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2016FLEX Conference
March 03, 2015
What are Flexible Hybrid Electronics?
American Semiconductor
Molex flexible substrate FleX-ICs
Sensor Signal Processing
Printed Electronics Data Processing
Sensors Data Storage
Interconnects Communications
Substrates
Displays Low Cost, High Performance
Compatible with Printed Electronics
Low Cost, Large Format Foundry CMOS + FleX Processing
Roll-To-Roll, Screen, Inkjet Print,
Humidity Testing
Temperature Testing
~300um ~30um
Test Setup:
Vdd = 2.5V
FleX OPAMP
Vss = 0V
Ibias = 10uA
In-pos = 1kHz square wave (YELLOW trace on
oscilloscope)
SoP In-neg = connected to Out, voltage follower configuration
Bare Die Flex Op-Amp functions at (BLUE trace on scope)
Package Die 5mm radius of curvature! Out= connected to In-neg, voltage follower configuration
Die (BLUE trace on scope)
2016 American Semiconductor, Inc. All rights reserved. 5
Attach and Interconnect
2014 MRL 4
Today MRL 8
Mechanical Requirements
Beta Units
Conformal
600um thickness
Thin
Rcurve limit 40mm Overlay
Flexible compare
Gen 1 2016
80% thinner Gen 1 Units RoC <5mm
120um thickness
~90% more flexible
Rcurve limit <5mm
PASS
Test Coupon:
Flexible Hybrid Electronics (FHE) system with FleX-OpAmp on a PET substrate
127um (5mil) thick PET substrate with traces screen printed using a silver nanoparticle ink
FleX-OpAmp general purpose operational amplifier configured as a voltage follower
UV curable, non-conductive adhesives used for die attach and overcoat
Thermal cure silver flake conductive adhesive used for interconnect
150mm
Thank You
Special thanks to :
Air Force Research Lab
Brewer Science
Molex
Boise State University