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Chip
Socket Pins Layout Supported Processors Introduced
Class
39x39
423 423 Pentium 4 FC-PGA Nov. 2000
SPGA
58x43
LGA 2011 2011 Core i7 Nov. 2011
hexLGA
29x29 Sept.
754 754 Athlon 64
mPGA 2003
AMD K8 31x31
939 939 Athlon 64 v.2 June 2004
mPGA
31x31
AM3 9412 Athlon II, Phenom II, Sempron Feb. 2009
mPGA
31x31
AM3+ 9412 "Bulldozer" Processors Mid-2011
mPGA
35x35
F (1207 FX) 1207 Athlon 64 FX, Opteron Aug. 2006
LGA
31x31
FM1 905 A4, A6, A8, Athlon II, E2, Sempron Jul. 2011
LGA
AMD A
31x31 Sept.
FM2 904 A4, A6, A8, A10
LGA 2012
Sockets 1, 2, 3, and 6 are 486 processor sockets and are shown together in the figure below so you can
see the overall size comparisons and pin arrangements between these sockets.
Sockets 4, 5, 7, and 8 are Pentium and Pentium Pro processor sockets and are shown together in the
figure below so you can see the overall size comparisons and pin arrangements between these sockets.
Pentium And Pentium Pro Processor Sockets
When the Socket 1 specification was created, manufacturers realized that if users were going to
upgrade processors, they had to make the process easier. The socket manufacturers found that 100 lbs.
of insertion force is required to install a chip in a standard 169-pin Socket 1 motherboard. With this
much force involved, you easily could damage either the chip or the socket during removal or
reinstallation. Because of this, some motherboard manufacturers began using low insertion force (LIF)
sockets, which required a smaller 60 lbs. of insertion force for a 169-pin chip. Pressing down on the
motherboard with 60100 lbs. of force can crack the board if it is not supported properly. A special tool
is also required to remove a chip from one of these sockets. As you can imagine, even the LIF was
relative, and a better solution was needed if the average person was ever going to replace his CPU.
Intel Sockets
Socket LGA 775 (also called Socket T) is used by the Core 2 Duo/Quad processors, the most recent
versions of the Intel Pentium 4 Prescott processor and the Pentium D and Pentium Extreme Edition
processors. Some versions of the Celeron and Celeron D also use Socket LGA 775. Socket LGA 775,
unlike earlier Intel processor sockets, uses a land grid array format, so the pins are on the socket,
rather than the processor.
LGA uses gold pads (called lands) on the bottom of the processor to replace the pins used in PGA
packages. It allows for much greater clamping forces via a load plate with a locking lever, with greater
stability and improved thermal transfer (better cooling). The first LGA processors were the Pentium II
and Celeron processors in 1997; in those processors, an LGA chip was soldered on the Slot-1 cartridge.
LGA is a recycled version of what was previously called leadless chip carrier (LCC) packaging. This was
used way back on the 286 processor in 1984, and it had gold lands around the edge only. (There were
far fewer pins back then.) In other ways, LGA is simply a modified version of ball grid array (BGA), with
gold lands replacing the solder balls, making it more suitable for socketed (rather than soldered)
applications. Socket LGA 775 is shown in the figure below.
The release lever on the left raises the load plate out of the way to permit the processor to be placed
over the contacts.
Socket LGA 1156 (also known as Socket H) was introduced in September 2009 and was designed to
support Intel Core ix-series processors featuring an integrated chipset northbridge, including a dual-
channel DDR3 memory controller and optional integrated graphics. Socket LGA 1156 uses a land grid
array format, so the pins are on the socket, rather than the processor. Socket LGA 1156 is shown in the
figure below.
Because the processor includes the chipset northbridge, Socket LGA 1156 is designed to interface
between a processor and a Platform Controller Hub (PCH), which is the new name used for the
southbridge component in supporting 5x series chipsets. The LGA 1156 interface includes the following:
PCI Express x16 v2.0For connection to either a single PCIe x16 slot, or two PCIe x8 slots
supporting video cards.
DMI (Direct Media Interface)For data transfer between the processor and the PCH. DMI in this
case is essentially a modified PCI Express x4 v2.0 connection, with a bandwidth of 2 GB/s.
DDR3 dual-channelFor direct connection between the memory controller integrated into the
processor and DDR3 SDRAM modules in a dual-channel configuration.
FDI (Flexible Display Interface)For the transfer of digital display data between the (optional)
processor integrated graphics and the PCH.
When processors with integrated graphics are used, the Flexible Display Interface carries digital display
data from the GPU in the processor to the display interface circuitry in the PCH. Depending on the
motherboard, the display interface can support DisplayPort, High Definition Multimedia Interface
(HDMI), Digital Visual Interface (DVI), or Video Graphics Array (VGA) connectors.
Socket LGA 1366 (also known as Socket B) was introduced in November 2008 to support high-end Intel
Core i7-series processors, including an integrated triple-channel DDR3 memory controller, but which
also requires an external chipset northbridge, in this case called an I/O Hub (IOH). Socket LGA 1366
uses a land grid array format, so the pins are on the socket, rather than the processor. Socket LGA
1366 is shown in the figure below.
Socket LGA 1366 is designed to interface between a processor and an IOH, which is the new name used
for the northbridge component in supporting 5x-series chipsets. The LGA 1366 interface includes the
following:
QPI (Quick Path Interconnect)For data transfer between the processor and the IOH. QPI
transfers two bytes per cycle at either 4.8 or 6.4 GT/s, resulting in a bandwidth of 9.6 or 12.8 GB/s.
DDR3 triple-channelFor direct connection between the memory controller integrated into the
processor and DDR3 SDRAM modules in a triple-channel configuration.
