Académique Documents
Professionnel Documents
Culture Documents
Abstract
Identification of rapid thermal processing parameters is examined to find a more accurate model to predict and control the
temperature of semiconductor wafers during processing. In this paper, a Wiener model is applied to identify the significant dynamics
of an RTP system. A recursive method is developed to simultaneously estimate the model parameters and states with respect to
parameter variation in RTP systems under process noise. The identification result shows that the model’s prediction error was
greatly reduced as compared to a linear model. The proposed method can also be easily applied to model-based adaptive control.
r 2004 Elsevier Ltd. All rights reserved.
Keywords: Identification; Nonlinear models; Kalman filters; Measurement noise; Recursive estimation; Adaptive control
0967-0661/$ - see front matter r 2004 Elsevier Ltd. All rights reserved.
doi:10.1016/j.conengprac.2004.08.001
ARTICLE IN PRESS
682 C. Tian, T. Fujii / Control Engineering Practice 13 (2005) 681–687
Extended Kalman Filter (Ljung, 1979) is applied to indicating static nonlinearity defined by
simultaneously estimate the model parameters and
xkþ1 ¼ Axk þ Buk þ wk ;
states under parameter variation in RTP systems
and process noise. We also explore the implications yk ¼ Cxk þ Duk ; ð1Þ
for the future design of model-based adaptive control zk ¼ jðyk Þ þ vk :
systems.
It is assumed that (1) both w and v are zero-mean
stationary stochastic processes with rational spectral
2. The identification problem of rapid thermal processing density; (2) the nonlinear function jðÞ is differentiable,
and hence it can be approximated by a set of
A small custom RTP system, shown in Fig. 1, was polynomials; (3) the physical parameters in RTP vary
used in identification. In this system, electrical energy as slowly during the processing and within a small range;
system input is supplied to one pot lamp arranged in the and (4) the RTP system was treated as a three-input and
center and two ring cylindrical lamps arranged three-output system in our experiment. Now the
in the middle and edge of the heater, respectively. identification problem is: given the power consumption
Energy transport is achieved both by radiation of each lamp (the model input uk ) and the temperature
through a quartz window onto a thin wafer and by of the wafer (measured output z^ k ¼ ½^zk;1 ; z^k;2 ; z^k;3 ),
reflections off the walls. The low thermal mass of a determine a state space realization ðA B C DÞ and a
single wafer allows the RTP system to rapidly increase parametric estimation of the static nonlinearity. Since it
wafer temperatures; the cold-wall system allows the is impossible to measure the internal signal yk ; let y^ k ¼
wafer to be quickly cooled as well. Three thermocouples ½y^ k;1 ; y^ k;2 ; y^ k;3 be the estimated output of linear sub-
are mounted on the surface of the wafer to measure the model yk in the sequel.
temperature at its center, middle, and edge (the system
output). 3. Extended Kalman filter-based recursive identification
To capture the significant dynamics of this kind of
physical system, we attempted to use a nonlinear Wiener 3.1. Canonical parameterization of the Wiener model
model. The Wiener model is a kind of block-oriented
nonlinear model consisting of a dynamic linear submodel In general, the linear dynamics and static nonlinearity
and a static or memoryless nonlinear block, illustrated of the Wiener model cannot be independently identified
in Fig. 2. The advantages of using this kind of model lie because of the models cascade structure (Billings &
in low computational cost for identification and Fakhouri, 1982). We use a canonical parameterization
suitability for control design. Here the model form is of the two blocks. Since a scale factor can be arbitrarily
chosen as the state space representation of the linear distributed between the linear dynamics and the static
submodel ðA B C DÞ and a nonlinear function jðÞ nonlinearity without affecting the input–output char-
acteristics of the model, the gain can be fixed in one of
them. Let the Wiener model be parameterized in the
pseudo-observability form (Ljung, 1997) of the linear
submodel and the Chebyshev approximation of the
static nonlinearity,
Aðyl Þ ¼ diag½A1 ; A2 ; A3 ;
Bðyl Þ ¼ ½B1 ; B2 ; B3 ;
Cðyl Þ ¼ diag½C1 ; C2 ; C3 ;
Dðyl Þ ¼ 0;
ji ðy^ k;i Þ ¼ g0;i T 0 þ g1;i T 1 þ þ gp 1;i T p 1 ;
i ¼ 1; 2; 3; ð2Þ
6 .. .. . . .. .. 7 6
7
6 . . . . . 7 6 7
Ai ¼ 6 7; Bi ¼ 6 . 7;
wk vk 6 7 6 . 7
40 0 0 1 5 4 . 5
uk Dynamic yk Static zk
linear nonlinear
and yl denotes the parameters of the linear block, linearity of the model, the experiment was designed so
gq;i ; ðq ¼ 0; 1; . . . ; p 1Þ the coefficients of the polyno- that the wafer temperature would not vary more than 30
mials, T q ; ðq ¼ 0; 1; . . . ; p 1Þ the Chebyshev polyno- from a reference temperature. From the SVD of the
mials. input–output data, shown in Fig. 4, we chose six as the
order of the linear submodel and empirically let the
T0 ¼ 1
indices order of each output signal be the same.
