Philips Semiconductors Product specification

PowerMOS transistor IRF730

Avalanche energy rated

FEATURES SYMBOL QUICK REFERENCE DATA

Repetitive Avalanche Rated d
Fast switching VDSS = 400 V
High thermal cycling performance
Low thermal resistance ID = 7.2 A
g

RDS(ON) 1
s

GENERAL DESCRIPTION PINNING SOT78 (TO220AB)

N-channel, enhancement mode PIN DESCRIPTION
tab
field-effect power transistor,
intended for use in off-line switched 1 gate
mode power supplies, T.V. and
computer monitor power supplies, 2 drain
d.c. to d.c. converters, motor control
circuits and general purpose 3 source
switching applications.
tab drain
The IRF730 is supplied in the 1 23
SOT78 (TO220AB) conventional
leaded package.

LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VDSS Drain-source voltage Tj = 25 C to 150C - 400 V
VDGR Drain-gate voltage Tj = 25 C to 150C; RGS = 20 k - 400 V
VGS Gate-source voltage - 30 V
ID Continuous drain current Tmb = 25 C; VGS = 10 V - 7.2 A
Tmb = 100 C; VGS = 10 V - 4.6 A
IDM Pulsed drain current Tmb = 25 C - 29 A
PD Total dissipation Tmb = 25 C - 125 W
Tj, Tstg Operating junction and - 55 150 C
storage temperature range

AVALANCHE ENERGY LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
EAS Non-repetitive avalanche Unclamped inductive load, IAS = 4.8 A; - 290 mJ
energy tp = 0.23 ms; Tj prior to avalanche = 25C;
VDD 50 V; RGS = 50 ; VGS = 10 V; refer
to fig:17
EAR Repetitive avalanche energy1 IAR = 7.2 A; tp = 2.5 s; Tj prior to - 9.4 mJ
avalanche = 25C; RGS = 50 ; VGS = 10 V;
refer to fig:18
IAS, IAR Repetitive and non-repetitive - 7.2 A
avalanche current

1 pulse width and repetition rate limited by Tj max.

March 1999 1 Rev 1.000

Philips Semiconductors Product specification

PowerMOS transistor IRF730

Avalanche energy rated

THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Rth j-mb Thermal resistance junction - - 1 K/W
to mounting base
Rth j-a Thermal resistance junction in free air - 60 - K/W
to ambient

ELECTRICAL CHARACTERISTICS
Tj = 25 C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V(BR)DSS Drain-source breakdown VGS = 0 V; ID = 0.25 mA 400 - - V
voltage
V(BR)DSS / Drain-source breakdown VDS = VGS; ID = 0.25 mA - 0.1 - %/K
Tj voltage temperature
coefficient
RDS(ON) Drain-source on resistance VGS = 10 V; ID = 3.6 A - 0.7 1
VGS(TO) Gate threshold voltage VDS = VGS; ID = 0.25 mA 2.0 3.0 4.0 V
gfs Forward transconductance VDS = 30 V; ID = 3.6 A 2 4 - S
IDSS Drain-source leakage currentVDS = 400 V; VGS = 0 V - 1 25 A
VDS = 320 V; VGS = 0 V; Tj = 125 C - 30 250 A
IGSS Gate-source leakage current VGS = 30 V; VDS = 0 V - 10 200 nA
Qg(tot) Total gate charge ID = 7.2 A; VDD = 320 V; VGS = 10 V - 52 62 nC
Qgs Gate-source charge - 3 5 nC
Qgd Gate-drain (Miller) charge - 26 30 nC
td(on) Turn-on delay time VDD = 200 V; RD = 27 ; - 12 - ns
tr Turn-on rise time RG = 12 - 33 - ns
td(off) Turn-off delay time - 93 - ns
tf Turn-off fall time - 42 - ns
Ld Internal drain inductance Measured from tab to centre of die - 3.5 - nH
Ld Internal drain inductance Measured from drain lead to centre of die - 4.5 - nH
Ls Internal source inductance Measured from source lead to source - 7.5 - nH
bond pad
Ciss Input capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 620 - pF
Coss Output capacitance - 108 - pF
Crss Feedback capacitance - 63 - pF

SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS

Tj = 25 C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
IS Continuous source current Tmb = 25C - - 7.2 A
(body diode)
ISM Pulsed source current (body Tmb = 25C - - 29 A
diode)
VSD Diode forward voltage IS = 7.2 A; VGS = 0 V - - 1.2 V
trr Reverse recovery time IS = 7.2 A; VGS = 0 V; dI/dt = 100 A/s - 270 - ns
Qrr Reverse recovery charge - 3.3 - C

March 1999 2 Rev 1.000

Philips Semiconductors Product specification

PowerMOS transistor IRF730

Avalanche energy rated

PD% Normalised Power Derating Zth j-mb, Transient thermal impedance (K/W) PHP3N60
120 1
D = 0.5
110
100 0.2
90
0.1
80 0.1 0.05
70
0.02
60
50
40 0.01
single pulse PD tp tp
30 D=
T
20
10 T
t
0 0.001
0 20 40 60 80 100 120 140 1us 10us 100us 1ms 10ms 100ms 1s
Tmb / C tp, pulse width (s)

Fig.1. Normalised power dissipation. Fig.4. Transient thermal impedance.

PD% = 100PD/PD 25 C = f(Tmb) Zth j-mb = f(t); parameter D = tp/T

ID% Normalised Current Derating ID, Drain current (Amps) PHP5N40

120 20
Tj = 25 C 10 V
110
7V
100
90 15 6.5 V
80
70 6V
60 10
50 5.5 V

40 5V
30 5
VGS = 4.5 V
20
10
0 0
0 20 40 60 80 100 120 140 0 5 10 15 20 25 30
Tmb / C VDS, Drain-Source voltage (Volts)

Fig.2. Normalised continuous drain current. Fig.5. Typical output characteristics.

ID% = 100ID/ID 25 C = f(Tmb); conditions: VGS 10 V ID = f(VDS); parameter VGS

ID, Drain current (Amps) PHP3N50 RDS(on), Drain-Source on resistance (Ohms) PHP5N40
100 2.5
4.5 V 5V 5.5 V VGS = 6 V Tj = 25 C
ID
S/ 2
6.5 V
VD
) =
ON tp = 10 us 7V
10 S( 10 V
RD 1.5
100 us

1
1 1 ms

DC 10 ms
0.5

0.1 0
10 100 1000 10000 0 5 10 15 20
VDS, Drain-source voltage (Volts) ID, Drain current (Amps)

Fig.3. Safe operating area. Tmb = 25 C Fig.6. Typical on-state resistance.

ID & IDM = f(VDS); IDM single pulse; parameter tp RDS(ON) = f(ID); parameter VGS

March 1999 3 Rev 1.000

Philips Semiconductors Product specification

PowerMOS transistor IRF730

Avalanche energy rated

ID, Drain current (Amps) PHP5N40 VGS(TO) / V

20
VDS > ID x RDS(on)max max.
Tj = 25 C 4

15 typ.
3
Tj = 150 C

min.
10
2

5 1

0 0
0 2 4 6 8 10 -60 -40 -20 0 20 40 60 80 100 120 140
VGS, Gate-Source voltage (Volts) Tj / C

Fig.7. Typical transfer characteristics. Fig.10. Gate threshold voltage.

ID = f(VGS); parameter Tj VGS(TO) = f(Tj); conditions: ID = 0.25 mA; VDS = VGS

gfs, Transconductance (S) PHP5N40 ID / A SUB-THRESHOLD CONDUCTION

7 1E-01
VDS > ID x RDS(on)max
Tj = 25 C
6
1E-02

5
150 C 2% typ 98 %
1E-03
4

3 1E-04

2
1E-05
1

0 1E-06
0 5 10 15 20 0 1 2 3 4
ID, Drain current (A) VGS / V

Fig.8. Typical transconductance. Fig.11. Sub-threshold drain current.

