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1 Introduction.............................................................................. 1-1
The XDM-100 Concept..................................................................................... 1-2
XDM-100 Platform Overview............................................................................ 1-3
XDM-100 Platform Options .............................................................................. 1-4
5 Maintenance............................................................................. 5-1
Overview .......................................................................................................... 5-1
Required Test Equipment, Tools, and Materials .............................................. 5-1
Preventive Maintenance................................................................................... 5-2
Traffic Monitoring System................................................................................. 5-6
Onsite Troubleshooting .................................................................................. 5-12
Replacing Cards and Modules ....................................................................... 5-22
Replacing xRAP/xRAP-100 Components ...................................................... 5-31
B XDM-100H................................................................................ B-1
Overview .......................................................................................................... B-1
XDM-100H Description..................................................................................... B-2
XDM-100H Configuration Options.................................................................... B-3
I/O Modules ...................................................................................................... B-7
TPU/OCU Shelf .............................................................................................. B-11
CWDM Networking Modules .......................................................................... B-11
Installing the TPU/OCU .................................................................................. B-21
Overview
The XDM-100 Installation and Maintenance Manual (IMM) provides
installation and maintenance instructions for XDM-100 shelves.
Intended Audience
This manual is intended for installation and other qualified service personnel
responsible for installing the system and its accessories.
The instructions in this manual require you to understand and follow the safety
practices included in this manual, as well as any applicable national regulations
and those enforced at your site. They also require that you understand the
physical, optical and electrical requirements of the installation site.
Documentation Conventions
When applicable, this manual uses the following conventions:
Convention Indicates Example
Bold Names of menus and On the Alarms menu
commands
Menu Option A selection from a menu Select Update View
Objects
Italics New terms and Build-as-you-grow
emphasized text architecture
Boxes around text Notes, cautions, warnings See examples below
Related Documentation
The following publications may be of assistance to you in the installation and
commissioning processes. Some of these documents present information
supplied in this installation manual in greater or lesser detail.
XDM-100 Miniature MSPP for Metro-Access and Cellular Networks
General Description
XDM System Specifications
XDM Element Management System (EMS-XDM) User Manual
eNM LightSoft Network Management System User Manual
IEC Publication 825 Laser Safety Requirements
Telephone + 972-3-9266000
Telefax + 972-3-9266370
Email mailto:on.support@ecitele.com
Documentation Feedback
Your comments are welcome. Please send us your comments in one of the
following ways:
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Fax your comments to +972-3-9268060
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In This Chapter
The XDM-100 Concept .............................................................. 1-2
XDM-100 Platform Overview.................................................... 1-3
XDM-100 Platform Options....................................................... 1-4
In This Chapter
Overview .................................................................................... 2-1
Outline of Installation Procedure................................................ 2-1
Site Preparation........................................................................... 2-3
Tools and Test Equipment .......................................................... 2-5
Installing XDM-100 in Racks..................................................... 2-7
Preparing Cables and Fibers ..................................................... 2-13
Work and Equipment Safety..................................................... 2-19
Protection against ESD............................................................. 2-28
Overview
This chapter contains important information that will help you carry out a safe
and trouble-free installation.
1 Prepare the installation site and check physical location, Site Requirements (see
environmental compliance, and availability of power sources. "Site Preparation" on
page 2-3)
2 Prepare power, alarm, management, and transmission cables at Preparing Cables and
the installation site. Fibers (on page 2-13),
Equipment Installation
(on page 3-1)
3 Route the required power, alarm, management, and transmission Equipment Installation
cables to the intended XDM-100 equipment location. (on page 3-1)
4 If required, install the equipment racks. Rack Installation
5 Mark the location of each XDM-100 shelf and relevant
accessories (Fiber Storage Tray [FST], patch panels, and Optical
Distribution Frame [ODF]) on each rack, in accordance with the
site installation plan.
Note: If you are currently installing an XDM-100 shelf without
TPU protection, you may want to leave sufficient space above
the shelf to enable the addition of the TPU cage at a later stage.
6 When applicable, install the EMS-XDM management station. EMS-XDM
User Manual
7 Install the power distribution and alarm panels Installing the xRAP-100
(xRAP/xRAP-100) and other equipment needed in each rack. (on page 3-13) or
Installing the xRAP (on
page 3-23)
8 Install the XDM-100 shelves in the appropriate rack. Installing the XDM-100
Shelf in the Rack (on
page 3-45)
9 For each XDM-100 shelf where optical modules are used, install Installing the Fiber
an FST above the XDM-100 shelf and route the optical fibers to Storage Tray (on page
the FST. 3-35)
Note: Even if you are not currently installing an FST, it is
recommended that you leave enough space above the XDM-100
shelf to enable future installation, in case optical modules are
added to the shelf at a later stage.
10 Install the ECU, FCU, and MXC cards in the shelf. Installing XDM-100
Cards (on page 3-48)
11 Install the prescribed I/O modules in the shelf. Installing XDM-100
Modules (on page 3-53)
12 Install the prescribed aggregate modules in the MXC-100 card. Installing Aggregate
Modules in MXC-100
Cards (on page 3-54)
13 If applicable, install the TC card and the prescribed TPMs in Installing TPU Modules
the TPU. (on page 3-63)
NOTE: In some cases, you may need to add a TPU unit after
the XDM-100 has already been installed. Instructions for this
procedure are provided in Installing a TPU on the XDM-100
Shelf (on page 3-84).
Site Preparation
Perform a preliminary survey of the installation site, taking into consideration
the following issues:
System environmental requirements,
Physical location of the XDM-100 shelves
Location of power sources
Types of interfaces used at the site (optical, electrical, management, alarm
monitoring, and so on)
Work and equipment safety requirements
Environmental Requirements
The following environmental conditions are applicable to XDM-100 equipment
and must be provided at the installation site:
Physical Location
Equipment type Height (mm) Width (mm) Depth (mm) Max. weight (kg)
XDM-100 200 443 231 7.6 (shelf only)
20.2 (fully populated)
TPU 75 443 231 5.5 (shelf only)
10 (fully populated)
XDM-100 + TPU 275 443 231 13.1 (shelf only)
30.2 (fully populated)
Equipment type Height (mm) Width (mm) Depth (mm) Max. weight (kg)
xRAP 100 450 285 10
xRAP-100 133 445 185 10
xDDF-21 44.5 440 150 3
Fiber Storage Tray 44.5 440 240 5
ODF 44.5 440 240 8
Power Sources
XDM-100 shelves must be powered only by DC sources complying with the
applicable sections of ETSI 300 132-2 and FTZ 19S1, and the SELV or TNV
requirements of EN 60950. The nominal supply voltage is -48 or -60 VDC
(positive lead grounded); however, the allowed supply voltage range is -40 to
-75 VDC. For redundancy, two separate DC power sources should be available.
The power consumption of the XDM-100 is:
Typical: 300 W
Maximum: 600 W
Environmental Considerations
Observe the following guidelines for the installation of XDM-100 shelves in
racks:
1. Free airflow through the rack must be guaranteed at all times.
2. XDM-100 shelves can be installed in open or closed (with door) racks.
When installed in a closed rack, the door must be perforated. An example
of a rack with a perforated door is the ETSI A rack shown in the figure
below.
3. Always install the first XDM-100 shelf in the lower part of the rack,
leaving a space of at least 1U from the bottom of the rack.
4. In mixed (horizontal and vertical airflow) equipment installations, always
install the equipment with the horizontal airflow (XDM-100) in the lower
part of the rack, and the equipment with the vertical airflow (for example,
XDM-1000) above it.
5. Leave a space of at least 1U between the upper accessory of the XDM-100
and the next shelf.
6. Leave as much space as possible between the racks cable supports and the
XDM-100 sidewalls.
7. Always consider the shelf airflow requirements when organizing the cable
and fiber routes near the XDM-100 sidewalls.
Fiber Storage Tray. A separate FST can be installed above each XDM-100
with optical modules. Each FST contains two storage reels, enabling the
fiber to be stored on the right or left side of the tray. Leave at least 50 mm
free space between the XDM-100 cabling accessories and its FST, and
another 50 mm free between the fiber tray and the next XDM-100 shelf.
Cable guide. A cable guide should be installed just above the XDM-100. It
helps neatly route of electrical cables connected to the shelf.
A fiber guide installed above the cable guide. The fiber guide helps to
obtain a tidy route of fibers, while keeping the minimum allowed bend
radius.
Grounding Cables
Equipment installed in racks is bonded through the screws that are used to
fasten the equipment chassis to the frame of the rack. Therefore, it is necessary
to provide a reliable, low-impedance connection between the rack frame and
the site grounding bus using copper conductors.
Connect the rack grounding screw and the site grounding bar with a 2 AWG
(35 mm2) or thicker copper lead with yellow/green insulation, in compliance
with UL/ETSI recommendations. The xRAP/xRAP-100 end of the lead must
be terminated in an M6 lug suitable for the gage of the lead in use.
Route grounding conductors along the shortest possible route. Treat the bare
portion of the conductor with antioxidant and connect a listed two-hole
compression lug. If the lug is not plated, bring it to a bright finish and coat it
with antioxidant before connecting it to the frame of the rack. Do not mix
conductors of different types of metal.
DC Power Cables
DC power cables should be prepared onsite. Two types of DC power cables are
needed:
xRAP/xRAP-100 input power cables
Shelf power cables
Alarm Cables
Alarm cables used within XDM-100 equipment racks are included in the
shipment according to the site specifications.
Alarm indications are carried by the following cables:
Shelf alarm indication cable. One shelf alarm indication cable is required
for each XDM-100 shelf installed in the rack. The cable connects between
the ALARMS connector on the XDM-100 and one of the RAP connectors
located on the xRAP or SHELF connectors located on the xRAP-100.
Cable length is 2.0 m. Refer to xRAP alarms cable (on page C-9) for a
description of this cable.
Bay alarm cable. This cable is usually prepared onsite, and carries the
alarm indications and monitoring lines of the bay (rack). The alarm
indications and monitoring lines are available in the CONTROL
CONNECTION connector located on the xRAP or in the ALARM IN/OUT
connector located on the xRAP-100. One bay alarm cable is required for
each rack.
