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IrDA Physical Layer

Implementation for Hewlett-


Packard’s Infrared Products

Application Note 1119

An IrDA physical layer implemen- expressed in NRZ data format. made up of ≤ 50% duty cycle
tation will include the data host Not-Return to Zero (NRZ) data is pulses would limit the heating
(UART, RS232, microprocessor, or 100% duty cycle, and so does not time period, and allow for IR
microcontroller), the IrDA modu- contain discrete pulses represent- emitter cooling after each pulse.
lator/demodulator (I/O chip, ASIC, ing data bits. See Figure 2. IrDA data modulations use ≤ 25%
or discrete IC), and the infrared duty cycle RZ pulses for all data
transceiver. The exact implemen- If NRZ data were sent directly to rates.
tation for each block will depend the IR transmitter, the IR emitter
upon the chosen bit rate for data would dissipate power for several Data Rates of
communication, and upon the bit periods in the case of a long 9.6-115.2 kbits/second
application system’s architecture. sequence of 1 bits. The lengthy Infrared data communication at
Bit rates at or below 115.2 kbits/ power dissipation could over- data rates ≤ 115.2kbits/s is de-
second can utilize serial ports of stress the IR emitter if it exceeds signed to utilize the serial port
UARTs, RS232 ports, microproces- the datasheet’s absolute maximum function of various devices. The
sors, or microcontrollers for the ratings. Emitter current for serial port data is Not-Return-to-
data host. Infrared data communi- infrared transmission is typically Zero (NRZ) modulation format,
cation hardware for bit rates in the 100’s of milliamps, and bulk and so needs to be modulated
above 115.2 kbits/second must resistance of typical IR emitters is further for use with infrared
interface to the microprocessor or 1-3 ohms. Power dissipation as components. The IrDA modula-
microcontroller data and address heat in the IR emitter can be as tion/demodulation function is
buses. The application system’s high as 0.7-1.5 watts for continu- available in 8-16 pin EnDec
architecture will help determine ous bias. Return to Zero (RZ) data (Encode/Decode) chips, or is
whether the infrared hardware
interface should be to a UART,
RS232, microprocessor, or INFRARED
SERIAL OUT TRANSMIT
microcontroller. See Figure 1. UART
RS232 MODULATION/
µP DEMODULATION
IrDA Data Modulation µC
SERIAL IN INFRARED
UART, RS232, microprocessor, or RECEIVE
microcontroller data needs to be Figure 1.
modulated for infrared data
communication. The infrared NRZ DATA
transceiver requires discrete
0 1 1 1 1 0 0 0
pulses to represent data bits. RZ 25% DUTY

UART, RS232, microprocessor, CYCLE DATA


and microcontroller data bits are Figure 2.
2

embedded into several common HSDL-1001 HSDL-7000 EnDec with no external


I/O chips manufactured by ASIC 16xBaud generator.
National Semiconductor, SMC,
IRTX 6
VLSI, or Winbond. UARTs with no 16xBaud pin
available should use the HSDL-
IRRX 4
Systems requiring I/O chips for 7001 and its internally generated
non-IrDA applications can often 16xBaud signal. The HSDL-7001’s
make use of I/O chips containing Figure 4. A0-A1 baudrate address lines can
the embedded IrDA modulation/ be programmed through the DTR
demodulation. Notebook PC’s and (HSDL-7000 or HSDL-7001), and an and RTS lines of the UART, or hard
desktop PC’s are examples of infrared transceiver (HSDL-1001). wired for a fixed 9600 bits/s data
systems which would use such Products such as handheld PCs, rate. Baudrate address line A2
I/O chips. The infrared enabled pocket organizers, pagers, cellular should be pulled low. See Figure 6
I/O chip can then interface directly phones, electronic measurement and Table 1.
to the infrared transceiver for instruments, and medical equip-
data communication. Figure 3 is ment are examples of systems that An example of an RS232 driven
an example implementation using would use such an implementation. infrared system is shown in the
the National Semiconductor diagram below. The HSDL-7001’s
PC87334 Super I/O chip and the A UART implementation example baudrate address lines should be
Hewlett-Packard HSDL-1001 is shown in Figure 5. UARTs which set using the DTR and RTS lines of
infrared transceiver. provide a 16xBaud pin can use the the RS232 port, just as in the UART
HSDL-1001
case above. See Figure 7.

PC87334 HSDL-1001

IRTX 63 6 UART HSDL-7000


7
SERIAL IN RCV IR_TXD 6
IRRX 68 4 3
SERIAL OUT TXD 6
2 IR_RCV 4
16 x BAUD 16 x BAUD
1
5
Figure 3. NRST
VCC
10 K OHM

Systems which use ASICs that


could contain peripheral func- 0.1 µF
tions can implement infrared
Figure 5. GND
communication with the IrDA
EnDec’s netlist along with a HSDL-1001
Hewlett-Packard transceiver. The
EnDec netlist can be embedded UART HSDL-7001
11
into the ASIC, and the Hewlett- GND A2
IR_TXD 6
6
Packard HSDL-1001 transceiver 10
RTS A1 IR_RCV 4
can be connected directly to the 5
DTR A0
ASIC. The EnDec netlist is 4
available from Hewlett-Packard SERIAL IN
3
RCV
15
OSCIN 15 pF
for customers also implementing SERIAL OUT
2
TXD
Hewlett-Packard’s infrared 10 MΩ XTAL GND
14
transceivers into their system. See OSCOUT 15 pF
Figure 4. 9
NRST VCC

