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DIAC
TRIAC
Diacs have no control or amplification but act much like a bidirectional switching
diode as they can conduct current from either polarity of a suitable AC voltage
supply. In SCRs and Triacs, we saw that in ON-OFF switching applications, these
devices could be triggered by simple circuits producing steady state gate
currents as shown.
If we wish to control the mean value of the lamp current, rather than just switch it
ON or OFF, we could apply a short pulse of gate current at a pre-set trigger
point to allow conduction of the SCR to occur over part of the half-cycle only.
Then the mean value of the lamp current would be varied by changing the delay
time, T between the start of the cycle and the trigger point. This method is known
commonly as phase control.
But to achieve phase control, two things are needed. One is a variable phase
shift circuit (usually an RC passive circuit), and two, some form of trigger circuit or
device that can produce the required gate pulse when the delayed waveform
reaches a certain level. One such solid state semiconductor device that is
designed to produce these gate pulses is the Diac.
The diac is constructed like a transistor but has no base connection allowing it to
be connected into a circuit in either polarity. Diacs are primarily used as trigger
devices in phase-triggering and variable power control applications because a
diac helps provide a sharper and more instant trigger pulse (as opposed to a
steadily rising ramp voltage) which is used to turn ON the main switching device.
The diac symbol and the voltage-current characteristics curves of the diac are
given below.
We can see from the above diac I-V characteristics curves that the diac blocks
the flow of current in both directions until the applied voltage is greater than VBR,
at which point breakdown of the device occurs and the diac conducts heavily
in a similar way to the zener diode passing a sudden pulse of voltage. This VBR point
is called the Diacs breakdown voltage or breakover voltage.
In an ordinary zener diode the voltage across it would remain constant as the
current increased. However, in the diac the transistor action causes the voltage
to reduce as the current increases. Once in the conducting state, the resistance
of the diac falls to a very low value allowing a relatively large value of current to
flow. For most commonly available diacs such as the ST2 or DB3, their breakdown
voltage typically ranges from about 25 to 35 volts. Higher breakover voltage
ratings are available, for example 40 volts for the DB4 diac.
This action gives the diac the characteristic of a negative resistance as shown
above. As the diac is a symmetrical device, it therefore has the same
characteristic for both positive and negative voltages and it is this negative
resistance action that makes the Diac suitable as a triggering device for SCRs or
triacs.
Diac Applications
As stated above, the diac is commonly used as a solid state triggering device for
other semiconductor switching devices, mainly SCRs and triacs. Triacs are widely
used in applications such as lamp dimmers and motor speed controllers and as
such the diac is used in conjunction with the triac to provide full-wave control of
the AC supply as shown.
It consists of an ON-FET, an OFF-FET and two transistors. The MOS structure of the
MCT is represented in the equivalent circuit. It consists of one ON-FET, a p-channel
MOSFET, and an OFF-FET. Both n-p-n and p-n-p transistors are joined together to
represent the n-p-n-p structure of MCT. An n-channel MOSFET is represented by
drawing the arrow towards the gate terminal. A p-channel MOSFET is indicated
by drawing the arrow away from the gate terminal. The two transistors in the
equivalent circuit indicate that there is regenerative feedback in the MCT just as
it is an ordinary thyristor. The circuit symbol of MCT is shown below.
Turning ON Process
The device is turned ON by a negative voltage pulse at the gate with respect to
the anode. For turning ON MCT, gate is made negative with respect to anode by
the voltage pulse between gate and anode. So, MCT must be initially forward
biased, and then only a negative voltage be applied. With the application of this
negative voltage pulse, ON-FET gets turned ON whereas OFF-FET is already OFF.
With ON-FET ON, current begins to flow from anode A, through ON-FET and then
as the base current and emitter of n-p-n transistor and then to cathode K. This
turns on n-p-n transistor. This causes the collector current to flow in n-p-n transistor.
As OFF FET is OFF, this collector current of npn transistor acts as the base current
of p-n-p transistor. Subsequently, p-n-p transistor is also turned ON. If both the
transistors are ON, regenerative action of the connection scheme takes place
and the MCT is turned ON.
Advantages of MCT
1. Low forward conduction drop
2. Fast TURN-ON and then OFF times
3. Low switching losses
4. High gate input impedance
STATIC INDUCTION THYRISTOR (SITH)
The static induction thyristor (SITh) or field-controlled diode (FCD) was
first introduced by Teszner in the 1960s. This device is capable of conducting
large currents with a low forward voltage and turn-off quickly.
It is normally ON state device, i.e if the anode is positive and the gate voltage is
zero, the device will behave like a diode and current will flow freely.
The forward biasing of the P+ N junction will cause a hole injection into the region
N- region and its conductivity will be modulated.
