MC14066B

Quad Analog Switch/Quad

Multiplexer

The MC14066B consists of four independent switches capable of

controlling either digital or analog signals. This quad bilateral switch
is useful in signal gating, chopper, modulator, demodulator and
CMOS logic implementation. http://onsemi.com
The MC14066B is designed to be pinforpin compatible with the
MC14016B, but has much lower ON resistance. Input voltage swings MARKING
as large as the full supply voltage can be controlled via each DIAGRAMS
independent control input. 14
PDIP14
Triple Diode Protection on All Control Inputs P SUFFIX MC14066BCP
Supply Voltage Range = 3.0 Vdc to 18 Vdc CASE 646 AWLYYWW

Linearized Transfer Characteristics 1

Low Noise 12 nV/Cycle, f 1.0 kHz typical 14

PinforPin Replacement for CD4016, CD4016, MC14016B

SOIC14
D SUFFIX
14066B

AWLYWW
For Lower RON, Use The HC4066 HighSpeed CMOS Device CASE 751A
1
14
TSSOP14 14
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.) DT SUFFIX 066B
CASE 948G ALYW
Symbol Parameter Value Unit
VDD DC Supply Voltage Range 0.5 to +18.0 V 1
14
Vin, Vout Input or Output Voltage Range 0.5 to VDD + 0.5 V
(DC or Transient) SOEIAJ14
F SUFFIX MC14066B
Iin Input Current (DC or Transient) 10 mA CASE 965 AWLYWW
per Control Pin
1
ISW Switch Through Current 25 mA
A = Assembly Location
PD Power Dissipation, 500 mW WL or L = Wafer Lot
per Package (Note 3.) YY or Y = Year
TA Ambient Temperature Range 55 to +125 C WW or W = Work Week

Tstg Storage Temperature Range 65 to +150 C

TL Lead Temperature 260 C ORDERING INFORMATION
(8Second Soldering)
Device Package Shipping
2. Maximum Ratings are those values beyond which damage to the device
may occur. MC14066BCP PDIP14 2000/Box
3. Temperature Derating:
Plastic P and D/DW Packages: 7.0 mW/_C From 65_C To 125_C MC14066BD SOIC14 55/Rail

This device contains protection circuitry to guard against damage due to high MC14066BDR2 SOIC14 2500/Tape & Reel
static voltages or electric fields. However, precautions must be taken to avoid 96/Rail
MC14066BDT TSSOP14
applications of any voltage higher than maximum rated voltages to this
highimpedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) vVDD.
MC14066BDTEL TSSOP14 2000/Tape & Reel

Unused inputs must always be tied to an appropriate logic voltage level (e.g., MC14066BDTR2 TSSOP14 2500/Tape & Reel
either VSS or VDD). Unused outputs must be left open.
MC14066BF SOEIAJ14 See Note 1.

MC14066BFEL SOEIAJ14 See Note 1.

1. For ordering information on the EIAJ version of

the SOIC packages, please contact your local
ON Semiconductor representative.

Semiconductor Components Industries, LLC, 2000 1 Publication Order Number:

March, 2000 Rev. 3 MC14066B/D
 MC14066B

PIN ASSIGNMENT

IN 1 1 14 VDD
OUT 1 2 13 CONTROL 1
OUT 2 3 12 CONTROL 4
IN 2 4 11 IN 4
CONTROL 2 5 10 OUT 4
CONTROL 3 6 9 OUT 3
VSS 7 8 IN 3

BLOCK DIAGRAM LOGIC DIAGRAM AND TRUTH TABLE

13 (1/4 OF DEVICE SHOWN)
CONTROL 1 2
1 OUT 1
IN/OUT OUT/IN
IN 1
5
CONTROL 2 3 CONTROL
4 OUT 2
IN 2 Control Switch Logic Diagram Restrictions
6 0 = VSS OFF VSS Vin VDD
CONTROL 3
9 VSS Vout VDD
OUT 3 1 = VDD ON
8
IN 3
12
CONTROL 4 10
11 OUT 4
IN 4 VDD = PIN 14
VSS = PIN 7

CIRCUIT SCHEMATIC
(1/4 OF CIRCUIT SHOWN)

VDD VDD VDD

VSS

VDD
VDD VDD VDD

CMOS
INPUT 300

VSS VSS

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 MC14066B

ELECTRICAL CHARACTERISTICS

55_C 25_C 125_C

Characteristic Symbol VDD Test Conditions Min Max Min Typ (4.) Max Min Max Unit

Power Supply Voltage

VDD
SUPPLY REQUIREMENTS (Voltages Referenced to VEE)

3.0 18 3.0 18 3.0 18 V

Range
A

Quiescent Current Per IDD 5.0 Control Inputs: 0.25 0.005 0.25 7.5
Package 10 Vin = VSS or VDD, 0.5 0.010 0.5 15
v

15 Switch I/O: VSS VI/O 1.0 0.015 1.0 30
v

VDD, and
v Vswitch 500 mV (5.)