Management Cables
The connection of out-of-band management communication to an XDM-100 is
made by means of a mini-hub with a pair of the RJ-45 ETHERNET connectors,
located on the ECU-F card.
If one XDM-100 is installed, the connection is made to the MNG MAIN RJ-45
connector. If more than one XDM-100 is installed in the same site, it is
possible to save the use of an external hub. In this case, the first system is
connected as explained above, and the other systems are connected in an
ETHERNET daisy chain. The MNG MAIN connector of each system is
connected to the MNG PROT connector of the previous system.
If ECU cards are used, each XDM-100 is connected to an external hub.
Suitable standard Ethernet station cables are available from many sources.
Cables of Category 3 or better must be used. In any case, the length of the
cables must not exceed the maximum recommended for the cable type and hub
port in use (up to a few dozen meters).
If the site timing reference distribution subsystem has unbalanced (75 ) G.703
interfaces, a 120 /75 adapter can be supplied for mounting on the
T3_1/T4_1 and T3_2/T4_2 connectors. This permits using coaxial cables
(BT3002 or equivalent) of the same type used for connecting to balanced E1
tributary interfaces.
Optical Fibers
Optical fibers can be prepared onsite.
Optical fibers used to connect to optical interfaces should use only 2 mm fibers.
For each optical interface, ECI Telecom supplies patch cords with mating
optical connectors already attached to the fiber. Therefore, only the optical
termination on the ODF side, which is installation-dependent, must be installed
onsite.
The optical fibers for connecting to equipment installed in a given rack should
enter the rack from the top, be threaded through cable guides running along the
rack side rails, and end at the fiber storage tray. The tray must contain enough
fiber length for extracting modules from the XDM-100 and for replacing fiber
in case of damage (splicing repairs).
When routing fibers, make sure to observe the minimum bending radius (35
mm).
The following table lists the type of cables and mating connectors needed to
prepare cables for each XDM-100 module.
Mating Qty/
I/O module Interface type Fiber type
connector module
SIM1_4/O STM-1 optical 1 pair of fiber patch LC male 8 fibers
cords per interface
Mating Qty/
I/O module Interface type Fiber type
connector module
SIM1_4/OE STM-1 optical 1 pair of fiber patch LC male 4 fibers
cords per interface
SAM1_4/O STM-1 optical 1 pair of fiber patch LC male 8 fibers
cords per interface
SAM1_4/OE STM-1 optical 1 pair of fiber patch LC male 4 fibers
cords per interface
SIM4_2 STM-4 optical 1 pair of fiber patch LC male 4 fibers
cords per interface
SAM4_2 STM-4 optical 1 pair of fiber patch LC male 4 fibers
cords per interface
SAM16_1 STM-16 1 pair of fiber patch LC male 2 fibers
cords per interface
Mating Qty/
I/O module Interface type Fiber type
connector module
PIM2_21 E1 balanced Twin multipair cable (2 x Twin 50-pin 1
(2.048 Mbps) 21 shielded 120 twisted SCSI male
pairs)
PIM2_63 E1 balanced Twin multipair cable (2 x Twin 50-pin 3
(2.048 Mbps) 21 shielded 120 twisted SCSI male
pairs)
PIM345_3 E3 and DS3 NCX coaxial cable DIN1.0/2.3 6
(34/45 Mbps) male
Mating Qty/
I/O module Interface type Fiber type
connector module
SIM1_4/E STM-1 NCX coaxial cable DIN1.0/2.3 8
electrical male
SIM1_4/OE STM-1 NCX coaxial cable DIN1.0/2.3 4
electrical male
SAM1_4/E STM-1 NCX coaxial cable DIN1.0/2.3 8
electrical male
SAM1_4/OE STM-1 NCX coaxial cable DIN1.0/2.3 4
electrical male
When a TPU is used, additional patch traffic cables between PIMs and TPMs
are required, as described in the table below.
Table 2-6: Patch traffic cables connecting I/O modules to the TPU
Qty/
TPM Interface type Cable type Mating connector
module
TPM2_ 3 E1 balanced Twin multipair PIM: Twin 50-pin SCSI 4
(2.048 Mbps) cable (21 pairs male
of shielded 120 TPM: 100-pin SCSI male
twisted pairs)
TPMH_1 E3 and DS3 RG179x8 PIM: DIN1.0/2.3 male 2
(34/45 Mbps) multicoaxial TPM: 8W8 D-type
STM-1 electrical cable
The table below the type of Ethernet electrical traffic cables and the mating
connectors needed for each EISM module.
Grounding Requirements
All the equipment, including XDM-100 shelves, ancillary units, and equipment
from other vendors, must be properly grounded at all times. Good equipment
grounding is necessary to protect personnel and equipment, minimize noise,
and allow the discharge of accumulated static charges to earth.
The rack mounting rails must be free of paint, and provide electrical continuity
to the main grounding bolt. The resistance between any rail and the rack main
grounding bolt must be less than 0.1 .
Pay particular attention to the area in which the xRAP/xRAP-100 is attached:
remove paint from the rack in this area to ensure efficient electrical contact.
Identification of UL listing
XDM-100 shelves are UL-listed. The following is a typical UL label.
Laser classification
The equipment and components with laser devices described in this manual
comply with the International Electrotechnical Commission (IEC) safety
standards, including IEC-60825-1 Safety of Laser Products and IEC-825
Safety of Optical Fiber Communication Systems.
With specific regard to the laser, XDM-100 equipment complies with laser
product performance standards set by government agencies for Class 1 laser
products. The product and its accessories do not emit hazardous light, and the
beam is totally enclosed during all operating modes and maintenance.
LASER KLASSE1
CLASS 1 LASER PRODUCT
HAZARD CLASS 1M
LASER RADIATION
WHEN OPEN AVOIO
EXPOSURE TO THE BEAM
Laser information
Information regarding the various optical modules available for the XDM-100
platform is provided in the following tables.
Personnel Training
During production and assembly, equipment is handled in workspaces
especially prepared and certified to serve as a permanent EPA. However, in
many cases the environment in which the same equipment is installed or
maintained cannot be assumed to form an EPA with a permanently controlled
boundary. Therefore, all the work involving handling of unprotected ESDS
must be considered as field work.
Field work in this context includes such activities as service and maintenance,
installation, site inspections, and commissioning of components and assemblies
classified as ESDS, together with associated packing and unpacking activities.
All the staff involved in field work must be trained to perform field work in the
same way as work performed in permanent EPAs with respect to the material
quality and personal responsibilities, training, labeling, and packing.
A means of equipotentially bonding the operator and any work surface and
flooring to ground must be used. For this purpose, the work surface and wrist
straps must be bonded either to a designated ground bonding point or to the
equipment being serviced, as shown in the above figure.
Whenever available, the mains ground will serve as the ESD grounding facility.
To enable ESD bonding to ground of equipment racks and any other non-
moveable equipment containing ESDS, an ESD ground bonding facility must
be located near such equipment, or the equipment must be fitted with a
designated ground bonding point presenting a resistance to ground not greater
than 1 M.
In This Chapter
Overview .................................................................................... 3-2
Unpacking and Visual Inspection............................................... 3-7
Installation Options..................................................................... 3-8
Installing Ancillary Units in Racks........................................... 3-12
Installing the Air Filter ............................................................. 3-42
Installing the Shelf in the Rack................................................. 3-45
Grounding the XDM-100 Shelf ................................................ 3-46
Installing XDM-100 Cards ....................................................... 3-48
Installing XDM-100 Modules .................................................. 3-53
Installing TPU Modules............................................................ 3-63
Connecting Fibers and Cables to the XDM-100 in ETSI A racks3-69
Connecting Fibers and Cables to the XDM-100 in ETSI B Racks3-81
Installing a TPU on the XDM-100 Shelf.................................. 3-84
Overview
This chapter provides general instructions for the installation of the XDM-100
and auxiliary equipment.
The procedures for equipment replacement and upgrades are similar to those
described for installation of the equipment, and when relevant, notes regarding
live replacement or upgrade are inserted in these procedures.
The information appearing in this chapter should be used in conjunction with
specific site installation plans in the particular customer network. If you are
interested in obtaining design or installation assistance from ECI Telecoms
Optical Networks Divisions Customer Support team, or wish to prepare a
network installation plan, contact your ECI Telecom sales representative.
The XDM-100 shelf, cards, modules, and ancillary equipment are described in
Equipment Description (on page A-1).
Preliminary Preparations
The installation procedures provided in this chapter assume that:
The sites at which the installation procedures are carried out comply with
the requirements listed in Site Requirements (see "Site Preparation" on
page 2-3)
The preliminary preparations specified in Before You Start (on page 2-1),
for example, rack installation, availability of grounding and power sources,
preparation and routing of cables, routing of traffic cables to the rack
locations, and so on, have been completed
Before you start, determine what equipment is to be installed in the rack by
referring to the site installation plan, and note the exact position of each unit (to
avoid errors, it is recommended that you mark the prescribed positions on the
rack rails using a soft pencil).
NOTE:
If you are not installing an FST for a particular XDM-100
shelf, it is recommended that you leave empty space in the
rack in case optical modules are added to the shelf in the
future.
If you are not installing a TPU for a particular XDM-100
shelf, it is recommended that you leave empty space in the
rack so that the protection unit can be added in the future,
if required, without interrupting operation.
CAUTION:
If additional equipment is used in the rack, a heat buffer
or a buffer plate must be installed between any such
additional equipment and the XDM-100 shelf to minimize
the transfer of heat from shelf to shelf. This heat buffer
must be purchased from ECI Telecom.
During the installation of equipment in the rack, make
sure all optical connectors are closed by protective caps.
Do not remove the cap until an optical fiber is connected
to the corresponding connector.
3. Search the shipping boxes for any additional small items that may be
present.
4. Open each of the module and card packages for inspection, but do not
remove the modules/cards from their individual packages.
5. To protect the modules/cards against possible damage, keep them in their
protective packages until they can be inserted in the shelf.
6. Check the contents of the shipping boxes against the packing list attached
to each box. If damaged parts are detected or if any parts are missing,
notify the project manager and your local ECI Telecom representative.
Installation Options
XDM-100 shelves can be installed in 19", 600 mm depth racks. These racks
can be installed on wooden, concrete or suspended floors, or suspended from
overhead mountings. An example of an approved 19" rack, and rack
installation procedures are given in Rack Installation.
In general, ancillary units are attached to the rack side rails by four M6 Philips
screws. No preparation is required before installation. The following sections
provide mechanical installation instructions for units that require additional
procedures. Skip sections that are not relevant to your particular application.
The DC input power cables connect between the two DC power sources and the
xRAP-100 source A and source B inputs. Two cables are required, one for each
source.
Grounding stud
2. Open the two captive screws fastening the xRAP-100 front cover and
remove the cover.
3. Identify the various terminals located on the power source terminal board in
accordance with the figure below. This figure shows the terminals at the
source A side; the same board is used at the source B side.
4. Bring the two leads of one DC source input power cable to the appropriate
xRAP-100 opening.
5. Attach the lug of the red lead to the positive stud terminal marked (+) on
the power terminal board.
6. Secure the lug using a flat washer, a spring washer, and a nut. Tighten the
nut with a torque of 450 to 550 N cm.
7. Attach the lug of the black lead to the negative stud terminal marked (-) on
the power terminal board.
8. Repeat Step 6 for the black lead lug.
9. If an additional power source (source B) is used, repeat Steps 3 to 8 for
source B.
10. Route the DC input power cables towards the cable support bracket at the
rear of the xRAP-100 (see Location of xRAP-100 grounding stud (on page
3-15)), and attach them to the bracket with cable ties.
2. Insert the end of the DC power cable terminating with a 3-pin D-type male
connector near the SOURCE A power connectors and connect it to
connector SHELF 1 (see above figure).
6. Route the DC power cables towards the cable support bracket at the rear of
the xRAP-100 (on page 3-15), and attach them to the bracket with cable
ties.
7. Route each shelf power cable along the rack side rails down to the
corresponding shelf position, then securely attach the power cable to the
rack inner wall using cable ties. Attach a tag to each power connector in
accordance with its function.
3. Insert the circuit breaker into the circuit breaker sockets located on the
xRAP-100 source A power terminal board, as shown in the above figure.
4. If more than one shelf is powered from source A, repeat Steps 2 and 3 to
insert the other circuit breaker into the corresponding shelf position of the
power terminal board.
5. If an additional power source is used, repeat Steps 2, 3, and 4 for source B
circuit breakers.
Position 2
Position 3 Position 1
ALARM
7&8 5&6 3&4 1&2
321 321 321 321 SHELF
ALARM
7&8 5&6 3&4 1&2
321 321 321 321 SHELF
The DC input power cables connect between the two DC power sources and the
xRAP source A and source B inputs. Two cables are required, one for each
source.
2. Open the two captive screws fastening the xRAP front cover and remove
the cover.
3. Identify the various terminals located on the power source terminal board
by referring to the figure below. This figure shows the terminals at the
source A side; the same board is used at the source B side.
4. Bring the two leads of one DC source input power cable to the appropriate
xRAP opening.
5. Attach the lug of the red lead to the positive stud terminal marked (+) on
the power terminals board (see the figure above).
6. Secure the lug using a flat washer, a spring washer, and a nut. Tighten the
nut with a torque of 1150 to 1300 N cm.
7. Attach the lug of the black lead to the negative stud terminal marked (-) on
the power terminals board (see the figure above).
8. Repeat Step 5 for the black lead lug.
9. If an additional power source (source B) is used, repeat Steps 3 to 8 for
source B.
10. Route the DC input power cables towards the cable retainers at the rear of
the xRAP (see Location of xRAP grounding stud (on page 3-27)), and
attach them to the retainers with cable ties.
11. Secure the DC input power cables to the rack inner wall using cable ties.
4. Make sure the voltage is within the allowed range (-40 to -75 VDC), and
that it has the correct polarity.
5. Return all the xRAP circuit breakers to OFF.
6. Disconnect the xRAP input power sources.
7. Reinstall the xRAP front cover and fasten it using the two captive screws.
5. Route the two cables along the side of the rack down to the corresponding
shelf position. Attach a tag to each connector in accordance with its
function.
6. If you are installing additional shelves in the rack, repeat Steps 2, 3, 4 and 5
for the cables serving them. Make sure to attach identification tags to each
cable end.
The procedures for attaching the rack mounting brackets to the fiber guide and
installing the fiber guide in ETSI B racks are identical to the procedures for
ETSI A racks described in Installing the Fiber Guide for ETSI A Racks (on
page 3-33).
NOTE: The FST has two opening positions. The tray latches
with a click at the halfway position. Pull it again to open it
fully so that you can thread the fibers.
6. Thread the fibers into the FST, as illustrated in the figure below.
2. Hold the end of the swing-out tray and pull it out to gain access to the ODF
components.
3. Open the two cover thumb nuts and remove the protective cover from the
ODF splice support.
4. Insert the external fibers cable through the protective tube.
5. Route the fiber ends through the cable guides as shown to the splice support
area.
6. Identify the adapter panel pigtail to be spliced to each user fiber.
7. Insert splicing sleeves over the pigtail, splice the user fiber to the pigtail,
and then slide the splicing sleeve over the splice.
8. Place the splicing sleeve in one of the slots in the splice support.
9. After splicing all the fibers, reinstall the protective cover removed in Step
2.
10. Push the swing-out tray back into the unit.
11. Close the ODF's front cover by pushing it up till it clicks to the unit.
12. Refer to Attaching rack mount brackets (on page 3-37) and secure the user
fibers with cable ties to the fiber fastening bracket at the rear of the ODF.
NOTE: The OPP has two opening positions. The tray latches
with a click at the halfway position. Pull it again to open it
fully so that you can thread the fibers.
6. Thread the fibers into the OPP, as illustrated in Threading and connecting
optical fibers in the OPP (on page 3-41).
7. Identify the duplex connector position on the duplex connectors panel (on
page 3-41).
8. Connect each equipment fiber to the corresponding network fiber according
to the site cabling diagram and the detailed cabling diagrams or tables of
each shelf.
9. Run the fibers up to the level of the corresponding optical connector.
10. Return the OPP to the rack until it latches in place with a click.
NOTE: Air filters are not supported for 19" rack installations
1. Open the six short screws fastening the right mounting bracket to the shelf.
2. Open the two long screws.
3. Remove the mounting bracket.
1. Place the spacer plate on the right side of the shelf as illustrated.
2. Place the filter frame on the spacer plate and fasten it to the shelf using the
six short screws supplied in the filter installation kit.
3. Insert two long screws from the filter installation kit as illustrated, and
fasten them to the shelf.
1. Open the two captive screws fastening the front panel to the frame, and
remove the panel.
2. Identify the filter's air intake side, indicated by two coding tabs.
3. Insert the clean filter in the frame, with the air intake side facing to the
right, and slide it forwards until its front edge is flush with the front frame
edges.
4. Reinstall the filter front panel and fasten it to the frame with its two captive
screws.
The XDM-100 with an air filter installed is illustrated in the following figure.
1. Check that the FCU has not been physically damaged during shipment, and
that the antistatic protection bag of the original packaging is sealed.
2. Remove the FCU from its antistatic protection packaging and perform a
visual inspection to detect damage during shipping. Report any problems.
3. Record the hardware version indicated on the units identification label.
4. Insert the rear end of the FCU into the card guides.
5. Push the FCU in until it mates the chassis connectors and the front of the
card is flush with the front of the XDM-100 shelf. If you feel resistance
before the connectors are mated, pull the fan unit out and repeat the
procedure.
6. Secure the FCU in place by tightening the two captive screws.
1. Check that the card has not been physically damaged during shipment, and
that the antistatic protection bag of the original packaging is sealed.
2. Remove the card from its antistatic protection packaging and perform a
visual inspection to detect damage during shipping. Report any problems.
3. Record the hardware and software versions indicated on the cards
identification labels.
4. Insert the rear end of the ECU into the card guides.
5. Push the ECU in until it mates the chassis connectors, and the front of the
card is flush with the front of the XDM-100 shelf. If you feel resistance
before the connectors are mated, pull the card out and repeat the procedure.
6. Secure the ECU in place by tightening the two captive screws.
1. Check that the card has not been physically damaged during shipment, and
that the antistatic protection bag of the original packaging is sealed.
2. Remove the card from its antistatic protection packaging and perform a
visual inspection to detect damage during shipping. Report any problems.
3. Record the hardware and software versions indicated on the cards
identification labels.
4. Bring both extractor handles of the card forward.
5. Insert the rear end of the MXC-100 card into the card guides.
6. If the NVM card was not installed in the MXC-100, install it as follows:
a. Check that the NVM card has not been physically damaged during
shipment.
b. Remove the NVM from its antistatic protection packaging and perform
a visual inspection to detect damage during shipment. Report any
problems.
c. Orient the NVM card against the dedicated slot on the MXC-100, and
then insert its rear end (the end with the connector) in the card guides,
and push in until it is locked in place.
d. Place the NVM cover on the slot, and fasten it with its two captive
screws.
7. Push the MXC-100 in until it mates the chassis connectors and the front of
the card is flush with the front of the shelf. If you feel resistance before the
connectors are mated, pull the card out and repeat the procedure.
8. Turn the two extractor handles to the horizontal position to lock the card in
place.
9. First close the upper left screw securing the MXC-100 in place, and then
the upper right screw and the two lower screws.
10. Install the required aggregate modules according to the site installation
plan, as described in Installing Aggregate Modules in MXC-100 Cards (on
page 3-54).
11. Close any unused aggregate slots with the supplied blank panel using the
four captive screws on the panel.
WARNING:
To reset the system using the RESET button, you must
first remove the NVM cover.
To extract the NVM, press the release pushbutton using
the cover as a tool.
