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R equirement
-7 V to 12 V
APPLICATIONS 1 VCC = 5V
Additional Noise
Margin
Utility Meters
Chassis-to-Chassis Interconnects
DTE/DCE Interfaces VCC = 5.5V
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright 20052009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN65HVD50-SN65HVD55
SLLS666E SEPTEMBER 2005 REVISED OCTOBER 2009 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
SN65HVD50, SN65HVD51, SN65HVD52 SN65HVD53, SN65HVD54, SN65HVD55
D PACKAGE (TOP VIEW)
NC 1 14 VCC
VCC 1 8 A R 2 13 VCC
R 2 7 B RE 3 12 A
D 3 6 Z DE 4 11 B
GND 4 5 Y D 5 10 Z
GND 6 9 Y
8 GND 7 8 NC
2 A
R 7
B NC - No internal connection
5
3 Y
D 6
Z
AVAILABLE OPTIONS
BASE
SIGNALING RATE UNIT LOADS ENABLES SOIC MARKING
PART NUMBER
25 Mbps 1/2 No SN65HVD50 65HVD50
5 Mbps 1/8 No SN65HVD51 65HVD51
1 Mbps 1/8 No SN65HVD52 65HVD52
25 Mbps 1/2 Yes SN65HVD53 65HVD53
5 Mbps 1/8 Yes SN65HVD54 65HVD54
1 Mbps 1/8 Yes SN65HVD55 65HVD55
UNIT
VCC Supply voltage range 0.3 V to 6 V
V(A), V(B), V(Y), V(Z) Voltage range at any bus terminal (A, B, Y, Z) 9 V to 14 V
(3)
V(TRANS) Voltage input, transient pulse through 100 . See Figure 12 (A, B, Y, Z) 50 to 50 V
VI Voltage input range (D, DE, RE) -0.5 V to 7 V
PD(cont) Continuous total power dissipation Internally limited (4)
IO Output current (receiver output only, R) 11 mA
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
(3) This tests survivability only and the output state of the receiver is not specified.
(4) The thermal shutdown typically occurs when the junction temperature reaches 165C.
(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
(2) See thermal characteristics table for information regarding this specification.
(1) All typical values are at 25C and with a 5-V supply.
(2) 10% of the peak-to-peak differential output voltage swing, per TIA/EIA-485
(3) Under some conditions of short-circuit to negative voltages, output currents exceeding the ANSI TIA/EIA-485-A maximum current of 250
mA may occur. Continuous exposure may affect device reliability.
(1) All typical values are at 25C and with a 5-V supply.
(2) tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices
operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
(1) All typical values are at 25C and with a 5-V supply.
(1) All typical values are at 25C and with a 5-V supply
(2) .tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices
operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
THERMAL CHARACTERISTICS
over operating free-air temperature range unless otherwise noted (1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Junctiontoambient Low-K board (3), No airflow HVD50, HVD51, HVD52 230.8
thermal resistance (2) HVD53, HVD54, HVD55 162.6
JA
Junctiontoambient High-K board (4), No airflow HVD50, HVD51, HVD52 135.1
thermal resistance (2) HVD53, HVD54, HVD55 92.1
C/W
Junctiontoboard HVD50, HVD51, HVD55 44.4
JB High-K board
thermal resistance HVD53, HVD54, HVD55 61.1
Junctiontocase HVD50, HVD51, HVD52 43.5
JC No board
thermal resistance HVD53, HVD54, HVD55 58.6
HVD50 (25Mbps) 420
RL= 60, CL = 50 pF,
Input to D a 50% duty cycle square HVD51 (10Mbps) 404
wave at indicated signaling rate
HVD52 (1Mbps) 383
PD Device power dissipation mW
RL= 60, CL = 50 pF, HVD53 (25Mbps) 420
DE at VCC RE at 0 V,
HVD54 (10Mbps) 404
