Data Sheet No.

PD60277

IRS2304(S)PbF
Features HALF-BRIDGE DRIVER
• Floating channel designed for bootstrap operation
Product Summary
to +600 V
• Tolerant to negative transient voltage, dV/dt
immune VOFFSET 600 V max.
• Gate drive supply range from 10 V to 20 V IO+/- (min) 60 mA/130 mA
• Undervoltage lockout for both channels VOUT 10 V - 20 V
• 3.3 V, 5 V, and 15 V input logic input compatible
• Cross-conduction prevention logic Delay Matching 50 ns
• Matched propagation delay for both channels Internal deadtime 100 ns
• Lower di/dt gate driver for better noise immunity
• Internal 100 ns deadtime ton/off (typ.) 150 ns/150 ns
• Output in phase with input
• RoHS compliant Package
Description 8-Lead 8 Lead
The IRS2304 is a high voltage, high speed power PDIP SOIC
MOSFET and IGBT driver with independent high-side
and low-side referenced output channels. Proprietary
HVIC and latch immune CMOS technologies enable
ruggedized monolithic construction.
The logic input is compatible with Feature Comparison
standard CMOS or LSTTL output, Cross-
Input conduction Deadtime ton/toff
down to 3.3 V logic. The output driver Part
logic prevention (ns)
Ground Pins
(ns)
features a high pulse current buffer logic
stage designed for minimum driver 2106/2301 HIN/LIN no none
COM
220/200
cross-conduction. The floating chan- 21064 VSS/COM
2108 Internal 540 COM
nel can be used to drive an N-chan- 21084
HIN/LIN yes
Programmable 540 - 5000 VSS/COM
220/200
nel power MOSFET or IGBT in the 2109/2302 Internal 540 COM
IN/SD yes 750/200
high-side configuration which oper- 21094 Programmable 540 - 5000 VSS/COM
ates up to 600 V. 2304 HIN/LIN yes Internal 100 COM 160/140

Block Diagram up to 600 V

Vcc

LIN LIN VB
HIN HIN HO
VCC VS TO
LOAD

COM LO
(Refer to Lead Assignments for cor-
rect pin configuration). These dia-
grams show electrical connections
only. Please refer to our Application
Notes and DesignTips for proper cir-
cuit board layout.

www.irf.com 1

PDF created with pdfFactory trial version www.pdffactory.com

 IRS2304(S)PbF

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance
and power dissipation ratings are measured under board mounted and still air conditions.

Symbol Definition Min. Max. Units

VS High- side offset voltage VB - 25 VB + 0.3
VB High- side floating supply voltage -0.3 625
VHO High- side floating output voltage HO VS - 0.3 VB + 0.3
VCC Low- side and logic fixed supply voltage -0.3 25 V
VLO Low- side output voltage LO -0.3 VCC + 0.3
VIN Logic input voltage (HIN, LIN) -0.3 VCC + 0.3
Com Logic ground VCC -25 VCC + 0.3
dVS/dt Allowable offset supply voltage transient — 50 V/ns
8-Lead SOIC — 0.625
PD Package power dissipation @ TA ≤ +25 °C W
8-Lead PDIP — 1.0
8-Lead SOIC — 200
RthJA Thermal resistance, junction to ambient °C/W
8-Lead PDIP — 125
TJ Junction temperature — 150
TS Storage temperature -50 150 °C
TL Lead temperature (soldering, 10 seconds) — 300

Recommended Operating Conditions

The input/output logic timing diagram is shown in Fig. 1. For proper operation the device should be used within the
recommended conditions. The VS offset rating is tested with all supplies biased at 15 V differential.

Symbol Definition Min. Max. Units

VB High- side floating supply voltage VS + 10 VS + 20
VS High- side floating supply offset voltage Note 1 600
VHO High-side (HO) output voltage VS VB
V
VLO Low- side (LO) output voltage COM VCC
VIN Logic input voltage (HIN, LIN) COM VCC
VCC Low- side supply voltage 10 20
TA Ambient temperature -40 125 °C

Note 1: Logic operational for VS of COM -5 V to COM +600 V. Logic state held for VS of COM -5 V to COM -VBS.

www.irf.com 2
 IRS2304(S)PbF

Static Electrical Characteristics

VBIAS (VCC, VBS) = 15 V and TA = 25 °C unless otherwise specified. The VIN, VTH, and IIN parameters are referenced to
COM. The VO and IO parameters are referenced to COM and VS is applicable to HO and LO.

