Académique Documents
Professionnel Documents
Culture Documents
HEX INVERTER
HEX INVERTER
VCC
LOW POWER SCHOTTKY
14 13 12 11 10 9 8
* * *
* * * J SUFFIX
CERAMIC
1 2 3 4 5 6 7 CASE 632-08
14
GND 1
* OPEN COLLECTOR OUTPUTS
N SUFFIX
PLASTIC
14 CASE 646-06
1
D SUFFIX
SOIC
14
1 CASE 751A-02
ORDERING INFORMATION
SN54LSXXJ Ceramic
SN74LSXXN Plastic
SN74LSXXD SOIC
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
IOH Output HIGH Current 54, 74 100 µA VCC = MIN, VOH = MAX
J SUFFIX
CERAMIC
1 2 3 4 5 6 7 CASE 632-08
14
GND 1
N SUFFIX
PLASTIC
14 CASE 646-06
1
D SUFFIX
SOIC
14
1 CASE 751A-02
ORDERING INFORMATION
SN54LSXXJ Ceramic
SN74LSXXN Plastic
SN74LSXXD SOIC
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
J SUFFIX
CERAMIC
1 2 3 4 5 6 7 CASE 632-08
GND 14
1
N SUFFIX
PLASTIC
14 CASE 646-06
1
D SUFFIX
SOIC
14
1 CASE 751A-02
ORDERING INFORMATION
SN54LSXXJ Ceramic
SN74LSXXN Plastic
SN74LSXXD SOIC
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
SN54 / 74LS13
VCC
14 13 12 11 10 9 8
N SUFFIX
PLASTIC
14 CASE 646-06
1
1 2 3 4 5 6 7 D SUFFIX
SOIC
GND 14
1 CASE 751A-02
SN54 / 74LS14
VCC
14 13 12 11 10 9 8 ORDERING INFORMATION
SN54LSXXJ Ceramic
SN74LSXXN Plastic
SN74LSXXD SOIC
1 2 3 4 5 6 7
GND
3V
VIN 1.6 V
0.8 V
0V
tPHL tPLH
Figure 1. AC Waveforms
5
VCC = 5 V
TA = 25°C
0
0 0.4 0.95 1.2 1.8 2
VIN, INPUT VOLTAGE (VOLTS)
2
TA = 25°C
V T , THRESHOLD VOLTAGE (VOLTS)
VT+
∆ V T, HYSTERESIS (VOLTS)
1.6
1.2
VT–
0.8
∆ VT
0.4
0
4.5 4.75 5 5.25 5.5
VCC, POWER SUPPLY VOLTAGE (VOLTS)
1.9
V T , THRESHOLD VOLTAGE (VOLTS)
1.7 VT+
∆ V T, HYSTERESIS (VOLTS)
1.5
1.3
1.1
0.9 VT–
∆ VT
0.7
– 55° 0° 25° 75° 125°
TA, AMBIENT TEMPERATURE (°C)
J SUFFIX
CERAMIC
1 2 3 4 5 6 7 CASE 632-08
GND 14
1
N SUFFIX
PLASTIC
14 CASE 646-06
1
D SUFFIX
SOIC
14
1 CASE 751A-02
ORDERING INFORMATION
SN54LSXXJ Ceramic
SN74LSXXN Plastic
SN74LSXXD SOIC
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
J SUFFIX
CERAMIC
1 2 3 4 5 6 7 CASE 632-08
14
GND 1
N SUFFIX
PLASTIC
14 CASE 646-06
1
D SUFFIX
SOIC
14
1 CASE 751A-02
ORDERING INFORMATION
SN54LSXXJ Ceramic
SN74LSXXN Plastic
SN74LSXXD SOIC
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
LOGIC SYMBOL
7 1 2 6 3 5
1 2 3 4 5 6 7 8
A B C D LT RBI
B C LT BI / RBO RBI D A GND
PIN NAMES LOADING (Note a)
HIGH LOW BI/
a b c d e f g RBO
A, B, C, D BCD Inputs 0.5 U.L. 0.25 U.L.
RBI Ripple-Blanking Input 0.5 U.L. 0.25 U.L.
LT Lamp-Test Input 0.5 U.L. 0.25 U.L. 13 12 11 10 9 15 14 4
BI / RBO Blanking Input or 0.5 U.L. 0.75 U.L.
Ripple-Blanking Output 1.2 U.L. 2.0 U.L. VCC = PIN 16
a, to g Outputs Open-Collector 15 (7.5) U.L. GND = PIN 8
NOTES:
a) 1 Unit Load (U.L.) = 40 µA HIGH, 1.6 mA LOW.
b) Output current measured at VOUT = 0.5 V
The Output LOW drive factor is 7.5 U.L. for Military (54) and 15 U.L. for Commercial (74) Temperature Ranges.
LOGIC DIAGRAM
a a
b b
B
INPUT
C c c
D
OUTPUT
d d
BLANKING INPUT OR
RIPPLE-BLANKING
OUTPUT e e
f f
LAMP-TEST
INPUT
RIPPLE-BLANKING
INPUT g g
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
TRUTH TABLE
INPUTS OUTPUTS
DECIMAL
OR LT RBI D C B A BI/RBO a b c d e f g NOTE
FUNCTION
0 H H L L L L H L L L L L L H A
1 H X L L L H H H L L H H H H A
2 H X L L H L H L L H L L H L
3 H X L L H H H L L L L H H L
4 H X L H L L H H L L H H L L
5 H X L H L H H L H L L H L L
6 H X L H H L H H H L L L L L
7 H X L H H H H L L L H H H H
8 H X H L L L H L L L L L L L
9 H X H L L H H L L L H H L L
10 H X H L H L H H H H L L H L
11 H X H L H H H H H L L H H L
12 H X H H L L H H L H H H L L
13 H X H H L H H L H H L H L L
14 H X H H H L H H H H L L L L
15 H X H H H H H H H H H H H H
BI X X X X X X L H H H H H H H B
RBI H L L L L L L H H H H H H H C
LT L X X X X X H L L L L L L L D
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
NOTES:
(A) BI/RBO is wire-AND logic serving as blanking Input (BI) and/or ripple-blanking output (RBO). The blanking out (BI) must be open or held
at a HIGH level when output functions 0 through 15 are desired, and ripple-blanking input (RBI) must be open or at a HIGH level if blanking
of a decimal 0 is not desired. X = input may be HIGH or LOW.
(B) When a LOW level is applied to the blanking input (forced condition) all segment outputs go to a LOW level regardless of the state of
any other input condition.
(C) When ripple-blanking input (RBI) and inputs A, B, C, and D are at LOW level, with the lamp test input at HIGH level, all segment outputs
go to a HIGH level and the ripple-blanking output (RBO) goes to a LOW level (response condition).
(D) When the blanking input/ripple-blanking output (BI/RBO) is open or held at a HIGH level, and a LOW level is applied to lamp test input,
all segment outputs go to a LOW level.
AC WAVEFORMS
Figure 1 Figure 2
N SUFFIX
CLEAR PLASTIC
2 (6)
K 14 CASE 646-06
J
3 (10) 14 (7) 1
1 (15)
CLOCK (CP)
D SUFFIX
SOIC
14
1 CASE 751A-02
ORDERING INFORMATION
SN54LSXXJ Ceramic
SN74LSXXN Plastic
SN74LSXXD SOIC
MODE SELECT — TRUTH TABLE
INPUTS OUTPUTS
OPERATING MODE
CD J K Q Q
LOGIC SYMBOL
Reset (Clear) L X X L H
Toggle H h h q q
Load “0” (Reset) H l h L H
Load “1” (Set) H h l H L 14 J Q 12 7 J Q 9
Hold H l l q q
1 CP 5 CP
H, h = HIGH Voltage Level
L, I = LOW Voltage Level
3 K C Q 13 10 K C Q 8
X = Don’t Care D D
l, h (q) = Lower case letters indicate the state of the referenced input (or output) one set-up time
l, h (q) = prior to the HIGH to LOW clock transition. 2 6
VCC = PIN 4
GND = PIN 11
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
J, K 20
Clear 60 µA VCC = MAX, VIN = 2.7 V
Clock 80
IIH Input HIGH Current
J, K 0.1
Clear 0.3 mA VCC = MAX, VIN = 7.0 V
Clock 0.4
J, K – 0.4
IIL Input LOW Current mA VCC = MAX, VIN = 0.4 V
Clear, Clock – 0.8
IOS Short Circuit Current (Note 1) – 20 –100 mA VCC = MAX
ICC Power Supply Current 6.0 mA VCC = MAX
Note 1: Not more than one output should be shorted at a time, nor for more than 1 second.
AC WAVEFORMS
J or K * 1.3 V
th(L) = 0 th(H) = 0
ts(L) ts(H)
tW(L)
CP
1.3 V 1.3 V 1.3 V
tW(H)
1
tPHL fMAX tPLH
Q
1.3 V 1.3 V
tPLH tPHL
1.3 V 1.3 V
Q
*The shaded areas indicate when the input is permitted to change for predictable output performance.
tW
SET
1.3 V 1.3 V
tW
CLEAR
1.3 V 1.3 V
tPLH tPHL
1.3 V 1.3 V
Q
tPHL tPLH
Q
1.3 V 1.3 V
SN54 / 74LS75
N SUFFIX
PLASTIC
16 CASE 648-08
1 2 3 4 5 6 7 8
Q0 D0 D1 E2–3 VCC D2 D3 Q3 1
Q0 Q1 E0–1 GND NC Q2 Q3
D SUFFIX
14 13 12 11 10 9 8
SOIC
16
1 CASE 751B-03
SN54 / 74LS77
J SUFFIX
CERAMIC
1 2 3 4 5 6 7 CASE 632-08
14
D0 D1 E2–3 VCC D2 D3 NC 1
TRUTH TABLE
(Each latch)
ORDERING INFORMATION
tn tn + 1 NOTES:
tn = bit time before enable SN54LSXXJ Ceramic
D Q negative-going transition SN74LSXXN Plastic
H H tn+1 = bit time after enable SN74LSXXD SOIC
negative-going transition
L L
LOGIC SYMBOLS
SN54/74LS75 SN54/74LS77
2 3 6 7 1 2 5 6
D0 D1 D2 D3 D0 D1 D2 D3
13 E0–1 12 E0–1 VCC = PIN 4
VCC = PIN 5
E2–3 E2–3 GND = PIN 11
4 GND = PIN 12 3
NC = PIN 7, 10
Q0 Q0 Q1 Q1 Q2 Q2 Q3 Q3 Q0 Q1 Q2 Q3
16 1 15 14 10 11 9 8 14 13 9 8
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
D Input – 0.4
IIL Input LOW Current mA VCC = MAX, VIN = 0.4 V
E Input –1.6
IOS Short Circuit Current (Note 1) – 20 –100 mA VCC = MAX
ICC Power Supply Current 12 mA VCC = MAX
Note 1: Not more than one output should be shorted at a time, nor for more than 1 second.
tPLH 12 20
Propagation Delay, Data to Q ns
tPHL 7.0 15 50V
VCC = 5.0
tPLH 15 27 CL = 15 pF
Propagation Delay, Enable to Q ns
tPHL 14 25
tPLH 16 30
Propagation Delay, Enable to Q ns
tPHL 7.0 15
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
D Input – 0.4
IIL Input LOW Current mA VCC = MAX, VIN = 0.4 V
E Input –1.6
IOS Short Circuit Current (Note 1) – 20 –100 mA VCC = MAX
ICC Power Supply Current 13 mA VCC = MAX
Note 1: Not more than one output should be shorted at a time, nor for more than 1 second.