Input to D a 50% duty cycle square
wave at indicated signaling rate HVD55 (1Mbps) 383
HVD50 40 55
Low-K board, No airflow HVD51, HVD52 40 84
TA Ambient air temperature HVD53, HVD54, HVD55 40 85
C
HVD50, HVD51, HVD52 40 85
High-K board, No airflow
HVD53, HVD54, HVD55 40 85
TJSD Thermal shutdown junction temperature 165
Figure 1. Driver VOD Test Circuit: Voltage and Figure 2. Driver VOD With Common-Mode Loading
Current Definitions Test Circuit
VOD(SS)
VOD(RING)
0 V Differential
VOD(RING)
-VOD(SS)
Y VY
VCC
27 1%
DE Z VZ
Y
D VOC(PP)
Input VOC(SS)
27 1%
Z VOC
CL = 50 pF 20% VOC
Figure 4. Test Circuit and Definitions for the Driver Common-Mode Output Voltage
W
Z
W
D S1
3V
3V Y
0V Z Y 1.5 V 1.5 V
VI
D S1 0V
VO 0.5 V
Z
t PZH(1 & 2)
V OH
DE RL = 110 W VO 2.3 V
Input
CL = 50 pF 1% ~0V
Generator
VI 50 W 20%
tPHZ
Generator: PRR = 500kHz, 50% Duty Cycle, t r<6 ns, t f < 6ns, Z 0 = 50 W
CL Includes Fixture and Instrumentation Capacitance
Figure 6. Driver High-Level Output Enable and Disable Time Test Circuit and Voltage Waveforms
VCC
D S1
3V Z RL = 110 3V
0V Y
1%
Y
S1 VI 1.5 V 1.5 V
D VO
0V
Z t PZL(1&2) t PLZ
DE
CL = 50 pF 20% VCC
Input
Generator VI 50 0.5 V
CL Includes Fixture
and Instrumentation VO 2.3 V
Capacitance VOL
Generator: PRR = 500 kHz, 50% Duty Cycle, t r <6 ns, t f <6 ns, Zo = 50
Figure 7. Driver Low-Level Output Enable and Disable Time Test Circuit and Voltage Waveforms
IA
A
IO
R
VID
VA B
VA+ VB VIC VO
VB IB RE
2
II VI
A 3 V
Input R 1.5 V 1.5 V
VI 50 W VI
Generator
B 0 V
1.5 V CL = 15 pF
VO tPLH tPHL
RE 20%
0V
VOH
90 % 90 %
1.5 V 1.5 V
VO 10% 10%
Generator : PRR = 500 kHz , 50 %
CL Includes Fixture
Duty Cycle , t < 6 ns , t < 6 ns , t t VOL
and Instrumentation r f
Z = 50 W Capacitance
V CC
A 3V
1.5 V A
VO 1 kW 1% S1
R VI 1.5 V 1.5 V
B
0V C L = 15 pF B 0V
20% t
PZH(1 & 2) PHZ
Input V OH
VI 50 W
Generator 1.5 V
C L Includes Fixture and VO 0.5 V
Instrumentation Capacitance ~0 V
Generator: PRR = 500 kHz, 50%, Duty Cycle, tr < 6 ns, tf < 6 ns, Z0 = 50 W
Figure 10. Receiver High-Level Enable and Disable Time Test Circuit and Voltage Waveforms
VCC
0V A 3V
A
VO 1 kW 1% S1
R VI 1.5 V 1.5 V
1.5 V B
C L = 15 pF B 0V
RE 20% t PZL(1 & 2)
t PLZ
Input V CC
Generator
VI 50 W
C L Includes Fixture VO 1.5 V 0.5 V
and Instrumentation VOL
Capacitance
Generator: PRR = 500 kHz, 50%, Duty Cycle, tr < 6 ns, tf < 6 ns, Z0 = 50 W
Figure 11. Receiver Low-Level Enable and Disable Time Test Circuit and Voltage Waveforms
0 V or 3 V
DE Y A
D R
Z 100 W 100 W B
RE
1% 1%
Pulse Generator 0 V or 3 V
+ 15 ms duration +
- 1% Duty Cycle -
tr, tf 100 ns
DEVICE INFORMATION
Low-Power
Standby
4
DE
9
5 Y
D
10
Z
If only the driver is re-enabled (DE transitions to high) the driver outputs are driven according to the D input after
the enable times given by tPZH2 and tPZL2 in the driver switching characteristics. If the D input is open when the
driver is enabled, the driver outputs defaults to A high and B low, in accordance with the driver failsafe feature.
If only the receiver is re-enabled (RE transitions to low) the receiver output is driven according to the state of the
bus inputs (A and B) after the enable times given by tPZH2 and tPZL2 in the receiver switching characteristics. If
there is no valid state on the bus the receiver responds as described in the failsafe operation section.
