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K I fs a
Where,
f is a dimensionless constant (related to geometry of specimen and flaw)
s is the applied stress
a is the crack length or half the length of an internal crack
KI is a variable but NOT a materials property
KI has unusual unit of Mpa(m)½ or psi(in)½ .
Fracture Toughness
Fracture Toughness
When the stress intensity, KI is increased to a critical value, KIC , crack
propagation will occur, which will lead to fracture.
It is written as:
K IC fs a
Where,
KIC is a measure of a materials resistance to crack propagation.
It is a material property.
KIC is dependent on temperature, microstructure, and strain rate.
KIC usually increases with a reduction in grain size.
Fracture Toughness
How to use KIC ?
• Fracture toughness is most useful in mechanical designs involving
materials with limited toughness or ductility.
• Usually s < syield/n is good enough for ductile materials, which are
statically loaded.
• Design criterion using KIC :
K I K IC
taking into account KIC , which is a material property, the allowable stress
(s) and/or the allowable flaw size (a) can be determined.
Material Selection:
• If the maximum applied stress, smax , and maximum crack length are
specified for a certain application, then only the materials with KIC
greater than KI can be used:
K IC fs max amax
Fracture Toughness
Allowable stress design (if “a” and KIC are specified by application
constraints) K
s max IC
f amax
Allowable crack size design (if the stress level, smax , and KIC are specified)
then,
1/ 2
K
IC 1
amax
fs
max
Allowable crack size design is possible if the stress level, smax , and KIC are
specified).
GENERACIÓN DE GRIETAS
Defectos típicos introducidos durante el procesado del material
Moldeo Soldadura
GENERACIÓN DE GRIETAS
•Concentración de
dislocaciones en un •Concentración de dislocaciones en
mismo plano de borde de grano
deslizamiento
Concentración de
dislocaciones en
borde de macla
PROPAGACIÓN DE LA GRIETAS:
Criterios que indican en qué condiciones una grieta preexistente iniciará su apertura
• Criterio de Griffith
• Criterio de Orowan
• Criterio de Irwin
Eg
s critical 2s
a
This equation shows that even small cracks can severely limit the strength.
This equation is particularly applicable to ceramics, semiconductors and
hard plastics, which fracture by crack mechanisms.
Microstructure of Fracture in Metals
Most often ductile fracture occurs in a transgranular manner, which means
through the grains rather than only along grain boundaries.
Brittle fracture is typically intergranular or along the grain boundaries,
which is enhanced when impurities collect and weaken the grain
boundaries.
In a simple tensile test, ductile fracture begins by the nucleation, growth and
coalescence of microvoids at the center of a sample (in the necked region).
The stress causes separation of the grain boundaries or the interfaces
between the metal and small inpurity particles (inclusions or
precipitates).
As the local stresses increase, the microvoids grow and coalesce into larger
cavities.
Eventually the metal-to-metal contact is too small to support the load and
fracture occurs.
Microstructure of Fracture in Metals
Formation of dimples during fracture, which change from round (top right)
to elongated (bottom right) towards the edge of the material sample.
Microstructure of Fracture in Metals
t
Fracture toughness is the most widely used param-
eter from fracture mechanics, and is expressed, KIC,
which is the critical value of the stress intensity factor
at a crack tip necessary to produce catastrophic
failure under simple uniaxial loading.
Compact test specimen KIC =Yσf √πα (unit : MPa√m) (8.1)
for fracture toughness Explain the use of this equation for design!
measurement
σf : overall applied stress at failure
Y: dimensionless geometry factor on order of 1
KIC is for plane strain condition, [ t ≥ 2.5(KIC /YS )2].
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internal flaws
Figure 6.30 Schematic drawing of fracture
toughness specimens with (a) edge and (b)
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Figure 6-32 Secondary cracks developed Figure 6-33 A scanning electron
during hardness testing can be used to micrograph showing crack propagation in
assess the fracture toughness of brittle a PZT ceramic. (Courtesy of Wang and Raj
materials N. Singh, Ferroelectrics, 207, 555–575
(1998).)
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Microstructural Features of Fracture in Metallic
Materials
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(c)2003 Brooks/Cole, a division of Thomson Learning, Inc. Thomson Learning ™ is a
trademark used herein under license.
Figure 6.38 Scanning electron micrographs of an annealed 1018 steel exhibiting ductile
fracture in a tensile test. (a) Equiaxed dimples at the flat center of the cup and cone, and
(b) elongated dimples at the shear lip (x 1250)
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Figure 6.39 Scanning electron micrograph of a brittle fracture surface of a
quenched 1010 steel (x 5000). (Courtesy of C.W. Ramsay.)
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37
(c)2003 Brooks/Cole, a division of Thomson Learning, Inc. Thomson Learning ™ is a trademark used herein under
license.
Figure 6.41 The Chevron pattern forms as the crack propagates from the origin
at different levels. The pattern points back to the origin
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Figure 6.42 Scanning electron micrographs of fracture surfaces in ceramics. (a) The
fracture surface Al203, showing the cleavage faces (x 1250), and (b) the fracture
surface of glass, showing the mirror zone (top) and tear lines characteristic of
conchoidal fracture (x 300)
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Figure 6.47 Fatigue fracture surface. (a) At low magnifications, the beach mark
pattern indicates fatigue as the fracture mechanism. The arrows show the
direction of growth of the crack front, whose origin is at the bottom of the
photograph. (Image (a) is from C.C. Cottell, ‘‘Fatigue Failures with Special
Reference to Fracture Characteristics,’’ Failure Analysis: The British Engine
Technical Reports, American Society for Metals, 1981, p. 318.) (b) At very high
magnifications, closely spaced striations formed during fatigue are observed
(x 1000)
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Figure 6.48 Schematic
representation of a fatigue
fracture surface in a steel
shaft, showing the initiation
region, the propagation of
fatigue crack (with beam
markings), and catastrophic
rupture when the crack
length exceeds a critical
value at the applied stress
(c)2003 Brooks/Cole, a division of Thomson Learning, Inc. Thomson Learning ™ is a trademark used herein under license.
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