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Lead free SOLUTIONS you can TRUST #47012E
2011.09.27

Contents
Features

Specifications
Continual printability
Viscosity variation
Thermal cycling
LEAD FREE solder paste
TOYOTA’s recommended solder paste for
automotive electronics

Tack time

Heat slump

Solder balling
GSP
Wetting
Product information
Capillary balling

Voiding

Solder spreading

Voltage applied SIR

Crack-Free Residue
Halide content

Dryness

Handling guide
This Product Information contains product performance assessed strictly according to our own test procedures
and may not be compatible with results at end-users.

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GSP 2

Contents
Features

Specifications

Continual printability
Product Features
Viscosity variation

Thermal cycling
„ Alloy composition: Sn96.5Ag3.0Cu0.5
Tack time
„ Highly reliable flux residue
Heat slump

Solder balling „ Crack-free in flux residue after 1000 thermal cycles of -40ºC /
Wetting +125ºC
Capillary balling „ Prevent the occurrence of capillary balling through 4-hour
Voiding continual printing
Solder spreading
„ Excelling wetting to lead frames of QFP and SOP
Voltage applied SIR

Halide content
„ Residue adhesion is extremely low

Dryness „ Specially designed for automotive electronics e.g. ECU, EV, EHV,
Handling guide to be used in N₂ environment

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GSP 3

Contents
Features Specifications
Specifications
Application Printing - Stencil
Continual printability
Product GSP
Viscosity variation
Composition （％） Sn96.5 Ag3.0 Cu0.5
Thermal cycling Melting point （℃） 217 － 219
Alloy

Tack time Shape Spherical

Heat slump Particle size （μm） 20 – 38

Halide content （％） 0.06

Solder balling
Flux content （％） 10.9 ± 0.5
Wetting
Product

Viscosity* (Pa.S) 160 ± 30

Capillary balling
Copper plate corrosion** Passed
Voiding
Tack time 24 hours
Solder spreading
Shelf life （below 10℃） 6 months
Voltage applied SIR
* Viscosity Malcom spiral type viscometer, PCU-205 at 25℃ 10rpm
Halide content
(Processing before measurement: Malcom sofner SPS-1 at 12min)
Dryness **Copper plate corrosion In accordance with JIS Z 3197

Handling guide

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GSP 4

Contents
Features
Product identification
Specifications

Continual printability

Viscosity variation

Thermal cycling
GSP
Tack time This product has been designed and co-developed by Toyota Motor Corporation with the
objective of improving the quality, cost performance, and lead time of automotive electronics
Heat slump to be used in N2 environment.

Solder balling Toyota group GSP co-development participated by:

Wetting Toyota Motor Corporation / Denso Corporation / Fujitsu Ten Limited

Capillary balling
Product name ‘GSP’ stands for Global Solder Paste.
Voiding Note that the conventional product identification system of Koki does not apply.
Solder spreading

Voltage applied SIR

Halide content

Dryness

Handling guide

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GSP 5

Contents
Features
Continual printability
• Squeegee Metal blade, angle - 60º
Specifications • Print speed 40mm/sec.
• Stencil 0.15mm thickness, laser cut
Continual printability • Stencil separation speed 10mm/sec
• Atmosphere 25±1°C, 50±10%RH
Viscosity variation • Test patterns QFP pad pattern – 0.4mm pitch, Length 1.5mm, Width 0.2mm
CSP pad pattern – Diameter 0.30mm
Thermal cycling

Tack time
1st print 10th print 100th print
Heat slump

Solder balling

Wetting QFP
Parallel to squeegee
Capillary balling

Voiding

Solder spreading

Voltage applied SIR CSP

0.30mm diameter
Halide content

Dryness

Handling guide Excellent and consistent printability through 100 prints.

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GSP 6

Contents
Viscosity variation in continual printing
Features
• Print (knead) solder paste on the sealed-up stencil continually and observe viscosity variation.
Specifications • Squeegee Metal blade, Angle - 60º
• Squeegee speed 30mm/sec.
Continual printability • Print stroke 300mm
• Printing environment 25±1ºC, 50±10%RH
Viscosity variation

Thermal cycling

Tack time 350

Heat slump 300

Solder balling 250

V iscosity　（Pa・s)

Wetting 200

Capillary balling 150

Voiding 100

Solder spreading 50
*120 strokes/hour
Voltage applied SIR 0
0 24 0 4 80 720 96 0
Halide content No, of printstrokes (times)

Dryness

Handling guide Specially formulated flux chemistry has succeeded in minimizing chemical reaction between solder powder
and flux during print rolling, thus exhibiting consistent long term printability.

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GSP 7

Contents
Thermal cycling
Features
• Cycle condition +40/+125ºC x 1000 cycles 0.65mm Pitch QFP
Specifications • Material Glass epoxy FR-4
• Surface treatment OSP
Continual printability • Stencil thickness 0.18mm (laser cut)
• Component 0.65mm pitch QFP
Viscosity variation • Stencil aperture 100% aperture opening to pad
• Reflow machine Koki Tech APSR-257
Thermal cycling • Atmosphere N2（O2 concentration < 1500ｐｐｍ）
• Reflow profile See below
Tack time
30min
Heat slump

Solder balling 5min

Wetting Initial After 1000 cycles 5min

Capillary balling 30min
Cycle conditions
Voiding
250
Solder spreading
200

Voltage applied SIR

Temp (℃)
150

100
Halide content
50
Dryness
0
0 60 120 180 240 300
Handling guide Time (sec)

No notable cracking in the residue through 1000 cycles.