CAUTION:
If you feel resistance during insertion, immediately retract
the module and repeat the process.
Do not use excessive torque when tightening the fastening
screws of modules.
CAUTION:
CAUTION:
When installing optical modules, make sure all SFP
transceiver slots are closed by protective caps. Do not
remove the cover until an SFP is inserted.
For your safety, to comply with electro-magnetic
compatibility (EMC) requirements and to prevent escape
of the ventilation from the fans through these openings, it
is required that you protect all unused slots with blank
panels.
free to move backward as the module slides in. If you feel resistance before
the connectors are fully mated, retract the module and repeat the procedure.
6. Fasten the module to the chassis by tightening the two fastening screws. Do
not use excessive torque when tightening the screws.
7. If you are installing an optical or mixed module with SFP transceivers,
proceed to Installing SFP Transceivers in Optical Modules (on page 3-58).
After inserting all the modules, check for correct installation against the
module insertion diagram. Install blank panels over all the free slots.
5. Remove the protective covers from the slot and from the SFP transceiver.
6. Insert the rear end of the transceiver into the slot guides, and push slowly
backwards to mate the connectors until the transceiver clicks into place. If
you feel resistance before the connectors are fully mated, retract the
transceiver and repeat the procedure.
CAUTION: All slots that are not in use must remain covered.
If you have to replace a module, remove the SFP first.
Because the PIM 2_63 and EISM modules occupy a pair of slots each, before
you can install them you must first remove the guide between the pair of slots.
The procedure for removing the modules guides differs, depending on whether
you are using the two upper slots (I1&I2 or I3&I4) or the two lower slots
(I5&I6 or I7&I8).
3. Identify the black anodized U-shaped metal part on the upper module guide
above the guide you have removed. Slide the black anodized part
backwards and downwards to remove it.
Figure 3-38: Removing the black anodized metal part from the upper module
guide
8. After inserting all the modules, check for correct installation against the
module insertion diagram. Install blank panels over all the free slots.
feel resistance before the connectors are mated, pull the module out and
repeat the procedure.
6. Fasten the module to the chassis by tightening the two fastening screws.
7. After inserting all the modules, check for correct installation against the
module insertion diagram. Install blank panels over any free slots.
6. Fasten the module to the chassis by tightening the two fastening screws.
7. After inserting all modules, check for correct installation against the
module insertion diagram. Install blank panels over any free slots.
2. Connect the free ends of the power cables, in accordance with the rack
installation plan and the cable tags, to the DC power connectors on the
MXC-100 front panel as follows:
If there are two MXC-100 cards (redundancy configuration), the power
cable from Source A is connected to the POWER IN A connector of the
MXC-100 in slot MXC-A, and the power cable from Source B is
connected to the POWER IN B connector of the MXC-100 in slot
MXC-B
If there is one MXC-100 card (non-redundant configuration), both
power cables are connected to the same MXC-100 POWER IN A and
POWER IN B
3. Connect the free ends of the alarm cable, in accordance with the rack
installation plan and the cable tags, to the ALARMS connectors on the
ECU/ECU-F front panel.
(Fiber Storage Tray) above the XDM-100 shelf you are installing, and threaded
into the FST, as described in Installing the Fiber Storage Tray (on page 3-35).
NOTE: The FST has two opening positions. The tray latches
with a click at the halfway position. If you cannot release the
fiber in the halfway position, pull the tray again to open it
fully.
3. Insert the end of the fiber in the appropriate slot of the conduit running
along the front support of the rack, and route it to the appropriate level.
4. At the desired level, lead the end through the appropriate slot of the
conduit, and pass the fiber through one of the slots in the fiber guide.
5. Bring the end of the fiber to the LC connector on the designated module.
Leave some slack to prevent stress.
6. Thoroughly clean the connectors of the optical fibers, using an approved
cleaning kit.
7. Remove the cover from the module connector, and connect the fiber
connector to the module connector.
8. Repeat Steps 2 through 7 for all optical modules in the XDM-100 shelf.
9. When you have finished connecting all the optical modules, gently push the
FST back into the rack until it clicks into place.
the cable connector is positioned against the appropriate slot. Use cable ties
as required to fasten the cable to the rack side rails.
5. Use a cabling diagram of the site to associate module connectors with the
appropriate DDF connections. Cut excess cable length if necessary.
6. Connect the cable connector to the corresponding module.
7. Secure the cable connector to the module connector with the two cable
connector screws. Tighten the screws manually; if the screws cannot be
reached with your bare hand, use an adjustable-torque flatblade screwdriver
(maximum blade size is 0.6). Set the tightening torque to 40 44 N cm.
5. Thread the end of the fiber through the rack slots to the SFP transceiver LC
connector on the designated EISM module. Leave some slack to prevent
stress.
6. Thoroughly clean the connectors of the optical fibers, using an approved
cleaning kit.
7. Remove the cover from the SFP transceiver, and connect the fiber
connector to the SFP connector.
8. Repeat Steps 2 to 7 for all optical EISM modules in the XDM-100 shelf.
9. When you have finished connecting all the optical modules, gently push the
FST back into the rack until it clicks into place.
7. Use cable ties as required to fasten the cables to the rack side rails.
Figure 3-48: Removing the TPU connector cover from the shelf
6. Remove the H-connector from its protective packaging and install it on the
XDM-100 shelf.
7. Carefully lower the TPU onto the XDM-100 shelf, taking care that the pin
guides are inserted into the slots as illustrated in the figure below.
8. Insert the four supplied long screws into the appropriate holes, as illustrated
in the figure below, and secure the TPU in place.
In This Chapter
Overview .................................................................................... 4-2
Test Equipment........................................................................... 4-3
Site Commissioning Tests .......................................................... 4-3
SDH Commissioning Tests ........................................................ 4-7
IOP Hardware Protection Test.................................................. 4-14
Severity Assignment Test ......................................................... 4-15
Transmission Alarm Handling Tests ........................................ 4-15
Maintenance Actions Tests....................................................... 4-16
MXC Redundancy Test ............................................................ 4-16
Cisco ATA 186/Cisco2600/CallManager Test ......................... 4-17
Data Network Commissioning Tests ........................................ 4-17
Optical Network Commissioning Tests.................................... 4-20
Overview
The commissioning tests are performed after completing the installation and
preliminary configuration of a new network. These procedures confirm that the
network has been properly installed and is operating in accordance with the
design specifications.
This chapter provides general commissioning procedures for the XDM-100,
and provides a basis for preparing tests in specific networks.
The commissioning procedures include:
Site commissioning tests, performed at the site level to ensure proper
functionality of the site
SDH commissioning tests, performed at the network level to ensure proper
SDH functionality of the integrated network
Data commissioning tests, performed at the network level to ensure proper
data functionality of the integrated network
Optical commissioning tests, performed at the network level to ensure
proper optical functionality of the integrated network
The commissioning procedures presented in this chapter include:
Test Equipment (on page 4-3)
Site Commissioning Tests (on page 4-3)
SDH Commissioning Tests (on page 4-7)
Data Network Commissioning Tests (on page 4-17)
Optical Network Commissioning Tests (on page 4-20)
Test Equipment
The following test equipment is required for the commissioning procedures:
PDH transmission analyzer for testing PDH transmission performance
SDH transmission analyzer for testing SDH transmission performance
Data transmission test equipment for testing GbE transmission performance
Optical power meter (OPM)
Optical spectrum analyzer (recommended for measurements at points
carrying multiple wavelengths, for example, inputs and outputs of optical
amplifiers)
Optical BER tester
Set of optical attenuators with various values
Variable optical attenuator
FC-to-LC and FC-to-SC adapters
FC/FC optical patch cords
Multimeter
Suitable equipment is available from a wide range of manufacturers, and
therefore no specific test equipment models are listed. You can use any
equipment that meets the applicable international standards and has satisfactory
measurement accuracy over the range of operating parameters and
environmental conditions that apply to the specific network. If necessary,
contact ECI Telecom's Field Engineering Department for specific
recommendations.
NOTE: Make sure that the boot version of each card and
module matches the embedded version.
2 Mbps tests
For 2 Mbps tributaries, configure the test equipment as follows:
Framing Unframed
Coding HDB3
Pattern 2*10-15 PRBS
Signal rate 2 Mbps
Timing Received clock
Inject error Code error
34 Mbps tests
For 34 Mbps tributaries, configure the test equipment as follows:
Framing Unframed
Coding HDB3
Pattern 2*10-15 PRBS
Signal rate 34 Mbps
Timing Received clock
Inject error Code error
45 Mbps tests
For 45 Mbps tributaries, configure the test equipment as follows:
Framing Unframed
Coding 45 Frame = C-bit
X-bit =11
Pattern 2*10-15 PRBS
Signal rate 45 Mbps
Timing Received clock
Inject error Code error
SDH tests
For SDH tests, configure the test equipment according to the interface type
being tested, as follows:
Signal rate STM-1, STM-4, or STM-16
Mapping Any mapping (preferably bulk)
Framing Off
Pattern 2*10-15 PRBS
Timing Received clock
Inject error Code error
MSP Test
This test verifies that MSP traffic in the XDM network operates properly when
a failure occurs.
MSP can be applied in a point-to-point configuration.
MS-SPRing Test
This test verifies that the MS-SPRing traffic operates properly when a failure
occurs.
This procedure uses a SAM-16 module and an MXC card.
If ALS = on, the management station reports a far-end optical port LOS
alarm.
NOTE:
Measured latency is for both the forward and return paths.
For a single path, the latency will be 50% of the measured
value.
The latency test is dependant on the throughput results.
For example, if 10 Mbps is tested and the throughput is
4%, the latency test should be for 4 Mbps (2*VC-12=4
Mbps).
Inject traffic according to the assigned bandwidth (VC-12
= 2.048 Mbps).
LAN port & 64 bytes/ 128 256 512 1024 1280 1518
speed frame bytes/ bytes/ bytes/ bytes/ bytes/ bytes/
frame frame frame frame frame frame
Throughput
Latency
For example, for a 100 Mbps test using 5*VC-12=10 Mbps, with input
fps=148810 and the output fps=14881; the frame loss is:
Frame rate
(% MFR)
100%
Stability Test
This test determines the stability of the network by checking that it can
function with no errors for a defined period of time.
