MECHANICAL PROPERTIES
Workability
-malleability-can be flattened
-ductility-can be drawn into wire
Brittleness-breaks instead of deforming
Elasticity-ability to return to original
Plasticity-retain new shape
Toughness-ability to absorb energy
-resistance to fracture
Strength-resistance to distortion
IMPACT-placing 2 notched specimen
-charpytest- supported at both ends
-izodtest-supported at one end
TYPES OF STRESSES/FORCES
-tension-pulling,tugofwar,slingshot
-compression-pushing together
-stress-strain:testing uses standardized
-tensiletest-most common test
-compressiontest-applies a load
ENGINEERINGSTRESS
ENGINEERING STRAIN
POISSON’S RATIO-relating modulus
Geometrical atoms-Atom Stru& InterBondng
Smallest particle-Atom
+C (1.67x10-23kg)-Proton & Neu
-C(9.11x10-31kg)-Electron
Gives an attraction -Electrical charge
Significant limitation-Bohr Atomic Model
Outermost orbit-The Wave Mechanical Model
Interaction bet 2 isolated-Atomic bonding
Number of protons in nuc-Atomic number
Total number of P and N-Mass number
P is not equal to N-isotopes
Metallic and non metallic-Ionic Bonding
Adjacent atom -Covalent Bonding
1,2,3 valence electron-Metallic bonding
Bond are weak-2ndary Bondng
Atoms, ions or molecules-CRYSTAL STRUCTURE
Repeating or periodic array-Crystalline
Atomic order -Structure of unit cell
Atoms are present only at UC-Simple cubic
Many metals has a UC-Face-Centered CubicCT
Atoms located at 8 corners-Body centered CubicCT
Material science-involves investigating
Material Engineering-designing
Material scientist-the one who develop
Material Engineer- create new products
CLASSIFICATION OF MATS
Metals-compose of one or more metallic
Ceramics-compounds between metallic
Traditional ceramics-composed of clay
Polymers-have low densities
COMPOSITES-2 or more individual metals
ADVANCE MATS-mats that are unitlized
Semiconductors- have electrical properties
Biomaterials-implanted to human body
Smart Mats-groupof newandstateof the art
Nanomats-we call this the bottom approach
Ex.Carbon nanotube
The density or compactness-Atomic Packing factorCT
6 atoms is contained-hexagonal closed-pck CT
Knowledge of the CT-Density computation
1 or 2 atomic position-Point Defects
1D-Linear Defects
2D-Interfacial Defects
3D-Bulk defects
Atom is missing-vacancy
Crowded-Self-Interstitial
Represent Elements of compound-Solvent/host atoms
Denote an element or compound-Solute
Solubility happens-Atomic size factor
CT for metals of both atoms-Crystal structure
The more electropositive one -Electronegativity
Metal have more of a tendency-Valences
Light microscope is used to study-Optical Microscopy
Capable of much higher -Electron Microscopy
Details of internal microstructural-Transmission Electron
Microscopy
Surface of a specimen to be examined-Scanning Electron
Microscopy
Microscope generates -Scanning Probe Mircroscopy
The most common method utilized by ASTM-Grain size
determination