Symbol Definition Min. Typ. Max. Units Test Conditions

VCCUV+ VCC and VBS supply undervoltage positive going
8 8.9 9.8
VBSUV+ threshold
VCCUV- VCC and VBS supply undervoltage negative going
7.4 8.2 9 V
VBSUV- threshold
VCCUVH
VCC supply undervoltage lockout hysteresis 0.3 0.7 —
VBSUVH
ILK Offset supply leakage current — — 50 VB = VS = 600 V
IQBS Quiescent VBS supply current 20 60 150 µA
VIN = 0 V or 5 V
IQCC Quiescent VCC supply current 50 120 240
VIH Logic “1” input voltage 2.3 — —
VIL Logic “0” input voltage — — 0.7
VOH High level output voltage, VBIAS - VO — 0.05 0.2 V
IO = 2 mA
VOL Low level output voltage, VO — 0.02 0.1
IIN+ Logic “1” input bias current — 5 40 VIN = 5 V
µA
IIN- Logic “0” input bias current — 1.0 5.0 VIN = 0 V
IO+ Output high short circuit pulse current 60 290 — VO = 0 V
mA PW ≤ 10 µs
IO- Output low short circuit pulsed current 130 600 —

Dynamic Electrical Characteristics

VBIAS (VCC, VBS) = 15 V, VS = COM, CL = 1000 pF and TA = 25 °C unless otherwise specified.

Symbol Definition Min. Typ. Max. Units Test Conditions

ton Turn-on propagation delay 90 150 210 VS = 0 V
toff Turn-off propagation delay 90 150 210 VS = 0 V or 600 V
tr Turn-on rise time — 70 120
ns
tf Turn-off fall time — 35 60
DT Deadtime 80 100 190
MT Delay matching, HS & LS turn-on/off — — 50

www.irf.com 3

PDF created with pdfFactory trial version www.pdffactory.com

 IRS2304(S)PbF

Functional Block Diagram

VB

2304 UV
DETECT
R HO
R Q
PULSE
HV
FILTER
LEVEL S
SHIFTER
HIN VS
PULSE
GENERATOR

SHOOT-
THROUGH
PREVENTION
VCC

UV
DETECT
LO

LIN DELAY
COM

Lead Definitions
Symbol Description
VCC Low-side supply voltage
COM Logic ground and low-side driver return
HIN Logic input for high-side gate driver output
LIN Logic input for low-side gate driver output
VB High-side floating supply
HO High-side driver output
VS High voltage floating supply return
LO Low-side driver output

www.irf.com 4
 IRS2304(S)PbF

Lead Assignments

1 LIN VB 8 1 LIN VB 8

2 HIN HO 7 2 HIN HO 7

3 VCC VS 6 3 VCC VS 6

4 COM LO 5 4 COM LO 5

8-Lead PDIP 8-Lead SOIC

HIN

LIN

HO

Internal Deadtime

LO

Figure 1. Input/Output Functionality Diagram

www.irf.com 5
 IRS2304(S)PbF

50%
50%
HIN LIN

t off tf
t on tr

90%
90%
HO
LO 10%
10%

Figure 2. Switching Time Waveforms

HIN

50% 50%
LIN

90%
10%
LO
HO DT DT
90%
10%

Figure 3. Internal Deadtime Timing

www.irf.com 6
 IRS2304(S)PbF
VCC and VBS U VLO T hr es hold (+) (V)

12 11

Vc c U VLO T hr es hold (- ) (V)

11 10

M ax.
10 9
M ax. Typ.
9 8
Typ. M in.

8 7
M in.

7 6
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
o
o
Temperature ( C) Temperature ( C)

Figure 4. VC C and V BS Undervoltage Figur e 5. V CC / V DD Undervoltage Threshold (-)

Threshold (+) vs. Temperature vs. T emperature
Offset Supply Leakage Current (µA)

300 300
Offs et Supply Leak ag e Current (µA)

240 240

180 180

120 120
M ax.
60 60
M ax.

0 0
-50 -25 0 25 50 75 100 125 0 100 200 300 400 500 600
o VB Boost Voltage (V)
Temperature ( C)

Figure 6A. Offset Supply L eakage Curre nt Figure 6B. Offse t Supply Leak age Current
vs. Temperature vs. Supply Voltage

www.irf.com 7

PDF created with pdfFactory trial version www.pdffactory.com

 IRS2304(S)PbF

300 300

V BS Supply Current (µA)

VBS Supply Current (µA)

240 240

180 180

M ax.
120 120 M ax.