Optical
loopback
TX T
TX
BER
tester R
RX P RX
Attenuator
Mux Demux
TRP ...........
...........
TX
BER
tester
RX
Variable ...........
attenuator ...........
Demux Mux
In This Chapter
Overview .................................................................................... 5-1
Required Test Equipment, Tools, and Materials ........................ 5-1
Preventive Maintenance ............................................................. 5-2
Traffic Monitoring System ......................................................... 5-6
Onsite Troubleshooting ............................................................ 5-12
Replacing Cards and Modules .................................................. 5-22
Replacing xRAP/xRAP-100 Components................................ 5-31
Overview
This chapter provides maintenance procedures for XDM-100 equipment.
Personnel involved in maintenance must be thoroughly familiar with safety
issues as described in Before You Start (on page 2-1).
Preventive Maintenance
The purpose of the preventive maintenance activities is to keep the XDM-100
hardware in good condition, and detect and correct as soon as possible any
condition that may lead to deterioration and equipment malfunction.
Record the execution of the various activities and their results according to the
procedures used in your organization.
Maintenance Intervals
Air particles trapped by the air filter increase the resistance to airflow, and can
eventually decrease the airflow below the minimum required for proper cooling
of internal components. The resulting increase in the internal temperature of the
equipment decreases the equipment reliability and performance. Therefore,
whenever an air filter is installed, it must be periodically cleaned, or replaced
with a clean filter.
It is accepted throughout the electronics equipment industry to recommend
cleaning or replacing air filters approximately every 90 days. However, the
cleaning intervals depend on the specific environmental conditions, and
therefore in dusty environments more frequent cleaning is required. Note that
foam filters, which are the type used in XDM-100 shelves, efficiently trap
particles without showing face loading of contaminants, and therefore visual
inspection cannot be used to determine cleaning intervals.
3. Cold Water Rinse: Under normal service conditions, the foam media used
in the filters installed on XDM-100 shelves require no oily adhesives.
Therefore, collected dust and dirt can be washed away using just a standard
hose nozzle with plain water. Let stand until completely dry and free of
moisture, and return to service.
4. Immersion in Warm, Soapy Water: Where stubborn airborne dirt is
present, the filter may be dipped in a solution of warm water and mild
detergent. Then simply rinse in clear water, let stand until completely dry
and free of moisture, and return to service.
The recommended method is No. 4, as it ensures thorough cleaning of all types
of contaminants under any reasonable service conditions.
6. Insert the clean filter in the holding frame and reinstall the front panel.
7. Insert the clean filter in the holding frame and reinstall the front panel.
Principles of Operation
The XDM-100 monitoring system enables to monitor traffic passing through
the aggregate modules installed in slots A1, A2, B1, and B2 of the MXC-100
cards, and the I/O modules installed in slots I1 to I8 of the modules cage.
The main components of the monitoring system interface are located on the
ECU-F front panel. These components, except for the monitoring point and
monitoring indicator, are common to all modules. In addition, the system has a
monitoring point and monitoring indicators on the front panel of the modules.
The PIM2_21 and PIM2_63 have only one monitoring indicator used for all its
channels. STM-1 modules do not have a monitoring point, and use the
monitoring point on the ECU-F card.
Selecting a module
The MODULE selector chooses the monitored module slot number. The
selected module is displayed on the 2-digit display to the right of the selector.
Pressing the selector upward increments the slot number; pressing it downward
decrements the slot number. The selection is cyclic. Possible selections are A1,
A2, B1, and B2 for the aggregate modules, and I1 to I8 for the I/O modules. If
the selected module is an STM-1, the MON indicator on the ECU-F lights.
Selecting a channel
The CHANNEL selector chooses the specific monitored channel (port) on the
module selected. The selected channel is displayed on the 2-digit display to the
left of the selector. Pressing the selector upward increments the channel
number; pressing it downward decrements the channel number. The selection is
cyclic. Possible selections are from 00 to the module's maximum number of
channels. For example, in a PIM2_21 module (which has 21 ports) the
selection goes from 00 to 21. When the value 00 is selected, the system blocks
the monitoring to the selected module.
In addition to the number of the selected channel shown on the display, a MON
indicator lights near the selected port on the module.
If an STM-1 module is selected, the MON indicator on the ECU-F lights in
addition to the LED near the selected port on the module.
Stabilization time
The monitoring system has a stabilization time of approximately 1.5 seconds.
This means that after a new value is selected with the MODULE or CHANNEL
selectors, the display starts blinking for the stabilization time, and only after
that the new selection is displayed.
Response to events
This section describes the response of the monitoring system to the following
events:
Power-up
Cold restart
MXC-100 switching to redundancy
Warm restart
ECU-F extraction/insertion
After power-up, the monitoring system displays A1 00. This is the default state,
and indicates slot A1 and channel 00. Channel 00 is defined in the system as
idle state, and indicates that no channel was selected and that monitoring is
disabled. To enable the monitoring results, a module and a channel must be
selected.
After cold restart to an MXC-100 card, only the traffic passing through its
aggregate modules and their monitoring is lost, while the traffic and monitoring
of all other modules is not affected. For example, after a cold reset to
MXC-100 in slot MXC-A, the traffic and monitoring in its aggregate modules
(slots A1 and A2) is lost, but the traffic and monitoring in aggregate modules
B1 and B2 and all other I/O modules is not affected.
The response of the system to MXC-100 switching to redundancy is identical
to the response to cold restart.
Warm restart does not affect the traffic or monitoring of any modules in the
XDM-100.
After extracting/inserting the ECU-F, the monitoring display is reset to the
default state: A1 00, and the monitoring history stored in the ECU-F's memory
is lost.
Monitoring options
The system can monitor a number of channels in different modules
simultaneously. This feature is useful when traffic passing through different
modules in the XDM-100 has to be analyzed.
After monitoring channels of different modules, all selected channel numbers
of these modules are saved in the ECU-F's memory.
You can connect test equipment to various modules or connect test equipment
with multiple inputs to simultaneously monitor the traffic passing through the
channels in these modules.
Onsite Troubleshooting
The purpose of onsite troubleshooting is to identify the hardware causing the
malfunction and return the equipment to normal operation as soon as possible.
Troubleshooting is usually initiated in response to one of the following
conditions:
Alarm or performance degradation reported by the management station.
Alarm or malfunction detected onsite by maintenance personnel, either as a
result of a troubleshooting activity initiated by the management center
personnel or as a result of a periodic inspection or preventive maintenance
action. Many problems can be detected via the various indicators available
on the XDM-100 system components.
This chapter assumes familiarity with the XDM-100, with SDH, data, and
CWDM equipment, and with the LightSoft and EMS-XDM management
stations. Refer to the respective user's manuals for details on the various
capabilities of the management stations, and for instructions on performing the
desired activities.
The following sections provide procedures for performing onsite
troubleshooting for various trouble categories, as well as for specific
subsystems, for example, OADMs, mux/demux subsystems, and so on. For
each category, you will find a troubleshooting table that provides the
instructions for identifying the trouble.
1 Green AC Defective module 1. Pull the module out and wait a minute
indicator is off before reinserting it. Make sure that you
fully insert the module in its slot.
2. If the AC indicator does not turn on
after reinsertion, replace the module.
CAUTION:
If your system contains SAMs, always remove them from
the MXC-100 prior to removing the MXC-100 card from
the shelf.
Do not extract/insert an MXC-100 card while the DC
cables are connected to it.
If the shelf has a single MXC-100 card, organize your
work to replace it as rapidly as possible. While the
MXC-100 card is out, management communication with
this shelf is not possible.
If the FAIL (red), MAIN (blue), and TMU (orange) LEDs
blink simultaneously, this indicates that the MXC is not
mounted correctly, or that not all four screws are properly
locked.
Before attempting to remove the card, monitor its NVM
(yellow) indicator; remove the card only after this
indicator has been off for at least 2 minutes.
4. Open the MXC-100 upper left screw first, then the upper right screw, and
then the two lower screws.
5. Hold both extractor handles, and pull them simultaneously outward until
the card is released from the backplane.
6. Keep holding the handles, and gently pull the card out of the shelf.
7. If the NVM card has to be transferred from the replaced MXC-100 card to
its replacement, do this now (see Replacing the NVM on MXC-100 cards
(on page 5-26)).
8. Insert the rear end of the replacement card into the corresponding card
guides.
9. Push the cards front panel with both hands until the extractor handles
attach to the panel.
10. Push the card in by holding both handles with your hands, and pushing
them simultaneously inward, until the card mates the chassis connectors
and is locked in place. If you feel resistance before the connectors are
mated, pull the card out and repeat the procedure.
11. Close the cards captive screws as follows: first close the upper left screw,
then the upper right screw, and then the two lower screws.
NOTE: Make sure that all four screws in the MXC-100 are
properly tightened. Failing to do so may result in improper
operation of the shelf.
12. Install the required aggregate modules according to the site installation
plan, as described in Installing Aggregate Modules in MXC-100 Cards (on
page 3-54).
2. Identify the faulty circuit breaker and remove it by pulling it straight out of
its socket.
3. Check the replacement circuit breaker ratings against those of the replaced
circuit breaker.
4. Insert the replacement circuit breaker into the circuit breaker sockets of the
corresponding xRAP power terminal board, as shown in the above figure.
5. Reinstall the xRAP front cover and fasten it with its two captive screws.
4. Insert the replacement circuit breaker into the circuit breaker sockets of the
corresponding xRAP-100 power terminal board, as shown in the figure
below.