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GSP 8

Contents
Features Tack time
Specifications • Stencil 0.2mm thick, 6.5mm dia. aperture
• Measurement instrument Malcom tackimeter TK-1
• Probe pressure 50gf
Continual printability
• Pressurizing time 0.2sec
• Pull speed 10mm/sec.
Viscosity variation • Test method JIS Z 3284
• Test environment 25±1°C, 50±10%RH
Thermal cycling

Tack time 200

Heat slump

Solder balling 150

Ta ck i nes s ( g f )

Wetting
100
Capillary balling

Voiding
Load
50 Pull up at
50gf
Solder spreading 10.0mm/sec.

Voltage applied SIR 0.2 sec.

0
Halide content 0 12 24 36 48
Ti m e ( hr)
Dryness

Handling guide
Unique solvent system successfully assures sufficient tack time.

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GSP 9

Contents
Features Heat slump
Specifications
• Stencil thickness 0.2mm
Continual printability • Stencil aperture Pattern (1) 3.0mm x 0.7mmm
Pattern (2) 3.0mm x 1.5mm
Viscosity variation • Spacing between apertures 0.2mm to 1.2mm
• Heat profile 180ºC X 5min.
Thermal cycling

Tack time
Pattern (1) Pattern (2)
Heat slump
0.2 0.3 0.4 0.5 mm 0.2 0.3 0.4 mm
Solder balling

Wetting

Capillary balling

Voiding
0.7 mm 1.5 mm
Solder spreading

Voltage applied SIR 3.0 mm 3.0 mm

Halide content
No merge at 0.4mm No merge at 0.4mm
Dryness

Handling guide
Improved heat slump property assures reduced soldering defects, such as solder beading and bridging.

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GSP 10

Contents
Features Solder balling (in air)
Specifications
Category 1 2 3 4
Continual printability
• Stencil 0.2mm
Viscosity variation • Stencil aperture 6.5mm diameter
• Solder pot temperature 250ºC
Thermal cycling • Test method JIS Z 3284

Tack time

Heat slump
1 hour after printing 24 hours after printing
Solder balling

Wetting

Capillary balling

Voiding

Solder spreading

Voltage applied SIR

Halide content

Dryness

Handling guide Category 3 Category 3

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GSP 11

Contents
Features
Wetting test
0.65mm Pich QFP
• Material Glass epoxy FR-4
Specifications
• Surface treatment OSP
• Stencil thickness 0.18mm (laser cut)
Continual printability • Component 0.65mm pitch QFP
• Stencil aperture 100% aperture opening to pad
Viscosity variation • Reflow machine Koki Tech APSR-257
• Atmosphere N2（O2 concentration - 1500ｐｐｍ）
Thermal cycling • Reflow profile See below

Tack time

Heat slump GSP Conventional product

Solder balling

Wetting
Initial
Capillary balling 250

Voiding 200

Temp (℃)
150
Solder spreading
After 4-hour 100
Voltage applied SIR kneading on 50
stencil
Halide content 0
0 60 120 180 240 300
Dryness Time (sec)

Handling guide Complete coalescence by minimum deterioration of barrier performances through 4-hour kneading.

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GSP 12

Contents
Features
Capillary balling 2125R

• Material Glass epoxy FR-4

Specifications
Continual printability
Viscosity variation
• Surface treatment OSP
• Stencil thickness 0.15mm (laser cut)
• Stencil aperture 100% aperture opening to pad
• Component 2125R 30 pieces / board
• Reflow profile Same as “Wetting test”

Thermal cycling

Tack time GSP Conventional product

Heat slump

Solder balling

Wetting Initial

Capillary balling

Voiding 0 pc. 3 pcs.

Solder spreading

Voltage applied SIR

After 4-hour
Halide content Kneading
On stencil
Dryness
0 pc. 13 pcs.
Handling guide

The occurrence of capillary balls is contained through 4-hour kneading.

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GSP 13

Contents
Voiding
Features
• Material Glass epoxy FR-4 6330R
• Surface treatment OSP
Specifications • Stencil thickness 0.15mm (Laser cut) 1.0mm Pich BGA
• Stencil aperture 100% aperture opening to pad
Continual printability • Components PwTr
PwTr 100% Sn plated
Viscosity variation 2125R 100% Sn plated
1.0mm pitch BGA Sn96.5Ag3.0Cu0.5
• Reflow profile Same as “Wetting test” 0.65mm Pich QFP
Thermal cycling

Tack time

Heat slump PwTr 6330R BGA QFP

Solder balling

Wetting Initial
Capillary balling

Voiding

Solder spreading After 4-hour

kneading on
Voltage applied SIR
stencil
Halide content

Dryness

Handling guide Prolonged kneading time does not affect the occurrence of voids.

