Journal of Mechanical Science and Technology

Analysis of the wire-drawing process with friction and thermal conditions obtained by
inverse engineering
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Manuscript Number: J2011-1725R1

Full Title: Analysis of the wire-drawing process with friction and thermal conditions obtained by
inverse engineering

Article Type: Original Paper

Keywords: Wire-drawing; Dimensional change; Quality of drawn product; Friction condition;

Thermal condition; Inverse Engineering

Corresponding Author: Naksoo Kim, Ph.D.

Sogang University
KOREA, REPUBLIC OF

Corresponding Author Secondary

Information:

Corresponding Author's Institution: Sogang University

Corresponding Author's Secondary

Institution:

First Author: Changsun Moon

First Author Secondary Information:

Order of Authors: Changsun Moon

Naksoo Kim, Ph.D.

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Abstract: In the cold wire-drawing process, although performed at room temperature, heat is
generated due to plastic work and friction at the workpiece-die interface. The
temperature distribution in both the workpiece and the die affects thermal expansion,
deformation pattern, and elastic recovery, resulting in the final dimension of drawn
products. We proposed inverse engineering procedures to determine the friction and
thermal conditions by comparing simple measurements with computation results of the
drawing power and temperature changes of the die. The conditions were then used to
simulate numerically the deformation behavior of wire and the temperature distribution
in the die. Thermal effects on the quality of drawn products were investigated based on
the prediction of the final dimensions of the products. It is concluded that thermal
effects should not be ignored even in the cold wire-drawing process and reasonable
numerical results were acquired in comparison with experiments.

Response to Reviewers: 1. Reviewer #1: There are English mistakes even in the first line of the abstract.

In the cold wire-drawing process, although performed at room temperature, heat is

generated due to plastic work ant friction at the workpiece-die interface.

The word ant was changed to and.

2. I added references of articles published in JMST

- [8] D. K. Leu, Evaluation of friction coefficient using sim-plified deformation model of

plastic hemispherical contact with a rigid flat. Journal of Mechanical Science and Tech-
nology, (24) (2010) 16971707.

- [9] J. S. Ajiboye, K. H. Jung, and Y. T. Im, Sensitivity study of frictional behavior by

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 dimensional analysis in cold forging. Journal of Mechanical Science and Technology,
(24) (2010) 115118.

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Analysis of the wiredrawing process with friction and thermal conditions obtained
by inverse engineering

Changsun Moon1, Naksoo Kim1*

1
Department of Mechanical Engineering, Sogang University, 121-742, Korea

(Manuscript Received 000 0, 2009; Revised 000 0, 2009; Accepted 000 0, 2009) -please leave blank

----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------

Abstract

In the cold wire-drawing process, although performed at room temperature, heat is generated due to plastic work and friction at the
workpiece-die interface. The temperature distribution in both the workpiece and the die affects thermal expansion, deformation
pattern, and elastic recovery, resulting in the final dimension of drawn products. We proposed inverse engineering procedures to
determine the friction and thermal conditions by comparing simple measurements with computation results of the drawing power
and temperature changes of the die. The conditions were then used to simulate numerically the deformation behavior of wire and
the temperature distribution in the die. Thermal effects on the quality of drawn products were investigated based on the prediction
of the final dimensions of the products. It is concluded that thermal effects should not be ignored even in the cold wire-drawing
process and reasonable numerical results were acquired in comparison with experiments.
Keywords: Wire-drawing; Dimensional change; Quality of drawn product; Friction condition; Thermal condition; Inverse Engineering
----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------

