Wave Soldering

April 9, 1999

University of Michigan
Dearborn

ECE 539

Spring 1999

Professor: J. Miller

Author:
Ayse B. Butler
 Introduction

Main topic
Wave soldering in PCB manufacturing
Types of wave soldering
Mini-wave process
Stencil-dip process
Pin transfer process

Samples of wave soldering equipment

Medium to high volume production
Econopack Plus
Features and benefits
Low to Medium volume production
Astrapak 400
Features and benefits
Future trends in wave soldering
45 degree wave soldering
YSM 890N Turbulent wave soldering machine
Features and Benefits
Nitrogen Atmosphere
CON2TOUR inert boundary soldering system
Features and Benefits

Conclusion

References
INTRODUCTION:

Soldering and cleaning falls under the process description Attachment Technology. These processes involve
physically forming the conductive bond that connects a component to a circuit. This is perhaps, the most critical
phase of circuit board assembly in that a failed or intermittent connection between the component and the board
dictates board failure. It is important, from a vendor point of view, to understand all the aspects of the technology to
manufacture state of the art equipment. The physical aspects, mechanical and thermal energy, and chemical
reactions must be understood, and the equipment must be engineered to endure the process economically and with
minimal downtime.

There are three different types of machines used in the production of circuit board assemblies: reflow soldering,
wave soldering, and cleaning. Specifically, these machines are used in the attachment of components to the circuit
board and the subsequent, post soldering removal of process chemicals and residues. A wide variety of machines
are available to accommodate low to high production volumes and different process requirements.

Reflow soldering process involves surface mounted components, whose lead sits on pads on the board. Typically, a
solder paste is applied to the pads which, when headed, will combine with the reflowed solder on the pads on the
board to form a joint. The reflow oven therefore, is a convection oven with tightly controlled temperature
parameters which will heat the board, spike the temperature to the point of reflowing the solder, then cool the
board.

Wave soldering is the most economical means of mass soldering leaded components into holes in a circuit board.
The board is conveyed over a flux station, then preheated, and finally passed over a wave of solder. There is a
large pot of molten solder which is pumped through one or more nozzles to form the wave. As the board skims over
the top of the wave, solder joints are formed between the components leads and the pads or plated trough holes of
the board.
Most wave soldering systems for PCBs have two waves. The first wave is the turbulent wave, used to scrub the
wettable surfaces, remove oxidation and solder all solderable areas. The second wave is the finishing wave, a
smooth wave to remove bridging and icicles.
The waves are perpendicular to board travel. The PCBs travel at an angle because it helps remove bridging when the
boards come out of finishing wave. The angle of the board travel does not have to be very drastic, the range is
usually from 3 to 6 degrees.

Depending on the type of flux used in the soldering process, the assembled board may need to be cleaned. In
military and high reliability applications, boards are almost always cleaned, as are boards which are to be used in
corrosive environments. Cleaning systems may be batch or in-line and may use plain water, water with additives or
semi-aqueous solvents. In accordance with the Montreal protocol, it is important that the cleaning process not use
any cholorofluorocarbons (CFC) in the wash chemistry.
TYPES OF WAVE SOLDERING:

Mini-Wave Process:

Molten solder is pumped upwards through a fountain shaped nozzle to the soldering joint. The overflow is directed
back down into the solder bath along all sides of the nozzle. The resulting contact surface of solder corresponds to
the dimensions of the individual solder joint.

The time of solder contact is selected so that the solder completely fills the thru-hole and a fillet connection occurs
on the topside of the circuit board. Multiple solder joints that are arranged in rows, as in the case of connectors, can
be processed in a passing fashion since the circuit board can be transported over the fountain wave in an x-y
direction. The environment around the solder emission point is maintained in an N2 atmosphere for reasons of
process integrity.

A suitable spray device selectively applies the flux so that only the joints to be soldered will have a reactive effect.
Activation of the flux by preheating is not selective, but affects the entire surface of the assembly. This prevents
deformation as well as heat dissipation to areas of the circuit board which were not preheated. The assembly is held
securely and positioned over the flux and solder stations by a CNC controlled, x-y transport system.

