PCB FABRICATION SPECIFICATION

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 PCB FABRICATION SPECIFICATION

1. PURPOSE ...........................................................................................................................................................4

2. SCOPE ................................................................................................................................................................4

3. APPLICABLE DEPARTMENTS.....................................................................................................................4

4. RESPONSIBILITIES ........................................................................................................................................4
4.1. SUPPLIER .....................................................................................................................................................4
4.2. COMPANY.......................................................................................................... 





5. APPROVAL LIST .............................................................................................................................................5
5.1. REQUIRED APPROVAL .................................................................................................................................5
6. ASSOCIATED DOCUMENTS .........................................................................................................................6
6.1. APPLICABLE SPECIFICATIONS ......................................................................................................................6
7. ORDER OF PRECEDENCE ............................................................................................................................6
7.1. ORDER OF PRECEDENCE ..............................................................................................................................6
8. CAD DATA .........................................................................................................................................................8
8.1. TOOLING VERIFICATION ...............................................................................................................................8
9. DIMENSIONAL REQUIREMENTS ...............................................................................................................8
9.1. PCB DRAWING ............................................................................................................................................8
9.2. HOLE LOCATION ..........................................................................................................................................8
9.3. HOLE SIZES .................................................................................................................................................8
10. TOOLING MODIFICATION ......................................................................................................................8
10.1. ACTIVE PADS & TEST POINTS ......................................................................................................................8
10.2. VIAS ............................................................................................................................................................8
10.3. COPPER FEATURES ......................................................................................................................................9
10.4. SCORE VALIDATION FEATURE .....................................................................................................................9
11. PRINTED CIRCUIT BOARD REQUIREMENTS ..................................................................................10
11.1. WORKMANSHIP .........................................................................................................................................10
11.2. CONTROLLED IMPEDANCE DESIGNS ..........................................................................................................10
11.3. PHYSICAL CONSTRUCTION ........................................................................................................................11
12. MATERIALS ...............................................................................................................................................12
12.1. LAMINATE .................................................................................................................................................12
12.2. LAMINATE MATERIALS REQUIRE ................................................................................................................12
12.3. MATERIAL CLASSIFICATIONS (GENERIC DRAWING CALLOUTS) .................................................................12
12.4. APPROVED ROHS MATERIALS ..................................................................................................................13
12.5. GENERIC TEMPERATURE SPECIFICATIONS FOR THE RAW MATERIAL USED .................................................13
12.6. COPPER FOIL .............................................................................................................................................13
12.7. COPPER PURITY .........................................................................................................................................13
12.8. LAMINATE IMPERFECTIONS .......................................................................................................................13
12.9. COPPER ADHESION ....................................................................................................................................13
13. COPPER PLATING REQUIREMENTS ..................................................................................................13
13.1. PLATED THROUGH HOLES .........................................................................................................................13
13.2. ANNULAR RING .........................................................................................................................................13

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 PCB FABRICATION SPECIFICATION
14. SURFACE FINISHES.................................................................................................................................14
14.1. GENERAL GUIDELINES ...............................................................................................................................14
14.2. SHELF LIFE REQUIREMENTS ......................................................................................................................14
14.3. ORGANIC SOLDERABILITY PRESERVATIVE.................................................................................................14
14.4. IMMERSION WHITE TIN .............................................................................................................................14
14.5. IMMERSION SILVER ........................................................................................... 





