SYNOVA

VA

LASER CUTTING SYSTEM

Incorporating Laser MicroJet® Technology

LCS 300

Expand your Capab

bilities with the Latest Development in Laser Technology
 The Laser MicroJet®
The Laser Microjet® surpasses laser
cutting and water cutting technologies.
The laser beam is contained within a
hair-thin water jet through total
reflection.
Machined parts are cooled by the
water jet at the cutting face, producing
what is effectively "cold laser cutting".
The resulting minimal thermal damage
ensures that almost no structural
changes occur during machining.
Low water jet pressure ensures that
virtually no mechanical force is exerted
during processing, allowing rapid,
trouble-free production of delicate and
composite parts.
Cold Laser
Power for:
Cutting
Grinding 500 micron wide hole drilled in
150 micron thick stainless steel
Drilling
Grooving
Scribing
Half polished, half ground Si wafer
Precise, parallel cutting is achieved over
the entire depth of the workpiece,
even with porous or layered materials,
leaving a fine, clean surface.
Complex 3-D cutting is possible due to
the long working distance and
constantly focused, parallel laser beam.
Extremely hard and brittle materials
can be machined rapidly and with high
precision.
In short, the Laser Microjet®
significantly expands your micro-
machining capabilities, especially with
difficult-to-machine parts.
Cut edge of 650 micron thick
pacemaker PCB
75 micron thick groove machined in
PV Si-solar cell
New Capabilities
Electronics
Complex, multi-layer PCB's & chip scale packages can be cut
economically to high precision. Ultra-precise stencils for
screen printing can be cut with no deformation of the sheet,
and no post-treatment being required. Air gaps of ferrite
cores can be machined rapidly with high precision, ensuring
ultra-low running costs.

Medical
Metal endoscope parts, micro-needles, and implants can all
be produced to very high precision with an excellent surface
finish. Scalpel blades made of silicon can be manufactured
economically and with a perfect cutting edge.

Tooling
Super-hard materials such as CBN, silicon nitride or synthetic
diamond employed in cutting tools can be manufactured very
economically. Advantages of the Laser Microjet include a high
cutting speed, very low tolerances, a smooth surface and no
thermal damages, all ensuring constant results.

Automotive
Complex parts such as catalytic converters can be cut with
no material deformation and minimal thermal damage to
active materials. Injection nozzles can be drilled to very high
tolerances and surface finishes.

Energy
Solar PV Si-cells with contoured edges can be cut out with no
mechanical stress, chipping, heat damage, or changes to
electrical properties. Further advantages over conventional
sawing include low running costs, higher quality, and very
high flexibility. Additional applications include turbine blades
and parts for nuclear energy.

Semiconductor
Economical, high quality cutting of silicon power
semiconductors is achieved with the Laser Microjet.
Advantages over conventional lasers and saws include a
smooth edge, no burrs, no thermal stress, and no micro-
cracks or chipping. Additional processes include drilling,
grooving, scribing, edge grinding, thinning and marking.
 The LCS 300

Ease of Use
A large colour TFT flat screen with touch panel
allows comfortable operation of all machine
functions. Using the latest generation of real-time
processors has enabled an entirely new concept in
CNC control and man-machine communication.

Fast Process Control

Due to the integration of the latest software in image
processing, nothing is faster in the market for
alignment and quality control. Work piece alignment
and quality checking are executed in milliseconds.

Low Cost of Ownership

LCS 300 employs Laser Microjet®
technology, eliminating the need for
expensive tools. LCS 300 has only
negligible needs for consumables. In
fact, the laser beam has no wear,
and water consumption is
negligible.

The Water Je
Laser S
0 at a glance

High Accuracy
A stable structure made of granite is the key to high
precision, ensuring an outstanding, dynamic
response. Linear motors are used to achieve high
speed and accuracy.

Reliability
LCS 300's component parts are backed by the
reliability of our carefully chosen suppliers, each one
a market leader within his own field. In addition, a
vast array of sensors provides constant control and
allows continuous diagnostic transparency through a
modem connection.

