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Abstract Micro-milling is a manufacturing process used as minimum chip thickness effect and its influence on
an alternative for the fabrication of Lab-on-a-Chip surface topography and burr formations. Although these
components among other medical applications. In the work models explain the cutting phenomenon, few papers have
presented here, the six sigma methodology was used for been developed to reduce process variability adjusting
evaluating micro-milling process parameters and their
impact on the generation of geometrical errors such as tool
operational settings.
wear, vibrations and burr formations. These critical Six Sigma methodology improves the process quality
variables affect surface quality and geometrical features for analyzing data statistically to find the root cause of quality
Lab-On-a-Chip microfluidic performance. This paper problems and to implement controls[8].This paper
presents the application of DMAIC (Define, Measure, presents the use of DMAIC (Define, Measure, Analyze,
Analyze, Improve and Control) methodology in micro- Improve and Control) methodology for micro-milling
milling process in order to study cutting parameters and process in order to study cutting mechanisms and its
their influence on surface quality. Finally, improvements are implications on surface finish.
implemented to enhance process capability as related to
surface roughness.
II. DMAIC METHODOLOGY
Keywords Micro-milling process, Six Sigma
methodology, geometrical accuracy, surface roughness The Six sigma projects can be classified as: Customer
satisfaction, productivity improvement, waste
I. INTRODUCTION minimization, cost reduction, quality improvement,
process improvement, reliability improvement, health,
Nowadays, the manufacturing of medical devices and safety and environment improvement and employee
Lab-on-a-Chip components requires advanced processing satisfaction [9, 10].
technologies, such as photolithographic micro fabrication, The process improvement projects involve the use of tools
micro-milling and laser microcutting, among others. and techniques used to discover and to execute process.
Micro-milling is a mechanical cutting process that Six Sigma methodologies are implemented by a team with
generates product features in dimensions of 1 mm or less specific objectives. The organizational structure of Six
[1]. This process is flexible and has low implementation Sigma implementation is based on precisely specified
cost. The study of various process factors can improve roles (e.g. Green Belts, Black Belts). In fact, black belts
surface finish, geometrical errors and tolerances. lead project teams; they are trained for collecting,
The main sources of geometrical errors for micro-milling combining and synthesizing the knowledge of team[11].
process are tool deflection, tool wear, vibrations and burr A key driver of success for Six Sigma projects is the
formations[2]. Tool deflection occurs when tool bends possibility to recruit the best resources in the company to
due to the action of cutting forces[3]meanwhile tool wear contribute to the project development[12].
and vibrations are inherent characteristics for milling Micro-milling operations involve a large number of
process. Aramcharoen et al. explained three basic process factors, where the Six Sigma methodology can
mechanisms for burr formations in micro-milling beneficial. A Six Sigma project was implemented for
process[4], based on the concept minimum chip thickness micro-milling operations focused on well-defined
necessary for an adequate chip mechanics. In case, the measurable goals in order to reduce variability, with
process is operated below the necessary chip thickness, financial benefits compared with other micro-fabrication
the cutting tool compresses the material, resulting in alternatives.
burrs[4].The appropriate minimum chip thickness is
influenced by friction, among other process factors[5]. III. APPLICATION MODEL
These sources of geometrical errors can be quantified in
terms of average surface roughness, tool wear and tool The DMAIC procedure was implemented for micro-
life and all of them affect the surface finish, which is milling process and it is discussed in the following
critical to Lab-on-a Chip components that require sections.
microfluidics.
Due to the complexity of cutting mechanisms, some Define
results have been reported on the estimations of minimum The first phase of DMAIC is to define and to identify key
chip thickness from analytical and fuzzy models[6, 7]. issues and problems through the voice of customer and
These studies focus on cutting forces in order to analyze the voice of business in micro-milling process.
I
Improvement Projject definitionn
The purposee of the improvementt phase is the From m previous studies, miicro-milling process waas
implementatioon of new chaanges so that the micro-miilling com
mpared with WEDM M, sandblasting andd
process perfoormance can be enhanced and the com mmon photolithographicc process [14]]. Hence, it was
w found thaat
variation cauuses are deetected. In this t stage, some
s sanddblasting proccess is econommically feasibble however it i
experiments are
a performedd in order to finnd out the opttimal prodduces in apppropriate surrface quality y. Meanwhilee,
cutting conditions. The deliverables forr the improvem ment photolithographicc process was the most expeensive process
phase are: thee optimizationn tools and thhe identificatioon of withh an excellennt surface quuality, while micro-millingg
operational coonditions[13].. proccess was econnomically feaasible with an n intermediatee
surfface quality.