T 1 ¼ y^ k;i Accordingly the quadruple ðA B C DÞ is of the form:
T 2 ¼ 2y^ k;i 1 (" # " # " #)
0 1 0 1 0 1
.. A ¼ diag ; ; ;
.
T qþ2 ðy^ k;i Þ ¼ 2y^ k;i T qþ1 ðy^ k;i Þ T q ðy^ k;i Þ; ðqX0Þ: ð3Þ B ¼ ½
6
3 ;
The Chebyshev polynomials are usually defined on the C ¼ diagf½ 0 1 ; ½ 0 1 ; ½ 0 1 g;
basic domain L ¼ ½ 1; 1: If the output of the linear D ¼ ½03
3 ð5Þ
dynamic submodel y^ k;i is not included in L, then a
previous transformation of y^ k;i from ½y l; y þ l to L is and was calculated using the remaining procedure of the
needed: subspace method. Tenth-order Chebychev polynomials
were used for the approximation of the static non-
y^ 0k;i ¼ ðy^ k;i yÞ=l;
(4) linearity. Although the parameters were valid for only a
where lXðy^ max y^ min Þ=2 and y is the average of y^ k : small temperature range, they provided an initial
estimation of the Wiener model for further identification
over a much wider range of wafer temperatures.
3.2. Preliminary experiments
To help obtain a priori information about the model, 3.3. Direct parameter and state estimation over a wide
such as the delay time, static gain, and the dominating range of wafer temperatures
time constant, we performed a preliminary step-
response experiment at a set of selected temperature Our aim was to be able to conveniently estimate and
points over the whole wafer temperature range. From directly track the model parameters by adjusting them
the results, we consider the dominating time constant until they reached the minimum of the 2-norm of the
variation with respect to the temperature, which is deviation between the system output and the estimate. A
illustrated in Fig. 3 and is similar to that of (Cho, systematic approach to this is to use the Extended
Paulraj & Kailath, 1994), the main nonlinearity of the Kalman Filter (EKF) (Ljung, 1979).
RTP system. It will lead to a significant model The EKF is based on a linearization of the state
prediction error when using a linear model to predict equations at each time step and the use of linear
the wafer temperature over a large operating tempera- estimation theory (Kalman filter). For the Wiener
ture range. model, this means linearizing the static nonlinearity
Based on the above preliminary step-response experi- jðÞ at each time step with respect to the output of the
ment, the initial parameter values of the Wiener model linear dynamic block:
and the order of the dynamic linear submodel can be x^ kþ1 ¼ Ax^ k þ Buk þ Mk ðzk Cj x^ k Þ;
obtained by linear system identification using the
x^ 0 ¼ 0; ð6Þ
subspace method (Overschee & Moor, 1996). To ensure
3
Temperature
250
2
200 1
0
150
-1
-2
100
-3
50 -4
150 200 250 300 350 400 450 500 550 600 0 2 4 6 8 10 12 14 16
Time Constant (sec) Model order
Fig. 3. Time constant with respect to temperature at the wafer center. Fig. 4. Singular value decomposition of the input–output data.
ARTICLE IN PRESS
684 C. Tian, T. Fujii / Control Engineering Practice 13 (2005) 681–687
Time updating: 0
up to zk 1 : -0.7
x^ kjk is the updated estimate based on the last 0 2000 4000 6000 8000 10000 12000 14000
time
measurement zk :
Z is a step size for adjusting the convergence of the Fig. 5. The updating of the independent parameter in matrix A.
parameters.
