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LCD TV CONTROL BOARD
SPECIFICATION
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MODEL : CV3393CH-O-11
AUTHOR :
CHECKED BY :
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APPROVED BY :
http:// WWW.CULTRAVIEW.COM
HTU UTH
ShenZhen Cultraview Digital Technology CO.,LTD
ITEM
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3. FEATURES ........................................................................................................................... 4
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7. PICTURE .............................................................................................................................. 9
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8. INTERFACE DEFINITION ............................................................................................... 11
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2. GENERAL DESCRIPTION
That product is digital & analogue TV board, can receive the NTSC analogue
television and the ATSC digital television. Apply to the North American ATSC
high-definition TV market.
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QAM (meet the performance requirements of ITU-J83).
Supports USB 2.0 Multimedia Player;supports audio and video play; supports
picture browse.
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Supports 16 Lane V by one interface
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HDMI 1.3/1.4 Compliant; HDCP 1.2 Compliant.
Digital(AC-3)
enhancement
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3. FEATURES
Type TFT-LCD
PANEL
Resolution Max. 3840X2160
Interface 4CH LVDS/ 8 lane V by one
Input Impedance 75Ω
Video System NTSC
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ATV
M, J, 4.43.
Sound System
BTSC/A2
Input Impedance 75Ω
Bandwidth 6MHz
DTV Modulation ATSC:8VSB QAM:64QAM, 256QAM
Video System MPEG 2 MP@HL
Sound System MPEG 1/ layer 1/AC-3
Sync H: 30-75KHz V: 56-75Hz
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PC Video Level 0.7Vp-p@75ohm
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MODE
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Color system
Max 1920X1080@60Hz
PAL/NTSC/SECAM
Video Level 1Vp-p@75ohm
Audio Level 500mV rms
Video Level Y:1Vp-p@75ohm,PbPr:0.7Vp-p@75ohm
YPbPr
Audio Level 500mVrms
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Format 480i, 480p, 576i, 576p, 720p, 1080i, 1080p
HDMI Video Level Standard TMDS
Format 480i,480p,576i,576p,720p,1080i,1080p,4K2K
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PHOTO
The maximum display
JPE resolution is 15360*8640,the
Minimum is 100*100
Sample rate : 8K-48K , Bit
MUSIC MP3 MP3
rate:32K-320K
Special Note:
1)Support hard disk,the maximum storage capacity is 400G
2)Folder in support of the greatest depth is 30
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3)Each folder in support of the largest number of documents is a 5000
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4)Only support single audio channel audio format and dual-audio channel audio
format
Operation Instructions
PS:USB only support PHOTO, MUSIC. The system automatically classified files,
only show the supported files. For example, it only shows JPG files on the PHOTO
mode.
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5. ENVIRONMENTAL CONDITION
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AMP POWER +12V +12V--+26V 2A 100mVp-p
The current of panel, Inverter MHL and extension modules are not included in max
current.
Power Up Timing
POWER
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+5Vstb
HWRESET
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PWR_ON/OFF T2
+5V
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T4
+12V
TIME
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General materials
Including SMT capacitors, SMT resistors, diodes, transistors, MOSFET, connectors,
common inductance, electrolytic capacitor, PCB etc., and having no obvious
changes in appearance or color. Our company has two or three alternative suppliers
with these materials, maybe we will alternative use these materials for follow-up
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mass production due to delivery time, stock or other reasons. We no longer notice
your company the alternative materials used. If necessary, you can apply for using
related materials (mention as above) in samples stage.
(Note: The alternative materials which have been accepted by our materials
confirmation department and PP will enter our system.)
Key materials
Including crystals, LDO , DC-DC, Amplifier, Audio &Video switch, and having obvious
changes in appearance and color of general materials, Our company has two or
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three alternative suppliers with these materials (See following table for detail),
maybe we will alternative use these materials for follow-up mass production due to
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delivery time, stock or other reasons. We will notice your company the alternative
materials used in written form. If necessary, you can apply for using related materials
(mention as above) in samples stage.