5. Reinstall the xRAP-100 cover and fasten it with its two captive screws.
In This Appendix
Shelf Overview ...........................................................................A-2
Fan Control Unit (FCU) .............................................................A-2
External Connection Unit (ECU)................................................A-5
Main Cross-Connect and Control (MXC) Card Options ............A-9
SDH Aggregate Modules (SAM) .............................................A-14
I/O Modules..............................................................................A-20
EISM I/O Modules ...................................................................A-29
Tributary Protection Unit (TPU) ..............................................A-33
Accessories for Rack Installation .............................................A-39
Cables .......................................................................................A-51
Shelf Overview
The basic XDM-100 shelf is 450 mm wide, 231 mm deep, and 200 mm high.
When the optional TPU (Tributary Protection Unit) is added to the shelf, the
combined height of the basic shelf and the TPU is 275 mm.
On the right side of the shelf is a vertical slot, which houses the FCU (Fan
Control Unit). The lower part of the shelf consists of the cards cage with three
horizontal slots, which accommodate (from bottom to top):
The External Connection Unit (ECU) or ECU-F.
One or two MXC-100 (Main Cross-Connect and Control) cards, each
including two slots for SDH aggregate modules (SAMs). When only one
MXC-100 card is used in slot MXC-A, an MXC-BR bridging card is
inserted in slot MXC-B.
The upper part of the shelf consists of the modules cage, where eight horizontal
slots can house up to eight I/O (PDH, SDH, or data) modules.
In an expanded XDM-100 shelf with I/O protection, a TPU shelf is mounted on
top of the basic XDM-100 shelf, including a TC (Tributary Control) module
and TPMs (Tributary Protection Modules).
LED lights up until the FCU is replaced. The FCU can be extracted and
replaced without interrupting the multiplexer operation (hot swapping) if the
activity does not exceed a few minutes.
NOTE: Air filters are not supported for 19" rack installations.
ECU-F
The ECU-F supports:
Management interfaces:
Management (NMS and EMS) interface (Ethernet)
Ethernet hub for the connection of multiple Network Elements (NEs)
Serial (RS-232) interface for craft terminal
USB interface
Synchronization inputs and outputs (T3/T4)
Alarm interfaces and indications, including:
Alarm severity outputs (Critical, Major, Minor, Warning)
External alarm outputs and inputs to client or xRAP/xRAP-100
Alarm Cut Off (ACO)
LEDs for display of operation and alarms
ECU
The ECU card is suitable for sites that do not require external timing
input/output or electrical monitor points. It supports:
Management interfaces, including:
Management (NMS and EMS) interface (Ethernet)
One Ethernet connection to Network Elements (NEs), named MNG
MAIN
Serial (RS-232) interface for craft terminal
USB interface
When installed without the redundant option, the XDM-100 shelf contains one
MXC-100 card installed in slot MXC-A, and a bridging unit, the MXC-BR,
installed in slot MXC-B. This option is described in MXC-100 Nonrredundant
Option (on page A-14).
CAUTION:
If your system contains SAMs, always remove them from
the MXC-100 prior to removing the MXC-100 card from
the shelf.
Do not extract/insert an MXC-100 card while the DC
cables are connected to it.
If the FAIL (red), MAIN (blue), and TMU (orange) LEDs
blink simultaneously, this indicates that the MXC is not
mounted correctly, or that not all four screws are properly
locked.
NOTE:
In case of a control failure in the MXC-100 card, the
aggregate modules in that card cannot be controlled.
However, this does not affect traffic.
The switching of control functions takes several minutes
and may affect traffic if the timing or SNCP functions
were previously handled by the MXC-100 card in slot
MXC-A.
In the MXC redundant option, a separate power input is fed to each MXC-100,
providing the XDM-100 platform with protection in case of a malfunction in
the power input of the main MXC-100 card.
Type Designation
Electrical SAM SAM1_4/E (on page A-15)
Optical SAMs SAM1_4/O (on page A-16)
SAM4_2 (on page A-17)
SAM16_1 (on page A-18)
Type Designation
Mixed Aggregate SAM1_4/OE (on page A-19)
Module
All optical cards contain slots for the insertion of Small Form-factor Pluggable
(SFP) transceivers.
NOTE:
All modules have a handle to facilitate easy removal and
insertion. The handle has been removed from the
illustrations in this section in order not to obscure the
front panel markings.
The traffic of STM-1 modules (I/O or aggregate) can be
monitored via the STM-1 MON connector on the ECU-F
card.
Electrical SAM
SAM1_4/E
The SAM1_4/E is an electrical aggregate module with four electrical STM-1
(155 Mbps) interfaces (pairs of DIN 1.0/2.3 connectors).
A maximum of four SAM1_4/E modules, totaling 16 interfaces, can be
incorporated in an XDM-100 shelf with full MXC redundancy, and a maximum
of two SAM1_4/E modules, totaling eight interfaces, can be incorporated in an
XDM-100 shelf with no MXC redundancy.
Channel monitoring is performed via the STM-1 monitoring port on the
ECU-F.
Optical SAMs
SAM1_4/O
The SAM1_4/O is an optical aggregate module with four STM-1 (155 Mbps)
interfaces, with slots for SFP transceivers.
A maximum of four SAM1_4/O modules, totaling 16 interfaces, can be
incorporated in an XDM-100 shelf with full MXC redundancy, and a maximum
of two SAM1_4/O modules, totaling eight interfaces, can be incorporated in an
XDM-100 shelf with no MXC redundancy.
Channel monitoring is performed via the STM-1 monitoring port on the
ECU-F.
SAM4_2
The SAM4_2 is an optical aggregate module with two STM-4 (622 Mbps)
interfaces, with two slots for SFP transceivers.
A maximum of four SAM4_2 modules, totaling eight interfaces, can be
incorporated in an XDM-100 shelf with full MXC redundancy, and a maximum
of two SAM4_2 modules, totaling four interfaces, can be incorporated in an
XDM-100 shelf with no MXC redundancy.
The front panel has a 622 Mbps monitoring point with a DIN 1.0/2.3 connector,
and these LED indicators:
SAM16_1
The SAM16_1 is an optical aggregate module with one STM-16 (2.488 Gbps)
interface and one slot for an SFP transceiver.
A maximum of four SAM16_1 modules, totaling four interfaces, can be
incorporated in an XDM-100 shelf with full MXC redundancy, and a maximum
of two SAM16_1 modules, totaling two interfaces, can be incorporated in an
XDM-100 shelf with no MXC redundancy.
The front panel has a 2.5 Gbps monitoring point with an SMA connector, and
these LED indicators:
SAM1_4/OE
The SAM1_4/OE is a mixed electrical/optical aggregate module with two
electrical STM-1 (155 Mbps) interfaces (DIN 1.0/2.3 connectors), and two
optical STM-1 interfaces with slots for SFP transceivers.
A maximum of four SAM1_4/OE modules, totaling 16 interfaces, can be
incorporated in an XDM-100 shelf with full MXC redundancy, and a maximum
of two SAM1_4/OE modules, totaling eight interfaces, can be incorporated in
an XDM-100 shelf with no MXC redundancy.
Channel monitoring is performed via the STM-1 monitoring port on the
ECU-F.
I/O Modules
Eight slots are available in the XDM-100 I/O modules cage to accommodate
the various types of I/O modules, as follows:
PDH I/O Modules (PIMs) and SDH I/O Modules (SIMs) can be inserted
into any of the I1 through I8 positions without any limitations
Ethernet Interface and Switching Modules (EISMs) and PIM2_63 PDH I/O
Modules occupy two slots, and can be inserted in slots I1-I2, I3-I4, I5-I6, or
I7-I8
PIMs and SIMs with electrical interfaces fully support direct connection to the
module without other external connection modules.
Type Designation
Electrical I/O Modules PIM2_21 (on page A-22)
PIM2_63 (on page A-23)
PIM345_3 (on page A-24)
Type Designation
Optical I/O Modules SIM1_4/O (on page A-26)
NOTES:
All modules have a handle to facilitate easy removal and
insertion. The handle has been removed from the
illustrations in this section in order not to obscure the
front panel markings.
The traffic of STM-1 modules (I/O or aggregate) can be
monitored via the STM_1 MON connector on the ECU-F
card.
PIM2_21
The PIM2_21 is a PDH I/O module with 21 x E1 (2 Mbps) electrical balanced
interfaces (two SCSI connectors) to which the traffic cables connect with a
special connector hood. A maximum of eight PIM2_21 modules can be
installed in the I/O cage, totaling 168 E1 interfaces. For unbalanced interfaces,
the PIM2_21 module is connected to the xDDF-21 conversion panel, described
in xDDF-21 Patch Panel for Unbalanced Electrical Connections (on
page A-47).
PIM2_63
The PIM2_63 is a PDH I/O module with 63 x E1 (2 Mbps) electrical balanced
interfaces (six SCSI connectors) to which the traffic cables connect with a
special connector hood. A maximum of four PIM2_63 modules can be installed
in the I/O cage (each occupying a double slot), totaling 252 E1 interfaces. For
unbalanced interfaces, each transmit/receive SCSI pair on the module can be
connected to an xDDF-21 conversion panel, as described in xDDF-21 Patch
Panel for Unbalanced Electrical Connections (on page A-47).
PIM345_3
The PIM345_3 is a PDH I/O module with 3 x E3/DS-3/STS-1 (34/45/51 Mbps)
interfaces (three pairs of DIN 1.0/2.3 connectors). A maximum of eight
PIM345_3 modules can be installed in the I/O cage, totaling 24 interfaces.
The front panel has a monitoring point (using a DIN 1.0/2.3 connector) and
these LED indicators:
SIM1_4/E
The SIM1_4/E is an electrical traffic module with 4 x STM-1e (155 Mbps)
interfaces (four pairs of DIN 1.0/2.3 connectors). A maximum of eight
SIM1_4/E modules can be installed in the I/O cage, totaling 32 interfaces.
SIM1_4/O
The SIM1_4/O is an optical traffic module with four optical STM-1 (155
Mbps) interfaces for SFP transceivers. A maximum of eight SIM1_4/O
modules, totaling 32 interfaces, can be installed in the I/O cage.
Channel monitoring is performed via the STM-1 monitoring port on the
ECU-F.