If both the receiver and driver are re-enabled simultaneously, the receiver output is driven according to the state
of the bus inputs (A and B) and the driver output is driven according to the D input. Note that the state of the
active driver affects the inputs to the receiver. Therefore, the receiver outputs are valid as soon as the driver
outputs are valid.
FUNCTION TABLES
130 kW
470 W 470 W
Input Input
9V 9V
125 kW
A Input B Input
VCC VCC
22 V R1 22 V R1
R3 R3
Input Input
22 V R2 R2
22 V
16 V
5W
Output Output
16 V
9V
R1/R2 R3
SN65HVD50, SN65HVD53 9 k 45 k
SN65HVD51, SN65HVD52, SN65HVD54, SN65HVD55 36 k 180 k
TYPICAL CHARACTERISTICS
HVD50, HVD53 HVD51, HVD54
RMS SUPPLY CURRENT RMS SUPPLY CURRENT
vs vs
SIGNALING RATE SIGNALING RATE
70 70
TA =25C RL = 54 W TA =25C RL = 54 W
RE = VCC CL = 50 pF RE = VCC CL = 50 pF
DE = VCC DE = VCC
65 65
ICC (RMS Supply Current, mA)
50 50
45 45
40 40
0 5 10 15 20 25 0 1 2 3 4 5
HVD52, HVD55
RMS SUPPLY CURRENT
vs
SIGNALING RATE
75
TA =25C RL = 54 W
RE = VCC CL = 50 pF
70 DE = VCC
ICC (RMS Supply Current, mA)
65
60
VCC = 5.0 VDC
55
50
45
40
0 0.2 0.4 0.6 0.8 1
100
20
50
0 0
-20
-100
-150
-40
-200
-250 -60
-7 -4 -1 2 5 8 11 14 -7 -4 -1 2 5 8 11 14
VI - Bus Input Voltage - V VI - Bus Input Voltage - V
0.06 -0.04
0.04 -0.06
0.02 -0.08
0 -0.1
0 1 2 3 3 4 5
TA = 25C
VCC = 5 V RL = 54 W
50
2.8 DE at VCC D = VCC
VOD - Driver Differential Voltage - V
40
2.7
30
2.6
20
2.5
10
2.4 0
-40 -15 10 35 60 85 0 1 2 3 4 5 6
TA - Free-Air Temperature - C VCC - Supply Voltage - V)
HVD55
600
VOD - Differential Output Voltage - V
5
HVD54 VOD
500
4
Enable Time ns
HVD53
400 R = 54 W
3
300
2
200
100 1
0 0
-7 -2 3 8 13 0 20 40 60 80 100
V(TEST) Common-Mode Voltage V IO - Output Current - mA
Z
DE
375 W 1%
Input V 50 W
Generator
50%
tpZH(diff)
VOD (high)
1.5 V
0V
tpZL(diff)
-1.5 V
VOD (low)
The time tpZL(x) is the measure from DE to VOD(x). VOD is valid when it is greater than 1.5 V.
APPLICATION INFORMATION
qCA Calculated
Surface Node
qJC Calculated/Measured
Junction
qJB Calculated/Measured
PC Board
REVISION HISTORY
Changed text of feature bullet From: Meets or Exceeds the Requirements of ANSI TIA/EIA-485-A and RS-422
Compatible To: Designed for RS-422 and RS485 Networks ................................................................................................ 1
Changed text of feature bullet From: 3.3-V Devices Available, SN65HVD30-39 To: 3.3-V Devices Available,
SN65HVD30-35 .................................................................................................................................................................... 1
Deleted all references to SN65HVD56, SN65HVD57, SN65HVD58, SN65HVD59 throughout the data sheet ................... 1
Deleted RECEIVER EQUALIZATION CHARACTERISTICS from the data sheet. .............................................................. 2
Changed scale of Figure 19 ................................................................................................................................................ 16
Changed scale of Figure 20 ................................................................................................................................................ 16
Added Figure 24 ................................................................................................................................................................. 17
Changed Figure 26 ............................................................................................................................................................. 19
www.ti.com 24-Sep-2016
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 24-Sep-2016
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
SN65HVD55DR ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 65HVD55
& no Sb/Br)
SN65HVD55DRG4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 65HVD55
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 24-Sep-2016
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Sep-2016
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Sep-2016
Pack Materials-Page 2
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