Académique Documents
Professionnel Documents
Culture Documents
STGW30NC60W
Features
■ High frequency operation
■ Lower CRES / CIES ratio (no cross-conduction
susceptibility)
( s )
ct
3 3
2 2
Applications 1 1
o
Pr
3
■ HF, SMPS and PFC in both hard switch and 1
resonant topologies D²PAK
Description
e t e
This IGBT utilizes the advanced PowerMESH™
s ol
process resulting in an excellent trade-off
between switching performance and low on-state
O bFigure 1. Internal schematic diagram
behavior.
) -
c t (s
d u
r o
e P
l e t
s o
O b
Table 1. Device summary
Order codes Marking Package Packaging
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) ............................. 5
4
s )
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
(
5 u ct
Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
o d
6
P r
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
e t e
o l
b s
- O
(s )
c t
d u
r o
e P
l e t
s o
O b
2/16
STGB30NC60WT4 - STGP30NC60W - STGW30NC60W Electrical ratings
1 Electrical ratings
(s)
ICL(2) Turn-off latching current 150 A
ct
ICP (3) Pulsed collector current 150 A
du
VGE Gate-emitter voltage ± 20 V
ro
PTOT Total dissipation at TC = 25 °C 200 W
Tj Operating junction temperature
e P – 55 to 150 °C
1. Calculated according to the iterative formula:
T
JMAX
–T
l e tC
C C R
THJ – C
s
× V
CESAT ( MAX ) C C
o
I ( T ) = -----------------------------------------------------------------------------------------------------
(T , I )
-
O b
-
3. Pulse width limited by max junction temperature allowed
)
Table 3.
t
Thermal resistance
c (s
u Value
od
Symbol Parameter TO-220 Unit
Pr
TO-247
D²PAK
ete
Rthj-case Thermal resistance junction-case max 0.62 °C/W
ol
Rthj-amb Thermal resistance junction-ambient max 50 62.5 °C/W
b s
O
3/16
Electrical characteristics STGB30NC60WT4 - STGP30NC60W - STGW30NC60W
2 Electrical characteristics
Collector-emitter
V(BR)CES breakdown voltage IC = 1 mA 600 V
(VGE = 0)
VCE(sat)
Collector-emitter saturation VGE=15 V, IC= 20 A
voltage VGE=15 V, IC= 20 A,Tc= 125 °C
2.1
1.8
2.5
( s ) V
V
ICES
Collector cut-off current VCE = 600 V
o d 10 µA
(VGE = 0)
Gate-emitter leakage
VCE = 600 V, Tc=125 °C
P r 1 mA
IGES
current (VCE = 0)
VGE = ±20 V
e t e ± 100 nA
c t
Cies
Coes
d u
Input capacitance
Output capacitance VCE = 25 V, f = 1 MHz,
2080
175
pF
pF
Cres
r o
Reverse transfer VGE=0
52 pF
e
QgP capacitance
VCE = 390 V, IC = 20 A,
let
Total gate charge 102 nC
Qge Gate-emitter charge VGE = 15 V, 17.5 nC
so
Qgc Gate-collector charge (see Figure 17) 47 nC
O b
4/16
STGB30NC60WT4 - STGP30NC60W - STGW30NC60W Electrical characteristics
( s )ns
ct
tf Current fall time (see Figure 18) 27 ns
du
tr(Voff) Off voltage rise time Vcc = 390 V, IC = 20 A, 46 ns
td(off)
tf
Turn-off delay time
Current fall time
RG=10 Ω, VGE =15 V,
TC=125 °C (see Figure 18)
r o 151
38
ns
ns
e P
e t
ol
Table 7. Switching energy (inductive load)
bs
Symbol Parameter Test conditions Min. Typ. Max. Unit
Eon
Eoff(1)
Turn-on switching losses
Turn-off switching losses
- O VCC = 390 V, IC = 20 A
RG= 10 Ω, VGE= 15 V,
305
181
µJ
µJ
Ets Total switching losses
Eon
c t
Turn-on switching losses VCC = 390 V, IC = 20 A 455 µJ
Eoff(1)
u
Turn-off switching losses
d
RG= 10 Ω, VGE= 15 V, 355 µJ
Ets
r o
Total switching losses TC= 125 °C (see Figure 18) 801 µJ
P
1. Turn-off losses include also the tail of the collector current
e
l e t
s o
O b
5/16
Electrical characteristics STGB30NC60WT4 - STGP30NC60W - STGW30NC60W
( s )
u ct
o d
Figure 4. Transconductance Figure 5. r
Collector-emitter on voltage vs
temperature P
e
let
HV28940
VCE(V)
so
3.2 VGE=15V
30A 40A
3
O b 2.8
20A
-
2.6
(s ) 2.4
2.2
ct 2
du
1.8
IC=10A
o
1.6
P r 1.4
-75 -50 -25 0 25 50 75 100 125 150 TJ(°C)
Figure 6.
t e
Gate charge vs gate-source voltage Figure 7.
e
Capacitance variations
o l
b s
O
6/16
STGB30NC60WT4 - STGP30NC60W - STGW30NC60W Electrical characteristics
( s )
ct
0.8
0 5 10 15 20 25 30 35 40 45 50 55 60 IC(A)
Figure 10. Normalized breakdown voltage vs Figure 11. Switching losses vs temperature
d u
temperature
r o
e P
l e t
s o
O b
) -
c t (s
d u
r o
e P
Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector
current
l e t
s o
O b
7/16
Electrical characteristics STGB30NC60WT4 - STGP30NC60W - STGW30NC60W
( s )
uct
o d
P r
e t e
o l
b s
- O
(s )
c t
d u
r o
e P
l e t
s o
O b
8/16
STGB30NC60WT4 - STGP30NC60W - STGW30NC60W Test circuit
3 Test circuit
Figure 16. Test circuit for inductive load Figure 17. Gate charge test circuit
switching
( s )
u ct
o d
P r
Figure 18. Switching waveform
e t e
o l
b s
- O
(s )
c t
d u
r o
e P
l e t
s o
O b
9/16
Package mechanical data STGB30NC60WT4 - STGP30NC60W - STGW30NC60W
( s )
u ct
o d
P r
e t e
o l
b s
- O
(s )
c t
d u
r o
e P
l e t
s o
O b
10/16
STGB30NC60WT4 - STGP30NC60W - STGW30NC60W Package mechanical data
mm inch
Dim
Min Typ Max Min Typ Max
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0.024 0.034
b1 1.14 1.70 0.044 0.066
c 0.48 0.70 0.019 0.027
D 15.25 15.75 0.6 0.62
D1
E 10
1.27
10.40 0.393
0.050
( s )
0.409
ct
e 2.40 2.70 0.094 0.106
e1
F
4.95
1.23
5.15
1.32
0.194
0.048
d u 0.202
0.051
H1
J1
6.20
2.40
6.60
2.72
0.244
r
0.094 o 0.256
0.107
L 13 14
e P
0.511 0.551
L1
L20
3.50
16.40
l e t
3.93 0.137
0.645
0.154
L30 28.90
o 1.137
bs
∅P 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
- O
( s )
c t
d u
r o
e P
l e t
s o
O b
11/16
Package mechanical data STGB30NC60WT4 - STGP30NC60W - STGW30NC60W
Dim. mm.
Min. Typ Max.
A 4.85 5.15
A1 2.20 2.60
b 1.0 1.40
b1 2.0 2.40
b2
c
3.0
0.40
3.40
0.80
( s )
D 19.85
ct
20.15
u
E 15.45
o d 15.75
e
L 14.20
5.45
P r 14.80
e
let
L1 3.70 4.30
L2 18.50
øP 3.55
s o 3.65
øR
S
4.50
O b 5.50
5.50
) -
t ( s
uc
o d
P r
e te
o l
b s
O
12/16
STGB30NC60WT4 - STGP30NC60W - STGW30NC60W Package mechanical data
mm inch
Dim
Min Typ Max Min Typ Max
A 4.40 4.60 0.173 0.181
A1 0.03 0.23 0.001 0.009
b 0.70 0.93 0.027 0.037
b2 1.14 1.70 0.045 0.067
c 0.45 0.60 0.017 0.024
)
c2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352
( s
0.368
ct
D1 7.50 0.295
E 10 10.40 0.394 0.409
E1 8.50 0.334
d u
o
e 2.54 0.1
Pr
e1 4.88 5.28 0.192 0.208
H 15 15.85 0.590 0.624
J1
L
2.49
2.29
2.69
2.79
e t e
0.099
0.090
0.106
0.110
ol
L1 1.27 1.40 0.05 0.055
s
L2 1.30 1.75 0.051 0.069
R
V2 0°
0.4
O b 8° 0°
0.016
8°
) -
c t (s
du
r o
e P
l e t
s o
O b
0079457_M
13/16
Packaging mechanical data STGB30NC60WT4 - STGP30NC60W - STGW30NC60W
D2PAK FOOTPRINT
( s )
u ct
o d
TAPE AND REEL SHIPMENT
P r
e t e
REEL MECHANICAL DATA
o l
DIM.
MIN.
mm
MAX.
inch
MIN. MAX.
b s A
B 1.5
330
0.059
12.992
)-
D 20.2 0795
t ( s G
N
24.4
100
26.4 0.960 1.039
3.937
u c T 30.4 1.197
o d
TAPE MECHANICAL DATA BASE QTY BULK QTY
Pr
1000 1000
mm inch
DIM.
MIN. MAX. MIN. MAX.
e t
A0
e 10.5 10.7 0.413 0.421
ol
B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
b s D1
E
1.59
1.65
1.61
1.85
0.062 0.063
0.065 0.073
O F
K0
11.4
4.8
11.6
5.0
0.449 0.456
0.189 0.197
P0 3.9 4.1 0.153 0.161
P1 11.9 12.1 0.468 0.476
P2 1.9 2.1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W 23.7 24.3 0.933 0.956
* on sales type
14/16
STGB30NC60WT4 - STGP30NC60W - STGW30NC60W Revision history
6 Revision history
u ct
17-Mar-2008 8
Figure 5 and Figure 9 have been updated
o d
Inserted device in D2PAK
P r
e t e
o l
b s
- O
(s )
c t
du
r o
e P
l e t
s o
O b
15/16
STGB30NC60WT4 - STGP30NC60W - STGW30NC60W
( s )
u ct
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
All ST products are sold pursuant to ST’s terms and conditions of sale.
P r
t e
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
e
o l
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
b s
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
- O
(s )
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
c t
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
d u
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
r o
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
P
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
e t e
o l
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
s
liability of ST.
b
O ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
16/16