LOGIC DIAGRAM
DATA
Q (SN54/74LS75 ONLY)
Q
ENABLE
TO OTHER LATCH
AC WAVEFORMS
D 1.3 V 1.3 V
ts th
tPHL tPLH
DEFINITION OF TERMS
SETUP TIME (ts) — is defined as the minimum time required for the correct logic level to be present at the logic input prior to the
clock transition from HIGH-to-LOW in order to be recognized and transferred to the outputs.
HOLD TIME (th) — is defined as the minimum time following the clock transition from HIGH-to-LOW that the logic level must be
maintained at the input in order to ensure continued recognition. A negative HOLD TIME indicates that the correct logic level may
be released prior to the clock transition from HIGH-to-LOW and still be recognized.
NOTE:
The Flatpak version has the ORDERING INFORMATION
same pinouts (Connection
Diagram) as the Dual In-Line SN54LSXXJ Ceramic
Package. SN74LSXXN Plastic
SN74LSXXD SOIC
1 2 3 4 5 6 7 8
B3 IA<B IA=B IA>B OA>B OA=B OA<B GND
LOGIC SYMBOL
LOGIC DIAGRAM
A3 (15)
B3
(1)
(5)
OA>B
(13)
A2
B2
(14)
(2)
A<B (6)
(3) OA=B
A=B (4)
A>B
(12)
A1
B1
(11)
(7)
OA<B
(10)
A0
B0
(9)
TRUTH TABLE
CASCADING
COMPARING INPUTS OUTPUTS
INPUTS
A3,B3 A2,B2 A1,B1 A0,B0 IA>B IA<B IA=B OA>B OA<B OA=B
A3>B3 X X X X X X H L L
A3<B3 X X X X X X L H L
A3=B3 A2>B2 X X X X X H L L
A3=B3 A2<B2 X X X X X L H L
A3=B3 A2=B2 A1>B1 X X X X H L L
A3=B3 A2=B2 A1<B1 X X X X L H L
A3=B3 A2=B2 A1=B1 A0>B0 X X X H L L
A3=B3 A2=B2 A1=B1 A0<B0 X X X L H L
A3=B3 A2=B2 A1=B1 A0=B0 H L L H L L
A3=B3 A2=B2 A1=B1 A0=B0 L H L L H L
A3=B3 A2=B2 A1=B1 A0=B0 X X H L L H
H = HIGH Level
A3=B3 A2=B2 A1=B1 A0=B0 H H L L L L
L = LOW Level
A3=B3 A2=B2 A1=B1 A0=B0 L L L H H L
X = IMMATERIAL
A n3
A n2
A n1
B n3
B n2
B n1
An
Bn
A0 A1 A2 A3 B0 B1 B2 B3
A0 A1 A2 A3 B0 B1 B2 B3 A0 A1 A2 A3 B0 B1 B2 B3
L IA > B OA > B IA > B OA > B A>B
L IA < B SN54/74LS85 OA < B IA < B SN54/74LS85 OA < B A<B
H IA = B OA = B IA = B OA = B A=B
L = LOW LEVEL
H = HIGH LEVEL
APPLICATIONS
Figure 2 shows a high speed method of comparing two 24-bit words with only two levels of device delay. With the technique
shown in Figure 1, six levels of device delay result when comparing two 24-bit words. The parallel technique can be expanded
to any number of bits, see Table 1.
Table 1
WORD LENGTH NUMBER OF PKGS. NOTE:
1 – 4 Bits 1 The SN54/74LS85 can be used as a 5-bit comparator
only when the outputs are used to drive the A0–A3 and
5 – 24 Bits 2–6
B0–B3 inputs of another SN54/74LS85 as shown in
25 – 120 Bits 8 – 31 Figure 2 in positions #1, 2, 3, and 4.
INPUTS
(LSB) (MSB)
A0 A1 A2 A3 B0 B1 B2 B3 A20 A21 A22 A23 B20 B21 B22 B23
A0 A1 A2 A3 B0 B1 B2 B3 A0 A1 A2 A3 B0 B1 B2 B3
L IA > B OA > B A19 IA > B OA > B
L IA < B #5 OA < B B19 IA < B #1 OA < B
H IA = B OA = B L IA = B OA = B NC
INPUTS
A5 A6 A7 A8 B5 B6 B7 B8 A10 A11 A12 A13 B10 B11 B12 B13 A15 A16 A17 A18 B15 B16 B17 B18
A0 A1 A2 A3 B0 B1 B2 B3 A0 A1 A2 A3 B0 B1 B2 B3 A0 A1 A2 A3 B0 B1 B2 B3
A4 IA > B OA > B A9 IA > B OA > B A14 IA > B OA > B
B4 IA < B #4 OA < B B9 IA < B #3 OA < B B14 IA < B #2 OA < B
L IA = B OA = B NC L IA = B OA = B NC L IA = B OA = B NC
A0 A1 A2 A3 B0 B1 B2 B3
IA > B OA > B
IA < B #6 OA < B OUTPUTS
IA = B OA = B
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 25
2.5 35
3.5 V VCC = MIN
MIN,, IOH = MAX,
MAX, VIN = VIH
VOH O
Output HIGH Voltage
V l
74 2.7 3.5 V or VIL per Truth Table
tPLH Any A or B to A = B 27 45 ns
tPHL 23 45
AC WAVEFORMS
Figure 3 Figure 4
QUAD 2-INPUT
EXCLUSIVE OR GATE
LOW POWER SCHOTTKY
VCC
14 13 12 11 10 9 8
J SUFFIX
CERAMIC
CASE 632-08
14
1 2 3 4 5 6 7 1
GND
N SUFFIX
PLASTIC
14 CASE 646-06
1
TRUTH TABLE
IN OUT
A B Z D SUFFIX
L L L SOIC
14
1 CASE 751A-02
L H H
H L H
H H L
ORDERING INFORMATION
SN54LSXXJ Ceramic
SN74LSXXN Plastic
SN74LSXXD SOIC
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
LOGIC SYMBOL
1 2
MS
14 CP0 14 CP0 14 CP0
1 CP1 1 CP1 1 CP1
MR Q0 Q1 Q2 Q3 MR Q0 Q1 Q2 Q3 MR Q0 Q1 Q2 Q3
1 2 1 2 1 2
2 3 12 9 8 11 6 7 12 11 9 8 2 3 12 9 8 11
VCC = PIN 5 VCC = PIN 5 VCC = PIN 5
GND = PIN 10 GND = PIN 10 GND = PIN 10
NC = PINS 4, 13 NC = PINS 2, 3, 4, 13 NC = PIN 4, 6, 7, 13
NC 2 13 NC
J Q J Q J Q J Q
14
CP0 NC 3 12 Q0
CP CP CP CP
KC Q KC Q KC Q KC Q NC 4 11 Q1
D D D D
VCC 5 10 GND
1
CP1 MR1 6 9 Q2
6
MR1 12 11 9 8 MR2 7 8 Q3
MR2
7 Q0 Q1 Q2 Q3
NC = NO INTERNAL CONNECTION
= PIN NUMBERS NOTE:
VCC = PIN 5 The Flatpak version has the same
GND = PIN 10 pinouts (Connection Diagram) as
the Dual In-Line Package.
FUNCTIONAL DESCRIPTION
The LS90, LS92, and LS93 are 4-bit ripple type Decade, C. Divide-By-Two and Divide-By-Five Counter — No external
Divide-By-Twelve, and Binary Counters respectively. Each interconnections are required. The first flip-flop is used as a
device consists of four master/slave flip-flops which are binary element for the divide-by-two function (CP0 as the
internally connected to provide a divide-by-two section and a input and Q0 as the output). The CP1 input is used to obtain
divide-by-five (LS90), divide-by-six (LS92), or divide-by-eight binary divide-by-five operation at the Q3 output.
(LS93) section. Each section has a separate clock input which
initiates state changes of the counter on the HIGH-to-LOW
LS92
clock transition. State changes of the Q outputs do not occur
simultaneously because of internal ripple delays. Therefore, A. Modulo 12, Divide-By-Twelve Counter — The CP1 input
decoded output signals are subject to decoding spikes and must be externally connected to the Q0 output. The CP0 in-
should not be used for clocks or strobes. The Q0 output of put receives the incoming count and Q3 produces a sym-
each device is designed and specified to drive the rated metrical divide-by-twelve square wave output.
fan-out plus the CP1 input of the device. B. Divide-By-Two and Divide-By-Six Counter —No external
A gated AND asynchronous Master Reset (MR1 • MR2) is interconnections are required. The first flip-flop is used as a
provided on all counters which overrides and clocks and binary element for the divide-by-two function. The CP1 in-
resets (clears) all the flip-flops. A gated AND asynchronous put is used to obtain divide-by-three operation at the Q1
Master Set (MS1 • MS2) is provided on the LS90 which and Q2 outputs and divide-by-six operation at the Q3 out-
overrides the clocks and the MR inputs and sets the outputs to put.
nine (HLLH).
Since the output from the divide-by-two section is not
internally connected to the succeeding stages, the devices LS93
may be operated in various counting modes. A. 4-Bit Ripple Counter — The output Q0 must be externally
connected to input CP1. The input count pulses are applied
LS90 to input CP0. Simultaneous divisions of 2, 4, 8, and 16 are
A. BCD Decade (8421) Counter — The CP1 input must be ex- performed at the Q0, Q1, Q2, and Q3 outputs as shown in
ternally connected to the Q0 output. The CP0 input receives the truth table.
the incoming count and a BCD count sequence is pro-
B. 3-Bit Ripple Counter— The input count pulses are applied
duced.
to input CP1. Simultaneous frequency divisions of 2, 4, and
B. Symmetrical Bi-quinary Divide-By-Ten Counter — The Q3 8 are available at the Q1, Q2, and Q3 outputs. Independent
output must be externally connected to the CP0 input. The use of the first flip-flop is available if the reset function coin-
input count is then applied to the CP1 input and a divide-by- cides with reset of the 3-bit ripple-through counter.
ten square wave is obtained at output Q0.
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
Q 1.3 V 1.3 V
Figure 1
*The number of Clock Pulses required between the tPHL and tPLH measurements can be determined from the appropriate Truth Tables.
CP 1.3 V CP 1.3 V
tPHL tPLH
Q0 • Q3
Q 1.3 V (LS90) 1.3 V
Figure 2 Figure 3
LOGIC SYMBOL
1 2
MS
14 CP0 14 CP0 14 CP0
1 CP1 1 CP1 1 CP1
MR Q0 Q1 Q2 Q3 MR Q0 Q1 Q2 Q3 MR Q0 Q1 Q2 Q3
1 2 1 2 1 2
2 3 12 9 8 11 6 7 12 11 9 8 2 3 12 9 8 11
VCC = PIN 5 VCC = PIN 5 VCC = PIN 5
GND = PIN 10 GND = PIN 10 GND = PIN 10
NC = PINS 4, 13 NC = PINS 2, 3, 4, 13 NC = PIN 4, 6, 7, 13
NC 2 13 NC
J Q J Q J Q J Q
14
CP0 NC 3 12 Q0
CP CP CP CP
KC Q KC Q KC Q KC Q NC 4 11 Q1
D D D D
VCC 5 10 GND
1
CP1 MR1 6 9 Q2
6
MR1 12 11 9 8 MR2 7 8 Q3
MR2
7 Q0 Q1 Q2 Q3
NC = NO INTERNAL CONNECTION
= PIN NUMBERS NOTE:
VCC = PIN 5 The Flatpak version has the same
GND = PIN 10 pinouts (Connection Diagram) as
the Dual In-Line Package.
FUNCTIONAL DESCRIPTION
The LS90, LS92, and LS93 are 4-bit ripple type Decade, C. Divide-By-Two and Divide-By-Five Counter — No external
Divide-By-Twelve, and Binary Counters respectively. Each interconnections are required. The first flip-flop is used as a
device consists of four master/slave flip-flops which are binary element for the divide-by-two function (CP0 as the
internally connected to provide a divide-by-two section and a input and Q0 as the output). The CP1 input is used to obtain
divide-by-five (LS90), divide-by-six (LS92), or divide-by-eight binary divide-by-five operation at the Q3 output.
(LS93) section. Each section has a separate clock input which
initiates state changes of the counter on the HIGH-to-LOW
LS92
clock transition. State changes of the Q outputs do not occur
simultaneously because of internal ripple delays. Therefore, A. Modulo 12, Divide-By-Twelve Counter — The CP1 input
decoded output signals are subject to decoding spikes and must be externally connected to the Q0 output. The CP0 in-
should not be used for clocks or strobes. The Q0 output of put receives the incoming count and Q3 produces a sym-
each device is designed and specified to drive the rated metrical divide-by-twelve square wave output.
fan-out plus the CP1 input of the device. B. Divide-By-Two and Divide-By-Six Counter —No external
A gated AND asynchronous Master Reset (MR1 • MR2) is interconnections are required. The first flip-flop is used as a
provided on all counters which overrides and clocks and binary element for the divide-by-two function. The CP1 in-
resets (clears) all the flip-flops. A gated AND asynchronous put is used to obtain divide-by-three operation at the Q1
Master Set (MS1 • MS2) is provided on the LS90 which and Q2 outputs and divide-by-six operation at the Q3 out-
overrides the clocks and the MR inputs and sets the outputs to put.
nine (HLLH).
Since the output from the divide-by-two section is not
internally connected to the succeeding stages, the devices LS93
may be operated in various counting modes. A. 4-Bit Ripple Counter — The output Q0 must be externally
connected to input CP1. The input count pulses are applied
LS90 to input CP0. Simultaneous divisions of 2, 4, 8, and 16 are
A. BCD Decade (8421) Counter — The CP1 input must be ex- performed at the Q0, Q1, Q2, and Q3 outputs as shown in
ternally connected to the Q0 output. The CP0 input receives the truth table.
the incoming count and a BCD count sequence is pro-
B. 3-Bit Ripple Counter— The input count pulses are applied
duced.
to input CP1. Simultaneous frequency divisions of 2, 4, and
B. Symmetrical Bi-quinary Divide-By-Ten Counter — The Q3 8 are available at the Q1, Q2, and Q3 outputs. Independent
output must be externally connected to the CP0 input. The use of the first flip-flop is available if the reset function coin-
input count is then applied to the CP1 input and a divide-by- cides with reset of the 3-bit ripple-through counter.
ten square wave is obtained at output Q0.
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
Q 1.3 V 1.3 V
Figure 1
*The number of Clock Pulses required between the tPHL and tPLH measurements can be determined from the appropriate Truth Tables.
CP 1.3 V CP 1.3 V
tPHL tPLH
Q0 • Q3
Q 1.3 V (LS90) 1.3 V
Figure 2 Figure 3
TL/F/6386 – 1
Order Number DM74LS123M or DM74LS123N
See NS Package Number M16A or N16E
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
VOH High Level Output VCC e Min, IOH e Max
2.7 3.4 V
Voltage VIL e Max, VIH e Min
VOL Low Level Output VCC e Min, IOL e Max
0.35 0.5
Voltage VIL e Max, VIH e Min V
IOL e 4 mA, VCC e Min 0.25 0.4
II Input Current @ Max VCC e Max, VI e 7V
0.1 mA
Input Voltage
IIH High Level Input Current VCC e Max, VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max, VI e 0.4V b 0.4 mA
IOS Short Circuit VCC e Max b 20 b 100 mA
Output Current (Note 2)
ICC Supply Current VCC e Max (Notes 3,4 and 5) 12 20 mA
Note 1: All typicals are at VCC e 5V, TA e 25§ C.
Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second.
Note 3: Quiescent ICC is measured (after clearing) with 2.4V applied to all clear and A inputs, B inputs grounded, all outputs open, CEXT e 0.02 mF, and
REXT e 25 kX.
Note 4: ICC is measured in the triggered state with 2.4V applied to all clear and B inputs, A inputs grounded, all outputs open, CEXT e 0.02 mF, and REXT e 25 kX.
Note 5: With all outputs open and 4.5V applied to all data and clear inputs, ICC is measured after a momentary ground, then 4.5V is applied to the clock.
Note 6: TA e 25§ C and VCC e 5V.
2
Switching Characteristics at VCC e 5V and TA e 25§ C
RL e 2 kX
From (Input) CL e 15pF CL e 15pF
Symbol Parameters Units
To (Output) CEXT e 0 pF, REXT e 5 kX CEXT e 1000 pF, REXT e 10 KX
Min Max Min Max
tPLH Propagation Delay Time
A to Q 33 ns
Low to High Level Output
tPLH Propagation Delay Time
B to Q 44 ns
Low to High Level Output
tPHL Propagation Delay Time
A to Q 45 ns
High to Low Level Output
tPHL Propagation Delay Time
B to Q 56 ns
High to Low Level Output
tPLH Propagation Delay Time
Clear to Q 45 ns
Low to High Level Output
tPHL Propagation Delay Time
Clear to Q 27 ns
High to Low Level Output
tWQ(Min) Minimum Width of Pulse
A or B to Q 200 ns
at Output Q
tW(out) Output Pulse Width A or B to Q 4 5 ms
Operating Rules
1. An external resistor (RX) and an external capacitor (CX) 3. For CX ll 1000 pF the output pulse width (TW) is de-
are required for proper operation. The value of CX may fined as follows:
vary from 0 to any necessary value. For small time con- TW e KRX CX
stants high-grade mica, glass, polypropylene, polycarbon- where [RX is in kX]
ate, or polystyrene material capacitors may be used. For
[CX is in pF]
large time constants use tantalum or special aluminum
capacitors. If the timing capacitors have leakages ap- [TW is in ns]
proaching 100 nA or if stray capacitance from either ter- K & 0.37
minal to ground is greater than 50 pF the timing equations 4. The multiplicative factor K is plotted as a function of CX
may not represent the pulse width the device generates. below for design considerations:
2. When an electrolytic capacitor is used for CX a switching
diode is often required for standard TTL one-shots to pre-
vent high inverse leakage current. This switching diode is
not needed for the ’LS123 one-shot and should not be
used. In general the use of the switching diode is not
recommended with retriggerable operation.
Furthermore, if a polarized timing capacitor is used on the
’LS123 the negative terminal of the capacitor should be
connected to the ‘‘CEXT’’ pin of the device (Figure 1 ).
TL/F/6386 – 2
FIGURE 2
TL/F/6386 – 8
FIGURE 1
3
Operating Rules (Continued)
5. For CX k 1000 pF see Figure 3 for TW vs CX family
curves with RX as a parameter:
TL/F/6386 – 7
FIGURE 7
9. Under any operating condition CX and RX must be kept
TL/F/6386 – 3 as close to the one-shot device pins as possible to mini-
FIGURE 3 mize stray capacitance, to reduce noise pick-up, and to
6. To obtain variable pulse widths by remote trimming, the reduce I-R and Ldi/dt voltage developed along their
following circuit is recommended: connecting paths. If the lead length from CX to pins (6)
and (7) or pins (14) and (15) is greater than 3 cm, for
example, the output pulse width might be quite different
from values predicted from the appropriate equations. A
non-inductive and low capacitive path is necessary to
ensure complete discharge of CX in each cycle of its
operation so that the output pulse width will be accurate.
TL/F/6386 – 4
10. The CEXT pins of this device are internally connected to
FIGURE 4 the internal ground. For optimum system performance
Note: ‘‘Rremote’’ should be as close to the device pin as possible. they should be hard wired to the system’s return ground
7. The retriggerable pulse width is calculated as shown be- plane.
low: 11. VCC and ground wiring should conform to good high-fre-
T e TW a tPLH e K c RX c CX a tPLH quency standards and practices so that switching tran-
The retriggered pulse width is equal to the pulse width sients on the VCC and ground return leads do not cause
plus a delay time period (Figure 5). interaction between one-shots. A 0.01 mF to 0.10 mF
bypass capacitor (disk ceramic or monolithic type) from
VCC to ground is necessary on each device. Further-
more, the bypass capacitor should be located as close
to the VCC-pin as space permits.
For further detailed device characteristics and output performance
please refer to the NSC one-shot application note AN-372.
TL/F/6386 – 5
FIGURE 5
8. Output pulse width variation versus VCC and tempera-
tures: Figure 6 depicts the relationship between pulse
width variation versus VCC, and Figure 7 depicts pulse
width variation versus temperatures.
TL/F/6386 – 6
FIGURE 6
4
Physical Dimensions inches (millimeters)
5
DM74LS123 Dual Retriggerable One-Shot
with Clear and Complementary Outputs
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
SN54/74LS125A
QUAD 3-STATE BUFFERS SN54/74LS126A
VCC E D O E D O
14 13 12 11 10 9 8
QUAD 3-STATE BUFFERS
LOW POWER SCHOTTKY
1 2 3 4 5 6 7
E D O E D O GND
LS125A J SUFFIX
CERAMIC
CASE 632-08
VCC E D O E D O 14
1
14 13 12 11 10 9 8
N SUFFIX
PLASTIC
14 CASE 646-06
1
1 2 3 4 5 6 7
E D O E D O GND
D SUFFIX
LS126A SOIC
14
1 CASE 751A-02
TRUTH TABLES
LS125A LS126A
ORDERING INFORMATION
INPUTS INPUTS
SN54LSXXXJ Ceramic
E D OUTPUT E D OUTPUT
SN74LSXXXN Plastic
L L L H L L SN74LSXXXD SOIC
L H H H H H
H X (Z) L X (Z)
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.4 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.4 V or VIL per Truth Table
Output
p Enable Time LS125A 15 25
tPZL ns Figures 3
3, 5
to LOW Level LS126A 21 35
Output
p Disable Time LS125A 20
tPHZ ns Figures 4
4, 5
from HIGH Level LS126A 25 VCC = 5.0
50V
CL = 5.0
5 0 pF
Output
p Disable Time LS125A 20 RL = 667 Ω
tPLZ ns FIgures 3
3, 5
from LOW Level LS126A 25
VIN VIN
1.3 V 1.3 V 1.3 V 1.3 V
VOUT
1.3 V 1.3 V 1.3 V 1.3 V
VOUT
Figure 1 Figure 2
VE VE
Figure 3 Figure 4
VCC
RL
SW1
TO OUTPUT
UNDER TEST
5 kΩ
CL SW2
Figure 5
SWITCH POSITIONS
SYMBOL SW1 SW2
tPZH Open Closed
tPZL Closed Open
tPLZ Closed Closed
tPHZ Closed Closed
1 2 3 4 5 6 7 8 D SUFFIX
Ea A0a A1a O0a O1a O2a O3a GND SOIC
16
1 CASE 751B-03
PIN NAMES LOADING (Note a)
HIGH LOW
A0, A1 Address Inputs 0.5 U.L. 0.25 U.L. ORDERING INFORMATION
E Enable (Active LOW) Input 0.5 U.L. 0.25 U.L. SN54LSXXXJ Ceramic
O0 – O 3 Active LOW Outputs (Note b) 10 U.L. 5 (2.5) U.L. SN74LSXXXN Plastic
NOTES: SN74LSXXXD SOIC
a) 1 TTL Unit Load (U.L.) = 40 µA HIGH/1.6 mA LOW.
b) The Output LOW drive factor is 2.5 U.L. for Military (54) and 5 U.L. for Commercial (74)
Temperature Ranges.
LOGIC SYMBOL
LOGIC DIAGRAM
1 2 3 15 14 13
Ea A0a A1a Eb A0b A1b
1 2 3 15 14 13
E A0 A1 E A0 A1
DECODER a DECODER b
O0 O1 O2 O3 O0 O1 O2 O3
VCC = PIN 16 4 5 6 7 12 11 10 9
GND = PIN 8
= PIN NUMBERS
VCC = PIN 16
GND = PIN 8
4 5 6 7 12 11 10 9
FUNCTIONAL DESCRIPTION
The LS139 is a high speed dual 1-of-4 decoder/demultiplex- demultiplexer application.
er fabricated with the Schottky barrier diode process. The Each half of the LS139 generates all four minterms of two
device has two independent decoders, each of which accept variables. These four minterms are useful in some applica-
two binary weighted inputs (A0, A1) and provide four mutually tions, replacing multiple gate functions as shown in Fig. a, and
exclusive active LOW outputs (O0 – O3). Each decoder has an thereby reducing the number of packages required in a logic
active LOW Enable (E). When E is HIGH all outputs are forced network.
HIGH. The enable can be used as the data input for a 4-output
E E
A0 O0 A0 O0
A1 A1
TRUTH TABLE
E E
INPUTS OUTPUTS A0 O1 A0 O1
E A0 A1 O0 O1 O2 O3 A1 A1
E E
H X X H H H H
A0 O2 A0 O2
L L L L H H H A1 A1
L H L H L H H
L L H H H L H E E
A0 O3 A0 O3
L H H H H H L
A1 A1
H = HIGH Voltage Level
L = LOW Voltage Level
X = Don’t Care Figure a
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 25
2.5 35
3.5 V MIN,, IOH = MAX,
VCC = MIN MAX, VIN = VIH
VOH O
Output HIGH Voltage
V l
74 2.7 3.5 V or VIL per Truth Table
AC WAVEFORMS
Figure 1 Figure 2
J SUFFIX
CERAMIC
CASE 620-09
CONNECTION DIAGRAM DIP (TOP VIEW) 16
1
VCC I4 I5 I6 I7 S0 S1 S2
16 15 14 13 12 11 10 9
N SUFFIX
PLASTIC
16 CASE 648-08
1
1 2 3 4 5 6 7 8
I3 I2 I1 I0 Z Z E GND
D SUFFIX
SOIC
16
1 CASE 751B-03
ORDERING INFORMATION
SN54LSXXXJ Ceramic
SN74LSXXXN Plastic
PIN NAMES LOADING (Note a) SN74LSXXXD SOIC
HIGH LOW
S0 – S2 Select Inputs 0.5 U.L. 0.25 U.L.
E Enable (Active LOW) Input 0.5 U.L. 0.25 U.L. LOGIC SYMBOL
I0 – I7 Multiplexer Inputs 0.5 U.L. 0.25 U.L.
Z Multiplexer Output (Note b) 10 U.L. 5 (2.5) U.L.
Z Complementary Multiplexer Output 10 U.L. 5 (2.5) U.L. 7 4 3 2 1 15 14 13 12
(Note b)
NOTES: E I0 I1 I2 I3 I4 I5 I6 I7
a) 1 TTL Unit Load (U.L.) = 40 µA HIGH/1.6 mA LOW. 11 S0
b) The Output LOW drive factor is 2.5 U.L. for Military (54) and 5 U.L. for Commercial (74) 10 S1
Temperature Ranges. 9 S2
Z Z
6 5
VCC = PIN 16
GND = PIN 8
LOGIC DIAGRAM
I0 I1 I2 I3 I4 I5 I6 I7
9 4 3 2 1 15 14 13 12
S2
10
S1
11
S0
7
E
VCC = PIN 16
GND = PIN 8 6 5
= PIN NUMBERS
Z Z
FUNCTIONAL DESCRIPTION
The LS151 is a logical implementation of a single pole, Z = E ⋅ (I0 ⋅ S0 ⋅ S1 ⋅ S2 + ⋅ I1 ⋅ S0 ⋅ S1 ⋅ S2 + I2 ⋅ S0 ⋅ S1 ⋅ S2
8-position switch with the switch position controlled by the + I3 ⋅ S0 ⋅ S1 ⋅ S2 + I4 ⋅ S0 ⋅ S1 ⋅ S2 + I5 ⋅ S0 ⋅ S1 ⋅ S2 + I6 ⋅ S0
state of three Select inputs, S0, S1, S2. Both assertion and ⋅ S1 ⋅ S2 + I7 ⋅ S0 ⋅ S1 ⋅ S2).
negation outputs are provided. The Enable input (E) is active The LS151 provides the ability, in one package, to select
LOW. When it is not activated, the negation output is HIGH from eight sources of data or control information. By proper
and the assertion output is LOW regardless of all other inputs. manipulation of the inputs, the LS151 can provide any logic
The logic function provided at the output is: function of four variables and its negation.
TRUTH TABLE
E S2 S1 S0 I0 I1 I2 I3 I4 I5 I6 I7 Z Z
H X X X X X X X X X X X H L
L L L L L X X X X X X X H L
L L L L H X X X X X X X L H
L L L H X L X X X X X X H L
L L L H X H X X X X X X L H
L L H L X X L X X X X X H L
L L H L X X H X X X X X L H
L L H H X X X L X X X X H L
L L H H X X X H X X X X L H
L H L L X X X X L X X X H L
L H L L X X X X H X X X L H
L H L H X X X X X L X X H L
L H L H X X X X X H X X L H
L H H L X X X X X X L X H L
L H H L X X X X X X H X L H
L H H H X X X X X X X L H L
L H H H X X X X X X X H L H
H = HIGH Voltage Level
L = LOW Voltage Level
X = Don’t Care
AC WAVEFORMS
Figure 1 Figure 2
N SUFFIX
PLASTIC
16 CASE 648-08
CONNECTION DIAGRAM DIP (TOP VIEW) 1
VCC Eb Eb A0 O3b O2b O1b O0b
16 15 14 13 12 11 10 9
NOTE: D SUFFIX
The Flatpak version SOIC
16
has the same pinouts 1 CASE 751B-03
(Connection Diagram) as
the Dual In-Line Package.
ORDERING INFORMATION
1 2 3 4 5 6 7 8 SN54LSXXXJ Ceramic
Ea Ea A1 O3a O2a O1a O0a GND SN74LSXXXN Plastic
SN74LSXXXD SOIC
LOGIC SYMBOL
VCC = PIN 16
GND = PIN 8
LOGIC DIAGRAM
Ea Ea A0 A1 Eb Eb
1 2 13 3 14 15
VCC = PIN 16
GND = PIN 8 7 6 5 4 9 10 11 12
= PIN NUMBERS
O0a O1a O2a O3a O0b O1b O2b O3b
FUNCTIONAL DESCRIPTION
The LS155 and LS156 are Dual 1-of-4 Decoder/Demulti- AND the minterm functions by tying outputs together. Any
plexers with common Address inputs and separate gated number of terms can be wired-AND as shown below.
Enable inputs. When enabled, each decoder section accepts
the binary weighted Address inputs (A0, A1) and provides four f = (E + A0 + A1) ⋅ (E + A0 + A1) ⋅ (E + A0 + A1) ⋅
mutually exclusive active LOW outputs (O0 – O3). If the Enable (E + A0 + A1)
requirements of each decoder are not met, all outputs of that where E = Ea + Ea; E = Eb + Eb
decoder are HIGH.
