curamik CERAMIC SUBSTRATE

DBC technology

Design Rules Version 13/2015

Content Available ceramic materials

Al 2 O 3 HPS * AlN
Alumina Alumina Aluminium
1. Geometric properties 3. Quality (9% ZrO2 doped) Nitride

1.01. Available ceramic types / thicknesses........................... 03 3.01. Solderability wetting on metallization.......................10

* The HPS products are subject to patent restrictions in some countries.
1.02. Copper thicknesses (standard)...................................... 03 3.02. Thick wire bondability on metallization.......................10 Based on zirconia toughened alumina (ZTA).

1.03. Total dimensions master card....................................... 04

1.04. Max. usable area............................................................ 04 4. Physical properties

1.05. Delivery form.................................................................. 04 4.01. Thermal conductivity......................................................10

4.02. Electrical resistivity of ceramic.....................................10

1. Geometric properties
1.06. Tolerances of single parts outside dimensions............ 04

1.07. Available material thickness combinations.................. 04 4.03. Dielectric constant.........................................................10

4.04. Dielectric loss................................................................. 11

1.01. Available ceramic types / thicknesses
1.08. Copper free perimeter................................................... 06
Material
1.09. Conductor dimensions width / spacing......................... 06 4.05. Dielectric strength (DC voltage) of ceramic.................. 11
Al2O3 HPS AlN
1.10. Sidewall of etched pattern............................................ 06 4.06. Electrical conductivity of copper surface...................... 11
0.25
1.11. Mismatch copper pattern front/back............................ 07 4.07. Copper peeling strength ................................................ 11

ceramic thicknesses mm
0.32
1.12. Etching tolerance........................................................... 07 4.08. Application temperature............................................... 11
0.38
1.13. Flatness (layout related)................................................ 07 4.09. Bending strength (bare ceramic)................................... 11
0.5
1.14. Chip-off at ceramic edge................................................. 07 4.10. Fracture toughness (K1c)................................................12
0.63
1.15. Tolerance of total thickness (ceramic + copper)............ 07 4.11. Youngs modulus (bare ceramic)......................................12
1.00
4.12. Coefficient of linear thermal expansion (CTE)...............12

2. Additional design features AI203 other thicknesses on request

2.01. Platings over entire surface.......................................... 08 HPS ZrO2 toughened Al2O3 with 9% content

AIN other thicknesses on request

2.02. Copper surface............................................................... 08

2.03. Dimples.......................................................................... 08

2.04. Lifetime with/without dimples.................................... 09

1.02. Copper thicknesses (standard)
2.05. Solder stop..................................................................... 09
Al2O3 0.127 mm 0.2 mm 0.25 mm 0.3 mm 0.4 mm
2.06. Holes and laser cut outlines......................................... 09
HPS 0.127 mm 0.2 mm 0.25 mm 0.3 mm 0.4 mm 0.5 mm 0.6 mm

AlN 0.127 mm 0.2 mm 0.25 mm 0.3 mm 0.4 mm

curamik CERAMIC SUBSTRATES I Design Rules DBC I Version 13/2015 03

 1.03. Total dimensions master card HPS

as fired 138 x 190.5 mm 1.5% copper thickness mm

0.127 0.2 0.25 0.3 0.4 0.5 0.6

ceramic thickness mm
0.25 available

1.04. Max. usable area standard material

combinations
0.32
laser scribed 127 x 178 mm + 0.2 mm / - 0.05 mm @ d(ceramic) 0.63 mm
+ 0.3 mm / - 0.05 mm @ d(ceramic) > 0.63 mm 0.38

Note When using master cards we recommend to use laser scribed material
due to the 1.5% average firing tolerance of ceramic (as fired).

AlN
copper thickness mm
1.05. Delivery form 0.127 0.2 0.25 0.3 0.4
Master card with or without laser scribing; defect parts inked available
0.38

ceramic thickness mm
Single parts minimum dimension 15 x 15 mm edge length, smaller on request standard material
combinations
0.5

0.63

1.06. Tolerances of single parts outside dimensions 1.00

+ 0.2 mm / - 0.05 mm @ d(ceramic) 0.63 mm + 0.3 mm / - 0.05 mm @ d(ceramic) > 0.63 mm

Note Single parts laser scribed

Note The copper thickness difference of front side to back side shall not exceed 100 m.
The copper thickness may not be larger than the ceramic thickness (except HPS).

