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Faster switching speeds essentially mean two things for engineers and PCB designers:
Signal Integrity goals are met through controlled impedance routing, terminations, and PCB stack-up.
Timing Constraint
Ensuring that multiple signals reach their destination pins at approximately the same time
Timing integrity is important in many applications including DDRx and SDRAM designs, which have become some of the
most common. Currently these types of designs contain one or more of the following; DDR, DDR2, DDR3, or DDR4. DDR
designs come with a long list of timing rules, including:
When routing for high speed its also extremely important to apply a Routing Topology. The topology of a net is the
arrangement or pattern of the pin-to-pin connections. By default, pin-to-pin connections of each net are arranged to give
the shortest overall connection length. A topology can be applied to a net for a variety of reasons. For high speed designs
where signal reflections must be minimized, the net is arranged with a daisy chain topology. However, for ground nets, a
star topology could be applied, to ensure that all tracks come back to a common point.
DDR2 (and some situations in DDR3) can employ balanced-T or branch matched topology. While DDR3 and DDR4
introduced fly-by topology. In fly-by topology, Address/Control/Clock signals are routed sequentially from one SDRAM
to the next, which eliminates reflections. This routing topology is much simpler. The memory controller compensates for
the inherent delay (read/write leveling). However, address/control lines still need to be matched chip-to-chip.
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HIGH SPEED DESIGN AND XSIGNALS
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Width, and Terminations. resistors, and often multiple vias between the starting
pad and the final destination pads. The multiple segments
and termination resistors make it very difficult to tune
the overall net length of all the data lines. In addition, in
designs of very high speeds you also need to account for
the individual pin delays that are built into the components
from pad to substrate. So as you can see, there are many
factors for the engineer or PCB designer to consider when
doing high speed routing. Its nothing if not a challenge.
In the past, engineers were forced to deal with length tuning by keeping track of everything in spreadsheets. This allowed
them to keep track of each individual segment length for a net, via depths, resistor lengths, and pin lengths. After adding
them all up for each net, then adding signal length wherever needed, this enabled them to equalize the lengths of all the
nets in the group. This is an antiquated method of length matching, which is both cumbersome and time-consuming.
XSignals
What is a XSignal? A XSignal is essentially a designer-defined signal path between 2 nodes. These can be two nodes within
the same net, or they can be two nodes in associated nets, separated by a component. Once the nodes are established,
the XSignal can then be used to scope relevant design rules such as Length and Matched Length. These rules will then be
obeyed during interactive length tuning and other design tasks.
The XSignal Wizard can be used to create and assign XSignals to XSignal Classes automatically
Design rules ensure length matching during the interactive tuning process.
XSignals support length tuning across terminators, such as serial resistors in the track with e.g. 34 ohm tracks.
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HIGH SPEED DESIGN AND XSIGNALS
XSignal Wizard
High Speed design is one of the most challenging tasks that an electrical engineer can take on. There are so many factors that
affect the way a high speed signal will respond. A common misconception is that High Speed Design is a function of the System
The Technology-Aware XSignals Wizard helps to automate the creation of XSignals. One of the first technology families
Clock Frequency. Thats not the case, high speed is determined by Rise Time, Impedance Control with PCB Stack-up, Trace
supported by the wizard was DDR3 or DDR4 memories.
Width, and Terminations.
Address/Command/Control nets
Data Byte-Lanes
Figure 2: Automatically generated xSignal Class of all Byte Lane 2
Clocks
specific Data xSignals
In every high speed design over 500 MHz, the connection medium, or bond wire to the die, introduces a delay to the signal.
This in-device delay is referred to as the pin-package delay.
These delays need to be accounted for. Pin package lengths can be defined as an attribute of the schematic component
pin. The length value is transferred to PCB layout, where it becomes the Pin/Pkg Length of the footprint pad. The Pin/Pkg
Length is automatically included in Signal length calculations as part of the XSignal definition.
Figure 3: Pin/Package distances can be specified as an attributes of the components schematic symbol (reference image: Samsung)
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