Académique Documents
Professionnel Documents
Culture Documents
Certified documentation
according to DIN EN ISO 9001:2000
To ensure a consistently high quality standard and
user-friendliness, this documentation was created to
meet the regulations of a quality management system
which complies with the requirements of the standard
DIN EN ISO 9001:2000.
cognitas. Gesellschaft fr Technik-Dokumentation mbH
www.cognitas.de
All hardware and software names used are trademarks of their respective manufacturers.
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Important notes . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 Notes on safety . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 CE Certificate . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.3 Environmental Protection . . . . . . . . . . . . . . . . . . . . . 7
3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.2 Main memory . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.3 PCI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.3.1 ISA bus resources . . . . . . . . . . . . . . . . . . . . . . . . 15
3.3.2 PCI resources . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.4 Screen resolution . . . . . . . . . . . . . . . . . . . . . . . . 17
3.5 Temperature / system monitoring . . . . . . . . . . . . . . . . 18
3.6 Interfaces and Connectors . . . . . . . . . . . . . . . . . . . . 19
3.6.1 External connectors . . . . . . . . . . . . . . . . . . . . . . . 20
3.7 Settings with jumpers . . . . . . . . . . . . . . . . . . . . . . 22
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Notational conventions
The meanings of the symbols and fonts used in this manual are as follows:
Batteries
V CAUTION!
Incorrect replacement of lithium battery may lead to a risk of
explosion. The batteries may only be replaced with identical batteries
or with a type recommended by the manufacturer.
It is essential to observe the instructions on page 25.
Do not throw batteries into the trash can. They must be disposed of
in accordance with local regulations concerning special waste.
The battery must be disposed of in accordance with local regulations
concerning special waste.
All batteries containing pollutants are marked with a symbol (a
crossed-out garbage can). In addition, the marking is provided with
the chemical symbol of the heavy metal decisive for the classification
as a pollutant:
Cd Cadmium
Hg Mercury
Pb Lead
When you handle components fitted with ESDs, you must observe the following
points under all circumstances:
You must always discharge yourself of static charges (e.g. by touching a
grounded object) before working.
The equipment and tools you use must be free of static charges.
Remove the power plug from the power socket before inserting or removing
boards containing ESDs.
Always hold boards with ESDs by their edges.
Never touch pins or conductors on boards fitted with ESDs.
Use a grounding cable designed for this purpose to connect yourself to the
system unit as you install/deinstall the board.
Place all components on a static-safe base.
I You will find a detailed description for handling ESD components in the
relevant European or international standards (EN 61340-5-1,
ANSI/ESD S20.20).
2.2 CE Certificate
3.1 Overview
Processors
1 or 2 x Intel Xeon processors
2 processor sockets mPGA604 for Intel Xeon processor with 800 MHz
front side bus
32 KB first level cache
Support of SMP, MPS 1.4 compliant
2xVRM 10.1 onboard (EVRD)
Main memory
8 slots for main memory DDRII/400 MHz (registered),
SDRAM memory modules,
2 channel with 2 modules per channel with 512 MB, 1 and 2 Gbyte
maximum 16 Gbyte of memory
supports 2 way interleaved memory subsystems (2 identical memory
modules have to installed at the same time)
ECC multiple bit error detection and single bit error correction
memory scrubbing function
Single Device Data Correction (SDDC) function (Chipkill)
memory mirroring function
hotspare memory technology
internal connectors
floppy disk connector
1 IDE connector (CD-ROM/DVD-ROM)
1 U320 SCSI connector
USB type C (for USB port on front side)
I2C connector
main power connector (12V, -12V and 5V auxiliary)
12V (CPU) power connector
RSB S2 power connector
IPMB connector
HDD activity connector
front panel
battery holder
connectors for PWM fans (Puls Wide modulation)
external connectors
1 serial port (COM1) for system and BMC (shared)
2 PS/2 interfaces for keyboard and mouse
3 USB 2.0 ports with 480 Mbits/s (1 x front, 2 x rear)
1 VGA port
1 RJ45 LAN port
PCI slots
1 x PCI-X (64 Bit / 133 MHz)
1 x PCI-X (64 Bit / 66 MHz)
BIOS features
Phoenix System-BIOS V 4.06
SMBIOS 2.31 (DMI)
MultiProcessor Specification 1.4
Server Hardware Design Guide 3.0
WfM 2.0
IPMI V1.5
ACPI 1.0b support
LSI SCSI BIOS with IME (Integrated Mirroring Enhanced)
USB keyboard/mouse
boot possible from:
floppy disk drive
CD-ROM
USB drive
LAN
console redirection support
OEM logo
CPU, memory disable
hotspare memory support
memory mirroring support
Environmental protection
Battery in holder
Form factor
295 x 412 mm
Module population
The memory modules have to be based on x4 organized SDRAMs.
The memory modules have to be populated in pairs.
Each pair must consist of identical memory modules.
Each memory bank and channel (module) can be populated with 2 memery
modules (single rank)
The module capacity between pairs can differ: pair 1A/1B can be populated
with two 512 Mbyte modules and pair 2A/2B with two 1 Gbyte modules.
Memory Mirroring
Following table shows the memory mirroring options:
module 1 2 3 4
bank
channel A B A B A B A B
(Modul)
Population 4 identical memory modules 4 identical memory modules
with 4 or 8
memory
modules
Population 2 identical 4 identical memory modules
with 6 memory
memory modules
modules
PCI slots
The following table shows an overview of the PCI slots:
IDSEL: ID Select
PCI_IRQ: PCI Interrupt Request
REQ/GNT: Request / Grant
Temperature monitoring
Measurement of the processor temperature, measurement of the ambient tem-
perature by a temperature sensor on the LED board.
Fan monitoring
Fans that are no longer available, blocked or sticky fans are detected.
Fan control
The fans are regulated according to temperature.
Sensor monitoring
The removal of, or a fault in, a temperature sensor is detected. Should this hap-
pen all fans monitored by this sensor run at maximum speed, to achieve the gre-
atest possible protection of the hardware.
Voltage monitoring
When voltage exceeds warning level high or falls below warning level low an
alert will be generated.
1 2
16
15 CPU0
CPU1
14
3
4
5
13 12 11 10 9 8 7 6
1 2 3 4 5 6 7 8 9
LEDs
LAN connectors
On this system board you will find one Intel LAN controller 82546GB (two chan-
nel). This LAN controller supports the transfer rates of 10 Mbit/s, 100 Mbit/s and
1 Gbit/s. The LAN controller supports WOL function through Magic Packet.
It is also possible to boot a device without its own boot hard disk via LAN. Here
Intel PXE is supported.
The LAN port serves as management interface and is prepared for Remote-
View.
The LAN controller connectors are equipped with two LEDs (light emitting
diode) indicating the transfer rate and the activity.
1 2
1 LAN transfer rate green + yellow off transfer rate 10 Mbit/s (or no
connection)
green on transfer rate 100 Mbit/s
yellow on transfer rate 1000 Mbit/s
CPU0
CPU1
JP7
JP15
JP16
2
3
1
Press the locking spring into direction of of the arrow (1), so that the lithium-
battery jumps out of its socket.
Remove the battery (2).
Insert a new lithium battery of the same type into the socket (3) and (4).
ACPI
Advanced Configuration and Power management Interface
ASSR
Automatic Server Recovery and Restart
ATA
Advanced Technology Attachment
BBU
Battery Backup Unit
BIOS
Basic Input Output System
BMC
Baseboard Management Controller
CMOS
Complementary Metal Oxide Semiconductor
COM
COMmunication port
CPU
Central Processing Unit
DDR
Double Data Rate
DIMM
Dual In-line Memory Module
DIP
Dual In-line Package
DMI
Desktop Management Interface
DRAM
Dynamic Random Access Memory
ECC
Error Correction Code
EEPROM
Electrical Erasable Programmable Read Only Memory
EPROM
Erasable Programmable Read Only Memory
EMRL
Embedded RAID Logic
EVRD
Enterprise VRD
HPC
Hotplug Controller
ICE
In Circuit Emulation
IDE
Integrated (intelligent) Drive Electronics
IME
Integrated Mirror Enhanced
IOOP
Intelligent Organisation Of PCI
IPMB
Intelligent Platform Management Bus
IPMI
Intelligent Platform Management Interface
LAN
Local Area Network
LED
Light Emitting Diode
MPS
Multi Processor Specification
NMI
Non Maskable Interrupt
OEM
Original Equipment Manufacturer
OHCI
Open Host Controller Interfache
OS
Operating System
PCI
Peripheral Components Interconnect
PDA
Prefailure Detection and Analyzing
PIO
Programmed Input Output
PLD
Programmable Logic Device
PS(U)
Power Supply (Unit)
PWM
Puls Wide Modulation
PXE
Preboot eXecution Environment
RAID
Redundant Array if Inexpensive Disks
RSB
Remote Service Board
RST
ReSeT
RTC
Real Time Clock
SCSI
Small Computer Systems Interfache
SDDC
Single Device Data Correction
SDRAM
Synchronous Dynamic Random Access Memory
SHDG
Server Hardware Design Guide
SMB
System Management Bus
SMM
Server Management Mode
SMP
Symmetrically Multi Processing
UHCI
Unified Host Controller Interface
USB
Universal Serial Bus
VGA
Video Graphics Adapter
VRD
Voltage Regulator Down
VRM
Voltage Regulator Module
WfM
Wired for Management
WOL
Wake up On LAN
email: manuals@fujitsu-siemens.com
http://manuals.fujitsu-siemens.com
Submitted by
email: manuals@fujitsu-siemens.com
http://manuals.fujitsu-siemens.com
Submitted by