and air.
1. Introduction Heat generation in the wiredrawing process was first
studied by Siebel and Kobitzsch[1]. In their analysis, the
In the wiredrawing process, the diameter of a wire is
plastic deformation work per unit volume was simply
reduced by pulling it through a conical die. The major
added to the frictional work and both of them were con-
variables in the drawing process are the reduction ratio,
verted to heat. Snidle further expanded the theory of Sie-
die angle, friction at the interface of wire and die, and
bel and Kobitzsch in that the acceleration of the wire as it
drawing velocity. Plastic deformation of the wire and
passes through the die is considered [2]. Lucca and
heat generated due to the friction between the wire and
Wright discussed the assumptions which might be taken
die raise the temperature of die, resulting in thermal ex-
into consideration in predicting the temperature rise re-
pansion of the die. The trend of using high speeds in the
sulting from frictional heating in the wire-drawing [3].
wiredrawing process to meet the demands for increased
They mentioned that the coefficient of friction at the
productivity is often difficult to manufacture the drawn
wiredie interface can be assumed to be constant and
products as a designated diameter because of the uncon-
independent of pressure and temperature. They also re-
trolled thermal expansion of the die. The magnitude and
ported that the frictional heating was concentrated on the
the distribution of temperature in the wire and die depend
interface between the wire and die, resulting in a severe
on the initial temperatures, heat generation due to plastic
temperature gradient.
deformation of the wire and friction at the wiredie inter-
There are many process variables, other than heat from
face, and heat transfer between the deforming wire, the
the drawing process, that affect the quality of drawn
die, and the surrounding environment, such as lubricant
products. U.S. Dixit and P.M. Dixit studied the effect of

This paper was recommended for publication in revised form by Associate Editor
process variables such as the reduction ratio, the die
000 000-please leave blank.
*
Corresponding author. Tel.: +82 2 705 8635, Fax.: +82 2 712 0799 semiangle, and the coefficient of friction of the interface
E-mail address: nskim@sogang.ac.kr on the quality of drawn product [4]. Castro et al. analyzed
KSME & Springer 2010
the effect of the dies semiangle on the mechanical
0000 G. Bell et al. / Journal of Mechanical Science and Technology 00 (2010) 0000~0000
properties of annealed copper bars [5]. To identify the
effect of inclusion, Norasethasopon and Yoshida studied
the effect that the inclusion size and the inclusion para-
meters of the aspect ratio have on the drawing stress,
maximum hydrostatic stress, and maximum die pressure
during the single filament copperwire drawing process
[6].
Vega et al. measured the temperature and drawing force
by changing the drawing velocity, and the drawing force
was measured by using a wire rolling gauge behind the
die [7]. Furthermore, they installed a thermocouple to
measure the temperature rise in the deformation zone.
They confirmed from their experiment that the tempera-
ture and drawing force relied on interface conditions. Leu
evaluated the friction coefficient using the model of plas-
tic hemispherical contact against a rigid flat [8]. To de-
scribe the deformed hemispherical shape, he utilized the
fractional profile of an ellipsoid and simultaneously de-
fined the contact area ratio. To investigate dependence of
the shear friction factor on d/t and L/1000, Ajiboye et al.
conducted ANOVA and compared two regression models
[9]. Based on the statistical results investigated, the mod-
el using d/t as the independent variable was found to be
valid in successfully predicting the shear friction factor at
the punch interface than the other model using L/1000
kN. Obi and Oyinlola investigated fattybased oils for
metal forming applications [10]. By measuring the coef-
ficient of friction it is possible to grade these oils accord-
ing to their lubricating capabilities since one of the quali-
ties of a good lubricant is the ability to reduce friction
and also applied load. Luksza et al. focused on the de-
formation behavior of the wires while conducting expe-
riments on both the single and the multipass drawing
process [11]. Corra et al. analyzed the influence of the
structural features of the drawn wire on the strain soften-
ing phenomenon [12]. They also conducted microstruc-
tural and Xray diffraction analyses to evaluate the draw-
ing stress. Son et al. investigated the deformation beha-
vior of the surface defects with a notch shape on the wire
in a multi-pass hot rolling process using a finite element
code, CAMProll [13].
Residual stress on the drawn products has a significant
effect on post deformation. verstam examined the effect
of the bearing geometry of die on the residual stress of
the drawn wire [14]. Atienza et al. studied the influence
of residual stresses on the environmentally assisted
cracking of the wire [15]. Carpinteri et al. studied the
effect on residual stresses due to fatigue crack propaga-
tion in a metallic cracked round bar with a Vshaped
circumferential notch [16]. Ripoll et al. proposed a reduc-
tion of the circumferential residual stresses during wire
drawing by using advanced die geometry and by per-
forming bending operations under favorable conditions
[17]. ElDomiaty and Kassab studied ways to minimize
the energy required for the wiredrawing process [18].
To minimize the drawing force, they determined the re-
duction ratio and the coefficient of friction between the
wire and die. Shinohara and Yoshida carried out multi
pass drawing of the stainless steel wire with an artificial
crack, and investigated growth and disappearance of a
crack from both sides by experiments and the finite ele-
ment analysis(FEA) [19]. Komori presented a new equa-
tion that denotes a change in the void volume fraction so
that the fracture defects in highcarbon steel wire could
be investigated [20]. McAllen and Pheland analyzed duc-
tile fracture initiation and propagation by central burst-
ing in 2011 Aluminium wire, and the damage incurred
before the ductile fracture was analyzed using the mod-
ified damage model [21].
Because a temperature rise in the die affects the lubri-
cating condition, equipment life, and quality of the drawn
products, it is crucial to accurately predict the tempera-
ture distribution in the die. The previous studies on the
temperature and products in the wiredrawing process
primarily address the dies temperature rise as result of
the deformation and frictional heating generated as the
wire passes through the die; they also discuss the temper-
ature rise due to the process variables such as the reduc-
tion ratio, reduction angle, and drawing velocity. In con-
trast, there is no information available about FEA proce-
dures for conducting a practical analysis of the tempera-
ture distribution in the die that considers the friction con-
dition and heat transfer to the surroundings, such as air.
This study tries to propose procedures to utilize the
measured drawing power and temperature curves of the
die at a certain position in determining the friction and
thermal conditions by inverse engineering. The process
variables obtained reasonably will be, in turn, used to
numerically simulate the deformation behavior of the
workpiece and die temperature distribution by FEA. Then
it is expected that the effect of the temperature distribu-
tion on the final dimension or the quality of drawn prod-
ucts can be investigated.
2. Drawing conditions
2.1 Process parameters
The dimensions of tooling used in the wire-drawing
process are illustrated schematically in Fig. 1. As shown
in Fig. 1(a), the inlet and the outlet diameters of the die
are D0 =10 mm and D f =8.1 mm, respectively; the
height of the die and case assembly (h) is 30.95mm and
the width of the case (w) is 35mm. The wire, die and case
were made of S45CS, WC, and AISIH13, respectively.
Fig. 1(b) shows the die geometry. The parameters that
define the die geometry include the back relief angle,
reduction angle, entrance angle, and bearing length.
Fig. 2 shows the flow stress of S45CS at 20 C and
200 C . Table 1 displays the thermal properties of the
 G. Bell et al. / Journal of Mechanical Science and Technology 23 (2009) 1261~1269 1263

