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Here, at first an electric analysis was performed. Thereby, the electric current
was simulated which follows from boundary conditions for the voltage.
When the current is known,one may calculate the effect of Joule heating, i. e.
the increase of temperature due to electric current. As a result, one obtains the
temperature distribution.
Thus, the mechanical stresses are calculated for the given temperature field.
Largest heat source: silicon chip due to its rather high resistivity in conducting
direction.
The temperature
derived from the
thermal analysis is
afterwards used as
input for a mechanical
analysis.
The largest heat sources are the silicon chips, because of their high resistivity.
Owing to AC voltage,
periodical vertical
motions of the wires
are observed.
FEM simulations were carried out for the same series of loading conditions as in the
experiments.
Aside from the lift off failure mode of wire-bonds, the failure mode
of the device with the second highest probability is fracture of the
solder material.
The maximum strain values obtained from the simulations are rather
high for the case of high cycle fatigue. This seems to be due to strain
gradient effects as explained in reference [3].
Acknowledgements: