Bdv-E 2100, 3100, 3200, 4100 (HBD) PDF

HBD-E2100/E3100/E3200/E4100/
E6100
SERVICE MANUAL US Model
HBD-E2100/E3100
Ver. 1.7 2014.06 Canadian Model
Singapore Model
HBD-E2100/E3100/E4100/E6100
AEP Model
Taiwan Model
HBD-E2100/E4100/E6100
UK Model
HBD-E2100/E3100/E4100
Photo: HBD-E3100
Chinese Model
HBD-E4100/E6100
E Model
• HBD-E2100 is the amplifier, video, HDMI, BD/DVD/CD system, USB, LAN, HBD-E2100/E3100/E3200/E4100/E6100
wireless LAN, Bluetooth, NFC and FM tuner section in BDV-E2100.
• HBD-E3100 is the amplifier, video, HDMI, BD/DVD/CD system, USB,
LAN, Argentina Model
BDV-E2100/E4100
• HBD-E3200 is the amplifier, video, HDMI, BD/DVD/CD system, USB, LAN,
• HBD-E4100 is the amplifier, video, HDMI, BD/DVD/CD system, USB, LAN,
Australian Model
HBD-E2100/E6100
• HBD-E6100 is the amplifier, video, HDMI, BD/DVD/CD system, USB,
LAN, Russian Model
Saudi Arabia Model
Thai Model
Model Name Using Similar Mechanism BDP-S3100 HBD-E3100/E4100/E6100
Mechanism Type
Optical Pick-up Block Name
BPX-7
KEM480AAA
South African Model
HBD-E2100/E3100/E6100
PX Model
HBD-E2100
SPECIFICATIONS
Amplifier Section Center: 150 W (at 6 ohms, 1 kHz) Bluetooth Section
Subwoofer: 150 W (at 6 ohms, 80 Hz) Communication system Bluetooth Specification version 3.0
US model only:
Inputs (Analog) Output Bluetooth Specification Power Class 2
AUDIO POWER SPECIFICATIONS
AUDIO IN Sensitivity: 1 V/400 mV Maximum communication range
POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
Inputs (Digital) Line of sight approx. 10 m 1)
(FTC)
TV (Audio Return Channel/OPTICAL) (except US, PX and Canadian models)
Front L + Front R: With 3 ohms loads, both channels driven, from
Supported formats: LPCM 2CH (up to 48 kHz), Line of sight approx. 10 m (33ft) 1)
180 Hz - 20,000 Hz;
Dolby Digital, DTS (US, PX and Canadian models)
rated 50 watts per channel
Frequency band 2.4 GHz band
minimum RMS power, with no more than 1% HDMI Section 2.4000 GHz - 2.4835 GHz
total harmonic distortion from 250 milliwatts to Connector Type A (19 pin) Modulation method FHSS (Freq Hopping Spread Spectrum)
rated output.
BD/DVD/CD System Compatible Bluetooth profiles 2)
BDV-E6100/BDV-E4100/BDV-E3100/BDV-E3200
Signal format system NTSC/PAL (except US, PX and Canadian models) A2DP 1.2 (Advanced Audio Distribution
BDV-E2100 (Except UK model):
NTSC (US, PX and Canadian models) Profile)
POWER OUTPUT (rated)
AVRCP 1.3 (Audio Video Remote Control
Front L/Front R: 75 W + 75 W (at 3 ohms, 1 kHz, 1% THD) USB Section Profile)
POWER OUTPUT (reference) (USB) port: Type A (For connecting USB memory, memory Supported Codecs 3)
SBC 4), AAC
Front L/Front R/Surround L/Surround R: card reader, digital still camera, and digital video Transmission range (A2DP)
125 W (per channel at 3 ohms, 1 kHz) camera) 20 Hz – 20,000 Hz (Sampling frequency
Center: 250 W (at 6 ohms, 1 kHz)
LAN Section 44.1 kHz, 48 kHz)
Subwoofer: 250 W (at 6 ohms, 80 Hz)
Inputs (Analog) LAN (100) terminal 100 BASE-TX Terminal 1)
The actual range will vary depending on factors such as obstacles
AUDIO IN Sensitivity: 1 V/400 mV Wireless LAN Section between devices, magnetic fields around a microwave oven, static
MIC 1/2 Sensitivity: 10 mV (Singapore model) Standards Compliance IEEE 802.11 b/g/n electricity, cordless phone, reception sensitivity, antenna’s perfor-
Inputs (Digital) Frequency and Channel US, Canadian, Argentina and Taiwan models: mance, operating system, software application, etc.
TV (Audio Return Channel/OPTICAL) 2.4 GHz band: channels 1–11
2)
Bluetooth standard profiles indicate the purpose of Bluetooth
Supported formats: LPCM 2CH Other models: communication between devices.
(up to 48 kHz), Dolby Digital, DTS 2.4 GHz band: channels 1–13
3)
Codec: Audio signal compression and conversion format
BDV-E2100 (UK model) Frequency band 2.4000 GHz - 2.4835 GHz
4)
Subband Codec
POWER OUTPUT (rated)
Front L/Front R: 75 W + 75 W (at 3 ohms, 1 kHz, 1% THD)
BLU-RAY DISC/DVD RECEIVER

POWER OUTPUT (reference)
Front L/Front R/Surround L/Surround R:
100 W (per channel at 3 ohms, 1 kHz)
Center: 200 W (at 6 ohms, 1 kHz)
Subwoofer: 200 W (at 6 ohms, 80 Hz)
BDV-E4100/ BDV-E6100 (Chinese model)
POWER OUTPUT
Front L/Front R/Surround L/Surround R:
75 W (per channel at 3 ohms, 1 kHz)
9-890-611-08
2014F80-1 Sony Corporation
© 2014.06 Published by Sony EMCS (Malaysia) PG Tec
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
FM Tuner Section • Windows Media is either a registered trademark or trademark of Microsoft Corporation in the
System PLL quartz-locked digital synthesizer United States and/or other countries.
Tuning range 87.5 MHz - 108.0 MHz (50 kHz step) This product is protected by certain intellectual property rights of Microsoft Corporation. Use
(except US, PX and Canadian models) or distribution of such technology outside of this product is prohibited without a license from
87.5 MHz - 108.0 MHz (100 kHz step) Microsoft or an authorized Microsoft subsidiary.
(US, PX and Canadian models)
Content owners use Microsoft® PlayReady™ content access technology to protect their in-
Antenna (aerial) FM wire antenna (aerial)
tellectual property, including copyrighted content. This device uses PlayReady technology to
General access PlayReady-protected content and/or WMDRM-protected content. If the device fails to
Power requirements US and Canadian models:
properly enforce restrictions on content usage, content owners may require Microsoft to revoke
120 VAC, 60 Hz
Taiwan model: the device’s ability to consume PlayReady-protected content. Revocation should not affect un-
120 V AC, 50/60 Hz protected content or content protected by other content access technologies. Content owners may
Latin-American, 110 – 240 V AC area in require you to upgrade PlayReady to access their content. If you decline an upgrade, you will not
E model and PX models: be able to access content that requires the upgrade.
110 V – 240 V AC, 50/60 Hz • DLNA™, the DLNA Logo and DLNA CERTIFIED™ are trademarks, service marks, or certifi-
Saudi Arabia model: cation marks of the Digital Living Network Alliance.
127 V – 240 V AC, 50/60 Hz • Opera® Devices SDK from Opera Software ASA. Copyright 1995-2013 Opera Software ASA.
Other models: All rights reserved.
220 V – 240 V AC, 50/60 Hz
Power consumption On: 95 W
Standby: 0.3 W
Dimensions (w/h/d) (approx.)
430 mm × 50.5 mm × 296 mm
(17 in × 2 in × 11 ¾ in) incl. projecting parts
Mass (approx.) 2.7 kg (5 lb 16 oz)
Design and specifications are subject to change without notice. • All other trademarks are trademarks of their respective owners.
• Other system and product names are generally trademarks or registered trademarks of the manu-
facturers. ™ and ® marks are not indicated in this document.
• Standby power consumption: 0.3 W.
• Over 85% power efficiency of amplifier block is achieved with the full digital amplifier, S-Master.
End User License Information
• This system incorporates with Dolby* Digital and Dolby Pro Logic adaptive matrix surround
decoder and the DTS** Digital Surround System. Gracenote® End User License Agreement
* Manufactured under license from Dolby Laboratories. This application or device contains software from Gracenote, Inc. of Emeryville, California
Dolby, Pro Logic, and the double-D symbol are trademarks of Dolby Laboratories. (“Gracenote”). The software from Gracenote (the “Gracenote Software”) enables this application
** Manufactured under license under U.S. Patent Nos: 5,956,674; 5,974,380; 6,226,616; to perform disc and/or file identification and obtain music-related information, including name,
6,487,535; 7,212,872; 7,333,929; 7,392,195; 7,272,567 & other U.S. and worldwide patents artist, track, and title information (“Gracenote Data”) from online servers or embedded databases
issued & pending. DTS-HD, the Symbol, & DTS-HD and the Symbol together are regis- (collectively, “Gracenote Servers”) and to perform other functions. You may use Gracenote Data
tered trademarks of DTS, Inc. Product includes software. © DTS, Inc. All Rights Reserved. only by means of the intended End-User functions of this application or device.
• This system incorporates High-Definition Multimedia Interface (HDMITM) technology. You agree that you will use Gracenote Data, the Gracenote Software, and Gracenote Servers for
The terms HDMI and HDMI High-Definition Multimedia Interface, and the HDMI Logo are your own personal non-commercial use only. You agree not to assign, copy, transfer or transmit
trademarks or registered trademarks of HDMI Licensing LLC in the United States and other the Gracenote Software or any Gracenote Data to any third party. YOU AGREE NOT TO USE
countries. OR EXPLOIT GRACENOTE DATA, THE GRACENOTE SOFTWARE, OR GRACENOTE
• Java is a trademark of Oracle and/or its affiliates. SERVERS, EXCEPT AS EXPRESSLY PERMITTED HEREIN.
• “DVD logo” is a trademark of DVD Format/ Logo Licensing Corporation. You agree that your non-exclusive license to use the Gracenote Data, the Gracenote Software,
• “Blu-ray Disc”, “Blu-ray”, “Blu-ray 3D”, “BD-LIVE”, “BONUSVIEW”, and logos are trade- and Gracenote Servers will terminate if you violate these restrictions. If your license terminates,
marks of the Blu-ray Disc Association. you agree to cease any and all use of the Gracenote Data, the Gracenote Software, and Gracenote
• “Blu-ray Disc”, “DVD+RW”, “DVD-RW”, “DVD+R”, “DVD-R”, “DVD VIDEO”, and “CD” Servers. Gracenote reserves all rights in Gracenote Data, the Gracenote Software, and the Gracenote
logos are trademarks. Servers, including all ownership rights. Under no circumstances will Gracenote become liable for
• “BRAVIA” is a trademark of Sony Corporation. any payment to you for any information that you provide. You agree that Gracenote, Inc. may enforce
• “AVCHD 3D/Progressive” and the “AVCHD 3D/Progressive” logo are trademarks of Panasonic its rights under this Agreement against you directly in its own name.
Corporation and Sony Corporation. The Gracenote service uses a unique identifier to track queries for statistical purposes. The purpose
• , “XMB”, and “xross media bar” are trademarks of Sony Corporation and Sony Computer of a randomly assigned numeric identifier is to allow the Gracenote service to count queries without
Entertainment Inc. knowing anything about who you are. For more information, see the web page for the Gracenote
• “Playstation” is a registered trademark of Sony Computer Entertainment Inc. Privacy Policy for the Gracenote service.
• “Sony Entertainment Network logo” and “Sony Entertainment Network” are trademarks of Sony The Gracenote Software and each item of Gracenote Data are licensed to you “AS IS.” Gracenote
Corporation. makes no representations or warranties, express or implied, regarding the accuracy of any Gracenote
• Music and video recognition technology and related data are provided by Gracenote®. Data from in the Gracenote Servers. Gracenote reserves the right to delete data from the
Gracenote is the industry standard in music recognition technology and related content delivery. Gracenote Servers or to change data categories for any cause that Gracenote deems sufficient.
For more information, please visit www.gracenote.com. No warranty is made that the Gracenote Software or Gracenote Servers are error-free or that
CD, DVD, Blu-ray Disc, and music and video-related data from Gracenote, Inc., copyright © functioning of Gracenote Software or Gracenote Servers will be uninterrupted. Gracenote is not
2000-present Gracenote. obligated to provide you with new enhanced or additional data types or categories that Gracenote
Gracenote Software, copyright © 2000-present Gracenote. One or more patents owned by Gra- may provide in the future and is free to discontinue its services at any time. GRACENOTE
cenote apply to this product and service. See the Gracenote website for a nonexhaustive list of DISCLAIMS ALL WARRANTIES EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED
applicable Gracenote patents. Gracenote, CDDB, MusicID, MediaVOCS, the Gracenote logo TO, IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
and logotype, and the “Powered by Gracenote” logo are either registered trademarks or trade- PURPOSE, TITLE, AND NON-INFRINGEMENT. GRACENOTE DOES NOT WARRANT THE
marks of Gracenote, Inc. in the United States and/or other countries. RESULTS THAT WILL BE OBTAINED BY YOUR USE OF THE GRACENOTE SOFTWARE
OR ANY GRACENOTE SERVER. IN NO CASE WILL GRACENOTE BE LIABLE FOR ANY
CONSEQUENTIAL OR INCIDENTAL DAMAGES OR FOR ANY LOST PROFITS OR LOST
REVENUES.
© Gracenote, Inc. 2009
• Wi-Fi®, Wi-Fi Protected Access® and Wi-Fi Alliance® are registered marks of the Wi-Fi CAUTION
Alliance.
• Wi-Fi CERTIFIED™, WPA™, WPA2™ and Wi-Fi Protected Setup™ are marks of the Wi-Fi
Use of controls or adjustments or performance of procedures
Alliance. other than those specified herein may result in hazardous radia-
• The N Mark is a trademark or registered trademark of NFC Forum, Inc. in the United States and tion exposure.
in other countries.
• Android is a trademark of Google Inc.
• The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc.
and any use of such marks by Sony Corporation is under license. Other trademarks and trade
names are those of their respective owners.
• MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and
Thomson.
• This product incorporates proprietary technology under license from Verance Corporation and
is protected by U.S. Patent 7,369,677 and other U.S. and worldwide patents issued and pending
as well as copyright and trade secret protection for certain aspects of such technology. Cinavia
is a trademark of Verance Corporation. Copyright 2004-2010 Verance Corporation. All rights
reserved by Verance. Reverse engineering or disassembly is prohibited.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
SAFETY-RELATED COMPONENT WARNING!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
REPLACE THESE COMPONENTS WITH SONY PARTS PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. PUBLIÉS PAR SONY.
2
HBD-E2100/E3100/ E3200/E4100/E6100
Ver. 1.5
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
To Exposed Metal
Parts on Set
AC
0.15 μF 1.5 kΩ voltmeter
(0.75 V)
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
3
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
TABLE OF CONTENTS
1. SERVICING NOTES .............................................. 5 6-19. Printed Wiring Board - PANEL Board - ......................... 56
6-20. Schematic Diagram - PANEL Board - ............................ 57
2. DISASSEMBLY 6-21. Printed Wiring Board
2-1. Disassembly Flow ........................................................... 13 - KARAOKE Board (SP, RU) - ...................................... 58
2-2. How To Bend FFC .......................................................... 14 6-22. Schematic Diagram
2-3. Case ................................................................................. 15 - KARAOKE Board (SP, RU) - ...................................... 58
2-4. Panel Loading Assy ........................................................ 15 6-23. Printed Wiring Board - POWER KEY Board -............... 58
2-5. Front Panel Assy ............................................................. 16 6-24. Schematic Diagram - POWER KEY Board - ................. 58
2-6. BD Drive (BPX-7) .......................................................... 16
2-7. POWER KEY Board, WLAN/BT COMBO Card, 7. EXPLODED VIEWS
KARAOKE Board (SP, RU), PANEL Board .................. 17 7-1. Case Section .................................................................... 76
2-8. MB1002 Board ............................................................... 18 7-2. Front Panel Section ......................................................... 77
2-9. AMP Board ..................................................................... 18 7-3. Chassis Bottom Section .................................................. 78
2-10. SWITCHING REGULATOR (SWR1) ........................... 19 7-4. Chassis Section ............................................................... 80
2-11. Optical Pick-up Block (KEM480AAA), 7-5. BD Drive Section (BPX-7) ............................................. 81
Wire (Flat Type) .............................................................. 20
8. ELECTRICAL PARTS LIST .............................. 82
3. TEST MODE ............................................................. 21
4. ELECTRICAL CHECK .......................................... 32
5. TROUBLESHOOTING ........................................... 33
6. DIAGRAMS
6-1. Block Diagram - SERVO Section - ................................ 37
6-2. Block Diagram - MEMORY/HDMI Section - ................ 38
6-3. Block Diagram - MAIN Section -................................... 39
6-4. Block Diagram - AMP Section - ..................................... 40
6-5. Block Diagram - POWER SUPPLY Section - ................ 41
6-6. Printed Wiring Board
- MB1002 Board (Component Side) - ............................ 43
- MB1002 Board (Conductor Side) - .............................. 44
6-8. Schematic Diagram - MB1002 Board (1/6) - ................. 45
- AMP Board (Component Side) - .................................. 51
- AMP Board (Conductor Side) - .................................... 52
6-16. Schematic Diagram - AMP Board (1/3) - ....................... 53
NOTES ON CHIP COMPONENT REPLACEMENT

• Never reuse a disconnected chip component.
This appliance is classified as a
CLASS 1 LASER product. This • Notice that the minus side of a tantalum capacitor may be dam-
marking is located on the rear aged by heat.
This appliance is classified as a exterior.
CLASS 3R LASER product. The nameplate is located on the FLEXIBLE CIRCUIT BOARD REPAIRING
Visible and invisible laser radiation bottom exterior. • Keep the temperature of soldering iron around 270 °C during
is emitted when the laser protective repairing.
housing is opened, so be sure to • Do not touch the soldering iron on the same conductor of the
avoid direct eye exposure.
circuit board (within 3 times).
This marking is located on the laser
protective housing inside the
• Be careful not to apply force on the conductor when soldering
enclosure. or unsoldering.
4
HBD-E2100/E3100/E3200/E4100/E6100
SECTION 1 Ver. 1.5
SERVICING NOTES
NOTE OF REPLACING THE IC101, IC102, IC103,
NOTES ON HANDLING THE OPTICAL PICK-UP
IC203, IC204, IC601, IC706, IC801 AND IC1001 ON
BLOCK OR BASE UNIT
THE MB1002 BOARD
The laser diode in the optical pick-up block may suffer electro- IC101, IC102, IC103, IC203, IC204, IC601, IC706, IC801 and
static break-down because of the potential difference generated by IC1001 on the MB1002 board cannot exchange with single. When
the charged electrostatic load, etc. on clothing and the human body. these parts on the MB1002 board are damaged, exchange the entire
During repair, pay attention to electrostatic break-down and also mounted board.
use the procedure in the printed matter which is included in the
repair parts. NOTE OF REPLACING THE IC102 AND IC103 ON
The flexible board is easily damaged and should be handled with THE MB1002 BOARD
care. Replacement of IC102 and IC103 on the MB1002 board used in
this unit requires a special tool.
NOTES ON LASER DIODE EMISSION CHECK TEST DISC
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical Part No. Description Layer
pickup block. Therefore, when checking the laser diode emission, J-6090-199-A BLX-104 Single Layer
observe from more than 30 cm away from the objective lens. J-6090-200-A BLX-204 Dual Layer
J-2501-307-A CD (HLX-A1)
UNLEADED SOLDER
J-2501-305-A HLX-513 Single Layer (NTSC)
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead. J-2501-306-A HLX-514 Dual Layer (NTSC)
(Caution: Some printed circuit boards may not come printed with J-6090-077-A HLX-506 Single Layer (PAL)
the lead free mark due to their particular size) J-6090-078-A HLX-507 Dual Layer (PAL)
: LEAD FREE MARK Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883-
989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204.
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
Operation and Display:
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
1. BLX-104
applied to the solder joint for a slightly longer time.
Procedure:
Soldering irons using a temperature regulator should be set to
1. Select 23.976Hz/1080p.
about 350 °C.
2. Play “4.Motion picture”.
Caution: The printed pattern (copper foil) may peel away if
3. Check whether player can play back or not.
the heated tip is applied for too long, so be careful!
4. Check each outputs.
• Strong viscosity
Video:
Unleaded solder is more viscous (sticky, less prone to flow)
Composite/S Video/component/HDMI.
than ordinary solder so use caution not to let solder bridges
Audio:
occur such as on IC pins, etc.
Speaker out.
• Usable with ordinary solder
* When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz)
It is best to use only unleaded solder but unleaded solder may
can use instead of 1080/24p.
also be added to ordinary solder.
However this is temporary correspondence.
RELEASING THE DISC TRAY LOCK
2. BLX-204
The disc tray lock function for the antitheft of an demonstration
Procedure:
disc in the store is equipped.
1. Select 1080i (59.94Hz or 50Hz).
Releasing Procedure:
3. Check whether player can play back or not (Check the picture
1. Press the [?/1] button to turn on the system.
and sound output).
2. Touch the [FUNCTION] sensor to select “BD/DVD”.
3. Touch the [x] and [Z] sensors simultaneously and hold down
3. CD (HLX-A1)
until “D. OFF” displayed on the fluorescent indicator tube
Procedure:
(around 5 seconds).
Check whether player can play back or not (Check the sound out-
Note: When “D. LOCK” is displayed, the disc tray lock is not released by
put).
turning power on/off with the [?/1] button.
4. HLX-513/514 (NTSC), HLX-506/507 (PAL)
ABOUT THE LENS CLEANING Procedure:
Do not do the lens cleaning with the cotton bud etc. It causes the 1. After displayed Main Menu, select “1.Video Signal”.
trouble. 2. Play “1.Color bar 100%” (Check the picture and sound out-
put).
3. Return to Menu.
4. Play “Demonstration 4:3” or “Demonstration 16:9” (Check the
picture and sound output).
5
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
NOTE OF REPLACING THE OPTICAL DEVICE 1-3. Barcode decoder (BDPRdec)

(KEM480AAA) OR MB1002 BOARD Jig name : BDPRdec.exe
Release : 2011.8.25
The password will be supplied to only service HQ, and
Version : 3.0.0.0
service center name, q’ty and all of software registered
Software contents :
information should be maintained by service HQ, and
• BDPRdec.exe : Barcode decoder software
Audio will ask to report the registration information.
• SavePath.ini : Decoded file destination setting file (Ini-
Optical device (KEM480AAA) for BD requires precise read out tial destination is “C:\BD\BuData.txt”)
functions and secure contents protection system for more than past • TasmanBars.dll : Decode dll
DVD/CD. • Uninst.exe : Uninstall the “BDPRdec.exe” from PC
Therefore, in the case repaired as follows, the writing work of the
OP data is necessary. Install procedure:
1. Unzip the barcode decoder files to any PC folder.
• When the optical device (KEM480AAA) is replaced (The 2. Check the attached 2D code photo (OK_sample.JPG) drag &
MB1002 board doesn’t replace). drop onto “BDPRdec.exe”.
• When both the optical device (KEM480AAA) and MB1002 When the barcode decoder is used for the first time, the pass-
board are replaced. word is necessary. It is unnecessary since the second times.
• When the MB1002 board is replaced (The optical device
(KEM480AAA) doesn’t replace) (In this case, do the work of Note 1: The password will be supplied to only service headquarters, and
“3. Optical device (KEM480AAA) replacement” other than service center name/q’ty/all of software registered information
the replacement of new optical device). should be maintained by service headquarters.
Note 2: Do not change the decoded file name “BuData.txt”.
Note: The servo adjustment is done while writing the OP data. The manual
adjustment is unnecessary. 3. When “.NET frame work requirements” is displayed, down-
LD ON TIME history doesn’t carry over. load following applications from Microsoft download site.
Do not touch any optical block parts, turn table and during replac-
ing. BD laser diode is very sensitive. • Microsoft .NET Framework Version 2.0 Redistributable Pack-
age (x86)
1. Preparation http://www.microsoft.com/downloads/details.aspx?displaylan
1-1. ESD Countermeasure g=en&FamilyID=0856eacb-4362-4b0d-8edd-aab15c5e04f5
It is necessary to confirm the state of static electricity in the work
space before the repair is started. • Microsoft .NET Framework 2.0 Service Pack 1 (x86)
The static electricity resistance of the BD laser is weaker than that http://www.microsoft.com/downloads/details.aspx?displaylan
of the DVD/CD laser. g=en&FamilyID=79bc3b77-e02c-4ad3-aacf-a7633f706ba5
Do work space and worker’s ESD countermeasures to prevent de-
struction by ESD. How to use:
Case 1 Drag & drop 2D code photo onto “BDPRdec.exe”.
1-2. Jig Case 2 Drag & drop BU data file onto “BDPRdec.exe”.
• Digital camera (Recommend with macro mode) Data file name be changed to specify format and end of
• USB memory 7 character are defined.
• PC You can also enter the file path at the prompt.
• Barcode decoder (Refer to “1-3. Barcode decoder
(BDPRdec)”)
6
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
2. Pass-fail judgment of the optical device (KEM480AAA)

Perform pass-fail judgment to judge whether the repair of the optical device (KEM480AAA) is necessary.
2-1. Flow of drive section check
Confirm whether Confirm whether the Confirm F201, F202,

BD (BLX-104) can be NO NO F203 on the MB1002
drive voltage is the
reproduced following values board, and replace it
Q205 pin 1 : 12 V when it is open.
YES Q206 pin 1 : 5 V
YES
Confirm OP FFC cable Confirm whether the Replace the

(Part No. 1-846-347-11) NO optical device IOP NO optical device
and SPD FFC cable is normal in the (KEM480AAA)
(Part No. 1-846-349-61), service mode (Refer to “3. Optical
and replace it when it (Refer to “2-2. Flow device (KEM480AAA)
has been damaged of optical device replacement”)
IOP check”)
Then, confirm whether
this unit operates
normally
YES
OK
Confirm whether
DVD (HLX-513)/ NO
CD (HLX-A1) can be
reproduced
Note: Refer to “2-11. OPTICAL PICK-UP BLOCK (KEM480AAA), WIRE (FLAT TYPE)” (page 20) about how to remove the COVER, DRIVE.
2-2. Flow of optical device IOP check
Turn the power on, Confirm whether Replace the

and change function value is the NO optical device
to “BD/DVD” specification value (Refer to “3. Optical
device (KEM480AAA)
Specification value: replacement”)
BD: ±6 mA
Press the buttons on DVD/CD: ±9 mA
the remote commander
in order of [DISPLAY], YES
[0], [2], [1] [SUBTITLE],
and enter the service OK
mode
Press the buttons on

the remote commander
in order of [8], [7], [3],
[ ], and the
dIOP value is displayed
7
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
3. Optical device (KEM480AAA) replacement

Flow of replacement:
Note: The photo in flow is an image.
Save the text data

to USB memory
Barcode label on (memory capacity
new optical device need not be 8GB)
(KEM480AAA)
bottom side
Connect USB memory
with front USB connector
on this unit, and read the
text data by the service mode
Take photo (JPEG)

by digital camera
Change photo into

the text data with
the barcode decoder
Procedure: – Front view –

1. Remove the INSULATOR (4 pieces) and broken optical de- (E2100) (E3100/E4100/E6100)
vice (KEM480AAA) from LOADING ASSY. \/1 \/1
2. Take photo of the barcode on new optical device

(KEM480AAA) bottom side by digital camera.
Front USB connector Front USB connector
7. Press the [FUNCTION] button on the remote commander to

select “BD/DVD”.
8. Press the buttons on the remote commander in order of
[DISPLAY], [0], [2], [1], [SUBTITLE], and enter the service
mode.
9. Press the buttons on the remote commander in order of [8], [1],
3. Assemble the INSULATOR (4 pieces) to new optical device [ENTER], and execute “[1] Drive OP data Write”. BDV must
(KEM480AAA), fix (Torque value: 2 kgf) it to LOADING select Mode 1.
ASSY with screw, and assemble this unit. 10. Turn the power off after writing the OP data.
4. Drag & drop the taken photo by step 2 to “BDPRdec.exe”, and 11. Turn the power on, and enter the service mode again.
make the text data (File name: BuData.txt). 12. Press the buttons on the remote commander in order of [8], [7],
5. Save the text data to USB memory. [3], [ENTER], and the dIOP value is displayed.
6. Connect USB memory with front USB connector on this unit, 13. Confirm value is the following specification value, and turn the
and turn the power on. power off.
Specification value:
BD : 6 mA
DVD/CD : 9 mA
14. Turn the power on, confirm playback performance of the BD

(BLX-104)/DVD (HLX-514)/CD (HLX-A1).
15. Completely assemble this unit, and complete the repair.
8
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
NOTE OF REPLACING MB1002 BOARD OR WLAN/ NOTE THE BD DRIVE (BPX-7) PARTS REPLACING
BT COMBO CARD The mechanism blocks except optical device of BD drive (BPX-7)
When the MB1002 board or WLAN/BT COMBO card are re- are chiefly composed of the following parts.
placed, please execute the below service mode. • HOLDER, CHUCK ASSY
1. Please update FW to M16.R.157 • LOADING ASSY
2. Whenever replace MB1002 board or WLAN/BT COMBO • COVER, DRIVE
CARD please execute “Reset to Factory Default Settings”
from XMB. These parts are produced by two venders, it is not compatible.
Procedure: Therefore, HOLDER, CHUCK ASSY and LOADING ASSY
[Home menu  Setup  Resetting  Reset to Factory Default are supplied by one pair as repair parts. Please exchange both
Settings  All Settings] HOLDER, CHUCK ASSY and LOADING ASSY at the same
Next, go to service menu and execute “(1) Bluetooth Enable” and time.
“(3) Write Bluetooth device address to Registry”.
Finally check one touch NFC listening function at normal power COVER, DRIVE need not be exchanged at the same time.
on.
Note 1: The laser caution label is not pasted to LOADING FOR SER-
Note: The operation in this mode must use a remote commander VICE. Please peel off an original laser caution label, and paste
and TV monitor. it to LOADING FOR SERVICE when you use LOADING FOR
SERVICE.
1. Connect this unit with TV monitor. LABEL, LASER CAUTION
2. Press the (\/1) button to turn the power on.
3. Press button in order of the [DISPLAY]  [0]  [2]  [1]  LOADING FOR SERVICE
[SUBTITLE] on the remote commander.
(Make the interval when each button is pressed within two
seconds) HOLDER, CHUCK ASSY
4. Enter the BD service mode. The OSD menu on TV monitor can
be operated by remote commander.
5. Press [m] and Enter Diag.
6. Press [,] and Enter Bluetooth Device Test (Screen 1).
7. Enter (1) Bluetooth Enable, wait until the display show
“ Status : Bluetooth Enable Successful ” (Screen 2). LOADING ASSY
8. Enter (3) Write Bluetooth device address to Registry, wait until
the display show “Bluetooth Device Address” and “Status :
Write Successfull” (Screen 3).
9. Enter [RETURN] to the selection of test category.
(Screen 1)
Diag
Category: Bluetooth Device Test
Diag
COVER, DRIVE
[1] Bluetooth Enable
[2] Bluetooth Disable /LPLWVDPSOHLQVWDWHRIODVHUFDXWLRQODEHO
[3] Write Bluetooth device address to Registry Note 2: If laser caution label is a condition of the figure below,
[4] Bluetooth Inquiry Test
it is acceptable.
Status : Bluetooth Enable Successful!
(Screen 2) HELP: [UP][DOWN][ENT][RET]
(Screen 3)
Diag

[2] Bluetooth Disable
[3] Write Bluetooth device address to Registry
Bluetooth device address : 00:01:36:23:FD:CF

Status : Write Successful!
HELP: [UP][DOWN][ENT][RET]
9
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
MODEL IDENTIFICATION NOTE OF REPLACING THE IC3102 AND IC3302 ON

- Rear view - THE AMP BOARD AND THE COMPLETE AMP BOARD
When IC3102 and IC3302 on the AMP board and the complete
Part No. AMP board are replaced, it is necessary to spread the compound
(GREASE (G-747)) 1KG) (Part No. 7-640-004-33 ) between parts
Model Part No. and heat sink.
Spread the compound referring to the figure below.
E2100 4-438-896-0[]
E3100 4-438-896-1[] – AMP Board (Component Side) –
E4100 4-438-896-2[]
E6100 4-438-896-3[]
E3200 4-438-896-6[]
CAPACITOR ELECTRICAL DISCHARGE PROCESSING

When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistor to both ends of respective capacitors. IC3302 IC3102
• Switching regulator
C207, C201, C402, C503, C504
– SWITCHING REGULATOR (Conductor Side) –
C402
C504 C503
C201
C207
IC3302 IC3102
(To both ends of each capacitor)
800 :/2 W
10
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
CHECKING METHOD OF NETWORK OPERATION 2. Checking method of wired LAN operation

It is necessary to check the network operation, when replacing the Check that access point is recognized surely.
MB1002 board. Check the operation of wireless and wired LAN,
according to the following method. Procedure:
1. Connect the main unit to the router or the hub, etc. with the
1. Checking Method of Wireless LAN Operation LAN cable.
Check that access point is recognized surely. 2. Press the [HOME] button on the remote commander to enter
the home menu.
Necessary Equipment: 3. Press the [m]/[M]/[<]/[,] buttons on the remote commander
Wireless access point with router function (AP) to select “Network Settings”“Internet Settings”, and press
the [ ] button on the remote commander.
Procedure: 4. Press the [m]/[M] buttons on the remote commander to select
1. Press the [HOME] button on the remote commander to enter “Wired Setup”, and press the [ ] button on the remote com-
the home menu. mander.
2. Press the [m]/[M]/[<]/[,] buttons on the remote command- 5. Press the [m]/[M] buttons on the remote commander to select
er to select “Network Settings”“Internet Settings”, and press “Auto”, and press the [ ] button on the remote commander.
the [ ] button on the remote commander. 6. Press the [,] button on the remote commander.
3. Press the [m]/[M] buttons on the remote commander to select 7. Press the [m]/[M] buttons on the remote commander to select
“Wireless Setup (built-in)”, and press the [ ] button on the “Save & Connect”, and press the [ ] button on the remote
remote commander. commander.
4. The system starts searching for access points, and displays a 8. When “Internet Settings is now complete.” appears, then press
list of up available network name (SSID). the [ ] button on the remote commander.
5. Check that access point (SSID) is displayed on the searching 9. Press the [HOME] button on the remote commander to enter
result. the home menu.
Note: Refer to the instruction manual about details of the setting method. 10. Press the [m]/[M]/[<]/[,] buttons on the remote commander
to select “Network Settings”“Network Connection Diagnostics”,
and press the [ ] button on the remote commander.
11. Press the [<]/[,] buttons on the remote commander to se-
lect “IPV4” or “IPV6”, and press [ ] button on the remote
commander.
12. Press the [<]/[,] buttons on the remote commander to
select “Start”, and press the [ ] button on the remote com-
mander.
13. Check that IP address can be acquired.
Note: Refer to the instruction manual about details of the setting method.
11
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF

Note 1: After the case is removed, this work is done.
Note 2: Please prepare the thin wire (clip etc. processed to the length of 8 cm or more).
1 Remove the case.

(Illustration of disassembly is omitted.)
hole
– Side view –
Insert the clip etc.

processed to the tray
BD drive
length of 8 cm or
more in the hole
on the side of the
chassis and push. 3
2 Insert the clip etc.

8 cm or more
tray
Note: Push after it inserts it in this hole well.

– Top view –
SERVICE POSITION
MB1002 board
BD drive (BPX-7)
AMP board
switching regulator (SWR1)

(3L392W-1) (US, CND, AEP, UK,
SAF, SP, TW, AUS,
TH, CH)
(3L392W) (E3, E51, PX, EA, E12,
POWER KEY board E32, RU, MX6, AR)
RC-S801/A (WW)
• Abbreviation
AR : Argentina model
card, WLAN/BT COMBO
AUS : Australian model
CH : Chinese model
CND : Canadian model
E3 : 240 V AC area in E model
PANEL board E12 : 220 – 240 V AC area in E model
KARAOKE board E32 : 110 – 240 V AC area in E model
(SP, RU) E51 : Chilean and Peruvian models
EA : Saudi Arabia model
NON-KARAOKE board
MX6 : Latin-American model
(EXCEPT SP, RU)
PX : PX model
RU : Russian model
SAF : South African model
SP : Singapore model
TH : Thai model
TW : Taiwan model
12
HBD-E2100/E3100/E3200/E4100/E6100
SECTION 2 Ver. 1.5
DISASSEMBLY
• This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
SET 2-2. HOW TO BEND FFC

(Page 14)
2-3. CASE
(Page 15)
2-4. PANEL LOADING ASSY

(Page 15)
2-5. FRONT PANEL ASSY

(Page 16)
2-6. BD DRIVE (BPX-7)

(Page 16)
2-7. POWER KEY BOARD, WLAN/BT COMBO CARD,

KARAOKE BOARD (SP, RU), PANEL BOARD
(Page 17)
2-8. MB1002 BOARD

(Page 18)
2-9. AMP BOARD

(Page 18)
2-10. SWITCHING REGULATOR (SWR1)

(Page 19)
2-11. OPTICAL PICK-UP BLOCK (KEM480AAA),

WIRE (FLAT TYPE)
(Page 20)
13
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
2-2. HOW TO BEND FFC

: Mountain fold
: Valley fold
wire (flat type) (8 core), length 260 mm (Ref. No. 52)

40 mm 220 mm
RC-S801/A MB1002
(WW) 45º
(CN806)
The upper side The upper side
is contact side. is contact side.
wire (flat type) (15 core), length 300 mm (Ref. No. 57) (EXCEPT SP, RU)
25 mm 235 mm 18 mm 22 mm
MB1002 board 45º 45º PANEL board
(CN805) (CN02)
wire (flat type) (21 core), length 305 mm (Ref. No. 57) (SP, RU)
30 mm 235 mm 10 mm 20 mm
MB1002 board 45º 45º PANEL board
(CN803) (CN01)

105 mm
MB1002 board AMP board

(CN707) (CN3505)


29 mm 78 mm 21 mm 12 mm 110 mm
MB1002 board BD drive
45º 45º 45º
(CN660) (BPX-7)
The lower side The lower side
39 mm 12 mm 120 mm
97 mm
flexible flat cable (45 core), length 231 mm (Ref. No. 207)
163 mm
19 mm 49 mm 101 mm 62 mm
45º 45º
(CN501) (BPX-7)
is contact side. 42 mm is contact side.
91 mm

33 mm 46 mm 58 mm 139 mm
(CN670) 45º 45º 45º (BPX-7)
The lower side The lower side
is contact side. 39 mm 133 mm is contact side.
85 mm
143 mm
14
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
Note: Follow the disassembly procedure in the numerical order given.
2-3. CASE
1 four screws (+BV3 (3-CR))
7 case
5
4
A
3 five claws
2 four screws (+BV3 (3-CR))
2-4. PANEL LOADING ASSY
4 panel loading assy
hole
– Side view –
Insert the clip etc.

processed to the
BD drive
length of 8 cm or
more in the hole
on the side of the 3 four claws
chassis and push. 2
1 Insert the clip etc.

8 cm or more
tray
Note: Push after it inserts it in this hole well.

– Top view –
15
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
2-5. FRONT PANEL ASSY
• Abbreviation
:LUHVHWWLQJ
RU : Russian model
switching regulator (SWR1) SP : Singapore model
MB1002 board
front side
1 wire (flat type) (8 core)

(CN806)
(E2100) (E3100/E4100/E6100)
3 three claws 3 three claws
4 front panel assy
2 four claws 2 four claws
(SP) 6358
4 front panel assy
2-6. BD DRIVE (BPX-7)
3 wire (flat type)

(5 core) (CN670) 2 wire (flat type)
(9 core) (CN660)
7 sheet, sound
4 four screws
(+BV3 (3-CR))
1 flexible flat cable (45 core) (CN501)
8 BD drive BPX-7
5 boss
Note: When you install the BD
drive (BPX-7), please match 6
the position of the boss two
places.
16
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
2-7. POWER KEY BOARD, WLAN/BT COMBO CARD, KARAOKE BOARD (SP, RU), PANEL BOARD
:LUHVHWWLQJ
front side
:LUHVHWWLQJ
front side MB1002 board
harness USB MB1002 board
7 wire (flat type) (21 core) (CN01)

(SP, RU)
wire (flat type) (15 core) (CN02)
(EXCEPT SP, RU)
4 CN404 (5P)
1 CN804 (2P)
3 POWER KEY board
2 one screw
(+BV3 (3-CR))
5 one screw
(+BV3 (3-CR)) G
D
F 9 harness (USB) CN51 (5P)
6 card, WLAN/BT COMBO
E
(SP, RU)
D
8 CN03 (6P)
:LUHVHWWLQJ F
switching regulator (SWR1) E
front side
0 two screws qs one screw
(+BV3 (3-CR)) (+BV3 (3-CR))
qa PANEL board
G qd KARAOKE board
(EXCEPT SP, RU)

D
MB1002 board F
E
qa PANEL board
• Abbreviation 0 two screws

RU : Russian model (+BV3 (3-CR))
qf NON-KARAOKE board
Note: When replacing the WLAN/BT COMBO card, refer to
“CHECKING METHOD OF NETWORK OPERATION”
(page 11).
17
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
2-8. MB1002 BOARD
5 five screws
(+BV3 (3-CR))
8 MB1002 board
6 one screw
(+BV3 (3-CR))
7 one screw
(+B 3 u5)
1 CN201 (2P)
2 tape
3 wire (flat type)
(24 core) (CN707)
4 CN202 (8P)
2-9. AMP BOARD
:LUHVHWWLQJ
AMP board
rear side
4 three screws
(+BV3 (3-CR))
3 four screws 5 heat sink (AMP 5.1CH)

(+BV3 (3-CR))
1 CN101 (4P)
2 CN4 (2P)
7 AMP board
6 two screws
(+BV3 (3-CR))
18
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
2-10. SWITCHING REGULATOR (SWR1)
2 five screws
(+BV3 (3-CR))
5 switching regulator (SWR1)

(3L392W-1) (US, CND, AEP, UK, SAF, SP, TW, AUS, TH, CH)
(3L392W) (E3, E51, PX, EA, E12, E32, RU, MX6, AR)
3 four claws
4 insulation, bottom
1 CN1 (2P)
3RZHUFRUGVHWWLQJ
rear side
• Abbreviation
CH : Chinese model
E12 : 220 – 240 V AC area in E model
E51 : Chilean and Peruvian models
PX : PX model
RU : Russian model
TH : Thai model
TW : Taiwan model
19
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
2-11. OPTICAL PICK-UP BLOCK (KEM480AAA), WIRE (FLAT TYPE)
3 holder, chuck assy (T)

1 four claws
2 two claws
0 insulator
6 two screws (S), float qa device, optical KEM480AAA
qs tape, non-halogene qf tape, FFC
qd wire (flat type) qg flexible flat cable

0 insulator (5 core) (45 core)
0 insulator 9
8
7
4 Insert the thin qk cover, drive

wire (clip etc.).
qh wire (flat type)

qj (9 core)
5 loading assy (T)
– Bottom view –
,QVWDOODWLRQRIIOH[LEOHIODWFDEOHFRUHZLUHIODWW\SHFRUHDQGZLUHIODWW\SHFRUH

Note: This illustration sees the loading assy (T) from bottom side.
3 wire (flat type) (9 core) 1 flexible flat cable (45 core)
4 Through the hole

Fold
2 Through the hole
5 tape, FFC
9 cover, drive
7 tape, non-halogene
8
terminal face
6 wire (flat type)
terminal face (5 core)
Fold
loading assy (T)

Under the
guide
Under the guide

(Fold area)
20
HBD-E2100/E3100/E3200/E4100/E6100
SECTION 3 Ver. 1.5
TEST MODE
COLD RESET FACTORY INITIALIZE
The cold reset clears certain data in this system without initialize Return all of the unit setting to their factory defaults.
Personal Information and some BD operation data. Execute this Note 1: Disconnect the following connections when you use this mode.
mode when returning the unit to the customers.  USB
Procedure:  LAN
Note 2: The operation in this mode must use a remote commander and TV
1. Press the [?/1] button to turn the power on.
monitor.
2. Press the [x] and [VOL –] buttons simultaneously and hold
down (around 5 seconds).
Procedure:
3. The message “WAIT” appears then “RESET” appears on fluo-
rescent indicator tube, then becomes standby states.
2. Press the [HOME] button on the remote commander, and the
home menu is displayed.
DEMO MODE
3. Select “Setup”  “Resetting”, and press the [ ] button on the
This mode let you lock the disc tray. When this mode is activated,
remote commander.
the disc will not eject when the [Z] button is pressed. The message
“D. LOCK” will be displayed on the fluorescent indicator tube.
Procedure:
1. Press the [?/1] button to turn the power on. Easy Network Settings
2. Press the [FUNCTION] button to select the “BD/DVD”.
3. Insert a disc.
4. During stop condition, press the [x] and [Z] buttons
simultaneously and hold down (around 5 seconds) until
“D. LOCK” displayed on the fluorescent indicator tube.
Releasing method: Resetting

Press the [x] and [Z] buttons simultaneously and hold down
(around 5 seconds) until “D. OFF” displayed on the fluorescent
indicator tube.
PANEL TEST
4. Select “Initialize Personal Information”, and press the [ ]
Procedure:
button on the remote commander.
2. Press button in order of the [DISPLAY] [0] [0] [1]
[SUBTITLE] on the remote commander (Make the interval
when each button is pressed within two seconds).
3. All segments in fluorescent indicator tube are lighted up. And
half segments in fluorescent indicator tube are lighted up, oth-
ers half segments in fluorescent indicator tube are lighted up,
then all segments in fluorescent indicator tube are lighted up. Reset to Factory Default Settings
This operation is repeated.
4. In the state of step 3, press the [VOL +] button on the remote
Initialize Personal Information
commander and model information is displayed on the fluores-
Delete personal data when disposing
cent indicator tube.
Each time the [VOL +] button on the remote commander is
pressed, the display changes from destination information,
STR version, special mode in this order, and returns to the
model information display.
5. Select “OK”, and press the [ ] button on the remote com-
5. In the state of step 3, press the [FUNCTION] button on the
mander.
remote commander and “K 0” is displayed on the fluorescent
indicator tube.
“K 0” value increases whenever a button or sensor on the unit Initialize Personal Information
is pressed. However, once a button or sensor has been pressed,
it is no longed taken into account. The information below will be deleted.
All button and sensors on the unit are pressed, “OK” and “K 9” Do you want to proceed?
are alternately displayed on the fluorescent indicator tube. - Playback history
- Internet video utilization information
Releasing method:
To release from this mode, press the [?/1] button.
OK Cancel
21
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6. The message “Close” appears, and press the [ ] button on the BD SERVICE MODE
remote commander. Note: The operation in this mode must use a remote commander and TV
monitor.

Setting method of the BD service mode:
1. Connect this unit with TV monitor.
Initialization complete. 3. Press button in order of the [DISPLAY] [0] [2] [1] 
[SUBTITLE] on the remote commander. (Make the interval
when each button is pressed within two seconds)
4. Enter the BD service mode. The OSD menu on TV monitor
Close
can be operated by remote commander.
1. Main Functions
• Diag
Performs unit test of devices installed on the board.
• Log
7. Select “Reset to Factory Default Settings”, and press the [ ] Error log is displayed. Displayed contents can also be saved in
button on the remote commander. an USB memory device.
• Factory Initialize
Restores the unit to its factory settings.
• Network
Checks the wired network connection.
• Version Up
• System Information
Reset to Factory Default Settings Displays the system information of the unit.
Restore each setting to the factory d Displays information such as the software version, drive infor-
mation, etc.
• EMC Test Mode
Not used.
• Drive
Write drive OP data and check drive.
• HDD Mode
Not used.
8. Select “All Settings”, and press the [ ] button on the remote
commander.
Reset to Factory Default Settings
Screen Settings
Audio Settings
BD/DVD Viewing Settings
Parental Control Settings
System Settings
Network Settings
All Settings
9. Select “Start”, and press the [ ] button on the remote com-

mander.
All Settings
Restore all settings to the factory default

settings. The system will turn off after
reset.
Start Cancel
10. Initialization ends when the message “HELLO” on the

fluorescent indicator tube disappears.
22
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
2. Menu Tree
Service
Service0ode
0ode 0enu
0enu DiaJ Device Test
[1]
[1] DiaJ
DiaJ 'LDJ7HVW 86%'$&,)FRQ0,&0),,3&
[2]
[2] LoJ
LoJ ([WHUQDO+'0,7UDQVFRGHUWHVW
[3]
[3] Factory
FactoryInitialize
Initialize
[4]
[4] Network
Network
[5]
[5] Version
Version Up
Up Video Test
[6]
[6] System
System Information
Information Video output test
[7] (0&7HVW0RGH
[8] Drive
>@+''0RGH
$udio Test
$udio output test
$udio Input Test

$XGLR,QSXW7HVW
:LUHOHVV/$17HVW
Only wireless model used
0LF7HVW
Not used
+'0,,QSXW7HVW
Not used
Transcorder Test
Not used
%OXHWRRWK'HYLFH7HVW
LoJ Error LoJ

Displays Error /RJ Displays error loJ
+''/RJ
Not used
Factory Initialize Start Initialize

,QLWLDOL]HGHIDXOWVHWWLQJ ,QLWLDOL]HGHIDXOWVHWWLQJIRUWKHXQLW
Network ,IFRQILJ
1Htwork diDJQRVLVIRUZLUHG View network status
3LQJ
&RQILUPQHWZRUNFRQQHFWLRQ
Version Up Start Update

DISC update 6WDUWGLVFXSJUDGH
System Information
Displays system information
(0&7HVW0RGH
Not used
Drive
Write drive OP data and check drive
+''0RGH
Not used
23
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
3. Service Mode Menu (Top Menu)

This is the top menu of service mode. Diag
Each function is accessed from this screen. Category: Device Test
Operation:
[1] Moves to Diag screen
[2] Moves to Log screen Diag
[3] Moves to Factory Initialize screen Category: Device Test

[4] Moves to Network screen Device: USB Host
[5] Moves to Version Up (DISC version update) screen
[6] Moves to System Information screen Front USB Media check ... OK
[7] Moves to EMC test mode screen (Not used)
Checking...
[8] Moves to Drive screen
[9] Moves to HDD mode (Not used) (Screen 1)
[M]/[m] Moves the cursor
[ ] Moves to the screen of the item selected with the cursor
HELP: [RIGHT] [UP] [ENT] [RET]

* Cursor is not displayed when the menu is first displayed. (Screen 2)
Service Mode Menu

• Device Test: List of devices
[1]
[1]Diag
Diag USB Host : USB media check (front). Only one time.
[2] Log
[3] Factory Initialize
[4] Network 5. Diag (Video/Audio Test)
[5] Version Up This screen performs video and audio tests.
[6] System Information
[7] EMC Test Mode
[8] Drive Screen 1: When video test category is selected
[9] HDD mode Operation:
[ ] Shows Color Bar
[M]/[RETURN] Returns to the selection of test category
HELP : [UP] [DOWN] [ENT] [NUM] Screen 2: When audio test category is selected
Operation:
[ ] Generate TONE Sound
[M]/[RETURN] Returns to the selection of test category
HELP (currently available keys, etc.) is displayed
• Video test:
Outputs a color bar (HDMI).
4. Diag (Device Test)
This screen is used to test devices mounted on the board. • Audio test:
TONE sound output (speaker & HDMI).
Screen 1: Selects the test category
Operation:
Diag
[<]/[,] Selects the category
[m]/[ ] Moves to the selected category Category: Video Test
[RETURN] Returns to the service top menu
Screen 2: Device test

Selects the device to test after selecting Device Test in screen 1. [ENT] Show Color Bar
Operation:
[<]/[,] Selects the device to test
Diag
[ ] Executes the test
[M] Returns to selection of test category Category: Audio Test
[RETURN] Returns to selection of test category HELP: [UP][ENT][RET]
(Screen 1)
• List of test categories
[ENT] Generate TONE Sound
Device Test
Video Test
Audio Test
Audio Input Test
Wireless LAN Test
Mic Test (Not used) HELP: [UP] [ENT] [RET]
HDMI Input Test (Not used) (Screen 2)
Transcorder Test (Not used)
Bluetooth Device Test
24
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6. Diag (Audio Input Test) 7. Diag (Wireless LAN Test)

This screen performs audio input test. This screen performs wireless LAN test.
Screen 1: Select Audio Input Test Category Screen 1: Selects the Wireless LAN test category
Operation: Operation:
[<]/[,] Selects the category [<]/[,] Selects the category
[m]/[ ] Activate the selected category [m]/[ ] Moves to the selected category
[RETURN] Returns to the service top menu [RETURN] Returns to the service top menu
Screen 2: Select Input Device Screen 2: Wireless LAN test

After “Audio Input Test” selects in Screen 1, the device to test is [1] Show WLAN Hwinfo
chosen. [2] Connect to AccessPoint
Operation: [3] Start display RSSI value.
[M]/[m] Selects Device [4] Start Ping Test
[ ] Activate and Start Test/Stop Operation:
[RETURN] Returns to the selection of test category [M]/[m] Selects the test
[ ] Executes the test
• Device Test : Device List [RETURN] Returns to selection of test category
Digital Input1 : CXD90019R-BA is inputted from Optical
Digital Input2 : CXD90019R-BA is inputted from ARC Screen 2 : Select [1] Show WLAN HwInfo
Analog Input : CXD90019R-BA is inputted from AUDIO • Viewing the display
Serial : Serial Number
• Audio Input Test Hard : Hardware Version
CXD90019R-BA is inputted from DIR/analog and outputs Mac : Mac Address
LineOut (8ch) L and R.
Check tone sound by speaker connected with LineOut (8ch) L and Screen 3 : Select [2] Connect to AccessPoint
R. Connect Access Point only with the following AP settings.
(Input; LPCM 48kHz 2ch) CERT: NO-ENCRYPT
WEPKEY: abcdef1234
PMK: ABCDE12345
Diag
SSID: SONY-Test-R
Category: Audio Input Test IPADDR: 192.168.1.100
NETMASK: 255.255.255.0
Diag BROADCAST: 192.168.1.10
When connect to AP, Status is “Connected!”
Category: Audio Input Test When cannot connect to AP, Status is “can’t Connect!”
Device:
Digital Input 1
Digital Input 2 Screen 4 : Select [3] Start Display RSSI Value
Analog Input Display RSSI value.
[ENT] Start Input Sound Screen 5 : Select [4 ] Start Ping Test

(Screen 1) Ping Test.
IP address use the value of “192.168.1.10”.
HELP: [LEFT] [RIGHT] [UP] [DOWN] [ENT] [RET]

(Screen 2)
[ ] [ ]
Diag
Category: Audio Input Test

Device:
Digital Input 1
Digital Input 2
Analog Input
[ENT] Stop Input Sound
HELP: [LEFT] [RIGHT] [UP] [DOWN] [ENT] [RET]
25
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
(Screen 1) 8. Diag (MIC Input Test)

Diag This screen performs MIC input test.
Note: Not used for the servicing.
Category: Wireless LAN Test
9. Diag (HDMI Input Test)

Diag This screen performs HDMI input test.
Note: Not used for the servicing.
[1] Show WLAN HwInfo 10. Diag (Transcoder Test)

[2] Connect to AccessPoint Note: Not used for the servicing.
[3] Start Display RSSI Value
[4] Start Ping Test
11. Diag (Bluetooth Device Test)
Serial : 200912313165535
This screen performs Bluetooth Device Test.
Hard : 22
Mac : 00:01:36:23:FD:CF Screen 1: Select Bluetooth Device Test Category
Operation:
(Screen 2) HELP: [UP][DOWN][ENT][RET] [<]/[,] Selects the category
[m]/[ ] Activate the selected category
(Screen 3)
[RETURN] Returns to the service top menu
Diag

Screen 2: Select Bluetooth Device Test
Operation:
[1] Show WLAN HwInfo [1] Bluetooth Enable
[2] Connect to AccessPoint
[3] Start Display RSSI Value [2] Bluetooth Disable
[4] Start Ping Test [3] Write Bluetooth device address to Registry.
CERT : NO-ENCRYPT
WEPKEY : abcdef1234 [M]/[m] Selects Device
PMK : ABCDE12345 [ ] Activate and Start Test
SSID : SONY-Test-R
IPADDR : 192.168.1.100
[RETURN] Returns to the selection of test category
NETMASK: 255.255.255.0
BROADCAST : 192.168.1.10 Screen 2: Select [1] Bluetooth Enable
Status : Connected! • Viewing the Status display, if
HELP: [UP][DOWN][ENT][RET] Successful: “Bluetooth Enable Successful!”
Fail: “Bluetooth Enable Fail!”
(Screen 4)
Diag
Screen 3 : Select [2] Bluetooth Disable
Category: Wireless LAN Test • Viewing the Status display, if
Successful: “Bluetooth Disable Successful!”
[1] Show WLAN HwInfo
[2] Connect to AccessPoint Fail: “Bluetooth Disable Fail!”
[3] Stop Display RSSI Value
[4] Start Ping Test Screen 4 : Select [3] Store Bluetooth device address to
Registry
RSSI Value : 60 Display will show : Bluetooth device address : “xx:xx:xx:xx:xx:xx”
• Viewing the Status display, if
Successful: “Write Successful!”
HELP: [UP][DOWN][ENT][RET] Fail: “Write Fail!”
(Screen 5)
Diag
[1] Show WLAN HwInfo

[2] Connect to AccessPoint
[3] Stop Display RSSI Value
[4] Start Ping Test
Ping To : 192.168.1.10
PING 192.168.1.10 OK!
26
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
(Screen 1) 12. Log: Error Log (Output of each Log)

Diag This screen displays the contents of each log.
Note: Do not refer to the displayed date.
Screen 1: Selects log

Diag Operation:
[1]/[ ] Moves to the Error Log output screen
[RETURN] Returns to the top menu of the service mode
[2] Bluetooth Disable
[3] Write Bluetooth device address to Registry Screen 2: Displays the Error Log
[4] Bluetooth Inquiry Test (not used) Operation:
[ <] Returns to the previous page
Status : Bluetooth Enable Successful! [ ,] Moves to the next page
Status : Bluetooth Enable Fail! [RETURN] Returns to the screen (Screen 1) that selects the log
type
(Screen 2)
[RED] Writes the log contents to an USB memory device
(Screen 3)
• Viewing the log display
Error Log:
Diag
[174] 2010/01/01 00:00:08 [ErrCode:0902A4053002]
Category: Bluetooth Device Test [Index number] [Date] [Time] [Error code]
[2] Bluetooth Disable About copying log to USB memory device:
[3] Write Bluetooth device address to Registry Press the [RED] button in each log display screen with the USB
[4] Bluetooth Inquiry Test (not used) memory device inserted into the unit.
Note: Please do not press the [RED] button immediately after USB mem-
Status : Bluetooth Disable Successful! ory is inserted.
Status : Bluetooth Disable Fail! Please do not pull out USB memory immediately after the [RED]
button was pressed.
Error Log:
(Screen 4) When “getErrLogFile.trm file” exists in the USB memory de-
vice, errlog.log file is output.
Diag

Select Log
[2] Bluetooth Disable [1] Error Log
[3] Write Bluetooth device address to Registry
[4] Bluetooth Inquiry Test (not used)
Bluetooth device address : 00:01:36:23:FD:CF Error Log

Status : Write Successful!
Status : Write Fail! 02]
[174] 2010/01/01 00:00:08 [ErrCode:0902A4053002]
[175] 2010/01/01 00:00:08 [ErrCode:0902A4053002]
[176] 2010/01/01 00:00:08 [ErrCode:0902A4053002]
HELP: [UP][DOWN][ENT][RET] [177] 2010/01/01 00:00:08 [ErrCode:0902A4053002]
[178] 2010/01/01 00:00:08 [ErrCode:0902A4053002]
[179] 2010/01/01 00:00:08 [ErrCode:0902A4053002]
[180] 2010/01/01 00:00:08 [ErrCode:0902A4053002]
HELP : [DOWN][ENT][(NUM)]
[181] 2010/01/01 00:00:08 [ErrCode:0902A4053002]
(Screen 1)
[182] 2010/01/01 00:00:08 [ErrCode:0902A4053002]
[183] 2010/01/01 00:00:08 [ErrCode:0902A4053002]
[184] 2010/01/01 00:00:07 [ErrCode:0902A4053002]
[185] 2010/01/01 00:00:08 [ErrCode:0902A4053002]
[186] 2010/01/01 00:00:08 [ErrCode:0902A4053002]
<Page 1/20>
HELP : Press [RED] key to store log to Udisc.

(Screen 2)
27
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
13. Factory Initialize (Factory Settings) 15. Network (Network Test Diagnosis Screen: Ping)
Ping test for the wired ethernet.
There is a possibility that this mode cannot be correctly execut-
ed. Never use this mode.
Screen 1: Ping Test
Operation:
14. Network (Network Test Diagnosis Screen: Ifconfig) [<] Select Ifconfig test
Network menu for the wired ethernet. [m] Ping execution preparation
Screen 1: Ifconfig Test
Operation: Screen 2: The IP address of the Ping point is set up
[ ] Activate Ifconfig (Display network setting) (IP address input mode)
[,] Select ping test When “Ping to :>” is reversed, the [ ] button is pressed and IP
[RETURN] Returns to the top menu of the service mode is inputted.
Operation:
Screen 2: Ping Test [ ] Finish to input
Operation: [RETURN] Finish to input
[<] Select Ifconfig test [<] Finish to input and Select Ifconfig Test
[RETURN] Returns to the top menu of the service mode [0] to [9] Input Character sting ‘0-9’
(The details of a Ping test are “14. Network (Network Test Diagno-
sis Screen: Ping)”) Screen 3: Ping Test Active
When [START] is reversed, the [ ] button is pressed and execute
Screen 3: Ifconfig Test Active ping.
Display Ifconfig command results. Operation:
Operation: [ ] Activate ping test
[ ] Ifconfig retry [M] The IP address of the ping point is set up
[,] Select Ping Test [RETURN] Returns to the top menu of the service mode
Network
Network Test: Ifconfig Ping

Ping To :
Test: Ifconfig Ping
[START]
Network Network
Test: Ifconfig Ping Test: Ifconfig Ping
Ping To: Ping to :> 192. 168. 200. 13
[START] [ENT] : Release
[RET] : Release
Network Network
Test: Ifconfig Ping (Screen 1)
Test: Ifconfig Ping
(Screen 1)
Ping to : 192. 168. 200. 13
IP 192. 168. 11. 2 MAC 00-16-01-85-21-A3 [START]
PING 192. 168. 200. 13 OK!

(Screen 2)
(Screen 2)
HELP : [ENT]: Re/Exe [RIGHT]

(Screen 3) HELP: [ENT] : Start [UP] [LEFT]
(Screen 3)
28
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
16. Version Up Test (Disc Update) (Screen 5)

This screen performs version update test.
Software Update
Operation:
Software update has started.
[m]/[ ] Activate the selected category. Never turn off while performing update.
[RETURN] Return to Service Top Menu. When the update is complete, the unit will automatically turn off.
55%
Screen 1: Select to Start Update
Operation:
[ENT] Start Update
[RETURN] Return to Top Menu 17. System Information (System Information Display)
This screen displays system information.
Screen 2: Insert Update Disc
Operation: Screen 1: Basic Information
[ ] Tray Close and Check start Operation:
[RETURN] Cancel [,] Drive information (delta IOP of a drive is measured)
and wireless device information (not used) displayed
Screen 3/ Screen 4 (go to Screen 2)
Operation: [RETURN] Returns to the top menu of the service mode
Mounting and checking the disc
If disc OK, upgrading will start Screen 2: Drive and Wireless Information Menu
Operation:
Screen 5 [<] Basic Information displayed (go to Screen 1)
Operation: [RETURN] Returns to the top menu of the service mode
Wait until the display bar show 100%.
When delta IOP is measured, it becomes impossible to use the Ver-
(Screen 1) sion Up function.
Version Update
Contents List:
Main LSIname
[ENT] Start Update
Model
[RET] Return to Top Menu Destination
Sequence Number
MAC
IP
IFCON IFCON Version
HELP: [ENT][RET] Bootloader Bootloader Version
Host Main Host Main Version
(Screen 2)
MicroBE MicroBE Version
Host Sub Host Sub Version
Version Update Middleware Middleware Version
ADSP ADSP Version
ADSP Coeff ADSP Coeff Version
Insert Update Disc
[ENT] Tray Close and Check start

IF Model
[RET] Cancel IF Dest
WLAN module Serial
WLAN module hw Version
WLAN module MAC Address
HELP: [ENT][RET] Drive Firm Revision
CD DIOP Delta IOP
(Screen 3) DVD DIOP Delta IOP
Version Update
BD DIOP Delta IOP
CD LD TIME LD Time
DVD LD TIME LD Time
Bluetooth Device Address
Now, mounting and checking…
(Screen 4)
Version Update
Upgrading, do not shut down the power!
29
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
(Screen 1)
System Information Drive

[1] Drive OP data Write
Main LSIname:
Model:
Destination: Drive OP data Write
Sequence Number:
MAC: Insert USB StorageDevice ...
IP: Remove DISC and Close tray.
IF-con Block0 Version:
Bootloader Version: Disc : Load
Host Main Version: Mode: 1
MicroBE Version:
Host Sub Version: [ENT] Start
Middleware Version:
ADSP Version:
ADSP Coeff Version:
(Screen 1)
HELP : [RET] [RIGHT] HELP: [ENT] [RET]

(Screen 2)
(Screen 2)
System Information Drive OP data Write
IF_MODEL: Insert USB StorageDevice ...

IF_DEST: Remove DISC and Close tray.
WLAN module Serial:
WLAN module hw version: [ENT] Start
WLAN module MAC Address:
Drive Firm Revision: NG - USB is not find
CD DIOP: OK - OP data write
DVD DIOP:
BD DIOP:
CD LD TIME:
DVD LD TIME:
Bluetooth Device Address:
HELP: [ENT] [RET]

(Screen 3)
HELP : [RET] [LEFT]
18. Drive
This menu is used to operate the drive using drive-related diagnos-
tic and tools.
Screen 1: Selecting items under *Drive

Operation:
[M]/[m] Selects the category
[m]/[ ] Activate the selected category
[1] Drive OP data Write
[2] Servo Parameter Check Menu
[3] Servo Signal Check Menu
[4] S-Curve Check Menu
[5] Readability Check Menu
[6] OP Position Check Menu
[7] OP Check Menu
[8] Load Eject Aging
[9] Spindle Control Check Menu
[10] FA Test Mode
Screen 2: To start OP data Write

Operation:
[ ] Starts
Screen 3: Show OP data Write result

Operation:
NG - USB is not find
OK - OP data write
• Drive Test
For drive operating check. Service is only use Drive OP data write
to rewrite OP data after change of new CPU.
30
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
CONFIRMATION ITEM 2. Networking Confirmation

1. Playback Operation Confirmation Confirm it according to the following procedure when you confirm
1-1. Test Disc the connection of the network.
Part No. Description Layer Note: Do not execute “Network Connection Diagnostics” of “Network
Settings” of the home menu with only the router connected.
J-6090-199-A BLX-104 Single Layer
J-6090-200-A BLX-204 Dual Layer Procedure:
J-2501-307-A CD (HLX-A1) 1. Connect the router with the unit with LAN cable.
J-2501-305-A HLX-513 Single Layer (NTSC) 2. Turn on the power of the unit and the router.
J-2501-306-A HLX-514 Dual Layer (NTSC) 3. Press the [HOME] button on the remote commander, and the
home menu is displayed.
J-6090-077-A HLX-506 Single Layer (PAL)
4. Select “Setup”  “Network Settings”  “Network Connec-
J-6090-078-A HLX-507 Dual Layer (PAL) tion Status”, and press the [ ] button on the remote com-
Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883- mander.
989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204. 5. Confirm IP address are displayed in “IP Address”, “Subnet
Mask” and “Default Gateway”.
Operation and Display:
Physical Connection: XXXX
1. BLX-104
Procedure: Internet Access: XXXX
1. Select 23.976Hz/1080p. IP Address Setting: XXXX
IP Address: XXX.XXX.XXX.XXX
4. Check each outputs. Subnet Mask: XXX.XXX.XXX.XXX
Video: Default Gateway: XXX.XXX.XXX.XXX
Composite/S Video/component/HDMI. DNS Settings: XXXX
Audio:
Primary DNS: XXX.XXX.XXX.XXX
Speaker out.
* When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz) Secondary DNS: XXX.XXX.XXX.XXX
can use instead of 1080/24p. MAC Address: XXX.XXX.XXX.XXX
However this is temporary correspondence.
* When the output of HDMI is 1080p, the signal of Composite/S
Video/Component are not output.
It is necessary to lower the output of HDMI to 1080i or less.
2. BLX-204
Procedure:
1. Select 1080i (59.94Hz or 50Hz).
(Check the picture and sound output)
3. CD (HLX-A1)
Procedure:
Check whether player can play back or not.
(Check the sound output)
4. HLX-513/514 (NTSC), HLX-506/507 (PAL)

Procedure:
1. After displayed Main Menu, select “1.Video Signal”.
2. Play “1.Color bar 100%”.
3. Return to Menu.
4. Play “Demonstration 4:3” or “Demonstration 16:9”.
1-2. Playback operation confirmation

Confirm operation in each signal/output mode of test disc (BLX-
104/204) according to the content of the repair.
Note: “AV Sync.” doesn’t operate.
31
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5 SECTION 4
ELECTRICAL CHECK
FM AUTO STOP CHECK
generator
SET
+
75 :
Procedure:
1. Turn the power on.
2. Input the following signal from Signal Generator to FM an-
tenna input directly.
Carrier frequency : A = 87.5 MHz, B = 98 MHz, C = 108 MHz

Deviation : 75 kHz
Modulation : 1 kHz
ANT input : 35 dBu (EMF)
Note: Please use 75 ohm “coaxial cable” to connect SG and the set. You
cannot use video cable for checking.
Please use SG whose output impedance is 75 ohm.
3. Set to FM tuner function and scan the input FM signal with

automatic scanning.
4. Confirm that input Frequency of A, B and C detected and auto-
matic scanning stops.
The stop of automatic scanning means “The station signal is re-

ceived in good condition”.
32
Power Check Flow (1/2)
Check that the output voltages of the switching regulator

(SWR1) are the following value. Check that harness is inserted normally at CN301 and
No No
The power is turned on. CN301 pin 1: 12 V (FEUNSW12V) CN202. When harness is inserted normally, exchange the
CN301 pin 2: 12 V (ICUNSW12V) switching regulator (SWR1).
Yes CN301 pin 3: 12 V (UNSW12V)
Yes
Check that the following fuses and thermistor are not damaged. Exchange the damaged fuse or thermistor. Exchange the
No
TH802/F802/F201/F202/F203 complete MB1002 board, when the power is not turned on,
even if you exchange fuses.
Yes
Check the following power control signal in the power on state.

(Normally voltage: +3.3 V)
No
MB1002 board IC801 pin 36 to 38 Exchange the complete MB1002 board.
(PCONT1 to PCONT3)
Pin 25 (PCONT_FL)
Yes
Check each voltage with reference to the schematic diagrams, No

Power supply IC is damaged. Exchange the power supply IC.
and check that there is no problem in them.
Yes
SECTION 5
Check the related IC on the MB1002 board.

TROUBLESHOOTING
Protect mode happened “PROTECT” Yes No

Check that harness is inserted normally at CN101 Insert normally the harness and power ON again.
display appears on fluorescent tube.
No Yes
Remove harness of CN101, CN4, FFC CN3505.

No Switching supply board damage. Exchange the complete
Measure switching supply board CN101 pin4 <-> pin1,
switching supply board.
(normal voltage > 30V)
Yes
A AMP board damage.

Exchange the complete AMP board.
HBD-E2100/E3100/E3200/E4100/E6100
33
Ver. 1.5
Power Check Flow (2/2)
34
Ver. 1.5
No No
Check that a sound is outputted normally. Check that a picture is outputted normally. Refer to the “HDMI Check Flow” on page 35.
Yes
Check that [Audio Settings]-[Audio output] in the menu No

Optimize the speaker settings.
screen is “Speaker”.
Yes
No Refer to the “2-1. Flow of drive section check” on page
Check that the drive is operating normally.
7 on original service manual.
Yes
Check that each power supply is supplied to the audio No

Refer to the “Power Check Flow (1/2)” on page 33.
block.
Yes
Check that a sound is normally outputted from each No Check that each speaker is connected normally. No Perform and check [Audio Settings] -
[Speaker Settings] - [Test Tone] in the menu
HBD-E2100/E3100/E3200/E4100/E6100
speaker. Front/Center/Surround/Subwoofer
screen, or reinsert the speaker cables.
Yes
Check that the signal is input to AMP board IC3001. No Change FFC.
Pin 22, 23, 24, 25, 27 Insert to AMP CN3505
Yes
Check that the PWM signal is outputted from the Exchange the IC3001.
No
following pins. Part No. 6-718-103-01
AMP board IC3001 pin 39, 40, 48, 49, 42, 43, 54, 55 Description IC TAS5538DGGR
Yes
Check that the signal is outputted from the following

pins.
AMP board IC3102 No Exchange the IC3102.
pin 10, 11 (SP FRONT R) Part No. 6-719-138-01
pin 16, 17 (SP FRONT L) Description IC STA516BF13TR-A
Pin 2, 3, 8, 9 (SP SUBWOOFER)
Yes
Check that the signal is outputted from the following

pins.
AMP board IC3302 No Exchange the IC3302.
pin 10, 11, 16, 17 (SP CENTER) Part No. 6-719-138-01
pin 2, 3 (SP SUR R) Description IC STA516BF13TR-A
Pin 8, 9 (SP SUR L)
HDMI Check Flow
No Refer to the “2-1. Flow of drive section check” on page 7

Check that the drive is operating normally. on original service manual.
Yes
No
Check that each power supply is supplied. Refer to the “Power Check Flow (1/2)” on page 33.
Yes
No
Check that only the digital output (HDMI) is affected. Check the settings on the menu screen.
Yes
Check that the input voltage of the following pin is 5.5 V. No

Refer to the “Power Check Flow (1/2)” on page 33.
MB1002 board IC408 pin 5 (VIN)
Yes
Check that the output voltage of the following pin is 5 V. No Check that the input voltage of the following pin is 3.3V. No Refer to the “Power Check Flow (1/2)” on page 33 to
MB1002 board IC408 pin 4 (VOUT) MB1002 board IC408 pin 1 (CONT) check on power control signal for PCONT_3
Yes Yes
Exchange the IC408.

Part No. 6-718-999-01
Description IC MM1839A50NRE
Check that the output voltage of the following pin is 3.3V. No Check that the input voltage of the following pin is 3.3V. No
MB1002 board Q204 pin 6 MB1002 board Q204 pin 4 (CONT)
Yes Yes
Exchange the Q204.

Part No. 6-553-007-01
Description TR PMG85XP
Exchange the CN401

No Note: When CN401 is exchanged, be careful of the
Check that there are no abnormalities in CN401. quality of soldering enough.
Part No. 1-821-398-41
Yes Description HDMI CONNECTOR (HDMI OUT ARC)
Perform other analyses.
HBD-E2100/E3100/E3200/E4100/E6100
35
Ver. 1.5
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7 SECTION 6
DIAGRAMS
• Circuit Boards Location
MB1002 board
RC-S801/A (WW)
AMP board
POWER KEY board
card, WLAN/BT COMBO
PANEL board switching regulator (SWR1)

(3L392W-1) (US, CND, AEP, UK, SAF, SP, TW, AUS,
TH, CH)
KARAOKE board (SP, RU) (3L392W) (E3, E51, PX, EA, E12, E32, RU, MX6, AR)
NON-KARAOKE board (EXCEPT SP, RU)
• Abbreviation
CH : Chinese model
PX : PX model
RU : Russian model
TH : Thai model
TW : Taiwan model
36
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-1. BLOCK DIAGRAM - SERVO Section -

BD DECODER
IC101 (1/3)
CN501 (1/2)
RF+ P18 RFIP

RF- P19 RFIN
B P6 INA FRONT USB VBUS

A P5 INB IC406
D P8 INC
C P7 IND 1 VOUT IN 5 DCDC5V
G P12 INE
H P11 INF
E P9 ING
F P10 INH
CN52
SDIO P30 FECFREQ 1

SCLK P28 FEOSCEN USB_DP_P1 P56 3
SEN_LDD P31 FECMOD USB_DM_P1 P55 2
TEST_V P256 FPDODVD
VC_PD P3 HAVC
THERMO P14 AUX1
CN404
MODE_A P32 FEGAINSW1 USB_DP_P2 P205 2

MODE_B P45 FEGIO5 WLAN/BT COMBO
USB_DM_P2 P204 3
CARD
4
LDEN P47 FEGIO7
WIFI PWR
CN670 1 CONTROL 4 DCDC5V
Q405
3
TRAY-IN P53 FETRAYIN_
TRAY-OUT P33 FEGAINSW2
LOAD-
LOAD+ COIL/MOTOR
DRIVER WIFI PWR
IC601 CEC P201 CONTROL DRIVER
27 26 Q404
BD DRIVE
LOAD_P
LOAD_N
(BPX-7)
CN660
B 1 SLED1_P
/B 2 SLED1_N
A 4 SLED2_P
/A 5 SLED2_N
CN380
W 43 U XFG 12 P41 FEFG
V 45 V RDY 13 P29 FEGAINSW3 TXVN_0 P213 4
U 47 W SSZ 14 P49 FEGIO4 TXVP_0 P214 3
COMMON 49 MCOM SCLK 15 P39 FETRAYPWM LAN (100)
TXVP_1 P212 5
SIMO 16 P34 FEFMO TXVN_1 P211 6
SOMI 17 P35 FEFMO2
CN501 (2/2) XRSTIN 19 P43 FEGIO0
TR 37 TRK_P
TD 38 TRK_N
FD1 39 FCS_P
FR1 40 FCS_N
FD2 36 TLT_P
+8V REG 6LJQDOSDWK
FR2 35 TLT_N IC520
: DISC PLAY
SA_B+ 33 STP1_P : LAN
12V 8 VCC VO_S 2 8.0V
SA_B- 32 STP1_N
: USB
SA_A+ 31 STP2_P
SA_A- 30 STP2_N
HBD-E2100/E3100/E4100/E6100
37 37
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-2. BLOCK DIAGRAM - MEMORY/HDMI Section -
BD DECODER
SD-RAM IC101 (2/3)
SD-RAM
IC102
IC103
DQL0 - DQL7, DQL0 - DQL7,

RDQ0 - RDQ15 RDQ16 - RDQ31
DQU0 - DQU7 DQU0 - DQU7
D0A0 - D0A13
D0A0 - D0A13
A0 - A13 RA0 - RA13
A0 - A13
BA0
M2 BA0
DML
DQSL
/DQSL
ODT
/RESET
BA0
BA1
BA2
/WE
/CS
/CAS
/RAS
CKE
CK
/CK
DMU
DQSU
/DQSU
BA1
N8 BA1
BA2
M3 BA2
/WE
L3 /WE
/CS
L2 /CS
/CAS
BA0 RBA0 K3 /CAS
M2 P140 /RAS
J3 /RAS
BA1 N8 P118 RBA1 ODT
BA2 RBA2 K1 ODT
M3 P139 CKE
/WE RWE_ K9 CKE
L3 P130 CK
/CS J7 CK
L2 P128 RCS_ /CK
RCAS_ K7 /CK
/CAS K3 P127 DMU
/RAS P126 RRAS_ D3 DMU
J3 DQSU
RODT C7 DQSU
ODT K1 P141 /DQSU
CKE RCKE B7 /DQSU
K9 P116 DML
CK E7 DML
J7 P98 RCLK0 DQSL
/CK P97 RCLK0_ F3 DQSL
K7 /DQSL
DMU RDQM1 G3 /DQSL
D3 P91 /RESET
DQSU RDQS1 T2 /RESET
C7 P100
/DQSU B7 P101 RDQS1_
DML E7 P99 RDQM0
DQSL F3 P94 RDQS0
/DQSL G3 P95 RDQS0_
/RESET T2 P134 RRESET
MAIN
SECTION A CEC CEC DRIVER
Q401
NAND FLASH
IC1001
(Page 39) CN401
NFD0 - NFD7 IO1 - IO8
CEC 13 WAVE MAIN
RESERVED (ARC) 14 SHAPER
IC403
P64 SPDIF_IN1
NFWEN P79 18 WE WP 19 NAND_RESET C SECTION
NFREN P75 8 RE (Page 39)
TMDS DATA0 + 7 P221 CH0_P NFCEN P76 9 CE
TMDS DATA0 – 9 P220 CH0_M NFRBN P74 7 RY/BY
NFALE P78 17 ALE
TMDS DATA1 + 4 P223 CH1_P CLE
NFCLE P77 16
TMDS DATA1 – 6 P222 CH1_M
TMDS DATA2 + 1 P225 CH2_P

HDMI TMDS DATA2 – 3 P224 CH2_M
OUT ARC
TMDS CLOCK + 10 P219 CLK_P
TMDS CLOCK – 12 P218 CLK_M
NS_XTALI P229
X301
SDA 16 P199 HDMISD 27MHz
SCL 15 P200 HDMISCK NS_XTALO P230
HPD 19 P197 HTPLG
+5V POWER 18 4 +5V REG 5 UNSW +5.5V

IC408
1
MAIN
SECTION B PCONT3
(Page 39)
6LJQDOSDWK
: VIDEO
: AUDIO
HBD-E2100/E3100/E4100/E6100
38 38
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-3. BLOCK DIAGRAM - MAIN Section -
MEMORY/HDMI
SECTION
(Page 38) A CEC
BD DECODER
IC101 (3/3)
J71
MIC 1 + MIC
AMP
IC71 OPTICAL
TV
RECEIVER
DIGITAL IN P246 AOSDATA3
JACK
OPTICAL
IC701
J72
MIC 2 ELECTRICAL
+ VOLUME
IC72
A/D CONVERTER
IC704
SP, RU
AUDIO SELECT
PLUG_DET
MIC_DATA
AOSDATA0 P243
MIC_CLK
IC703 DOUT 9 P241 SPDIF_IN0 AMP_D1
J702 2 Y2 SCKI 6 P237 AL0 AOSDATA1 P244 AMP_D2

LRCK 7 P242 AOLRCK
L 5 Y1 Y 3 13 VinL BCK 8 P239 AR0 AOSDATA2 P245 AMP_D3
AUDIO IN 1 Y0 R-CH 14 VinR AMP
R R-CH
A
10
B
9 AMP_MCK
E SECTION
(Page 40)
AUDIO SELECT X801
FM DRIVER DRIVER 8MHz
(FM RECEIVER) Q703 AMP_LRCK
IC706
CN706
69 70 15 11 13 AMP_BCK
ANTENNA 1 FRF1 L OUT 13
XOUT
XIN
ASEL0
ASEL1
CEC_ TX_RX
FM MIC_CLK
R OUT 12 R-CH 57 MIC CLK
MIC_DATA
58 MIC_DATA
PLUG_DET BD_SDI(IF_SDO)(IF_SDO) 75 P191 VDATA
63 PLUG_DET/MIC IN
BD_SDO(IF_SDI)(IF_SDI) 76 P188 GPIO0
BD_CLK 77 P189 VCLK
17 X2
X701 DA 11 45 ST_SDA BD_CS 78 P187 GPIO1
12MHz CK 8 46 ST_SCL JIG_MODE1 82 P203 LED0
16 X1
IIC/RDSI 6 73 ST_RDS_INT OPWRSB 83 P178 OPWRSB
FE_EJECT 84 P2 TRINA
SP, RU
UPG_STATUS 85 P196 AMUTE
ND01 OVERLOAD
A5V (KARAOKE) DETECTION 61 NJU72341_POWER BD_RESET 81 P193 RESET_
VACUUM FLUORESCENT
DISPLAY Q701, Q702
DIN 18 3 FL_DOUT MEMORY/HDMI

DISPLAY
PANEL 12V SW
DRIVER
21 SW
23 VH
CLK 19
STB 20
5 FL_CLK
68 FL_CS
NAND_RESET 74 NAND_RESET C SECTION
SYSTEM CONTROLLER (Page 38)
Q01
IC801
(1/3)
REMOTE PCONT1 36 PCONT1 POWER SUPPLY
VDD
CONTROL
D
F+
F+
TH802 SIGNAL
1 SIRCS_IN PCONT2 37 PCONT2 SECTION
15 27 28 PCONT3 38 PCONT3 (Page 41)
RECEIVER
IC01
OVERLOAD
FE_SW12V DETECTION MEMORY/HDMI
Q803 S41
AC_CUT 18
AC CUT
DRIVER DCDC +5V
PCONT3 B SECTION
\/1 89 KEY0(EJ) Q209 (Page 38)
OVERLOAD
DETECTION KEY1
Q804 S05 ~ S08 88 KEY1_EJ VOLTAGE
RESET DETECT UNSW +12V
+3.3V REG KEY2 DRIVER IC803
3 1 Q801
IC03 S01 ~ S04 87 KEY2_EJ
4
PANEL 5.5V
4 CN802 6LJQDOSDWK
RESET
3 +3.3V REG 1 25 PCONT_FL RESET 10
RXD1
2 : AUDIO
IC02 RXD1 30 4
ON CHIP DEBUG/CLK1
CLK1
5
FLASH : TUNER
31 PROGRAMMING
RTS1
NO USE/RTS1 32 7 : MIC
WHITE_ LED TXD1
LED DRIVER 24 WHITE_LED TXD1 29 8
D06 Q02
LED
BT_LED
DRIVER 26 BT_LED(EJ)
D05
Q03
HBD-E2100/E3100/E4100/E6100
39 39
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-4. BLOCK DIAGRAM - AMP Section -

STREAM PROCESSOR POWER AMP
IC3001 IC3102
TB3451
AMP_MCK 11 MCLK PWM_P_1 39 29 1N1A OUT1A 16

FRONT L
AMP_LRCK 22 LRCK PWM_M_2 40 30 IN1B OUT1A 17 +
MAIN AMP_BCK PWM_M_8 48 31 IN2A
23 SCLK
SECTION E AMP_D1 24 SDIN1 PWM_P_8 49 32 1N2B OVERLOAD
(Page 39) L3101 DETECTION
AMP_D2 25 SDIN2 Q3101
AMP_D3 27 SDIN4
23 VL OUT1B 10 +
FRONT R
OUT1B 11
25 xPWRDN
26 xTRISTATE
27 xFAULT
OUT2B 3
L3103 SUBWOOFER
OUT2A 8 +
OVERLOAD
DETECTION SPEAKERS
POWER AMP Q3202
IC3302
PWM_M_3 42 29 1N1A OUT1B 11

L3303

CENTER
PWM_P_3 43 30 IN1B OUT1A 16 +
PWM_P_5 54 31 IN2A
PWM_M_6 55 32 1N2B TB3401
OUT2A 8
25 xPWRDN SUR L
VALID 37 26 xTRISTATE OUT2A 9 +
27 xFAULT
OVERLOAD
L3301 DETECTION
23 VL
Q3302
OUT2B 2 + SUR R
XRESET
XMUTE
OUT2B 3
SDA
SCL
16 19 20 21
DC FAN
M1
OVERLOAD FAULT FE_UNSW +12V DRIVER M (FAN)
DETECTION DETECTION IC201
Q3552 Q3555
DC
DETECTION
Q3553
DC FAN
DRIVER
Q208
D804 POWER SUPPLY

EN_POWER F SECTION
(Page 41)
51 52 33 34 50 65 40 35 2 42
TAS5538_SDA
TAS5538_SCL
TAS5538_XRST
TAS5538_XMUTE
DRIVER_SD/POWER_DET
PCONT STA516
STA516_XPDN
DC_DET
FAN_CONT
FAN_ON
6LJQDOSDWK
: AUDIO
SYSTEM CONTROLLER
IC801 (2/3)
HBD-E2100/E3100/E4100/E6100
40 40
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-5. BLOCK DIAGRAM - POWER SUPPLY Section -
DCDC5V SWR1
SWITCHING
REGULATOR
5V VOLTAGE
CONTROL DC-DC CONVERTER
Q206 IC205
F202
FE_SW5V 5 4 3 SW VIN 2 UNSW12V
3 EN
7
OVERLOAD
DETECTION
Q207
12V VOLTAGE
CONTROL
Q205
F203
FE_SW12V 5 4 FEUNSW12V
OVERLOAD
DETECTION
Q202
3.3V VOLTAGE
CONTROL DC-DC CONVERTER
Q204 IC203
F201
3.3V 5 4 3 SW1 VIN1 1 ICUNSW12V
3 SW2
14
OVERLOAD
DETECTION
Q203
DC-DC CONVERTER
IC204
1.2V 3 SW1 VIN1 1
EN2
12
OVERLOAD
DETECTION
Q201
SYSTEM CONTROLLER
IC801 (3/3)
+5V REG +5V REG

3 4
IC710 PVDD_VOL_SEL(EJ) 99 PVDD_CONT
+3.3V REG 4 +3.3V REG 5

IC805
AMP
+3.3V REG 4 +3.3V REG
IC804
5 SECTION F EN_POWER EN_POWER
(Page 40)
UNSW 5.5V
F802
PANEL 5.5V (AC IN)
PCONT3
MAIN
SECTION D PCONT2
(Page 39) PCONT1
HBD-E2100/E3100/E4100/E6100
41 41
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. • Waveforms
(In addition to this, the necessary note is printed in each block.)
– MB1002 Board –
For Printed Wiring Boards. For Schematic Diagrams.
Note: Note:
• X : Parts extracted from the component side. • All capacitors are in μF unless otherwise noted. (p: pF) 50 1 IC704 6 (SCKI) 4 IC801 qa (XOUT)
• Y : Parts extracted from the conductor side. WV or less are not indicated except for electrolytics and
• f : Internal component. tantalums.
• : Pattern from the side which enables seeing. • All resistors are in Ω and 1/4 W or less unless otherwise
(The other layers' patterns are not indicated.) specified.
• f : internal component.
Caution:
• C : panel designation. 1.7 Vp-p
Pattern face side: Parts on the pattern face side seen
3.3 Vp-p
(Conductor Side) from the pattern face are indicated. Note: The components identified by mark 0 or 125 ns
Parts face side: Parts on the parts face side seen from 40.8 ns
dotted line with mark 0 are critical for safety.
(Component Side) the parts face are indicated. Replace only with part number specified. 1 V/DIV, 20 ns/DIV 1 V/DIV, 50 ns/DIV
Note: Les composants identifiés par une marque
• MB1002 board is multi-layer printed board. However, the
patterns of intermediate-layers have not been included in 0 sont critiques pour la sécurité. 2 IC704 8 (BCK) 5 IC706 qj (X2)
this diagrams. Ne les remplacer que par une piéce portant
• Abbreviation le numéro spécifié.
CH : Chinese model
3.3 Vp-p
CND : Canadian model 0.4 Vp-p
20.8 Ps
E3 : 240 V AC area in E model • A : B+ Line. 83.33 ns
E12 : 220 – 240 V AC area in E model • B : B– Line.
E32 : 110 – 240 V AC area in E model • Voltages and waveforms are dc with respect to ground 1 V/DIV, 10 Ps/DIV 1 V/DIV, 50 ns/DIV
E51 : Chilean and Peruvian models under no-signal conditions.
no mark : TUNER 3 IC704 7 (LRCK)
* : Impossible to measure
PX : PX model • Voltages are taken with VOM (Input impedance 10 M).
RU : Russian model Voltage variations may be noted due to normal production
SAF : South African model tolerances.
SP : Singapore model • Waveforms are taken with a oscilloscope.
TH : Thai model Voltage variations may be noted due to normal production
TW : Taiwan model tolerances. 3.4 Vp-p
• Indication of transistor. • Circled numbers refer to waveforms. 40.7 ns
• Signal path.
F : AUDIO 1 V/DIV, 25 ns/DIV
C
f : TUNER
Q These are omitted. L : USB
B E E : VIDEO
d : LAN
J : DISC PLAY
Q N : MIC
• Abbreviation
B C E AR : Argentina model
These are omitted. CH : Chinese model
• Lead layouts E3 : 240 V AC area in E model
surface E12 : 220 – 240 V AC area in E model
PX : PX model
RU : Russian model
Lead layout of conventional IC CSP (Chip Size Package) TH : Thai model
TW : Taiwan model
* Replacement of IC102 and IC103 on the MB1002 board used • The voltage and waveform of CSP (chip size package)
in this unit requires a special tool. cannot be measured, because its lead layout is different
from that of conventional IC.
Note: When the AMP board is replaced, spread the compound
referring to “NOTE OF REPLACING THE IC3102 AND * Replacement of IC102 and IC103 on the MB1002 board used
IC3302 ON THE AMP BOARD AND THE COMPLETE in this unit requires a special tool.
AMP BOARD” on servicing notes (page 10).
Note: When the AMP board is replaced, spread the compound
referring to “NOTE OF REPLACING THE IC3102 AND
IC3302 ON THE AMP BOARD AND THE COMPLETE
AMP BOARD” on servicing notes (page 10).
HBD-E2100/E3100/E4100/E6100
42 42
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-6. PRINTED WIRING BOARD - MB1002 Board (Component Side) - • See page 36 for Circuit Boards Location. • : Uses unleaded solder.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A
J702
MB1002 BOARD L AUDIO IN R
(COMPONENT SIDE)
CN401
CN706 CN380 TV
HDMI DIGITAL IN
ANTENNA OUT ARC LAN (100)
OPTICAL
FM
B (CHASSIS)
IC701
D702
2 1
R789 1 19
VOUT GND VCC
R424
C743 L703
CL715 L702 C401
C R402
R422
R411 R425
L704 C760
C747
C730
R423
R410
C415
(CHASSIS) C742 C744 R419 C242 (CHASSIS)
JL219
CN201
X701
JL218
R785
IC408
C741
C745
Q401
GS
5 1
6
M
20 L205
C430
CN404
1
R786 R725
IC706
C331
1
10 16
C240
2
11 15 1 8
C332
C746
R724
R788
CL706 C759 C408 C414 JL215

C740
C751 M1 (FAN)
R331
C353
R726
R727
X301
C427
C382
C739
C738
L707 C383
R787
5
D R332
WLAN/BT COMBO CARD
JL316
R7014
C737
C350
CL318
JL524
C352
C549
R581
JL515
C580
R365
JL514
R353
JL320
C359
R582
C330
R319
JL512 C303
R831
R840
R841
R838
R827
R830
R828
JL503 JL502
CL844
CL846
CL843
JL511 R814 R816
R903 R803 R804
24
JL508 JL501
JL506 JL504
C563
23
CL510
P256 P193
CL845
CL847
AMP
C503
C505
C504
CL509
C717
P1 P192 R907
CN707
CL703 R761
R818 CL885
CL865
JL318
CL867
IC710 R817 R760
BOARD
F
JL507 75 51 CL884 FB701
C721
R894
JL319
C718 76 50 CL861
C518
JL505 C170 R109 R114 R112 R815 IC801
R773
CN3505
E CL701 R771
CL548
JL1105
JL144
R913 R877
R575
R769
(Page 51)
CL536
JL124 CL808 R904
C115
C186 C192 R768
CL533
C519
JL146
JL145
JL160 JL159
CL535
C506
CL538 CL540 R819 R813
CL532
CL542
CL544
CL546
R858
CL539 CL541 JL157 CL813
JL518 CL549
JL133 A9 B9 C9 D9 E9 F9 G9 H9 J9 K9 L9 M9 N9 P9 R9 T9 JL158
2
R820
CL534 C320 JL134 R821 R766
1
C575 C516 A8 B8 C8 D8 E8 F8 G8 H8 J8 K8 L8 M8 N8 P8 R8 T8
JL155 R867
CL527 JL513 A7 B7 C7 D7 E7 F7 G7 H7 J7 K7 L7 M7 N7 P7 R7 T7 R822 R856
CL537 JL522 JL1106 JL120 JL156 R823 R863 R767
JL519
JL121
R860
IC101
R865 R862
(CHASSIS) 2
CN501
44 C533
JL119
C185 JL147
IC103 JL191 CL886
R920
R770
R861
C311
CL615
CL821
1 45 CL616 C184
A3 B3 C3 D3 E3 F3 G3 H3 J3 K3 L3 M3 N3 P3 R3 T3
JL126 R864 R772
A2 B2 C2 D2 E2 F2 G2 H2 J2 K2 L2 M2 N2 P2 R2 T2
JL127 100 26
CL612 C321 A1 B1 C1 D1 E1 F1 G1 H1 J1 K1 L1 M1 N1 P1 R1 T1
1 25
JL118
CL526 C577 R531
CL547
R521 JL154 JL148 JL153 CL890 CL883

C312 JL131 C183 CL878 RB301
CL543
CL545
JL132
JL125
CL530 JL1103
CL854 CL855 C812 CL857
C690
R533 R585
C810
JL525 JL123
R522
IC520
CL889
C193
CL531 JL527 JL122 JL149 CL849
F
C583 C586
JL128
JL189
JL130
1
IC803
JL192
C524
R868
JL151
JL152
JL129
CL614 JL1104
C553
C806
CN301
C523
JL150
R871
CL661 JL526 C182 X801 CL888
1
CL673
C159
R110
C130
JL554
R118
R847
JL190
R105
CN660
2
CL662 C816 R880 R307
R910
R909
CL663 RB112 R837
C521
JL826 R318 (NC)
R869
R395 JL188 R872 R886 R308
R908
R911
CL664 C313
C390 P64
CL666 P129 1 7 E K A R386
P65 D803
P128 CN806 Q801
C384
6
BD DRIVE 2 8
JL1007
CL667
JL1005
C610
8
BPX-7 CL668 R870 C809 R387

C643 C642 JL1101
9
CL669 JL1003 JL135

JL104
C172
C178
JL103
C314
C177
JL199
JL170 JL102
C179
JL168 JL169
JL172 JL198
JL136
JL1102
JL105
JL106 JL167
JL1008
JL1006
C180
C176
C646
JL101
X801
JL1004
JL1002
JL1001
R246
JL171 RB101 R245
JL173
G
JL117 JL142
C647 C618 C226 C221
JL166 JL143
JL114 C269
JL165 C220
C1003 C227
A1 A2 A3 A7 A8 A9
C811
C622 B1 B2 B3 B7 B8 B9
RB103
C603 JL164 C1 C2 C3 C7 C8 C9 JL140 RB102 RB104 L209
48 25
JL115
JL141 L201
C628
C601
JL116 JL163 D1 D2 D3 D7 D8 D9 JL175

C190
JL162 E1 E2 B3 E7 E8 E9
C168
R113
R117
C631
R228
L208
JL174
F1 F2 F3 F7 F8 F9
CN804 JL139 R204
L203
JL161
1
G1 G2 G3 G7 G8 G9
JL107 RB105
C600
FB600
R108
C208
C201
R111
H1 H2 B3 H7 H8 H9
IC102 J1 J2 J3 J7 J8 J9
L204
D220
A
CL677
CL678
K1 K2 K3 K7 K8 K9 JL196
L1 L2 L3 L7 L8 L9
SWR1
CN202
JL195
IC1001
JL138
C206
C207
JL194
JL176
M1 M2 M3 M7 M8 M9
C238
CN670
SWITCHING
N1 N2 N3 N7 N8 N9
E
JL1014 L202 L207
1
P1 P2 P3 P7 P8 P9
JL193 R275
H
C6212
POWER KEY
C6205
R1 R2 R3 R7 R8 R9
2
REGULATOR
T1 T2 T3 T7 T8 T9
JL177 R231
JL1013
BOARD JL197 JL185 JL109 JL178
(Page 51)
4
CL675 JL112
5
JL187 JL108 C252

TP41
JL113
JL181
JL179
JL186
JL1012 JL111 JL110

RB106 C244
C191
R896
R898
C253
JL180
R888
R889
R887
R824
R825
L206
IC205
JL183
JL182
(Page 58) C245

JL184
24
8
C426 C428 1
C251
R305
C680 R260
2 14 20 R215 R216
C1001
E
Q202
5 1 C1002 CN805 CN803
JL1009
R258 R259
JL221
1 15 21
Q205
JL1010
JL1011
C212
CN402 R306 R211
C214
I
Q206
R1001
R217
R218
(CHASSIS)
R734 C818
E C719
Q702 S G
Q701
R733
(CHASSIS) SP, RU
13, 21
EXCEPT SP, RU SP, RU 1-886-840- (13, 21)
J NFC
2 14 2 20
CN805 CN803
B 1 15 1 21
PANEL BOARD
CN51
(Page 56)
K
C D
PANEL BOARD PANEL BOARD
CN02 CN01
(Page 56) (Page 56)
Note 1: IC101, IC102, IC103, IC706, IC801 and IC1001 on the

MB1002 board cannot exchange with single. When Note 2: When replacing the WLAN/BT COMBO card, refer to
these parts on the MB1002 board are damaged, ex- “CHECKING METHOD OF NETWORK OPERATION”
change the entire mounted board. (page 11).
HBD-E2100/E3100/E4100/E6100
43 43
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-7. PRINTED WIRING BOARD - MB1002 Board (Conductor Side) - • See page 36 for Circuit Boards Location. • : Uses unleaded solder.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
MB1002 BOARD
B (CONDUCTOR SIDE)
JL714
R416
C410
JL715 CL714 CL713
R455
R415
D202 R412 C409
C407
Q208 R406
A K
R249
JL716
IC403
E JL214 JL718 JL719
C C241 C243
C706 JL403 JL717 R708
R709
R707
C714
JL402 C713
R276
CL719
R248
C715
JL226 CL401
IC201
R717
R716
R718
R719
C716
JL401
R256
JL220
R252
R739
C729
C722
R443 R444 Q404
E
R247
C723
C728
C727
IC703
JL216 R738
JL217
C726
Q405
IC704
C712
C431
R741
R740
C758
C711
R445
C731
R751 R744 R743 R713
R712
R752
Q703
R754
R749
R750
SP, RU
C351
R753
C360
C316
C361
C315 C325 JL592
C324
C317
R385 C381 JL593 CL596 JL591
C356
C380
R859
JL825
D804 R876 CL887
R848 R779 R777
R928
CL597
R892
C358
C357
R778
CL839
R850
JL516
R780
CL827
R782
E
CL882
CL842
C513 CL702
C140
R914 C328 R781
C326
R853 C152 C514
C801 JL520
C135
CL811
C327
C157
C175
C323
R807
C136
C802
R854 C133 JL523
CL705 R810 R811 R808 JL521
R855
JL740 R809 C149
R107
CL704
C188
R103
C803
CL879
C807
C804
C148
R927
R835
CL853
CL852
CL851
C822
RB302
C174
JL301
F CL856 R926
R553
R457
C440
JL303
C318
JL304 C167 R101
CL317
C141 R456
JL315 C173 C187 C441
C322
JL306
56
C169
JL302
C607
JL317
C163
C662
R647
R648
C823
R646
R316
R304
C824
IC805 C235
R243
R219
CL601
RB107
R269
IC601
R645
RB110
R244 R268 JL212 CL613
RB109
R918
RB108
G
IC203
RB802 JL211 JL213 CL617

C264
R644
R643
JL815 R226 C263 CL619
CL1200
C236
C223
JL816
JL817 R274 RB111
C630 C629
C118
R873
JL818
C120
R229
C261
JL819 C108
28
29
C217 C216 C205
R106 C109
C609
JL821
R874
R116
C204
JL820
C257
C634
JL202
JL814
JL210 IC204
C122
JL209 R115
C121
C142
C259
JL208
C123
R230
C250
C254
H JL207 C237
C262
R209
R203
F202 C249 JL201

R263
Q201
JL205
E
C817
R210
F201 JL802
JL204
TH802
R264 C247
Q803 G S
F203
R900
IC804
R901
JL804
JL206 Q804 E JL409
C805
Q203
C813
JL408 JL411
R1010
JL885
JL883
F802
R237 C234
C429
IC406
R437
JL807
JL884 JL801 JL808 JL806 JL809 JL812 JL410
R212 JL827 R434
R236
JL811
I C815
R884
Q204 CL402
Q207
JL810
JL887 JL886
E
JL224
C424
R459 R431 C423
JL225
13, 21
1-886-840- (13, 21)
J
Note: IC203, IC204 and IC601 on the MB1002 board cannot

exchange with single. When these parts on the MB1002
board are damaged, exchange the entire mounted board.
HBD-E2100/E3100/E4100/E6100
44 44
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-8. SCHEMATIC DIAGRAM - MB1002 Board (1/6) - • See page 59 for IC Block Diagrams. • See page 64 for IC Pin Function Descriptions.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
MB1002 BOARD (1/6) NFD7 JL1001 P73 P86 D0DQ0

NFD7 RDQ0
NFD6 P107 D0DQ1
A JL1002 P71 JL198
NFD6 RDQ1
NFD5 JL1003 P70 P84 D0DQ2
NFD5 RDQ2
NFD4 JL1004 P69 P109 D0DQ3
NFD4 RDQ3
P82 JL199 D0DQ4
RDQ4
NFD3 JL1005 P68 P111 D0DQ5 RB101 RB107
NFD3 RDQ5 47 47
NFD2 JL1006 P67 P83 D0DQ6 D0CKE D0CKE_2G D0A0_2G D0DQ0 D0CKE D0CKE_1G D0A0_1G E3 D0DQ16
NFD2 RDQ6 N3 E3 JL188 N3 JL131
NFD1 P110 D0DQ7 A0 DQL0 A0 DQL0
JL1007 P66 D0A10 D0A10_2G D0A1_2G P7 F7 JL114 D0DQ1 D0A10 D0A10_1G D0A1_1G P7 F7 D0DQ17
NFD1 RDQ7 A1 DQL1 A1 DQL1
NFD0 JL1008 P65 P106 D0DQ8 D0BA1 D0BA1_2G D0A2_2G D0DQ2 D0BA1 D0BA1_1G D0A2_1G F2 D0DQ18
NFD0 RDQ8 P3 F2 P3
P88 D0DQ9 A2 DQL2 A2 DQL2
B MB1002 NFCEN
RDQ9
P105 D0DQ10
D0A4 D0A4_2G D0A3_2G
D0A4_2G
N2
P8
A3 DQL3
F8
H3 JL115
D0DQ3
D0DQ4
D0A4 D0A4_1G D0A3_1G
D0A4_1G
N2
P8
A3 DQL3
F8
H3 JL132
D0DQ19
D0DQ20
RDQ10 A4 DQL4 A4 DQL4
NFRBN JL1009 P74 P87 JL1101 D0DQ11
BOARD RB102 D0A5_2G JL197 P2 H8 D0DQ5 RB108 D0A5_1G JL189 P2 H8 D0DQ21
1
NFRBN RDQ11 A5 DQL5 A5 DQL5
NFREN JL1010 P75 P103 JL1102 D0DQ12 47 47
D0A1 D0A1_2G D0A6_2G R8 G2 D0DQ6 D0A1 D0A1_1G D0A6_1G R8 G2 D0DQ22
(3/6) NFCEN JL1011 P76
NFREN RDQ12
P89 D0DQ13 D0A6 D0A6_2G D0A7_2G R2
A6 DQL6
H7 D0DQ7 D0A6 D0A6_1G D0A7_1G R2
A6 DQL6
H7 D0DQ23
NFCEN RDQ13
(Page 47) NFWEN RDQ14
P104 D0DQ14 D0A8 D0A8_2G D0A8_2G T8
A7 DQL7
D7 D0DQ8 D0A8 D0A8_1G D0A8_1G T8
A7 DQL7
D7 JL133 D0DQ24
NFCLE JL1012 P77 P90 D0DQ15 A8 DQU0 A8 DQU0
NFCLE RDQ15 D0A11 D0A11_2G D0A9_2G R3 C3 D0DQ9 D0A11 D0A11_1G D0A9_1G R3 C3 D0DQ25
NFALE P78 A9 DQU1 A9 DQU1
JL1013 D0A10_2G JL196 L7 C8 D0DQ10 D0A10_1G L7 C8 D0DQ26
1 NC NC 48 NFALE P99 D0DM0 A10 DQU2 A10 DQU2
NFWEN JL1014 P79 RDQM0 RB109
C IC1001
H27U2G8F2CTR-BCR 2 NC NC 47
NFWEN
RDQS0
P94 D0DQS0
D0A12
RB103
47
D0A12_2G
D0A11_2G
D0A12_2G
R7
N7
A11 DQU3
C2
A7
JL116
JL117
D0DQ11
D0DQ12 D0A12
47
D0A12_1G
D0A11_1G
D0A12_1G
R7
N7
A11 DQU3
C2
A7 JL134
D0DQ27
D0DQ28
IC1001 3 NC NC 46
RDQS0_
P95 D0DQS0B
D0RAS D0RAS_2G
A12 DQU4
A2 D0DQ13 D0RAS D0RAS_1G
A12 DQU4
A2 D0DQ29
DQU5 DQU5
IC B/D P91 D0DM1 D0ODT D0ODT_2G
DQU6
B8 D0DQ14 D0ODT D0ODT_1G
DQU6
B8 D0DQ30
4 NC NC 45 RDQM1
NAND FLASH P100 D0DQS1 D0CAS D0CAS_2G D0BA0_2G JL195 M2 A3 D0DQ15 D0CAS D0CAS_1G D0BA0_1G JL190 M2 A3 D0DQ31
NFD7 RDQS1 BA0 DQU7 BA0 DQU7
5 NC IO8 44 P101 D0DQS1B D0BA1_2G JL194 N8 D0BA1_1G JL191 N8
1.5 RDQS1_ BA1 BA1
RB104 D0BA2_2G JL193 M3 RB110 D0BA2_1G JL192 M3
NFD6 BA2 47 BA2
6 NC IO7 43 P97 D0CK0B 47
1.5 D0WE D0WE_2G D0WE D0WE_1G
RCLK0_
NFRBN 3.3 NFD5 P98 D0CK0 D0A0_2G
D 7 RY/BY IO6 42 RCLK0 D0A0 D0A0 D0A0_1G
3.3
D0A3 D0A3_2G D0DM1 JL101 D3 J1 D0A3 D0A3_1G D0DM3 JL118 D3 J1
NFREN 3.3 NFD4 P148 D0DQ16 DMU NC DMU NC
8 RE IO5 41 JL1103
3.3 RDQ16 D0A13 D0A13_2G D0DQS1 JL102 C7 J9 D0A13 D0A13_1G D0DQS3 JL119 C7 J9
NFCEN 3.3 P169 D0DQ17 DQSU NC DQSU NC
9 CE NC 40 RDQ17 D0DQS1B JL103 B7 L1 D0DQS3B JL120 B7 L1
P146 D0DQ18 /DQSU NC /DQSU NC
RDQ18 RB105 L9 RB111 L9
10 NC NC 39 P171 D0DQ19 47 NC 47 NC
RDQ19 D0A9 D0A9_2G D0DM0 JL104 E7 M7 D0A9 D0A9_1G D0DM2 JL121 E7 M7
R1001 C1001 P144 D0DQ20 DML NC DML NC
0.001 JL1104
3.3k RDQ20 D0DQS0 JL105 F3 T7 D0DQS2 JL122 F3 T7
11 NC NC 38 P173 DQSL NC DQSL NC
D0DQ21
3.3 RDQ21 D0RRESET D0RRESET_2G D0DQS0B JL106 G3 T3 D0A13_2G D0RRESET D0RRESET_1G D0DQS2B JL123 G3 T3 D0A13_1G
12 Vcc Vcc 37 P145 D0DQ22 /DQSL A13 /DQSL A13
IC101 (1/3) RDQ22 D0A7 D0A7_2G D0A7 D0A7_1G
E 13 Vss Vss 36
3.3 C1003
0.1 CXD90019R-BA
RDQ23
P172 D0DQ23
D0CK0
R106 100
J7 D0CK1
R107 100
J7
C1002 IC101 RDQ24
P168 JL1105 D0DQ24
RB106 D0CK0B K7
CK
RB112 D0CK1B K7
CK
R1010 0.1 P150 D0DQ25 100 /CK 100 /CK
14 NC NC 35 BD DECODER
10k RDQ25 D0A2 D0A2_2G D0CKE_2G JL107 K9 D0A2 D0A2_1G D0CKE_1G JL124 K9
P167 D0DQ26 CKE CKE
15 NC NC 34 RDQ26 D0A5 D0A5_2G C190 100p D0A5 D0A5_1G C192 100p
P149 D0DQ27
RDQ27 D0BA2 D0BA2_2G D0CS_2G JL108 L2 D0BA2 D0BA2_1G D0CSX_1G JL125 L2
NFCLE 3.3
P165 D0DQ28 /CS /CS
16 CLE NC 33 JL1106
RDQ28 D0BA0 D0BA0_2G D0RAS_2G JL109 J3 H1 D0BA0 D0BA0_1G D0RAS_1G JL126 J3 H1
NFALE 3.3 NFD3 P151 D0DQ29 /RAS VREFDQ /RAS VREFDQ
17 ALE IO4 32 RDQ29 D0CAS_2G JL110 K3 M8 D0CAS_1G JL127 K3 M8
3.3 P166 D0DQ30 /CAS VREFCA /CAS VREFCA
D0CS_2G D0WE_2G D0CSX_1G
F MB1002 NFWEN 3.3
18 WE IO3 31
NFD2 RDQ30
P152 D0DQ31
D0CS R117 22
D0RRESET_2G
JL111 L3
/WE
C142
D0CSX R118 22 D0WE_1G JL128 L3
/WE
C159
3.3 RDQ31 JL112 T2 D0RRESET_1G JL129 T2
BOARD /RESET 0.1 /RESET 0.1
2
0.6 NFD1 D0CK0 D0CK1
NAND_RESET 19 WP IO2 30 P162 D0DM2 C191 100p C193 100p
(6/6) 3.3
NFD0
RDQM2
P157 D0DQS2
D0CK0B D0ODT_2G JL113 K1
ODT ZQ
L8 R108 240 D0CK1B D0ODT_1G JL130 K1
ODT ZQ
L8 R109 240
20 NC IO1 29 RDQS2
(Page 50) 3.3
RDQS2_
P158 D0DQS2B
21 NC NC 28
P153 D0DM3
22 NC NC 27 RDQM3
P163 D0DQS3
RDQS3
23 NC NC 26 P164 D0DQS3B A9 B2 C118 0.1 A9 B2
G RDQS3_ JL138
JL139
B3
VSS
VSS
VDD
VDD
D9
JL163
JL164
B3
VSS
VSS
VDD
VDD
D9
24 NC NC 25 P160 D0CK1 E1 G7
E1 G7 C120 0.1 C133 0.01
RCLK1 JL140 VSS VDD JL165 VSS VDD
P159 D0CK1B G8 K2 C121 0.1 G8 K2
RCLK1_ JL141 VSS VDD JL166 VSS VDD
J2 K8 C122 0.1 J2 K8 C135 0.1
P131 D0A0 JL142 VSS VDD JL167 VSS VDD
C169 0.1 P81 RA0 J8 N1 J8 N1
DDRVCCK_1 P120 D0A1 JL143 VSS VDD JL168 VSS VDD
C172 0.1 P92 RA1 M1 N9 C123 0.01 M1 N9 C136 0.1
C173 0.1 P112 RA2 M9 R1 M9 R1
C174 0.1 P154 RA3 P1 R9 P1 R9
H C175 0.1 P174
DDRVCCK_4
RA4
P119
P137
D0A4
D0A5
JL146
JL147
P9
VSS
VSS
VDD JL171
JL172
P9
VSS
VSS
VDD
DDRVCCK_5
RA5 T1 A1 T1 A1
P121 D0A6 JL148 VSS VDDQ JL173 VSS VDDQ
RA6 T9 A8 T9 A8
P135 D0A7 JL149 VSS VDDQ JL174 VSS VDDQ
CORE_1.2V RA7 C1 C1
C176 0.1 P85 P122 D0A8 JL150 VDDQ JL175 VDDQ
DDRVCCIO_1 RA8 B1 C9 B1 C9 C140 0.1
C177 0.1 P96 P133 D0A9 JL151 VSSQ VDDQ JL176 VSSQ VDDQ
DDRVCCIO_2 RA9 B9 D2 B9 D2
C178 0.1 P102 P117 D0A10 JL152 VSSQ VDDQ JL177 VSSQ VDDQ
DDRVCCIO_3 RA10 D1 E9 D1 E9
3.3V C179 0.1 P108 P124 D0A11 JL153 VSSQ VDDQ JL178 VSSQ VDDQ
DDRVCCIO_4 RA11 D8 F1 D8 F1
I C180 0.1 P123
P129
DDRVCCIO_5 RA12
P125
P132
D0A12
D0A13
JL154
JL155
E2
VSSQ
VSSQ
VDDQ
VDDQ
H2
JL179
JL180
E2
VSSQ
VSSQ
VDDQ
VDDQ
H2
DDRVCCIO_6 RA13 E8 H9 E8 H9 C141 10
C182 0.1 P143 JL156 VSSQ VDDQ JL181 VSSQ VDDQ
DDRVCCIO_7 F9 F9
C183 0.1 P147 JL157 VSSQ JL182 VSSQ
DDRVCCIO_8 G1 G1
C184 0.1 P156 P140 D0BA0 JL158 VSSQ JL183 VSSQ
C163 DDRVCCIO_9 RBA0 G9 G9
P118 JL159 VSSQ JL184 VSSQ
MB1002 10 C185 0.1 P161
DDRVCCIO_A RBA1
D0BA1
JL160 JL185
C186 0.1 P170 P139 D0BA2
BOARD DDRVCCIO_B RBA2
J (2/6) 3 C187 0.1 P93

DDRVREF RCKE
P116 D0CKE
JL161
JL162
IC102
JL186
JL187
IC103
(Page 46) RCS_
P128 D0CS K4B2G1646Q-BCMA K4B2G1646Q-BCMA
R112
1k
R115
1k
R101
1k
C188 0.1 P155
DDRVREF RCAS_
P127 D0CAS
IC102 IC103
C167 P126 D0RAS SD-RAM
RRAS_ SD-RAM
0.1 *CSP *CSP
R114 C115 R116 R103 P130 D0WE
RWE_ (Chip Size Package) (Chip Size Package)
1k 0.1 1k 1k P113 P141 D0ODT
RODT
AVDD33_MEMPLL
DDR_1.5V
0.1
0.1
0.1
P114 P134 D0RRESET
10
R105 R111 RRESET
1
1
1
JL135 TP_MEMPLL
K 1k 1k
JL136
P115
TN_MEMPLL
RCSX_ P142 D0CSX
C108
C109
C170
C157
C152
C149
C148
R110 C130 R113 C168
1k 0.1 1k 0.1
GND
Note: IC101, IC102, IC103 and IC1001 on the MB1002 board cannot
exchange with single. When these parts on the MB1002 board
HBD-E2100/E3100/E4100/E6100
are damaged, exchange the entire mounted board.
45 45
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-9. SCHEMATIC DIAGRAM - MB1002 Board (2/6) -
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
MB1002 BOARD (2/6)

A
5.3 0.8
1 2 3 4
MB1002 BOARD
VOUT
FB
GND
N.C
8
IC201
BD00GA3WEFJ-E2 DCDC5V (3/6)
FIN(GND)
IC201 (Page 47)
VCC
N.C
N.C
EN
CN201 9 DC FAN DRIVER
2P 8 7 6 5
JL218
B M1 M
DC-FAN +
DC-FAN -
2
1
JL219
12 3.3
FE_SW12V
(FAN) C242 R249 D202 L205
FE_SW5V
MB1002
0.1 22uH
5.6k DA2J10100L L207 JL221 BOARD
C241
10
R276 JL220
L206
2.2uH
C249
0.1
10uH
C250 R258 4 5
5 5
6
5 FE_GND_M
3.3V 9 (4/6)
100 C243 0.001 8.2k S D D GND
10 5.5 12 10
Q206 CORE_1.2V (Page 48)
R256 4 3 2 1 PMG85XP R211 C212
1.8k IC205 5V VOLTAGE 33k 0.01
BOOT
GND
SW
VIN
5.3 2.4 RT7256ALZSP CONTROL
C Q208
LSCR523UBFS8TL C244 C245 IC205
C254
0.001
C252
22
C253
22
R259
47k
G D
3 2 1
D
10 10
COMP
3 DC FAN DRIVER DC-DC CONVERTER 5 5
EN
SS
FB
9
R252 R248 C240
470 1k 0.1 5 6 7 8
JL214
MB1002 FAN_CONT
JL216
JL215
1 0 3.3 3.6
R212
BOARD JL217 R247 1k 33k
(6/6) 4 FAN_ON
PVDD_VOL_SEL
R264
12k
C251
0.01 R263
3.3
R260
10k Q207
0
2.9
D (Page 50)
EN_POWER C247
2200p
LTC014EUBFS8TL
OVERLOAD
DETECTION
MB1002 R275 1k
PCONT_WOL_STANDBY
BOARD
(4/6) 5 FE_GND_M
GND GND
MB1002
(Page 48) PCONT2
BOARD
JL226
JL225
JL224
JL211
E
EN_POWER
PVDD_CONT
1
2
JL210
JL209
PCONT3
PCONT1 10 (6/6)
DGND 3
JL208
UNSW12V (Page 50)
SWR1 AGND 4
JL207
SWITCHING FE_GND 5
REGULATOR JL205 3.3VA
(1/3) UNSW12V 6 F202 3.15A 32V
JL204 UNSW5.5V
ICUNSW12V 7
JL206
FEUNSW12V 8
CN202 3.3V
F 8P
F201 3.15A 32V
L203
2.2uH C216
10 17 C217
F203 3.15A 32V 10
GND
MB1002 Q205
Q204
1
12 C236
A_GND PMG85XP VIN1 VIN2 16 0.1
BOARD PMG85XP L208 C223 0.1 12 5.3 L209
6
3.3V VOLTAGE 2
12V VOLTAGE JL212 2.2uH VBST1 VBST2 15 2.2uH JL213
CONTROL 5.3
(6/6)
5.5
CONTROL 3 SW1 SW2 14 UNSW5.5V
ICUNSW12V R269 R226 3.3
R245
G (Page 50) 12 12 12
3.3 3.3 3.3
68k C226 C227
1k
4 PGND1 PGND2 13
0 C264 56k MB1002
6 5 4 5 EN1 EN2 12 0.01
22 22
4 5 6 D220 R268 C263 0 0 R244
BOARD
11
D D S 5.6k 0.01 6 SS1 SS2 11 82k
S D D BZT52H-C6V2 0 0
C234 R236 0
7 VFB1 VFB2 10
5.6
(3/6)
R215 C214 R217 R218 0.01 47k 8 VREG5 9
33k 0.01 2.2k 2.2k R219
GND
C235
(Page 47)
D D G 22k
G D D 1 C220 C221 R243
1 2 3 22 22 22k
3 2 1
3.3 3.3 1.4
6 12 12 IC203
TPS54295PWPR
H C269 R246
R237
1 33k
IC203
R216 33k DC-DC CONVERTER
33k GND
0 0
2.9 Q202 Q203 2.9
LTC014EUBFS8TL LTC014EUBFS8TL PCONT3
OVERLOAD OVERLOAD CORE_1.2V
DETECTION
MB1002
DETECTION
MB1002 BOARD
UNSW5.5V
BOARD 3.3VA PCONT1 12 (5/6)
I (5/6) 7 GND
L204
(Page 49)
(Page 49) 2.2uH C259
10 C257
17 10
12 C205
1 VIN1 VIN2 16 0.1
MB1002 3.3V
JL201
L202
2.2uH
C237 0.1 12
2 VBST1 VBST2 15
5.3 L201
2.2uH JL202
5.3 1.5
BOARD CORE_1.2V 3 SW1 SW2 14
J (1/6) 3 GND
R231 C206 C207 C238
1.2
4
5
PGND1 PGND2 13
EN1 EN2 12
0
DDR_1.5V 4.7k
(Page 45) R209
1.5k
22 22 0.01
C262 0
6 SS1 SS2 11
0 C261
0.01
R228
18k
0.01 0 0
7 VFB1 VFB2 10
0 5.6 C201 C208
8 GND VREG5 9 22 22
R230 R203 C204 R274 R204
8.2k 1k 1 1k 3.3k
2.9 IC204
TPS54295PWPR
K 0.7 Q201
LTC014EUBFS8TL
R210 OVERLOAD IC204 R229
22k
2.2k DETECTION DC-DC CONVERTER
Note: IC203 and IC204 on the MB1002 board cannot exchange

with single. When these parts on the MB1002 board are
HBD-E2100/E3100/E4100/E6100 damaged, exchange the entire mounted board.
46 46
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
MB1002 BOARD (3/6) CORE_1.2V
A IC101 (2/3) UNSW5.5V

5 5.5
CXD90019R-BA
4 5
IC101 MB1002
Vout
Vin
BD DECODER IC408
MM1839A50NRE BOARD
11
C408 C414
IC408 1 1
(2/6)
GND
Cont
NC
+5V REG
3 2 1 R419 (Page 46)
1k
B C311 0.1 P36 AVDD33_VDAC P232 C351 C350
5.2 PCONT3
DVCC33_IO_1 _BG 0.1 10
C312 0.1 P46 AVDD33_VDAC P233 3.3V
DVCC33_IO_2 _X
C313 0.1 P61 P234 GND
DVCC33_IO_3 VDACX_OUT CL318
C314 0.1 P72
DVCC33_IO_4 C353 C352
C315 0.1
AVDD33_HDMI
P217 0.1 0.1 MB1002 BOARD
15
Q401
C316 0.1 AVDD12_HDMI_C P226 LSK3541FS8T2L
3.3 3.3
CEC (6/6)
C317 0.1 P240 AVDD12_HDMI P227 CEC DRIVER
MB1002 BOARD
DVCC33_IO_7 _D P228
C356
(Page 50)
C AVSS12_HDMI
1
NFCEN 0.1 CN401
(1/6) NFWEN
C320 0.1 P27
DVCC12_K_1
5.5
19P
C321 0.1 P42 P225 CH2_P CH2_P
(Page 45) C318 0.1 P60
DVCC12_K_2 CH2_P
P224 CH2_N
1 TMDS DATA2 +
R305 R306 DVCC12_K_3 CH2_M 2 TMDS DATA2 SHIELD
10k 10k C322 0.1 P80 IC403 CH2_N
DVCC12_K_4 TC7WHU04FK 3 TMDS DATA2 -
C323 0.1 P175 P223 CH1_P CH1_P
UNSW3.3V_MTK
SIRCS R304 C324 0.1 P216
DVCC12_K_5 CH1_P
P222 CH1_N IC403 4 TMDS DATA1 +
SIRCS 10k DVCC12_K_6 CH1_M 5 TMDS DATA1 SHIELD
UPG_STATUS
UPG_STATUS C325 0.1 P248
DVCC12_K_7 IC B/D CH1_N
6 TMDS DATA1 -
WOL_INT P221 CH0_P WAVE SHAPER CH0_P
D WOL_INT
START_BIT
CH0_P
P220 CH0_N
7 TMDS DATA0 +
START_BIT CH0_M 8 TMDS DATA0 SHIELD
MB1002 XIF_CS
XIF_CS CL401 CH0_N
9 TMDS DATA0 -
IF_SDI P184 P219 CLK_P 5 2Y GND 4
BOARD CLK_P HDMI
13
DVCC33_IO_STB_1 CLK_P 1.5 R412 10 TMDS CLOCK +
IF_SDI 6 3A 2A 3 OUT ARC
OPWRSB P198 P218 CLK_N 220k
(6/6) OPWRSB
IF_SCK
DVCC33_IO_STB_2 CLK_M 1.5
3.3
7 1Y 3Y 2
1.6
1.6 CLK_N
11 TMDS CLOCK SHELD
12 TMDS CLOCK -
(Page 50) IF_SCK
SYS_REQ C326 0.1 P176
AVDD33_LDO HDMISCK
P200 JL401 HDMISCK 8 VCC 1A 1
13 CEC
SYS_REQ
IF_SDO C327 1 P177 P199 JL402 HDMISD
IF_SDO AVDD12_LDO HDMISD C407 R406 10k 14 RESERVED (ARC)
CPU_XRST C328 1 P197 JL403 HTPLG 0.1 HDMISCK JL401 R422 22
E CPU_XRST HTPLG
CEC
P201 WIFI_PCONT
R415
47k
C410
1 HDMISD JL402 R423 22
15 SCL
R457 16 SDA
C441 C440 R456 R410 1.8k
JIG_MODE1 0.01 12p 220 17 DDC/CEC GND
C330 0.1 P231 100 R455 C409 R416 R411 1.8k
AVDD33_PLLGP 470 0.01 18 +5V POWER
X301 P229 P236 C358 C357 68 HTPLG JL403 R424 1k
NS_XTALI AVDD33_DAC 1 10 19 HPD
27MHz P230 P238 C401 0.1
100k
C331 NS_XTALO AVSS33_DAC
10p P235 C359 1 C415
3 1 VMID_PWMDAC R425 R402 47k
68 1
R331
P237 R353 100 AOMCLK
2 4 AL0
F RB301 AR0
P239 AOBCLK
CN380
10k P242 AOLRCK 8P 2
C332 R332 AOLRCK
1.8k P243 AOSDATA0 3
12p AOSDATA0
CN301 AOSDATA1
P62 P244
6P SCL AOSDATA1
JL301 CL317 P63 P245 AOSDATA2 4
3.3V 1 SDA AOSDATA2
JL302 P59 P246 JL320 SPDIF_IN 5
GND 2 EFPWRQ AOSDATA3
JL303 R307 100
RXD 3
(NC) JL304 R308 100 P194 P64 JL317 6 LAN (100)
TXD 4 UATXD SPDIF_IN1
G JIG_MODE1 5
JL305 R386 100 P195
UARXD SPDIF_IN0
P241 MICIN 7
JL306 R387 100 P247 JL316 8
JIG_MODE0 6 SPDIF
P202 C382 C383 1
LED1 0.1 0.1
P203
LED0
P210
RB302 AVDD33_COM Q405
10k P196 P215 C381 C380 IC406
AMUTE AVDD33_LD PMG85XP
UPG_STATUS P208 0.1 10 TPS2065CDBVR WIFI PWR CONTROL
AVSS33_BG
P179 5 5 5
GPIO8
H P180
GPIO7 TXVP_0
P214 CL402 5
5 IN VOUT 1
3.3 4 5 6
P181 P213 R431 C424
GPIO6 TXVN_0 GND 2 S D D
P182 P212 1k 10 3.3 5.3
GPIO5 TXVP_1 4 EN Fault 3 R443 R445
P183 P211 33k 10k
R316 R318 JL319 GPIO4 TXVN_1 C423
100k 10k WOL_INT P185 R385 0.1
START_BIT P186
GPIO3
P209 24k IC B/D G D D
3 2 1
GPIO2 REXT
XIF_CS P187
GPIO1 C390 C384 IC406 R437 5 5
IF_SDI JL318 P188 10k
0.1 10 FRONT USB VBUS
GPIO0 R444
I AVDD33_USB_P1
P58 33k
0
P55 DM1 R434
USB_DM_P1 WIFI_PCONT 100k 3.2 Q404
P56 DP1 LTC014EUBFS8TL
USB_DP_P1
P57 WIFI PWR
USB_VRT_P1 R459 CONTROL DRIVER
4.7k CN402
R395 C361 C360 5P
5.1k 0.1 10
P207
OPWRSB P178
AVDD33_USB_P2
P204 DM2 DP1 DP JL408
1 GND PANEL
2 DP
OPWRSB USB_DM_P2
BOARD
A
IF_SCK P189 P205 DP2 DM1 DM JL409
VCLK USB_DP_P2 3 DM
J SYS_REQ P190
VSTB USB_VRT_P2
P206 VBUS JL410
4 VBUS CN51
IF_SDO GND JL411
AOMCLK
SIRCS
P191
VDATA
R365
5.1k
C426
7p
C428
7p
C429
10
5 SHIELD GND (Page 57)
AOMCLK P192
AOBCLK IR CN404
AOBCLK CPU_XRST R319 100 P193 P257
MB1002 AOLRCK
AOLRCK RESET_ EPAD 5P
AOSDATA0 1 GND
BOARD C303 DP2 DP
14
AOSDATA0
AOSDATA1 0.001 2 DP
DM2 DM
(5/6) AOSDATA1
AOSDATA2
VBUS
3 DM WLAN/BT COMBO
CARD
AOSDATA2
K (Page 49) SPDIF_IN
SPDIF_IN C427
10p
C430
10p C431 GND
4 VBUS
MICIN 10 5 GND
MICIN
MB1002 BOARD
DCDC5V
8 (2/6)
(Page 46)
Note 1: IC101 on the MB1002 board cannot exchange with Note 2: When replacing the WLAN/BT COMBO card, refer to
single. When this part on the MB1002 board is damaged, “CHECKING METHOD OF NETWORK OPERATION”
exchange the entire mounted board. (page 11).
HBD-E2100/E3100/E4100/E6100
47 47
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
A MB1002 BOARD (4/6)

CN660
9P
FE_SLED_A- CL661
1 /A
FE_SLED_A+ CL662
2 A
FE_SLED_B- CL663
3 /B
R522 FE_SLED_B+ CL664
10k FE_RFO+ C518 0.1 P18 P249 C549 0.01 4 B BD DRIVE
C521 RFIP AVDD12_1
B 1 C523
0.1
FE_RFO- C519 0.1 P19
RFIN AVDD12_2
P22 C506 0.01
FE_SPDL_W CL666
5 FGND BPX-7
(2/3)
P20 6 U
CL548 RFIP2 FE_SPDL_V CL667
12 12 P21 7 V
CL549 RFIN2 FE_SPDL_U CL668
8 7 6 5 8 W
P4 C504 0.01 FE_SPDL_COM CL669
9 FIN AVDD33_1 9 COMMON
VCC
NC
NC
EN
IC520 P23 C505 0.01
BD80GA3WEFJ-E2 FE_IN_A JL501 P6 AVDD33_3
INA
IC520 FE_IN_B JL502 P5
INB
VOUT
VO_S
GND +8V REG FE_IN_C JL503 P8 3.3V
NC
INC
C 1 2 3 4 FE_IN_D JL504 P7
IND CORE_1.2V
8 8 FE_IN_E JL505 P12
INE
FE_IN_F JL506 P11
INF
FE_IN_G JL507 P9
ING
C524 FE_IN_H JL508 P10
1 INH FE_SW12V
C603 1
MB1002
BOARD
9
FE_LDD_SDIO P30
FECFREQ
D FE_LDD_SEN P31
FECMOD 56 SLED1_P 1
FE_SLED_B+
FE_SW5V
(2/6)
FE_LDD_CLK P28 (N.C) 0
FEOSCEN
55 SLED1_N 2
FE_SLED_B- C609 (Page 46)
LINFB 0 10
CN501 54 P12V_SLD 3
45P LIN9VG 12 C601
CL526 FE_CO_A- FE_SLED_A+ 10
SA_A- 1 53 SLED2_P 4
CL527 FE_CO_A+ TEST 0 FE_GND_M
SA_A+ 2 FE_SLED_A-
CL530 FE_CO_B- 52 SLED2_N 5 C600 FB600
SA_B- 3 (N.C) 0 0.01 2.2
CL531 FE_CO_B+
SA_B+ 4 51 PGND_2 6 GND
E GND 5
C575 0.1 R575 10k AGND C607
FE_AUX1 C10V 7 0.1
CL532 FAST_EJECT CL509 P2 50
THERMO 6 TRINA (N.C) *1 *1 4.5(10) (SP)
C6205
FE_VHAVC FE_SPDL_COM C690 C6212
P1 0 (5.2)
CP1 8
10 (EXCEPT SP)
47 16V
VC_PD 7 C577 0.1 CL510 TRINB 49 0.1 47 16V
FE_IN_G MCOM 0 C662
E 8 0.1
FE_IN_A R648 R647 48 CP2 9 C680
B 9 2.2k 2.2k PGND_SPM2 12
0.1
FE_IN_C FE_SPDL_W 0 (5.2) C610 0.1
D 10 47 W CP3 10
FE_IN_H 12 (18.8)
F 11 P252 R646 12
FE_IN_F JL511 R645 46 GPOUT 11 CL601
VWDC2O 2.2k 2.2k
H 12 P253 C647 1 C646 0.001 P12V_SPM2
F C 13
FE_IN_D VWDC3O FE_SPDL_V 0 (5.2)
45 XFG 12 CL612 FG FE_FG
FE_IN_B V 3.3 (1.8)
A 14 P15 R644 CL613 RDY FE_GAINSW3
FE_IN_E MPXOUT1 R643 44 RDY 13
G 15 P16 2.2k 2.2k PGND_SPM1 3.3
MPXOUT2 FE_SPDL_U 0 (5.2) CL614 SSZ FE_GIO4
5V_PD 16 P17 43 SSZ 14
C516 0.1 MPXOUT3 U 3.3 (1.4)
GND 17 12 CL615 SCLK FE_TYPWM
CL533 FE_RFO+ 42 SCLK 15
RF+ 18 FE_FPDODVD P256 C643 1 C642 0.001 P12V_SPM1 0 (0.8)
CL534 FE_RFO- FPDODVD CL616 SIMO FE_FMO
RF- 19 P255 41 SIMO 16
R521 JL512 FPDOCD IC101 (3/3) PGND_1 0 (0.8)
GND 20 47k FE_FR- 0 CL617 SOMI FE_FMO2
G MODE_A 21
CL535 FE_GAINSW CXD90019R-BA 40
FCS_N
SOMI 17
0 C618 1
BD DRIVE MODE_B 22
CL536 FE_GIO5
FE_AUX1 P14
IC101 FE_FR+ 0
39 SIOV 18
R531 33k AUX1 BD DECODER FCS_P 3.3
BPX-7 NC 23 FE_TR- 0 CL619 FE_MUTE1
(1/3) FE_3.3V_D R553 47k 38 XRSTIN 19
GND 24 TRK_N 3.3
FE_TR+ 0
GND 25 FE_GAINSW P32 37 (N.C) 20
CL537 FE_LDD_SDIO FEGAINSW1 TRK_P
SDIO 26 FE_TRAYOUT JL513 P33 FE_TILT+ 0
CL538 FE_LDD_CLK FEGAINSW2 36 (N.C) 21
SCLK 27 FE_GAINSW3 P29 TLT_P
CL539 FE_LDD_SEN FEGAINSW3 FE_TILT- 0 C622 0.1
SEN_LDD 28 35 CV3P3 22
H LDEN 29
CL540 FE_GIO7 C533
0.01
C634 1
5.3
TLT_N 3.3
CL541 FE_FPDODVD 34 AGND/DGND 23

TEST_V 30 P251 P5V
JL515 VDAC0 R581 FE_CO_B+ 0
GND 31 P13 P250 4.7k FE_3.3V_D 33 (N.C) 24
JL524 STP1_P
R533 2.2k JL516 V14 RSTI C631 1
GND 32 C514 1 C513 1 P254 FE_CO_B- 0
C580 R582 32 P5V12L 25
FVREF 0.1 5.1k STP1_N
8.0V 33 FE_VHAVC JL514 P3 5.3 C629 0.01
C583 0.1 HAVC FE_CO_A+ 0
8.0V 34 C563 1 C503 0.01 31 LOAD_N 26 CL677
R585 4.7k STP2_P 0 C630 0.01 1 LOAD-
GND 35 P43 MUTE1 FE_MUTE1 FE_CO_A- 0 CL678
FEGIO0 30 LOAD_P 27 2 LOAD+
5.0V 36 STP2_N 0 BD DRIVE
FE_FMO P34 P44 FE_TRAYIN CL673
I 5.0V 37
C586 0.1
FE_FMO2 P35
FEFMO FEGIO1 JL527
29
(N.C)
CA5V 28 C628 0.1 3 TRAY-IN BPX-7
(3/3)
FEFMO2 5.3 4 GND
GND 38 P37 FE_TRAYOUT CL675
JL518 FEFMO3 IC601 5 TRAY-OUT
GND 39 P38
CL542 FE_FR+ JL519 FEFMO4 TPIC2060ADFDRG4 CN670
FD1 40 P24 P54
FR1 41
CL543 FE_FR- JL520
P25
FOO FEGIO3 JL554 IC B/D 5P
CL544 FE_TR+
TR 42
FE_TR-
JL521
P40
TRO
IC601
CL545 JL522 FEDMO
TD 43 P26 COIL/MOTOR DRIVER
CL546 FE_TILT+ JL523 TLO
FD2 44 P49 FE_GIO4
FE_TILT-
J FR2 45
CL547 C553
0.01
FEGIO4
P45 FE_GIO5
FEGIO5
FE_TRAYIN P53 P48
FETRAYIN_ FEGIO6 JL525
FE_TYPWM P39 P47 FE_GIO7
FETRAYPWM FEGIO7
MB1002 BOARD FE_FG P41 P50

FEFG FEGIO9 JL526
(2/6)
(Page 46)
5 FE_GND_M
GND FEGIO10
FEGIO11
P51
P52
K MB1002 BOARD
(6/6) 16
FAST_EJECT
FAST_EJECT
(Page 50)
Note: IC101 and IC601 on the MB1002 board cannot exchange

HBD-E2100/E3100/E4100/E6100 with single. When these parts on the MB1002 board are
48 48 damaged, exchange the entire mounted board.
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-12. SCHEMATIC DIAGRAM - MB1002 Board (5/6) - • See page 42 for Waveforms. • See page 59 for IC Block Diagrams.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

STA516_TH_WARN
STA516_TH_WARN
TAS5538_XPDN
TAS5538_XPDN
DRIVER_SD/PVDD_DETECT
DRIVER_SD/PVDD_DETECT MB1002
DC_DET
BOARD
19
DC_DET
L707
22nH
TAS5538_XRST (6/6)
B R7014
0
STA516_XPDN
TAS5538_XRST
STA516_XPDN (Page 50)
TAS5538_XMUTE
TAS5538_XMUTE
C741 C745 C746 C751 TAS5538_SCL
2200p 3p 3p 10 TAS5538_SCL
TAS5538_SDA
TAS5538_SDA
C744 X701 12MHz
10p
CN707
C737 24P
3.3 3.3 0 0
1
1 3.3VA
20 19 18 17 16 TAS5538_SCL R766 22
C 2 TAS5538_SCL
VDDRF
GND
VDD
X2
X1
CN706 C743 3 3.3VA
2P L703
68p TAS5538_SDA R767 22
PCONT1
UNSW5.5V
CL713 47nH 4 TASS5538_SDA
ANTENNA RF 2
0
1 FRF1 5 CP1 15 SP, RU TAS5538_XPDN R768 100
5 TASS5538_XPDN
CL714 R789 L704 C742 C738
FM GND 1 2 FRF2 IISD 14 Q702 DRIVER_SD/PVDD_DETECT
100 47nH 47p 1 IC710
CL706 RTM001P02T2L 6 DRIVE_SD
3 GNDRF L OUT 13 MM3411A50URE DC_DET R769 100
0 1.5 OVERLOAD 7 DC_DET
D702 IC706 4 CP2 R OUT 12
1.5
DETECTION IC710 R770 100
8 STA516_TH_WARN
BAV99-215 RN5B701-0001 C747 C739 +5V REG
5 GNDRF DA 11 KA5V_OUT 5 5 TAS5538_XRST R771 100
(EXCEPT AEP, UK) 0.047 3.3 1 9 TASS_XRST
IIC/RDSI
S STA516_XPDN R772 100 AMP BOARD
D IC B/D 10 STA516_XPDN
GND
C719 CL703
VDD
CL701
CK
TAS5538_XMUTE R773
(1/3)
LA
0.01 100
B
RN5B701-0002 11 TASS5538_XMUTE
6 7 8 9 10 2.5 5.5 5
(AEP, UK)
3.3 3.3 3.3 4 3 FB701 120ohm
12 DGND CN3505
IC B/D 13 AMP_MCK
(Page 53)
VOUT
VIN
CL715
R733 14 DGND
IC706 L702
22nH
C740
R734
33k 33k C717 C718
1
C721 R760 100
15 AMP_BCK
2200p 10 1
FM DRIVER
16 DGND
GND
(FM RECEIVER) 0
CE
R785 R761 100
10k Q701 3 17 AMP_LRCK
LTC014EUBFS8TL 1 2
R786 100 18 DGND
E ST_RDS_INT
R788 22
OVERLOAD
DETECTION
3.3
19 AMP_D1(FL/FR)
I2C_CLK_TUNER
R787 22 20 DGND
MB1002 I2C_DATA_TUNER
NJU72341_POWER
21 AMP_D3(C/SW)
BOARD
(6/6) 17 ASEL1
CL702
22 DGND
23 AMP_D2(SL/SR)
(Page 50) ASEL0 24 DGND

JL740
NJU72341_POWER
F NJU72341_POWER CL704
CL705
R725 R724
47k 47k
MB1002 BOARD KA5V_OUT
18
KA5V_OUT
(6/6) R727
47k
R726
47k
C723 R749 100
MIC_SIG 10
(Page 50) C726
10
MB1002 BOARD UNSW5.5V

2.5 2.5 1.5 1.6 2
G
12
UNSW5.5V 14 13 12 11 10 9 8
(2/6) PCONT1 R740
47k
R741 R743
47k
R744
47k
IC704
PCM1808PWR
VinL
FMT
DOUT
VinR
MOD1
MOD0
BCK
PCONT1 47k
(Page 46) IC B/D
R780 100
AOSDATA0
1 R781 100
AOSDATA1
DGND
AGND
IC704
LRCK
DVdd
SCKI
AVcc
R782 100
Vref
AOSDATA2
A/D CONVERTER
5 2.5 2.5 2.5 2.5 2.5 0 5
1 2 3 4 5 6 7 MICIN MB1002
16 15 14 13 12 11 10 9 R750 22
2.5 5 3.3 1.6 1.6
BOARD
14
KA5V_IN
3
VDD
X2
X1
X0
X3
B
R777 22
R751 AOBCLK
(3/6)
0.1
H IC703 0 R753 22
SN74LV4052APWR
0 5 R778 22
AOMCLK (Page 47)
C722
C727 C728
VEE
VSS
INH
R752 C731 R754 22

Y0
Y2
Y3
Y1
3.3 0.1 0.1

Y
0 0.1
1 2 3 4 5 6 7 8 0 R779 22
AOLRCK
2.5 2.5 2.5 2.5 2.5
C729
10 SPDIF_IN
C730
10
R738
SP, RU 47k GND MB1002 BOARD
I
7
Q703
R713
4.7k
C711
100p IC B/D RN1902
C758
10
C759
0.1
(2/6)
C712 R739 AUDIO SELECT
R712
12k 0.47 47k
IC703 DRIVER
3.3VA (Page 46)
AUDIO SELECT
J702
2P R716 R718
18k 18k
1 JL716 R707 22k C715 10
L
2 JL717 R708 22k C716 10
J AUDIO IN WHT
RED C713 C714 R717 R719
3 47p 47p 18k 18k
R
4 JL715 JL718
G 5
JL714 C706 1
C760 0.1 R709 VCC
100 TV
0.1 JL719 2
VOUT DIGITAL IN
CL719 3 OPTICAL
GND
4 5
K IC701 IC701
3P
OPTICAL RECEIVER
JACK
Note: IC706 on the MB1002 board cannot exchange with single.

When this part on the MB1002 board is damaged, ex-
HBD-E2100/E3100/E4100/E6100 change the entire mounted board.
49 49
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-13. SCHEMATIC DIAGRAM - MB1002 Board (6/6) - • See page 42 for Waveforms. • See page 64 for IC Pin Function Descriptions.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

MB1002
BOARD
2
FAST_EJECT
CPU_XRST
NAND_RESET
WOL_INT
PLUG_DET
UPG_STATUS
OPWRSB
JIG_MODE1
XIF_CS
IF_SCK
IF_SDI
IF_SDO
FL_CS
MIC_DATA
MIC_CLK
NAND_RESET
NAND_RESET
(1/6)
(Page 45)
PCONT_STA516
I2C_DATA_TUNER
ST_RDS_INT
DRIVER_SD/PVDD_DET
TAS5538_XRST
ASEL1
ASEL0
STA516_TH_WARN
NJU72341_POWER
TAS5538_XMUTE
STA516_XPDN
TAS5538_XPDN
I2C_DATA_TUNER TAS5538_XPDN
I2C_CLK_TUNER TAS5538_XPDN
B I2C_CLK_TUNER DRIVER_SD/PVDD_DET R876 100
17 ST_RDS_INT
ST_RDS_INT
DC_DET
STA516_TH_WARN
DRIVER_SD/PVDD_DETECT
DC_DET 19
MB1002 ASEL0
ASEL0
TAS5538_XRST
STA516_TH_WARN MB1002
ASEL1 TAS5538_XRST
BOARD ASEL1 STA516_XPDN
STA516_XPDN
BOARD
(5/6)
TAS5538_XMUTE
(5/6)
2.2k
4.7k
4.7k
TAS5538_XMUTE
10k
100
TAS5538_SCL
(Page 49) TAS5538_SDA
TAS5538_SCL (Page 49)
NJU72341_POWER
R818
R831
R838
R840
R841
TAS5538_SDA
C NJU72341_POWER
D804 R877
RB751S40, 115 1k
100k
100k
JL825
100
10k
1k
CN806
8P
R813
100 EN_POWER MB1002
FAN_CONT
BOARD
R827
R828
R907
R892
R830
FAN_CONT
4
GND 8
R908 100 NFC_RFDET FAN_ON
RFDET 7
R909 100 NFC_SW
FAN_ON (2/6)
CL842
CL843
CL844
CL845
CL846
CL847
SW 6 PVDD_VOL_SEL
(Page 46)
CL887
CL882
CL827
CL839
R910 100 NFC IRQ R894 10k R804 PVDD_VOL_SEL
IRQ 5 100
NFC R911 100 NFC SEL R858 R859
D SEL 4 R814 10k 0 3.3 3.3 3.3 0 0 3.3 3.3 3.3 3.3 3.3 0 0 3.3 3.3 3.3 0 0
4.7k 4.7k
100
100
100
DATA 3 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
BD_SDI
TS_SCL
NAND_RESET
ST_RDS_INT
NFC_RFDET
DRIVER_SD/POWER_DET
_XRST
WOL_WLAN
ASEL1
ASEL0
FL_CS
STA516_TH_WARN
BD_TEMP(EJ)
BT_LED(NJ)
PLUG_DET/MIC IN
VSS
NJU72341_POWER
VCC2
Front_End_Reset
MIC_DATA
MIC CLK
NO USE
TS_SDA
XWAMUTE
TAS5538
_XMUTE
TAS5538
SPICLK(clock) 2
R815
R816
R817
(IF_SDO)
C VDD 3.3V 1
0
76
(IF_SDO)
STA516
_XPDN 50
3.3
0.5 R848 100

R850
100k
SYS_REQ
CN804 C822
POWER KEY 2P 10
R903
3.3
77 BD_CLK BD_IF_REQ(EJ) 49
3.3 CL861
KEY0 78 BD_CS BD_SDO(IF_SDI) TAS5538_XPDN 48
BOARD KEY0 2 100 0
79 NFC DATA
(IF_SDI)
BD_IF_START(EJ) 47
0.6 START_BIT
KEY0 1 R928 100k 0 R913 100 I2C_CLK_TUNER
TP41
3.3
E R904 CL808 3.3
80 NFC SPICLK ST_SCL 46
3.3 R914 100 I2C_DATA_TUNER IC805
(Page 58) 100 3.3
81 BD_RESET ST_SDA 45
3.3 R853 10k
MM1839A33NRE
EXCEPT SP, RU
R803
R819 10k 3.3
82 JIG_MODE1 CE 44
CL885
IC805
CN805 10k 83 OPWRSB NO USE 43 +3.3V REG
CL811 0 3.3 CL865 FAN_ON
15P 84 FE_EJECT FAN_ON 42
R820 10k 3.3VA
3.3
BT_LED 1 85 UPG_STATUS NO USE 41 CL884
R807 10k C801 0.1 CL813 3.3 PCONT_STA516 UNSW5.5V
FL_DOUT 2
3.3 CL867
KEY2 R821 100 86 S_AIR_RST (NJ) PCONT STA516 40
0 IC801 0 R854 10k
WHITE_LED 3 R808 10k C802 0.1 87 KEY2_EJ R5F3650KCDFB EPM 39 3.3 5.5 IC803
KEY1 R855 3.3k R856 100k PCONT3 PST8429UL
R822 100 3.3 3.3 4 5
F FL_CLK 4 88 KEY1_EJ IC801 PCONT3 38
IC803
D
KEY0 R823 100 3.3 3.3 PCONT2
Vout
Vin
UNSW3.3V 5 89 KEY0(EJ) SYSTEM CONTROLLER PCONT2 37 R880 R886
R809 10k C803 0.1 3.3 3.3 R867 10k PCONT1 VOLTAGE DETECT
12k 33k
1
1
FL_CS 6 CL886
10
90 DESTINATION(NJ) PCONT1 36 UNSW12V
R810 1k 3.3 DC_DET
PANEL FL_GND 7 91 MODEL DC_DET 35 JL826
C823
C824
GND
R860 10k
Cont
0 TAS5538_SCL 12
R811 1k 2.6
NC
FL_GND 8 92 DESTINATION(EJ) TAS5538_SCL 34 3 CD VDD 2
BOARD SIRCS_IN 9
0
93 PCONT_WOL_STANDBY(EJ) TAS5538_SDA 33
2.6 R861 2.2k TAS5538_SDA 3 2 1 C812
1.8 C816
0.01 MB1002
R862 2.2k 0.022 4 OUT GND 1
CN02 Panel 12V 10
3.3
94 AVSS NO USE/RTS1 32
0
R863 47k
R873 100
JL820
1.3 3.3
BOARD
0
(Page 57) GND 11 R920
10k C804 0.1
CL879 95 KEY0(NJ) ON CHIP DEBUG/CLK1 31
3.3 R864 10k
R918
1k (2/6)
PCONT_FL 12 96 VREF RXD1 30
G KEY2 13
3.3
97 AVCC TXD1 29
3.3 R874 100
JL821
GND
PCONT_WOL_STANDBY
(Page 46)
NFC SEL 3.3
Panel 5.5V 14 98 NFC SEL WS_SDA 28 CL883
BD_IF_START(NJ)
R927 100k CL821 0
KEY1 15 4
BD_IF_REQ (NJ)
SPK_LED_PWM
99 PVDD_VOL_SEL(EJ) WS_SCL 27 CL878
3.3 0 PCONT1
CEC_TX_RX
WHITE_LED
100 NO USE BT_LED(EJ) 26 PCONT1
FAN_CONT
PCONT_TS
LED PWM3
SIRCS_IN
FL_DOUT
SP, RU 0 PCONT2
NFC_SW
NFC IRQ
CL890
AC_CUT
KEY INT
FL_CLK
TS RST
PCONT
CNVSS
PCONT2
RESET
TS INT
XOUT
VCC1
BYTE
CN803 RB802 PCONT3

VSS
_FL
XIN
21P PCONT3
100
JL886 BT_LED 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
BT_LED 1
JL811 R888 100 FL_DOUT 3.3 3.3 3.3 3.3 3.3 0 1.5 3.3 1.8 1.7 3.3 3.3 3.3 0 3.3
H FL_DOUT 2
JL887 WHITE_LED R865
100k
100k
WHITE_LED 3
CL849
CL888
CL851
CL852
CL853
CL854
CL855
CL856
CL857
CL889
FL_CLK R868 47k

JL812 R889 100
FL_CLK 4 47k
JL810 UNSW3.3V_MTK
UNSW3.3V 5
R835
R926
FL_CS C807 0.1

JL809 R887 100 OPWRSB
FL_CS 6 OPWRSB
XIF_CS
FL_GND 7 3.3 5.5 XIF_CS
JL808 R871
E 10k UPG_STATUS
FL_GND 8 4 5 UPG_STATUS
JL806 R824 100 SIRCS_IN
SIRCS_IN 9 R869
WOL_INT
MB1002
Vout
Vin
WOL_INT
10k JIG_MODE1
I
1
PANEL Panel 12V 10 JIG_MODE1 BOARD
13
R847 Q801 IF_SCK
GND 11 R837 1M LSCR523UBFS8TL IF_SCK
BOARD (3/6)
C813
JL807 R825 100 PCONT_FL 27k
GND
IF_SDI
Cont
PCONT_FL 12 RESET DRIVER R870
NC
3.3 IF_SDI
KEY2
CN01 KEY2 13
JL801 0 47k
3 2 1
IF_SDO
IF_SDO (Page 47)
JL804 R884 CPU_XRST
(Page 57) Panel 5.5V 14 C809
0.1
DA2J10100L
1.3 1k CPU_XRST
JL802 KEY1 R872 0.22 C810 SYS_REQ
D803
KEY1 15 0.01 SYS_REQ
JL883 R896 100 MIC_DATA 100k
C815 START_BIT
C806
SDA 16 X801 START_BIT

JL884 PLUG_DET 8MHz 1
SIRCS
MIC_DEC 17 SIRCS
JL885 R898 100 MIC_CLK
J SCL 18 IC804
MM1839A33NRE MB1002 BOARD
15
AGND 19 FAN_CONT CEC
CEC
IC804 (3/6)
PVDD_VOL_SEL
JL827
MIC_SIG 20 F802 TH802
C805
WHITE_LED
1A 50V +3.3V REG

(Page 47)
PCONT_FL
A5V 21
SIRCS_IN
FL_DOUT
0.1
NFC_SW
NFC IRQ
JL819
BT_LED
FL_CLK
SIRCS
MB1002
CEC
18
KA5V_OUT
C811 MB1002
16
3.2 FAST_EJECT
BOARD MIC_SIG 0.1 FAST_EJECT
R901 12
BOARD
(5/6) C818 10k 2.1 Q803
K
0.1
0
RSM002P03T2L (4/6)
(Page 49) Q804 R900
OVERLOAD
LTC014EUBFS8TL 47k
S 12
DETECTION (Page 48)
OVERLOAD
MB1002 DETECTION
BOARD C817
6
A_GND
0.1
(2/6) ICUNSW12V
(Page 46)
Note: IC801 on the MB1002 board cannot exchange with single.

When this part on the MB1002 board is damaged, ex-
HBD-E2100/E3100/E4100/E6100 change the entire mounted board.
50 50
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-14. PRINTED WIRING BOARD - AMP Board (Component Side) - • See page 36 for Circuit Boards Location. • : Uses unleaded solder.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
SPEAKERS
TB3401 TB3451
A SUR L SUR R CENTER SUBWOOFER FRONT L FRONT R
AMP BOARD + – + – + – + – + – + –
(COMPONENT SIDE)
C3351
CL3467
E1 B1 C2
C1 B2 E2
C CL3410
R3212
C3228
JL3213
Q3202
JL3111
RB3303
Q3101
RB3304
CL3469
R3109
TP3104
E1 B1 C2
C1 B2 E2
RB3305 TP3101
JL3212
C3353
C3153
C3127
(CHASSIS) C3328 C3352 (CHASSIS)
JL3110
TP3103
R3312
TP3102
Q3302
C3341
C3339
C3354
TP3301
C3154
E2 B2 C1
C2 B1 E1
C3138
C3117
C3115
C3140
TP3022
C3151
RB3003 L3303 C3122
C3315 C3317
C3141
C3139
C3338
C3340
R3557
C3322 L3103
1
C3120
TP3020
2
L3101
TP3018 L3301
E
CN3505
TP3019 Q3553
R3073
C3320
F
E
C3152
TP3008
R3560
C3253
TP3004
MB1002
R3558
TP3002
C3557
C3251
BOARD TP3009 R3559
TP3007
CN707
23
24
C3555 TP3307
(Page 43) TP3053 TP3107
F TP3011
1
Q3552
SL3000
R3555
TP3001
CN3001
RB3001 D3503 C3554 4 1
RB3002 C2 B1 E1
R3062
CN3502
R3556
3
R3371
TP3010 C3308 C3309 C3318 C3319 C3118 C3119 C3108 C3109
E2 B2 C1
C3552 TP3308 R3272 EB3007
TP3305
C3371
TP3054 C3156 C3157 C3106 C3107 JL3103

C3356 C3357 C3306 C3307 JL3303
TP3015
R3281
R3382
TP3106 TP3105
G C3272
R3072
C3372
LP3003 TP3306 1 18 1 18
C3271
C3282
C3281
C3381
IC3102
SL3002
C3382
R3271
R3372
TP3108
R3282
IC3302
R3381
SL3008
H SL3001
SL3007
36 19 36 19
SL3011
C3335
C3135
SL3009
SL3010
C3134 C3133
C3334 C3041 R3033
C3136
TP3230 TP3231 TP3006
C3131
C3333 C3331 56 29
C3336
RB3302
RB3102 EB3008
TP3046
D3351
R3060
IC3001 D3151
R3161
R3162
C3042
R3361
TP3052
C3031
C3021
TP3045
I
R3032
C3027 C3028 TP3042 Q3555

1 28
R3061
C3050
TP3051
C3014
C3013
R3024
TP3043
C3026
R3023
C3029
C1 B2 E2
C3032
R3041
C3022
C3025
TP3025
C3033
L3051 E1 B1 C2
12
R3059
EB3003
R3022
R3021
C3023
1-887-311- (12)
J
(CHASSIS) (CHASSIS)
~ AC IN
1
CN3001
4 1 SWR1
SWITCHING
CN3502
K REGULATOR MB1002
3
BOARD
E CN202
(Page 43)
Note: When the AMP board is replaced, spread the compound referring to “NOTE OF
REPLACING THE IC3102 AND IC3302 ON THE AMP BOARD AND THE
COMPLETE AMP BOARD” on servicing notes (page 10).
HBD-E2100/E3100/E4100/E6100
51 51
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-15. PRINTED WIRING BOARD - AMP Board (Conductor Side) - • See page 36 for Circuit Boards Location. • : Uses unleaded solder.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A
AMP BOARD
(CONDUCTOR SIDE)
C3452
JL3470
C3403
C3464
B
C3466
C3404
JL3469
C3402
JL3412
JL3411
C3455
C3401
C3407
C3408
C3454
JL3466 JL3407
JL3461 JL3459
C3451
C3460 C3457 C3463 C3459 C3405 EB3002
JL3463 JL3462
C3462 JL3405 JL3408 TP3304 R3353
C3456
C JL3460
C3458 C3453 C3465 C3461 C3406
TP3201 TP3202
JL3465
TP3203 TP3204
R3355
JL3464
C3949
R3906 R3907 R3908 R3909 TP3302 JL3312
R3155
R3156 JL3313
D C3124 C3123 C3324 C3323
JL3406
R3356
EB3001
R3354
JL3026 JL3020
C3950
R3153
C3951 C3952 JL3019
JL3022
JL3018
R3904
R3905
R3902
R3903
D3305
D3306
JL3486
E TP3303
D3105
D3106
JL3017
JL3013
JL3015
JL3012
R3154
C3051
JL3004 JL3011
JL3489
R3051 JL3499 JL3010 JL3009
JL3487 JL3488 JL3001
JL3007
JL3053
C3099
JL3002
F JL3008
D3302
D3301
D3307
JL3501 JL3503
JL3500
D3103
C3570
D3102
D3108
D3304
D3101
D3308
JL3520
D3104
JL3521 JL3485
D3107
D3303
JL3054
H JL3504
JL3473 JL3506
JL3518
JL3477 JL3474 JL3476

JL3472 JL3471 JL3519
JL3480
JL3482
JL3478 JL3505
JL3507
I JL3479 JL3409
JL3508 JL3484
JL3481
JL3510 12
1-887-311- (12)
J
HBD-E2100/E3100/E4100/E6100
52 52
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-16. SCHEMATIC DIAGRAM - AMP Board (1/3) - • See page 59 for IC Block Diagrams.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
AMP BOARD (1/3)
5
B DRIVE_SD
6
CN3505 DC_DET
24P 7
TP3001 JL3001
D3.3V 24
TP3002 JL3002 TAS5538_SCL
TAS5538_SCL 23
TP3004 JL3004 RB3001 TAS5538_SDA
D3.3V 22
TP3007 JL3007 100 TAS5538_XPDN
TAS5538_SDA 21
JL3008
TAS5538_XPDN 20
TP3008 R3062
C DRIVE_SD 19
DC_DET 18
TP3009 JL3009 10k
TP3010 JL3010 JL3409 STA516_TH_WARN
STA516_TH_WARN 17
TP3011 JL3011 RB3002 TAS5538_XRST AMP BOARD
B TAS5538 XRST 16
STA516_XPDN 15
JL3012 100 TAS5538_XMUTE
STA516_XPDN
2 (2/3)
TAS5538 XMUTE 14
JL3013
(Page 54)
MB1002 BOARD DGND 13
(5/6) AMP_MCK 12
TP3015 JL3015 R3072 47 AMP_MCK
JL3520
D CN707 DGND 11
JL3017 R3073 47 AMP_BCK
AMP_BCK 10
(Page 49) DGND 9
JL3521
TP3018 JL3018 AMP_LRCK
AMP_LRCK 8 IC3001
AMP_D1 TAS5538DGGR
DGND 7
AMP_D1(FL/FR) 6
TP3019 JL3019 AMP_D3
IC3001
AMP_D2
DGND 5
TP3020 JL3020 IC B/D 8
AMP_D3(C/SW) 4 RB3003 STREAM
47 PROCESSOR 9
DGND 3
E AMP_D2(SL/SR) 2
TP3022 JL3022
JL3026 C3050
DGND 1 100
6.3V 1 PWM_HPM_L 56
PWM_P_6
AMP_D4 TP3231 SR Right +
JL3486
JL3485
JL3484
TP3025 2 PWM_HPP_L 55
PWM_M_6 0
TP3230 SR Left -
R3061 3 PWM_HPM_R 54
PWM_P_5 0
10k
4 PWM_HPP_R 53 C3041 JL3505
PWM_M_5 0.1
1 R3032
F AMP BOARD 2
0
R3023 C3029
5 AVSS
VR_PWM
52
1.8
(2/3)
(Page 54)
1 3
STA516_TH_WARN
STA516_XPDN
470 C3028
C3026
0.047
0.047
4700p 0.6
1.1
6 PLL_FLTM
AVSS_PWM
51
C3042
0.1
4 7 PLL_FLTP 50
R3024 C3027 AVDD_PWM 3.3
470 4700p 1.8 TP3052 SW -
8 VR_ANA 49
C3025 PWM_P_8 1.6
0.1 3.3 TP3051 SW +
9 AVDD 48
PWM_M_8 1.6
R3022 15k 0.2
10 ASEL_VACS2 47
G EB3003 AMP_MCK R3041 47 1.6
PWM_P_7
11 MCLK 46
PWM_M_7
R3021 18k 1.1
12 OSC_RES 45
PWM_P_4
13 DVSS2_CORE 44
C3022 C3032 C3023 C3033 PWM_M_4
10 0.1 10 0.1 3.3 TP3046 Center -
14 DVDD2_CORE 43
L3051 PWM_P_3 1.6
10uH TP3045 Center +
JL3510 15 VACS_1 42
PWM_M_3 1.6
H TAS5538_XRST 3.3
16 XRESET 41 JL3507
PWM_P_2
R3059 10k 3.3 TP3043 Right +
17 XHP_SEL 40
PWM_M_2 1.6
TAS5538_XPDN 3.3 TP3042 Left -
18 XPDN 39
PWM_P_1 1.6
TAS5538_XMUTE 3.3
19 XMUTE
PWM_M_1
38
R3033 AMP BOARD
3
TAS5538_SDA TP3006 10k
(3/3)
3.3
20 SDA 37 10
VALID 3.3
I TAS5538_SCL 3
21 SCL 36 JL3519 (Page 55)
DVSS1_CORE C3031 C3021
AMP_LRCK 1.7 0.1 10
22 LRCK 35
DVDD1_CORE 3.3
AMP_BCK 1.7 R3060 10k
23 SCLK 34
XBKND_ERR 3.3
AMP_D1 0
24 SDIN1 33
PSVC
AMP_D2 JL3508 0
25 SDIN2 32
TEST
AMP_D4 0
26 SDIN3 31
J AMP_D3 0
LRCLKO
27 SDIN4 30
SCLKO
C3014 0.1 1.8
28 VR_DIG 29
C3013 10 SDOUT
EB3008 JL3481
HBD-E2100/E3100/E4100/E6100
53 53
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
A AMP BOARD (2/3)

DC_DET
7
5
JL3501
SL3001 PVDD_DET
6
JL3503
B
R3555 D3503
47k RB751S40, 115
SL3002 C3552
47 4V
C3570 1 SL3000
R3556
C AMP C3554 0.01
22k
BOARD
(1/3) 2 0
1.2
JL3500
(Page 53)
3.3
Q3552
XP4501
0
OVERLOAD DETECTION
C3555 0.1
D R3559 1k
R3558
JL3499 10k
R3557
47k
CL3410
3.3
Q3553
0 LSCR523UBFS8TL
DC DETECTION
E 8
R3560
9 SL3007 100k
1000p
1000p
1000p
1000p
0.01
0.01
0.01
0.01
C3557
C3335 0.1 0.01
C3402
C3401
C3404
C3403
C3406
C3405
C3408
C3407
54 TB3401
JL3471 36 VCC_SIGN 1 R3353 R3355 2P
GND_SUB 4.7k 4.7k JL3405 1
54 TP3305 +
F C3334
0.1
35 VCC_SIGN
OUT2B
2
0
C3315 C3317
C3351
560 35V
C3353
560 35V TP3304 SL +
JL3406
JL3407 5
2
-
SUR R
SPEAKERS
34 VSS 3 0.1 1000p +
OUT2B 27 C3356 SR Left - TP3303 SL - JL3408 3 SUR L
0.1 C3371 R3371 D3307 -
RB3302 JL3472 33 VSS 4 330p 22 D3301 STPS1H100A C3949 4
47 VCC2B 32.5 C3308 STPS1H100A 0.47 SR Left +
SR Right + 1.6 2.2
32 1N2B 5
SR Left - GND2B 1 2
JL3504 1.6 C3372
Center - 31 IN2A 6 330p 3 4 SR Right -
GND2A C3309
Center + 1.6 2.2 D3302 L3301 C3950 JL3412
30 IN1B 7 R3372 STPS1H100A 20uH 0.47 SR Right + TP3302 SR +
G 1.6
29 1N1A
VCC2A
8
32.5 C3357
0.1 22
C3320 C3322 C3352 C3354 TP3301 SR - JL3411
OUT2A 27 D3308 0.1 1000p 560 35V 560 35V
3.3 STPS1H100A
3 28 TH_WARN 9 TP3306
OUT2A 27 R3354 R3356
JL3473 RB3305
R3361 10k 3.3 4.7k 4.7k
27 xFAULT 10 TP3307 100k
D3351 OUT1B 27 C3338 C3340
AMP RB751S40, 115 3.3
26 xTRISTATE 11 0.1 1000p
C3333 OUT1B C3306
BOARD 27
R3381
1 10 0.1
3.3
4 25 xPWRDN 12 22 D3303 JL3313
D3305 L3303 C3323
(1/3) VCC1B 32.5 C3318 STPS1H100A C3381
STPS1H100A
20uH 0.47 C3253
H (Page 53) JL3474
24 CONFIG
GND1B
13
2.2
330p 1 2 270 63V 27 R3312
100k
3.3 0 27
2 23 VL 14 C3382 3 4 Q3302
C3331 GND1A C3319 330p C3324 C3328
D3304 0.47 HN1A01FU 2.2
10 JL3518 5 2.2 OVERLOAD
1 22 VDD 15 R3382
STPS1H100A 0 27
VCC1A 32.5 C3307 D3306 DETECTION
SL3009 5 STPS1H100A 22
0.1 27
21 VDD 16 C3339 C3341
Center +
Center -
C3336 OUT1A 27 0.1 1000p
0.1 JL3312
20 GND_REG 17
OUT1A 27 TP3308
JL3476
3.3
19 GND_CLEAN 18
I 0
N.C JL3303
SL3011 IC3302
STA516BF13TR-A EB3002
0
R3908 R3909
3.3 Q3555 IC3302 33k 33k
HN1A01FU
FAULT IC B/D EB3007
DETECTION
POWER AMP
JL3487 R3904 R3905
33k 33k
JL3488 CN3502
J EB3001
JL3489 3P
1 MON GND
SWR1
2 MON PVDD
SWITCHING
3 MON GND REGULATOR
(2/3)
C+
C-
K 11 12 13 14 15 16 17 18 19 20 21 22 23
4 5
AMP BOARD AMP BOARD
(3/3) (3/3)
(Page 55) (Page 55) Note: When the AMP board is replaced, spread the compound referring to “NOTE OF
HBD-E2100/E3100/E4100/E6100
54 54
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
A AMP BOARD
(2/3)
(Page 54)
5
B 18 19 22 20 21 23
AMP BOARD (3/3)
C+
C-
Q3202
HN1A01FU
OVERLOAD
JL3213 DETECTION
27
C 0 27
C3228 R3212
10 100k
0 27
27
JL3212
RB3304
100k
D TP3204
TP3203
TP3202
TP3201
JL3110
E 27
SW +
SW -
C+
C-
0 27
C3127 R3109
2.2 100k
0 27
AMP BOARD SL3008

27
SW +
SW -
(1/3) 10 JL3111
1000p
1000p
1000p
1000p
Q3101
0.01
0.01
0.01
0.01
(Page 53) HN1A01FU
OVERLOAD
F DETECTION
C3453
C3451
C3457
C3455
C3461
C3459
C3465
C3463
C3135 0.1
TB3451
4P
54 JL3459 8
JL3482 36 VCC_SIGN 1 RB3303 -
15 GND_SUB 100k JL3460 CENTER
54 7 +
SL3010 35 VCC_SIGN 2 TP3107 C3138 C3140 JL3461 10
C3134 OUT2B 0 6 -
0.1 1000p
13 0.1 JL3462 5 SUBWOOFER
34 VSS 3 +
OUT2B 27
R3281 JL3463
D3105 R3903 R3907 4 SPEAKERS
L3103 -
G SW -
RB3102
47
JL3478 33 VSS
VCC2B
4
32.5 C3156
0.1 C3118
STPS1H100A 22
C3281
D3103
STPS1H100A
20uH
33k 33k JL3464 3
+
FRONT L
1.6 C3123 SW + JL3465 9
32 1N2B 5 2.2 330p 1 2 0.47 -
SW + GND2B JL3466 2 FRONT R
AMP BOARD Right + JL3506
1.6
31 IN2A 6 C3119 C3282 3 4 C3124
1
+
SW -
4
GND2A 2.2 0.47
(2/3) Left - 1.6
C3157
0.1
D3106 330p
D3104
30 IN1B 7 STPS1H100A
R3282 STPS1H100A R3902 R3906
(Page 54) VCC2A
1000p
1000p
1000p
1000p
32.5 33k 33k
22
0.01
0.01
0.01
0.01
17 1.6
29 1N1A 8
16 OUT2A 27
C3139 C3141
R3162 10k 3.3 C3251
C3454
C3452
C3458
C3456
C3462
C3460
C3466
C3464
12 28 TH_WARN 9 TP3108 0.1 1000p 270 63V
H R3161 10k JL3479 3.3
27 xFAULT
OUT2A
10
27
TP3105 C3115 C3117 CL3469

D3151 OUT1B 27 R3153 R3155
RB751S40, 115 0.1 1000p 4.7k 4.7k TP3104 FL +
3.3 JL3469
11 26 xTRISTATE 11
C3133 OUT1B 27 C3106 D3107 Left - TP3103 FL -
10 3.3 0.1 C3271 R3271 JL3470
14 25 xPWRDN 12 330p 22 D3101 STPS1H100A L3101
VCC1B 32.5 C3108 20uH C3952
STPS1H100A C3151 C3153
2.2 1 0.47
24 CONFIG 13 1 2 560 35V 560 35V
GND1B
3.3
23 VL 14 3 4 Left +
C3131 GND1A C3109
JL3480 CL3467
I 10 5
22 VDD
VCC1A
15
32.5
2.2
C3107
C3272 R3272 D3102 D3108 Right - TP3101 FR -
330p 22 STPS1H100A STPS1H100A C3122 C3120 C3951
5 0.1
21 VDD 16 0.1 1000p 0.47 Right +
C3136 OUT1A 27 TP3102 FR +
0.1 C3152 C3154
20 GND_REG 17 TP3106 560 35V 560 35V
JL3477 OUT1A 27
19 GND_CLEAN 18 JL3103
N.C R3154 R3156
4.7k 4.7k
IC3102
STA516BF13TR-A CN3001
J IC3102 TP3054
4P
1 P-GND
IC B/D C3099 C3051 R3051 JL3054
2 P-GND SWR1
POWER AMP 2.2 0.01 100k
JL3053 3 +32.5V SWITCHING (AC IN)
REGULATOR
TP3053 4 +32.5V (3/3)
HBD-E2100/E3100/E4100/E6100
55 55
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-19. PRINTED WIRING BOARD - PANEL Board - • See page 36 for Circuit Boards Location. • : Uses unleaded solder.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A MB1002 MB1002
BOARD BOARD
KARAOKE
D CN803 CN805
BOARD (Page 43) (Page 43)
CN71 G SP, RU CN01
(Page 58)
21 1 C
20 2
B
PANEL BOARD SP, RU
CN03
CL11
CL09
CL14
CL03
CL13
JR JR05
JR JR04
S08 S04 S03
CL71
CL72
CL06
C02
R02
FUNCTION
R07
R06
> .
R03 R05 21 CN01 15 CN02 1 CN02
CN51
15 1
B S05
R01
C01
S07 1 6 20 14 2 CL01
R08
JR07
C51
VOL + CL08
R04
1 5 Z CL17 JR09 R22 14 2
JR
C
R11
JR CL73
R18 CL05
CL07
C24
D04
R19
C15
C13
MB1002 CL15
JR08
CL10
R17 R12
R10CL02
C21
CL04
S06 S02 S01
JR
JL53 JL54
C05
C10 EXCEPT SP, RU
JR JR10
BOARD VOL – CL12
C23
C53
C54
C06
x N
R21
1 JR
CN402 IC01
R15
R16
D02 JR06
1 IC02
R20
JR JR11
R13
4 1 CL51 JR02
Q01
IC03
C16
(Page 43) 7 5 6 C22 CL18 D03 JR D05
Q03
R28
CL16 R24
C26 D01
EB
C04
C03
28 25 15 C14 2 1 R14 JR03 D06
11
C12
VS O C2 B1 E1
ND01 C11 JR R26
D
EB
VACUUM FLUORESCENT DISPLAY R29
(11)
Q02
R09
E2 B2 C1 R30 1-887-134-
CN52
HBD-E2100/E3100/E4100/E6100
56 56
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-20. SCHEMATIC DIAGRAM - PANEL Board -
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
PANEL BOARD
B CL16
5.5 3.3
ND01
4 3 VACUUM FLUORESCENT DISPLAY
Vin
Vout
IC03
MM3411Z41URE
R26 R29 R30 C22 C23
IC01
220 220 220
GP1UE27XK0VF
1 1 IC03
GND
CE
+3.3V REG
C IC01
PGND
DOUT
LGND
1 2
OSC
VDD
CLK
STB
DIN
REMOTE CONTROL
VIN
SW
F+
VH
3.3
F-
SIGNAL RECEIVER
1 2 15 16 17 18 19 20 21 22 23 24 25 27 28
C26
470p CL17
D06 D05
1L0353W34A0MKT01 1L0353B14E0MKT01
GND
OUT
CL18
VS
WHITE LED BT LED 5.5 3.3
4 3 R13
3.3 3.3 33k
C21
Vin
Vout
IC02
C05 MM3411A33URE 470p
C03 1 C06 C11 D01 R14 R15 R16 R17 R18
D R24 0
0
0.01 IC02 1 1 UDZVTE-172.0B 100 100 100 75 75
Q03
GND
Q02 0 +3.3V REG
CE
10k 0 LSCR523UBFS8TL CL15
LSCR523UBFS8TL LED DRIVER C04
EXCEPT SP, RU 4.7 1 2
LED DRIVER R28
CN02 10k 3.3
15P
CL03
BT_LED 1
CL01 R12 220
FL_DOUT 2
CL14
WHITE_LED 3
CL02 R11 220
E FL_CLK 4
CL05
MB1002 UNSW3.3V 5
CL04 R10 220
BOARD FL_CS 6
CL06
D
FL_GND 7
(6/6) FL_GND 8
CN805 SIRCS_IN 9
CL07 R09 47
CL08
(Page 50) PANEL12V 10
CL09 R21
GND 11 10
CL10 R22 1k
F PCONT_FL 12
CL11 6 C14 1 C16
0.22
C24
0.22
KEY2 13
CL12 C12
PANEL5.5V 14 6
1
CL13 D02
KEY1 15 C10 BAV99-215 R20
0.1 12 6 10
SP, RU Q01 C13 D03 C15 R19

BC817DPN BAV99-215 1 33k D04
DISPLAY SW DRIVER 1 DZ2J300M0L
CN01
G 21P
BT_LED 1
FL_DOUT 2
WHITE_LED 3
R01 R02 R03 R04 R05 R06 R07 R08
FL_CLK 4 100 1k 2.2k 2.2k 100 1k 2.2k 2.2k
UNSW3.3V 5
FL_CS 6
FL_GND 7 C01 S01 S02 S03 S04 C02 S05 S06 S07 S08
0.1 N x FUNCTION . 0.1 Z VOL – VOL + >
H MB1002 FL_GND 8
SIRCS_IN 9
BOARD PANEL12V 10
(6/6)
CN803
E GND
PCONT_FL 12
11
KEY2 13
(Page 50) PANEL5.5V 14
KEY1 15 C51
CL71 SDA CN52 C54 C53 220
I SDA 16
CL72 MIC_DET 4P 10p 10p 10V CN51
5P
MIC_DET 17
CL73 SCL 4 MB1002
SCL 18 1 GND
AGND 19
AGND 3
2 DP BOARD
MIC_SIG
A5V
20
21
MIC_SIG
A5V
2
1 JL53
3
4
DM
VBUS
A (3/6)
CN402
JL54
5 SHIELD GND
(Page 47)
J SP, RU
CN03 CL51
6P
SDA
SDA 1
KARAOKE MIC_DET 2
MIC_DET
BOARD SCL
F
SCL 3
AGND
CN71 AGND 4
MIC_SIG
K (Page 58) MIC_SIG 5

A5V
A5V 6
HBD-E2100/E3100/E4100/E6100
57 57
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
6-21. PRINTED WIRING BOARD – KARAOKE Board (SP, RU) – 6-23. PRINTED WIRING BOARD – POWER KEY Board –
• See page 36 for Circuit Boards Location. • : Uses unleaded solder. • See page 36 for Circuit Boards Location. • : Uses unleaded solder.
1 2 3 4 5 6 7 8 1 2 3 4 5 6
KARAOKE BOARD
A (SP, RU) A POWER KEY
J71
MIC 1
J72
MIC 2
BOARD
S41
CL42
B B &/1
C41
R41
CL41
TP41
C95
11
R86
R76 C94
CL80
(11)
R75
1-887-135-
IC71
C C85 CL84 C
C86
R71 C82 C78 CL79 R73
C80
C81
C79
C84
C73 C74 R81 R80 C75

CL77
R74
A
R72
JW52 JR
C76
C87
R79
R77
R78
C77
CL83
R82
CL76
R87 C71 MB1002
IC72
C93
CL81
C88
C89
R85
JW53
BOARD
D71
CL74
D CL72
CL73 JR
D CN804
11
R84
CL71 CL75 (Page 43)

R88
1
CN71
3 7
1-887-377- (11)
PANEL
BOARD
CN03 G
E (Page 56) (CHASSIS)
E
6-22. SCHEMATIC DIAGRAM - KARAOKE Board (SP, RU) - 6-24. SCHEMATIC DIAGRAM - POWER KEY Board -
1 2 3 4 5 6 7 8 9 1 2 3 4
KARAOKE BOARD
A (SP, RU) A
C80 R78
POWER KEY BOARD
1M
MB1002
27k
10
10
C81
R77
10k
C77 BOARD
C79
R79
C78 1 R41
C
TP41
0.1 4.7 (6/6) CL41 100
S41
CN804 C41
0.1 "/1
B 5 2.5 0.9 2.5 2.5
B (Page 50)
8 9 10 11 12 13 14
Bias Detector
IC71
NJM2783V (TE2)
IC71
MIC AMP CL42
CN71 7 6 5 4 3 2 1
7P
2.5 2.5 2.5 2.5 2.5 2.5 2.5
CL71
SDA 1
C PANEL MIC_DET 3
CL72 R87 100 R72 C74
C85 R76 1k 0.22 CL77
BOARD CL73 47k J71
F SCL 4 1
CL74 MIC 1
C82
CN03 AGND 5
CL75 1000p C94
R71
100k
C73
1000p
MIC_SIG 6
(Page 57) A5V 7
CL76 R80
R81
270p
R75
15k 1k
8.2k
C84 C95 C71

0.1 2.2 R86
0 1000p
D CL84
R88 C89 C88 C87 C86 D71
470 0.1 10 10 2.2 CL83 BAV99-215 CL81
5 2.5 2.5
8 9 10 11 12 13 14
SDA
SCL
IC72 R82
V+
VREF
GND
OUT2
OUT1
NC
NC
0
NJU72341V (TE2)
C76 CL80
R74
E IC72 1k 0.22 CL79 J72
MUTE
MIC 2
SDA
ELECTRICAL
SCL
IN2
IN1
NC
NC
VOLUME
R73 C75
7 6 5 4 3 2 1 100k 1000p
3.3 3.3 2.5 C93
2.2
R84 100
R85 100
HBD-E2100/E3100/E4100/E6100
58 58
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
• IC Block Diagrams
IC3001 TAS5538DGGR (AMP BOARD (1/3))
PWM_HPM_L 1
PWM_HPP_L 2 56 PWM_P_6
PWM_HPM_R 3 55 PWM_M_6
PWM_HPP_R 4 54 PWM_P_5
AVSS 5 53 PWM_M_5
PLL_FLTM 6 Power Supply 52 VR_PWM
PLL_FLTP 7 51 AVSS_PWM
VR_ANA 8 50 AVDD_PWM
Digital Audio Processor PWM Section
Clock, PLL, and Serial Data I/F
AVDD 9 0 7 Soft Soft Loud DC De 49 PWM_P_8

Det Biquads Tone Vol Comp DRC Block Emph Interpolate SRC NS PWM
48 PWM_M_8
0 7 Soft Soft Loud DC De
ASEL_VACS2 10 Det Biquads Tone Vol Comp DRC Block Emph Interpolate SRC NS PWM 47 PWM_P_7
MCLK 11 0 7 Soft Soft Loud DC De 46 PWM_M_7
Output Control
OSC_RES 12 Device
8.8 Crossbar Mixer
45 PWM_P_4
8.2 Crossbar Mixer

Control 0 7 Soft Soft Loud DC De
DVSS2_CORE 13 Det Biquads Tone Vol Comp DRC Block Emph Interpolate SRC NS PWM 44 PWM_M_4
DVDD2_CORE 14 0 7 Soft Soft Loud DC De 43 PWM_P_3
I 2C Det Biquads Tone Vol Comp DRC Block Emph Interpolate SRC NS PWM
VACS_1 15 Serial 42 PWM_M_3
0 7 Soft Soft Loud DC De
XRESET 16 Control Det Biquads Tone Vol Comp DRC Block Emph Interpolate SRC NS PWM
41 PWM_P_1
I/F
System Control
DAP Control
XHP_SEL 17 0 7 Soft Soft Loud DC De

Det Biquads Tone Vol Comp DRC Block Emph Interpolate SRC NS PWM 40 PWM_M_2
XPDN 18 0 7 Soft Soft Loud DC De 39 PWM_P_1

XMUTE 19 38 PWM_M_1
SDA 20 8 8 4 8 2 8 8
37 VALID
PWM Control
SCL 21 2 36 DVSS1_CORE
Volume
LRCK 22 9 Control 35 DVDD1_CORE
PSVC
SCLK 23 34 XBKND_ERR
SDIN1 24 33 PSVC
SDIN2 25 32 TEST
SDIN3 26 31 LRCLKO
SDIN4 27 30 SCLKO
VR_DIG 28 29 SDOUT
IC3102 STA516BF13TR-A (AMP BOARD (3/3))

IC3302 STA516BF13TR-A (AMP BOARD (2/3))
GND_CLEAN 19 18 NC
GND_REG 20
M3
17 OUT1A
VDD 21
16 OUT1A
VDD 22
M2 15 VCC1A
VL 23
PROTECTIONS 14 GND1A
CONFIG 24
& 13 GND1B
xPWRDN 25
LOGIC 12 VCC1B
xTRISTATE 26
M5
xFAULT 27
TH_WARN 28
IN1A 29
IN1B 30
M4
11 OUT1B
REGULATORS 10 OUT1B
M17
9 OUT2A
8 OUT2A
IN2A 31 M15
IN2B 32 7 VCC2A
M16
VSS 33 6 GND2A
VSS 34 5 GND2B
4 VCC2B
VCC_SIGN 35 M14 3 OUT2B
VCC_SIGN 36 2 OUT2B
1 GND_SUB
59
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
IC403 TC7WHU04FK (MB1002 BOARD (3/6))
2Y 5 4 GND
3A 6 3 2A
1Y 7 2 3Y
VCC 8 1 1A
IC406 TPS2065CDBVR (MB1002 BOARD (3/6))
Current
Sense
IN 5 CS 1 OUT
Charge Current
Pump Limit (Disabled+ 2 GND
UVLO)
EN 4 Driver
3 FLT
UVLO
OTSD 9-ms
Thermal Deglitch
Sense
60
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
IC601 TPIC2060ADFDRG4 (MB1002 BOARD (4/6))
P12V_SLD
SLED2_N
SLED1_N
SLED2_P
SLED1_P
PGND_2
C10V
CP3
CP2
CP1
10 9 8 7 6 5 4 3 2 1
56 NC
55 LINFB
GPOUT 11
54 LIN9VG
XFG 12
53 TEST
int 10V
Regulator 52 NC
RDY 13
SPM_RCOM
XSLEEP Charge 19V 51 AGND
pump
50 NC
SPM 49 MCOM
SIOV SPM_ENA Current limit
SPM Logic
DAC PWM BEMF 48 PGND_SPM2
detector
XSLEEP pre 47 W
-driver pwr FET
200k
SSZ 14 Digital core 46 P12V_SPM2

SCLK 15
SPI I/F
DAC PWM pre

-driver pwr FET 45 V
SIMO 16
200k
SIOV 44 PGND_SPM1
SLD_ENA
SOMI 17 I-F/B
SIOV 43 U
SLED END
SIOV 18 pre
det
On chip -driver pwr FET

thermometer
GPOUTENA 42 P12V_SPM1
XRSTIN 19 SLD_E_ENA
I-F/B
200k
41 PGND_1
NC 20 int 3.3V pre

Regulator DAC PWM -driver pwr FET
SIOV P5V TLT_ENA

NC 21 SIOV F/B
33k
P12V 40 FCS_N
Power
monitor
CV3P3 22 pre 39 FCS_P
P5V
DAC PWM -driver pwr FET
FCS_ENA 38 TRK_N
AGND 23
5V Analog F/B
ACTTEMP
ACTTEMPTH>0 pre 37 TRK_P

NC 24 -driver pwr FET
LDO LIN9V_DIS
control TRK_ENA 36 TLT_P
DAC PWM
F/B
35 TLT_N
analog
TRAY xxx
pre 34 P5V
det
-driver pwr FET

TRAY_E_ENA
LOAD_ENA
F/B
33 STP1_P
pre
DAC PWM -driver pwr FET 32 STP1_N
F/B
STEP END
det
pre 31 STP2_P
-driver pwr FET
STEP_E_ENA 30 STP2_N
STP_ENA
F/B
TPIC2060A
25 26 27 28 29
P5V12L
LOAD_P
LOAD_N
CA5V
NC
61
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
IC703 SN74LV4052APWR (MB1002 BOARD (5/6))
2Y0 1 16 VCC
15 1Y2
2Y2 2
2-COM 3 14 1Y1
2Y3 4 13 1-COM
12 1Y0
2Y1 5
INH 6 11 1Y3
GND 7 10 A
GND 8 9 B
IC704 PCM1808PWR (MB1002 BOARD (5/6))
ANTIALIAS
14 VINR
LOW-PASS FILTER
ANTIALIAS
13 VINL
LOW-PASS FILTER
DELTA-SIGMA
MODULATOR u1/64 12 FMT
SERIAL
DECIMATION 11 MD1
INTERFACE
VREF 1 FILTER 10 MD0
REFERENCE &
WITH
MODE/FORMAT 9 DOUT
HIGH-PASS
DELTA-SIGMA CONTROL 8 BCK
FILTER
MODULATOR
AGND 2
VCC 3 POWER
VDD 4 SUPPLY
DGND 5
CLOCK & TIMING CONTROL
SCKI 6
LRCK 7
IC706 RN5B701-0001 (MB1002 BOARD (5/6)) (except AEP and UK models)

VDDRF
GND
VDD
CP1
X2
X1
20 19 18 17 16 15
IISD
14 IISD
Digital Signal Processing
LOUT
Filter 13 LRCK/LOUT
Digital FM Stereo DAC
AGC Mixer Demodulator Decoder
FRF1 1 AMP
FM LNA ADC ROUT 12 BCLK/ROUT
AGC Digital RSSI
FRF2 2 Calculation
AMP AGC
LRCK
Image Station IIS BCLK
GNDRF 3 AGC Control Detector Generator
DET
ADC
Digital Filters
Clock Serial Interface/Registers

CP2 4 LOSC XOSC
Generator
5 6 7 8 9 10 11
GND
IIC/RDSI
VDD
GNDRF
CK
DA
LA
62
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
IC706 RN5B701-0002 (MB1002 BOARD (5/6)) (AEP and UK models)
VDDRF
GND
VDD
CP1
X2
X1
20 19 18 17 16 15
IISD
14 IISD
Digital Signal Processing
LOUT
Filter 13 LRCK/LOUT
Digital FM Stereo DAC
AGC Mixer Demodulator Decoder
FRF1 1 AMP
FM LNA ADC ROUT 12 BCLK/ROUT
AGC Digital RSSI RDS
FRF2 2 Calculation Decoder
AMP AGC
LRCK
Image Station IIS BCLK
GNDRF 3 AGC Control Detector Generator
DET
ADC
Digital Filters
Clock Serial Interface/Registers

CP2 4 LOSC XOSC
Generator
5 6 7 8 9 10 11
GND
IIC/RDSI
VDD
GNDRF
CK
DA
LA
IC1001 H27U2G8F2CTR-BCR (MB1002 BOARD (1/6))
NC 1 48 NC
NC 2 47 NC
NC 3 46 NC
NC 4 45 NC
NC 5 44 IO8
NC 6 Status register 43 IO7
RY / BY 7 42 IO6
RE 8 41 IO5
CE 9 Address register Column buffer 40 NC
NC 10 I/O 39 NC
Control circuit Column decoder
NC 11 38 NC
VCC 12 Command register Data register 37 VCC
VSS 13 36 VSS
Sense amp
NC 14 35 NC
NC 15 34 NC
Row address buffer decoder
CLE 16 33 NC
Row address decoder
ALE 17 32 IO4
WE 18 Logic control Control circuit Memory cell array 31 IO3
WP 19 30 IO2
NC 20 29 IO1
NC 21 28 NC
NC 22 27 NC
NC 23 26 NC
NC 24 25 NC
RY/BY HV generator
63
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
• IC Pin Function Descriptions

MB1002 BOARD (1/6), (3/6), (4/6) IC101 CXD90019R-BA (BD DECODER)
Pin No. Pin Name I/O Description
P1 TRINB I Input of Tracking Signal (B)
P2 TRINA I Input of Tracking Signal (A)
P3 HAVC O Decoupling Pin for Reference Voltage of Main and Sub Beams
P4 AVDD33_1 - 3.3 V Power Pin
P5 INB I Input of Main Beam Signal (B)
P6 INA I Input of Main Beam Signal (A)
P7 IND I Input of Main Beam Signal (D)
P8 INC I Input of Main Beam Signal (C)
P9 ING I Input of Main Beam Signal (G)
P10 INH I Input of Main Beam Signal (H)
P11 INF I Input of Main Beam Signal (F)
P12 INE I Input of Main Beam Signal (E)
P13 V14 O Output of Voltage Reference (1.4 V)
Auxiliary Input
P14 AUX1 I/O
Alternative function: Signal Monitoring
Multiplexer Output 1 for Signal Monitoring. The pin is not allowed to pull-up in circuit layout.
P15 MPXOUT1 O
Alternative function: Internal monitored signal output / General output.
P16 MPXOUT2 O
P17 MPXOUT3 O
P18 RFIP I Differential Input of AC Coupling RF SUM Signal (Positive)
P19 RFIN I Differential Input of AC Coupling RF SUM Signal (Negative)
P20 RFIP2 I Differential Input of AC Coupling RF SUM Signal (Positive)
P21 RFIN2 I Differential Input of AC Coupling RF SUM Signal (Negative)
P24 FOO O Focus servo output. PDM output of focus servo compensator.
P25 TRO O Tracking servo output. PDM output of tracking servo compensator.
P26 TLO O Tilt servo output
P27 DVCC12_K_1 - 1.2V Digital Power
High frequency modulation enable signal output, or LDD serial interface CLK or I2C SCL.
P28 FEOSCEN I/O
The pin is spike-free at power-on stage.
P29 FEGAINSW3 O Read gain switch 3.
Frequency selection signal output, or LDD serial interface data or I2C SDA.
P30 FECFREQ I/O
High frequency modulation mode selection signal output, or LDD serial interface command
P31 FECMOD I/O enable.
Feed motor 4 control. DAC output.
P34 FEFMO I/O
Alternative function: Auxiliary servo input
P35 FEFMO2 O Feed motor 2 control. DAC output.
P36 DVCC33_IO_1 - 3.3V Digital IO Power
P37 FEFMO3 I/O
P38 FEFMO4 I/O
P39 FETRAYPWM O Tray DAC / PWM control input. Controlled by uP.
P40 FEDMO O Disk motor control output. DAC output.
P41 FEFG I Motor Hall sensor input.
64
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5

LDD serial interface data. The pin is spike-free at power-on stage.
P43 FEGIO0 I/O The pin is not allowed to pull-up in circuit layout.
General IO
P44 FEGIO1 I/O PC RS232 serial receive data. The pin is spike-free at power-on stage.
P45 FEGIO5 O General IO
General IO. The pin is spike-free at power-on stage. The pin is not allowed to pull-up in
P47 FEGIO7 I/O
circuit layout.
Read gain switch 6. The pin is not allowed to pull-up in circuit layout.
P48 FEGIO6 O
General IO
Read gain switch 4
P49 FEGIO4 O
General IO
General IO. The pin is spike-free at power-on stage.
P50 FEGIO9 I/O
General IO
P51 FEGIO10 I/O PC RS232 serial receive data. The pin is spike-free at power-on stage.
P52 FEGIO11 I/O PC RS232 serial transmit data. The pin is spike-free at power-on stage.
P53 FETRAYIN_ I A logical Low indicates the Tray is IN
LED Control Output. Initial 0 Output. The pin is spike-free at power-on stage.
P54 FEGIO3 I/O
General IO
P55 USB_DM_P1 I/O USB port1 differential serial data bus (minus)
P56 USB_DP_P1 I/O USB port1 differential serial data bus (plus)
P57 USB_VRT_P1 - USB port1 reference resistor
P58 AVDD33_USB_P1 - 3.3V Analog power for USB port1
P59 EFPWRQ - 2.5 V power for E-fuse programming
P62 SCL I USB over current Protection indication
P63 SDA I USB PCONT
P64 SPDIF_IN1 I HDMI ARC SPDIF input
P65 NFD0 I/O NAND Flash Data input/output bit0
P74 NFRBN I/O NAND Flash ready / busy
P75 NFREN I/O NAND Flash read enable
P76 NFCEN I/O NAND Flash chip enable
P77 NFCLE I/O NAND Flash command latch enable
P78 NFALE I/O NAND Flash address latch enable
P79 NFWEN I/O NAND Flash write enable
P81 DDRVCCK_1 - 1.2V Digital Power
P82 RDQ4 I/O Memory data bit 4
P85 DDRVCCIO_1 - 1.5V Digital IO Power
65
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5

P91 RDQM1 O Memory data mask bit 1
P93 DDRVREF I Memory VREF
P94 RDQS0 I/O Memory positive data strobe bit 0
P95 RDQS0_ I/O Memory negative data strobe bit 0
P96 DDRVCCIO_2 - 1.5V Digital IO power
P97 RCLK0_ O Memory clock 0 negative
P98 RCLK0 O Memory clock 0 positive
P113 AVDD33_MEMPLL - 3.3 V Analog Power for MEMPLL
P114 TP_MEMPLL - Test Pin
P115 TN_MEMPLL - Test Pin
P116 RCKE O Memory clock enable
P117 RA10 O Memory address bit 10
P118 RBA1 O Memory bank address bit 1
P126 RRAS_ O Memory row address strobe
P127 RCAS_ O Memory column address strobe
P128 RCS_ O Memory chip select
P130 RWE_ O Memory write enable
P134 RRESET O Memory reset
P139 RBA2 O Memory bank address bit 2
P140 RBA0 O RBA0
P141 RODT O Memory on die termination enable
P142 RCSX_ O Memory chip select
66
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5

P155 DDRVREF I Memory VREF
P159 RCLK1_ O Memory clock 1 negative
P160 RCLK1 O Memory clock 1 positive
P161 DDRVCCIO_A - 1.5V Digital IO Power
P170 DDRVCCIO_B - 1.5V Digital IO power
P176 AVDD33_LDO - Line driver 3.3V analog power
P177 AVDD12_LDO - 1.2 V standby power
P178 OPWRSB I/O Power Control
P179 GPIO8 I/O ICE1_TDO
P180 GPIO7 I/O ICE1_TCK
P181 GPIO6 I/O ICE1_TMS
P182 GPIO5 I/O ICE1_TDI
P183 GPIO4 - Not used
P184 DVCC33_IO_STB_1 - 3.3V Digital IO Power for Stand-By Module
P185 GPIO3 I/O WOL_INT
P186 GPIO2 I/O START_BIT
P187 GPIO1 I/O XIF_CS
P188 GPIO0 I IF_SDI
P189 VCLK - IF_SCK
P190 VSTB I SYS_REQ
P191 VDATA O IF_SDO
P192 IR I SIRCS
P193 RESET_ I Power on reset
Reserved for debug-only Uart pins.
P194 UATXD I/O (1) 1st RS232 TX
(2) T8032 RS232 TX
67
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5

Reserved for debug-only Uart pins.
P195 UARXD I/O (1) 1st RS232 RX
(2) T8032 RS232 RX
P196 AMUTE I UPG_STATUS
P197 HTPLG I/O HDMI Hot Plug
P198 DVCC33_IO_STB_2 - 3.3V Digital IO Power for Stand-By Module
P199 HDMISD I/O HDMI I2C data
P200 HDMISCK I/O HDMI I2C clock
P201 CEC I/O HDMI CEC
P202 LED1 I JIG_MODE0
P203 LED0 I JIG_MODE1
P204 USB_DM_P2 I/O USB port2 differential serial data bus (minus)
P205 USB_DP_P2 I/O USB port2 differential serial data bus (plus)
P206 USB_VRT_P2 - USB port2 reference resistor
P207 AVDD33_USB_P2 - 3.3V Analog Power for USB port2
P208 AVSS33_BG - BG Analog Ground
P209 REXT O External reference resistor
P210 AVDD33_COM - PLL / BG 3.3 V Analog Power
P211 TXVN_1 I/O Ethernet RD -
P212 TXVP_1 I/O Ethernet RD +
P213 TXVN_0 I/O Ethernet TD -
P214 TXVP_0 I/O Ethernet TD +
P215 AVDD33_LD - 3.3 V power for standby
P217 AVDD33_HDMI - 3.3 V Analog Power
P218 CLK_M O HDMI TX clock differential pair (M)
P219 CLK_P O HDMI TX clock differential pair (P)
P220 CH0_M O HDMI TX data 0 differential pair (M)
P221 CH0_P O HDMI TX data 0 differential pair (P)
P226 AVDD12_HDMI_C - 1.2 V Analog Power
P227 AVDD12_HDMI_D - 1.2 V Analog Power
P228 AVSS12_HDMI - 1.2V Analog Ground
P229 NS_XTALI - 3.3V power for standby
P230 NS_XTALO I 27MHz Crystal In
P231 AVDD33_PLLGP - 3.3 V Analog Power for PLL Group
P232 AVDD33_VDAC_BG - 3.3V Analog Power
P233 AVDD33_VDAC_X - 3.3V Analog Power
P234 VDACX_OUT O DAC output
P235 VMID_PWMDAC - PWMDAC internal LDO reference
P236 AVDD33_DAC - 3.3 V Analog Power
P237 AL0 I I2S Master Clock line
P238 AVSS33_DAC - Analog Ground
P239 AR0 I I2S Bit Clock line
P240 DVCC33_IO_7 - 3.3V Digital IO power
P241 SPDIF_IN0 I Microphone signal input
P242 AOLRCK I/O Audio output left-right clock
P243 AOSDATA0 I/O Audio output serial data 0
68
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5

P247 SPDIF I/O SPDIF digital audio output
P250 RSTI I Front-End Power on reset
P251 VDAC0 O Output of General DAC
P252 VWDC2O O Output Voltage 2 of Laser Diode Control in APC
P253 VWDC3O O Output Voltage 3 of Laser Diode Control in APC
P254 FVREF O Output of Voltage Reference
P255 FPDOCD I Laser Power Monitor Input for CD APC / Differential negative input
P256 FPDODVD I Laser Power Monitor Input for DVD APC / Differential positive input
P257 EPAD - DGND
69
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
MB1002 BOARD (1/6) IC102, IC103 K4B2G1646Q-BCMA (SD-RAM)

A1 VDDQ - DQ Power Supply: 1.5V +/-0.075V
A2 DQU5 I/O Data Input/output: Bi-directional data bus.
A4 NO_USE - Not used
A8 VDDQ - DQ Power Supply: 1.5V +/-0.075V
A9 VSS - Ground
B1 VSSQ - DQ Ground
B2 VDD - Power Supply: 1.5V +/-0.075
B3 VSS - Ground
B4 NO_USE - Not used
Data Strobe: Output with read data, input with write data. Edge-aligned with read data, cen-
tered in write data. For the x16, DQSL: corresponds to the data on DQL0-DQL7; DQSU corre-
sponds to the data on DQU0-DQU7. The data strobe DQS, DQSL and DQSU are paired with
B7 DQSU I/O
differential signals DQS, DQSL and DQSU, respectively, to provide differential pair signaling
to the system during reads and writes. DDR3 SDRAM supports differential data strobe only
and does not support single-ended.
B8 DQU6 I/O Data Input/output: Bi-directional data bus.
B9 VSSQ - DQ Ground
C1 VDDQ - DQ Power Supply: 1.5V +/-0.075V
C2 DQU3 I/O Data Input/output: Bi-directional data bus.
C4 NO_USE - Not used
C7 DQSU I/O
C9 VDDQ - DQ Power Supply: 1.5V +/-0.075V
D1 VSSQ - DQ Ground
D2 VDDQ - DQ Power Supply: 1.5V +/-0.075V
Input Data Mask: DM is an input mask signal for write data. Input data is masked when DM
is sampled HIGH coincident with that input data during a Write access. DM is sampled on
D3 DMU I
both edges of DQS. For x8 device, the function of DM or TDQS/ TDQS is enabled by Mode
Register A11 setting in MR1.
D4 NO_USE - Not used
D7 DQU0 I/O Data Input/output: Bi-directional data bus.
D8 VSSQ - DQ Ground
D9 VDD - Power Supply: 1.5V +/-0.075
E1 VSS - Ground
E2 VSSQ - DQ Ground
E3 DQL0 I/O Data Input/output: Bi-directional data bus.
E4 NO_USE - Not used
70
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5

Input Data Mask: DM is an input mask signal for write data. Input data is masked when DM
is sampled HIGH coincident with that input data during a Write access. DM is sampled on
E7 DML I
both edges of DQS. For x8 device, the function of DM or TDQS/ TDQS is enabled by Mode
Register A11 setting in MR1.
E8 VSSQ - DQ Ground
E9 VDDQ - DQ Power Supply: 1.5V +/-0.075V
F1 VDDQ - DQ Power Supply: 1.5V +/-0.075V
F2 DQL2 I/O Data Input/output: Bi-directional data bus.
F3 DQSL I/O
F4 NO_USE - Not used
F9 VSSQ - DQ Ground
G1 VSSQ - DQ Ground
G2 DQL6 I/O Data Input/output: Bi-directional data bus.
G3 DQSL I/O
G4 NO_USE - Not used
G7 VDD - Power Supply: 1.5V +/-0.075
G8 VSS - Ground
G9 VSSQ - DQ Ground
H1 VREFDQ - Reference voltage for DQ
H2 VDDQ - DQ Power Supply: 1.5V +/-0.075V
H3 DQL4 I/O Data Input/output: Bi-directional data bus.
H4 NO_USE - Not used
H9 VDDQ - DQ Power Supply: 1.5V +/-0.075V
J1 NC - No Connect: No internal electrical connection is present.
J2 VSS - Ground
J3 RAS I Command Input: RAS (along with CS) define the command being entered.
J4 NO_USE - Not used
Clock: CK is differential clock input. All address and control input signals are sampled on the
J7 CK I
crossing of the positive edge of CK. Output (read) data is referenced to the crossing of CK.
J8 VSS - Ground
J9 NC - No Connect: No internal electrical connection is present.
On Die Termination: ODT (registered HIGH) enables termination resistance internal to the
DDR3 SDRAM. When enabled, ODT is only applied to each DQ, DQS, DQS and DM/TDQS,
K1 ODT I
NU/TDQS (When TDQS is enabled via Mode Register A11=1 in MR1) signal for x8 configura-
tions. The ODT pin will be ignored if the Mode Register (MR1) is programmed to disable ODT.
K2 VDD - Power Supply: 1.5V +/-0.075
71
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5

K3 CAS I Command Input: CAS (along with CS) define the command being entered.
K4 NO_USE - Not used
Clock: CK is differential clock input. All address and control input signals are sampled on the
K7 CK I
crossing of the negative edge of CK. Output (read) data is referenced to the crossing of CK.
K8 VDD - Power Supply: 1.5V +/-0.075
Clock Enable: CKE HIGH activates, and CKE LOW deactivates, internal clock signal and de-
vice input buffers and output drivers. Talking CKE LOW provides Precharge Power-Down and
Self Refresh operation (all banks idle), or Active Power-Down (Row Active in any bank). CKE
is asynchronous for self refresh exit. After VREFCA has become stable during the power on and
K9 CKE I
initialization sequence, it must be maintained during all operations (including Self-Refresh).
CKE must be maintained high throughout read and write accesses. Input buffers, excluding
CK, CK, ODT and CKE are disabled during power-down. Input buffers, excluding CKE, are
disabled during Self-Refresh.
L1 NC - No Connect: No internal electrical connection is present.
Chip Select: All commands are masked when CS is registered HIGH. CS provides for external
L2 CS I
Rank selection on system with multiple Ranks. CS is considered part of the command code.
L3 WE I Command Input: WE (along with CS) define the command being entered.
L4 NO_USE - Not used
Address inputs: Provided the row address for active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective bank.
The address inputs also provide the op-code during Mode Register Set commands.
Autoprecharge: A10 is sampled during Read/Write commands to determine whether Auto-
L7 A10 I precharge should be performed to the accessed bank after the Read/Write operation. (HIGH:
Autoprecharge; LOW: No Autoprecharge)
A10 is sampled during a Precharge command to determine the Percharge applies to one bank
(A10 LOW) or all banks (A10 HIGH). If only one bank is to be precharged, the bank is selected
by bank adresses.
L8 ZQ - Reference Pin for ZQ calibration
L9 NC - No Connect: No internal electrical connection is present.
M1 VSS - Ground
Bank Address Inputs: BA0 define to which bank an Active, Read, Write or Precharge com-
M2 BA0 I mand is being applied. Bank address also determines if the mode register or extended mode
register is to be accessed during a MRS cycle.
M3 BA2 I mand is being applied. Bank address also determines if the mode register or extended mode
M4 NO_USE - Not used
M7 NC - No Connect: No internal electrical connection is present.
M8 VREFCA - Reference voltage for CA
M9 VSS - Ground
N1 VDD - Power Supply: 1.5V +/-0.075
N2 A3 I Read/Write commands to select one location out of the memory array in the respective bank.
N3 A0 I Read/Write commands to select one location out of the memory array in the respective bank.
N4 NO_USE - Not used
Address inputs: Provided the row address for active commands and the column address
for Read/Write commands to select one location out of the memory array in the respective
N7 A12 I bank. The address inputs also provide the op-code during Mode Register Set commands.
Burst Chop: A12 is sampled during Read and Write commands to determine if burst chop (on-
the-fly) will be performed. (HIGH: no burst chop, LOW: burst chopped).
72
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5