1.07. Available material thickness combinations

Al2O3
copper thickness mm
0.127 0.2 0.25 0.3 0.4

available
0.25
ceramic thickness mm

standard material
combinations
0.32

0.38

0.5

0.63

1.00

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 1.08. Copper free perimeter 1.11. Mismatch copper pattern front/back
A A M A
Cu-thickness A Copper M 0.1 mm Copper

Ceramic Ceramic
0.2 mm 0.2 mm Copper
Copper

0.3 mm 0.25 mm Note Metallization is measured at the interface of ceramic and copper. The A M
A = Copper free perimeter difference of copper-free perimeter between the front and back should be
0.4 mm 0.3 mm A = Layout side / Bottom side
defined as < 0.5 mm.
M = Mismatch copper pattern
0.5 mm 0.35 mm
0.6 mm 0.4 mm

Note Metallization is measured at the interface of ceramic and copper. Final peri-
meter depend on ceramic thickness and manufacturing tolerances such as etching 1.12. Etching tolerance A
or lasering.
Cu-thickness tolerance Copper
Ceramic
0.2 mm typ. 0.15 mm
0.3 mm typ. 0.20 mm A = pad/conductor

1.09. Conductor dimensions width / spacing Pitch

0.4 mm typ. 0.25 mm

Note Metallization is measured at the interface of ceramic and copper. The

Conductor dimensions Copper d
Cu-thickness (d) Min. Pitch etching tolerance is always symmetric to the center axis of the pad/conductor.
width / spacing (W) Ceramic

0.127 mm typ. 0.35 mm 0.7 mm W

W = Width
0.2 mm typ. 0.4 mm 0.8 mm d = Cu-thickness
1.13. Flatness (layout related)
0.25 mm typ. 0.45 mm 0.9 mm
Requested flatness of single DBC substrates or master cards cannot be guaranteed in
0.3 mm typ. 0.5 mm 1.0 mm
advance due to specific design influences of the circuit. A flatness (not 100% inspected)
0.4 mm typ. 0.6 mm 1.2 mm can only be specified after design definition and sample delivery with initial sample
test report.
0.5 mm typ. 0.7 mm 1.4 mm

0.6 mm typ. 0.8 mm 1.6 mm

Note Metallization is measured at the interface of ceramic and copper. Upper width 1.14. Chip-off at ceramic edge
of conductors on Cu-layout side could be smaller (see sidewall of etched pattern).
Length max. 1 x ceramic thickness W
L D
Width max. x ceramic thickness
W = Width L = Length D = Depth
Depth max. x ceramic thickness
1.10. Sidewall of etched pattern
d
Cu-thickness
Copper d
Ceramic
Note Metallization is measured at the interface of ceramic and copper.
The sidewall of the etched pattern (the outside edge of a pad or conductor) d = Cu-thickness 1.15. Tolerance of total thickness (ceramic + copper)
has a paraboloid shape. When indicating the width of a pad or conductor,
+ 7 % / - 10 % copper thickness 0.4 mm
the width at the bottom side of the etched pattern (at the ceramic) is typi-
cally used. The nature of the etching process results in the effective width
Note Tolerance of total thickness for grinded DBC single parts or master cards
of a pad or conductor at its top surface being reduced by a maximum of the
can only be specified after sample delivery with initial sample test report.
copper thickness (d).

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 2. Additional design features 2.04. Lifetime with/without dimples
Measurement conditions -55 C up to 150 C shock testing

2.01. Platings over entire surface ceramic Cu ceramic Cu cycles without

layout side thickness back side dimples [0]
Electroless Ni 3 7 m (8% 2% P)
Al2O3 0.3 mm 0.32 mm 0.3 mm > 65
Electroless Ag 0.1 0.6 m
HPS 0.3 mm 0.32 mm 0.3 mm > 110
Electroless NiAu Ni: 3 7 m (8% 2% P)
AlN 0.3 mm 0.63 mm 0.3 mm > 35
Au Class A: 0.01 0.05 m
Note curamik internal tests with curamik test layout
Au Class B: 0.03 0.13 m
With dimples, lifetime can be increased by a factor of 10.
Electroless NiPdAu* Ni: 3 7 m (8% 2% P)

Pd: 0.05 0.15 m Lifetime

Au Class A: 0.01 0.05 m 1800

1600

Number of Thermal Cycles

Note Partial plating and other thicknesses on request. * samples available 1400
1200
1000
800

2.02. Copper surface 600

400 without
Roughness Rmax = 50 m; Ra 3 m; Rz 16 m 200 dimples

0 with
Note Lower roughness on request. dimples

Al2O3 HPS AlN

2.03. Dimples
d2 (corner
Copper Dimple area Dimple Corner dimple Dimple pitch
dimple)
2.05. Solder stop
thickness - e1 row - diameter diameter - M-M -
-d- - d2 - standard solder stop high temperature solder stop*
d
0.127 mm 0.50 mm 0.35 mm 0.35 mm 0.50 mm M-M min. 0.4 mm min. 0.4 mm
Width
Copper tolerance 0.2 mm tolerance 0.2 mm
0.20 mm 0.60 mm 0.45 mm 0.45 mm 0.65 mm
Mismatch solder stop line
0.2 mm 0.2 mm
0.25 mm 0.70 mm 0.50 mm 0.45 mm 0.70 mm Ceramic (center) to layout (center)

