Maave Electronics Pvt Limited

WORK INSTRUCTIONS No.: WI/ PROD / 1/ 08

PRODUCTION Prepared By: Rev. No.: 1 Page No
TESTING OF PCB's, Approved By: Page 1 of 6
Date:18/06/2008
SUB-SYSTEMS& SYSTEMS

PURPOSE:

To follow a systematic procedure in production department for handling of

testing activities at Various stages like assembled PCB's, sub-systems, systems.

2.0 ACTIVITIES TO BE PERFORMED:

a) To Co-ordinate with the respective departments to get the required inputs.

b) Programming of programmable IC's.
c) To carry out the testing activities of assembled PCB's, modules /sub-systems,
and systems.
d) To carry out the Burn-in / aging tests on finished systems.
e) Maintenance of test reports at all stages of testing.
f) Offering of final systems/ finished products to the customer/
QAD for inspection and acceptance.

3.0 INPUTS:

a) Specifications, schematics, block diagrams, parts list.

b) Test set-up drawings, test formats, test procedures.
c) Test Jigs, test equipment and Tools.
d) Assembled PCB's, sub-system /modules, systems.
e) Cable assemblies.
f) Programmed IC's
g) Inspection memos.

OUTPUTS:

a) Tested PCB's, sub-systems/modules, systems.

b) Test reports of PCB's, sub-systems/modules, systems.
c) Configuration sheets.

5.0 INSTRUCTIONS:

5.1 TESTING OF ASSEMBLED PCBs:

a) Check serial numbers of all the assembled PCBs /sub-systems/systems
and process cards which are received from the assembly section.

b) Verify the details furnished on process card are related to the card/ sub-system/
 Maave Electronics Pvt Limited
WORK INSTRUCTIONS No.: WI/ PROD / 1/ 08
PRODUCTION Prepared By: Rev. No.: 1 Page No
TESTING OF PCB's, Approved By: Page 2 of 6
Date:18/06/2008
SUB-SYSTEMS& SYSTEMS

j) Start testing the given PCBs / sub-systems / systems according to the test
procedure & check the parameters one by one.

k) Adjust the respective variable components if any to get the required measurement
values as per the given format by using the tuning tool. Verify the other
related parameters when tuning is carried out (In certain cases some parameters
may be disturbed when tuning is carried out).

l) Change the test selects component values where ever necessary to get the parameters
as per the format (use always the test selects values, which are given in parts list only).

m) Verify all the parameters once again after testing / tuning is carried out and record
all the readings / results in the given test format.

n) If any problems / faults noticed during testing, keep them away for time being
and continue the testing.

o) Do the sign with date on the process card and test format.

p) On completion of testing send back the tested PCBs / sub-systems to the

assembly section and inform to the assembly supervisor for further proceeding
(If PCBs are more sent batch wise instead of waiting till completion of all).

q) Attend all the problem / faulty cards and sub-systems one by one after completion
of testing activity. Identify the problem and rectify with the help of schematic
and trouble shooting procedure.

r) Verify all the parameters after rectification of faults, to ensure it is meeting

all the parameters.

s) If any components are to be replaced, send the faulty card/ sub-system

and component to rework station. Give the card / sub-system number and
reference of the component to be replaced.
 Maave Electronics Pvt Limited
WORK INSTRUCTIONS No.: WI/ PROD / 1/ 08
PRODUCTION Prepared By: Rev. No.: 1 Page No
TESTING OF PCB's, Approved By: Page 3 of 6
Date:18/06/2008
SUB-SYSTEMS& SYSTEMS

t) Return all the faulty and test select components on MATERIAL RETURN
NOTE (MRN) to the stores through QAD.

u) Raise the MIR against material return note (MRN) to draw the material for
replaced components or test select values.

v) If any non-conformances are noticed during testing, record the same in process card.

w) Bring all non-conformances to the knowledge of incharge.

TESTING OF SUB- SYSTEMS/MODULES:

a) Follow the same instructions as above (5.1) to test the sub-systems/modules.

b) If any sub-contracted modules/items are found faulty during testing, return the
same to stores through QAD on MATERIAL RETURN NOTE.
c) Offer the sub-systems/modules to the QAD inspection after completion of testing.

d) Furnish all the details of inspection memo and send to the QAD for offering of
sub- systems/modules with signature and date.
e) Keep ready the test set-up before calling QAD inspector for inspection.

f) The person who is tested the sub- systems/modules must be accompanied with
QAD during inspection.

g) Arrange all QAD accepted sub-systems / modules in the racks in order, So that
the can be utilised during the system testing. If any wiring has to be done with the
system, then hand over the QAD accepted sub-systems / modules to the assembly
supervisor for further process.