Typ.
60 60 Typ.
M in. M in.
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
o
Temperature ( C) V BS Supply Voltage (V)

Figure 7A. V BS Supply Current Figur e 7B. V BS Sup ply Current

vs. Temperatu re vs. Supply Voltage

500 500
V CC Supp ly Current (µA)

V CC Supp ly Current (µA)

400 400

300 300
Max.

200
Typ.
200 Max.

100 Typ.
100
Min.
0 Min.

-50 -25 0 25 50 75 100 125 0

o
10 12 14 16 18 20
Temperature ( C)
VCC Supply Voltage (V)

Figure 8A. Quiescen t VCC Supply Figure 8B. Quiescent Vcc Supply Curre nt
Cu rrent vs. Tem perature vs. Supply Voltage

www.irf.com 8

PDF created with pdfFactory trial version www.pdffactory.com

 IRS2304(S)PbF

6 6

5 5
Input Voltage (V)

Input Voltage (V)

4 4

3 3
M in. M in.

2 2

1 1

0 0
-50 -25 0 25 50 75 100 125 5 10 15 20
Temperature ( oC) Supply Voltage (V)

Figure 9A. Logic "1" Input Voltage Figure 9B. Logic "1" In put Voltage
vs. Temperature vs. Supply Voltage

4 4
Input Voltage (V)

Input Voltage (V)

3 3

2 2

1 1
Max. M ax.

0 0
- 50 -25 0 25 50 75 100 125 10 12 14 16 18 20
o
Temperatre ( C) Supply Voltage (V)

Figure 10A. Logic "0" Inpu t Voltage vs. Figure 10B. Logic "0" In put Voltage
Temperature vs. Supply Volt age

www.irf.com 9

PDF created with pdfFactory trial version www.pdffactory.com

 IRS2304(S)PbF

0.5 0.5
High L ev el O utput Vo ltage (V)

High L evel Output Vol tage (V)

0.4 0.4

0.3 0.3 M ax

0.2 0.2
M ax.

0.1 0.1

0.0 0.0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (oC) V BIAS Supply Voltage (V)

Figure 11A. High Level Output Voltage Figure 11B. High Level Output Voltage
vs. Te mperature (I o = 2 mA) vs. Su pply Voltage (Io = 2 mA)
Low Level Output Voltage (V)

0.20 0.20
Low Level Output Voltage (V)

0.15 0.15
M ax

0.10 M ax.
0.10

0.05 0.05

0.00 0.00
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
o
Temperature ( C) V BIAS Supply Voltage (V)

Figure 12A. Low Level Output Voltage Figure 12B. Low L evel Output
vs.Temperature (Io = 2 mA) vs. Supply Voltage (Io = 2 mA)

www.irf.com 10

PDF created with pdfFactory trial version www.pdffactory.com

 IRS2304(S)PbF

100 50

Logic "1" Input Current (µA))

Logic "1" Input Curren t (µA)

Max.
40
75
30
50
20
25 Max. 10
Typ.
Typ.
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20

Temperature ( oC) V CC Supply Voltage (V)

Figure 13B. Logic "1" Input Current

Figure 13A. Logic "1" Inpu t Current vs.
vs. Supply Voltage
Temperature

6 6
Logic "0" Input Bias C urrent (µA)
Lo gic "0" Input Bia s Current (µA)

5 Max 5 Max

4 4

3 3

2 2

1 1

0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (°C) Supply Voltage (V)
Figure 14A. Logic "0" Input Bias Current Figure 14B. Logic "0" Input Bias Current
vs. Temperature vs. Voltage

www.irf.com 11
 IRS2304(S)PbF

100 100
Outpu t Sourc e Curre nt (mA)

Outpu t Sourc e Curren t (mA)

75 75

Min.
50 50
Min.

25 25

0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
o
Temperature ( C) V BIAS Supply Voltage (V)

Figure 15A. Output Sour ce Current vs . Figure 15B. Output Source Current
Temperatu re vs. Supply Voltage

200 200
Outpu t Sink Current (m A)
Outpu t Sink Current (mA)

Min.
150 150

100 100

M in.
50 50

0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20

Temperature ( oC) V BIAS Supply Voltage (V)

Figure 16A. Output Sink Current Figure 16B. Output Sink Current
vs.Temperature vs. Supply Vo ltage

www.irf.com 12

PDF created with pdfFactory trial version www.pdffactory.com

 IRS2304(S)PbF

500 500
Turn-On Delay Time ( ns ) .