E½vðtÞvðtÞT ¼ Rdðt tÞ;
E½wðtÞwðtÞT ¼ Qdðt tÞ Table 1
Comparison of ARX model and Wiener model
and the process noise covariance matrices Q are also
updated, since a large (or small) gain implies that the Performance function
system is sensitive (or insensitive), thus, the process
Linear ARX model 1.9675e+003
noise will have a strong (or weak) influence on the Wiener model 1.7635e+002
output.
500
The dynamics between the three lamps and the wafer
400
temperatures were tested over a large operating tem- Center
perature range from 350 to 600 using a small custom 300
0 2000 4000 6000 8000 10000 12000 14000
RTP system. PRBS (pseudo-random binary sequence) time
700
signals were designed as input signals based on
600
preliminary experiments. The average switch time of
temperature
the PRBS signals was 350 s, leaving enough time for a 500
model. This will allow a linear control technique to be a linear adaptive regulator is designed to control the
applied by using state feedback. A block diagram of the output of a linear subsystem with respect to the
control of Wiener-type systems is shown in Fig. 9, where parameter variation in the RTP system. The details of
controller design and its analysis are left for future
Identification result real output"." model output"-" research.
700
600
temperature
500
400
5. Conclusions
Center
300
0 2000 4000 6000 8000 10000 12000 14000 In this paper, a predictive model for RTP has been
time
700 identified using a nonlinear Wiener model with an online
600
EKF-based parameter estimator. It has been shown that
temperature
ref e u zk
ϕ(∗ )−1 Adaptive regulator Linear y
Dynamic
Static
Nonlinearity
-
Wiener system
EKF
x^ k y^ k
Acknowledgements Cho, Y. M., & Gyuyi, P. (1997). Control of rapid thermal processing:
A system theoretic approach. IEEE Transactions on Control
Systems Technology, 5(6), 644–653.
The authors gratefully acknowledge the help provided
Cho, Y. M., & Kailath, T. (1993). Model identification in rapid
by Professor Karl F. MacDorman (Osaka University) thermal processing systems. IEEE Transactions on Semiconductor
through his many useful discussions and constructive Manufacturing, 6(3), 233–245.
comments. Cho, Y. M., Paulraj, A., & Kailath, T. (1994). A contribution to
optimal lamp design in rapid thermal processing. IEEE Transac-
tions on Semiconductor Manufacturing, 7(1), 34–41.
Gyurcsik, R. S., Riley, T. J., & Sorrell, F. Y. (1991). A model for rapid
thermal processing: Achieving uniformity through lamp
References control. IEEE Transactions on Semiconductor Manufacturing,
4(1), 9–13.
Acharya, N., Kirtikar, V., Shooshtarian, S., Hong, D., Timans, P. J., Jin, Y. C., & Hyun, M. D. (2001). A learning approach of wafer
Balakrishnan, K. S., & Knutson, K. L. (2001). Uniformity temperature control in a rapid thermal processing system. IEEE
optimization techniques for rapid thermal processing systems. Transactions on Semiconductor Manufacturing, 14(1), 1–10.
IEEE Transactions on Semiconductor Manufacturing, 14(3), Ljung, L. (1979). Asymptotic behavior of the extended Kalman filter as
218–226. a parameter estimator for linear systems. IEEE Transactions on
Billings, S. A., & Fakhouri, S. Y. (1982). Identification of systems Automatic Control, AC-24, 36–50.
containing linear dynamic and static nonlinear elements. Auto- Ljung, L. (1997). System identification: Theory for the user. Englewood
matica, 18(1), 15–26. Cliffs, NJ: Prentice-Hall.
Bishop, C. M. (1997). Neural networks for pattern recognition. Oxford: Overschee, P. V., & Moor, B. D. (1996). Subspace identification for
Oxford University Press. linear systems. Dordrecht: Kluwer Academic Publishers.
Campbell, S. A., Ahn, K. H., Knutson, K. L., Liu, B. Y. H., & Schetzen, M. (1980). The Volterra and Wiener theories of nonlinear
Leighton, J. D. (1991). Steady-state thermal uniformity systems. New York: Wiley.
and gas flow patterns in a rapid thermal processing Wang, J. X., & Spanos, C. J. (2002). Real-time furnace modeling and
chamber. IEEE Transactions on Semiconductor Manufacturing, diagnostics. IEEE Transactions on Semiconductor Manufacturing,
4(1), 14–19. 15(4), 393–403.