14.6. ELECTROLESS NICKEL / IMMERSION GOLD, (ENIG) .................................................................................14
14.7. HOT AIR SOLDER LEVEL (HASL) ..............................................................................................................14
14.8. ACCEPTABLE SURFACE FINISH DEPOSITION GUIDELINES...........................................................................14
14.9. NICKEL/GOLD ELECTROPLATING ...............................................................................................................15
15. SOLDER MASK .........................................................................................................................................15
15.1. SMOBC ....................................................................................................................................................15
15.2. REWORK....................................................................................................................................................15
15.3. ADHESION .................................................................................................................................................15
16. PCB LEGEND AND MARKINGS ............................................................................................................16
16.1. NOMENCLATURE .......................................................................................................................................16
16.2. MODIFICATIONS.........................................................................................................................................16
16.3. OTHER INK-MARKINGS .............................................................................................................................16
16.4. SOURCE IDENTIFICATION AND PRODUCT DATE CODE.................................................................................16
16.5. UL MARKING ............................................................................................................................................17
17. BARE BOARD ELECTRICAL TEST ......................................................................................................17
17.1. ELECTRICAL TEST .....................................................................................................................................17
17.2. NOTIFICATION ...........................................................................................................................................17
17.3. CIRCUIT REPAIRS (OPEN CIRCUIT).............................................................................................................17
17.4. CIRCUIT REPAIRS (SHORT CIRCUIT)...........................................................................................................17
18. SOLDERABILITY ......................................................................................................................................18
18.1. CONTROLLING DOCUMENT ........................................................................................................................18
18.2. SOLDER SAMPLES ......................................................................................................................................18
19. PACKAGING FOR SHIPMENT...............................................................................................................18
19.1. PREPARATION FOR PACKAGING..................................................................................................................18
19.2. PACKAGING ...............................................................................................................................................18
19.3. CARDBOARD BOXES ..................................................................................................................................18
19.4. CONTAINER IDENTIFICATION LABELS ........................................................................................................18
20. V-SCORE .....................................................................................................................................................19

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 PCB FABRICATION SPECIFICATION

1. PURPOSE
This document, in conjunction with the fabrication drawing establishes and defines materials,
process and quality requirements for Printed Circuit Boards (PCB) purchased by Company.

2. SCOPE
This document describes the requirements for single sided, double sided and multi-layer Printed
Circuit Boards configured for through hole, surface mount and mixed technologies.

3. APPLICABLE DEPARTMENTS
Controlled copies of this document must be made available to the following:
1. Printed Circuit Board Fabrication Suppliers
2. Purchasing
3. Engineering
4. Engineering Services
5. Manufacturing
6. Receiving

4. RESPONSIBILITIES
4.1. Supplier
4.1.1. It is the responsibility of the supplier to maintain the latest revision of
all documents and specifications referenced in this document
4.1.2. It is the responsibility of the supplier to verify the tooling data matches
the part number and revision of the PCB requested on the purchase
order.
4.1.3. It is the responsibility of the supplier to notify Company of any
significant process or material change in the fabrication of a given part
number.
4.1.3.1. A significant process change is one that may affect the final quality
of the assembled product or impact current assembly methods or
functionality.. In the event of such a change:
4.1.3.2. Company will require sample product for testing and evaluation. The
testing of the new product must occur before production lots will be
accepted.
4.1.3.3. Changing the fabrication facility for a given part number is a
significant process change

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4.1.4. It is the responsibility of the supplier to provide arrays that are 100%
tested. X outs are not acceptable unless specifically requested on the
purchase order.
4.2. Company

5. APPROVAL LIST
5.1. Required Approval
1. PCB Design Manager
2. New Technology Program Manager
3. Supplier Quality Engineer
4. PCB Commodity Manager
5. Component Engineer / Supplier Quality Engineer

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 PCB FABRICATION SPECIFICATION

6. ASSOCIATED DOCUMENTS
6.1. Applicable Specifications
6.1.1. Where specific acceptability criteria are not provided, the requirements
of IPC-A-600 and IPC6012 Class2, will apply.
6.1.2. All PCBs regardless of technology are required to meet the SMT IPC-
2221 Bow and Twist Specification stated in section 5.2.4.
6.1.3. Test methods are defined in IPC-TM-650
6.1.4. Flex Circuits are to meet the requirements of IPC-6013