Name Main Type Brand Backup Type Brand
BM1117 BM
LDO BL1117 BL
BCD1117 BCD
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24MHz +-20PPM 20PF
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24MHz +-20PPM HC 49US
RS
20PF HC 49US 24MHz +-20PPM 20PF
TJ
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HC 49US
Crystal
16MHz +-10PPM 20PF
RS
16MHz +-10PPM HC 49US
ZG
20PF HC 49US 16MHz +-10PPM 20PF
TJ
HC 49US
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Core materials
Including FLASH, TUNER, and the materials related to change software. Our
company has two or three alternative suppliers with these materials (See following
table for detail), maybe we will alternative use these materials for follow-up mass
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production due to delivery time, stock or other reasons. We will notice your company
in written form and we must get your company confirm whether accept before using
the alternative materials.
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TUNER TDA18274 NXP SI2158 Silicon Labs
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7. PICTURE
TOP VIEW
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FRONT VIEW
Y PB PR CVBS L R
EARPHONE COAX PC AUDIO VGA
YPBPR AV
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SIDE VIEW
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TV USB HDMI1 HDMI2(ARC) HDMI3(MHL)
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8. INTERFACE DEFINITION
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2 GND Ground
3 RX Serial Data Receiver
4 TX Serial Data Transmitter
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3 RX Serial Data Receiver
4 TX
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Serial Data Transmitter
7 GND
Ground
8 GND
9 ON/OFF Power On/Off
10 5VSTB +5V DC Power Supply when Standby
4 GND Ground
5 GND Ground
6 GND Ground
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1 GND
Ground
2 GND
3 ADJ Brightness Adjustment for Panel
4 ON/OFF Back-Light ON/OFF Control for Panel (1:ON/0: OFF)
5 +12V
INVERTER +12V DC Power Supply
6 +12V
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NO. SYMBOL DESCRIPTION
1 GND Ground
2 K7 Key7(Reserved)
3 POWER POWER KEY (AD1)
4 VOL+ VOL+ KEY
5 VOL- VOL- KEY
6 INPUT INPUT KEY (POWER)
7 CH+ CH+ KEY
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8 CH- CH- KEY
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MENU
GND
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MENU KEY (AD0)
Ground
11 IR IR Receiver
12 LED_G Green Indicator
13 LED_R Red Indicator
14 +5V +5V DC Power Supply
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J16. SPEAKER CONNECTOR(4PIN/2.54)
NO. SYMBOL DESCRIPTION
1 ROUT Audio Right channel Output
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2 GND
Ground
3 GND
4 LOUT Audio Left channel Output
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1 GND Ground
2 NC No connection
3 GND Ground
4 VBY15P V-by-One HS Data Lane 15+
5 VBY15N V-by-One HS Data Lane 15-
6 GND Ground
7 GND Ground
8 VBY14P V-by-One HS Data Lane 14+
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9 VBY14N V-by-One HS Data Lane 14-
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GND
GND
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Ground
Ground
12 VBY13P V-by-One HS Data Lane 13+
13 VBY13N V-by-One HS Data Lane 13-
14 GND Ground
15 GND Ground
16 VBY12P V-by-One HS Data Lane 12+
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17 VBY12N V-by-One HS Data Lane 12-
18 GND Ground
19 GND Ground
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26 GND Ground
27 GND Ground
28 VBY9P V-by-One HS Data Lane 9+
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NO. SYMBOL DESCRIPTION
1 SYNC 3D 3D Sync. In Flag
2 NC No connection
3 GND Ground
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4 VBY7P V-by-One HS Data Lane 7+
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VBY7N
GND
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V-by-One HS Data Lane 7-
Ground
7 GND Ground
8 VBY6P V-by-One HS Data Lane 6+
9 VBY6N V-by-One HS Data Lane 6-
10 GND Ground
11 GND Ground
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12 VBY5P V-by-One HS Data Lane 5+
13 VBY5N V-by-One HS Data Lane 5-
14 GND Ground
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15 GND Ground
16 VBY4P V-by-One HS Data Lane 4+
17 VBY4N V-by-One HS Data Lane 4-
18 GND Ground
19 GND Ground
20 VBY3P V-by-One HS Data Lane 3+
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31 GND Ground
32 VBY0P V-by-One HS Data Lane 0+