System configurations are available both in-line and off-line processes. Product changes are easy to make requiring
only the loading new program recipe. High flexibility such as automatic width adjustment, unrestricted
programming of coordinates and individual solder joint parameters is an advantage of this concept.
Stencil-Dip Process:

A pump and solder nozzle are used to create a soldering area in a solder bath. The size of the solder area corresponds
to the over all solder area of the circuit board. The board is lowered onto a stencil, which is then lowered onto the
soldering area. Apertures in the stencil correspond to the solder joint locations on the board. Made of a heat resistant
material, the stencil completely covers the remaining areas of the circuit board. Relief cavities are used for SMD and
/or other components mounted to the bottom of the board. In principle, there is no limit to the height of these
components. After each cycle, the stencil is raised and a wiper blade is used to skim any oxides form surface of the
solder area.

The flux is applied by a spraying through a cover stencil. The relief cavities for the SMD and /or other components
are necessary only in certain situations.

Upon a change in production design, the stencils are exchanged. Due to the short change over time of the stencils,
this system is highly flexible. Since both the flux and solder applications are done simultaneously, this process is
relatively fast offering a high throughput.

System configurations are available for both in-line and off-line processes. This process is frequently used for
automotive electronics such as ABS controllers, seat restraint systems, dash board displays and high volume
telecommunications.
Pin Transfer Process:

A molten ball of solder in the appropriate volume is directed to the solder joint from below and establishes the
connection. Submerging a transfer pin below the surface of the solder bath creates the solder ball. Upon raising, the
pin creates a solder ball due to the concave shape of its top surface. The transfer pin remains in contact with the
solder ball and joint.

The flux application can also be performed by transfer pin or spraying through a cover stencil. A controlled
atmosphere prevents oxides formation on the upper surface of the solder bath but is not required for the procedure.

The board specific arrangement of several pins on a single carrier plate enables simultaneous soldering of all joints
in one cycle. The position of the transfer pins can always be adapted to the geometry of the solder joints.

This process is relatively fast and preferred for use in high volume applications.
SAMPLES of WAVE SOLDERING EQUIPMENT:

MEDIUM to HIGH VOLUME PRODUCTION:

Econopak Plus:

This is an enhanced wave soldering system incorporating expanded processing capabilities, new standard features,
additional options and enhanced data acquisition software. Capable of soldering all types of printed circuits
including dense and difficult to solder SMT boards. It is the ideal system for medium to high volume production
requiring fast change over, process flexibility and system reliability.

Econopak Plus will accommodate up to four preheaters ( two above and two below the rails) with optional top side
board temperature verification and a selection of fluxer types for low solids fluxes. The system also incorporates a
solder nozzle design based on the patented Lambda concept which produces a more stable , smoother wave.

Features:

High performance: The Econopak Plus is a proven high performance, moderately priced ($95,000) wave
soldering system for printed circuit boards with an emphasis on surface mount technology.

It is a completely automated system with digital controls and readouts. All instruments, controls and readouts are
positioned on a central control panel.

The system will accommodate up to four preheaters ( two above and two below the rails). It also features a dual
aerator foam fluxer for low solid fluxes and a solder nozzle design based on the Lambda concept (smooth wave).

As an option, a nitrogen inerting package is available that will enable the system to operate in a controlled
atmosphere as well in ambient air.

Fluxer Module: In order to maintain a stable head with low solids fluxes, a new titanium foam fluxer utilizes two
aerator stones and special chimney. An adjustable angle exit air knife drives flux up into plated through holes to
enhance topside wetting. It also removes excess flux after the fluxing operation, minimizing flux drippings and
waste.

Options: Specific gravity can be automatically controlled (from 750-999) with an integral flux density controller,
flux level control and adjustable overflow pipe. In lieu of a foam fluxer, a titanium wave fluxer, foam/wave
combination or rotating drum spray fluxer is available.
Preheat module: The fast response IR platen preheater is zoned in three independently controlled sections across its
width, a valuable energy conservation feature.

Options: One or two topside IR preheaters and / or additional bottom preheater. System will accommodate a
maximum of two above and two below the rails. High/Low temperature audio/visual alarm also available.

Solder module: The solder module incorporates the proven Lambda wave (smooth wave) based on Wave-dynamics
with its shape and flow characteristics precisely controlled to provide ideal entry, contact and exit conditions.
It will solder dense circuits, fine lines, large land areas, difficult line geometrys and multilayer boards without
icicles, bridges, or buildups. If required for SMD soldering and deep thru-hole filling, the Lambda wave can be
enhanced with one or more of Electroverts wavesoldering options. Rollout jacking stand is standard.

