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One simulation
Boost Productivity
HPC+GPU
Setup Solving Results Variations
N simulations
Multiphysics Workflow
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Turn On GPU
Solder Joint
Creep Analysis
Solder - 4M DOF
balls
Mold
PCB
Material Library
Spot Welds
Beam
Joint Spring
Mesh connection
Curvature On
Proximity On
Applied Load
Reactive Force
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Surface
Electromagnetics
33 2011 ANSYS, Inc. June 21, 2012
Fluid-Structure Coupling
Efficient mapping of
point cloud data is
required to account for
misalignment, non
matching units or
scaling issues.
! Input parameters:
esel,s,type,,10
cm,component,ELEM
thickness = 0.005
film_coefficient = 200.
temperature = 226.85
! Treatment:
/prep7
et,100,152
keyop,100,8,2.
et,1001,131
keyo,1001,3,2
sectype,1001,shell
secdata,thickness,10
secoff,mid
cmsel,s,component
emodif,all,type,1001
emodif,all,secnum,1001
type,100
esurf
fini APDL
alls
/solu
esel,s,type,,100
nsle
sf,all,conv,film_coefficient,temperature
alls
Opportunity to migrate existing process automation
from MAPDL to ANSYS Mechanical at low cost
43 2011 ANSYS, Inc. June 21, 2012
ACT Structure
XML definition:
<load internalName="Convection on Blade" caption="Convection on Blade" icon="Convection"
issupport="false" isload="true">
<version>1</version>
<callbacks>
<onsolve>Convection_Blade_Computation</onsolve>
</callbacks>
<details>
<property internalName="Geometry" dataType="string" control="scoping"></property>
<property internalName="Thickness" caption="Thickness" dataType="string"
control="text"></property>
<property internalName="Film Coefficient" caption="Film Coefficient" dataType="string"
control="text"></property>
<property internalName="Ambient Temperature" caption="Ambient Temperature"
dataType="string" control="text"></property>
</details>
</load>