Turn-On Delay Time ( ns ) .

400 400

300 300
M ax

200 M ax 200
Typ.
100 100
Typ.

0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature(oC) Supply Voltage (V)
Figure 17A. Turn-On Pro pagation Delay Figure 17B. Turn-On Pro pagation Delay
vs. Tem perature vs. Supply Vo ltage

500 500

400
Turn- Off Time (ns)

400
Turn- Off Time (ns)

300 300
Max.

200 200
M ax.
Typ.

100 100
Typ.

0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20

Temperature(oC) Supply Voltage (V)

Figure 18A. Turn-Off Propagation Delay Figure 18B. Tu rn-Off Propag ation Delay
vs . Temperatur e vs. Supply Voltag e

www.irf.com 13

PDF created with pdfFactory trial version www.pdffactory.com

 IRS2304(S)PbF

500 500
Turn-O n Rise Time (ns) .

Turn-O n Rise Time (n s) .

400 400

300 300

200 200
M ax
M ax.
100 100
Typ
Typ.
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20

Temperature (oC) V BIAS Supply Voltage (V)

Figure 19A. Turn-On Rise Time Figure 19B. Turn-On Rise Time
vs.Temperatur e vs . Supply Voltage

500 500
Turn-Off Fall Time (n s)
Turn-Off Fall Time (n s)

400 400

300 300

200 200

100 100 M ax
M ax.
Typ
0 Typ. 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
o
Temperature ( C) V BIAS Supply Voltage (V)

Figure 20A. Turn-Off Fall Time Figure 20B. Turn-Off Fall Time
vs. Temperature vs. Supply voltag e

www.irf.com 14
 IRS2304(S)PbF

300 300

250 250

Deadti me (ns)
Deadti me (ns)

M ax.
200 M ax. 200

150 150
Typ. Typ.
100 100
M in.
50 M in. 50

0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature ( oC) Supply Voltage (V)

Figure 21A. Deadtime vs. Temperature

Figure 21B. Deadtime vs. Supply Voltage

0 140
VS Offset Supply Voltage (V)

-2 120
Temperature ( oC)

Typ. 100
-4
80
140 V
-6
70 V
60 0V
-8
40
-10
20
10 12 14 16 18 20 1 10 100 1000
V BS Floating Supply Voltage (V)
Frequency (kHz)

Figure 22. Maximum V S Negative Offset Figure 23. IRS 2304 vs. Frequen cy (IRFBC20),
vs. Supply Voltag e Rga te=33 Ω , VCC=15 V

www.irf.com 15

PDF created with pdfFactory trial version www.pdffactory.com

 IRS2304(S)PbF

140
140

120 120

Temperature (o C)
Temperature (oC)

100
100 140 V

140 V
80 80 70 V
70 V
0 V 0 V

60 60

40 40

20 20
1 10 100 1000 1 10 100 111000
Frequency (kHz) Frequency (kHz)
Figure 24. IRS2304 vs. Frequency (IRFBC30), Figure 25. IRS2304 vs. Frequency (IRFBC40),
R gate =22 Ω , Vcc =15 V R gate =15 Ω , Vcc =15 V

140 V
140 70 V
140
0 V
120 120
Temperature (o C)

Tempe rature ( o C)

100 100

80 80 140 V

60 60 70 V
0V
40 40

20 20
1 10 100 1000 1 10 100 1000

Frequency (kHz) Frequency (kHz)

Figure 26. IRS2304 vs. Frequency (IRFPE50), Figure 27. IRS2304S vs. Frequency (IRFBC20),
R gate =10 Ω , Vcc =15 V R gate =33 Ω , Vcc =15 V

www.irf.com 16

PDF created with pdfFactory trial version www.pdffactory.com

 IRS2304(S)PbF

140 1140 V 70 V
140
120
120

Temperature (o C)
Temperature (oC)

140 V
0V
100
70 V 100
80 0 V 80
60 60
40 40

20 20
1 10 100 1000 1 10 100 1000
Frequency (kHz)
Frequency (kHz)
Figure 28. IRS2304S vs. Frequency (IRFBC30), Figure 29. IRS2304S vs. Frequency (IRFBC40),
R gate =22 Ω , Vcc =15 V R gate =15 Ω , Vcc =15 V

140 V 70 V 0 V
140

120
Tempr eture (oC)

100

80

60

40

20
1 10 100 1000
Frequency (kHz)