General Options: High/low temperature alarms, time clock and solder wire feeder with solder level sensor.

Omega wave option: This is a leading technology for state of the art SMD wave soldering. It wavesolders both
surface mount and leaded components with equal ease. The surface active Omega wave virtually eliminates solder
skips-the most stubborn defects in SMD wavesoldering. And soldering of leaded components is improved, with thru
hole filling rated 99.9% effective. The Omega system is simple to setup and operate. When switched off, the Omega
wave functions exactly as a Lambda Wave.

Dual wave option: The Dual wave/Dual pump solder module is used for both leaded and SMD components. For
SMD soldering, two waves, the second being a Lambda, are utilized in tandem. For leaded component soldering, the
first wave can be turned off, allowing the station to function solely as a Lambda wave. Each wave is controlled
independently via a soft start DC control. The Omega wave can also be incorporated into a Dual wave system.

Conveyor: Standard features include digital readout of actual speed control and calibration functions via control
panel. Idle zones at load and unload ends are included on pallet systems.
A finger type conveyor is standard. Single spaced V shaped groove flexible titanium fingers mounted on a double
chain conveyor provide uniform clamping force unaffected by board irregularities or thermal expansion. Other
finger configurations are available.

Options: Available options are a finger mask set for solder and flux and a finger cleaner with low liquid level alarm
that automatically shuts down the finger cleaner pump, activates an alarm buzzer, and a displays a warning message.
The palletless finger conveyor can be furnished with a 4 degree to 7 degree adjustable incline. For post cooling of
circuit boards, a cooling fan assembly is available.

Basic design & Construction: The econopak system combines compact design, streamlined styling and heavy duty
construction. The one piece lift up hood and large tempered glass window provide easy access to and optimum
visibility of the operational process. The hinged, drop down electrical box is ideal for quick, simple access to the
machines interior.

Option: Hood lights, stainless steel deck, and CO2 fire extinguisher system.

Nitrogen Inerting Option: The coN2tour inert boundary soldering system offers high atmosphere purity (<10 ppm
O2) coupled with low nitrogen consumption (<300 CFH per wave). The coN2tour also provides variable lead
clearance and no throughput limitations. In addition, the system offers excellent visibility and accessibility.
LOW to MEDIUM VOLUME PRODUCTION

Astrapak 400:

This is a low to medium volume wave soldering system which combines a compact, integrated design with
streamlined styling to make maximum use of its proven Lambda wavesoldering technology. Packed with many
standard features. Moderately prices $75,000 system. The system is available with a standard 16 (400 mm) pallet
conveyor or an optional finger conveyor.

Features:

Fluxer Module: The standard fluxer is stainless steel, dual aerator foam fluxer with adjustable air knife. It features
quick disconnect air lines and separate air pressure regulator, pressure gauges and flow control valves for both the
air knife and aerators. The adjustable angle exit air knife drives flux up into plated through holes to enhance top side
wetting as well as removing excess flux to minimized dripping. The fluxer is mounted on a slide mechanism for ease
of access . The dual chamber/dual aerator design maintains a stable head with the new generation of low solids
fluxes. The system is also available with a ceramic aerator in lieu of standard polyethylene, flux density controller,
or spay fluxing alternatives.

Preheater Module: A 36 dual zone bottom side, fast response IR platen provides a very uniform preheating
surface. I t transfers heat for activating and drying flux solvents while preventing thermal shock by conditioning the
board prior to wavesoldering.

Solder module: To meet high density package requirements and provide maximum process flexibility, the system
can be used to process both SMDs, conventional leaded components or a mixture of both. The wave will solder
dense circuits, fine lines, large land areas, difficult line geometrys and multilayer boards without icicles, bridges or
solder build up. If required for SMD and deep through hole filling, the wave can be enhanced with one or more of
Electroverts wavesoldering options.

The model features a variable speed motor to provide wave height control, safety pump interlock, quick disconnect
pump, drop reduction flow control , stainless steel construction and easily removable heaters. To conserved energy
and ensure controlled solder melt down without eruptions , a timer circuit powers only the upper heaters at first.
There is a 2 hour factory set time delay before the lower heaters switch on, or when the solder temperature reaches
the pump interlock temperature thus ensuring that the solder in the pot is molten.

