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Application Note
Philips Semiconductors Application information
SUMMARY
Description of products
BGA2001: RF transistor with internal bias circuit. Benefit is lower component count, internal compensation for
temperature and current gain spread.
Application Area
Low noise amplifiers for systems like GSM, DECT, DCS with low component count.
Presented Applications
The applications present low noise amplifiers at 900 and 1800 MHz at 3 V supply voltage and 4.4 mA supply current
with matching components.
Main results
An amplifier has been designed and tested with 16.6 dB gain, IIP3 = 7.4 dBm, VSWRin = 2.0, VSWRout = 2.1,
1.65 dB Noise Figure at 900 MHz, 3 V and 4.4 mA supply.
An amplifier has been designed and tested with 13 dB gain, IIP3 = 4.5 dBm, VSWRin = 1.3, VSWRout = 1.2,
1.6 dB Noise Figure at 1800 MHz, 3 V and 4.4 mA supply.
1999 Feb 16 2
Philips Semiconductors Application information
handbook, halfpage Rd
Vp-Out
Q3
Rb
In
C1 Rc
Q2 Ra Q5
Q4 C2
Q1 GND1
GND2
MGR975
Q5 is the main RF transistor. Q4 forms a current mirror with Q5. The input current of this current mirror is determined by
the voltage on node Vp-Out and resistors Ra, Rb and Rd. The voltage derived of Vp-Out is stabilised by three stacked
diodes made with transistors Q1, Q2 and Q3. R3 and C2 decouple the bias circuit from the RF input signal and C1
decouples the bias circuit from the RF output signal. On the Printed Circuit Board (PCB) an additional emitter inductance
of about 0.8 nH was added, which is beneficial for achieving good noise match, for stability and easier impedance match.
This inductance was made with a stripline (length 1 mm and width 0.5 mm).
Remarks
The input match on the 900 MHz application is not very good and can be improved by a larger emitter inductance, which
reduces gain and increases the risk of instability. According to simulation the input and output match can be improved
without these disadvantages by using an extra inductance in series with the input capacitor in the order of magnitude of
12 nH. This inductance can be also made by a stripline on the PCB, which is preventing the use of an extra relatively
expensive component.
The PCB used for these application examples was designed for the BGA2003, which is the reason for the unused
component position on the board. With the BGA2003 this is a control input, and with the BGA2001 this is the GND2 pin.
This pin is not connected, only GND1 is connected to the circuit ground via a stripline.
The components used are equal as used in report RNR-T45-98-0260. The difference in the used MMIC BGA2001 is
made with the final diffusion process. Comparing this report with the new results on both 900 and 1800 MHz show a
minor degradation in input and output match, but improvement in gain and noise performance.
1999 Feb 16 3
Philips Semiconductors Application information
handbook, halfpage
Vsupply
R1
Vsupply
Lout C1
Vp-Out 50 C1 R1
Cout output
Lout
OUT
BIAS
a IN Cout
CIRCUIT
50 In MMIC
Cin BGA2001
input b
Cin s1:
c
Gnd2 Gnd1
f d
s1
e
MGR973
MGR974
Table 1 Used components for the BGA2001, 900 MHz version of the demoboard
Note
1. IIP3 measured at 28 dBm input level, f = 200 kHz.
1999 Feb 16 4
Philips Semiconductors Application information
Note
1. IIP3 measured at 25 dBm input level, f = 200 kHz.
1999 Feb 16 5
Philips Semiconductors Application information
NOTES
1999 Feb 16 6
Philips Semiconductors Application information
NOTES
1999 Feb 16 7
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Printed in The Netherlands 125006/3100/01/pp8 Date of release: 1999 Feb 16 Document order number: 9397 nnn nnnnn