H ANK F ANG 10441 Hunters Ridge Pl.

♦ San Diego, CA 92127

(858) 699-2125 ♦ hank.fang.usa@gmail.com

Strong engineering experiences on power and performance analysis for customized SOC, designed and
implemented various innovative methodologies of analyzing and quantifying active/idle/stall power for
various IP core, provided valuable power suggestion for Qualcomm Snapdragon SoC power evolution,
especially on LTE modem, Camera, and DDR sub-system.

10+ years diverse experiences in embedded system (hardware and software), particularly in areas of
hardware/device drivers, digital and analog circuits, wireless, IOT, sensors, camera, protocol stack, user
interface, TCP/IP socket programming, peripheral interfaces CAN/GPIO/Serial/I2C/RS-232/RS-485, multiple
threading and large-scale data application development.

15+ years C/C++/C# programming on various embedded and PC platform, large scale software integration
and release experiences.

C AREER H ISTORY

Qualcomm. (2016 – Present)

Senior Staff System Engineer

Focusing on Qualcomm Snapdragon MSM SoC power management techniques and comparing them with
competitive devices, provided valuable power suggestion for Qualcomm Snapdragon SoC power evolution

 Did device level sustainable mode study involve thermal mitigation, performance impact, power data.
 Designed and implemented various innovative methodologies of analyzing and quantifying
active/idle/stall power for various IP core (GPU, video, camera CAMSS, modem), gained good knowledge
of Snapdragon SoC (8996/835/845) architecture, PMIC, power grid, memory system.

 Deeply analyzed Snapdragon 845 new camera subsystem, including power breakdown, SoC common
power rail partition, designed various innovative approaches to decompose camera ISP pipeline so
leakage/idle/stall/active power of individual camera core can be measured precisely
 Deeply analyzed Snapdragon 8996/835 modem PDCCH use case and full-stack LTE use cases DDR traffic
pattern, active power, provided the power optimization recommendation on dedicated cache size and
SoC power rail partitions

TechVali Inc. (2014 – 2016)

Technical Lead

Taking challenges and facing uncertainties by reaching out for customers and applications. Writing enormous
project proposals and developing functional prototypes, driving project from concept to completion to meet
schedule, customer requirement and budget.
 Drove multiple projects across all phases of development
H ANK F ANG Page 2
(858) 699-2125 ♦ hank.fang.usa@gmail.com

 Built a small but very talent team, made enormous adjustments and effort to achieve project milestones
 Made multiple business proposals, well presented to customers and lead to a several successful projects
 Designed and implemented a visual simultaneous localization and mapping (SLAM) dual camera sensor
module with on-board 6-axis IMU (Gyro + accelerometer) module and Cypress FX3 USB3.0 stack
 Connected various sensors to cloud for IOT applications for solar customers: prototypes include sensors,
signal conditioning, wireless (ZigBee, WIFI, Cellular, LoRa, Ingenu RPMA) communication, data collection
and processing, cloud integration.
 Designed and delivered a working system for DOT (Department of Transportation) sponsored project
(SBIR) to collect vehicle’s GPS/OBD-II/Gyro data with Android mobile app.
 Designed and implemented a Wireless Sensor Network platform to collect various sensor data:
temperature/humidity/motion/strain/gas etc. platform includes hardware, firmware, protocol and
application software development, dealing with many practical issues, stability and performance issues.

BROADCOM, San Diego, CA (2006 – 2014)

Principle Software Engineer
 Deeply involved for Broadcom mobile SOC's power management. Focused on debugging and
optimizing the power. Responsible for tuning parameters for optimized power and performance,
power related error triage, tools development for log analysis and power measurement, power rail
break-out measurement and analysis, power measurement automation. Covered areas in system
bring-up, PMU (Power Management Unit), CPM (Central Power Management), DVFS/CPUFreq,
CPUIdle, Suspend/Resume, Deep Sleep, Tracing.

 Technical lead for the integration and release of the Broadcom chipset platform software. Ensured
that bi-weekly software releases were on time, having the correct content and quality for all
development teams across the global sites.

NOKIA MOBILE PHONE, San Diego, CA (2002 – 2006)

Senior Software Engineer (Team Lead)

 Served as technical lead for various Nokia S40 UI applications (mobile voice call, data call, emergency
call, conference call, security screen etc.) sold in millions of devices.
 Gathered virous new requirements, drove the projects schedule and generated status reporting etc.

Early Career:
Siemens Mobile Phone, San Diego, CA – Embedded Software Engineer
 Embedded software development and debugging for Siemens GSM-TDMA dual-mode phone, focused
on audio bridge, crash dump analysis, debug and error fixing.

Motorola Software Center, Beijing, China – Software Engineer (Project Manager)

 Motorola HC08/HC12 microcontroller device driver development (GPIO, Serial, Timer, ADC…)
 Motorola CDMA mobile phone protocol stack (IS-95) verification and testing using TTCN scripting
language.
Beijing Institute of Technology, Sino-Japan O&E Lab – Assistant Professor
 Embedded industrial system (CCD camera and LED, LCD display) firmware development on Hitachi
SuperH 32-bit processor and Motorola 68000 processor.

E DUCATION & C REDENTIALS

Master of Electrical Engineering (Optical Electronics)

BEIJING INSTITUTE OF TECHNOLOGY

P ATENTS

2 patents under final review with USPTO, 1 under filing

T ECHNICAL S KILLS

 Snapdragon SoC power and performance analysis

 Qualcomm camera subsystem architecture, ISP pipeline, Camera HAL, CAMX, device driver
 Snapdragon SoC thermal
 Snapdragon modem PDCCH, LTE
 Snapdragon SoC active/idle/stall, memory system, power rail breakdown
 IOT with various low power radio technologies (Cellar, WIFI, Bluetooth, Zigbee, LoRa, RPMA)
 Sensor technologies (strain, gas, GPS, Gyro, IMU, OBDII, image sensor…)
 Embedded system (8/16/32/64-bits processor/SOC platform)
 Single or multiple core environment, embedded OS (ThreadX, Nucleus and uC/OS, Linux),
SuperH/68000/HC-08/HC-12/ARM/Atmel/mbed LPC1768/Particle Photon/ Electron
 Programming experience on C/C++/C#, and scripting language
 peripheral interfaces CAN/GPIO/Serial/I2C/RS-232/RS-485
 Multi-threading programing, design pattern, real-time streaming data handling, database/file
handling, M2M data communication (wire or wireless communication)
 Various benchmark and profiling tools
 Using instrument and tools like JTAG, logic analyzer, wireless call box (CMU 500), signal generator,
simulator, oscilloscope to debug