When the gate is reversed biased with respect to cathode, a depletion layer will
block Anode current. As a results device gets OFF.
Evidently it is not a thyristor like structure like trigger into conduction device but
somewhat SIT like V-I characteristics with varying Negative gate bias.
WORKING
ON-STATE
Some examples
Advantages
The device has also high immunity for electromagnetic noise.
SITh has high di/dt and dv/dt critical ratio. capable of handling rapid
voltage or current changes.
Disadvantages
One of the disadvantages of the SIT is the relatively flat shape of the
potential barrier. This leads to slow, diffusion based transport of carriers in
the vicinity of the potential barrier.
SPECIFICATIONS
A Gate Turn off Thyristor or GTO is a three terminal, bipolar (current controlled
minority carrier) semiconductor switching device. Similar to conventional thyristor,
the terminals are anode, cathode and gate as shown in figure below. As the
name indicates, it has gate turn off capability.
These are capable not only to turn ON the main current with a gate drive circuit,
but also to turn it OFF. A small positive gate current triggers the GTO into
conduction mode and also by a negative pulse on the gate, it is capable of
being turned off. Observe in below figure that the gate has double arrows on it
which distinguish the GTO from normal thyristor. This indicates the bidirectional
current flow through the gate terminal.
The gate current required to turn off the GTO is relatively high. For example, a GTO
rated with 4000V and 3000A may need -750A gate current to switch it off. So the
typical turn off gain of GTO is low and is in the range of 4 to 5. Due to this large
negative current, GTOs are used in low power applications.
On the other hand, during the conduction state GTO behaves just like a thyristor
with a small ON state voltage drop. The GTO has faster switching speed than the
thyristor and has higher voltage and current ratings than the power transistors.
Several varieties of GTOs are available in todays market with asymmetric and
symmetric voltage capabilities. GTOs with identical forward and reverse blocking
capabilities are called as symmetric GTOs (S-GTOs). These are used in current
source inverters, but these are somewhat slower. Mostly asymmetric GTOs (A-
GTOs) are used due to its lower ON state voltage drop and stable temperature
characteristics.
The doping level of the p type gate is highly graded because the doping level
should be low to maintain high emitter efficiency, whereas for having a good turn
OFF properties, doping of this region should be high. In addition, gate and
cathodes should be highly interdigited with various geometric forms to optimize
the current turn off capability.
The junction between the P+ anode and N base is called anode junction. A
heavily doped P+ anode region is required to obtain the higher efficiency anode
junction so that a good turn ON properties is achieved. However, the turn OFF
capabilities are affected with such GTOs.
However, with a large number of anode shorts, the efficiency of the anode
junction reduces and hence the turn ON performance of the GTO degrades.
Therefore, careful considerations have to be taken about the density of these
anode shorts for a good turn ON and OFF performance.
In response to this, more hole current is extracted through the gate results more
suppression of electrons from the cathode. Eventually, the voltage drop across
the p base junction causes to reverse bias the gate cathode junction and hence
the GTO is turned OFF.
During the hole extraction process, the p-base region is gradually depleted so
that the conduction area squeezed. As this process continuous, the anode
current flows through remote areas forming high current density filaments. This
causes local hot spots which can damage the device unless these filaments are
extinguished quickly.
By the application of high negative gate voltage these filaments are extinguished
rapidly. Due to the N base region stored charge, the anode to gate current
continues to flow even though the cathode current is ceased. This is called a tail
current which decays exponentially as the excess charge carriers are reduced by
the recombination process. Once the tail current reduced to a leakage current
level, the device retains its forward blocking characteristics.
To avoid dv/dt triggering and protect the device during turn OFF, either a
recommended value of resistance must be connected between the gate and
cathode or a small reverse bias voltage (typically -2V) must be maintained on the
gate terminal. This prevents the gate cathode junction to become forward biased
and hence the GTO sustains during the turn OFF state.
In reverse biased condition of GTO, the blocking capability is depends on the type
of GTO. A symmetric GTO has a high reverse blocking capability while asymmetric
GTO has a small reverse blocking capability as shown in figure.
It is observed that, during reverse biased condition, after a small reverse voltage
(20 to 30 V) GTO starts conducting in reverse direction due to the anode short
structure. This mode of operation does not destroy the device provided that the
gate is negatively biased and the time of this operation should be small.
AC drives
DC drives or DC choppers
AC stabilizing power supplies
DC circuit breakers
Induction heating
And other low power applications
REFERENCES:
http://www.electronics-tutorials.ws/power/diac.html
http://www.electronics-tutorials.ws/power/triac.html
http://www.circuitstoday.com/mos-controlled-thyristor-mct
https://www.scribd.com/doc/169347410/STATIC-INDUCTION-THYRISTOR-SITH
http://www.electronicshub.org/gate-turn-off-thyristor/