N8 BA1 I mand is being applied. Bank address also determines if the mode register or extended mode
N9 VDD - Power Supply: 1.5V +/-0.075
P1 VSS - Ground
P2 A5 I Read/Write commands to select one location out of the memory array in the respective bank.
P4 NO_USE - Not used
P9 VSS - Ground
R1 VDD - Power Supply: 1.5V +/-0.075
R2 A7 I Read/Write commands to select one location out of the memory array in the respective bank.
R4 NO_USE - Not used
R9 VDD - Power Supply: 1.5V +/-0.075
T1 VSS - Ground
Active Low Asynchronous Reset: Reset is active when RESET is LOW, and inactive when
RESET is HIGH. RESET must be HIGH during normal operation. RESET is CMOS rail to rail
T2 RESET I
signal with DC high and low at 80% and 20% of VDD, example, 1.20V for DC high and 0.30V
for DC low.
T3 A13 I Read/Write commands to select one location out of the memory array in the respective bank.
T4 NO_USE - Not used
T7 NC - No Connect: No internal electrical connection is present.
T8 A8 I Read/Write commands to select one location out of the memory array in the respective bank.
T9 VSS - Ground
73
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
MB1002 BOARD (6/6) IC801 R5F3650KCDFB (SYSTEM CONTROLLER)

1 SIRCS_IN I SIRCS signal input from the remote control receiver
Fan motor speed control signal output terminal control by DA converter
2 FAN_CONT O
Port output higher, speed slower
3 FL_DOUT O Serial data output to the fluorescent indicator tube driver
4 NO_USE - No used
5 FL_CLK O Serial data transfer clock signal output to the fluorescent indicator tube driver
6 BYTE I External data bus width selection signal input terminal
7 CNVSS I Processor mode selection signal input terminal
8 NFC_SW O Stand-by control signal output to the NFC module
9 NFC_IRQ I Wireless data reception signal input from NFC module
System reset signal input from the reset signal generator and reset switch "L": reset
10 RESET I For several hundreds msec. After the power supply rises, "L" is input, then it change to
"H"
11 XOUT O System clock output terminal (8MHz)
12 VSS - Ground terminal
13 XIN I System clock input terminal (5MHz)
14 VCC1 - Power supply terminal (+3.3V)
15 CEC_TX_RX I/O CEC serial data input/output with the HDMI connector
16 NO_USE - No used
17 NO_USE - No used
18 AC_CUT I AC cut detection signal input terminal "L": AC cut
19 NO_USE - No used
20 NO_USE - No used
21 NO_USE - No used
22 NO_USE - No used
23 NO_USE - No used
24 WHITE_LED O Front panel LED drive signal output terminal “H”: on
Power supply on/off control signal output terminal for fluorescent indicator tube driver
25 PCONT_FL O
"H": power on
26 BT_LED O Bluetooth LED drive signal output terminal “H”: on
27 NO_USE - No used
28 NO_USE - No used
29 TXD1 O TXD1 (for debug) / flash write TXD1
30 RXD1 I RXD2 (for debug) / flash write RXD1
31 ON CHIP DEBUG / CLK1 I On chip debuger / flash write CLK1
32 NO_USE / RTS1 O No used
33 TAS5538_SDA I/O Two-way data bus with the DAMP processor
34 TAS5538_SCL I/O Serial data transfer clock signal output to the DAMP processor
35 DC_DET I Speaker DC detection signal input terminal "L": speaker DC is detected
36 PCONT1 O Power supply on/off control signal output terminal "H": power on
37 PCONT2 O Power supply on/off control signal output terminal “H”: power on
38 PCONT3 O Power supply on/off control signal output terminal "H": power on
39 EPM O EPM for update used
40 PCONT_STA516 O STA516 IC Power Control, "H": power on
41 NO_USE - No used
42 FAN_ON O Power supply on/off control signal output terminal for fan motor "H": power on
43 NO_USE - No used
44 CE I Chip enable signal input terminal
45 ST_SDA I/O Two-way data bus with the FM receiver
46 ST_SCL I/O Serial data transfer clock signal output to the FM receiver
47 BD_IF_START O Ready signal output to the BD decoder "H": ready
48 TAS5538_XPDN O Power down signal output to the power amplifier "L": power down
49 BD_IF_REQ I Request signal input from the BD decoder “H”: request
74
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5

50 STA516_XPDN O DAMP Driver Standby Control
51 TAS5538_XRST O Reset signal output to the DAMP processor "L": reset
52 TAS5538_XMUTE O Muting on/off control signal output to DAMP processor "L": muting on
53 NO_USE - No used
54 NO_USE - No used
55 NO_USE - No used
56 NO_USE - No used
57 MIC_CLK I/O Clock signal output terminal
58 MIC_DATA I/O Serial data output terminal
59 NO_USE - No used
60 VCC2 - Power supply terminal (+3.3V)
61 NJU72341_POWER O Power control for MIC IC
62 VSS - Ground terminal
63 PLUG_DET / MIC_IN I Microphone plug insert detection signal input terminal "H": Microphone plug insert.
64 NO_USE - No used
DRIVE_SD / POWER_
65 I Shut down signal input from the power amplifier "L": detect
DET
66 BD_TEMP I Temperature detection signal input terminal
67 STA516_TH_WARN I Thermal warning for temperature of the IC STA516 more than 130 °C
68 FL_CS O Chip select signal output to the fluorescent indicator tube driver
69 ASEL0 O Audio selection signal output terminal
70 ASEL1 O Audio selection signal output terminal
71 WOL_WLAN I WOL wake up detect port input from BD decoder “H”: detect
72 NFC_RFDET I RF signal input from the NFC module “H”: detect
73 ST_RDS_INT I RDS interrupt signal input from the FM receiver
74 NAND_RESET O Reset signal output to the NAND flash "L": reset
75 BD_SDI (IF_SDO) O Serial data output to the BD decoder
76 BD_SDO (IF_SDI) I Serial data input from the BD decoder
77 BD_SCLK I Serial data transfer clock signal input from the BD decoder
78 BD_CS O Chip select signal output to the BD decoder
79 NFC_DATA I/O Serial DATA input / output with the NFC module
80 NFC_SPICLK O Serial interface clock output to the NFC module
81 BD_RESET O Reset signal output to the BD decoder and EEPROM "L": reset
82 JIG MODE1 I/O Jig mode selection signal input from the BD decoder
83 OPWRSB I Power control signal input from the BD decoder
84 FE_EJECT O Eject key input detection signal output to the BD decoder
85 UPG_STATUS I UPG status signal input from the BD decoder
86 NO_USE - No used
87 KEY2_EJ I Key input terminal
88 KEY1_EJ I Key input terminal
89 KEY0 I Power key input terminal
90 NO_USE - No used
91 MODEL I Model setting terminal Fixed at "L" in this unit
92 DESTINATION I Destination setting
93 PCONT_WOL_STANDBY O Power Control for WOL / WOW function
94 AVSS - Ground terminal
95 NO_USE - No used
96 VREF I Reference voltage (+3.3V) input terminal
97 AVCC - Power supply terminal (+3.3V)
Data transfer direction and data transfer completion notification signal output to the NFC
98 NFC_SEL O
module
99 PVDD_VOL_SEL O No used
100 NO_USE - No used
75
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7 SECTION 7
EXPLODED VIEWS
Note:
• -XX and -X mean standardized parts, so E32 : 110 – 240 V AC area in E model The components identified by mark 9 con-
they may have some difference from the E51 : Chilean and Peruvian models tain confidential information.
original one. EA : Saudi Arabia model Strictly follow the instructions whenever the
• Items marked “*” are not stocked since MX6 : Latin-American model components are repaired and/or replaced.
they are seldom required for routine ser- PX : PX model
vice. Some delay should be anticipated RU : Russian model Les composants identifiés par la marque
when ordering these items. SAF : South African model 9 contiennent des informations confiden-
• The mechanical parts with no reference SP : Singapore model tielles.
number in the exploded views are not sup- TH : Thai model Suivre scrupuleusement les instructions
plied. TW : Taiwan model chaque fois qu’un composant est remplacé
• Color Indication of Appearance Parts Ex- et / ou réparé.
ample: The components identified by mark 0
KNOB, BALANCE (WHITE) . . . (RED) or dotted line with mark 0 are critical for
  safety.
Parts Color Cabinet’s Color Replace only with part number specified.
• Abbreviation
Les composants identifiés par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce por-
CH : Chinese model
tant le numéro spécifié.
7-1. CASE SECTION
3
1
not supplied
4
not supplied
front panel section
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
1 3-077-331-71 +BV3 (3-CR) 3 X-2585-804-1 PANEL LOADING ASSY
2 4-438-897-02 CASE (US) 4 4-295-431-01 SPRING, LOADING
2 4-438-897-12 CASE (EXCEPT US)
76
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
7-2. FRONT PANEL SECTION

(E2100) not supplied
54
B
BD drive section
(BPX-7)
(SP) 51
(E3100/E4100/E6100)
B 55
57
C
51
54 58
(SP, RU) 56 C
D
not supplied
E
not supplied
(POWER KEY board)
54
G
chassis bottom section
52 F
B
53
(SP, RU ) (EXCEPT SP, RU)
D
F D
H E F
H
E
54 H
54
ND01 not supplied 59 59
54
not supplied
G 60 (NON-KARAOKE board)
Note 1: When replacing the WLAN/BT COMBO card, refer to Note 2: Wires (flat type) for service is all straight.
“CHECKING METHOD OF NETWORK OPERATION” Please bend it referring go “HOW TO BEND FFC” on
(page 11). page 14 when you install it in the unit.
51 X-2585-795-2 FRONT PANEL ASSY (EJ1) (E2100: EXCEPT SP) 53 8-989-470-05 RC-S801/A5 (WW)
51 X-2585-796-2 FRONT PANEL ASSY (EJ1K) (E2100: SP) 54 3-077-331-71 +BV3 (3-CR)
51 X-2585-797-2 FRONT PANEL ASSY (EJ2) 55 1-968-687-12 HARNESS (USB)
(E3100: EXCEPT SP, RU) 56 1-458-601-11 CARD, WLAN/BT COMBO
51 X-2585-798-2 FRONT PANEL ASSY (EJ2K) (E3100: SP, RU) 57 1-846-376-61 WIRE (FLAT TYPE) (21 CORE) (SP, RU)
51 X-2585-799-2 FRONT PANEL ASSY (EJ4)
(E4100: EXCEPT SP, RU) 57 1-846-377-61 WIRE (FLAT TYPE) (15 CORE) (EXCEPT SP, RU)
58 1-969-958-11 HARNESS (USB)
51 X-2585-800-2 FRONT PANEL ASSY (EJ4K) (E4100: SP, RU) 59 A-1901-384-A PANEL BOARD, COMPLETE (EXCEPT SP, RU)
51 X-2585-801-2 FRONT PANEL ASSY (EJ8) 59 A-1901-496-A PANEL BOARD, COMPLETE (SP, RU)
(E6100: EXCEPT SP, RU) 60 A-1901-498-A KARAOKE BOARD, COMPLETE (SP, RU)
51 X-2585-802-2 FRONT PANEL ASSY (EJ8K) (E6100: SP, RU)
51 X-2589-165-1 FRONT PANEL ASSY (EJ2) MK2 (E3200) ND01 1-483-460-11 VACUUM FLUORESCENT DISPLAY
52 1-846-378-51 WIRE (FLAT TYPE) (8 CORE)
77
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
7-3. CHASSIS BOTTOM SECTION

101
104 101
not supplied
101
102
105
(PX, MX6, E32)
101 108 109

107 (E2100: SP for
#1 103 Hong Kong model)
106
101
chassis section
Note: Wires (flat type) for service is all straight.

Please bend it referring go “HOW TO BEND FFC” on page
14 when you install it in the unit.
101 3-077-331-71 +BV3 (3-CR) 9 102 A-1901-764-A MB1002 BOARD, COMPLETE (for SERVICE)
9 102 A-1901-414-A MB1002 BOARD, COMPLETE (for SERVICE) (E3100: SP)
(E2100: US) 9 102 A-1901-794-A MB1002 BOARD, COMPLETE (for SERVICE)
9 102 A-1901-461-A MB1002 BOARD, COMPLETE (for SERVICE) (E3100: TH)
(E2100: CND) 9 102 A-1901-800-A MB1002 BOARD, COMPLETE (for SERVICE)
9 102 A-1901-480-A MB1002 BOARD, COMPLETE (for SERVICE) (E3100: E32)
(E2100: AEP) 9 102 A-1902-052-A MB1002 BOARD, COMPLETE (for SERVICE)
9 102 A-1901-487-A MB1002 BOARD, COMPLETE (for SERVICE) (E4100: CND)
(E2100: UK) 9 102 A-1902-058-A MB1002 BOARD, COMPLETE (for SERVICE)
(E4100: AEP)
9 102 A-1901-506-A MB1002 BOARD, COMPLETE (for SERVICE)
(E2100: SAF) 9 102 A-1902-064-A MB1002 BOARD, COMPLETE (for SERVICE)
9 102 A-1901-513-A MB1002 BOARD, COMPLETE (for SERVICE) (E4100: UK)
(E2100: SP) 9 102 A-1902-110-A MB1002 BOARD, COMPLETE (for SERVICE)
9 102 A-1901-526-A MB1002 BOARD, COMPLETE (for SERVICE) (E4100: RU)
(E2100: AUS) 9 102 A-1902-120-A MB1002 BOARD, COMPLETE (for SERVICE)
(E2100: TW) 9 102 A-1902-140-A MB1002 BOARD, COMPLETE (for SERVICE)
(E2100: E51, MX6) 9 102 A-1902-170-A MB1002 BOARD, COMPLETE (for SERVICE)
(E4100: EA)
(E3100: US) 9 102 A-1902-180-A MB1002 BOARD, COMPLETE (for SERVICE)
9 102 A-1901-575-A MB1002 BOARD, COMPLETE (for SERVICE) (E4100: SP)
(E3100: CND) 9 102 A-1902-234-A MB1002 BOARD, COMPLETE (for SERVICE)
9 102 A-1901-651-A MB1002 BOARD, COMPLETE (for SERVICE) (E4100: CH)
(E3100: E3) 9 102 A-1902-240-A MB1002 BOARD, COMPLETE (for SERVICE)
9 102 A-1901-657-A MB1002 BOARD, COMPLETE (for SERVICE) (E4100: TH)
(E3100: SAF) 9 102 A-1902-248-A MB1002 BOARD, COMPLETE (for SERVICE)
9 102 A-1901-689-A MB1002 BOARD, COMPLETE (for SERVICE) (E4100: TW)
(E3100: EA) 9 102 A-1902-254-A MB1002 BOARD, COMPLETE (for SERVICE)
(E4100: E51, MX6)
– Continued on next page –
78
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
Ref. No. Part No. Description Remark

(E6100: CND)
(E6100: AEP)
(E6100: RU)
(E6100: E3)
(E6100: SAF)

(E6100: EA)
(E6100: SP)
(E6100: AUS)
(E6100: TH)
(E3100: UK)

(E6100: TW)
(E2100: PX)
(E2100: E3)
(E4100: AR)
(E6100: CH)

(E2100: AR)
(E3200)
(E3100: RU)
(E4100: E51)
(E2100: E51)
0 103 A-1901-382-A AMP BOARD, COMPLETE (EXCEPT US)

0 103 A-1924-824-A AMP BOARD, COMPLETE (US)
104 4-214-276-01 TAPE
0 106 4-966-267-12 BUSHING (FBS001), CORD
0 107 1-834-966-41 POWER-SUPPLY CORD

(AEP, E3, E51, SAF, SP, E32, RU, MX6, PX)
0 107 1-835-068-21 CORD, POWER (AUS)
0 107 1-837-308-11 CORD, POWER-SUPPLY (US, CND)
0 107 1-837-312-11 CORD, POWER-SUPPLY (AR)
0 107 1-837-345-11 CORD, POWER-SUPPLY (TW)
0 107 1-837-822-21 CORD, POWER-SUPPLY (CH)

0 107 1-839-012-11 CORD, POWER-SUPPLY (E12)
0 107 1-839-940-21 POWER-SUPPLY CORD (TH)
0 107 1-839-999-21 POWER-SUPPLY CORD (UK, EA)
0 108 1-785-504-21 ADAPTOR, CONVERSION (E51, PX, E32, MX6)
0 109 1-770-019-71 ADAPTOR, CONVERSION PLUG 3P

(E2100: SP for Hong Kong model)
#1 7-682-546-09 SCREW +B 3X5
79
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
7-4. CHASSIS SECTION
151
SWR1
not supplied
151
M1
not supplied
151
not supplied
152
152

151 3-077-331-71 +BV3 (3-CR)
152 4-295-590-01 FOOT
0 M1 1-855-244-11 DC FAN
0 SWR1 1-798-453-11 SWITCHING REGULATOR (3L392W-1)
(US, CND, AEP, UK, SAF, SP, TW, AUS, TH, CH)
0 SWR1 1-798-453-21 SWITCHING REGULATOR (3L392W)
(E3, E51, PX, EA, E12, E32, RU, MX6, AR)
80
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
7-5. BD DRIVE SECTION (BPX-7)
not supplied
not supplied
204
203
205
204
204
204
not supplied
201
202
207
206
not
supplied
not supplied
208
Note: Wires (flat type) for service is all straight.

Please bend it referring go “HOW TO BEND FFC” on page
14 when you install it in the unit.
201 4-295-426-01 COVER, DRIVE 206 1-846-349-61 WIRE (FLAT TYPE) (9 CORE)
202 A-1850-153-D LOADING FOR SERVICE (BPX-7) 207 1-846-347-11 FLEXIBLE FLAT CABLE (45 CORE)
203 2-345-115-01 SCREW (S), FLOAT 208 1-846-348-61 WIRE (FLAT TYPE) (5 CORE)
204 4-175-937-31 INSULATOR
0 205 8-820-452-07 DEVICE, OPTICAL KEM480AAA/C2RP2
81
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7 SECTION 8
AMP
ELECTRICAL PARTS LIST
Note:
• Due to standardization, replacements in • SEMICONDUCTORS The components identified by mark 0
the parts list may be different from the In each case, u: μ, for example: or dotted line with mark 0 are critical for
parts specified in the diagrams or the com- uA. . : μA. . , uPA. . , μPA. . , safety.
ponents used on the set. uPB. . : μPB. . , uPC. . , μPC. . , Replace only with part number specified.
• -XX and -X mean standardized parts, so uPD. . : μPD. .
they may have some difference from the • Abbreviation Les composants identifiés par une marque
original one. AR : Argentina model 0 sont critiques pour la sécurité.
• Items marked “*” are not stocked since AUS : Australian model Ne les remplacer que par une pièce por-
they are seldom required for routine ser- CH : Chinese model tant le numéro spécifié.
vice. Some delay should be anticipated CND : Canadian model
when ordering these items. E3 : 240 V AC area in E model
• RESISTORS E12 : 220 – 240 V AC area in E model
All resistors are in ohms. E32 : 110 – 240 V AC area in E model
METAL: Metal-film resistor. E51 : Chilean and Peruvian models The components identified by mark 9 con-
METAL OXIDE: Metal oxide-film resistor. EA : Saudi Arabia model tain confidential information.
F: nonflammable MX6 : Latin-American model Strictly follow the instructions whenever the
• CAPACITORS PX : PX model components are repaired and/or replaced.
uF: μF RU : Russian model
• COILS SAF : South African model Les composants identifiés par la marque
uH: μH SP : Singapore model 9 contiennent des informations confiden-
TH : Thai model tielles.
TW : Taiwan model Suivre scrupuleusement les instructions
chaque fois qu’un composant est remplacé
When indicating parts by reference num- et / ou réparé.
ber, please include the board name.
0 A-1901-382-A AMP BOARD, COMPLETE (EXCEPT US) C3133 1-116-717-11 CERAMIC CHIP 10uF 20% 10V
0 A-1924-824-A AMP BOARD, COMPLETE (US) C3134 1-118-698-11 CERAMIC CHIP 0.1uF 10% 100V
******************** C3135 1-118-698-11 CERAMIC CHIP 0.1uF 10% 100V
< CAPACITOR > C3136 1-118-668-11 CERAMIC CHIP 0.1uF 10% 50V
C3138 1-118-668-11 CERAMIC CHIP 0.1uF 10% 50V
C3013 1-116-717-11 CERAMIC CHIP 10uF 20% 10V C3139 1-118-668-11 CERAMIC CHIP 0.1uF 10% 50V
C3014 1-118-668-11 CERAMIC CHIP 0.1uF 10% 50V C3140 1-100-158-91 CERAMIC CHIP 1000PF 5% 100V
C3021 1-116-717-11 CERAMIC CHIP 10uF 20% 10V C3141 1-100-158-91 CERAMIC CHIP 1000PF 5% 100V
C3022 1-116-717-11 CERAMIC CHIP 10uF 20% 10V
C3023 1-116-717-11 CERAMIC CHIP 10uF 20% 10V C3151 1-118-470-31 ELECT 560uF 20% 35V
C3152 1-118-470-31 ELECT 560uF 20% 35V
C3025 1-118-668-11 CERAMIC CHIP 0.1uF 10% 50V C3153 1-118-470-31 ELECT 560uF 20% 35V
C3027 1-118-689-81 CERAMIC CHIP 0.0047uF 5% 10V C3156 1-118-698-11 CERAMIC CHIP 0.1uF 10% 100V
* C3228 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V
C3031 1-118-668-11 CERAMIC CHIP 0.1uF 10% 50V C3251 1-118-122-11 ELECT 270uF 20% 63V (US)
C3033 1-118-668-11 CERAMIC CHIP 0.1uF 10% 50V (EXCEPT US)
C3041 1-118-668-11 CERAMIC CHIP 0.1uF 10% 50V C3253 1-118-122-11 ELECT 270uF 20% 63V (US)
C3253 1-118-453-31 ELECT 270uF 20% 63V
C3050 1-165-979-21 ELECT CHIP 100uF 20% 6.3V (EXCEPT US)
C3117 1-100-158-91 CERAMIC CHIP 1000PF 5% 100V C3309 1-118-691-11 CERAMIC CHIP 2.2uF 10% 100V
C3127 1-116-731-11 CERAMIC CHIP 2.2uF 20% 6.3V C3323 1-114-920-21 CERAMIC CHIP 0.47uF 10% 250V
82
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
AMP
C3328 1-116-731-11 CERAMIC CHIP 2.2uF 20% 6.3V D3103 6-503-967-01 DI STPS1H100A
C3331 1-116-717-11 CERAMIC CHIP 10uF 20% 10V D3104 6-503-967-01 DI STPS1H100A
C3333 1-116-717-11 CERAMIC CHIP 10uF 20% 10V D3105 6-503-967-01 DI STPS1H100A
C3334 1-118-698-11 CERAMIC CHIP 0.1uF 10% 100V D3106 6-503-967-01 DI STPS1H100A
C3338 1-118-668-11 CERAMIC CHIP 0.1uF 10% 50V D3151 6-503-761-01 DI RB751S40, 115
C3340 1-100-158-91 CERAMIC CHIP 1000PF 5% 100V D3302 6-503-967-01 DI STPS1H100A

C3341 1-100-158-91 CERAMIC CHIP 1000PF 5% 100V D3303 6-503-967-01 DI STPS1H100A
C3351 1-118-470-31 ELECT 560uF 20% 35V D3304 6-503-967-01 DI STPS1H100A

C3371 1-100-154-91 CERAMIC CHIP 330PF 5% 100V D3503 6-503-761-01 DI RB751S40, 115
C3372 1-100-154-91 CERAMIC CHIP 330PF 5% 100V
< IC >
C3382 1-100-154-91 CERAMIC CHIP 330PF 5% 100V IC3001 6-718-103-01 IC TAS5538DGGR
C3401 1-164-232-91 CERAMIC CHIP 0.01uF 10% 100V IC3102 6-719-138-01 IC STA516BF13TR-A
C3402 1-100-158-91 CERAMIC CHIP 1000PF 5% 100V IC3302 6-719-138-01 IC STA516BF13TR-A
< COIL >
C3405 1-164-232-91 CERAMIC CHIP 0.01uF 10% 100V L3051 1-400-791-21 INDUCTOR 10uH
C3406 1-100-158-91 CERAMIC CHIP 1000PF 5% 100V L3101 1-482-176-11 INDUCTOR 20uH
C3407 1-164-232-91 CERAMIC CHIP 0.01uF 10% 100V L3103 1-482-176-11 INDUCTOR 20uH
C3408 1-100-158-91 CERAMIC CHIP 1000PF 5% 100V L3301 1-482-176-11 INDUCTOR 20uH
L3303 1-482-176-11 INDUCTOR 20uH
C3452 1-164-232-91 CERAMIC CHIP 0.01uF 10% 100V < TRANSISTOR >
C3454 1-100-158-91 CERAMIC CHIP 1000PF 5% 100V Q3101 8-729-013-22 TR HN1A01FU
C3455 1-164-232-91 CERAMIC CHIP 0.01uF 10% 100V Q3202 8-729-013-22 TR HN1A01FU
Q3302 8-729-013-22 TR HN1A01FU
C3456 1-164-232-91 CERAMIC CHIP 0.01uF 10% 100V Q3552 8-729-427-72 TRANSISTOR XP4501
C3457 1-100-158-91 CERAMIC CHIP 1000PF 5% 100V Q3553 6-552-892-01 TR LSCR523UBFS8TL
C3459 1-164-232-91 CERAMIC CHIP 0.01uF 10% 100V Q3555 8-729-013-22 TR HN1A01FU
< RESISTOR >
C3462 1-100-158-91 CERAMIC CHIP 1000PF 5% 100V R3021 1-218-968-11 METAL CHIP 18K 5% 1/16W
C3463 1-164-232-91 CERAMIC CHIP 0.01uF 10% 100V R3022 1-218-967-11 METAL CHIP 15K 5% 1/16W
C3464 1-164-232-91 CERAMIC CHIP 0.01uF 10% 100V R3023 1-218-949-11 METAL CHIP 470 5% 1/16W
C3465 1-100-158-91 CERAMIC CHIP 1000PF 5% 100V R3024 1-218-949-11 METAL CHIP 470 5% 1/16W
R3032 1-216-295-91 SHORT CHIP 0
C3552 1-126-208-21 ELECT CHIP 47uF 20% 4V R3033 1-218-965-11 METAL CHIP 10K 5% 1/16W
R3060 1-218-965-11 METAL CHIP 10K 5% 1/16W
C3570 1-100-908-11 CERAMIC CHIP 1uF 10% 6.3V
R3109 1-218-977-11 METAL CHIP 100K 5% 1/16W
< CONNECTOR >
R3153 1-220-281-11 METAL CHIP 4.7K 5% 1/4W
CN3505 1-815-763-32 CONNECTOR, FFC/FPC 24P R3154 1-220-281-11 METAL CHIP 4.7K 5% 1/4W
R3155 1-220-281-11 METAL CHIP 4.7K 5% 1/4W
< DIODE > R3156 1-220-281-11 METAL CHIP 4.7K 5% 1/4W
R3161 1-218-965-11 METAL CHIP 10K 5% 1/16W
D3101 6-503-967-01 DI STPS1H100A
D3102 6-503-967-01 DI STPS1H100A R3162 1-218-965-11 METAL CHIP 10K 5% 1/16W
Note: When the IC3102 and IC3302 on the AMP board are replaced, spread the
compound referring to “NOTE OF REPLACING THE IC3102 and IC3302 ON THE
AMP BOARD AND THE COMPLETE AMP BOARD” on servicing notes (page 10).
83
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.5
AMP KARAOKE MB1002
R3212 1-218-977-11 METAL CHIP 100K 5% 1/16W C82 1-118-290-11 CERAMIC CHIP 0.001uF 10% 50V
R3271 1-218-282-11 METAL CHIP 22 5% 1/2W * C84 1-118-360-11 CERAMIC CHIP 0.1uF 10% 25V
R3272 1-218-282-11 METAL CHIP 22 5% 1/2W C85 1-116-734-11 CERAMIC CHIP 1uF 20% 16V
R3281 1-218-282-11 METAL CHIP 22 5% 1/2W C86 1-118-040-11 CERAMIC CHIP 2.2uF 10% 16V
R3282 1-218-282-11 METAL CHIP 22 5% 1/2W
R3312 1-218-977-11 METAL CHIP 100K 5% 1/16W * C88 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V
R3353 1-220-281-11 METAL CHIP 4.7K 5% 1/4W * C89 1-118-360-11 CERAMIC CHIP 0.1uF 10% 25V
R3354 1-220-281-11 METAL CHIP 4.7K 5% 1/4W C93 1-118-040-11 CERAMIC CHIP 2.2uF 10% 16V
R3355 1-220-281-11 METAL CHIP 4.7K 5% 1/4W C94 1-164-388-91 CERAMIC CHIP 270PF 5% 50V
R3356 1-220-281-11 METAL CHIP 4.7K 5% 1/4W
R3361 1-218-965-11 METAL CHIP 10K 5% 1/16W < DIODE >
R3371 1-218-282-11 METAL CHIP 22 5% 1/2W
R3372 1-218-282-11 METAL CHIP 22 5% 1/2W D71 6-500-400-01 DIODE BAV99-215
R3381 1-218-282-11 METAL CHIP 22 5% 1/2W
< IC >
R3382 1-218-282-11 METAL CHIP 22 5% 1/2W
R3555 1-218-973-11 METAL CHIP 47K 5% 1/16W IC71 6-713-989-01 IC NJM2783V (TE2)
R3556 1-218-969-11 METAL CHIP 22K 5% 1/16W IC72 6-718-174-01 IC NJU72341V (TE2)
R3557 1-208-927-11 METAL CHIP 47K 0.5% 1/16W
R3558 1-208-911-11 METAL CHIP 10K 0.5% 1/16W < JACK >
R3559 1-208-683-11 METAL CHIP 1K 0.5% 1/16W J71 1-794-702-11 JACK, HEADPHONE (MIC 1)
R3560 1-218-977-11 METAL CHIP 100K 5% 1/16W J72 1-794-702-11 JACK, HEADPHONE (MIC 2)
R3902 1-216-839-11 METAL CHIP 33K 5% 1/10W
R3903 1-216-839-11 METAL CHIP 33K 5% 1/10W < JUMPER WIRE >
R3904 1-216-839-11 METAL CHIP 33K 5% 1/10W
JW52 1-216-295-91 SHORT CHIP 0
R3905 1-216-839-11 METAL CHIP 33K 5% 1/10W JW53 1-216-296-11 SHORT CHIP 0
R3906 1-216-839-11 METAL CHIP 33K 5% 1/10W
R3907 1-216-839-11 METAL CHIP 33K 5% 1/10W < RESISTOR >
R3908 1-216-839-11 METAL CHIP 33K 5% 1/10W
R3909 1-216-839-11 METAL CHIP 33K 5% 1/10W R71 1-216-845-11 METAL CHIP 100K 5% 1/10W
R72 1-216-821-11 METAL CHIP 1K 5% 1/10W
< COMPOSITION CIRCUIT BLOCK > R73 1-216-845-11 METAL CHIP 100K 5% 1/10W
R74 1-216-821-11 METAL CHIP 1K 5% 1/10W
RB3001 1-234-372-11 RES, NETWORK 100 (1005X4) R75 1-216-821-11 METAL CHIP 1K 5% 1/10W
RB3002 1-234-372-11 RES, NETWORK 100 (1005X4)
RB3302 1-234-371-11 RES, NETWORK 47 (1005X4) R78 1-216-857-11 METAL CHIP 1M 5% 1/10W
R79 1-216-838-11 METAL CHIP 27K 5% 1/10W
RB3303 1-234-381-11 RES, NETWORK 100K (1005X4) R80 1-216-835-11 METAL CHIP 15K 5% 1/10W
RB3304 1-234-381-11 RES, NETWORK 100K (1005X4)
RB3305 1-234-381-11 RES, NETWORK 100K (1005X4) R81 1-216-832-11 METAL CHIP 8.2K 5% 1/10W
R82 1-216-864-11 SHORT CHIP 0
< TERMINAL > R84 1-216-809-11 METAL CHIP 100 5% 1/10W
R85 1-216-809-11 METAL CHIP 100 5% 1/10W
TB3401 1-780-452-11
TERMINAL BOARD (SPEAKER) 2P R86 1-216-296-11 SHORT CHIP 0
(SPEAKERS SUR R/SUR L)
TB3451 1-780-951-11 TERMINAL BOARD (SPEAKER) 4P R87 1-216-809-11 METAL CHIP 100 5% 1/10W
(SPEAKERS FRONT R/FRONT L/SUBWOOFER/ R88 1-216-817-11 METAL CHIP 470 5% 1/10W
CENTER) ************************************************************
************************************************************
9 A-1901-414-A MB1002 BOARD, COMPLETE (for SERVICE)
A-1901-498-A KARAOKE BOARD, COMPLETE (SP, RU) (E2100: US)
************************ 9 A-1901-461-A MB1002 BOARD, COMPLETE (for SERVICE)
(E2100: CND)
< CAPACITOR > 9 A-1901-480-A MB1002 BOARD, COMPLETE (for SERVICE)
(E2100: AEP)
C71 1-118-290-11 CERAMIC CHIP 0.001uF 10% 50V 9 A-1901-487-A MB1002 BOARD, COMPLETE (for SERVICE)
C73 1-118-290-11 CERAMIC CHIP 0.001uF 10% 50V (E2100: UK)
C74 1-116-743-11 CERAMIC CHIP 0.22uF 10% 16V 9 A-1901-506-A MB1002 BOARD, COMPLETE (for SERVICE)
C75 1-118-290-11 CERAMIC CHIP 0.001uF 10% 50V (E2100: SAF)
C77 1-116-734-11 CERAMIC CHIP 1uF 20% 16V (E2100: SP)
C78 1-116-724-11 CERAMIC CHIP 4.7uF 20% 6.3V 9 A-1901-526-A MB1002 BOARD, COMPLETE (for SERVICE)
* C79 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V (E2100: AUS)
* C80 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V 9 A-1901-532-A MB1002 BOARD, COMPLETE (for SERVICE)
* C81 1-118-360-11 CERAMIC CHIP 0.1uF 10% 25V (E2100: TW)
84
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
MB1002
9 A-1901-538-A MB1002 BOARD, COMPLETE (for SERVICE) 9 A-1921-463-A MB1002 BOARD, COMPLETE (for SERVICE)
(E2100: E51, MX6) (E2100: PX)
(E3100: US) (E2100: E3)
9 A-1901-575-A MB1002 BOARD, COMPLETE (for SERVICE) (E4100: AR)
(E3100: CND) 9 A-1972-053-A MB1002 BOARD, COMPLETE (for SERVICE)
9 A-1901-651-A MB1002 BOARD, COMPLETE (for SERVICE) (E6100: CH)
(E3100: E3) 9 A-1994-882-A MB1002 BOARD, COMPLETE (for SERVICE)
9 A-1901-657-A MB1002 BOARD, COMPLETE (for SERVICE) (E2100: AR)
(E3100: SAF)
(E3100: EA) (E3200)
(E3100: SP) (E3100: RU)
9 A-1901-794-A MB1002 BOARD, COMPLETE (for SERVICE) (E4100: E51)
(E3100: TH) 9 A-2060-250-A MB1002 BOARD, COMPLETE (for SERVICE)
9 A-1901-800-A MB1002 BOARD, COMPLETE (for SERVICE) (E2100: E51)
(E3100: E32) ****************************
(E4100: CND) < CAPACITOR >
(E4100: AEP) C108 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
9 A-1902-064-A MB1002 BOARD, COMPLETE (for SERVICE) C109 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
(E4100: UK) C115 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
(E4100: RU)
(E4100: E12) C122 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
(E4100: EA)
(E4100: SP) C136 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
9 A-1902-234-A MB1002 BOARD, COMPLETE (for SERVICE) C141 1-100-909-11 CERAMIC CHIP 10uF 10% 6.3V
(E4100: CH) C142 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
(E4100: TH) * C148 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V
9 A-1902-248-A MB1002 BOARD, COMPLETE (for SERVICE) * C149 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V
(E4100: TW) * C152 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V
(E4100: E51, MX6) C159 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
(E6100: CND) C163 1-100-909-11 CERAMIC CHIP 10uF 10% 6.3V
(E6100: AEP) C169 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
9 A-1902-276-A MB1002 BOARD, COMPLETE (for SERVICE) C170 1-100-909-11 CERAMIC CHIP 10uF 10% 6.3V
(E6100: RU)
(E6100: SAF) C175 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
(E6100: EA)
(E6100: SP) C179 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
(E6100: AUS) C182 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
(E6100: TH) C183 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
(E3100: UK) C185 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
(E6100: TW) C187 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
85
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
MB1002
C190 1-164-874-11 CERAMIC CHIP 100PF 5% 50V C327 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C191 1-164-874-11 CERAMIC CHIP 100PF 5% 50V C328 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C193 1-164-874-11 CERAMIC CHIP 100PF 5% 50V C331 1-164-850-11 CERAMIC CHIP 10PF 0.5PF 50V
* C201 1-116-714-11 CERAMIC CHIP 22uF 20% 6.3V C332 1-164-852-11 CERAMIC CHIP 12PF 5% 50V
C204 1-116-734-11 CERAMIC CHIP 1uF 20% 16V * C350 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V
* C206 1-116-714-11 CERAMIC CHIP 22uF 20% 6.3V C352 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V
C212 1-112-777-11 CERAMIC CHIP 0.01uF 10% 25V * C357 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V
C214 1-112-777-11 CERAMIC CHIP 0.01uF 10% 25V C358 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C216 1-116-716-11 CERAMIC CHIP 10uF 10% 16V C359 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C247 1-118-399-11 CERAMIC CHIP 0.0022uF 10% 50V C426 1-164-847-11 CERAMIC CHIP 7PF 0.5PF 50V
C252 1-116-713-11 CERAMIC CHIP 22uF 20% 10V C430 1-164-850-11 CERAMIC CHIP 10PF 0.5PF 50V
86
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
MB1002
C690 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V C6205 1-137-765-21 ELECT CHIP 47uF 20% 16V
C6212 1-137-765-21 ELECT CHIP 47uF 20% 16V
C711 1-164-874-11 CERAMIC CHIP 100PF 5% 50V < CONNECTOR/JACK >
(SP, RU)
C712 1-100-415-91 CERAMIC CHIP 0.47uF 10% 6.3V * CN201 1-695-320-21 PIN, CONNECTOR (1.5MM) (SMD) 2P
(SP, RU) CN202 1-779-992-11 PIN, CONNECTOR (PWB) 8P
C713 1-164-866-11 CERAMIC CHIP 47PF 5% 50V CN301 1-573-806-21 PIN, CONNECTOR (1.5MM) (SMD) 6P
C714 1-164-866-11 CERAMIC CHIP 47PF 5% 50V CN380 1-843-693-21 ETHERNET CONNECTOR (LAN (100))
CN401 1-821-398-41 HDMI CONNECTOR (HDMI OUT ARC)
* C716 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V CN402 1-573-768-21 PIN, CONNECTOR (1.5MM) (SMD) 5P
* C717 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V * CN404 1-819-333-11 HEADER ASSEMBLY FOR PWB 5P
C718 1-116-734-11 CERAMIC CHIP 1uF 20% 16V CN501 1-843-036-11 FFC/FPC CONNECTOR 45P
C719 1-112-777-11 CERAMIC CHIP 0.01uF 10% 25V CN660 1-820-112-51 CONNECTOR, FFC/FPC 9P
(SP, RU) CN670 1-794-362-51 CONNECTOR, FFC/FPC 5P
C721 1-116-734-11 CERAMIC CHIP 1uF 20% 16V CN706 1-770-160-21 PIN, CONNECTOR (PC BOARD) 2P
C722 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V (ANTENNA FM)
* C723 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V CN707 1-815-763-32 CONNECTOR, FFC/FPC 24P
* C726 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V CN803 1-820-119-51 CONNECTOR, FFC/FPC 21P (SP, RU)
C727 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V * CN804 1-695-320-21 PIN, CONNECTOR (1.5MM) (SMD) 2P
CN805 1-820-115-51 CONNECTOR, FFC/FPC 15P (EXCEPT SP, RU)
* C729 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V CN806 1-820-384-31 CONNECTOR, FFC/FPC (LIF) 8P
C731 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V < DIODE >
D202 6-502-961-01 DI DA2J10100L
* C738 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V D220 6-503-752-01 DI BZT52H-C6V2
* C739 1-116-738-11 CERAMIC CHIP 1uF 10% 6.3V D702 6-500-400-01 DIODE BAV99-215
C740 1-118-399-11 CERAMIC CHIP 0.0022uF 10% 50V D803 6-502-961-01 DI DA2J10100L
< FUSE >
C744 1-164-850-11 CERAMIC CHIP 10PF 0.5PF 50V 0 F201 1-523-135-31 FUSE (3.15A/32V)
C747 1-119-923-11 CERAMIC CHIP 0.047uF 10% 10V 0 F802 1-523-132-31 FUSE (1A/50V)
* C751 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V < RESISTOR/FERRITE BEAD >
C759 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V FB600 1-244-161-81 METAL CHIP 2.2 5% 1/16W
C760 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V FB701 1-400-462-21 FERRITE, EMI (SMD) (1005)
< IC >
C803 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V IC101 (Not supplied) IC CXD90019R-BA
C804 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V @ IC102 (Not supplied) IC K4B2G1646Q-BCMA
C805 1-118-386-11 CERAMIC CHIP 0.1uF 10% 16V @ IC103 (Not supplied) IC K4B2G1646Q-BCMA
Note: IC101, IC102 and IC103 on the MB1002 board cannot
@ Replacement of IC102 and IC103 on the MB1002 board used exchange with single. When these parts on the MB1002
in this unit requires a special tool. board are damaged, exchange the entire mounted board.
87
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
MB1002
IC201 6-716-462-01 IC BD00GA3WEFJ-E2 < RESISTOR >
IC203 (Not supplied) IC TPS54295PWPR
0 R101 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
IC204 (Not supplied) IC TPS54295PWPR R103 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
IC205 6-719-190-01 IC RT7256ALZSP R105 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
IC403 6-709-888-01 IC TC7WHU04FK R106 1-218-941-11 METAL CHIP 100 5% 1/16W
IC406 6-720-030-01 IC TPS2065CDBVR R107 1-218-941-11 METAL CHIP 100 5% 1/16W
IC408 6-718-999-01 IC MM1839A50NRE
R108 1-208-668-11 METAL CHIP 240 0.5% 1/16W
IC520 6-718-188-01 IC BD80GA3WEFJ-E2 R109 1-208-668-11 METAL CHIP 240 0.5% 1/16W
IC601 (Not supplied) IC TPIC2060ADFDRG4 R110 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
IC701 1-843-541-11 OPTICAL RECEIVER JACK R111 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
(TV DIGITAL IN OPTICAL) R112 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
IC703 8-759-596-39 IC SN74LV4052APWR
IC704 6-710-554-01 IC PCM1808PWR R113 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
R114 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
IC706 (Not supplied) IC RN5B701-0001 (EXCEPT AEP, UK) R115 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
IC706 (Not supplied) IC RN5B701-0002 (AEP, UK) R116 1-208-683-11 METAL CHIP 1K 0.5% 1/16W
IC710 6-719-070-01 IC MM3411A50URE R117 1-218-933-11 METAL CHIP 22 5% 1/16W
IC801 (Not supplied) IC R5F3650KCDFB
IC803 6-713-333-01 IC PST8429UL R118 1-218-933-11 METAL CHIP 22 5% 1/16W
R203 1-218-953-11 METAL CHIP 1K 5% 1/16W
IC804 6-719-061-01 IC MM1839A33NRE R204 1-208-695-11 METAL CHIP 3.3K 0.5% 1/16W
IC805 6-719-061-01 IC MM1839A33NRE * R209 1-250-499-11 METAL CHIP 1.5K 1% 1/16W
IC1001 (Not supplied) IC H27U2G8F2CTR-BCR R210 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
< JACK > R211 1-218-971-81 METAL CHIP 33K 5% 1/16W