Document Description
ANIPC-2221 Design Standards for Rigid Printed Boards and Printed Board Assemblies
IPC-6012 Qualification and Performance Specification for Rigid Printed Boards
ICP-6013 Qualification and Performance Specification for Flexible Printed Boards
ANSI/IPC-D-2615 Printed Board Dimensions and Tolerances
ANSI/IPC-A-600 Acceptability of Printed Boards
ANSI/J-STD-003 Solderability Tests for Printed Boards
ANSI/IPC-SM-840 Qualification and Performance of Permanent Polymer Coating (Solder
Mask) for Printed Boards
IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic
Circuits
IPC-TM-650 Test Methods Manual

7. ORDER OF PRECEDENCE
7.1. Order of Precedence
7.1.1. The requirements of this specification may be superseded by
requirements of the PCB fabrication drawing. In case of conflict, the
following order of precedence shall apply: e.g. the purchase order
would supersede the PCB Drawing.
1. The Purchase Order
2. The PCB Drawing (see exception for v-score, section 20)
3. This Specification
4. Referenced Documents

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PCB FABRICATION SPECIFICATION

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8. CAD DATA
8.1. Tooling verification
8.1.1. It is the suppliers responsibility to complete a design rule check of all
tooling data from Company. In the event of a discrepancy the PCB
Design Manager and the PCB Designer are to be notified.
8.1.2. The supplier is required to build the PCB to the provided tooling
package. Only in extreme situations will a deviation be granted. All
requests for a deviation must include the PCB Designer and notification
of the PCB Design Manager.
8.1.3. Design Data is under part number and revision control. A revision
change may affect a single tooling file or multiple tooling files.
Typically revision changes are allowed for silkscreen, soldermask or
clerical drawing changes. In each of these cases only the changed files
will show the new revision number.

9. DIMENSIONAL REQUIREMENTS
9.1. PCB Drawing
9.1.1. The PCB Drawing is the controlling document regarding dimensional
information and construction of the PCB.
9.2. Hole Location
9.2.1. Except where specified by the PCB drawing, hole centerline location, as
referenced to the primary index hole shall be within .005 RFS
(Regardless of Feature Size).
9.2.2. Tooling hole registration shall be held to within +.002/-.000 in size and
+/- .003 in location in the x and y directions.
9.3. Hole Sizes
9.3.1. Drilled holes are to be in compliance with the finished hole size
as specified on the PCB drawing and within the tolerances indicated.

10. TOOLING MODIFICATION

10.1. Active Pads & Test points
10.1.1. It is permissible to modify the soldermask openings to allow for a
.002 minimum relief on active copper pads. Exposed copper on
adjacent conductors is not permitted.
10.2. Vias
10.2.1. The soldermask relief for vias is to relieve only the finished hole. The
soldermask opening should be .002 larger that the finished hole
diameter. Latent or residual soldermask in vias is acceptable

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10.2.2. Tented vias are not allowed. If the provided CAD tooling has tented
vias the vendor is to add an opening equal to the drill size +.002 per
side.
10.3. Copper Features
10.3.1. Changes to the intended routing or connectivity of provided circuit
layer tooling are not permitted.
10.3.2. Minimal width modifications to allow for normal processes are
permitted.
10.3.3. Tear dropping is permitted to meet the annular ring requirement or to
improve yields due to other fabrication processes All added copper
must meet the minimal spacing requirement
10.3.4. Tear dropping is recommended for Immersion silver to mitigate acid
entrapment at the soldermask trace junction
10.3.5. Copper may be added to non functional breakaways tabs. It is not
permissible to add copper for balance or thieving purposes within the
functional area of the PCB
10.4. Score Validation Feature
10.4.1. The score validation feature is a copper feature added to the scrap area
of the array to allow for the verification of the existence of a score line.
10.4.2. The score validation feature is to be placed on the scrap area of a
printed circuit board array.
10.4.3. The score validation feature may be placed on the finished PCB if and
only if it clears all other copper by .250

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11. PRINTED CIRCUIT BOARD REQUIREMENTS