TESTING OF SYSTEM:

a) Follow the same instructions as above (5.1) to test the final systems.

b) Before arranging the test set-up collect all sub-systems, necessary

interconnecting cable assemblies and integrate the system.

c) Arrange the test set-up as per system (final) test set-up drawing.
 Maave Electronics Pvt Limited
WORK INSTRUCTIONS No.: WI/ PROD / 1/ 08
PRODUCTION Prepared By: Rev. No.: 1 Page No
TESTING OF PCB's, Approved By: Page 4 of 6
Date:18/06/2008
SUB-SYSTEMS& SYSTEMS

c) Arrange the test set-up as per system (final) test set-up drawing.
d) Ensure the systems having all sub-assemblies and verify the inter connections as
per system assembly drawing before starts testing and prepare the configuration sheet.
e) If any non-conformances are noticed rectify them and record on process cards.
Bring all non -conformances to the knowledge of your incharge for necessary action.
f) On completion of testing keep the systems under aging / burn-in test as
per QUALITYPLAN /SYSTEM SPECIFICATIONS.(If the system is combination
of individual modules, then perform the aging / burn-in test at sub-system level).
g) Monitor all the systems every day at regular time, which are under aging / burn-in test.
Check all the parameters as per format on completion of aging/ burn-in test. Offer
the systems to QAD / customer for inspection. If any deviations are noticed attend

h) Furnish all the details of INSPECTION MEMO and send it to QAD for offering of
final systems with signature and date.
i) For stock orders raise the INSPECTION MEMO on receipt of INSPECTION ADVICE
from P.P.C. (P.P.C issues the INSPECTION ADVICE for stock orders) .
j) Keep ready the test set-up before calling the QAD/customer inspector for inspection.

k) On completion of inspection (QAD / CUSTOMER INSPECTION), collect the

INSPECTION CERTIFICATE for accepted items from QAD/CUSTOMERS INSPECTOR.

l) Send the copy of INSPECTION CERTIFICATE (CUSTOMER COPY

"WHITE" and "YELLOW" copy) to P.P.C department and get the
Signature on INSPECTION ADVICE
m) Get the signature of the stores incharge on DISPATCH ADVICE copy
(PINK colour), which is issued by P.P.C department (The P.P.C department will issue
the DISPATCH ADVICE on receipt of INSPECTION CERTIFICATE
from production).
 Maave Electronics Pvt Limited
WORK INSTRUCTIONS No.: WI/ PROD / 1/ 08
PRODUCTION Prepared By: Rev. No.: 1 Page No
TESTING OF PCB's, Approved By: Page 5 of 6
Date:18/06/2008
SUB-SYSTEMS& SYSTEMS

n) Hand over the copies inspection memo and configuration details to P.P.C
on acceptance of systems and get the signature s on production copies.

o) Hand over the accepted systems (finished goods) to the stores for packing and
dispatch (Stores staff collects the finished goods as per DELIVERY SET LIST on
receipt of DISPATCH ADVICE).
NOTE: If any of the sub-system/modules, systems are need to under go for
VIBRATION TEST, follow the instructions given below.
p) After testing of sub-systems / modules, systems send them to QAD batch wise
on intimation through IOC to perform the vibration test. In case of systems send
them to QAD before keeping in aging / burn-in test.

q) Collect the sub-systems/modules, systems, which are undergone vibration

test and check physically for any of the components are damaged / unscrewed
mechanical fixings.
r) Test all parameters of the sub-systems / modules, systems as per the respective formats.
Do the signature with date on process card and send them for further process.
s) Bring all non-conformances to the knowledge of your incharge for necessary
corrective action.
6.0 PRECAUTIONS:
a) Ensure the test equipment's used for testing are must be calibrated.
b) Avoid mishandling of test equipment.
c) If any test equipment having problem / showing wrong results, kindly brought
to the knowledge of the incharge for necessary action and don’t continue the
testing with same equipment. Verify the previous results with new test
equipment to ensure the satisfactory results.
d) Remove the batteries of multimeters when it shows "LOW BATTERY"
indication. Othewise battery leakage's may occur and damage the meters.

e) Don't hide any type of non-conformances noticed during the process. Non-conformances
 Maave Electronics Pvt Limited
WORK INSTRUCTIONS No.: WI/ PROD / 1/ 08
PRODUCTION Prepared By: Rev. No.: 1 Page No
TESTING OF PCB's, Approved By: Page 6 of 6
Date:18/06/2008
SUB-SYSTEMS& SYSTEMS

are Component failures, parameter deviations due to dry- solders, components mounted in
wrong orientation, mounting of wrong components and mistakes in wiring e.t.c.

f) Check the supply voltage (230V A.C) every day at 9.00 am. The ground to
neutral voltage must be less than 5V. If it is high means improper earthling and
it may damage the test equipment's.

g) Use always CARD trays to keep and carry the PCBs.

h) Set the required voltage of regulated power supplies before making connections.

i) Check the wrist strap, connecting wires before working on ESD workstations
and record on format. QAD personal checks the resistivity of ESD mats once in a week
and records it on same format. Follow the ESD sensitive devices
handling instructions while handling the ESD sensitive devices.

j) Keep all the connections must be made tight and avoid projections of bare supply
wires when the systems are kept under aging / burn-in test. Otherwise it may cause
the supply short circuits and fire accidents.

k) Care must be taken to avoid the scratches / damages while handling the
sub-systems /systems.

l) Don't disturb the test set-up when production activity running in shifts and
brief the status of testing to next person before leaving.

m) Keep the test equipment's, test jig's and all records at their respective places.

n) Avoid over writings on process cards and test reports and counter sign if any.

7.0 RESPONSIBILITIES:

It is the responsibility of the Senior Engineers, Engineers, junior engineers

and technicians of testing section to follow these instruction.