Unmatched Cutting Quality

LCS 300's Laser Microjet® has
negligible tool wear, enabling
reliable machining of components
to exact tolerances, batch after
batch. The Laser Microjet ®
eliminates heat damage associated
with conventional lasers. The
dimensions and finish of machined
parts are excellent, with no burrs,
et - Guided contamination or slag.

System
 General Specifications LCS 300
AXES
Type XY-Table with separate axes on granite base
Drive Linear motors
Useable working area 300 x 300 mm
SYNOVA Maximum stroke (X x Y) 600 x 400 mm
Accuracy < 0.003 mm
Repeatability < 0.001 mm
CORPORATE HEADQUARTER Maximum axis speed 600 mm/s
SYNOVA SA Maximum acceleration 20 m/s2
Chemin de la Dent d'Oche Index 0.0001 mm
CH - 1024 Ecublens
Tel (41) 21 694 35 00 LASER
Fax (41) 21 694 35 01 Type Solid state Nd:YAG, pulsed
email info@synova.ch Available Wavelengths 1064 nm, 532 nm
http://www.synova.ch Average power 100 W, optional 200 W
Laser beam transmission Optical fiber 0.200 mm, length 10 m
EUROPE
SYNOVA SA WATER PUMP
Chemin de la Dent d'Oche Type Two-cylinder pressure amplifier
CH - 1024 Ecublens Average Water flow 0.05 l/min
Tel (41) 21 694 35 00 Water pressure 50 to 500 bars (5 to 50 Mpa)
Fax (41) 21 694 35 01 Pressure transmission Flexible water hose
http://www.synova.ch
Sales Office OPTICAL HEAD
Tel (41) 21 694 35 13 Type Projection of fiber exit into water jet nozzle
Fax (41) 21 694 35 01 Image ratio 4:1, 6:1 or 8:1
email info@synova.ch Nozzle diameter 0.050 mm, 0.075 mm or 0.100 mm
Technology Center Alignment Vision controlled
Tel (41) 21 694 35 17
email test@synova.ch VISION SYSTEM
Type Image matching
USA Magnification Two-level (high/low magnification)
Contact SYNOVA SA Optical magnification x 0.5 to x 5.0
Pending the opening of Illumination Coaxial and ring light, fiber-coupled
SYNOVA Inc. Automatic alignment method Image processing, alignment time < 5 s
Quality control Kerf check by image analysis

JAPAN
Itochu Mechatronics Co.
2-8-4, Nihonbashi-horidomecho
Chuo-ku,Tokyo ,103-0012
http://www.itcm.co.jp
Sales Office Tokyo
Tel (81) 3 5640 0724
Fax (81) 3 5640 0741
email y-iwata@itcm.co.jp
Sales Office Osaka
Tel (81) 6 6252 0601
Fax (81) 6 6552 0610
email h-okada@itcm.co.jp
Sales Office Nagoya
Tel (81) 5 2211 3673
Fax (81) 5 2202 0385
Email m-ooshiro@itcm.co.jp
Technology Center
Tel (81) 5 66 83 22 29
UTILITIES
Electrical power 3 x 400 V or 3 x 200 V, 50/60 Hz
Total power consumption 20 kVA
Air pressure 5 - 6 bars, oil free
Laser cooling water Max. 25 l/min, max 16°C, industrial water
Average DI-Water flow for cutting 0.05 l/min, < 0.3 mm, degasified
DI-Water flow for cleaning Max. 1 l/min, DI-water, particles < 0.0003 mm
DIMENSIONS/WEIGHT
Basic machine (W x D) LCS 300: 1100 x 900 mm, 1100 kg
Laser (W x D) 2550 x 650 mm, 900 kg
Water pump (W x D) 1300 x 700 mm, 350 kg
Options
200 V/400 V transformer
Vacuum pump
Water treatment system
Laser chiller
20 m fibre length
Z-axis
Rotary axis
2D-Reference plate 0.001 mm precision
The above specifications are subject to change without notice due to technical
improvement.
The Laser Cutting System incorporates the worldwide patented technology of water
jet guided laser, invented at the Swiss Federal Institute of Technology Lausanne,
Switzerland.
This machine conforms to CE and CDRH regulations.