11.1. Workmanship
11.1.1. Workmanship shall be of a level as to indicate controlled conditions of
manufacture such that subsequent assembly operations, board
functionality, and performance are not degraded. Gross cosmetic
imperfections are not acceptable. Gross cosmetic imperfections are
those that readily stand out without special lighting, magnification, or
positioning of the product.
11.2. Controlled Impedance Designs
11.2.1. The PCB Drawing will indicate when a design has impedance
requirements and will typically document the initial recommended
construction. The requested impedance value typically takes priority
over the recommended physical construction. In some cases the

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physical construction will take priority and it will be noted as such on

the drawing.
11.2.2. TDR tested products require the TDR report to accompany the order
and test coupons to be retained by the vendor for 12 months.
11.2.3. Non Impedance Controlled PCBs are to maintain a consistent
construction as to allow for similar impedance on all lots of product
11.3. Physical Construction
11.3.1. The physical construction of a PCB is noted on newer PCB drawings
and is intended as a guideline for construction. Final construction
variation is allowed such that the characteristic impedance of the design
is not significantly changed.

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12. MATERIALS
12.1. Laminate
12.1.1. Unless otherwise specified, Laminate material shall be reinforced epoxy that meets NEMA FR-4 grade
requirements and Underwriters Laboratory 94V-0 flammability requirements.
12.2. Laminate materials require
12.2.1. UL recognized PCB having a UL designated CTI of >175 or PLC </=3 per the UL recognized Component
Directory
12.2.2. An Electric strength >/=750V/MIL (Tested in Air)

12.3. Material Classifications (Generic Drawing Callouts)

Z-Axis Tg Min.
Dk Td Min. Anti-
Laminate Classification Dk Min CTE Celsius
Max Celsius CAF
Max. (DSC)
Low Temp FR4 4.3 4.6 4.20% 130 310 No
Hi Temp FR4 4.3 4.6 3.50% 170 310 No
High Speed/Low Loss 3.5 3.8 3.80% 170 310 No
RoHS Assembly Capable 4.2 4.6 3.30% 175 345 Yes
High Speed / Low Loss / RoHS capable 3.5 3.8 3.30% 175 345 Yes
Halogen-Free 3.8 4.9 3.30% 140 310 Yes
Halogen-Free/RoHs Capable 3.8 4.9 3.30% 175 345 Yes
 PCB FABRICATION SPECIFICATION

12.4. Approved RoHS Materials

12.5. Generic Temperature specifications for the raw material used
12.5.1. PCBs of 4 or more layers are to be fabricated using 170C Tg
materials with an maximum continuous operating temperature equal to
or greater than 130C
12.5.2. 2 layer PCBs are to be fabricated with the highest temperature laminate
that does not incur addition cost and no less than 130 C.
12.6. Copper Foil
12.6.1. Copper foil weight shall be 1 ounce per square foot. Fine line PCBs
with trace width < .006 may be ounce copper foil per square foot.
12.6.2. Symmetrical construction with regard to stacking of conducting and
dielectric layers shall be used so as to minimize the likelihood of
warpage in subsequent processing.
12.7. Copper purity
12.7.1. Copper Purity shall be 99.5% or better per IPC-6012, section 3.5.8.3.
12.8. Laminate Imperfections
12.8.1. Allowable laminate imperfections shall be per IPC-6012, section 3.6.2.
12.9. Copper Adhesion
12.9.1. Copper adhesion shall meet requirements of IPC-TM-650, test 2.4.8.1
Peel Strength, Metal Foil.

13. COPPER PLATING REQUIREMENTS

13.1. Plated Through Holes
13.1.1. All plated through holes shall have an average wall thickness of .001
inches and a minimum wall thickness of .0008 inches of copper.
13.1.2. Integrity of plated through holes before and after thermal stress shall be
per IPC-6012
13.2. Annular Ring
13.2.1. The minimum internal and external annular ring requirements shall be
per IPC-2221, Class 2. Breakout is not allowed.
13.2.2. Via holes shall have a minimum annular ring of .001 and .002 at the
trace egress. Breakout is not allowed.
13.2.3. It is the suppliers responsibility to inform Company Purchasing
Department of any potential problems associated with meeting annular
ring requirements prior to board fabrication.