General options: High temperature audio/visual alarms and 7 day time clock for solder heater.
Omega Wave option: A surface activating device imparts vibrations to the entry position of the wave to eliminate
shadowing, drive out entrapped gases and provide a scrubbing action that reduces solder skips on SMT components.
Amplitude of vibration is controlled. Soldering of leaded components is improved with through hole filling 99.9%
effective.

Dual Wave Option: The dual pump/dual wave for both leaded and SMT components. For SMD soldering, two
waves-the first being a controlled turbulent wave, the second being a smooth wave- are utilized in tandem.

For leaded component soldering, the first wave can be turned off, allowing the station to function solely as a smooth
wave. Each wave is controlled independently via a soft start DC control. The Omega wave can also be
incorporated into a Dual wave system.

Conveyor Module: Standard is a dual chain pallet type, 16 9406mm) wide with a fixed 6 conveyor angle. Both
rails are powered by a variable drive motor with current limiting speed control card and including a digital speed
controller with closed loop feedback. The conveyor features a pneumatic lift mechanism to enable rails to be raised
for soldering pot roll out.

Options: Hand held adjustable width 16 (406mm) wide pallets conveyor with V-groove titanium fingers that
provide a uniform clamping force a unaffected by board irregularities or thermal expansion. All L-shape fingers
(for use with pallets), rigid titanium fingers(L-shaped or V-groove), and intermix of L and V (L in every third
position). Also available are a finger mask set for solder and flux , combination spray/brush finger cleaner with
solvent reservoir, recirculating pump and low liquid level alarm that automatically shuts down the finger cleaner
pump, activates an alarm buzzer, and a displays a warning message.

General: One piece hood with sliding tempered glass view window and hinged lift off rear doors provide easy
access to processing area. Three 24 V hood light turns on with power switch.

FUTURE TRENDS in WAVE SOLDERING:

45 degrees wave soldering:

The situation in PCB wave soldering has changed recently. There are more complex circuit board patterns, there are
more components on the boards and the boards and their components are becoming smaller and harder to solder.
Over the years, through extensive experimentation, it was discovered that running PCBs and their components at 45
degrees over a standard wave had some distinct advantages. It seems like going over angled waves will reduce the
solder skipping and bridging. When the waves hit the components at a 45 degree angle allows the solder to flow
around the corners instead if hitting them straight on, eliminating the shadowing effect. The bridging on connector
pins is eliminated because the pins enter and exit at an angle instead of being perpendicular to the solder waves.

The most importantly, yield advantages that are associated with the 45 degree wave soldering system can be
obtained at minimal cost per a board. Better yields from the wave solder machine will require less rework and fewer
soldering machines to produce the same number of acceptable boards.

Some board manufactures have introduced another step to their process line, where they load their PCBs into pallets
to get 45 degree wave solder benefits. The board is set in the pallet so that it goes over the standard wave process at
a 45 degrees angle to the solder fountains.

Disadvantages with using pallet are:

The added process time needed to load and unload the PCBs from the pallets.
The cost and maintenance of the pallets. Every board size would require and any production increases would
require pallets to be made.

A better solution to putting a printed circuit boards in pallets is to have the solder pot ( and its wave fountain) at 45
degrees to board travel. This eliminates the need for these type of pallets.
YSM-890N Turbulent wave soldering machine:

Recent trend prevailing in the world market today is miniaturization of electrical and electronic devices. To produce
solder machines capable of nearly zero defect soldering for highly populated SMD mounted PCBs is a difficult task.

Features and Benefits:

A rail slant adjustable range of 3- 6 degrees: when chip components are densely loaded on a board, solder
skips and bridging are likely to occur. To avoid this problem , some PCB assemblers have designed pallets
where the PCB is mounted obliquely. However, this is no longer required with YSN 890N. Solder skips or
solder bridges, which are likely to occur between the chips can be eliminated with a proven turbulent wave
application and 3-6 degrees angle adjustable rail structure.
Perfect solder wettablility with its structural and functional behaviors
Obliquely arranged fluxer, preheater and solder bath at 45 degrees to rail track
Easy access solder bath: The solder bath can be rolled in or out by a motor. This provides easy access for daily
maintenance. With is feature down time of the machine is reduced.
Moderately priced $75,000
Flux tank and preheater modules unique design: The flux tank and the preheater modules are obliquely
arranged. Total flux coating and a constant temperature profile can be attained with these designed structures.
An air curtain is provided between the fluxer and preheater to intercept gasified flux flow into the preheater
zone.
Nitrogen Atmosphere:

Another soldering process used to reduce the environmental effects of a wave soldering system and use the new
fluxes being developed is to do the soldering process in an inert (Nitrogen) atmosphere.
Advantages of using Nitrogen in the wave soldering process:
Less oxygen results in increased wetting forces; reducing icicles.
Nitrogen reduces surface tension of the solder to the PCB ; allowing for reduced solids in the flux.
Dramatically reduced dross generation; less solder usage and less solder dross for disposal.
Solder joints are smooth and shiny; a cosmetic benefit.

CON2TOUR inert boundary soldering system:

This technology is a method of inerting only the solder wave. This method dispenses with most of the expense and
complexity of current inerting technologies, providing the benefits of nitrogen wavesoldering, without cost.
Moderately priced at $105,000.
Advantages over inerted tunnels and dedicated N2 wavesoldering systems: the coN2tour system applies the inerting
gas only to the point where it is really required.. the printed circuit assembly/solder wave interface. This provides
an atmosphere of less than 10 ppm O2 while using less than 300 cubic feet per hour of nitrogen per solder
wave.and no tunnels, no hoods, no curtains, no shutters.

CoN2tour users have indicated tremendous soldering quality improvements in reduction of bridges and instances of
excess solder. The coN2tour yields these benefits within a wider process window than traditional nitrogen soldering
ease of maintenance.

Because the coN2tour system avoids using a tunnel, there is easy, open access to the solder pot and wave for process
monitoring and adjustments. O2 levels and the open environment. There is no requirement to measure the O2 levels
with the coN2tour technology since the atmosphere is selectively applied to the solder wave within an essentially
open environment. Pure nitrogen is diffused directly below the circuit assembly/solder interface and consequently
the atmosphere is maintained less than 10 ppm O2.

INERT vs WAVE SOLDERING

COST COMPARISON
EXPENSES AIR NITROGEN
Solder consumed $ 630 $115
Nitrogen N/A 48 meter cube
Maintenance-Labor 75 11 hours
TOTAL COST $705 $174

Net savings/week $531

Annual savings $27,612
CONCLUSION:

Wave soldering technology has been improving since its introduction to the printed circuit board assembly process.
Manufacturers have required a wave soldering process that would solder PCB quickly. In the past, soldering
problems were left to lines of people who inspected and reworked any defective boards. This was fine when boards
were simple and rework could be done quickly and efficiently, but what happens to a high volume production
process when the printed circuit boards become smaller and more complex? Hence, a decision making process to
buy certain wave soldering equipment should be based on the need of the PCB manufacturer. The PCB designers
may not do the necessary board design to make them more compatible to increase yields at the wave soldering
process. Therefore, selection process should include present and future needs of the organization.

Followings are the summary of the selection criterias for the decision making process. Each criteria should be
considered according to need of PCB manufacturer.
Computer:
Multilevel security
Event and alarm logging
Fluxer
Slide out fluxer module
On board flux tank storage
Foam, spray and jet flux options
Preheat Module:
Preheat capability
Slide out preheaters
Infrared or forced convection
Heater tunnel with tempered glass covers
Solder Module:
Motorized roll out solder pot and jack stand
Multiple chip wave options
Low maintenance solder pumps
Closed loop temperature and wave height control
Angle of the solder fountain
Conveyor:
Finger conveyor with motorized width adjust
Finger cleaner with liquid level alarm
Adjustable incline from 5-7 degree
Environmental impacts:
There are new laws governing chemical emissions and their use in manufacturing industry. Environmental
legislations are forcing PCB manufacturers to change to low residue no clean or VOC free fluxes to meet the new
laws on emission control and waste chemical disposal. There has been a lot of research by flux chemical companies
to make the new fluxes effective and available. Hence, environmental impact of the equipment should be considered
before a buying decision can be made.
Safety:
All of the equipment have some kind of alarm system built in. Certain systems have fire extinghuers placed on the
unit.
Service and Support: 24 hour technical and service support were available through out the industry.
Warranty: The majority of the equipments have 3 year manufacture warranty.
Price: Low end units were staring from $50,000 where the high end units with advance features were staring from
$100,000. Since, wave soldering systems requires high capital investment , decision making process should be very
carefully investigated according to needs of the specific manufacturer.

REFERENCES:
Down, W. H. Wave Soldering Issues. Circuits Assembly; November 1994.