33 VBY0N V-by-One HS Data Lane 0-
34 GND Ground
35 LOCKN Lock detect
36 HTPDN Hot plug detect
37 GND
38 GND
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39 GND Ground
40 GND
41 GND
42 NC
43 NC
44 NC
45 NC
46 NC
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No connection
47 NC
48
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NC
NC
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50 NC
51 NC
5 NC No connection
6 NC No connection
7 NC No connection
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8 NC No connection
9 NC No connection
10 NC No connection
11 NC No connection
12 NC No connection
13 NC No connection
14 NC No connection
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15 NC No connection
16 NC No connection
17 GND Ground
18 VBY15P V-by-One HS Data Lane 15+
19 VBY15N V-by-One HS Data Lane 15-
20 GND Ground
21 VBY14P V-by-One HS Data Lane 14+
22 VBY14N V-by-One HS Data Lane 14-
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23 GND Ground
24 VBY13P V-by-One HS Data Lane 13+
25 VBY13N V-by-One HS Data Lane 13-
26 GND Ground
27 VBY12P V-by-One HS Data Lane 12+
28 VBY12N V-by-One HS Data Lane 12-
29 GND Ground
30 VBY11P V-by-One HS Data Lane 11+
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31 VBY11N V-by-One HS Data Lane 11-
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33
GND
VBY10P
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Ground
V-by-One HS Data Lane 10+
34 VBY10N V-by-One HS Data Lane 10-
35 GND Ground
36 VBY9P V-by-One HS Data Lane 9+
37 VBY9N V-by-One HS Data Lane 9-
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38 GND Ground
39 VBY8P V-by-One HS Data Lane 8+
40 VBY8N V-by-One HS Data Lane 8-
41 GND Ground
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17 VBY2P V-by-One HS Data Lane 2+
18 VBY2N V-by-One HS Data Lane 2-
19 GND Ground
20 VBY1P V-by-One HS Data Lane 1+
21 VBY1N V-by-One HS Data Lane 1-
22 GND Ground
23 VBY0P V-by-One HS Data Lane 0+
24 VBY0N V-by-One HS Data Lane 0-
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25 GND Ground
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LOCKN
HTPDN
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Lock detect
Hot plug detect
28 GND Ground
29 GND Ground
30 LD_EN H’ = Enable , ‘L’ or NC = Disable
31 Bit_SEL H=10BIT,L=8BIT
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32 NC No connection
33 SCL I2C Data
34 SDA I2C CLK
35 NC No connection
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42 GND Ground
43 NC No connection
44 VIN12
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45 VIN12
46 VIN12
47 VIN12
+12V DC Power Supply
48 VIN12
49 VIN12
50 VIN12
51 VIN12
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9. CONFIGURATION
Board Type 1:
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Board Type 2:
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10. PACKAGING
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10.2 PACKING METHOD
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attend ESD transaction.
When the whole set assemble, it can down pack or side pack, but don't
make the board transform or distort, don't be subjected to heavy pressure.
The hole of each port does not be opened too small, especially the HDMI
port hole, avoid the whole set morphing to cause the extrusion of port when
installing.
The hole of RGB socket is recommended the situation of not using the
screw stationary on the RGB socket to fix on the structure board.
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The connected wire which between the other boards and this board can't be
leaded too long, or affect performance and image quality.
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The whole set inner wires matching reasonable, each connected wire try to
not directly cross the PCB board, especially cross over from the main IC,
avoid affect the whole set EMC performance.
n order to obtain better EMC effect of the whole set, we suggest the LVDS
twisted pair wire between the main board and panel must be tied up well
and try to use shielding wire. If it’s possible, try to put on the magnetic belt
ring on the wire which near the board terminal.
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The HDMI and HDCP on the main board are all passed the related
certifications, but we just provide testing certification of the inner usage
standard. If you need to use legal HDMI and HDCP, please apply related
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12. EXCURSUS
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