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14. SURFACE FINISHES

14.1. General Guidelines
14.1.1. OSP may be reapplied one time with prior approval from Company.
14.1.2. Re-coated boards are to be marked with the Letters RC stamped on the
PCB in permanent ink.
14.1.3. PCBs requiring the reapplication of surface finish are to be recoated
within one week of shipment to Company.
14.1.4. Only products covered by the Company agreement are to be re-coated.
It is the suppliers responsibility to manage product not under the
agreement such that it never exceeds the shelf life limit.
14.2. Shelf Life Requirements
14.2.1. When stored in a controlled environment and in the original packaging
the following table contains shelf life requirements.

Surface Finish Shelf life requirements based on Date code

OSP 12 months
ENIG 12 months
HASL 12 months

14.3. Organic Solderability Preservative

14.3.1. OSP is to be Entek XXX or equivalent.
14.4. Immersion White Tin
14.4.1. Immersion White tin is not an acceptable surface finish.
14.5. Electroless Nickel / Immersion Gold, (ENIG)
14.5.1. ENIG is an acceptable surface finish
14.6. Hot Air Solder Level (HASL)
14.6.1. PCBs shall be HASL unless otherwise specified on the PCB drawing
or purchase order.
14.7. Acceptable Surface Finish Deposition Guidelines

Surface Finish Acceptable Thickness Guideline

OSP 8-20 micro inches 0.2 - 0.5 microns
ENIG IPC-4552

HASL .000050 inch and a maximum of .0015 inch.

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14.8. Nickel/Gold Electroplating

14.8.1. When specified on the PCB drawing, contact fingers shall be plated
with .000030 inches minimum hard gold over .000100 inch minimum
low stress nickel plating. Gold plated finish shall be free of pits, dents,
scratches and exposed underplate or basis metal. The finish shall not
show evidence of burning (brown shades of bath contamination) or
excessive edge build-up. Plating discontinuity at the juncture of gold
and either solder or solder mask which exposes bare copper is not
acceptable.

15. SOLDER MASK

15.1. SMOBC
15.1.1. PCBs shall be solder mask over bare copper unless otherwise
specified on the PCB drawing.
15.1.2. Solder mask is to be a green liquid photoimageable type and semi-
gloss in appearance.
15.1.3. Solder mask is to comply with ANSI/IPC-SM-840, Class 2.
15.2. Rework
15.2.1. Touch up of solder mask is acceptable if not excessive and if the
application is uniform and neat in appearance.
15.2.2. The cured solder mask shall not be stripped or removed without
specific authorization from Company.
15.3. Adhesion
15.3.1. IPC-TM-650 shall be used for evaluating adhesion of solder mask with
the following exceptions:
15.3.2. A sample of several PCBs from the lot to be delivered may be utilized
in lieu of a checkerboard pattern
15.3.3. Normal wave soldering or reflow soldering may be utilized in lieu of
other soldering methods specified in ANSI/J-STD-003.
15.3.4. 3M type 610 tape may be used instead of type 600.

