FHE Integration & Manufacturing for Killer Apps

Nov. 18, 2015

Doug Hackler
doughackler@americansemi.com
 Introduction

New Boise, Idaho Facility Headquarters and manufacturing

Small Business Flexible Hybrid Lab

Privately Held
Founded Nov. 2001
Member:
Class 100 Cleanroom

9,000 s.f. FHE Manufacturing Facility

Flexible Hybrid Assembly Thin Wafer Processing
IC Design FHE System Integration
Antenna Design Failure Analysis
FleX-ICs (SoP) FleXform Dev Kits

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 Killer Apps What are they?

Products are starting to emerge Today Future

Asset Monitoring Systems for Next Generation

structural, quality and Fully Flexible?
performance Source: American
Source: PakSense Source: Phase IV Semiconductor

Wearable monitoring for

Medical and Performance
Source: Fitbit Source: Google
Source: Univ. of Illinois

Consumer product safety,

new features. Next Generation
FHE?

3
Source: Thin Film
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 What are Flexible Hybrid Electronics?

Printed Electronics Flexible FleX-ICs

Low Cost, R2R, Large High Performance, High Density
Format Flexible Hybrid System
Combination of flexible printed materials and
flexible silicon-based ICs to create a new class
of flexible electronics.

American Semiconductor
Molex flexible substrate FleX-ICs
Sensor Signal Processing
Printed Electronics Data Processing
Sensors Data Storage
Interconnects Communications
Substrates
Displays Low Cost, High Performance
Compatible with Printed Electronics
Low Cost, Large Format Foundry CMOS + FleX Processing
Roll-To-Roll, Screen, Inkjet Print,

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 Basic FHE Manufacturing Process

Semiconductor IC
Packaged IC Flexible Hybridization
Die IC IC attach
- Thin Die: < 50um IC interconnect
- Ultra-thin/SoP Die: < 12um IC Overcoat
Lamination
Surface mount
Printing
Flexible Substrate Fabrication
Screen Print
Testing FHE
Roll-2-Roll
Sheets or Roll Integration

Sensors/display
Printed material
Surface mount
Unique Material

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 Semiconductor ICs

ICs are required for logic, memory and communications

Packaged parts can be surface mounted ~300um
Bare die (300um typical) and Thin ICs (<50um ) can be used ~30um
SoP
Ultra-thin die (<12um) and SoP die are fully flexible Bare Die
SOP ADC, MCU and OPAMO are commercially available Package Die
FleX 8-bit ADC FleX-MCU Die
Flex Op-Amp functions at
FleX OPAMP
5mm radius of curvature.
Test Setup:
Available in
Vdd = 2.5V
FleXform Kit
Vss = 0V
picL supported by AFRL

Product Overview Product Overview

Ibias = 10uA
8-bit ADC 8-bit Microcontroller
Low Power In-pos = 1kHz square wave
2.5V
Product Features (YELLOW trace on
Flexible and conformal
RISC microcontroller oscilloscope)
Product Features

ROM and SRAM In-neg = connected to Out,

8-bit Successive voltage follower configuration
UART, I2C and SPI
Approximation ADC comm. (BLUE trace on scope)
8 input, 100k s/s Multiple programmable
Out= connected to In-neg,
Single and continuous timers voltage follower configuration
2-wire I2C communication Multiple GPIO ports for
(BLUE trace on scope)
sensor data collection
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 Die Attach and Connect

Active areas of integration current development

Ultra-Thin Die and SoP Dicing Die interconnect for volume manufacturing
<50um Thickness Physical flexibility after cure
New edge issues Electrical conductivity versus
Release film is critical bulk silver
Printability: pitch capability, z-
height requirements, thermal
budget
Manufacturability: throughput,
total COO
Pick & Place and Die attach
Z-Axis methods have
Currently Manual
been demonstrated and
Automation in R&D are in development for
Flexibility is a new pick volume manufacturing.
and attach issue.
New attach material
requirements

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 Overcoat

Overcoat
Reliability requirement
Scratch protection
Profile
Environmental protection
Mechanical Requirements
Conformal
Thin FleX IC with Overcoat

Flexible Overlay
FleXform-ADC Overcoat compare

Beta Units
600um thickness
Fail
Rcurve Test limit 40mm
Gen 1 Units
120um thickness
Rcurve Test limit <5mm PASS
80% thinner, ~90% more flexible

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 Testing and Reliability

Reliability Standards and Tests are an Rcurve - radius of curvature testing

active area of FHE Development. Rcurve Test Mandrels

FHE provided unique challenges for

testing and reliability
Standards for FHE have yet to emerge
Testing methods are being developed
Test associated with flexibility pioneer
new characteristics.
Radius of Curvature is one important
new reliability characteristic
Rcurve is a test method currently being
developed and utilized for early stage
FHE products.
Unique qualification test requirements
have also been adopted to support the
release of the FleXform-ADC Dev Kit.

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 FleXform-ADC Development Kit
This work sponsored
FleXform-ADC Kits provide: in part by
SOTA FHE System Air Force
Research Laboratory
Supports printed sensor development
User printable FHE with on-board FleX-ADC
Integration Board and Software
Enables printed device demonstrations
Fully supported by ASI flexible technology
integration team for design and manufacturing

FleXform-ADC Kit contents:

Quick Start Guide
FleXform-ADC printed circuit board (PCB)
Two button cell batteries
One 8.5 X 5.5 flexible circuit board sheet with two instances
of the FleXform-ADC flexible circuit board (FCB)
Additional documentation, videos and software development
tools are available for download

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 FHE Capability Demonstration

Brewer Science/American Semiconductor collaboration

FleXform-ADC Dev Kit (FleX ADC IC)
Temperature and humidity sensors (printed SWCNT)

Humidity Testing

Temperature Testing

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 Thank you for attending

Special thanks to :


Air Force Research Lab
Brewer Science
Thank You
Soligie Molex
Boise State University

American Semiconductor, Inc.

6987 W. Targee St.
Boise, ID 83709
2015 American Semiconductor, Inc. All rights reserved. Tel: 208.336.2773
American Semiconductor is a registered trademark of American Semiconductor,
Inc. FleXform, FleXform-ADC, FleX, Silicon-on-Polymer, FleX-ADC, FleX-MCU Fax: 208.336.2752
and FleX-IC are trademarks of American Semiconductor, Inc. www.americansemi.com
 Hybridization of flexible and semiconductor technologies is required for flexible bodyworn, IoT and industrial
products.
High volume Flexible Hybrid Electronic (FHE) manufacturing is emerging to support feasibility for bio-patch,
conformal and smart wearable or structural products.
This presentation includes methods and initial results for FHE manufacturing of complex FHE prototypes.
1. Examples of early killer apps
2. Definition of a FHE Current State of the Art: reference Brewer/ASI dev kit demo
3. FHE manufacturing flow
1. Substrate
2. Thin IC thin and ultra-thin
3. Die attach and interconnect
4. Overcoat
5. Test
6. Capability to manufacture prototypes is enabling first killer app concepts

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