Total Supply Current

(Dynamic Plus Quiescent,
ID(AV)

5.0
10
TA = 25_C only The
channel component,
Typical
(0.07 A/kHz) f + IDD
(0.20 A/kHz) f + IDD
A

Per Package 15 (Vin Vout)/Ron, is
(0.36 A/kHz) f + IDD
not included.)

CONTROL INPUTS (Voltages Referenced to VSS)

LowLevel Input Voltage

VIL

5.0
10
15
Ron = per spec,
Ioff = per spec



1.5
3.0
4.0



2.25
4.50
6.75
1.5
3.0
4.0



1.5
3.0
4.0
V

HighLevel Input Voltage






VIH 5.0 Ron = per spec, 3.5 3.5 2.75 3.5 V

10
15
Ioff = per spec 7.0
11


7.0
11
5.50
8.25


7.0
11

Input Leakage Current Iin 15 Vin = 0 or VDD 0.1 0.00001 0.1 1.0 A

Input Capacitance Cin 5.0 7.5 pF

SWITCHES IN AND OUT (Voltages Referenced to VSS)

Recommended Peakto VI/O Channel On or Off 0 VDD 0 VDD 0 VDD Vpp
Peak Voltage Into or Out

of the Switch

Recommended Static or Vswitch Channel On 0 600 0 600 0 300 mV

Dynamic Voltage Across
the Switch (5.) (Figure 1)

Output Offset Voltage





VOO
Vin = 0 V, No Load 10 V

ON Resistance v










Ron 5.0 Vswitch 500 mV (5.), 800 250 1050 1200

10 Vin = VIL or VIH 400 120 500 520

15 (Control), and Vin = 220 80 280 300
0 to VDD (Switch)

ON Resistance Between

Ron 5.0 70 25 70 135

Any Two Channels 10 50 10 50 95

in the Same Package 15 45 10 45 65
100 0.05 100 1000

OffChannel Leakage Ioff 15 Vin = VIL or VIH nA
Current (Figure 6) (Control) Channel to

Channel or Any One
Channel

Capacitance, Switch I/O





CI/O Switch Off 10 15 pF

(Switch Off)


Capacitance, Feedthrough





CI/O

0.47 pF

4. Data labeled Typ is not to be used for design purposes, but is intended as an indication of the ICs potential performance.
5. For voltage drops across the switch (Vswitch) > 600 mV ( > 300 mV at high temperature), excessive VDD current may be drawn; i.e. the
current out of the switch may contain both VDD and switch input components. The reliability of the device will be unaffected unless the
Maximum Ratings are exceeded. (See first page of this data sheet.)

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 MC14066B

ELECTRICAL CHARACTERISTICS (6.) (CL = 50 pF, TA = 25_C unless otherwise noted.)

VDD

Characteristic Symbol Vdc Min Typ (7.) Max Unit

Propagation Delay Times VSS = 0 Vdc tPLH, tPHL ns
Input to Output (RL = 10 k)

tPLH, tPHL = (0.17 ns/pF) CL + 15.5 ns 5.0 20 40

tPLH, tPHL = (0.08 ns/pF) CL + 6.0 ns 10 10 20
tPLH, tPHL = (0.06 ns/pF) CL + 4.0 ns 15 7.0 15

Control to Output (RL = 1 k) (Figure 2)

Output 1 to High Impedance
tPHZ
5.0 40 80
ns

10 35 70
15 30 60

Output 0 to High Impedance

tPLZ 5.0
10
15



40
35
30
80
70
60
ns

High Impedance to Output 1 tPZH 5.0
10


60
20
120
40
ns

15 15 30

High Impedance to Output 0 tPZL 5.0 60 120 ns
10 20 40

Second Harmonic Distortion

VSS = 5 Vdc
15
5.0


15
0.1
30
%

(Vin = 1.77 Vdc, RMS Centered @ 0.0 Vdc,
RL = 10 k, f = 1.0 kHz)