0.30 mm 0.80 mm 0.60 mm 0.50 mm 0.80 mm Temperature

288 C / 10 sec. 400 C / 5 min.
e 1 r ow resistance
0.40 mm 1.00 mm 0.70 mm 0.60 mm 1.00 mm
Note In case of mismatch between Cu pad and outside edge, the etching tolerance is to be
0.50 mm 1.20 mm 0.90 mm 0.75 mm 1.20 mm considered. Higher/ longer temperature exposure only possible at customers own risk.
0.60 mm 1.40 mm 1.20 mm 1.20 mm 1.40 mm Solder stop is available for all platings except Au-platings. * samples available

2.06. Holes and laser cut outlines

Minimum hole diameter 1 mm, smaller on request.

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 3. Quality 4.04. Dielectric loss
Al2O3 0.0003 @ 20 C, 1MHz
HPS 0.001 @ 20 C, 1MHz
3.01. Solderability wetting on metallization
AlN 0.0005 @ 20 C, 1MHz
Soldering conditions SnCu3ln0.5 - Preform 95 % wetting,
on Cu surface forming gas (5 % H2, 95 % N2) and vacuum

4.05. Dielectric strength (DC voltage) of ceramic

3.02. Thick wire bondability on metallization > 20 kV/mm

300 m aluminum wire AlH11

Shear speed 500 m/s
Shear height 30 m
Shear force 1000 cN 4.06. Electrical conductivity of copper surface
50 % aluminum residue on DBC after shear test
58 x 106 S/m @ 20 C

4.07. Copper peeling strength

4.0 N/mm @ 50 mm/min @ Cu-thickness 0.3 mm on Al2O3
1
4. Physical properties 1
Values from literature
Note According to curamik internal tests.

4.01. Thermal conductivity

Al2O3 24 W/mK @ 20 C 4.08. Application temperature
HPS 26 W/mK @ 20 C -55 C up to +850 C depending on atmosphere and time
AlN 170 W/mK @ 20 C Critical at H2 with >400 C

4.09. Bending strength (bare ceramic)

4.02. Electrical resistivity of ceramic
Al2O3 > 450 N/mm2
> 1014 cm @ 20 C
HPS > 600 N/mm2

AlN > 350 N/mm2

4.03. Dielectric constant Note According to curamik internal tests. Bending strength of DBC can be more than double
of the above mentioned, depending on Cu-thickness and layout.
Al2O3 9.8 @ 1 MHz 10.0 @ 1 GHz

HPS 12.5 @ 1 MHz 9.0 @ 1 GHz

AlN 9.0 @ 1 MHz 7.5 @ 1 GHz

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 4.10. Fracture toughness (K1c)
Al2O3 3.8 4.2 MPam

HPS 4.5 5.0 MPam

AlN 3.0 3.4 MPam

4.11. Youngs modulus (bare ceramic)

Al2O3 340 GPa

HPS 310 GPa

AlN 320 GPa

4.12. Coefficient of linear thermal expansion (CTE)

ceramic ceramic substrate

Al2O3 6.8 ppm/K @ 20 C 300 C 5% to 30% higher (dependent on copper thickness)

HPS 7.1 ppm/K @ 20 C 300 C 5% to 60% higher (dependent on copper thickness)

AlN 4.7 ppm/K @ 20 C 300 C 5% to 30% higher (dependent on copper thickness)

ECu dCu
DBC surface = ceramic + (Cu ceramic ) Copper dCu
ECu dCu + Eceramic dceramic Ceramic dceramic
Copper dCu

Cu = 16.5 ceramic = see list above d = width mm

= coefficient of thermal expansion

E = youngs modulus

The information contained in this document is intended to assist you in designing with Rogers Power Electronics Solutions
Materials. It is not intended to and does not create any warranties, express or implied, including any warranty of merchanta-
bility or fitness for a particular purpose or that the results shown in this document will be achieved by a user for a particular
purpose. The user should determine the suitability of Rogers curamik products for each application. The Rogers logo, the
curamik logo and curamik are licensed trademarks of Rogers Corporation or one of its subsidiaries..
2015 Rogers Corporation. All rights reserved.

This document is not subject of updating.

Version 13/2015 issued in May 2015.

Issued by Bernd Lehmeier / Nico Kuhn

Approved by Tomas Block

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Rogers Germany GmbH Phone +49 9645 92 22 0
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92676 Eschenbach www.rogerscorp.com/pes
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