PI Ceramic provides a wide selection of Important fields of application for soft
piezoelectric ceramic materials based on piezo ceramics are actuators for micro- modified Lead Zirconate Titanate (PZT) and positioning and nanopositioning, sensors Barium Titanate. The material properties are such as conventional vibration pickups, classified according to the EN 50324 ultrasonic transmitters and receivers for flow European Standard. or level measurement, for example, object identification or monitoring as well as In addition to the standard types described electro-acoustic applications as sound here in detail, a large number of modifica- transducers and microphones, through to tions are available which have been adapted their use as sound pickups on musical to a variety of applications. instruments.
Internationally, the convention is to divide
Hard Piezo Ceramics piezo ceramics into two groups. The terms soft and hard PZT ceramics refer to the Hard PZT materials can be subjected to mobility of the dipoles or domains and high electrical and mechanical stresses. hence also to the polarization and depolar- Their properties change only little under ization behavior. these conditions and this makes them parti- cularly ideal for high-power applications. Soft Piezo Ceramics The advantages of these PZT materials are Characteristic features are a comparably the moderate permittivity, large piezoelectric high domain mobility and resulting soft coupling factors, high qualities and very ferroelectric behavior, i.e. it is relatively good stability under high mechanical loads easy to polarize. The advantages of the and operating field strengths. Low dielectric soft PZT materials are their large piezo- losses facilitate their continuous use in electric charge coefficient, moderate permit- resonance mode with only low intrinsic tivities and high coupling factors. warming of the component. These piezo elements are used in ultrasonic cleaning (typically kHz frequency range), for example, the machining of materials (ultrasonic welding, bonding, drilling, etc.), for ultra- sonic processors (e.g. to disperse liquid media), in the medical field (ultrasonic tartar removal, surgical instruments etc.) and also in sonar technology.