INDUSTRIAL INSTRUMENTATION

Generalized configurations and functional description of measuring instruments

Generalized performance characteristics of instruments: Static & Dynamic
Characteristics
Errors in measurement: Static error reduction techniques, statistical analysis of
errors, Techniques for dynamic compensation, loading effects.
Primary sensing elements and transducers
o Resistive transducers: potentiometers, RTDs, Strain Gauges
o inductive transducers: variable reluctance & LVDT sensors
o capacitive transducer: variable separation, area & dielectric
o piezoelectric transducer: static & dynamic characteristics
Analog signal conditioning: Deflection bridges, Amplifiers, A.C. carrier systems,
oscillators & resonators.
Motion measurement: translational & rotational measurement, accelerometers.
Temperature measurement: Thermal expansion methods, Thermocouple laws,
installation problems.
Pressure measurement
Flow measurement: Essential principles of fluid mechanics, Measurement of
velocity at a point in a fluid, Measurement of volume flow rate, Measurement of
mass flow rate, Measurement of flow rate in difficult situations: electromagnetic
& cross correlation flow meters.
Recent developments in instruments and measurements

Text Book:
John P. Bentley, Principles of Measurement Systems, 3rd Edition,

MICROFABRICATION TECHNOLOGIES
 Crystal Growth: Silicon crystal growth from the melt, Silicon Float zone process, GaAs
Crystal Growth Techniques, Material Characterization
Silicon Oxidation: Thermal Oxidation Process, Impurity Redistribution During
Oxidation, Masking properties of Silicon Dioxide, Oxide Quality, Oxide Thickness
Characterization
Photolithography: Optical Lithography, Electron Beam Lithography, Extreme Ultraviolet
Lithography, X-Ray Lithography, Ion Beam Lithography, Comparison of above methods.
Etching: Wet Chemical Etching, Dry Etching
Diffusion: Basic Diffusion Process, Extrinsic Diffusion, Lateral Diffusion
Ion Implantation: Range of implanted ions, Implant Damage & annealing, Implantation
related processes
Film deposition: Epitaxial Growth Techniques, Structures & Defects in Epitaxial Layers
Dielectric Deposition, Poly-silicon Deposition, Metallization.
Process Integration: Passive components, Bipolar Technology, MOSFET Technology,
Bulk micromachining, Surface micromachining, LIGA process
IC Manufacturing: Electrical testing, Statistical Process control, Yield.

TEXT BOOK: Fundamentals of Semiconductor Fabrication, May, Gary S. and Sze, S., M.,
Wiley