Control A high number of defects in w workpieces and d variability inn
The purpose of this phase is to sustain the
t benefits ofo the micrro-milling process
p was registered according too
new process and to ensuree that previouss problems doo not histoorical data. Therefore,
T the goal was to reduce
r averagee
resurface[14]. Critical process parameters are surfface roughnesss in order too get values less
l than 0.500
continuously monitored and a documentted to updatee the m.. Hard savingss involve a diffference betw
ween photolithoo
information. The deliverabbles for the control
c phase are: grapphic vs. microo-milling proccesses (300 vs.
v 60 USD inn
control technniques, controol plan and project
p status[13]. unitt cost) [15].Therefore, m micro-milling cost is jusst
For the coomplete succcess of Sixx Sigma, prroper 20%%percent, com mpared to phottolithographicc process. Sofft
documentatioon of the proceess is recomm
mended. saviings are associated with cusstomer satisfaction, who haas
a prroduct at low wer price andd accessible to biomedicaal
marrket.
1118
Proceedings of the 2015 IEEE IEEM
Measure stage and statistical model for surface roughness response. The
The steps for micro-milling operations include a fixture determination coefficient R-sq (adj) was 90.8%. After this
system to hold the workpiece, and the referencing the stage, optimal cutting conditions are found.
workpiece position relative to the machine coordinate A process capability analysis (PCA) was performed with
system. Then, cutting parameters are adjusted and a CNC the optimal cutting parameters (11,000 RPM in spindle
program is developed according to final microfluidic speed, 0.08 mm in axial depth and 0.005 mm/tooth in feed
design. Figure 2 illustrates a complete process flow per tooth). Process capability results (see Figure 5)
diagram for micro-milling process. In order to prioritize indicate that Z bench level was improved from -0.4 to
input variables for micro-milling process, a cause and 2.48 (room temperature) and from -1.1 to 3.8 applying a
effect matrix (Table 1) and an Ishikawa diagram (Figure precooling on the workpiece(-65C).
3) were developed. The cause and effect matrix was
performed including key output customer requirements Improvement actions and Control stage
and their importance was rated from 1 to 10. Then, input Cause and effect matrix, as well as the Ishikawa diagram
variables were related with key requirements and scored show the factors to be considered to carry out actions
by 9 (strong correlation), 3 (moderate correlation), 1 implemented through Six Sigma methodology. The
(remote correlation) and 0 (no correlation).These values improvement proposal involves implementation of a
were multiplied by the weights assigned to customer displacement sensor in order to quantify the distance
requirements and added for each input variables. The between workpiece and cutting tool or to develop a new
results suggest that average surface roughness is the most fixture in order to identify the distance between material
indicated to evaluate micro-milling process. and cutting tool. The project team needs to evaluate if
Also, process mapping was used to understand the micro- these modifications contribute to reduce variability.
milling process. Identification of input variables (Xs),
Table 1. Cause and effect matrix of Micro-milling process
Output variables (Ys) and all value added and non-value
added process steps [16]. Table 2 presents a process Key output customer
mapping of micro-milling process. The Ishikawa diagram requirements (Ys)
illustrates the current process in order to narrow down the
material percent
Burr formation
problem into its main factors or root causes that affect the
Distance tool-
Adjustment
Machining
percentage
percentage
cutting process. The following stages analyze the
workpiece
roughness
Average
influence of cutting parameters on average surface
roughness as main indicator of surface quality.
An initial experimentation was performed in order to Input variables (Xs) 8 9 6 10 7 Total
evaluate process capability. Two cutting temperatures Precision tool holder 1 1 3 47
were evaluated: a) room temperature (25 C) and b) pre- Spindle accuracy 1 1 3 47
Maximum Width workpiece 3 18
cooling on workpiece using solid carbon dioxide (-65 C),
Maximum Height workpiece 3 18
with cutting parameters fixed at 8,000 RPM spindle Axial depth 3 9 9 171
speed, 0.12 mm axial depth and 0.010 mm/ tooth feed Spindle speed 3 30
rate. Figure 4 illustrates initial PCA in order to analyze Z- Feed per tooth 9 9 153
bench level. In both graphs, it is observed a negative level Workpiece Temperature 3 1 37
of Z-bench. Therefore, the cutting process is not capable Processing time 1 6