Each decoder section has a 2-input enable gate. The E E
enable gate for Decoder “a” requires one active HIGH input A0 O0 A0 O0
A1 A1
and one active LOW input (Ea•Ea). In demultiplexing applica-
tions, Decoder “a” can accept either true or complemented E E
data by using the Ea or Ea inputs respectively. The enable gate A0 O1 A0 O1
for Decoder “b” requires two active LOW inputs (Eb•Eb). The A1 A1
LS155 or LS156 can be used as a 1-of-8 Decoder/Demulti- E E
plexer by tying Ea to Eb and relabeling the common connection A0 O2 A0 O2
A1 A1
as (A2). The other Eb and Ea are connected together to form
the common enable. E E
The LS155 and LS156 can be used to generate all four A0 O3 A0 O3
minterms of two variables. These four minterms are useful in A1 A1
some applications replacing multiple gate functions as shown
in Fig. a. The LS156 has the further advantage of being able to Figure a
TRUTH TABLE
ADDRESS ENABLE “a” OUTPUT “a” ENABLE “b” OUTPUT “b”
A0 A1 Ea Ea O0 O1 O2 O3 Eb Eb O0 O1 O2 O3
X X L X H H H H H X H H H H
X X X H H H H H X H H H H H
L L H L L H H H L L L H H H
H L H L H L H H L L H L H H
L H H L H H L H L L H H L H
H H H L H H H L L L H H H L
H = HIGH Voltage Level
L = LOW Voltage Level
X = Don’t Care
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
AC WAVEFORMS
Figure 1 Figure 2
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
IOH Output HIGH Current 54, 74 100 µA VCC = MIN, VOH = MAX
AC WAVEFORMS
Figure 1 Figure 2
16 15 14 13 12 11 10 9
NOTE:
N SUFFIX
The Flatpak version
has the same pinouts PLASTIC
(Connection Diagram) as 16 CASE 648-08
the Dual In-Line Package.
1
1 2 3 4 5 6 7 8
MR Q0 Q0 D0 D1 Q1 Q1 GND
D SUFFIX
SOIC
PIN NAMES LOADING (Note a) 16
1 CASE 751B-03
HIGH LOW
D0 – D3 Data Inputs 0.5 U.L. 0.25 U.L.
CP Clock (Active HIGH Going Edge) Input 0.5 U.L. 0.25 U.L. ORDERING INFORMATION
MR Master Reset (Active LOW) Input 0.5 U.L. 0.25 U.L.
Q0 – Q3 True Outputs (Note b) 10 U.L. 5 (2.5) U.L. SN54LSXXXJ Ceramic
Q0 – Q 3 Complemented Outputs (Note b) 10 U.L. 5 (2.5) U.L. SN74LSXXXN Plastic
SN74LSXXXD SOIC
NOTES:
a. 1 TTL Unit Load (U.L.) = 40 µA HIGH/1.6 mA LOW.
b. The Output LOW drive factor is 2.5 U.L. for Military (54) and 5 U.L. for Commercial (74)
b. Temperature Ranges.
LOGIC SYMBOL
LOGIC DIAGRAM 4 5 12 13
MR CP D3 D2 D1 D0
1 9 13 12 5 4
D0 D1 D2 D3
9 CP
D Q D Q D Q D Q 1 MR
Q0 Q0 Q1 Q1 Q2 Q2 Q3 Q3
CP Q CP Q CP Q CP Q
CD CD CD CD
3 2 6 7 11 10 14 15
14 15 11 10 6 7 3 2
VCC = PIN 16 VCC = PIN 16
Q3 Q3 Q2 Q2 Q1Q1 Q0 Q0
GND = PIN 8 GND = PIN 8
= PIN NUMBERS
FUNCTIONAL DESCRIPTION
The LS175 consists of four edge-triggered D flip-flops with LOW input on the Master Reset (MR) will force all Q outputs
individual D inputs and Q and Q outputs. The Clock and LOW and Q outputs HIGH independent of Clock or Data
Master Reset are common. The four flip-flops will store the inputs.
state of their individual D inputs on the LOW to HIGH Clock The LS175 is useful for general logic applications where a
(CP) transition, causing individual Q and Q outputs to follow. A common Master Reset and Clock are acceptable.
TRUTH TABLE
Inputs (t = n, MR = H) Outputs (t = n+1) Note 1
D Q Q
L L H
H H L
Note 1: t = n + 1 indicates conditions after next clock.
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
AC WAVEFORMS
1/fmax
tw
CP 1.3 V 1.3 V tW
ts(H) t MR 1.3 V 1.3 V
th(H) s(L) th(L)
trec
D * 1.3 V 1.3 V 1.3 V 1.3 V
CP
tPLH tPHL tPHL
Q
Q 1.3 V 1.3 V 1.3 V 1.3 V
tPHL tPLH tPLH
Q 1.3 V 1.3 V
Q 1.3 V 1.3 V
Figure 1. Clock to Output Delays, Clock Pulse Width, Figure 2. Master Reset to Output Delay, Master Reset
Frequency, Setup and Hold Times Data to Clock Pulse Width, and Master Reset Recovery Time
DEFINITIONS OF TERMS
SETUP TIME (ts) — is defined as the minimum time required nition. A negative HOLD TIME indicates that the correct logic
for the correct logic level to be present at the logic input prior to level may be released prior to the clock transition from LOW to
the clock transition from LOW to HIGH in order to be recog- HIGH and still be recognized.
nized and transferred to the outputs.
RECOVERY TIME (trec) — is defined as the minimum time
HOLD TIME (th) — is defined as the minimum time following required between the end of the reset pulse and the clock
the clock transition from LOW to HIGH that the logic level must transition from LOW to HIGH in order to recognize and transfer
be maintained at the input in order to ensure continued recog- HIGH Data to the Q outputs.
16 15 14 13 12 11 10 9
NOTE:
N SUFFIX
The Flatpak version
has the same pinouts PLASTIC
(Connection Diagram) as 16 CASE 648-08
the Dual In-Line Package.
1
1 2 3 4 5 6 7 8
MR Q0 Q0 D0 D1 Q1 Q1 GND
D SUFFIX
SOIC
PIN NAMES LOADING (Note a) 16
1 CASE 751B-03
HIGH LOW
D0 – D3 Data Inputs 0.5 U.L. 0.25 U.L.
CP Clock (Active HIGH Going Edge) Input 0.5 U.L. 0.25 U.L. ORDERING INFORMATION
MR Master Reset (Active LOW) Input 0.5 U.L. 0.25 U.L.
Q0 – Q3 True Outputs (Note b) 10 U.L. 5 (2.5) U.L. SN54LSXXXJ Ceramic
Q0 – Q 3 Complemented Outputs (Note b) 10 U.L. 5 (2.5) U.L. SN74LSXXXN Plastic
SN74LSXXXD SOIC
NOTES:
a. 1 TTL Unit Load (U.L.) = 40 µA HIGH/1.6 mA LOW.
b. The Output LOW drive factor is 2.5 U.L. for Military (54) and 5 U.L. for Commercial (74)
b. Temperature Ranges.
LOGIC SYMBOL
LOGIC DIAGRAM 4 5 12 13
MR CP D3 D2 D1 D0
1 9 13 12 5 4
D0 D1 D2 D3
9 CP
D Q D Q D Q D Q 1 MR
Q0 Q0 Q1 Q1 Q2 Q2 Q3 Q3
CP Q CP Q CP Q CP Q
CD CD CD CD
3 2 6 7 11 10 14 15
14 15 11 10 6 7 3 2
VCC = PIN 16 VCC = PIN 16
Q3 Q3 Q2 Q2 Q1Q1 Q0 Q0
GND = PIN 8 GND = PIN 8
= PIN NUMBERS
FUNCTIONAL DESCRIPTION
The LS175 consists of four edge-triggered D flip-flops with LOW input on the Master Reset (MR) will force all Q outputs
individual D inputs and Q and Q outputs. The Clock and LOW and Q outputs HIGH independent of Clock or Data
Master Reset are common. The four flip-flops will store the inputs.
state of their individual D inputs on the LOW to HIGH Clock The LS175 is useful for general logic applications where a
(CP) transition, causing individual Q and Q outputs to follow. A common Master Reset and Clock are acceptable.
TRUTH TABLE
Inputs (t = n, MR = H) Outputs (t = n+1) Note 1
D Q Q
L L H
H H L
Note 1: t = n + 1 indicates conditions after next clock.
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
AC WAVEFORMS
1/fmax
tw
CP 1.3 V 1.3 V tW
ts(H) t MR 1.3 V 1.3 V
th(H) s(L) th(L)
trec
D * 1.3 V 1.3 V 1.3 V 1.3 V
CP
tPLH tPHL tPHL
Q
Q 1.3 V 1.3 V 1.3 V 1.3 V
tPHL tPLH tPLH
Q 1.3 V 1.3 V
Q 1.3 V 1.3 V
Figure 1. Clock to Output Delays, Clock Pulse Width, Figure 2. Master Reset to Output Delay, Master Reset
Frequency, Setup and Hold Times Data to Clock Pulse Width, and Master Reset Recovery Time
DEFINITIONS OF TERMS
SETUP TIME (ts) — is defined as the minimum time required nition. A negative HOLD TIME indicates that the correct logic
for the correct logic level to be present at the logic input prior to level may be released prior to the clock transition from LOW to
the clock transition from LOW to HIGH in order to be recog- HIGH and still be recognized.
nized and transferred to the outputs.
RECOVERY TIME (trec) — is defined as the minimum time
HOLD TIME (th) — is defined as the minimum time following required between the end of the reset pulse and the clock
the clock transition from LOW to HIGH that the logic level must transition from LOW to HIGH in order to recognize and transfer
be maintained at the input in order to ensure continued recog- HIGH Data to the Q outputs.
D SUFFIX
CONNECTION DIAGRAM DIP (TOP VIEW) SOIC
16
VCC P0 MR TCD TCU PL P2 P3 1 CASE 751B-03
16 15 14 13 12 11 10 9
ORDERING INFORMATION
NOTE:
The Flatpak version SN54LSXXXJ Ceramic
has the same pinouts SN74LSXXXN Plastic
(Connection Diagram) as SN74LSXXXD SOIC
the Dual In-Line Package.
1 2 3 4 5 6 7 8
P1 Q1 Q0 CPD CPU Q2 Q3 GND LOGIC SYMBOL
11 15 1 10 9
PIN NAMES LOADING (Note a)
HIGH LOW
PL P0 P1 P2 P3
CPU Count Up Clock Pulse Input 0.5 U.L. 0.25 U.L. 5 CPU TCU 12
CPD Count Down Clock Pulse Input 0.5 U.L. 0.25 U.L.
MR Asynchronous Master Reset (Clear) Input 0.5 U.L. 0.25 U.L.