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GSP 14

Contents
Features
Solder spreading
• Material piece Copper, Brass, Nickel
Specifications • Stencil thickness 0.2mm（laser cut）
• Stencil aperture 6.5mm diameter
Continual printability • Heat source & temp. Same as “Wetting test”

Viscosity variation
Copper plate Brass Nickel
Thermal cycling

Tack time

Heat slump

Solder balling

Wetting

Capillary balling

Voiding Category 2 Category 2 Category 2

Solder spreading
Category 1 : Solder has spread more than the area where solder paste was printed.
Category 2 : Solder has spread whole area where solder paste was printed.
Voltage applied SIR Category 3 : Solder has not partially spread.
Category 4 : Solder spread is less than the area where solder paste was printed （non-wetting）
Halide content

Dryness

Handling guide Solder spreads well to all of the materials.

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GSP 15

Contents
Features
Voltage applied surface insulation resistance
•Test conditions 85±2ºC x 85%±5RH 1000 hr.
Specifications •Stencil thickness 150 μｍ
•Comb type electrode JIS type-II
Continual printability •Measurement voltage DC100V
•Voltage applied DC20V
Viscosity variation
SIR GR A PH
Thermal cycling Backlight
1.E +14
Tack time

Heat slump 1.E +13

Ins ul ati on res i s ta nce ( Ω)

Solder balling 1.E +12

Wetting
1.E +11
Capillary balling
1.E +10
Voiding
Direct light
1.E +09
Solder spreading

Voltage applied SIR 1.E +08

Halide content 1.E +07

0 168 336 504 672 840 1008
Dryness
Ti m e ( hour)
Handling guide
No evidence of electro-migration.

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GSP 16

Contents
Features
Halide content
Specifications
・Test method JIS Z 3197（Potentiometric titration method）
Continual printability ・ Measurement instrument AT-400 (Kyoto Electronics Manufacturing)

Viscosity variation

Thermal cycling

Tack time (%)

Heat slump n1 n2 n3 AVE

Solder balling

Wetting
0.06108 0.06113 0.05943 0.0606

Capillary balling ＊Figures are converted into Chlorine.

Voiding

Solder spreading

Voltage applied SIR

Halide content

Dryness

Handling guide

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GSP 17

Contents
Features
Dryness
• Material piece Copper plate
Specifications • Stencil thickness 0.2mm （laser cut）
• Stencil aperture 6.5mm diameter
Continual printability • Heat source & temp. Same as “Wetting test”
• Judge chalk powder on flux residue are softly brushed.
Viscosity variation

Thermal cycling

Tack time

Heat slump
Initial After brushing of chalk powder
Solder balling

Wetting

Capillary balling

Voiding

Solder spreading

Voltage applied SIR

Halide content

Dryness

Handling guide Chalk powder can be easily removed by a soft brush.

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GSP 18

Contents
Handling guide
Features
1. Printing
Specifications 1) Recommended printing parameters
(1) Squeegee
Continual printability 1. Kind : Flat
2. Material : Rubber or metal blade
Viscosity variation 3. Angle : 60°
4. Pressure : 40N
Thermal cycling 5. Squeegee speed : 20～40mm/sec.

Tack time (2) Stencil

1. Thickness : 180～150μm for 0.65mm pitch pattern
Heat slump 120～100μm for 0.5～0.4mm pitch pattern
2. Type: : Laser or electroform
Solder balling
3. Separation speed : 7.0～10.0mm/sec.
Wetting
4. Snap-off distance : 0mm

(3) Ambiance
Capillary balling
1. Temperature : 22～25ºC
Voiding 2. Humidity : 40～60%RH
3. Air draft : Air draft in the printer badly affects stencil life and tack performance of
Solder spreading solder pastes.
2. Shelf life
Voltage applied SIR 0～10℃ : 6 months from manufacturing date

Halide content * Manufacturing date can be obtained from the lot number
ex. Lot No. 0 05 15 2
Dryness No. of lot : 2nd
Date : 15th
Handling guide
Month : May
Year : 2010

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GSP 19

Contents
Features Handling guide – Recommended reflow profile
Specifications

Continual printability (ºC)

Peak temp. 240~255ºC
Viscosity variation 250
Pre-heat temp.
Thermal cycling 150~185ºC 90~120sec.
200
Tack time

Heat slump 150 Over 220ºC > 30 sec.

Solder balling
100 Ramp-up temp.
Wetting Oxygen density : < 1,500 ppm
1.5~3.0ºC/sec.
Capillary balling
50 Pre-heat conditions
Voiding Upper limit: 180~190ºC 120sec
Lower limit: 150~180ºC 90sec
Solder spreading 0
60 120 180 240 300 (sec.)
Voltage applied SIR

Halide content

Dryness
Exclusively designed for N2 environment (Atmospheric environment not recommended).
Handling guide Recommended O2 concentration is below 1500ppm. However, it may require ample studies
before use as the optimum parameters may vary depending on the machine and environment.

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