Infrared data communication 10 K OHM


driven from the UART, RS232, or
microcontroller can be imple- 0.1 µF
mented with an 8-16 pin EnDec
Figure 6. GND
3

Table 1. A microcontroller implementation


would also use the HSDL-7001
DTR (A0) RTS (A1) Data Rate (bits/s) EnDec, and HSDL-1001 trans-
Programmed Programmed
ceiver, as shown in Figure 8.
Low Low 115200

Low High 57600


The CLKSEL pin can be pulled
down to ground to enable the
High Low 19200 HSDL-7001 internal 16xBaud
High High 9600
generator, instead of programming
it through the microcontroller.
The PULSEMOD pin can be pulled
HSDL-1001
high for 1.63 µs pulse mode or
RS232 232 TO TTL HSDL-7001 pulled low for 3/16 modulation.
11
IR_TXD 6 Programming the POWERDN pin
GND A2
6
10
high shuts down the HSDL-7001
RTS RTS A1 IR_RCV 4
5 internal oscillator, which accounts
DTR DTR A0 for most of the EnDec’s power
4
SIN TTL SERIAL IN
3
RCV
15
consumption. See the HSDL-7001
OSCIN 15 pF datasheet for information on
SOUT TTL SERIAL OUT TXD
2
10 MΩ XTAL setting the baudrate address lines
GND
14 A0-A2.
OSCOUT 15 pF

9
NRST VCC Data Rates of 0.576, 1.15,
10 K OHM and 4.0 Mbits/second
Infrared data communication
0.1 µF implementations using data rates
≥ 115.2 kbits/s need to interface to
GND
Figure 7. the microprocessor or
microcontroller data bus. The
system bus data is typically in NRZ
format and so IrDA modulation/
HSDL-7001
demodulation is necessary. Each
MICROCONTROLLER IrDA data rate ≥ 115.2 kbits/s
IO6 POWERDN requires a specific modulation
13 HSDL-1001
IO5 PULSEMOD format, which can be provided by
12
IO4 CLKSEL
an infrared controller chip or an
7 11 I/O chip with embedded IrDA
IR_TXD 6
IO3 A2
6 modulation/demodulation.
IO2 A1 10
IR_RCV 4
5
IO1
4
A0 The data transfer to the micropro-
SERIAL IN RCV cessor or microcontroller can
3 15
SERIAL OUT TXD
OSCIN 15 pF either be through Direct Memory
2
10 MΩ XTAL GND Access (DMA), or through inter-
OSCOUT
14
15 pF rupts.
9
NRST VCC Each implementation makes use of
10 K OHM either the HSDL-1100 or the HSDL-
2100 infrared transceiver. The
HSDL-2100 is specifically designed
0.1 µF
for applications requiring small
Figure 8. GND package height. Both transceivers
have a data receive pin (RxdA) for
data rates up to 115.2 kbits/s, and a R1
TXD
SUPER I/O IRTX
data receive pin (RxdB) for data
CX2
rates above 115.2 kbits/s. HSDL-1100
RXDA
IRRX OR
HSDL-2100
Systems such as notebook PCs and
RXDB
desktop PCs, which require an I/O RXAUX

chip for non-IrDA applications can


use I/O chips with embedded IrDA Figure 9.
modulation/demodulation. The I/O
chip connects directly to the
infrared transceiver. I/O chips Table 2.
with up to 4 Mbits/s IrDA modula-
tion/demodulation include: Na- Super I/O Txd RxdA RxdB
tional Semiconductor PC87338, NS IRTX pin 39 IRRX1 pin 38 IRSLO/IRRX2 pin 37
SMC FDC37C669FR or PC87338
FDC37C95xFR, VLSI VL82C147.
SMC TXD2/IRTX pin 89 RXD2/IRRX pin 88 IR_Mode/IRR3 pin 23
Implementations using these I/O
FDC37C669
chips and the HSDL-1100 or HSDL-
2100 infrared transceiver are SMC IRTX pin 204 IRRX pin 203 IR_Mode pin 190
shown in Figure 9 and Table 2. FDC37C95x
VLSI IROUT pin 66 SIRIN pin 67 FIRIN pin 65
Refer also to the application note VL82C147
titled General Application Guide
for the HSDL-1100 4 Mbits/s
Infrared Transceiver, and the note
titled Report on HSDL-1100 Inter-
operability with 4 Mbits/s Infrared
Controllers.

Systems needing to drive infrared


communication from the
microprocessor or microcontroller
bus can use an infrared controller
(PC87109, SMC35C44) connected
to the infrared transceiver (HSDL-
1100 or HSDL-2100). Products such
as handheld PCs, pocket
organizers, pagers, cellular phones,
electronic measurement
www.hp.com/go/ir
instruments, and medical
For technical assistance or the location of
equipment are examples of your nearest Hewlett-Packard sales office,
systems that would use such an distributor or representative call:
implementation. Americas/Canada: 1-800-235-0312 or
(408) 654-8675
Far East/Australasia: Call your local HP
sales office.
Japan: (81 3) 3335-8152
Europe: Call your local HP sales office.
Data Subject to Change
Copyright © 1998 Hewlett-Packard Co.
Obsoletes 5965-9636E
Printed in U.S.A. 5966-3871E (2/98)

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