selected materials used as workpiece or tooling in the
wiredrawing process. The drawing velocity was 916
mm/s, the initial temperature of the tools was 30 C , and
the environment temperature was 20 C .
Table 1. Thermal property of selected materials
Material S45CS
Heat conductivity( W / mK ) 51.9
Heat capacity( J / mmK ) 0.486
Thermal Expansion coefficient 1.397e-05
( 1/ K )
Fig. 2. True stress-strain curve of S45CS
2.2 Experiments
In the wiredrawing process, wires are pulled through a
die at a consistent drawing velocity. Friction acts on the
WC AISIH13 interface between the wire and die, disrupting the relative
59 24
motion of the wire. The drawing force will differ, de-
15 2.7
pending on the magnitude of the friction. To estimate the
5e-05 1.17e-05
friction stress, we will use a simple friction model of
constant friction factor. The friction stress in the actual
process can be determined inversely by measuring the
drawing power using the drawing equipment [22]. The
drawing power was measured by wire rolling gauge be-
hind the die. The drawing powers were measured with
several combinations of the diameter of the wires, the
inner diameter of the die, and the reduction ratio. Fig.
3(a) contains the schematic diagram illustrating the mea-
surement of temperature on the die in the wiredrawing
process. A thermocouple was installed to measure the die
temperature at a certain position. For approximately 4,000
seconds, the wire was pulled through a die and the tempera-
ture at a specific position was recorded. Fig. 3(b) shows the
temperature curve measured for 4,000 seconds; the tem-
perature reached as high as 107.4 C during the wire
drawing process.