to produce Lab-on-a-Chip components. Evaluation of Raw material percentage 1 6
cutting parameters is necessary. Fixture distance 9 3 111
Work offset distance X 9 3 102
Work offset distance Y 9 3 102
Analysis stage Work offset distance Z 9 3 102
A Design of experiments 24 was performed to evaluate Cycle time 1 6
cutting parameters (see Table 3) in a vertical machining 16 261 72 390 217 956
center. Table 4 illustrates p-values, analysis of variance
Adjusting tool
in holder
Programming
CAM design
1119
Proceedings of the 2015 IEEE IEEM
Add
Input/ Output
Value Input/Output variables
How this variable How this variable
From Process Flow Diagram or from Specific Std (if exists)
is measured is controlled
not add this process step
value
AV/
Process Step Variables Specification Measurement System Control
NAV
Precision tool holder I 0.001 m Micrometer Uncontrolled
Adjusting tool in tool holder AV
Spindle accuracy I 0.0001 m Micrometer Uncontrolled
Max. Width workpiece I 500 mm Caliper Process plan
Selecting workpiece fixture AV
Max. Height workpiece I 400 mm Caliper Process plan
AV Axial depth I 0.015 m-0.6 m Micrometer Automated control
AV Spindle speed I 10- 30000 RPM Tachometer Automated control
Programming cutting parameters
AV Feed per tooth I 0.001- 0.015 mm/tooth Micrometer Automated control
AV Workpiece Temperature I -63 - 25 C Thermocouple Process plan
Programming CAM design AV Processing time I Not specified Timer Process plan
AV Raw material percentage I Not specified Caliper Process plan
Adjusting workpiece AV Fixture distance I Not specified Micrometer Process plan
AV Adjustment percentage O Not specified Micrometer Uncontrolled
Work offset distance X I 0 m Micrometer Automated control
Work offset distance Y I 0 m Micrometer Automated control
Getting zero work offset AV
Work offset distance Z I 0 m Micrometer Automated control
Distance tool-workpiece O 0 m Micrometer Uncontrolled
Running machine program AV Cycle time I Not specified Timer Process plan
Raw material percentage I Not specified Caliper Process plan
Machining material perc. O Not specified Caliper Process plan
Removing workpiece AV
Average roughness O 0 m- 0.2 m Roughness tester Inspection
Burr formation percentage O 0-10% Go/ No go Inspection
Surface
quality
Burr formation
Non homogeneous Runout
microstructure material
Tool deflection
Fixture
Vibrations
Cutting forces
1120
Proceedings of the 2015 IEEE IEEM
LEI LES
P rocess data Within
LE I 0.05 Ov erall
Target *
LE S 0.5 P otential capability (O v erall)
S ample mean 0.552714 Z.Bench -0.40
S ample number 7 Z.LE I 3.78
S t. D ev . (Within) 0.13289 Z.LE S -0.40
S t. D ev . (O v erall) 0.127491 C pk -0.13
O v erall capability
P otential capability (Within)
Z.Bench -0.41
Cp 0.56
Z.LE I 3.94
C PL 1.26
Z.LE S -0.41
C P U -0.13
P pk -0.14
C pk -0.13
C pm *
G eneral capability
Pp 0.59
PPL 1.31
PPU -0.14 Workpiece
P pk -0.14 Temperature: 25 oC
C pm * 0.2 0.4 0.6 0.8
LEI LES
P rocess data Within
LE I 0.05 Overall
Target *
LE S 0.5 P otential capability (O v erall)
S ample mean 0.563429 Z.Bench -1.17
S ample number 7 Z.LE I 9.44
S t. D ev . (Within) 0.0543886 Z.LE S -1.17
S t. D ev . (G eneral) 0.0521787 C pk -0.39
G eneral C apability
P otential capability (Within)
Z.Bench -1.22
Cp 1.38
Z.LE I 9.84
C PL 3.15
Z.LE S -1.22
C PU -0.39
P pk -0.41
C pk -0.39
C pm *
G eneral capability
Pp 1.44
PPL 3.28
PPU -0.41
P pk -0.41 Workpiece
C pm *
0.2 0.4 0.6 0.8
Temperature: 65 oC
Figure 4.Initial process capability analysis (PCA)for average surface roughness
LEI LES
P rocess data W ithin
LE I 0.05 O v erall
Target *
LE S 0.5 P otencial capability (O v erall)
S ample mean 0.196286 Z.Bench 2.48
S ample number 7 Z.LE I 2.48
S t. D ev . (Within) 0.0590923 Z.LE S 5.14
S t. D ev . (O v erall) 0.0566913 C pk 0.83
O v erall capability
P otential capability (Within)
Z.Bench 2.58
Cp 1.27
Z.LE I 2.58
C PL 0.83
C PU 1.71
Z.LE S 5.36
C pk 0.83 P pk 0.86
C pm *
G eneral capability
Pp 1.32
PPL 0.86
PPU 1.79
P pk 0.86
Workpiece
C pm * Temperature: 25 oC
0.2 0.4 0.6
LEI LES
P rocess data W ithin
LEI 0.05 General
Target *
LES 0.5 P otential capability (O v erall)
S ample mean 0.192714 Z.Bench 3.89
S ample number 7 Z.LE I 3.89
S t. Dev . (Within) 0.0366542 Z.LE S 8.38
S t. Dev . (O v erall) 0.0351649 C pk 1.30
O v erall capability
P otential capability (Within)
Z.Bench 4.06
Cp 2.05
C P L 1.30 Z.LE I 4.06
C P U 2.79 Z.LE S 8.74
C pk 1.30 P pk 1.35
C pm *
G eneral capability
Pp 2.13
PPL 1.35
PPU 2.91
P pk 1.35 Workpiece
C pm * 0.2 0.4 0.6 Temperature: 65 oC
Figure 5. Final process capability analysis (PCA) for average surface roughness
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Proceedings of the 2015 IEEE IEEM
1122
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