Bandwidth (Switch ON) (Figure 3)

VSS = 5 Vdc
(RL = 1 k, 20 Log (Vout/Vin) = 3 dB, CL = 50 pF,
5.0 65 MHz

Vin = 5 Vpp)

Feedthrough Attenuation (Switch OFF) VSS = 5 Vdc 5.0 50 dB
(Vin = 5 Vpp, RL = 1 k, fin = 1.0 MHz) (Figure 3)

Channel Separation (Figure 4)

(Vin = 5 Vpp, RL = 1 k, fin = 8.0 MHz)
VSS = 5 Vdc 5.0 50 dB

(Switch A ON, Switch B OFF)

Crosstalk, Control Input to Signal Output (Figure 5) mVpp
VSS = 5 Vdc 5.0 300

(R1 = 1 k, RL = 10 k, Control tTLH = tTHL = 20 ns)
6. The formulas given are for the typical characteristics only at 25_C.
7. Data labelled Typ is not to be used for design purposes but is intended as an indication of the ICs potential performance.

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 MC14066B

TEST CIRCUITS

Vout
VC
RL CL
ON SWITCH
Vin Vx
CONTROL 20 ns
SECTION VDD
90%
OF IC VC 50%
10%
tPZH VSS
tPHZ
LOAD 90%
V Vout Vin = VDD
10%
tPZL tPLZ Vx = VSS
90%
Vout Vin = VSS
SOURCE 10% Vx = VDD

Figure 1. V Across Switch Figure 2. TurnOn Delay Time Test Circuit

and Waveforms

VDD VSS
VC = VDD FOR BANDWIDTH TEST 2
VC = VSS FOR FEEDTHROUGH TEST

VDD VSS Vin

2
RL CL
VDD
Vin Vout

RL CL

VC
RL CL
VSS
VDD VSS

Figure 3. Bandwidth and Figure 4. Channel Separation

Feedthrough Attenuation

OFF CHANNEL UNDER TEST

VDD
Vin
A
Vout VSS
1k CONTROL
RL CL = 50 pF SECTION
10 k OF IC
VSS

VC = 5.0 V TO + 5.0 V SWING VDD

Figure 5. Crosstalk, Figure 6. Off Channel Leakage

Control to Output

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 MC14066B

VDD
KEITHLEY 160
DIGITAL
MULTIMETER
10 k

1 k
VDD RANGE XY
PLOTTER
VSS

Figure 7. Channel Resistance (RON) Test Circuit

TYPICAL RESISTANCE CHARACTERISTICS

350 350

300 300
R ON , ON RESISTANCE (OHMS)

R ON , ON RESISTANCE (OHMS)
250 250

200 200

150 150 TA = 125C

TA = 125C
100 100 25C
25C
55C 55C
50 50

0 0
10 8.0 6.0 4.0 2.0 0 0.2 4.0 6.0 8.0 10 10 8.0 6.0 4.0 2.0 0 0.2 4.0 6.0 8.0 10
Vin, INPUT VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)

Figure 8. VDD = 7.5 V, VSS = 7.5 V Figure 9. VDD = 5.0 V, VSS = 5.0 V

700 350
TA = 25C
600 300
RON , ON RESISTANCE (OHMS)
R ON , ON RESISTANCE (OHMS)

500 250 VDD = 2.5 V

400 200

300 150
TA = 125C 5.0 V
200 100
25C 7.5 V

100 55C 50

0 0
10 8.0 6.0 4.0 2.0 0 0.2 4.0 6.0 8.0 10 10 8.0 6.0 4.0 2.0 0 0.2 4.0 6.0 8.0 10
Vin, INPUT VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS)

Figure 10. VDD = 2.5 V, VSS = 2.5 V Figure 11. Comparison at 25C, VDD = VSS

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 MC14066B

APPLICATIONS INFORMATION

Figure A illustrates use of the Analog Switch. The 0
to5 volt digital control signal is used to directly control a
5 volt peaktopeak analog signal.
The digital control logic levels are determined by VDD
and VSS. The VDD voltage is the logic high voltage, the VSS
voltage is logic low. For the example, VDD = + 5 V = logic
high at the control inputs; VSS = GND = 0 V = logic low.
The maximum analog signal level is determined by VDD
and VSS. The analog voltage must not swing higher than
VDD or lower than VSS.
The example shows a 5 volt peaktopeak signal which
allows no margin at either peak. If voltage transients above
VDD and/or below VSS are anticipated on the analog
channels, external diodes (Dx) are recommended as shown
in Figure B. These diodes should be small signal types able
to absorb the maximum anticipated current surges during
clipping.
The absolute maximum potential difference between
VDD and VSS is 18.0 volts. Most parameters are specified up
to 15 volts which is the recommended maximum difference
between VDD and V SS.