SIM4_2
The SIM4_2 is an optical traffic module with two STM-4 (622 Mbps)
interfaces for SFP transceivers. A maximum of eight SIM4_2 modules, totaling
16 interfaces, can be installed in the I/O cage.
The front panel has a 622 Mbps monitoring point with a DIN1.0/2.3 connector,
and these LED indicators:
SIM1_4/OE
The SIM1_4/OE is a mixed electrical/optical traffic module with two optical
STM-1 interfaces with slots for SFP transceivers, and two electrical STM-1
(155 Mbps) interfaces (DIN 1.0/2.3 connectors). A maximum of eight
SIM1_4/OE modules totaling 32 interfaces can be installed in the I/O cage.
Channel monitoring is performed via the STM-1 monitoring port on the
ECU-F.
EISM_208
The EISM_208 is an electrical Fast Ethernet module including eight
10/100BaseT ports with RJ45 connectors, which can be connected with these
cables:
10/100BaseT CAT5 UTP 2-pair
1000BaseT CAT5 UTP 4-pair
A maximum of four EISM_208 modules, totaling 32 interfaces, can be
installed in the I/O cage.
EISM_244
The EISM_244 is a mixed optical/electrical Fast Ethernet module with four
electrical 10/100BaseT ports with RJ45 connectors, and four optical ports (two
GbE/FX ports and two FX only ports) for the insertion of SFP transceivers.
A maximum of four EISM_244 modules, totaling 32 interfaces, can be
installed in the I/O cage.
The cable options for the different ports are:
EISM_226
The EISM_226 is a mixed electrical/optical Fast Ethernet module with six
electrical 10/100BaseT ports, and two GbE/FX optical ports for the insertion of
SFP transceivers.
A maximum of four EISM_226 modules, totaling 32 interfaces, can be
installed in the I/O cage.
The cable options for the different ports are:
TPM2_3
The TPM2_3 provides 1:3 protection for up to three PIM2_21 I/O modules. It
is activated by the MXC-100 via the TC module, enabling a single I/O backup
module to protect any of the three other I/O modules when a failure is detected.
The TPM2_3 is connected as follows:
The traffic connector on the protection I/O module is connected to the
PIM2_21 PROTECT 100-pin SCSI connector on the TPM2_3
The traffic connectors on the three active I/O modules are connected to the
PIM 2_21#1, PIM 2_21#2, and PIM 2_21#3 100-pin SCSI connectors on
the TPM2_3
The traffic cables from the DDF are connected to connectors DDF#1,
DDF#2, and DDF#3 on the TPM2_3
TPMH_1
The TPMH_1 provides 1:1 protection for:
A single PIM345_3 I/O module, or
A single SIM1_4/E module
The module is activated by the MXC-100 via the TC module, enabling a single
I/O backup module to protect a single I/O module when a failure is detected.
The TPMH_1 is connected as follows:
The protection I/O module is connected to the PROTECT connector on the
TPMH_1
The active I/O module is connected to the MAIN connector on the
TPMH_1
The traffic cables are connected to the OUT/IN connectors on the TPMH_1
Bay alarm indications. The xRAP-100 includes four alarm indicators, one
for each alarm severity. When alarms of different severities are received
simultaneously, the different alarm indications light simultaneously.
The xRAP-100 connectors are located on its circuit board, as shown in the
following figure. The table lists the connector functions. The connector pin
assignment is provided in Connection Data (on page C-1).
Bay alarm indications. The xRAP includes four alarm indicators, one for
each alarm severity. At any time, only the indicator corresponding to the
highest unacknowledged alarm severity present in the XDM shelves
installed in the rack lights.
A buzzer is activated whenever an unacknowledged alarm is present in
XDM shelves installed in the rack.
The ground references of the input and output alarm lines on the two sides
of the xRAP are isolated by active circuits located within the xRAP.
The following figure shows the front panel of the xRAP and the table below
lists the functions of the front panel components. The index numbers in the
table correspond to those in the figure.
The following figure shows the xRAP connectors, and slide switches located
on its rear side, and the table lists the connector functions. The connector pin
assignment is provided in Connection Data (on page C-1). The index numbers
in the table correspond to those in the figure.
8 9 10 11
1 2 3
ALARM
7&8 5&6 3&4 1&2
321 321 321 321 SHELF
4 5 6 7
customers cables are connected to the connectors inside the patch panel, while
the cables leading from the PIM2_21 or PIM2_63 module are connected to the
SCSI connectors at the rear of the xDDF-21. A special split cable is available to
convert the output from the PIM2_21 or PIM2_63 module to SCSI connector
pairs at the back of the xDDF-21.
The xDDF-21 can be supplied with BT43, DIN1.6/5.6, or BNC connectors for
connection to the customers traffic cables.
All fiber connections are made on a swing-out tray that opens to the right in
90, and houses the splicing trays, optical adapter panels, and the fiber support.
Left side tray opening is available per order. The swing-out tray enables quick
and easy access to all internal parts for connection or maintenance activities.
The fiber connections are protected by a front cover, which latches to the
assembly, and prevents unintended disconnection of fibers.
Optical terminal fibers can enter the ODF from the right or left side, and be
connected to the optical adapters from one side. Pigtails connect to the adapters
from the other side. Excess length of pigtails and patch cords are threaded on a
fiber support that maintains the minimum bend radius to prevent fiber breaks.
A durable and robust tube leads the external fibers cable to the swing-out tray,
and protects them from breaks. The adapters are arranged on panels, in groups
of four or two (depending on the total number of ports). A large space between
the adapters enables easy access to each individual fiber and quick
reconfiguration.
Cables
The XDM-100 is supplied with a number of cables, as described in the
following table.
In This Appendix
Overview ....................................................................................B-1
XDM-100H Description .............................................................B-2
XDM-100H Configuration Options............................................B-3
I/O Modules................................................................................B-7
TPU/OCU Shelf........................................................................B-11
CWDM Networking Modules ..................................................B-11
Installing the TPU/OCU ...........................................................B-21
Overview
The XDM-100H integrates the Ethernet, SDH, and PDH capabilities of the
XDM-100 with the CWDM (Coarse Wavelength Division Multiplexing)
functionality of the XDM-200. It is compact, fully modular and redundant.
XDM-100H Description
The XDM-100H consists of the following units:
Basic XDM-100 shelf as described in Shelf Overview (on page A-2). The
shelf includes the ECU or ECU-F (External Connection Unit), two
MXC-100 cards, the I/O modules cage with eight slots, and the FCU (Fan
Control Unit).
Each MXC-100 card houses an NVM module, which contains the licensed
optional software.
The eight slots of the I/O modules cage support installation of XDM-100
I/O modules, as well as XDM-200 CWDM I/O modules (transponders and
combiners).
A TPU/OCU shelf, mounted on top of the basic XDM-100 shelf, with five
slots: four for supporting any mix of mux/demux, OADM,
splitters/couplers and TPMs, and one for a Tributary Control (TC) module.
One or two TPU/OCUs can be mounted on the basic XDM-100 shelf.
The following figure shows the layout of the expanded XDM-100 shelf
configuration.
Only XDM-100 Any mix of I/O Only TPMs Any mix of TPM and
I/O modules modules (PIMs, CWDM optical
(PIMs, SIMs, SIMs, EISMs) and (mux/demux,
EISMs) CWDM modules splitters/couplers,
(transponders and OADM) modules
combiners)
The following figure shows the layout of the double-expanded XDM-100 shelf
configuration.
I/O Modules
Eight slots are available in the XDM-100H I/O modules cage to accommodate
the modules including:
Single PDH I/O Modules (PIMs) and SDH I/O Modules (SIMs) can be
inserted into any of the I1 through I8 positions without any limitations.
CWDM I/O modules can be inserted into any of the I1 through I8 positions
without limitations. Various types of I/O modules with a variety of client
interfaces for SDH, data services, and CWDM line transceivers are
available.
Ethernet Interface and Switching Modules (EISMs) and the PIM2_63
modules occupy two slots, and can be inserted in slots I1-I2, I3-I4, I5-I6, or
I7-I8.
The various PIMs and SIMs are described in Electrical I/O Modules (on page
A-21) and Mixed I/O Module. The EISMs are described in EISM I/O Modules
(on page A-29)
CWDM I/O modules are described in the following sections and include:
CRPT25_2C (on page B-8)
CTRP25_2C (on page B-9)
CCMB25_2D (on page B-10)
CRPT25_2C
The CRPT25_2C is an optical traffic module for two bidirectional continuous
transponders (100 Mbps to 2.7 Gbps), each with two SFP transceivers: a 2.5
Gbps CWDM line SFP and an STM-16 client interface, for A/D mode only.
CTRP25_2C
The CTRP25_2C is an optical traffic module for two bidirectional continuous
transponders (100 Mbps to 2.7Gbps), each with two SFP transceivers: a 2.5
Gbps CWDM line SFP and an STM-16 client SFP interface, or two line SFPs
for regenerator mode.
CCMB25_2D
The CCMB25_2D is an optical traffic combiner for two GbE/FC/FICON client
SFP transceivers and one 2.7 Gbps CWDM line interface with G.709 FEC
framing.
TPU/OCU Shelf
The TPU/OCU shelf can be mounted on top of the basic XDM-100 shelf to add
I/O protection and CWDM optical networking capabilities to the system.
The TPU/OCU is 231 mm deep, 450 mm wide, and 75 mm high, and
comprises a single cage with five slots. One or two TPU/OCUs can be installed
on the XDM-100. The first connects to a connector on top of the XDM-100
that provides the power and control buses required for its operation. In case an
additional TPU/OCU is required, it connects similarly to a connector on top of
the first one.
The modules are distributed as follows:
The rightmost slot is allocated to the TC (Tributary Control) module. The
TC module is described in TC Module (on page B-12).
The other four slots can accommodate any combination of TPM and
CWDM optical (mux/demux, OADM, or splitter/coupler) modules. The
TPMs are described in Tributary Protection Modules (TPMs) (on
page A-36). For a description of the optical networking modules refer to
CWDM Optical Networking Modules (on page B-11).
All connectors on the optical networking modules are LC connectors.
