Académique Documents
Professionnel Documents
Culture Documents
LM231, LM331
SNOSBI2C JUNE 1999 REVISED SEPTEMBER 2015
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM231, LM331
SNOSBI2C JUNE 1999 REVISED SEPTEMBER 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.3 Feature Description................................................. 10
2 Applications ........................................................... 1 8.4 Device Functional Modes........................................ 10
3 Description ............................................................. 1 9 Application and Implementation ........................ 11
4 Revision History..................................................... 2 9.1 Application Information............................................ 11
9.2 Typical Applications ................................................ 12
5 Description continued ........................................... 3
9.3 System Examples .................................................. 15
6 Pin Configuration and Functions ......................... 4
10 Power Supply Recommendations ..................... 18
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4 11 Layout................................................................... 18
11.1 Layout Guidelines ................................................. 18
7.2 ESD Ratings.............................................................. 4
11.2 Layout Example .................................................... 18
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information .................................................. 5 12 Device and Documentation Support ................. 19
7.5 Electrical Characteristics........................................... 5 12.1 Related Links ........................................................ 19
7.6 Dissipation Ratings ................................................... 6 12.2 Community Resources.......................................... 19
7.7 Typical Characteristics .............................................. 7 12.3 Trademarks ........................................................... 19
12.4 Electrostatic Discharge Caution ............................ 19
8 Detailed Description .............................................. 9
12.5 Glossary ................................................................ 19
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ......................................... 9 13 Mechanical, Packaging, and Orderable
Information ........................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
5 Description continued
Further, the LMx31A attain a new high level of accuracy versus temperature which could only be attained with
expensive voltage-to-frequency modules. Additionally the LMx31 are ideally suited for use in digital systems at
low power supply voltages and can provide low-cost analog-to-digital conversion in microprocessor-controlled
systems. And, the frequency from a battery-powered voltage-to-frequency converter can be easily channeled
through a simple photo isolator to provide isolation against high common-mode levels.
The LMx31 uses a new temperature-compensated band-gap reference circuit, to provide excellent accuracy over
the full operating temperature range, at power supplies as low as 4 V. The precision timer circuit has low bias
currents without degrading the quick response necessary for 100-kHz voltage-to-frequency conversion. And the
output are capable of driving 3 TTL loads, or a high-voltage output up to 40 V, yet is short-circuit-proof against
VCC.
P Package
8-Pin PDIP
Top View
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
IOUT 1 O Current Output
IREF 2 I Reference Current
FOUT 3 O Frequency Output. This output is an open-collector output and requires a pullup resistor.
GND 4 G Ground
RC 5 I R-C filter input
THRESH 6 I Threshold input
COMPIN 7 I Comparator Input
VS 8 P Supply Voltage
7 Specifications
7.1 Absolute Maximum Ratings (1) (2) (3)
MIN MAX UNIT
Supply Voltage, VS 40 V
Output Short Circuit to Ground Continuous
Output Short Circuit to VCC Continuous
Input Voltage 0.2 +VS V
Lead Temperature (Soldering, 10 sec.) PDIP 260 C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are measured with respect to GND = 0 V, unless otherwise noted.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) Human body model, 100 pF discharged through a 1.5-k resistor.
(1) All voltages are measured with respect to GND = 0 V, unless otherwise noted.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(1) Non-linearity is defined as the deviation of fOUT from VIN (10 kHz/10 VDC) when the circuit has been trimmed for zero error at 10 Hz
and at 10 kHz, over the frequency range 1 Hz to 11 kHz. For the timing capacitor, CT, use NPO ceramic, Teflon, or polystyrene.
(1) The absolute maximum junction temperature (TJmax) for this device is 150C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (JA), and the ambient temperature TA, and can be calculated using the formula
PDmax = (TJmax - TA) / JA. The values for maximum power dissipation will be reached only when the device is operated in a severe
fault condition (e.g., when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed).
Obviously, such conditions should always be avoided.
Figure 3. Non-Linearity Error vs. Power Supply Voltage Figure 4. Frequency vs. Temperature
Figure 7. 100 kHz Non-Linearity Error (Figure 17) Figure 8. Non-Linearity Error (Figure 14)
Figure 9. Input Current (Pins 6,7) vs. Temperature Figure 10. Power Drain vs. VSUPPLY
Figure 11. Output Saturation Voltage vs. IOUT (Pin 3) Figure 12. Non-Linearity Error, Precision F-to-V Converter
(Figure 19)
8 Detailed Description
8.1 Overview
8.1.1 Detail of Operation, Functional Block Diagram
The Functional Block Diagram shows a band gap reference which provides a stable 1.9-VDC output. This 1.9 VDC
is well regulated over a VS range of 3.9 V to 40 V. It also has a flat, low temperature coefficient, and typically
changes less than % over a 100C temperature change.
The current pump circuit forces the voltage at pin 2 to be at 1.9 V, and causes a current i = 1.90 V/RS to flow.
For RS=14 k, i=135 A. The precision current reflector provides a current equal to i to the current switch. The
current switch switches the current to pin 1 or to ground, depending upon the state of the R-S flip-flop.
The timing function consists of an R-S flip-flop and a timer comparator connected to the external RtCt network.
When the input comparator detects a voltage at pin 7 higher than pin 6, it sets the R-S flip-flop which turns ON
the current switch and the output driver transistor. When the voltage at pin 5 rises to VCC, the timer comparator
causes the R-S flip-flop to reset. The reset transistor is then turned ON and the current switch is turned OFF.
However, if the input comparator still detects the voltage on pin 7 as higher than pin 6 when pin 5 crosses
VCC, the flip-flop will not be reset, and the current at pin 1 will continue to flow, trying to make the voltage at pin 6
higher than pin 7. This condition will usually apply under start-up conditions or in the case of an overload voltage
at signal input. During this sort of overload the output frequency will be 0. As soon as the signal is restored to the
working range, the output frequency will be resumed.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
*Use stable components with low temperature coefficients. See Application Information.
**0.1 F or 1 F, See Typical Applications.
Figure 16. Standard Test Circuit and Applications Circuit, Precision Voltage-to-Frequency Converter
Figure 21. Temperature to Frequency Converter Figure 22. Long-Term Digital Integrator Using VFC
Figure 23. Basic Analog-to-Digital Converter Using Figure 24. Analog-to-Digital Converter With
Voltage-to-Frequency Converter Microprocessor
Figure 25. Remote Voltage-to-Frequency Converter Figure 26. Voltage-to-Frequency Converter With
With 2-Wire Transmitter and Receiver Square-Wave Output Using 2 Flip-Flop
Figure 27. Voltage-to-Frequency Converter With Figure 28. Voltage-to-Frequency Converter With
Isolators Isolators
Figure 29. Voltage-to-Frequency Converter With Figure 30. Voltage-to-Frequency Converter With
Isolators Isolators
11 Layout
GND
2
GND
1 8
COMP-OUT VS
C
O
M
P-
O
U 1
2 T 7 VINF
IREF VINF
3 6
FOUT COMP-OUT
1 2
COMP-OUT LOAD
4 5
GND RC_TIME
1
RC_TIME
2
GND
12.3 Trademarks
E2E is a trademark of Texas Instruments.
Teflon is a registered trademark of E.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 17-Mar-2017
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2