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Description
STMicroelectronics BAL-NRF02D3 is an
ultraminiature balun. The BAL-NRF02D3
integrates matching network and harmonics filter.
Matching impedance has been customized for
the following Nordic Semiconductor circuits:
nRF51422-CEAA, nRF51422-CDAB, nRF51422-
CFAC and nRF51822-CEAA, nRF51822-CDAB,
nRF51822-CFAC.
Flip-Chip (5 bumps) package The BAL-NRF02D3 uses STMicroelectronics IPD
technology on non-conductive glass substrate
which optimize RF performances.
Features The BAL-NRF02D3 has been tested and
50 nominal input / conjugate match to approved by Nordic Semiconductor in the nRFgo
Nordic Semiconductor chips nRF51422- modules.
CEAA, nRF51422-CDAB, nRF51422-CFAC Figure 1: Pin coordinates
and nRF51822-CEAA, nRF51822-CDAB,
nRF51822-CFAC
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Small footprint: < 1.2 mm2
Benefits
Very low profile < 560 m after reflow
High RF performances
RF BOM and area reduction
Applications
2.45 GHz impedance matched balun filter
Optimized for Nordic's chip set nRF51422-
CEAA, nRF51422-CDAB, nRF51422-CFAC
and nRF51822-CEAA, nRF51822-CDAB,
nRF51822-CFAC
1 Application
Figure 2: Application schematic
C1
12pF
X1
16MHz
C2
12pF
C8
P0.29 100nF
P0.28
P0.25
P0.24
P0.22
P0.21
P0.27
P0.26
P0.23
VCC_nRF
C7
C5
B7
A2
A6
B5
A5
A8
A7
B6
A4
A3
C9
1.0nF
P0.27
P0.24
P0.23
P0.21
P0.29
P0.28
P0.26
P0.25
P0.22
DEC1
VCC_nRF
XC1
XC2
B8
VDD
B9 A1
DCC AVDD
P0.30 D8 G6
P0.30 VSS
P0.31 E8 G9
C7 P0.31 VSS
P0.00 C9 D7 B1
100nF P0.00 VSS
P0.01 E9 C1 B3 A1 RF
P0.01 ANT2 ANT2 SE
P0.02 D9 D1 A3
P0.02 ANT1 ANT1
P0.03 F9 E1 A2 B1
P0.03 VDD_PA VDD_PA GND
P0.04 F8 F1
P0.04 DEC2
SWDIO/nRESET
H8 G2 P0.17
VDD P0.17
P0.09
P0.10
P0.12
P0.13
P0.15
P0.16
P0.08
P0.14
P0.11
C11 C10 C3
VSS
VSS
VSS
VSS
U1
J8
J6
J4
J7
J5
J3
J2
C8
B1
B4
H4
H2
H3
H6
H5
nRF51822-CEAA
SWDCLK
SWDIO
P0.08
P0.14
P0.15
P0.09
P0.10
P0.12
P0.13
P0.16
P0.11
R1
12k
2 Characteristics
Table 1: Absolute ratings (limiting values)
Value
Symbol Parameter Unit
Min. Typ. Max.
PIN Input power RFIN - 20 dBm
ESD ratings human body model (JESD22-A114-C), all I/O
2000 -
one at a time while others connected to GND
VESD V
ESD ratings charge device model (JESD22-C101-C) 500 -
ESD ratings machine model, all I/O 200 -
TOP Operating temperature (JESD22-A115-C), all I/O -40 - +105 C
-
Tstg Storage temperature range +150 C
55C
-5 -0.5
-10 -1.0
-1.5
-15
-2.0
-20
-2.5
-25
F (GHz)
F (GHz) -3.0
-30
0 1 2 3 4 5 6 7 8 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50
Figure 5: Return loss on SE port (Tamb = 25 C) Figure 6: Return loss on DIFF port (Tamb = 25 C)
dB dB
-10 -15.0
-11
-17.5
-12
-20.0
-13
-22.5
-14
F (GHz) F (GHz)
-25.0
-15
2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50
2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50
3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Epoxy meets UL94, V0
Lead-free package
35um
230um
35um
9 30um
35um
230um
35um
Dot, ST logo
ECOPACK grade
xx = marking
z = manufacturing
location
x x z
yww = datecode
y ww
Figure 16: Footprint - 5 mils stencil -non solder Figure 17: Footprint - 5 mils stencil - solder mask
mask defined defined
Copper pad diameter: Solder mask opening:
220 m recommended 220 m recommended
180 m minimum 180 m minimum
260 m maximum 260 m maximum
4 Ordering information
Table 6: Ordering information
Order code Marking Package Weight Base qty. Delivery mode
BAL-NRF02D3 SK Flip-Chip 5 bumps 1.58 mg 5000 Tape and reel
5 Revision history
Table 7: Document revision history
Date Revision Changes
02-Jul-2013 1 Initial release.
30-Aug-2013 2 Updated Table 1.
13-Oct-2014 3 Updated Figure 9.
25-Mar-2015 4 Updated cover page, added Table 4 and Table 5.
15-Jun-2015 5 Updated Table 1.
07-Dec-2016 6 Updated Table 1: "Absolute ratings (limiting values)".
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