TC Module
The TC module is installed in the rightmost slot of the TPU/OCU shelf. It
controls and monitors the TPU/OCU modules, and transfers power from the
MXC to these modules. Extraction of the TC module does not affect traffic.
Figure B-19: Removing the connector cover and the fastening bracket from the
first TPU/OCU
6. Open the 10 screws securing the fastening bracket to the first TPU/OCU
shelf installed on the expanded XDM-100H (see the above figure for
reference).
7. Open the two screws fastening the bracket to the rack. Remove the bracket.
8. Assemble eight M2.5 x 6 screws on the first TPU/OCU shelf in the places
indicated in the figure below.
9. Assemble two M2.5 x 4 screws on the first TPU/OCU shelf in the places
indicated in the figure below.
10. Remove the H-connector from its protective packaging and install it on the
first TPU/OCU shelf as shown in the figure below.
Figure B-21: Inserting the TPU/OCU connector on to the first TPU/OCU shelf
11. Carefully lower the second TPU/OCU onto the expanded XDM-100H (on
the first TPU/OCU shelf), taking care that the pin guides are inserted into
the slots as illustrated in the following figure.
12. Insert the four supplied long screws into the appropriate holes, as illustrated
in the following figure, and secure the second TPU/OCU in place.
In This Appendix
Overview ....................................................................................C-2
MXC-100 DC Input Power Connectors .....................................C-3
ECU/ECU-F Card Connectors....................................................C-3
PIM2_21 Module Connection Data..........................................C-13
PIM2_63 Module Connection Data..........................................C-17
EISM Connectors .....................................................................C-21
xRAP Connectors .....................................................................C-21
xRAP-100 Connectors..............................................................C-27
Overview
This appendix provides connection data for the user connectors located in the
XDM-100 shelf and associated ancillary equipment supplied by ECI Telecoms
Optical Networks Division, as follows:
MXC-100 DC Input Power Connectors (on page C-3)
ECU/ECU-F Card Connectors (on page C-3)
PIM2_21 Module Connection Data (on page C-13)
PIM2_63 Module Connection Data (on page C-17)
EISM Connectors (on page C-21)
xRAP Connectors (on page C-21)
xRAP-100 Connectors (on page C-27)
Any connectors not described in this Appendix are reserved for use by ECI
Telecoms Optical Networks Division technical support personnel and/or for
future expansion, and therefore no user equipment may be connected to them.
USB Connector
The USB connector is a 6-pin Type A USB connector that provides a serial
USB management interface. This interface is a future option and not used in the
current XDM-100 system.
The figure below identifies the connector pins, as seen when looking into the
connector. The table below lists the pin assignment for a typical connector.
ALARMS Connector
The ALARMS connector is a 36-pin SCSI female connector that carries three
groups of lines:
Five external alarm input lines referenced to an internal power supply
common line (the power supplys common line is floating relative to the
chassis ground). The alarm input lines are monitored by the XDM-100
management subsystem. Each input is connected to the input diode of an
optocoupler.
Three external alarm outputs/inputs. Each output is provided by three relay
dry contacts. These lines can be configured as additional alarm inputs by
the systems management.
Four severity alarm outputs and a buzzer control line. Each output is
provided by three relay dry contacts. The buzzer control line is provided by
two dry contacts.
Relay contact ratings are 75 V in open state, and 1 A in closed state.
The figure below identifies the connector pins, as seen when looking into the
connector. The table below lists the pin assignment for the ALARMS
connector.
appropriate cables for each of the configurations. These cables are described in
the sections that follow.
F-CHANNEL Connector
The F-CHANNEL connector is a 9-pin D-type male connector that provides a
serial RS-232 communication channel supporting SLIP. This connector is
intended for connection to an eCraft service terminal. The connection is made
to one of the serial RS-232 ports of the PC serving as an eCraft terminal, using
a crossed cable.
The figure below identifies the connector pins, as seen when looking into the
connector. The table below lists the connector pin assignment, together with the
corresponding pin in the eCraft serial RS-232 port (assuming that this port uses
a 9-pin connector).
ETHERNET Connectors
The two ETHERNET connectors located on the ECU-F panel, designated
MNG MAIN and MNG PROT, are 8-pin RJ-45 connectors that provide two
Ethernet 10BaseT management interfaces (one for each MXC-100 card
installed in the XDM-100 shelf).
At any time, only the interface connected to the MXC-100 card serving as the
current main card is active; the interface connected to the MXC-100 card
serving as the protection card is in standby, to provide protection for the out-of-
band management traffic.
Each ETHERNET connector is wired as a station port intended for direct
connection through a straight cable to a port of a 10BaseT Ethernet hub.
The figure below identifies the connector pins, as seen when looking into the
connector. The table below lists the pin assignment for a typical connector.
Table C-9: PIM2_21 module, receive lines (upper) connector pin assignment
Table C-10: PIM2_21 module, transmit lines (lower) connector pin assignment
UPPER
Pin 1 Pin 25
Pin 26 Pin 50
Pin 1 Pin 25
Pin 26 Pin 50
LOWER
Figure C-8: PIM2_63 typical pair connectors, pin identification
Table C-11: PIM2_63 module, receive lines (upper) connector pin assignment
Table C-12: PIM2_63 module, typical transmit lines (lower) connector pin
assignment
EISM Connectors
EISMs are Fast Ethernet modules that also provide electrical 10/100BaseT
ports with 8-pin RJ-45 connectors.
The figure below identifies the connector pins, as seen when looking into the
connector. The table below lists the pin assignment for a typical connector.
xRAP Connectors
RAP Connector
The RAP connector is a 9-pin D-type female connector that carries the shelf
severity alarm outputs, and a buzzer control line. All outputs are referenced to a
common line, which is floating relative to the chassis ground. The connector
connects to the XDM-100ALARMS connector.
The figure below identifies the connector pins, as seen when looking into the
connector. The table below lists the pin assignment for the RAP connector.
The connection between each RAP connector and the corresponding XDM-100
ALARMS connector is performed with an alarm cable. For cable wiring, see
xRAP alarms cable wiring (on page C-9).
xRAP-100 Connectors
In This Appendix
Installing XDM-100 Equipment Racks ......................................D-1
European 19 Rack Installation ..................................................D-7
D-4), or diagram c of Mounting diagrams for 19" and 23" racks (on page
D-5).
12 mm - 4 places 12 mm - 4 places
1-45/64 1-45/64
18-1/2 14-1/2
3-11/16 3-11/16
25-7/8 21-7/8
a. 23 wide bay mounting hole drilling template b. 19 wide bay mounting hole drilling template
SCREW M12X50
FLAT WASHER
SPACER
SQUARE WASHER
ANCHOR BRACKET
OPEN DUCT
NUT M8
LOCK WASHER
FLAT WASHER CEILING
FLAT WASHER
640 MAX
50 MIN
NUT M8
FLAT WASHER
SCREW M8X20
Rack Grounding
Immediately after installing the rack, connect its grounding stud to the
prescribed grounding point on the site grounding bar. Use a grounding lead that
meets the grounding requirements listed in Before You Start (on page 2-1).
605.5
667
600
500
Maximum distance
between levels
2021
1912
499mm
625
515
44
Z 538
Mounting angle
355
Foremost position
Detail Z
44
500
515
538
In This Appendix
Table of Frequencies and Wavelengths...................................... E-1
21 192.1 1560.61
22 192.2 1559.79
23 192.3 1558.98
24 192.4 1558.17
25 192.5 1557.36
26 192.6 1556.55
27 192.7 1555.75
28 192.8 1554.94
29 192.9 1554.13
30 193.0 1553.33
31 193.1 1552.52
32 193.2 1551.72
33 193.3 1550.92
34 193.4 1550.12
35 193.5 1549.32
36 193.6 1548.51
37 193.7 1547.72
38 193.8 1546.92
39 193.9 1546.12
40 194.0 1545.32
41 194.1 1544.53
42 194.2 1543.73
43 194.3 1542.94
44 194.4 1542.14
45 194.5 1541.35
46 194.6 1540.56
47 194.7 1539.77
48 194.8 1538.98
49 194.9 1538.19
50 195.0 1537.40
51 195.1 1536.61
52 195.2 1535.82
53 195.3 1535.04
54 195.4 1534.25
55 195.5 1533.47
56 195.6 1532.68
57 195.7 1531.90
58 195.8 1531.12
59 195.9 1530.33
60 196.0 1529.55
description A-8 I
front panel A-8 I/O Module Description
functions A-8 EISM_208 A-31
overview A-5 EISM_226 A-33
EISM EISM_244 A-32
EISM_208 A-31 overview A-22
EISM_226 A-33 overview of EISM A-30
EISM_244 A-32 overview of electrical A-23
overview A-30 overview of optical A-27
Electrical I/O Module PIM2_21 A-23
overview A-23 PIM345_3 A-25
PIM2_21 A-23 SIM1_4/E A-26
PIM345_3 A-25 SIM1_4/O A-27
SIM1_4/E A-26 SIM1_4/OE A-29
Electrical SAM Module Description SIM4_2 A-28
SAM1_4/E A-16 IOP Hardware Protection Test 4-13
Equipment Installation
M
XDM-100H B-22
Ethernet Modules See EISM Module Main Cross-Connect and Control See
Description A-30 MXC A-10
Extendable Rails, Rack Installation D-6 Maintenance
External Connection Unit See ECU Card action handling test 4-15
A-5 monitoring system 5-6
F on-site troubleshooting 5-13
preventive 5-2
Fan Control UnitSee FCU Card A-2
replacing cards and modules 5-22
FCU Card
replacing I/O and aggregate modules
description A-2 5-28
general view A-2 replacing SFP transceivers in optical
Floating (Suspended) Floors, Rack interfaces 5-29
Installation D-6 replacing the FCU 5-30
Floor Marking, Rack Installation D-2 replacing xRAP/xRAP-100
FST components 5-30
description A-48 required equipment, tools and
materials 5-1
G
Mixed Aggregate Module Description
Grounding SAM1_4/OE A-21
rack installation D-7 Mixed I/O Module Description