gfs = f(ID); parameter Tj ID = f(VGS); conditions: Tj = 25 C; VDS = VGS

a Normalised RDS(ON) = f(Tj) Junction capacitances (pF) PHP5N40

1000
Ciss
2

100
1 Coss

Crss

0
-60 -40 -20 0 20 40 60 80 100 120 140 10
1 10 100 1000
Tj / C VDS, Drain-Source voltage (Volts)

Fig.9. Normalised drain-source on-state resistance. Fig.12. Typical capacitances, Ciss, Coss, Crss.
a = RDS(ON)/RDS(ON)25 C = f(Tj); ID = 3.6 A; VGS = 10 V C = f(VDS); conditions: VGS = 0 V; f = 1 MHz

March 1999 4 Rev 1.000

Philips Semiconductors Product specification

PowerMOS transistor IRF730

Avalanche energy rated

VGS, Gate-Source voltage (Volts) PHP5N40 IF, Source-Drain diode current (Amps) PHP5N40
15 20
ID = 7.2 A VGS = 0 V
240 V
Tj = 25 C

80 V VDD = 320 V 15
10

10
150 C Tj = 25 C
5
5

0 0
0 10 20 30 40 50 60 70 80 0 0.2 0.4 0.6 0.8 1 1.2 1.4
Qg, Gate charge (nC) VSDS, Source-Drain voltage (Volts)

Fig.13. Typical turn-on gate-charge characteristics. Fig.16. Source-Drain diode characteristic.

VGS = f(QG); parameter VDS IF = f(VSDS); parameter Tj

Switching times (ns) PHP5N40

1000
VDD = 200 V Non-repetitive Avalanche current, IAS (A)
VGS = 10 V 10
RD = 27 Ohms
Tj = 25 C 25 C

Tj prior to avalanche = 125 C

100 td(off) 1
VDS
tf
tp
tr
ID
PHP7N40E
0.1
td(on) 1E-06 1E-05 1E-04 1E-03 1E-02
10
0 10 20 30 40 50 60
RG, Gate resistance (Ohms) Avalanche time, tp (s)

Fig.14. Typical switching times; td(on), tr, td(off), tf = f(RG) Fig.17. Maximum permissible non-repetitive
avalanche current (IAS) versus avalanche time (tp);
unclamped inductive load

Normalised Drain-source breakdown voltage

1.15
V(BR)DSS @ Tj
V(BR)DSS @ 25 C
Maximum Repetitive Avalanche Current, IAR (A)
10
1.1
Tj prior to avalanche = 25 C

1.05 125 C
1

0.95 0.1

0.9 PHP7N40E
0.01
0.85 1E-06 1E-05 1E-04 1E-03 1E-02
-100 -50 0 50 100 150
Tj, Junction temperature (C)
Avalanche time, tp (s)

Fig.15. Normalised drain-source breakdown voltage; Fig.18. Maximum permissible repetitive avalanche
V(BR)DSS/V(BR)DSS 25 C = f(Tj) current (IAR) versus avalanche time (tp)

March 1999 5 Rev 1.000

Philips Semiconductors Product specification

PowerMOS transistor IRF730

Avalanche energy rated

MECHANICAL DATA
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220 SOT78

E A
P A1

q
D1

L2(1) L1

Q
b1
L

1 2 3

b c

e e

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

(1)
UNIT A A1 b b1 c D D1 E e L L1 L2 P q Q
max.

mm 4.5 1.39 0.9 1.3 0.7 15.8 6.4 10.3 15.0 3.30 3.8 3.0 2.6
2.54 3.0
4.1 1.27 0.7 1.0 0.4 15.2 5.9 9.7 13.5 2.79 3.6 2.7 2.2

Note
1. Terminals in this zone are not tinned.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

SOT78 TO-220 97-06-11

Fig.19. SOT78 (TO220AB); pin 2 connected to mounting base (Net mass:2g)

Notes
1. This product is supplied in anti-static packaging. The gate-source input must be protected against static
discharge during transport or handling.
2. Refer to mounting instructions for SOT78 (TO220AB) package.
3. Epoxy meets UL94 V0 at 1/8".

March 1999 6 Rev 1.000

Philips Semiconductors Product specification

PowerMOS transistor IRF730

Avalanche energy rated

DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.

March 1999 7 Rev 1.000