Figure 30. IR2304s vs . Frequency (IRFPB50),

R gate =10 Ω , Vcc =15 V

www.irf.com 17

PDF created with pdfFactory trial version www.pdffactory.com

 IRS2304(S)PbF
Case outlines

01-6014
8-Lead PDIP 01-3003 01 (MS-001AB)

INCHES MILLIMETERS
D B DIM
MIN MAX MIN MAX
A 5 FOOTPRINT A .0532 .0688 1.35 1.75
A1 .0040 .0098 0.10 0.25
8X 0.72 [.028]
b .013 .020 0.33 0.51
8 7 6 5 c .0075 .0098 0.19 0.25
6 H D .189 .1968 4.80 5.00
E 0.25 [.010] E .1497 .1574 3.80 4.00
A
1 2 3 4 6.46 [.255] e .050 BASIC 1.27 BASIC
e1 .025 BASIC 0.635 BASIC
H .2284 .2440 5.80 6.20
K .0099 .0196 0.25 0.50
L .016 .050 0.40 1.27
6X e 3X 1.27 [.050] 8X 1.78 [.070] y 0° 8° 0° 8°

e1 K x 45°
A
C y

0.10 [.004]
A1 8X L 8X c
8X b
7
0.25 [.010] C A B

NOTES: 5 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.

1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994.
2. C ONTROLLING DIMENSION: MILLIMETER
3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].
4. OUTLINE C ONFORMS TO JEDEC OUTLINE MS-012AA.
8 Lead SOIC
MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].
6 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.
MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].
7 DIMENSION IS THE LENG TH OF LEAD FOR SOLDERING TO
A SUBSTRATE.
01-6027
01-0021 11 (MS-012AA)

www.irf.com 18
 IRS2304(S)PbF

Tape & Reel LOAD ED TA PE FEED DIRECTION

8-lead SOIC
B A H

F C

N OT E : CO NTROLLING
D IM ENSION IN M M E

C A R R I E R T A P E D IM E N S I O N F O R 8 S O I C N
M e tr ic Im p e r ia l
Co d e M in M ax M in M ax
A 7 .9 0 8 .1 0 0. 31 1 0 .3 1 8
B 3 .9 0 4 .1 0 0. 15 3 0 .1 6 1
C 1 1 .7 0 1 2 . 30 0 .4 6 0 .4 8 4
D 5 .4 5 5 .5 5 0. 21 4 0 .2 1 8
E 6 .3 0 6 .5 0 0. 24 8 0 .2 5 5
F 5 .1 0 5 .3 0 0. 20 0 0 .2 0 8
G 1 .5 0 n/ a 0. 05 9 n/ a
H 1 .5 0 1 .6 0 0. 05 9 0 .0 6 2

B
C
A
E

R E E L D IM E N S I O N S F O R 8 S O IC N
M e tr ic Im p e r ia l
Co d e M in M ax M in M ax
A 32 9.60 3 3 0 .2 5 1 2 .9 76 1 3 .0 0 1
B 2 0 .9 5 2 1 . 45 0. 82 4 0 .8 4 4
C 1 2 .8 0 1 3 . 20 0. 50 3 0 .5 1 9
D 1 .9 5 2 .4 5 0. 76 7 0 .0 9 6
E 9 8 .0 0 1 0 2 .0 0 3. 85 8 4 .0 1 5
F n /a 1 8 . 40 n /a 0 .7 2 4
G 1 4 .5 0 1 7 . 10 0. 57 0 0 .6 7 3
H 1 2 .4 0 1 4 . 40 0. 48 8 0 .5 6 6

www.irf.com 19

PDF created with pdfFactory trial version www.pdffactory.com

 IRS2304(S)PbF

LEADFREE PART MARKING INFORMATION

Part number IRSxxxxx

Date code YWW? IR logo

Pin 1 ?XXXX
Identifier
Lot Code
? MARKING CODE (Prod mode - 4 digit SPN code)
P Lead Free Released
Non-Lead Free
Released
Assembly site code
Per SCOP 200-002

ORDER INFORMATION
8-Lead PDIP IRS2304PbF
8-Lead SOIC IRS2304SPbF
8-Lead SOIC Tape & Reel IRS2304STRPbF

The SOIC-8 is MSL2 qualified.

This product has been designed and qualified for the industrial level.
Qualification standards can be found at www.irf.com
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105
Data and specifications subject to change without notice. 12/4/2006

20
www.irf.com