(a)

(a)

(b)
Fig. 1. (a) Schematic outline of the model used in experiments and
FEA and (b) parameters defining the die geometry

(b)
Fig. 3. Measurement of the die temperature during the wire drawing
process: (a) experimental setup; (b) temperature transition at chan-
nel 1
0000 G. Bell et al. / Journal of Mechanical Science and Technology 00 (2010) 0000~0000
3. Inverse engineering for determination of expe-
rimental conditions
The friction conditions can be determined by comparing
the drawing power obtained from the experiments with a
computed one using the FEA with assigned friction factor.
The method is similar to determine thermal conditions by
comparing the measured temperature curves of the die
with those of computed ones, described later. In compu-
tations of FEA, we need to evaluate the heat transfer
coefficients for all parts. We used DEFORM 2D (ver. 9.0,
Scientific Forming Technologies Co., USA) for the wire
drawing process simulation. The die and case were as-
sumed to be elastic and the wires have elasticplastic
deformation behavior. The drawing analysis was con-
ducted based on the twodimensional axisymmetric
model.
3.1 Friction conditions
Pressure and a sliding motion at the interface between
the wire and die cause the wire deformation and generate
frictional heating, resulting in a temperature rise. The
elevated temperature affects the drawn products and fric-
tion by itself influences the wire deformation pattern,
serving as another important factor that affects the tem-
perature.
If a wire is pulled through a die at a consistent velocity
in the wiredrawing process, the pulling force differs
based on the lubrication status. Drawing power, Pdrawing ,
drawing force, Fdrawing , and drawing stress, d can be
calculated using Eqs. (1) (3), respectively [23].
Pdrawing Fdrawing Vdrawing velocity
Fdrawing d Af
m R 2
d Y0 2(1 f
)ln 0 tan
sin 2 Rf 3
If we measure the drawing power Pdrawing at con-
stant Vdrawing velocity , the drawing stress, d can be easily
estimated using Eqs. (1) and (2). Ideally, the friction fac-
tor m is calculated by Eq. (3). But since Eq. (3) does
f
not consider excessive or redundant deformation and
ignores temperature effects on the yield stress Y0 , it is
expected that the estimated value of friction factor using
Eq. (3) will be far from the actual one.
We measured the drawing powers for three cases with
the same materials and the same condition of lubrications
except having different geometrical dimensions, like the
diameter of the wire, the inner diameter of the die, and
the reduction ratio, as summarized in Table 2. We can
assume that the same friction condition applied to all
three cases resulting in one value of friction factor, m .
f
The difference between the experimental drawing
forces and the computed ones can be expressed as a qua-
dratic function of m as expressed in Eq. (4). It is easily
f
obtained by multiple simulation of FEA with different
values of m near the minimum.
f
Eerror 43.947m f 2 15.526m f 1.387 (4)
The friction factor can be determined as a value that is
closest to the drawing force obtained from the experi-
ments. The value minimizing the difference function in
the equation above was found to be m f 0.1765 , which
gives a good correlation in three cases but it is twice as
much as the value obtained using Eq. (3). Since Eq. (3)
does not consider the decrease of flow stress due to the
temperature rise, m f is quite underestimated. It should
be noted that in the cold wire-drawing process, thermal
effect should not be ignored.
3.2 Thermal conditions
3.2.1 Temperature at the wire-die interface
Even though heat is generated in the workpiece due to
plastic deformation and at the wire-die interface due to
the friction, and heat is transferred to the die and to the
environment, the temperature at the wire-die interface
becomes constant in a short time period. In other words,
thermally steady state at the interface is easily attained in
the wire-drawing process.
The friction factor calculated above ( m f 0.1765 ) was
used to obtain a temperature transition curve at the inter-
(1) face by carrying out a FE simulation for deformation and
temperature of the workpiece and the die. Fig. 4(a) shows
(2) temperature distribution in the die and three specific
points at the interface. Fig. 4(b) shows temperature rise at
three points. It is verified that the temperature becomes
(3) constant in a short time period less than 2.5 sec.
The temperature distribution along the wire-die inter-
face after attaining thermally steady state condition was
used as one boundary condition of temperature in inverse
engineering to find out heat transfer coefficients at other
boundary.
3.2.2 Boundary conditions for the wiredrawing model
For the relevant simulation of heat transfer in the wire-
drawing process, it is necessary to use appropriate heat
transfer coefficient at each boundary of tool fragment, as
can be seen in Fig. 5.
It is assumed that the interface of the wire and die a-b
and the interface of the die and case c-g-f have the same
interface heat transfer coefficient defined as hlub . It is a
 G. Bell et al. / Journal of Mechanical Science and Technology 23 (2009) 1261~1269 1265