4 CPD TCD 13
PL Asynchronous Parallel Load (Active LOW) Input 0.5 U.L. 0.25 U.L.
MR Q0 Q1 Q2 Q3
Pn Parallel Data Inputs 0.5 U.L. 0.25 U.L.
Qn Flip-Flop Outputs (Note b) 10 U.L. 5 (2.5) U.L.
TCD Terminal Count Down (Borrow) Output (Note b) 10 U.L. 5 (2.5) U.L. 14 3 2 6 7
TCU Terminal Count Up (Carry) Output (Note b) 10 U.L. 5 (2.5) U.L.
VCC = PIN 16
NOTES:
a. 1 TTL Unit Load (U.L.) = 40 µA HIGH/1.6 mA LOW. GND = PIN 8
b. The Output LOW drive factor is 2.5 U.L. for Military (54) and 5 U.L. for Commercial (74)
b. Temperature Ranges.
STATE DIAGRAMS
14 6 14 6
LS193 LOGIC EQUATIONS
FOR TERMINAL COUNT
13 7 13 7
TCU = Q0 ⋅ Q1⋅ Q2⋅ Q3 ⋅ CPU
TCD = Q0 ⋅ Q1 ⋅ Q2 ⋅ Q3 ⋅ CPD
12 11 10 9 8 12 11 10 9 8
COUNT UP
COUNT DOWN
LS192 LS193
LOGIC DIAGRAMS
P0 P1 P2 P3
PL 11 15 1 10 9
(LOAD)
5
CPU 12 TCU
(UP COUNT) (CARRY
OUTPUT)
SD SD SD SD
Q Q Q Q
T T T T
CD Q CD Q CD Q CD Q
13 TCD
CPD 4
(BORROW
(DOWN OUTPUT)
COUNT) 14
MR
(CLEAR) 3 2 6 7
Q0 Q1 Q2 Q3
P0 P1 P2 P3
PL 11 15 1 10 9
(LOAD)
5
CPU TCU
12
(UP COUNT) (CARRY
OUTPUT)
SD SD SD SD
Q Q Q Q
T T T T
CD Q CD Q CD Q CD Q
13 TCD
CPD 4
(BORROW
(DOWN OUTPUT)
COUNT) 14
MR
(CLEAR) 3 2 6 7
Q0 Q1 Q2 Q3
LS193
VCC = PIN 16
GND = PIN 8
= PIN NUMBERS
FUNCTIONAL DESCRIPTION
The LS192 and LS193 are Asynchronously Presettable The Terminal Count Up (TCU) and Terminal Count Down
Decade and 4-Bit Binary Synchronous UP / DOWN (Revers- (TCD) outputs are normally HIGH. When a circuit has reached
able) Counters. The operating modes of the LS192 decade the maximum count state (9 for the LS192, 15 for the LS193),
counter and the LS193 binary counter are identical, with the the next HIGH-to-LOW transition of the Count Up Clock will
only difference being the count sequences as noted in the cause TCU to go LOW. TCU will stay LOW until CPU goes
State Diagrams. Each circuit contains four master/slave HIGH again, thus effectively repeating the Count Up Clock,
flip-flops, with internal gating and steering logic to provide but delayed by two gate delays. Similarly, the TCD output will
master reset, individual preset, count up and count down go LOW when the circuit is in the zero state and the Count
operations. Down Clock goes LOW. Since the TC outputs repeat the clock
Each flip-flop contains JK feedback from slave to master waveforms, they can be used as the clock input signals to the
such that a LOW-to-HIGH transition on its T input causes the next higher order circuit in a multistage counter.
slave, and thus the Q output to change state. Synchronous Each circuit has an asynchronous parallel load capability
switching, as opposed to ripple counting, is achieved by permitting the counter to be preset. When the Parallel Load
driving the steering gates of all stages from a common Count (PL) and the Master Reset (MR) inputs are LOW, information
Up line and a common Count Down line, thereby causing all present on the Parallel Data inputs (P0, P3) is loaded into the
state changes to be initiated simultaneously. A LOW-to-HIGH counter and appears on the outputs regardless of the
transition on the Count Up input will advance the count by one; conditions of the clock inputs. A HIGH signal on the Master
a similar transition on the Count Down input will decrease the Reset input will disable the preset gates, override both Clock
count by one. While counting with one clock input, the other inputs, and latch each Q output in the LOW state. If one of the
should be held HIGH. Otherwise, the circuit will either count by Clock inputs is LOW during and after a reset or load operation,
twos or not at all, depending on the state of the first flip-flop, the next LOW-to-HIGH transition of that Clock will be
which cannot toggle as long as either Clock input is LOW. interpreted as a legitimate signal and will be counted.
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
tPLH 24 40
PL to Q ns
tPHL 25 40
DEFINITIONS OF TERMS
SETUP TIME (ts) is defined as the minimum time required for tion. A negative HOLD TIME indicates that the correct logic
the correct logic level to be present at the logic input prior to the level may be released prior to the PL transition from
PL transition from LOW-to-HIGH in order to be recognized and LOW-to-HIGH and still be recognized.
transferred to the outputs.
RECOVERY TIME (trec) is defined as the minimum time
HOLD TIME (th) is defined as the minimum time following the required between the end of the reset pulse and the clock
PL transition from LOW-to-HIGH that the logic level must be transition from LOW-to-HIGH in order to recognize and
maintained at the input in order to ensure continued recogni- transfer HIGH data to the Q outputs.
AC WAVEFORMS
tW
CPU or CPD 1.3 V 1.3 V
tPLH
tPHL
Q 1.3 V 1.3 V
Figure 1
NOTE: PL = LOW
Figure 2 Figure 3
Pn 1.3 V
PL 1.3 V
tw
tW trec
PL 1.3 V
tPLH tPHL CPU or CPD 1.3 V
tPHL
1.3 V
Qn
Q 1.3 V
Figure 4 Figure 5
Pn 1.3 V 1.3 V
th(H) th(L)
ts(H) ts(L) MR 1.3 V
PL 1.3 V
tW trec
Figure 6 Figure 7
J SUFFIX
SN54 / 74LS240 CERAMIC
VCC 2G 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 CASE 732-03
20
20 19 18 17 16 15 14 13 12 11
1
N SUFFIX
PLASTIC
CASE 738-03
20
1
1 2 3 4 5 6 7 8 9 10
1G 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND
DW SUFFIX
SN54 / 74LS241 SOIC
20
CASE 751D-03
VCC 2G 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 1
20 19 18 17 16 15 14 13 12 11
ORDERING INFORMATION
SN54LSXXXJ Ceramic
SN74LSXXXN Plastic
SN74LSXXXDW SOIC
1 2 3 4 5 6 7 8 9 10
1G 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND
SN54 / 74LS244
VCC 2G 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1
20 19 18 17 16 15 14 13 12 11
1 2 3 4 5 6 7 8 9 10
1G 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND
TRUTH TABLES
SN54 / 74LS241
INPUTS INPUTS
OUTPUT OUTPUT
1G D 2G D
L L L H L L
L H H H H H
H X (Z) L X (Z)
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = HIGH Impedance
AC WAVEFORMS
Figure 1 SW1
TO OUTPUT
UNDER TEST
Figure 2
VE
1.3 V 1.3 V SWITCH POSITIONS
VE
tPZL tPLZ SYMBOL SW1 SW2
VOUT 1.3 V ≈ 1.3 V tPZH Open Closed
VOL
0.5 V tPZL Closed Open
Figure 5
VE
1.3 V 1.3 V
VE
tPZH tPHZ
≥VOH
VOUT 1.3 V ≈ 1.3 V
0.5 V
Figure 4
Connection Diagram
Dual-In-Line Package
TL/F/8442 – 1
Order Number 54LS244DMQB, 54LS244FMQB, 54LS244LMQB,
DM74LS244WM or DM74LS244N
See NS Package Number E20A, J20A, M20B, N20A or W20A
Function Table
Inputs Output
G A Y
L L L
L H H
H X Z
L e Low Logic Level
H e High Logic Level
X e Either Low or High Logic Level
Z e High Impedance
Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted)
Typ
Symbol Parameter Conditions Min Max Units
(Note 1)
VI Input Clamp Voltage VCC e Min, II e b18 mA b 1.5 V
HYS Hysteresis (VT a b VTb) VCC e Min
0.2 0.4 V
Data Inputs Only
VOH High Level Output Voltage VCC e Min, VIH e Min DM74
2.7
VIL e Max, IOH e b1 mA
VCC e Min, VIH e Min 54LS/DM74
2.4 3.4 V
VIL e Max, IOH e b3 mA
VCC e Min, VIH e Min 54LS/DM74
2
VIL e 0.5V, IOH e Max
VOL Low Level Output Voltage VCC e Min IOL e 12 mA 54LS/DM74 0.4
VIL e Max V
IOL e Max DM74 0.5
VIH e Min
IOZH Off-State Output Current, VCC e Max VO e 2.7V
20 mA
High Level Voltage Applied VIL e Max
VIH e Min
IOZL Off-State Output Current, VO e 0.4V
b 20 mA
Low Level Voltage Applied
II Input Current at Maximum VCC e Max VI e 7V (DM74)
0.1 mA
Input Voltage VI e 10V (54LS)
IIH High Level Input Current VCC e Max VI e 2.7V 20 mA
IIL Low Level Input Current VCC e Max VI e 0.4V b 0.5 b 200 mA
54LS b 50
IOS Short Circuit Output Current VCC e Max (Note 2) b 225 mA
DM74 b 40
2
Switching Characteristics at VCC e 5V, TA e 25§ C (see Section 1 for Test Waveforms and Output Load)
Symbol Parameter Conditions 54LS Max DM74LS Max Units
tPLH Propagation Delay Time CL e 45 pF
18 18 ns
Low to High Level Output RL e 667X
tPHL Propagation Delay Time CL e 45 pF
18 18 ns
High to Low Level Output RL e 667X
tPZL Output Enable Time to CL e 45 pF
30 30 ns
Low Level RL e 667X
tPZH Output Enable Time to CL e 45 pF
23 23 ns
High Level RL e 667X
tPLZ Output Disable Time CL e 5 pF
25 25 ns
from Low Level RL e 667X
tPHZ Output Disable Time CL e 5 pF
18 18 ns
from High Level RL e 667X
tPLH Propagation Delay Time CL e 150 pF
21 ns
Low to High Level Output RL e 667X
tPHL Propagation Delay Time CL e 150 pF
22 ns
High to Low Level Output RL e 667X
tPZL Output Enable Time to CL e 150 pF
33 ns
Low Level RL e 667X
tPZH Output Enable Time to CL e 150 pF
26 ns
High Level RL e 667X
Note: 54LS Output Load is CL e 50 pF for tPLH, tPHL, tPZL and tPZH.
