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It happens around us whatever you notice or not
IPC research:
80% defects could be found and resolved at NPI
stage.
Change from DFx
Above issues puzzles most of us. Vayo customer solved this issue. They may still happen at your side.
Ex.: Venture/SurfaceArt/Sierra/Sandisk…
Vayo DFx software help you detect defects from the initial beginning.
Company introduction
Founded on Jan of 2005, headquarter in China/Shanghai;
Dedicates to intelligent NPI software to accelerate design to manufacturing;
Fully in-house development, owns copyrights and patents;
Product installed >20 countries and regions worldwide;
Strategy partnership with equipment and EDA provider: Keysight/ViTrox/TRI/Fuji/Panasonic/Altium…
“We started with Vayo at year “From years of experience with “Vayo tool has been extremely “We have been impressed with “Vayo tool is a very intuitive and
“I was impressed by Vayo NPI 2009 and has not been turning DFT and CAD SW's, VayoPro-Test useful for us in identifying user-friendly. You can match parts
back since then. What differentiate the product capabilities, their
tool, it is really world class Expert is the best. It is fast, assembly issues much ahead of and pds visually and new pd can be
Vayo from the rest is their communication and commitment
willingness to listen to accurate and easy to use. Its DFT the actual assembly process. This created easily. Part Data Editor and
solution in the industry!“
customer’s needs with fast report is very comprehensible for has drastically reduced holdups in to supporting their products is Parts Verification ensure every
respond.” our customers.” the production line, increasing our truly world class.” location has correct part, size and
productivity.” orientation.”
Murad Kurwa CHIA Kar Lin David Kim Atar Mittal Kent Kim Eddie Chang
Senior Vice President Head of Innovation Centre Test Development Manager General manager Vice President SMT engineer
“From the selection of Vayo “ Accelerator allowed us to “With VayoPro-Test Expert “Communication is important ”by introducing Vayo‘s “The accelerator function could
solution on the year of 2007, we intelligent software tool it is now help us a lot on component
reduce a lot the quantity of solution and great support of for every filed, good conversation
are able to support these data possible for operators to perform placement orientation, we don't
mistakes in the projects and the Vayo team, we could accelerate shall bring joyful experience, Vayo
source whatever we receives what data conversion requiring little need to do mapping Gerber file
kind of data from new customer, time required for their our product review for DFT is such company we worked
skill, while reducing the work time and check placement orientation
and then quickly complete preparation. “ (ICT/Boundary).” with!” one by one any more.”
required to a fifth of what it
placement programming. ”
was.”
Tony Zhou Sergei Fedorov Tong Chang CC Cho Mitsuo Imai Mohamad Azlan Ahmad,
CEO, IPC board director Product Director Production Associate Manager Sr. Manufacturing Engineer General manager GPEO-M PE,
Core product: Intelligent NPI software for PCBA
IPC research:
80% defects could be found and
resolved at NPI stage.
Predict defect opportunity,
increase manufacturing quality
and reduce cost
Validate Signal
Validate Drill
Validate Solder
mask/Silkscreen...
Standard IPC rules
Industry Experience Validate footprint/pad
BOM Analysis Configurable Validate spacing/distance
Comprehensive library
Validate soldering …
Quick manual create
Detailed parts info.
Internal
validation
BOM&CAD Validation
Support alternative part
CAD/Gerber Source
Interactive check
Easy to share
Powerful/Configurable
DFM Expert
Support all CAD Design for Manufacturing Analysis
Gerber/Drill import
13 IPC356 (*.ipc)
Save >70%
manipulation cycle
Rich Component Entity Library
Multi-layers body
Detailed pin info.
(Shape, size, direction, location, …)
2D & 3D View
Fastest part creation approach
among the industry
Intelligent capture info. from CAD
Practical Checking Rule
Interactive query
Snapshot defects
Add remark/comments
Colorful warning level
Result Report Export
Comprehensive Content
• Defect Level
• Defect Name
• Rule Info.
• Actual Value
• Picture
• Locations
• Layer/Side Info.
• ……
Export Report
• Excel, PDF, …
• Customization service
Sample DFx issue: material not match PAD design
Impact
Package not match Package not match • Stop production, waste
product line resource
• Delay shipment & go-to-
market
Impact:
• Require high precise equipment
• Risk of assembly conflict
• Difficult to rework
Sample DFx issue: Via distance to pad
Impact:
More via on boards, it shall be more easy
to bring short, bridge, and insufficient
solder issues.
Good design
Sample DFx issue: annual ring design
Impact:
Easy to cause weak structure; lead to crack/ broke & malfunction
in severe usage conditions.
Sample DFx issue: risk for via under component
Impact:
May cause bridge/short when PCBA goes through wave process.
Sample DFx issue: Via under BGA pad
Impact:
via in BGA pad, it might lead to weak solder joint strength because of void. It
shall impact product reliability.
Sample DFx issue: BGA pad design
Solder mask defined pad, it shall easily cause the root of solder joint crack
especially in frequently shock environment.
Sample DFx issue: no thermal consideration
Poor design
Impact:
It might cause tombstone if there is no thermal consideration. Or it might cause insufficient solder for
PTH parts, and then impact solder joint strength and product reliability.
Sample DFx issue: PTH part to mask strip
Poor design
Impact:
PTH part approach mask strip too near, easily cause solder issue
like short.
Sample DFx issue: poor test point design
TP size impact contact of probe, then impact faults reject rate of test.
Sample DFx issue: poor silkscreen design
Impact
• Wrong polarity during assembly
• Replace with wrong material during rework
Sample DFx issue: no local fiducial for fine-pitch parts
Impact
Good design
Sample DFx issue: Orientation of part pass through oven
Impact:
Part placement orientation shall be consistent with wave process, otherwise it may
casue bridge.
Sample DFx issue: BOM content error
Impact:
Component mismatch may leads material shortage for the work order, which leads to
production stop, waste equipment resource; Or cause excessive material purchasing
and extra inventory.
Sample DFx issue: Alternative part analysis
Impact
Big size difference between alternative part with primary part may cause assembly
problem, solder joint defect or poor reliability.
DFM Expert
Function & feature
300 check items, cover potential risk in those layers (signal, silk
Fabrication
DFM screen, solder mask, …) & drill
Analysis 900 check items, cover the process of screen printer, pick&place,
Assembly
reflow, manual insert, wave, testing, repair & etc
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