+5 V

VDD VSS

+ 5.0 V

5 Vpp SWITCH
ANALOG SIGNAL IN SWITCH 5 Vpp
+ 2.5 V
+5 V OUT ANALOG SIGNAL

GND
EXTERNAL 0TO5 V DIGITAL MC14066B
CMOS
CONTROL SIGNALS
DIGITAL
CIRCUITRY

Figure A. Application Example

VDD VDD

DX DX

SWITCH SWITCH
IN OUT
DX DX

VSS VSS

Figure B. External Germanium or Schottky Clipping Diodes

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 MC14066B

PACKAGE DIMENSIONS

P SUFFIX
PLASTIC DIP PACKAGE
CASE 64606
ISSUE M NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
14 8 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
B FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1 7 5. ROUNDED CORNERS OPTIONAL.

INCHES MILLIMETERS
A DIM MIN MAX MIN MAX
A 0.715 0.770 18.16 18.80
F L B 0.240 0.260 6.10 6.60
C 0.145 0.185 3.69 4.69
D 0.015 0.021 0.38 0.53
N F 0.040 0.070 1.02 1.78
C G 0.100 BSC 2.54 BSC
H 0.052 0.095 1.32 2.41
T J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
SEATING
PLANE L 0.290 0.310 7.37 7.87
K J M 10_ 10_
H G D 14 PL M N 0.015 0.039 0.38 1.01

0.13 (0.005) M

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 MC14066B

PACKAGE DIMENSIONS

D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
A Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
14 8 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
B P 7 PL 5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
1 7
0.25 (0.010) M B M PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS INCHES
G R X 45 _ F DIM MIN MAX MIN MAX
C A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
T F 0.40 1.25 0.016 0.049
K M J G 1.27 BSC 0.050 BSC
SEATING D 14 PL
PLANE J 0.19 0.25 0.008 0.009
0.25 (0.010) M T B S A S K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019

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 MC14066B

PACKAGE DIMENSIONS

DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G01
ISSUE O

14X K REF NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
0.10 (0.004) M T U S V S Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
0.15 (0.006) T U S 3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
N 0.15 (0.006) PER SIDE.
0.25 (0.010)
14 8 4. DIMENSION B DOES NOT INCLUDE
2X L/2 INTERLEAD FLASH OR PROTRUSION.
M INTERLEAD FLASH OR PROTRUSION SHALL NOT
EXCEED
L B 0.25 (0.010) PER SIDE.
U N 5. DIMENSION K DOES NOT INCLUDE DAMBAR
PIN 1 PROTRUSION. ALLOWABLE DAMBAR
IDENT. F PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
1 7 MATERIAL CONDITION.
DETAIL E 6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
0.15 (0.006) T U S
A K DETERMINED AT DATUM PLANE W.
MILLIMETERS INCHES

V K1 DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200

B 4.30 4.50 0.169 0.177
J J1 C 1.20 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
SECTION NN G 0.65 BSC 0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
C W K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
0.10 (0.004) L 6.40 BSC 0.252 BSC
M 0_ 8_ 0_ 8_
T SEATING D G H DETAIL E
PLANE

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 MC14066B

PACKAGE DIMENSIONS

F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 96501
ISSUE O NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
14 8 LE MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
Q1 OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
E HE M_ 4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
1 7 L DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DETAIL P DIMENSION AT MAXIMUM MATERIAL CONDITION.
Z DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
D BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
VIEW P
A MILLIMETERS INCHES
e DIM MIN MAX MIN MAX
c A 2.05 0.081
A1 0.05 0.20 0.002 0.008
b 0.35 0.50 0.014 0.020
c 0.18 0.27 0.007 0.011
b A1 D 9.90 10.50 0.390 0.413
E 5.10 5.45 0.201 0.215
0.13 (0.005) M 0.10 (0.004) e 1.27 BSC 0.050 BSC
HE 7.40 8.20 0.291 0.323
0.50 0.50 0.85 0.020 0.033
LE 1.10 1.50 0.043 0.059
M 0_ 10 _ 0_ 10 _
Q1 0.70 0.90 0.028 0.035
Z 1.42 0.056

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 MC14066B

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