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BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _Body Length X Body
Width X Height
BGA + Pin Qty + C or N + Col Pitch X Row Pitch P + Ball Columns X Ball Rows _Body
Length X Body Width X Height
BGAS + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _Body Length X Body
Width X Height
LGA + Pin Qty + C + Pitch P + Pin Columns X Pin Rows _Body Length X Body Width X
Height
LGA + Pin Qty + S + Pitch P + Pin Columns X Pin Rows _Body Length X Body Width X
Height
LGA + Pin Qty + R + Pitch P + Pin Columns X Pin Rows _Body Length X Body Width X
Height
PLCC + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height -Pin Qty
PLCCS + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height -Pin Qty
QFP – Quad Flat Packages (Pitch = 0.65mm, 0.80mm or 1.00mm; Height > 1.6mm)
QFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height -Pin Qty
SQFP – Shrink Quad Flat Packages (Pitch = 0.30mm, 0.40mm or 0.50mm; Height >
1.6mm)
SQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height -Pin Qty
TQFP – Thin Quad Flat Packages (Pitch = 0.65mm or 0.80mm; Height ≤ 1.6mm)
TQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height -Pin Qty
TSQFP – Thin Shrink Quad Flat Packages (Pitch = 0.30mm, 0.40mm or 0.50mm;
Height ≤ 1.6mm)
TSQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height -Pin Qty
CQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height -Pin Qty
QFN + Pitch P + Body Width X Body Length X Height -Pin Qty + Thermal Pad
PQFN + Pitch P + Body Width X Body Length X Height – Pin Qty + Thermal Pad
SOIC127P – Small Outline Integrated Circuit, (50 mil (1.27mm) Pitch SOIC)
TSSOP – Thin Shrink Small Outline Packages (Pitch = 0.30mm, 0.40mm, 0.50mm
or 0.55mm; Height ≤ 1.6mm)
SON + Pitch P + Body Width X Body Length X Height – Pin Qty + Thermal Pad
PSON + Pitch P + Body Width X Body Length X Height – Pin Qty + Thermal Pad
SOD (JEDEC)
SOT23 Packages
SOT223 Packages
SOT89