R212 1-218-971-81 METAL CHIP 33K 5% 1/16W
J702 1-854-005-11 JACK, PIN (2P) (AUDIO IN L/R) R215 1-218-971-81 METAL CHIP 33K 5% 1/16W
R216 1-218-971-81 METAL CHIP 33K 5% 1/16W
< COIL > R217 1-216-825-11 METAL CHIP 2.2K 5% 1/10W
L201 1-460-358-11 INDUCTOR 2.2uH R218 1-216-825-11 METAL CHIP 2.2K 5% 1/10W
L202 1-460-358-11 INDUCTOR 2.2uH R219 1-208-715-11 METAL CHIP 22K 0.5% 1/16W
L203 1-400-789-21 INDUCTOR 2.2uH R226 1-218-953-11 METAL CHIP 1K 5% 1/16W
L204 1-400-789-21 INDUCTOR 2.2uH R228 1-208-713-11 METAL CHIP 18K 0.5% 1/16W
L205 1-400-792-21 INDUCTOR 22uH R229 1-208-715-11 METAL CHIP 22K 0.5% 1/16W
L206 1-400-789-21 INDUCTOR 2.2uH R230 1-208-909-11 METAL CHIP 8.2K 0.5% 1/16W
L207 1-457-874-11 INDUCTOR 10uH R231 1-208-699-11 METAL CHIP 4.7K 0.5% 1/16W
L702 1-414-467-31 INDUCTOR 22nH R243 1-208-715-11 METAL CHIP 22K 0.5% 1/16W
L704 1-414-851-21 INDUCTOR 47nH R245 1-218-974-11 METAL CHIP 56K 5% 1/16W
R247 1-218-953-11 METAL CHIP 1K 5% 1/16W
< TRANSISTOR > R248 1-218-953-11 METAL CHIP 1K 5% 1/16W
Q201 6-552-936-01 TR LTC014EUBFS8TL R249 1-208-905-11 METAL CHIP 5.6K 0.5% 1/16W
Q202 6-552-936-01 TR LTC014EUBFS8TL R252 1-208-675-11 METAL CHIP 470 0.5% 1/16W
Q203 6-552-936-01 TR LTC014EUBFS8TL R256 1-218-853-11 METAL CHIP 1.8K 0.5% 1/10W
Q204 6-553-007-01 TR PMG85XP R258 1-208-909-11 METAL CHIP 8.2K 0.5% 1/16W
Q205 6-553-007-01 TR PMG85XP R259 1-208-927-11 METAL CHIP 47K 0.5% 1/16W
Q206 6-553-007-01 TR PMG85XP R260 1-208-911-11 METAL CHIP 10K 0.5% 1/16W
Q207 6-552-936-01 TR LTC014EUBFS8TL R263 1-216-791-11 METAL CHIP 3.3 5% 1/10W
Q208 6-552-892-01 TR LSCR523UBFS8TL R264 1-218-966-11 METAL CHIP 12K 5% 1/16W
Q401 6-551-346-01 TRANSISTOR LSK3541FS8T2L R268 1-208-905-11 METAL CHIP 5.6K 0.5% 1/16W
Q404 6-552-936-01 TR LTC014EUBFS8TL R269 1-208-931-11 METAL CHIP 68K 0.5% 1/16W
Q405 6-553-007-01 TR PMG85XP R274 1-218-953-11 METAL CHIP 1K 5% 1/16W

Q701 6-552-936-01 TR LTC014EUBFS8TL (SP, RU) R275 1-218-953-11 METAL CHIP 1K 5% 1/16W
Q702 6-552-217-01 TR RTM001P02T2L (SP, RU) R276 1-218-941-11 METAL CHIP 100 5% 1/16W
Q703 6-550-978-01 TR RN1902 R304 1-218-965-11 METAL CHIP 10K 5% 1/16W
Q801 6-552-892-01 TR LSCR523UBFS8TL R305 1-218-965-11 METAL CHIP 10K 5% 1/16W
Q803 6-553-296-01 TR RSM002P03T2L R306 1-218-965-11 METAL CHIP 10K 5% 1/16W

Q804 6-552-936-01 TR LTC014EUBFS8TL R307 1-218-941-81 METAL CHIP 100 5% 1/16W
R308 1-218-941-81 METAL CHIP 100 5% 1/16W
Note: IC203, IC204, IC601, IC706, IC801 and IC1001 on the R316 1-218-977-11 METAL CHIP 100K 5% 1/16W
MB1002 board cannot exchange with single. When these
parts on the MB1002 board are damaged, exchange the
entire mounted board.
88
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
MB1002
R727 1-218-973-11 METAL CHIP 47K 5% 1/16W
R319 1-218-941-81 METAL CHIP 100 5% 1/16W R733 1-218-971-81 METAL CHIP 33K 5% 1/16W
R331 1-218-977-11 METAL CHIP 100K 5% 1/16W (SP, RU)
R332 1-218-956-11 METAL CHIP 1.8K 5% 1/16W
R365 1-218-864-11 METAL CHIP 5.1K 0.5% 1/10W (SP, RU)
R738 1-218-973-11 METAL CHIP 47K 5% 1/16W
R385 1-208-920-81 METAL CHIP 24K 0.5% 1/16W R739 1-218-973-11 METAL CHIP 47K 5% 1/16W
R395 1-218-864-11 METAL CHIP 5.1K 0.5% 1/10W
R744 1-218-973-11 METAL CHIP 47K 5% 1/16W
R406 1-218-965-11 METAL CHIP 10K 5% 1/16W R749 1-218-941-81 METAL CHIP 100 5% 1/16W
R410 1-218-956-11 METAL CHIP 1.8K 5% 1/16W R750 1-218-933-11 METAL CHIP 22 5% 1/16W
R411 1-218-956-11 METAL CHIP 1.8K 5% 1/16W R751 1-218-990-81 SHORT CHIP 0
R412 1-218-981-81 METAL CHIP 220K 5% 1/16W
R415 1-218-973-11 METAL CHIP 47K 5% 1/16W R752 1-218-990-81 SHORT CHIP 0
R753 1-218-933-11 METAL CHIP 22 5% 1/16W
R416 1-208-859-81 METAL CHIP 68 0.5% 1/16W R754 1-218-933-11 METAL CHIP 22 5% 1/16W
R422 1-218-933-11 METAL CHIP 22 5% 1/16W R761 1-218-941-81 METAL CHIP 100 5% 1/16W
R423 1-218-933-11 METAL CHIP 22 5% 1/16W
R767 1-218-933-11 METAL CHIP 22 5% 1/16W
R425 1-208-859-81 METAL CHIP 68 0.5% 1/16W R768 1-218-941-81 METAL CHIP 100 5% 1/16W
R437 1-218-965-11 METAL CHIP 10K 5% 1/16W
R772 1-218-941-81 METAL CHIP 100 5% 1/16W
R456 1-218-941-81 METAL CHIP 100 5% 1/16W
R780 1-218-941-81 METAL CHIP 100 5% 1/16W
R531 1-250-531-11 METAL CHIP 33K 1% 1/16W
R787 1-218-933-11 METAL CHIP 22 5% 1/16W
R575 1-208-911-11 METAL CHIP 10K 0.5% 1/16W R789 1-218-941-81 METAL CHIP 100 5% 1/16W
R581 1-208-699-11 METAL CHIP 4.7K 0.5% 1/16W R803 1-218-965-11 METAL CHIP 10K 5% 1/16W
R582 1-218-864-11 METAL CHIP 5.1K 0.5% 1/10W
R807 1-218-965-11 METAL CHIP 10K 5% 1/16W
R643 1-216-825-11 METAL CHIP 2.2K 5% 1/10W R808 1-218-965-11 METAL CHIP 10K 5% 1/16W
R646 1-216-825-11 METAL CHIP 2.2K 5% 1/10W
R813 1-218-941-81 METAL CHIP 100 5% 1/16W
R709 1-218-941-81 METAL CHIP 100 5% 1/16W
(SP, RU) R818 1-218-941-81 METAL CHIP 100 5% 1/16W
R819 1-218-965-11 METAL CHIP 10K 5% 1/16W
(SP, RU) R821 1-218-941-81 METAL CHIP 100 5% 1/16W
R716 1-218-968-11 METAL CHIP 18K 5% 1/16W
R825 1-218-941-81 METAL CHIP 100 5% 1/16W
R725 1-218-973-11 METAL CHIP 47K 5% 1/16W
89
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
MB1002 PANEL
R830 1-218-941-81 METAL CHIP 100 5% 1/16W R7014 1-218-990-81 SHORT CHIP 0
R831 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
R835 1-218-977-11 METAL CHIP 100K 5% 1/16W < COMPOSITION CIRCUIT BLOCK >
R837 1-218-989-11 METAL CHIP 1M 5% 1/16W
RB101 1-234-371-11 RES, NETWORK 47 (1005X4)
R838 1-218-965-11 METAL CHIP 10K 5% 1/16W RB102 1-234-371-11 RES, NETWORK 47 (1005X4)
R840 1-218-961-11 METAL CHIP 4.7K 5% 1/16W RB103 1-234-371-11 RES, NETWORK 47 (1005X4)
R848 1-218-941-81 METAL CHIP 100 5% 1/16W
RB106 1-234-372-11 RES, NETWORK 100 (1005X4)
R856 1-218-977-11 METAL CHIP 100K 5% 1/16W
RB111 1-234-371-11 RES, NETWORK 47 (1005X4)
R859 1-218-961-11 METAL CHIP 4.7K 5% 1/16W RB301 1-234-378-21 RES, NETWORK 10K (1005X4)
R860 1-218-965-11 METAL CHIP 10K 5% 1/16W RB302 1-234-378-21 RES, NETWORK 10K (1005X4)
R862 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
< THERMISTOR >
R863 1-218-973-11 METAL CHIP 47K 5% 1/16W
R864 1-218-965-11 METAL CHIP 10K 5% 1/16W TH802 1-811-765-21 THERMISTOR, POSITIVE (SMD)
R865 1-218-973-11 METAL CHIP 47K 5% 1/16W
R867 1-218-965-11 METAL CHIP 10K 5% 1/16W < VIBRATOR >
R868 1-218-973-11 METAL CHIP 47K 5% 1/16W
X301 1-814-278-11 VIBRATOR, CRYSTAL (27MHz)
R869 1-218-965-11 METAL CHIP 10K 5% 1/16W X701 1-814-365-11 QUARTZ CRYSTAL UNITS (12MHz)
R870 1-218-973-11 METAL CHIP 47K 5% 1/16W X801 1-795-313-21 VIBRATOR, CERAMIC (8MHz)
R871 1-218-965-11 METAL CHIP 10K 5% 1/16W ************************************************************
R872 1-218-977-11 METAL CHIP 100K 5% 1/16W
R873 1-218-941-81 METAL CHIP 100 5% 1/16W A-1901-384-A PANEL BOARD, COMPLETE (EXCEPT SP, RU)
A-1901-496-A PANEL BOARD, COMPLETE (SP, RU)
R874 1-218-941-81 METAL CHIP 100 5% 1/16W **********************
R876 1-218-941-81 METAL CHIP 100 5% 1/16W
R877 1-218-953-11 METAL CHIP 1K 5% 1/16W < CAPACITOR >
R880 1-208-709-11 METAL CHIP 12K 0.5% 1/16W
R884 1-218-953-11 METAL CHIP 1K 5% 1/16W * C01 1-118-360-11 CERAMIC CHIP 0.1uF 10% 25V
* C02 1-118-360-11 CERAMIC CHIP 0.1uF 10% 25V
R886 1-208-923-11 METAL CHIP 33K 0.5% 1/16W C03 1-118-373-11 CERAMIC CHIP 0.01uF 10% 50V
R887 1-218-941-81 METAL CHIP 100 5% 1/16W C04 1-116-724-11 CERAMIC CHIP 4.7uF 20% 6.3V
R889 1-218-941-81 METAL CHIP 100 5% 1/16W
R892 1-218-953-11 METAL CHIP 1K 5% 1/16W C06 1-116-734-11 CERAMIC CHIP 1uF 20% 16V
* C10 1-118-360-11 CERAMIC CHIP 0.1uF 10% 25V
R900 1-218-973-11 METAL CHIP 47K 5% 1/16W
R903 1-218-941-81 METAL CHIP 100 5% 1/16W C16 1-118-042-11 CERAMIC CHIP 0.22uF 10% 50V
R904 1-218-941-81 METAL CHIP 100 5% 1/16W C21 1-164-315-91 CERAMIC CHIP 470PF 5% 50V
R908 1-218-941-81 METAL CHIP 100 5% 1/16W
R910 1-218-941-81 METAL CHIP 100 5% 1/16W C26 1-164-315-91 CERAMIC CHIP 470PF 5% 50V
R911 1-218-941-81 METAL CHIP 100 5% 1/16W C51 1-126-176-11 ELECT 220uF 20% 10V
R913 1-218-941-81 METAL CHIP 100 5% 1/16W C53 1-118-434-11 CERAMIC CHIP 10PF 50V
R914 1-218-941-81 METAL CHIP 100 5% 1/16W
R918 1-218-953-11 METAL CHIP 1K 5% 1/16W C54 1-118-434-11 CERAMIC CHIP 10PF 50V
R920 1-218-965-11 METAL CHIP 10K 5% 1/16W < CONNECTOR >

R926 1-218-977-11 METAL CHIP 100K 5% 1/16W
R927 1-218-977-11 METAL CHIP 100K 5% 1/16W CN01 1-779-558-11 CONNECTOR, FFC (LIF (NON-ZIF)) 21P (SP, RU)
R928 1-218-977-11 METAL CHIP 100K 5% 1/16W CN02 1-779-552-21 CONNECTOR, FFC (LIF (NON-ZIF)) 15P
R1001 1-208-695-11 METAL CHIP 3.3K 0.5% 1/16W (EXCEPT SP, RU)
CN03 1-785-332-11 PIN, CONNECTOR (LIGHT ANGLE) 6P (SP, RU)
90
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7
PANEL POWER KEY
CN51 1-564-721-11 PIN, CONNECTOR (SMALL TYPE) 5P R26 1-216-813-11 METAL CHIP 220 5% 1/10W
CN52 1-819-866-11 USB CONNECTOR (A) ( ) R28 1-216-833-11 METAL CHIP 10K 5% 1/10W
< DIODE > R29 1-216-813-11 METAL CHIP 220 5% 1/10W

R30 1-216-813-11 METAL CHIP 220 5% 1/10W
D01 6-503-605-01 DI UDZVTE-172.0B
D02 6-500-400-01 DIODE BAV99-215 < SWITCH >
D03 6-500-400-01 DIODE BAV99-215
D04 6-503-040-01 DI DZ2J300M0L S01 1-762-875-21 SWITCH, TACTILE (N)
D05 6-503-891-01 DI 1L0353B14E0MKT01 S02 1-762-875-21 SWITCH, TACTILE (x)
S03 1-762-875-21 SWITCH, TACTILE (FUNCTION)
D06 6-503-890-01 DI 1L0353W34A0MKT01 S04 1-762-875-21 SWITCH, TACTILE (.)
S05 1-762-875-21 SWITCH, TACTILE (Z)
< IC >
S06 1-762-875-21 SWITCH, TACTILE (VOL –)
IC01 6-600-665-01 IC GP1UE27XK0VF S07 1-762-875-21 SWITCH, TACTILE (VOL +)
IC02 6-719-198-01 IC MM3411A33URE S08 1-762-875-21 SWITCH, TACTILE (>)
IC03 6-719-197-01 IC MM3411Z41URE ************************************************************
< JUMPER RESISTOR > POWER KEY BOARD

****************
JR02 1-216-296-11 SHORT CHIP 0
JR03 1-216-296-11 SHORT CHIP 0 < CAPACITOR >
JR04 1-216-296-11 SHORT CHIP 0
JR05 1-216-296-11 SHORT CHIP 0 * C41 1-118-360-11 CERAMIC CHIP 0.1uF 10% 25V
JR06 1-216-296-11 SHORT CHIP 0
< RESISTOR >
JR07 1-216-295-91 SHORT CHIP 0
JR08 1-216-296-11 SHORT CHIP 0 R41 1-216-809-11 METAL CHIP 100 5% 1/10W
JR09 1-216-296-11 SHORT CHIP 0
JR10 1-216-296-11 SHORT CHIP 0 < SWITCH >
JR11 1-216-296-11 SHORT CHIP 0
S41 1-762-875-21 SWITCH, TACTILE (\/1)
< FLUORESCENT INDICATOR TUBE > ************************************************************
ND01 1-483-460-11 VACUUM FLUORESCENT DISPLAY MISCELLANEOUS

**************
< TRANSISTOR >
Q01 6-553-291-01 TR BC817DPN 55 1-968-687-12 HARNESS (USB)
Q02 6-552-892-01 TR LSCR523UBFS8TL 56 1-458-601-11 CARD, WLAN/BT COMBO
Q03 6-552-892-01 TR LSCR523UBFS8TL 57 1-846-376-61 WIRE (FLAT TYPE) (21 CORE) (SP, RU)
57 1-846-377-61 WIRE (FLAT TYPE) (15 CORE) (EXCEPT SP, RU)
< RESISTOR >
58 1-969-958-11 HARNESS (USB)
R01 1-216-809-11 METAL CHIP 100 5% 1/10W 105 1-846-375-51 WIRE (FLAT TYPE) (24 CORE)
R02 1-216-821-11 METAL CHIP 1K 5% 1/10W 0 107 1-834-966-41 POWER-SUPPLY CORD
R03 1-216-825-11 METAL CHIP 2.2K 5% 1/10W (AEP, E3, E51, SAF, SP, E32, RU, MX6, PX)
R04 1-216-825-11 METAL CHIP 2.2K 5% 1/10W 0 107 1-835-068-21 CORD, POWER (AUS)
R05 1-216-809-11 METAL CHIP 100 5% 1/10W 0 107 1-837-308-11 CORD, POWER-SUPPLY (US, CND)
R06 1-216-821-11 METAL CHIP 1K 5% 1/10W 0 107 1-837-312-11 CORD, POWER-SUPPLY (AR)
R07 1-216-825-11 METAL CHIP 2.2K 5% 1/10W 0 107 1-837-345-11 CORD, POWER-SUPPLY (TW)
R08 1-216-825-11 METAL CHIP 2.2K 5% 1/10W 0 107 1-837-822-21 CORD, POWER-SUPPLY (CH)
R09 1-216-805-11 METAL CHIP 47 5% 1/10W 0 107 1-839-012-11 CORD, POWER-SUPPLY (E12)
R10 1-216-813-11 METAL CHIP 220 5% 1/10W 0 107 1-839-940-21 POWER-SUPPLY CORD (TH)
R11 1-216-813-11 METAL CHIP 220 5% 1/10W 0 107 1-839-999-21 POWER-SUPPLY CORD (UK, EA)
R12 1-216-813-11 METAL CHIP 220 5% 1/10W 0 108 1-785-504-21 ADAPTOR, CONVERSION (E51, PX, E32, MX6)
R13 1-216-839-11 METAL CHIP 33K 5% 1/10W 0 109 1-770-019-71 ADAPTOR, CONVERSION PLUG 3P
R14 1-216-809-11 METAL CHIP 100 5% 1/10W (E2100: SP for Hong Kong model)
R15 1-216-809-11 METAL CHIP 100 5% 1/10W 202 A-1850-153-D LOADING FOR SERVICE (BPX-7)
0 205 8-820-452-07 DEVICE, OPTICAL KEM480AAA/C2RP2
R16 1-216-809-11 METAL CHIP 100 5% 1/10W
R17 1-218-285-11 METAL CHIP 75 5% 1/10W 206 1-846-349-61 WIRE (FLAT TYPE) (9 CORE)
R18 1-218-285-11 METAL CHIP 75 5% 1/10W 207 1-846-347-11 FLEXIBLE FLAT CABLE (45 CORE)
R19 1-216-839-11 METAL CHIP 33K 5% 1/10W 208 1-846-348-61 WIRE (FLAT TYPE) (5 CORE)
R20 1-216-797-11 METAL CHIP 10 5% 1/10W 0 M1 1-855-244-11 DC FAN
0 SWR1 1-798-453-11 SWITCHING REGULATOR (3L392W-1)
R21 1-216-797-11 METAL CHIP 10 5% 1/10W (US, CND, AEP, UK, SAF, SP, TW, AUS, TH, CH)
R22 1-216-821-11 METAL CHIP 1K 5% 1/10W
R24 1-216-833-11 METAL CHIP 10K 5% 1/10W
Note 1: When replacing the WLAN/BT COMBO card, refer to Note 2: Wires (flat type) for service is all straight.
“CHECKING METHOD OF NETWORK OPERATION” Please bend it referring go “HOW TO BEND FFC” on
(page 11). page 14 when you install it in the unit.
91
HBD-E2100/E3100/E3200/E4100/E6100
Ver. 1.7

0 SWR1 1-798-453-21 SWITCHING REGULATOR (3L392W)
(E3, E51, PX, EA, E12, E32, RU, MX6, AR)
92
HBD-E2100/E3100/E3200/E4100/E6100
REVISION HISTORY
Clicking the version allows you to jump to the revised page.

Also, clicking the version at the top of the revised page allows you to jump to the next revised page.
Ver. Date Description of Revision
1.0 2012.12 New
1.1 2013.04 Addition of E3, Latin-American and Taiwan models. (HBD-E2100)
Addition of Thai and E32 models. (HBD-E3100)
Addition of Russian, E12, E3, Saudi Arabia, Singapore, Chinese, Thai, Taiwan and Latin-American
models. (HBD-E4100)
Addition of Russian, E3, South African, Saudi Arabia, Singapore, Australian, Thai and Taiwan models.
(HBD-E6100)
Change of MB1002 board (Suffix 12).
Change P/N for Ref. No. 58 in Page 77.
Change P/N and description for Q3101, Q3202, Q3302 and Q3555 in AMP board.
Delete Servicing Notes for IC102 and IC103 in MB1002 board.
Change description for J702 in MB1002 board.
Add safety mark for DC, FAN.
Delete IC707, C732, C736, R784 and R7015 in MB1002 board.
Add R7014 in MB1002 board.
Change P/N and description for D3101, D3102, D3103, D3104, D3105, D3106, D3107, D3108,
D3301, D3302, D3303, D3304, D3305, D3306, D3307 and D3308 in AMP board.
Change P/N for Ref. No. 108 in page 78 and 90.
1.2 2013.07 Addition of Chinese model. (HBD-E6100)
Change of MB1002 board (Suffix 13, 21).
Change of AMP board (Suffix 12).
Change of P/N and description for C3027, C3029, C3117, C3120, C3140, C3141, C3317, C3322, C3340
and C3341 in AMP board.
Change of P/N for C3014, C3025, C3031, C3032, C3033, C3041, C3042, C3051, C3115, C3122, C3136,
C3138, C3139, C3315, C3320, C3336, C3338, C3339, C3401, C3403, C3405, C3407, C3451, C3452,
C3455, C3456, C3459, C3460, C3463, C3464 and C3555 in AMP board.
Delete R3157, R3158, R3283, R3284, R3357, R3358, R3383 and R3384 in AMP board.
Change P/N and description for R246 and D220 in MB1002 board.
Add R307, R308, R386 and R387 in MB1002 board.
Delete C425, C705, CN802, D701, Q209 and R265 in MB1002 board.
Delete Servicing Notes for IC205 and IC406 in MB1002 board.
Service code change for C745 and C746 in MB1002 board.
Change P/N and description for Ref. No. 107 for PX model in Page 78 and Page 90.
1.3 2013.09 Add servicing notes in page 9.
Change P/N for Ref No.58 in page 77 and 90.
HBD-E2100/E3100/E3200/E4100/E6100
Ver. Date Description of Revision

1.4 2013.12 Addition of Argentina model. (HBD-E2100 and HBD-E4100)
Change of P/N and description for C3099, C3108, C3109, C3118, C3119, C3308, C3309, C3318 and
C3319 in AMP board.
Service code change for C3228 in AMP board.
Service code change for C79, C80, C87 and C88 in KARAOKE board.
Service code change for C350, C357, C360, C380, C384, C424, C429, C431, C715, C716, C717, C723,
C726, 729, C730, C751, C758 and C822 in MB1002 board.
Change of P/N for R847 in MB1002 board.
Change of P/N and description for Ref. No. 53 in page 77.
Change of P/N and description for IC102 and IC103 in MB1002 board.
Change of P/N for C3106, C3107, C3134, C3135, C3156, C3157, C3306, C3307, C3334, C3335, C3356
and C3357 in AMP board.
1.5 2014.03 Additional of BDV-E3200 model.
Change of P/N for CN380, R211, R212, R215, R216, R237, R412, R443, R444, R733 and R734 in
MB1002 board.
Change of P/N for LOADING FOR SERVICE (BPX-7) in page 80 and page 90.
Change of P/N for L3101, L3103, L3301 and L3303 in AMP board.
1.6 2014.04 Add P/N and description for ADAPTOR, CONVERSION PLUG 3P (E2100 : SP for Hong Kong model)
in page 79 and 91.
1.7 2014.06 Additional of E51 model (HBD-E2100 and HBD-E4100) and Russian model (HBD-E3100).

Bdv-E 2100, 3100, 3200, 4100 (HBD) PDF

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HBD-E2100/E3100/E3200/E4100/

BLU-RAY DISC/DVD RECEIVER

4. ELECTRICAL CHECK .......................................... 32

NOTES ON CHIP COMPONENT REPLACEMENT

NOTE OF REPLACING THE OPTICAL DEVICE 1-3. Barcode decoder (BDPRdec)

2. Pass-fail judgment of the optical device (KEM480AAA)

2-1. Flow of drive section check

Confirm whether Confirm whether the Confirm F201, F202,

Confirm OP FFC cable Confirm whether the Replace the

2-2. Flow of optical device IOP check

Turn the power on, Confirm whether Replace the

Press the buttons on

3. Optical device (KEM480AAA) replacement

Save the text data

Take photo (JPEG)

Change photo into

Procedure: – Front view –

2. Take photo of the barcode on new optical device

Front USB connector Front USB connector

7. Press the [FUNCTION] button on the remote commander to

14. Turn the power on, confirm playback performance of the BD

Category: Bluetooth Device Test

Status : Bluetooth Enable Successful!

(Screen 2) HELP: [UP][DOWN][ENT][RET]

Category: Bluetooth Device Test

Bluetooth device address : 00:01:36:23:FD:CF

MODEL IDENTIFICATION NOTE OF REPLACING THE IC3102 AND IC3302 ON

CAPACITOR ELECTRICAL DISCHARGE PROCESSING

– SWITCHING REGULATOR (Conductor Side) –

(To both ends of each capacitor)

CHECKING METHOD OF NETWORK OPERATION 2. Checking method of wired LAN operation

HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF

1 Remove the case.

Insert the clip etc.

2 Insert the clip etc.

Note: Push after it inserts it in this hole well.

switching regulator (SWR1)

2-1. DISASSEMBLY FLOW

SET 2-2. HOW TO BEND FFC

2-4. PANEL LOADING ASSY

2-5. FRONT PANEL ASSY

2-6. BD DRIVE (BPX-7)

2-7. POWER KEY BOARD, WLAN/BT COMBO CARD,

2-8. MB1002 BOARD

2-9. AMP BOARD

2-10. SWITCHING REGULATOR (SWR1)

2-11. OPTICAL PICK-UP BLOCK (KEM480AAA),

2-2. HOW TO BEND FFC

wire (flat type) (8 core), length 260 mm (Ref. No. 52)

The upper side The upper side

MB1002 board AMP board

The upper side The upper side

wire (flat type) (9 core), length 252 mm (Ref. No. 206)

wire (flat type) (5 core), length 276 mm (Ref. No. 208)

Note: Follow the disassembly procedure in the numerical order given.

1 four screws (+BV3 (3-CR))

2 four screws (+BV3 (3-CR))

2-4. PANEL LOADING ASSY

4 panel loading assy

Insert the clip etc.

1 Insert the clip etc.

Note: Push after it inserts it in this hole well.

2-5. FRONT PANEL ASSY

,QVWDOODWLRQRIIOH[LEOHIODWFDEOHFRUHZLUHIODWW\SHFRUHDQGZLUHIODWW\SHFRUH