Académique Documents
Professionnel Documents
Culture Documents
DATA SHEET
FEATURES PINNING
Low current (max. 100 mA) PIN DESCRIPTION
Low voltage (max. 65 V). 1 base
2 emitter
APPLICATIONS 3 collector
General purpose switching and amplification.
DESCRIPTION
NPN transistor in a SOT23 plastic package.
PNP complements: BC856, BC857 and BC858.
handbook, halfpage
3
3
MARKING
BC846 1D*
2
BC846A 1A* 1 2
BC846B 1B* Top view MAM255
BC847 1H*
BC847A 1E*
BC847B 1F*
BC847C 1G* Fig.1 Simplified outline (SOT23) and symbol.
BC848B 1K*
Note
1. * = p: made in Hong Kong.
* = t: made in Malaysia.
* = W: made in China.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME DESCRIPTION VERSION
BC846 plastic surface mounted package; 3 leads SOT23
BC846A
BC846B
BC847
BC847A
BC847B
BC847C
BC848B
2004 Feb 06 2
Philips Semiconductors Product specification
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter
BC846 80 V
BC847 50 V
BC848 30 V
VCEO collector-emitter voltage open base
BC846 65 V
BC847 45 V
BC848 30 V
VEBO emitter-base voltage open collector
BC846; BC847 6 V
BC848 5 V
IC collector current (DC) 100 mA
ICM peak collector current 200 mA
IBM peak base current 200 mA
Ptot total power dissipation Tamb 25 C; note 1 250 mW
Tstg storage temperature 65 +150 C
Tj junction temperature 150 C
Tamb operating ambient temperature 65 +150 C
Note
1. Transistor mounted on an FR4 printed-circuit board, standard footprint.
THERMAL CHARACTERISTICS
Note
1. Transistor mounted on an FR4 printed-circuit board, standard footprint.
2004 Feb 06 3
Philips Semiconductors Product specification
CHARACTERISTICS
Tamb = 25 C; unless otherwise specified.
Note
1. Pulse test: tp 300 s; 0.02.
2004 Feb 06 4
Philips Semiconductors Product specification
MGT723 MGT724
400 1200
handbook, halfpage handbook,
V halfpage
BE
hFE (mV)
1000
(1)
300
(1)
800
(2)
(2)
200 600
(3)
400
(3)
100
200
0 0
101 1 10 102 103 101 1 10 102 103
I C (mA) I C (mA)
MGT725 MGT726
103 1200
handbook, halfpage handbook, halfpage
VBEsat
VCEsat (mV)
(mV) 1000
(1)
800
(2)
102 600
(1)
(3)
(2)
400
(3)
200
10 0
101 1 10 102 103 101 1 10 102 103
I C (mA) I C (mA)
2004 Feb 06 5
Philips Semiconductors Product specification
MGT727 MGT728
600 1200
handbook, halfpage handbook, halfpage
hFE VBE
(mV)
500 (1) 1000
(1)
400 800
(2) (2)
300 600
(3)
200 400
(3)
100 200
0 0
101 1 10 102 103 102 101 1 10 102 103
I C (mA) I C (mA)
MGT729 MGT730
104 1200
handbook, halfpage handbook, halfpage
VBEsat
VCEsat (mV)
(mV) 1000
(1)
103 800
(2)
600
(3)
102 400
(1)
10 0
101 1 10 102 103 101 1 10 102 103
I C (mA) I C (mA)
2004 Feb 06 6
Philips Semiconductors Product specification
MGT731 MGT732
1200 1200
handbook, halfpage handbook, halfpage
hFE VBE
(mV)
1000 1000
(1)
(1)
800 800
(2)
(2)
600 600
200 200
0 0
101 1 10 102 103 102 101 1 10 102 103
I C (mA) I C (mA)
MGT733 MGT734
104 1200
handbook, halfpage handbook, halfpage
VBEsat
VCEsat (mV)
(mV) 1000
(1)
103 800
(2)
600
(3)
102 400
(1)
200
(3) (2)
10 0
101 1 10 102 103 101 1 10 102 103
I C (mA) I C (mA)
2004 Feb 06 7
Philips Semiconductors Product specification
PACKAGE OUTLINE
D B E A X
HE v M A
A1
1 2 c
e1 bp w M B Lp
e
detail X
0 1 2 mm
scale
97-02-28
SOT23 TO-236AB
99-09-13
2004 Feb 06 8
Philips Semiconductors Product specification
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS DISCLAIMERS
Short-form specification The data in a short-form Life support applications These products are not
specification is extracted from a full data sheet with the designed for use in life support appliances, devices, or
same type number and title. For detailed information see systems where malfunction of these products can
the relevant data sheet or data handbook. reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
Limiting values definition Limiting values given are in
for use in such applications do so at their own risk and
accordance with the Absolute Maximum Rating System
agree to fully indemnify Philips Semiconductors for any
(IEC 60134). Stress above one or more of the limiting
damages resulting from such application.
values may cause permanent damage to the device.
These are stress ratings only and operation of the device Right to make changes Philips Semiconductors
at these or at any other conditions above those given in the reserves the right to make changes in the products -
Characteristics sections of the specification is not implied. including circuits, standard cells, and/or software -
Exposure to limiting values for extended periods may described or contained herein in order to improve design
affect device reliability. and/or performance. When the product is in full production
(status Production), relevant changes will be
Application information Applications that are
communicated via a Customer Product/Process Change
described herein for any of these products are for
Notification (CPCN). Philips Semiconductors assumes no
illustrative purposes only. Philips Semiconductors make
responsibility or liability for the use of any of these
no representation or warranty that such applications will be
products, conveys no licence or title under any patent,
suitable for the specified use without further testing or
copyright, or mask work right to these products, and
modification.
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2004 Feb 06 9
Philips Semiconductors a worldwide company
Contact information
Printed in The Netherlands R75/05/pp10 Date of release: 2004 Feb 06 Document order number: 9397 750 12395