reasonable assumption considering that the interfaces are

closely contacted with high pressure. Heat transfer coef-
ficient at the case boundary d-e to the support is defined
as hlub1 ; b-c-d and e-f-a of the case that come in contact
with air is defined as the convective heat transfer coeffi-
cient, h1 . The support of the case is assumed to have the
same temperature as environment air.
Table 2. Friction factors calculated by Eq. (3) and a comparison of the drawing force between the experiments and FEA ( m f 0.1765 )

D0 Df V P(kw) F(N) mf F(N) Differences (%)

CASE (mm) (mm) (mm/s) (Experiment) (Experiment) Eq. (3) (FEA) (Experiment vs FEA)

CASE 1 10 8.1 25,565 27,904 0.086 28,298 1.3

CASE 2 12 10 916 35,214 38,437 0.093 38,309 0.3
CASE 3 14 13 30,563 33,366 0.091 32,725 1.9
Average 1.2

(a)

Fig. 5. Model of heat tansfer on surface in FE simulation of the

wire-drawing process

3.2.3 Determination of hlub

(b)
Fig. 4. (a) Temperature distribution of dies after 2.25sec and (b)
temperature curves of node 1, 2, and 3
The convective heat transfer coefficient ( h1 ) is be-
tween 0.02~0.025 kW / m2 K when in contact with air
of 1 atmosphere pressure; it was assumed to have the
value of 0.025 kW / m 2 K [24, 25].
As shown in Fig. 6, a simple method was used to de-
termine hlub . Fig. 6(a) is a oneobject model with two
different materials, and Fig. 6(b) is a twoobject model
with two different materials. As shown in 6(a), the
model was heated at a certain temperature and the
temperature at a certain position was measured. The
model in Fig. 6(b) was heated at the same temperature
as the model in Fig. 6(a) but hlub was changed to
compare the temperature curve of the models in Fig.
6(a) and (b). As can be seen in Fig. 6(c), the tempera-
ture curves coincide with that of one-object model for
hlub over 10 kW / m2 K , and thus it is reasonable to
assume that hlub of 10 kW / m 2 K is applicable.
0000 G. Bell et al. / Journal of Mechanical Science and Technology 00 (2010) 0000~0000

(a) (b)

(c)
Fig. 6. Two models and effects of interfacial heat transfer coefficient: (a) One-object model, (b) two-object model, and (c) temperature
curves with different hlub values

3.2.4 Determination of hlub1 and h1
To obtain the appropriate values of hlub1 and h1 , the
design of experiments was applied to the function of
area difference under temperature transition curves
between measurement and computation, as shown in
Fig. 7. Following the study of Yen et al., initial
guesses of hlub1 and h1 , were set as 0.1 kW / m2 K
and 0.025 kW / m2 K , respectively [24]. The constraint
condition of hlub1 was set to be 0.1~0.102 kW / m2 K ,
considering that the relative error was less than 4% in
the range. The initial value and level of the design
parameters are shown in Table 3. The computation
results using the FEA are summarized in Table 4. The
response surface method was used based on orthogon-
al arrays to obtain an objective function comprising the
design parameters. The object function for optimiza-
tion is expressed in Eq. (5).
c 1,142,818hlub1
2
18,480h12 235,274 hlub1
(5)
15,214h1 141,057hlub1h1 12,118,
To minimize the objective function, BFGS was used.
The method is an optimization methodology that di-
rectly updates a Hessian matrix. As a result, it was
determined that the design parameter hlub1 was
0.1011 kW / m2 K , and h1 , 0.0246 kW / m2 K . The cal-
culated parameters were compared with the FEA re-
sults. It can be regarded that hlub1 and h1 are deter-
mined to be appropriate, since the comparison revealed
a margin of error less than 0.05%.
0000 G. Bell et al. / Journal of Mechanical Science and Technology 00 (2010) 0000~0000

Table 3. The levels of the design variables

Design variables Initial value Level 0 Level 1 Level 2
2
hlub1 ( kW / m K ) 0.101 0.100 0.101 0.102
2
h1 ( kW / m K ) 0.025 0.020 0.025 0.030

Table 4. Table of orthogonal arrays for the optimization of the

area
Object
Exp.
hlub1 h1 function Error
No. ( kW / m2 K ) ( kW / m2 K ) Area( mm2 ) (%)
1 0.100 0.020 393,927 3.40
2 0.100 0.025 392,099 2.92
Fig. 7. Temperature transition curves obtained by experiment and 3 0.100 0.030 390,296 2.45
computation 4 0.101 0.020 389,404 2.22
5 0.101 0.025 382,639 0.44
6 0.101 0.030 380,947 0.0007
4. Dimensional changes of the drawn wire 7 0.102 0.020 379,276 0.43
8 0.102 0.025 378,449 0.65
4.1 The definition of dimensional change and nu- 9 0.102 0.030 372,160 2.30
merical steady state

As the wire passes through the drawing die, the final

dimension of the drawn wire deviates from the desig-
nated dimension or the inner diameter of the die. If die
wear is ignored, it is mainly due to the elastic deforma-
tion of the die, the elastic recovery of the workpiece,
and the thermal expansion of both the die and the
(a)
workpiece. The dimensional difference between the
drawn wire and the designated dimension is defined as
a dimensional change.
In experiment, the dimensional change is measured
by subtracting the inner diameter of the die from the
average diameter of the drawn wire. Fig. 8(a) shows
that the average diameter was calculated after measur-
ing diameters at three points in a sample. Size of popu-
lation is 50 wire samples, with 3m cut off after draw-
(b)
ing. The standard deviation was order of 0.05%.
In the meanwhile, the computation results of FEA for Fig. 8. Measurement method for the dimensional change: (a)
the wiredrawing process revealed that the nodes that experiment; (b) FEA
represent the surface of the wires did not have the
same dimension as shown in Fig. 8(b). Therefore, it is
necessary to define the numerical average diameter of
the drawn wire. The computed diameter is defined as
the volumetric average of diameter with certain num-
ber, say, 50 nodes on the wire surface. It should be
noted that the computed diameter is meaningful to
compare with experiments since the level of the com-
puted deviation was less than 0.1%.
In the wiredrawing process, the deformation pattern
in the wire reaches a steady state after the wire being
drawn to a certain length. In the computation, the
steady state was assumed to be attained after the draw-
ing force becomes constant, as shown in Fig. 9. Fig. 9. Drawing force in steady state of the wire-drawing process
(FEA)
 G. Bell et al. / Journal of Mechanical Science and Technology 23 (2009) 1261~1269
4.2 Thermal effect on the dimensional change
Effects of thermal deformation and elastic recovery
of the workpiece and the die on the final dimensional
accuracy have been investigated in other metal form-
ing processes [26, 27]. In this study, the friction and
thermal conditions obtained from inverse engineering
were used to simulate numerically the deformation and
heat transfer occurred during the cold wire-drawing
process by using FEA. It is intended to investigate the
thermal effect on the final dimension of the drawn
products.
Table 5. Comparison of the dimensional changes
CASE D0 Df
(mm) (mm) (mm)
CASE 1-1 0 3.645
CASE 1-2 10 8.1 2.4
CASE 1-3 2.4
5. Conclusions
The procedures of inverse engineering to determine the
friction and thermal conditions in the wire-drawing
process are proposed by measuring the drawing force and
the transition curve of temperature at a certain position of
the die assembly. The analysis tool used in inverse engi-
neering was a commercial finite element analysis pro-
gram based on elastic-plastic deformation and coupled
heat transfer algorithm. Based on the close investigations
on the comparisons of the computation results with mea-
surements obtained in experiments, the followings are
concluded:
(1) With the determined friction factor via inverse engi-
neering, the computed drawing forces showed strong
correlation. Also with the determined thermal condi-
tions or the heat transfer coefficients, we obtained
close temperature curves to experiments. Therefore
the procedures and methodology of inverse engineer-
ing to determine the friction and thermal conditions is
reasonable. Moreover, since the measurements in-
clude the drawing force and temperature monitoring
at a convenient position, it is simple and useful to be
applied in reality.
(2) The computed dimensional changes considering
thermal effect was much closer to measurements than
those without considering thermal effect. It means
that the simulation of the cold wire-drawing process
with FEA always should consider thermal effect. Cor-
rect values of the friction and thermal conditions
should be used to yield reliable computation results.
1263
It is revealed that the inner diameter of the die with
thermal effect was less than that of isothermal case,
resulting in the reduced dimensional change of the
wire by the amount of 0.003mm~0.004mm for three
cases of die geometry, as summarized in Table 5. Ta-
ble 5 also shows the dimensional changes of the drawn
wire with three cases of die geometry measured in
experiments, computations with and without thermal
effect, respectively. It should be noted that the compu-
tation results considering thermal effect is twice closer
than those without thermal effect.
Dimensional changes(mm),
L (Deviation from measurement, %)
Experi- FEA with ther- Isothermal
(mm) ( ) ( )
ment mal effect FEA
0 0.009 0.008(11%) 0.011(25%)
3.645 12 6 0.013 0.011(15%) 0.015(18%)
5.265 6 0.010 0.009(10%) 0.012(22%)
(3) The computed dimensional changes reflect thermal
and elastic deformation of the die and elastic recovery
of the workpiece. Since the computation results with
FEA are in good agreements with experiments, we
can utilize FEA to identify the contribution of each
source to the dimensional change. We may control
the dimensional changes by varying process parame-
ters, resulting in enhancement of the quality of the
drawn-wire.
Acknowledgements
We would like to thank to the members of instrumenta-
tion and control team in Dongbu steel Co. Ltd. for their
supporting the research. This work was also supported by
the National Research Foundation of Korea(NRF) grant
funded by the Korea government(MEST) (No. 2010
0023152) and Sogang university research program with a
Grant No. 201010042.01.
0000 G. Bell et al. / Journal of Mechanical Science and Technology 00 (2010) 0000~0000

