics have a major effect on thermal performance. As a

Moulding techniques affect thermal performance. Gating, runner systems and

MacDermid plc, Palmer Street, Bordesley, Birmingham B9 4EU

4.2 Electroplate Distribution

Selective plating is also another means of controlling electroplate distribution.

Stop-offs or plating resists are normally applied by conventional spray, dip or

The use of auxiliary anodes to enhance the thickness of the electrodeposit in

MacDermid plc, Palmer Street, Bordesley, Birmingham B9 4EU

5.0 Moulding Design Considerations

z Integral parts should be used to avoid welded joints

z Gates should be put in non-appearance areas and should be 50% larger

z Ribs and bosses should be designed to eliminate sink marks

z Parting lines should be put in non-significant areas if possible

z Close tolerant fits must include the final electroplate thickness

z Wall thickness should be as thick as possible for rigidity and adhesion

z Plate uniformity, as a result of high and low current densities must be

z The designer should take into account and be aware of:

z Consideration should also be given to blind recess rack contact areas

MacDermid plc, Palmer Street, Bordesley, Birmingham B9 4EU

5.1 Moulding Considerations

The surface of a moulding, which is to be plated in a decorative finish, i.e.

5.2 Surface Composition Requirements

5.3 Internal Moulding Conditions

MacDermid plc, Palmer Street, Bordesley, Birmingham B9 4EU

5.4 Water Cooling

The sprue area is normally maintained at a higher temperature than the

6.0 Equipment Selection

MacDermid plc, Palmer Street, Bordesley, Birmingham B9 4EU