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Material Properties and Classification

PI Ceramic provides a wide selection of Important fields of application for soft


piezoelectric ceramic materials based on piezo ceramics are actuators for micro-
modified Lead Zirconate Titanate (PZT) and positioning and nanopositioning, sensors
Barium Titanate. The material properties are such as conventional vibration pickups,
classified according to the EN 50324 ultrasonic transmitters and receivers for flow
European Standard. or level measurement, for example, object
identification or monitoring as well as
In addition to the standard types described electro-acoustic applications as sound
here in detail, a large number of modifica- transducers and microphones, through to
tions are available which have been adapted their use as sound pickups on musical
to a variety of applications. instruments.

Internationally, the convention is to divide


Hard Piezo Ceramics
piezo ceramics into two groups. The terms
soft and hard PZT ceramics refer to the Hard PZT materials can be subjected to
mobility of the dipoles or domains and high electrical and mechanical stresses.
hence also to the polarization and depolar- Their properties change only little under
ization behavior. these conditions and this makes them parti-
cularly ideal for high-power applications.
Soft Piezo Ceramics The advantages of these PZT materials are
Characteristic features are a comparably the moderate permittivity, large piezoelectric
high domain mobility and resulting soft coupling factors, high qualities and very
ferroelectric behavior, i.e. it is relatively good stability under high mechanical loads
easy to polarize. The advantages of the and operating field strengths. Low dielectric
soft PZT materials are their large piezo- losses facilitate their continuous use in
electric charge coefficient, moderate permit- resonance mode with only low intrinsic
tivities and high coupling factors. warming of the component. These piezo
elements are used in ultrasonic cleaning
(typically kHz frequency range), for example,
the machining of materials (ultrasonic
welding, bonding, drilling, etc.), for ultra-
sonic processors (e.g. to disperse liquid
media), in the medical field (ultrasonic tartar
removal, surgical instruments etc.) and also
in sonar technology.

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