3
Physical Dimensions inches (millimeters)
4
Physical Dimensions inches (millimeters) (Continued)
5
54LS244/DM74LS244 Octal TRI-STATE Buffers/Line Drivers/Line Receivers
Physical Dimensions inches (millimeters) (Continued)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
SN54/74LS245
OCTAL BUS TRANSCEIVER
The SN54 / 74LS245 is an Octal Bus Transmitter/Receiver designed for
8-line asynchronous 2-way data communication between data buses.
Direction Input (DR) controls transmission of Data from bus A to bus B or bus
B to bus A depending upon its logic level. The Enable input (E) can be used
to isolate the buses. OCTAL BUS TRANSCEIVER
• Hysteresis Inputs to Improve Noise Immunity
LOW POWER SCHOTTKY
• 2-Way Asynchronous Data Bus Communication
• Input Diodes Limit High-Speed Termination Effects
• ESD > 3500 Volts
N SUFFIX
PLASTIC
CASE 738-03
20
1 2 3 4 5 6 7 8 9 10
1
DIR A1 A2 A3 A4 A5 A6 A7 A8 GND
DW SUFFIX
SOIC
TRUTH TABLE 20
CASE 751D-03
1
INPUTS
OUTPUT
E DIR
L L Bus B Data to Bus A
ORDERING INFORMATION
L H Bus A Data to Bus B
H X Isolation SN54LSXXXJ Ceramic
H = HIGH Voltage Level
SN74LSXXXN Plastic
L = LOW Voltage Level SN74LSXXXDW SOIC
X = Immaterial
1 2 3 4 5 6 7 8 9 10 N SUFFIX
MR Q0 D0 D1 Q1 Q2 D2 D3 Q3 GND PLASTIC
CASE 738-03
20
PIN NAMES LOADING (Note a)
1
HIGH LOW
CP Clock (Active HIGH Going Edge) Input 0.5 U.L. 0.25 U.L.
D0 – D7 Data Inputs 0.5 U.L. 0.25 U.L. DW SUFFIX
MR Master Reset (Active LOW) Input 0.5 U.L. 0.25 U.L. SOIC
20
CASE 751D-03
Q0 – Q7 Register Outputs (Note b) 10 U.L. 5 (2.5) U.L. 1
NOTES:
a) 1 TTL Unit Load (U.L.) = 40 µA HIGH/1.6 mA LOW.
b) The Output LOW drive factor is 2.5 U.L. for Military (54) and 5 U.L. for Commercial
(74) Temperature Ranges.
ORDERING INFORMATION
TRUTH TABLE SN54LSXXXJ Ceramic
SN74LSXXXN Plastic
MR CP Dx Qx
SN74LSXXXDW SOIC
L X X L
H H H
H L L
H = HIGH Logic Level
L = LOW Logic Level
X = Immaterial
LOGIC DIAGRAM 3 4 7 8 13 14 17 18
11 D0 D1 D2 D3 D4 D5 D6 D7
CP
CP D CP D CP D CP D CP D CP D CP D CP D
1 CD Q CD Q CD Q CD Q CD Q CD Q CD Q CD Q
MR
VCC = PIN 20
GND = PIN 10
= PIN NUMBERS Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
2 5 6 9 12 15 16 19
FUNCTIONAL DESCRIPTION
The SN54 / 74LS273 is an 8-Bit Parallel Register with a independent of the other inputs. Information meeting the setup
common Clock and common Master Reset. and hold time requirements of the D inputs is transferred to the
When the MR input is LOW, the Q outputs are LOW, Q outputs on the LOW-to-HIGH transition of the clock input.
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
AC WAVEFORMS
1/f max tW
tW MR 1.3 V
CP 1.3 V 1.3 V 1.3 V 1.3 V trec
tPHL tPLH
Figure 1. Clock to Output Delays, Clock Pulse Width, Figure 2. Master Reset to Output Delay, Master Reset
Frequency, Setup and Hold Times Data to Clock Pulse Width, and Master Reset Recovery Time
DEFINITION OF TERMS
SETUP TIME (ts) — is defined as the minimum time required recognition. A negative HOLD TIME indicates that the correct
for the correct logic level to be present at the logic input prior to logic level may be released prior to the clock transition from
the clock transition from LOW-to-HIGH in order to be recog- LOW-to-HIGH and still be recognized.
nized and transferred to the outputs.
RECOVERY TIME (trec) — is defined as the minimum time
HOLD TIME (th) — is defined as the minimum time following required between the end of the reset pulse and the clock
the clock transition from LOW-to-HIGH that the logic level transition from LOW-to-HIGH in order to recognize and
must be maintained at the input in order to ensure continued transfer HIGH data to the Q outputs.
DW SUFFIX
PIN NAMES LOADING (Note a) SOIC
20
HIGH LOW CASE 751D-03
1
D0 – D7 Data Inputs 0.5 U.L. 0.25 U.L.
LE Latch Enable (Active HIGH) Input 0.5 U.L. 0.25 U.L.
CP Clock (Active HIGH going edge) Input 0.5 U.L. 0.25 U.L.
OE Output Enable (Active LOW) Input 0.5 U.L. 0.25 U.L. ORDERING INFORMATION
O0 – O7 Outputs (Note b) 65 (25) U.L. 15 (7.5) U.L.
SN54LSXXXJ Ceramic
SN74LSXXXN Plastic
NOTES:
SN74LSXXXDW SOIC
a) 1 TTL Units Load (U.L.) = 40 µA HIGH/1.6 mA LOW.
b) The Output LOW drive factor is 7.5 U.L. for Military (54) and 25 U.L. for Commercial
(74) Temperature Ranges. The Output HIGH drive factor is 25 U.L. for Military (54) and
65 U.L. for Commercial (74) Temperature Ranges.
1 2 3 4 5 6 7 8 9 10 NOTE: 1 2 3 4 5 6 7 8 9 10
OE O0 D0 D1 O1 O2 D2 D3 O3 GND The Flatpak version OE O0 D0 D1 O1 O2 D2 D3 O3 GND
has the same pinouts
(Connection Diagram) as
the Dual In-Line Package.
TRUTH TABLE
LS373 LS374
Dn LE OE On Dn LE OE On
H H L H H L H
L H L L L L L
X L L Q0 X X H Z*
X X H Z*
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
* Note: Contents of flip-flops unaffected by the state of the Output Enable input (OE).
LOGIC DIAGRAMS
SN54LS / 74LS373 3 4 7 8 13 14 17 18
VCC = PIN 20
D0 D1 D2 D3 D4 D5 D6 D7 GND = PIN 10
= PIN NUMBERS
D D D D D D D D
LATCH Q Q Q Q Q Q Q Q
ENABLE G G G G G G G G
11
LE
OE
1
O0 O1 O2 O3 O4 O5 O6 O7
2 5 6 9 12 15 16 19
SN54LS / 74LS374
3 4 7 8 13 14 17 18
11 D0 D1 D2 D3 D4 D5 D6 D7
CP
CP D CP D CP D CP D CP D CP D CP D CP D
Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q
OE
1 O0 O1 O2 O3 O4 O5 O6 O7
2 5 6 9 12 15 16 19
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.4 3.4 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.4 3.1 V or VIL per Truth Table
tPZH 15 28 20 28
Output Enable Time ns
tPZL 25 36 21 28
tPHZ 12 20 12 20
Output Disable Time ns CL = 5.0 pF
tPLZ 15 25 15 25
DEFINITION OF TERMS
SETUP TIME (ts) — is defined as the minimum time required HOLD TIME (th) — is defined as the minimum time following
for the correct logic level to be present at the logic input prior to the LE transition from HIGH-to-LOW that the logic level must
LE transition from HIGH-to-LOW in order to be recognized and be maintained at the input in order to ensure continued
transferred to the outputs. recognition.
AC WAVEFORMS
tW tW
LE 1.3 V
ts th
Dn
tPLH tPHL
OUTPUT
Figure 1
AC LOAD CIRCUIT
VCC
SWITCH POSITIONS
RL
SYMBOL SW1 SW2
tPZH Open Closed
SW1
tPZL Closed Open
tPLZ Closed Closed
TO OUTPUT
UNDER TEST tPHZ Closed Closed
5.0 kΩ
CL* SW2
Figure 4
AC WAVEFORMS
tWH tWL
OE 1.3 V 1.3 V
CP 1.3 V 1.3 V 1.3 V
ts th tPZL tPLZ
Figure 5
OE 1.3 V 1.3 V
tPZH tPHZ
≥ VOH
VOUT 1.3 V ≈ 1.3 V
0.5 V
Figure 7
AC LOAD CIRCUIT
VCC
SWITCH POSITIONS
RL
SYMBOL SW1 SW2
tPZH Open Closed
SW1
tPZL Closed Open
tPLZ Closed Closed
TO OUTPUT
UNDER TEST tPHZ Closed Closed
5.0 kΩ
CL* SW2
Figure 8
DW SUFFIX
PIN NAMES LOADING (Note a) SOIC
20
HIGH LOW CASE 751D-03
1
D0 – D7 Data Inputs 0.5 U.L. 0.25 U.L.
LE Latch Enable (Active HIGH) Input 0.5 U.L. 0.25 U.L.
CP Clock (Active HIGH going edge) Input 0.5 U.L. 0.25 U.L.
OE Output Enable (Active LOW) Input 0.5 U.L. 0.25 U.L. ORDERING INFORMATION
O0 – O7 Outputs (Note b) 65 (25) U.L. 15 (7.5) U.L.
SN54LSXXXJ Ceramic
SN74LSXXXN Plastic
NOTES:
SN74LSXXXDW SOIC
a) 1 TTL Units Load (U.L.) = 40 µA HIGH/1.6 mA LOW.
b) The Output LOW drive factor is 7.5 U.L. for Military (54) and 25 U.L. for Commercial
(74) Temperature Ranges. The Output HIGH drive factor is 25 U.L. for Military (54) and
65 U.L. for Commercial (74) Temperature Ranges.
1 2 3 4 5 6 7 8 9 10 NOTE: 1 2 3 4 5 6 7 8 9 10
OE O0 D0 D1 O1 O2 D2 D3 O3 GND The Flatpak version OE O0 D0 D1 O1 O2 D2 D3 O3 GND
has the same pinouts
(Connection Diagram) as
the Dual In-Line Package.
TRUTH TABLE
LS373 LS374
Dn LE OE On Dn LE OE On
H H L H H L H
L H L L L L L
X L L Q0 X X H Z*
X X H Z*
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
* Note: Contents of flip-flops unaffected by the state of the Output Enable input (OE).