LGA 1366 is designed for high-end PC, workstation, or server use. It supports configurations with
multiple processors.
Socket LGA 1155 (also known as Socket H2) was introduced in January 2011 to support Intels Sandy
Bridge (second-generation) Core ix-series processors, which now include Turbo Boost overclocking.
Socket LGA 1155 uses a land grid array format, so the pins are on the socket, rather than the
processor. Socket LGA 1155 uses the same cover plate as Socket 1156, but is not interchangeable with
it. Socket LGA 1155 is also used by Intels Ivy Bridge (third-generation) Core ix-series processors. LGA
1155 supports up to 16 PCIe 3.0 lanes and eight PCIe 2.0 lanes.
Socket LGA 2011 was introduced in November 2011 to support high-performance versions of Intels
Sandy Bridge (second-generation) Core ix-series processors (Sandy Bridge-E), which now include Turbo
Boost overclocking. LGA 2011 supports 40 PCIe 3.0 lanes, quad-channel memory addressing, and fully-
unlocked processor multipliers.
Socket LGA 2011 uses a land grid array format, so the pins are on the socket, rather than the
processor. Socket LGA 2011 is shown in the figure below.
AMD Sockets:
Socket AM2/AM2+/AM3/AM3+
In May 2006, AMD introduced processors that use a new socket, called Socket AM2 (see figure below).
AM2 was the first replacement for the confusing array of Socket 754, Socket 939, and Socket 940 form
factors for the Athlon 64, Athlon 64 FX, and Athlon 64 X2 processors.
Socket AM2/AM2+: The arrow (triangle) at the lower left indicates pin 1.
Although Socket AM2 contains 940 pinsthe same number that Socket 940 usesSocket AM2 is
designed to support the integrated dual-channel DDR2 memory controllers that were added to the
Athlon 64 and Opteron processor families in 2006. Processors designed for Sockets 754, 939, and 940
include DDR memory controllers and are not pin compatible with Socket AM2. Sockets 939, 940, and
AM2 support HyperTransport v2.0, which limits most processors to a 1 GHz FSB.
Socket AM2+ is an upgrade to Socket AM2 that was released in November 2007. Although Sockets AM2
and AM2+ are physically the same, Socket AM2+ adds support for split power planes and
HyperTransport 3.0, allowing for FSB speeds of up to 2.6 GHz. Socket AM2+ chips are backward
compatible with Socket AM2 motherboards, but only at reduced HyperTransport 2.0 FSB speeds. Socket
AM2 processors can technically work in Socket AM2+ motherboards; however, this also requires BIOS
support, which is not present in all motherboards.
Socket AM3 was introduced in February 2009, primarily to support processors with integrated DDR3
memory controllers such as the Phenom II. Besides adding support for DDR3 memory, Socket AM3 has
941 pins in a modified key pin configuration that physically prevents Socket AM2 or AM2+ processors
from being inserted (see figure below).
Socket AM3: The arrow (triangle) at the lower left indicates pin 1.
Socket AM3+ is a modified version of AM3 designed for the new Bulldozer processors. It has 938 pins,
and also supports processors made for AM3 sockets. The table below shows the essential differences
between Socket AM2, AM2+, AM3, and AM3+:
Here is a summary of the compatibility between AM2, AM2+, AM3, and AM3+ processors and
motherboards:
You cannot install Socket AM2 or AM2+ processors in Socket AM3 motherboards.
You can install Socket AM3 or AM2+ processors in Socket AM2 motherboards; however, the BIOS
must support the processor, the FSB will run at lower HT 2.0 speeds, and only DDR2 memory is
supported.
You can install Socket AM3 processors in Socket AM2+ motherboards, but the BIOS must support
the processor, and only DDR2 memory is supported.
You can install Socket AM3 processors in Socket AM3+ motherboards, but the BIOS must support
the processor.
Although you can physically install newer processors in motherboards with older sockets, and they
should theoretically work with reductions in bus speeds and memory support, this also requires BIOS
support in the specific motherboard, which may be lacking. In general, you are best off matching the
processor to a motherboard with the same type of socket.
Socket F (1207FX)
Socket F (also called 1207FX) was introduced by AMD in August 2006 for its Opteron line of server
processors. Socket F is AMDs first land grid array (LGA) socket, similar to Intels Socket LGA 775. It
features 1207 pins in a 35-by-35 grid, with the pins in the socket instead of on the processor. Socket F
normally appears on motherboards in pairs because it is designed to run dual physical processors on a
single motherboard. Socket F was utilized by AMD for its Quad FX processors, which are dual-core
processors sold in matched pairs, operating as a dual socket dual-core system. Future versions may
support quad-core processors, for a total of eight cores in the system. Due to the high expense of
running dual physical processors, only a limited number of nonserver motherboards are available with
Socket F.
Socket FM1
Socket FM1 was introduced by AMD in July 2011 for use by accelerated processing units (APUs CPU
plus GPU) and CPUs based on the Llano core. These include the Ax-3xxx series APUs and some Athlon II
CPUs, as well as the E2-3200 APU. FM1 has 905 pins in a 31-by-31 grid and uses a PGA socket similar
to those used by previous AMD processors. Socket FM1 supports DDR3 memory. It was replaced by
Socket FM2.
Socket FM2
Socket FM1 was introduced by AMD in September 2012 for use by its Trinity series of APUs. These
include the Ax-5xxx series APUs. FM2 has 904 pins in a 3131 grid and uses a PGA socket similar to
those used by previous AMD processors. Socket FM2 supports DDR3 memory. The figure below
illustrates Socket FM2: