International Conference on Advances & Challenges in Interdisciplinary Engineering and Management 78

International Conference on Advances & Challenges in Interdisciplinary Engineering and

Management 2017 [ICACIEM 2017]

ISBN 978-81-933235-1-9 VOL 01

Website icaciem.org eMail icaciem@asdf.res.in
Received 10 January 2017 Accepted 28 - January 2017
Article ID ICACIEM155 eAID ICACIEM.2017.155

An Ultra-Low Power Microprocessor Based Wireless ECG

Arthi P1, Kalaivani K2, Madhubala V3, Punitha S4, Nivethini G5, Umamaheswari M6
1,2,3,4,5,6
UG Scholars, Department of ECE, Vidyaa Vikas College of Engineering and Technology, Tiruchengode, India

Abstract: This paper presents the design of a fully integrated electrocardiogram (ECG) signal processor (ESP) for the prediction of ventricular
arrhythmia using a unique set of ECG features and a naive Bayes classifier. Real-time and adaptive techniques for the detection and the delineation of
the P-QRS-T waves were investigated to extract the fiducially points. Those techniques are robust to any variations in the ECG signal with high
sensitivity and precision. Two databases of the heart signal recordings from the MIT Physic Net and the American Heart Association were used as a
validation set to evaluate the performance of the processor. Based on application-specified integrated circuit (ASIC) simulation results, the overall
classification accuracy was found to be 86% on the out-of-sample validation data with 3-s window size. The proposed architecture of this paper
analysis the logic size, area and power consumption using Xilinx 14.2.

ISBN 978-81-933235-1-9 VOL 01

Website icaciem.org eMail icaciem@asdf.res.in
Received 10 January 2017 Accepted 28 - January 2017
Article ID ICACIEM156 eAID ICACIEM.2017.156

Heat Transfer Enhancement Analysis of Micro Channel

Vetrichelvan G1
1
Associate Professor, Department of Mechanical Engineering,
Vidyaa Vikas College of Engineering and Technology, Tiruchengode, India

Abstract: In our research work its considered Due to the high performance of electronics components, Heat Dissipation becomes a significant issue for
stable operation of components. Micro channels provide very high heat transfer coefficients because of their small diameters. In this study, two
dimensional fluid flow and heat transfer in a rectangular micro channel heat sink are analysed using FLUENT as solver with water as cooling fluid.
With strong literature study it is found that down to 50 m of hydraulic diameter, macro scale model can be applicable. Three channels of height 50
m, 100 m and 150 me are considered. The study is mainly focused on Nussle Number and height effects on micro channel thermal performance. The
highest temperature is encountered at the heated surface of the heat sink immediately above the channel outlet.

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