LOGIC DIAGRAMS
SN54LS / 74LS373 3 4 7 8 13 14 17 18
VCC = PIN 20
D0 D1 D2 D3 D4 D5 D6 D7 GND = PIN 10
= PIN NUMBERS
D D D D D D D D
LATCH Q Q Q Q Q Q Q Q
ENABLE G G G G G G G G
11
LE
OE
1
O0 O1 O2 O3 O4 O5 O6 O7
2 5 6 9 12 15 16 19
SN54LS / 74LS374
3 4 7 8 13 14 17 18
11 D0 D1 D2 D3 D4 D5 D6 D7
CP
CP D CP D CP D CP D CP D CP D CP D CP D
Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q
OE
1 O0 O1 O2 O3 O4 O5 O6 O7
2 5 6 9 12 15 16 19
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.4 3.4 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.4 3.1 V or VIL per Truth Table
tPZH 15 28 20 28
Output Enable Time ns
tPZL 25 36 21 28
tPHZ 12 20 12 20
Output Disable Time ns CL = 5.0 pF
tPLZ 15 25 15 25
DEFINITION OF TERMS
SETUP TIME (ts) — is defined as the minimum time required HOLD TIME (th) — is defined as the minimum time following
for the correct logic level to be present at the logic input prior to the LE transition from HIGH-to-LOW that the logic level must
LE transition from HIGH-to-LOW in order to be recognized and be maintained at the input in order to ensure continued
transferred to the outputs. recognition.
AC WAVEFORMS
tW tW
LE 1.3 V
ts th
Dn
tPLH tPHL
OUTPUT
Figure 1
AC LOAD CIRCUIT
VCC
SWITCH POSITIONS
RL
SYMBOL SW1 SW2
tPZH Open Closed
SW1
tPZL Closed Open
tPLZ Closed Closed
TO OUTPUT
UNDER TEST tPHZ Closed Closed
5.0 kΩ
CL* SW2
Figure 4
AC WAVEFORMS
tWH tWL
OE 1.3 V 1.3 V
CP 1.3 V 1.3 V 1.3 V
ts th tPZL tPLZ
Figure 5
OE 1.3 V 1.3 V
tPZH tPHZ
≥ VOH
VOUT 1.3 V ≈ 1.3 V
0.5 V
Figure 7
AC LOAD CIRCUIT
VCC
SWITCH POSITIONS
RL
SYMBOL SW1 SW2
tPZH Open Closed
SW1
tPZL Closed Open
tPLZ Closed Closed
TO OUTPUT
UNDER TEST tPHZ Closed Closed
5.0 kΩ
CL* SW2
Figure 8
J SUFFIX
CERAMIC
CASE 632-08
1 2 3 4 5 6 7 14
1
GND
N SUFFIX
PLASTIC
14 CASE 646-06
1
D SUFFIX
SOIC
14
1 CASE 751A-02
ORDERING INFORMATION
SN54LSXXJ Ceramic
SN74LSXXN Plastic
SN74LSXXD SOIC
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
J SUFFIX
CERAMIC
1 2 3 4 5 6 7 CASE 632-08
GND 14
1
N SUFFIX
PLASTIC
14 CASE 646-06
1
D SUFFIX
SOIC
14
1 CASE 751A-02
ORDERING INFORMATION
SN54LSXXJ Ceramic
SN74LSXXN Plastic
SN74LSXXD SOIC
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
HEX INVERTER
VCC
LOW POWER SCHOTTKY
14 13 12 11 10 9 8
J SUFFIX
CERAMIC
1 2 3 4 5 6 7 CASE 632-08
14
GND 1
N SUFFIX
PLASTIC
14 CASE 646-06
1
D SUFFIX
SOIC
14
1 CASE 751A-02
ORDERING INFORMATION
SN54LSXXJ Ceramic
SN74LSXXN Plastic
SN74LSXXD SOIC
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
J SUFFIX
CERAMIC
1 2 3 4 5 6 7 CASE 632-08
14
GND 1
N SUFFIX
PLASTIC
14 CASE 646-06
1
D SUFFIX
SOIC
14
1 CASE 751A-02
ORDERING INFORMATION
SN54LSXXJ Ceramic
SN74LSXXN Plastic
SN74LSXXD SOIC
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
J SUFFIX
CERAMIC
1 2 3 4 5 6 7 CASE 632-08
14
GND 1
N SUFFIX
PLASTIC
14 CASE 646-06
1
D SUFFIX
SOIC
14
1 CASE 751A-02
ORDERING INFORMATION
SN54LSXXJ Ceramic
SN74LSXXN Plastic
SN74LSXXD SOIC
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
J SUFFIX
LOGIC DIAGRAM (Each Flip-Flop) CERAMIC
CASE 632-08
14
1
SET (SD)
4 (10)
Q
5 (9)
CLEAR (CD)
1 (13) N SUFFIX
PLASTIC
CLOCK 14 CASE 646-06
3 (11)
Q 1
6 (8)
D
2 (12)
D SUFFIX
SOIC
14
1 CASE 751A-02
ORDERING INFORMATION
SN54LSXXJ Ceramic
MODE SELECT — TRUTH TABLE SN74LSXXN Plastic
SN74LSXXD SOIC
INPUTS OUTPUTS
OPERATING MODE
SD SD D Q Q
Set L H X H L
LOGIC SYMBOL
Reset (Clear) H L X L H
*Undetermined L L X H H 4 10
Load “1” (Set) H H h H L
Load “0” (Reset) H H l L H
2 D SD Q 5 12 D SD Q 9
* Both outputs will be HIGH while both SD and CD are LOW, but the output states are unpredictable
if SD and CD go HIGH simultaneously. If the levels at the set and clear are near VIL maximum then 3 11
CP CP
we cannot guarantee to meet the minimum level for VOH.
H, h = HIGH Voltage Level 6 8
L, I = LOW Voltage Level
CD Q CD Q
X = Don’t Care
i, h (q) = Lower case letters indicate the state of the referenced input (or output) one set-up time 1 13
i, h (q) = prior to the HIGH to LOW clock transition.
VCC = PIN 14
GND = PIN 7
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 2.5 3.5 V VCC = MIN,, IOH = MAX,, VIN = VIH
VOH Output HIGH Voltage
74 2.7 3.5 V or VIL per Truth Table
Data Setup
p Time — HIGH 20 ns VCC = 5.0
50V
ts Figure 1
Data Setup Time — LOW 20 ns
th Hold Time 5.0 ns Figure 1
AC WAVEFORMS
D* 1.3 V 1.3 V
th(H)
th(L)
ts(L) tW(H) ts(H)
tW(L)
1.3 V 1.3 V
CP
1
fMAX
tPHL tPLH
Q
1.3 V 1.3 V
tPHL
tPLH
1.3 V 1.3 V
Q
*The shaded areas indicate when the input is permitted to change for predictable output performance.
tW
SET
1.3 V 1.3 V
tW
CLEAR
1.3 V 1.3 V
tPLH tPHL
1.3 V 1.3 V
Q
tPHL tPLH
Q
1.3 V 1.3 V
NOTE:
The Flatpak version N SUFFIX
has the same pinouts PLASTIC
(Connection Diagram) as CASE 648-08
the Dual In-Line Package. 16
1
1 2 3 4 5 6 7 8
A0 A1 A2 E1 E2 E3 O7 GND
D SUFFIX
PIN NAMES LOADING (Note a)
SOIC
HIGH LOW 16
1 CASE 751B-03
A0 – A2 Address Inputs 0.5 U.L. 0.25 U.L.
E1, E2 Enable (Active LOW) Inputs 0.5 U.L. 0.25 U.L.
E3 Enable (Active HIGH) Input 0.5 U.L. 0.25 U.L. ORDERING INFORMATION
O0 – O7 Active LOW Outputs (Note b) 10 U.L. 5 (2.5) U.L.
SN54LSXXXJ Ceramic
NOTES:
SN74LSXXXN Plastic
a) 1 TTL Unit Load (U.L.) = 40 µA HIGH/1.6 mA LOW.
SN74LSXXXD SOIC
b) The Output LOW drive factor is 2.5 U.L. for Military (54) and 5 U.L. for Commercial (74)
Temperature Ranges.
LOGIC DIAGRAM
LOGIC SYMBOL
A2 A1 A0 E1 E2 E3
3 2 1 4 5 6 VCC = PIN 16 1 2 3 456
GND = PIN 8
12 3
= PIN NUMBERS
A0 A1 A2 E
O0 O1 O2 O3 O4 O5 O6 O7
15 14 13 12 11 10 9 7
VCC = PIN 16
GND = PIN 8
7 9 10 11 12 13 14 15
O7 O6 O5 O4 O3 O2 O1 O0
FUNCTIONAL DESCRIPTION
The LS138 is a high speed 1-of-8 Decoder/Demultiplexer pansion of the device to a 1-of-32 (5 lines to 32 lines) decoder
fabricated with the low power Schottky barrier diode process. with just four LS138s and one inverter. (See Figure a.)
The decoder accepts three binary weighted inputs (A0, A1, A2) The LS138 can be used as an 8-output demultiplexer by
and when enabled provides eight mutually exclusive active using one of the active LOW Enable inputs as the data input
LOW Outputs (O0 – O7). The LS138 features three Enable in- and the other Enable inputs as strobes. The Enable inputs
puts, two active LOW (E1, E2) and one active HIGH (E3). All which are not used must be permanently tied to their appropri-
outputs will be HIGH unless E1 and E2 are LOW and E3 is ate active HIGH or active LOW state.
HIGH. This multiple enable function allows easy parallel ex-
TRUTH TABLE
INPUTS OUTPUTS
E1 E2 E3 A0 A1 A2 O0 O1 O2 O3 O4 O5 O6 O7
H X X X X X H H H H H H H H
X H X X X X H H H H H H H H
X X L X X X H H H H H H H H
L L H L L L L H H H H H H H
L L H H L L H L H H H H H H
L L H L H L H H L H H H H H
L L H H H L H H H L H H H H
L L H L L H H H H H L H H H
L L H H L H H H H H H L H H
L L H L H H H H H H H H L H
L L H H H H H H H H H H H L
H = HIGH Voltage Level
L = LOW Voltage Level
X = Don’t Care
A0
A1
A2
LS04
A3
A4
H
A0 A1 A2 E A0 A1 A2 E A0 A1 A2 E A0 A1 A2 E
O0 O31
Figure a
VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA
54 25
2.5 35
3.5 V VCC = MIN
MIN,, IOH = MAX,
MAX, VIN = VIH
VOH O
Output HIGH Voltage
V l
74 2.7 3.5 V or VIL per Truth Table
AC WAVEFORMS
Figure 1 Figure 2