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16. PCB LEGEND AND MARKINGS

16.1. Nomenclature
16.1.1. Reference designators and PCB nomenclature shall use permanent non-
conductive solvent resistant RoHS compliant material.
16.1.2. Legend shall be legible and sharply defined per ANSI/IPC-A-600 Class
2.
16.1.3. It is the vendors responsibility to ensure legend is not removed from
via pads. Relief of legend .002 from via holes is permissible
16.1.4. If legend is defined on active pads it is the responsibility of the CAM
department to contact Company PCB Design for corrected Tooling
16.1.5. Legend shall be RoHS compliant
16.2. Modifications
16.2.1. The MADE IN USA has been removed from new designs and replaced
with a box containing the word COUNTRY. Do not modify this text.
16.2.2. When country of origin is required for a design fabricated outside of
the United States it is permissible to add text to the legend.
16.2.3. The preferred text is PCB MADE IN country. Eg. PCB MADE IN
CHINA
16.2.4. The preferred location is in a non functional breakaway area. Alternate
location would be on the back side under a component.
16.2.5. The text should be as small as possible.
16.3. Other Ink-Markings
16.3.1. All required markings shall be sharply defined and fully legible. All
markings shall be resistant to normal cleaning solvents.
16.3.2. Ink markings shall be white in color.
16.4. Source Identification and Product date code
16.4.1. Suppliers identification (etched in copper preferred) shall appear in
each Printed Circuit Board and shall remain visible after assembly of
board is complete.
16.4.2. The Source Identification marking must be on the actual PCB.
Breakaway tabs are not an acceptable location
16.4.3. A 4 digit date code and the vendor logo are to be placed in the area
specified on the PCB drawing within the active PCB. Placing the Logo
and date code on the breakaway tab is not permitted.
16.4.4. The date code format is 4 digits where the first two digits are the week
and the second two digits are the year.
e.g. 0105 = week 1 of 2005 5205 = week 52 of 2005

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16.5. UL Marking
16.5.1. The suppliers UL signature, as defined in the UL Recognized
Component Directory shall be present on each Printed Circuit Board
and shall remain legible after assembly of board is complete.

17. BARE BOARD ELECTRICAL TEST

17.1. Electrical Test
17.1.1. All PCBs require 100% netlist testing unless otherwise specified on
the Purchase Order.
17.1.2. .030 round test points shall be tested as net endpoints
17.2. Notification
17.2.1. Supplier shall notify Company of marking system used to identify
PCBs passing electrical test.
17.3. Circuit Repairs (Open Circuit)
17.3.1. Open circuits may be repaired using an approved welding technique if
the following requirements are met.
17.3.2. Trace repairs are not permitted on controlled impedance designs
requiring TDR testing..
17.3.3. The weld is a continuous straight line
17.3.4. The weld dimension in width and thickness are consistent with the
design.
17.3.5. Post repair soldermask touchup shall meet the requirements of 15.2.1
17.3.6. A maximum of 2 welds per side are permitted
17.4. Circuit Repairs (Short Circuit)
17.4.1. Shorted circuits may be repaired by removing the material joining the
circuits provided the following requirements are met
17.4.2. The offending material is removed cleanly and completely without
damaging the original traces
17.4.3. Trace width and space requirements are maintained
17.4.4. TDR testing requirements are met
17.4.5. Soldermask touch-up meets the requirements of 15.2.1

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18. SOLDERABILITY
18.1. Controlling Document
18.1.1. PCB solderability testing shall be per ANSI/J-STD-003
18.2. Solder Samples
18.2.1. Two Solder Samples are required on the first order of any part number.

19. PACKAGING FOR SHIPMENT

19.1. Preparation for packaging
19.1.1. Prior to packaging, all boards shall be suitably cleaned to remove all
processing materials including etchants, machining dust, plating salts,
oils, fluxes, etc.
19.2. Packaging
19.2.1. Shrink wrap is the preferred method of packaging.
19.2.2. Boards or arrays shall be bundled in stacks of ten preferred to a
maximum of 25 unless otherwise specified on the purchase order.
19.2.3. PCBs less than .030 thick shall be packaged with stiffening material
on the top and bottom of the bundle
19.2.4. Each bundle of PCBs will be identified with the part number and date
Code. Shipments shall be separated by date code.
19.2.5. Silver saver paper is to be used for all immersion silver products.
19.3. Cardboard Boxes
19.3.1. Corrugated cardboard boxes (sulfur free) will be used as bulk
containers for bagged boards. Loaded boxes must not weigh more than
25 30 pounds.
19.4. Container Identification Labels
19.4.1. The identification label that a supplier is required to affix to the
shipping containers will be as outlined in Company Labeling
Requirements

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20. V-SCORE

20.1.1. The V score for .062 PCBs is .015 +/- .003

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