Nomenclature ing. Journal of Mechanical Science and Technology, (24)

(2010) 115118.
d : Drawing stress
[10] A. I. Obi and A. K. Oyinlola, Frictional characteristics
Y0 : Yield stress of fatty-based oils in wire drawing. Wear, (194) (1996) 30
m f : Friction factor 37.
R0 : Wire radius before drawing [11] J. Luksza, J. Majta, M. Burdek, and M. Ruminski,
Rf : Wire radius after drawing Modelling and measurements of mechanical behaviour in
Re : Reduction ratio multi-pass drawing process. Journal of Materials Processing
D0 : Wire diameter before drawing Technology, (8081) (1998) 398405.
[12] E. C. S. Corra, M. T. P. Aguilar, and P. R. Cetlin, The
Df : Wire diameter after drawing
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Mr. Changsun Moon is currently a

candidate for the master degree at
the department of mechanical engi-
neering, Sogang University. He
received his B.S. degree from the
department of Mechanical Engineer-
ing, Incheon University, Incheon,
South Korea in 2009. His research interests are in the
area of optimal design of forming process and metal
forming plasticity.
0000 G. Bell et al. / Journal of Mechanical Science and Technology 00 (2010) 0000~0000

Table and Figure captions list

Table 1. Thermal property of selected materials

Table 2. Friction factors calculated by Eq. (3) and a comparison of the drawing force between the experiments and FEA
( m f 0.1765 )
Table 3. The levels of the design variables
Table 4. Table of orthogonal arrays for the optimization of the area
Table 5. Comparison of the dimensional changes

Fig. 1. (a) Schematic outline of the model used in experiments and FEA and (b) parameters defining the die geometry
Fig. 2. True stress-strain curve of S45CS
Fig. 3. Measurement of the die temperature during the wire drawing process: (a) experimental setup; (b) temperature transition at
channel 1
Fig. 4. (a) Temperature distribution of dies after 2.25sec and (b) temperature curves of node 1, 2, and 3
Fig. 5. Model of heat tansfer on surface in FE simulation of the wire-drawing process
Fig. 6. Two models and effects of interfacial heat transfer coefficient: (a) One-object model, (b) two-object model, and (c)
temperature curves with different hlub values
Fig. 7. Temperature transition curves obtained by experiment and computation
Fig. 8. Measurement method for the dimensional change: (a) experiment; (b) FEA
Fig. 9. Drawing force in steady state of the wire-drawing process (FEA)
0000 G. Bell et al. / Journal of Mechanical Science and Technology 00 (2010) 0000~0000

Table list:

Table 1. Thermal property of selected materials

Material S45CS WC AISIH13
Heat conductivity( W / mK ) 51.9 59 24
Heat capacity( J / mmK ) 0.486 15 2.7
Thermal Expansion coefficient 1.397e-05 5e-05 1.17e-05
( 1/ K )

Table 2. Friction factors calculated by Eq. (3) and a comparison of the drawing force between the experiments and FEA ( m f 0.1765 )

D0 Df V P(kw) F(N) mf F(N) Differences (%)

CASE (mm) (mm) (mm/s) (Experiment) (Experiment) Eq. (3) (FEA) (Experiment vs FEA)

CASE 1 10 8.1 25,565 27,904 0.086 28,298 1.3

CASE 2 12 10 916 35,214 38,437 0.093 38,309 0.3
CASE 3 14 13 30,563 33,366 0.091 32,725 1.9
Average 1.2

Table 3. The levels of the design variables

Design variables Initial value Level 0 Level 1 Level 2
hlub1 ( kW / m2 K ) 0.101 0.100 0.101 0.102
h1 ( kW / m2 K ) 0.025 0.020 0.025 0.030

Table 4. Table of orthogonal arrays for the optimization of the area

Object
Exp. hlub1 ( kW / m2 K ) h1 ( kW / m2 K ) function
No. Error (%)
Area( mm2 )
1 0.100 0.020 393,927 3.40
2 0.100 0.025 392,099 2.92
3 0.100 0.030 390,296 2.45
4 0.101 0.020 389,404 2.22
5 0.101 0.025 382,639 0.44
6 0.101 0.030 380,947 0.0007
7 0.102 0.020 379,276 0.43
8 0.102 0.025 378,449 0.65
9 0.102 0.030 372,160 2.30

Table 5. Comparison of the dimensional changes

Dimensional changes(mm),
CASE D0 Df L (Deviation from measurement, %)
Experi- FEA with thermal
(mm) (mm) (mm) (mm) ( ) ( ) Isothermal FEA
ment effect
CASE 1-1 0 3.645 0 0.009 0.008(11%) 0.011(25%)
CASE 1-2 10 8.1 2.4 3.645 12 6 0.013 0.011(15%) 0.015(18%)
CASE 1-3 2.4 5.265 6 0.010 0.009(10%) 0.012(22%)
 G. Bell et al. / Journal of Mechanical Science and Technology 23 (2009) 1261~1269 1263

Figure list:

(a)

(b)
Fig. 1. (a) Schematic outline of the model used in experiments and FEA and (b) parameters defining the die geometry

Fig. 2. True stress-strain curve of S45CS

0000 G. Bell et al. / Journal of Mechanical Science and Technology 00 (2010) 0000~0000

(a)

(b)
Fig. 3. Measurement of the die temperature during the wire drawing process: (a) experimental setup; (b) temperature transition at channel 1

(a)

(b)
Fig. 4. (a) Temperature distribution of dies after 2.25sec and (b) temperature curves of node 1, 2, and 3
 0000 G. Bell et al. / Journal of Mechanical Science and Technology 00 (2010) 0000~0000

Fig. 5. Model of heat tansfer on surface in FE simulation of the wire-drawing process

(a) (b)

(c)
Fig. 6. Two models and effects of interfacial heat transfer coefficient: (a) One-object model, (b) two-object model, and (c) temperature curves
with different hlub values
0000 G. Bell et al. / Journal of Mechanical Science and Technology 00 (2010) 0000~0000

Fig. 7. Temperature transition curves obtained by experiment and computation

(a)

(b)
Fig. 8. Measurement method for the dimensional change: (a) experiment; (b) FEA

Fig. 9. Drawing force in steady state of the wire-drawing process (FEA)