ISSN: 2277-3754

ISO 9001:2008 Certified

International Journal of Engineering and Innovative Technology (IJEIT)
Volume 7, Issue 2, August 2017

Fabrication of Copper Foam from Copper - Polymer

composite By Powder Metallurgy Technique for
using as Electrode
Alaa I. Eid a, Omayma A.M. Elkadyb, Elsayed. M. Elsayed c, Ahmed Abu-Oqaild
a
Polymer composite and nanocomposite Laboratory, Advanced Material Division, Central
Metallurgical R&D Institute.
b
Powder Metallurgy Division, Manufacturing Department, Central Metallurgical R&D Institute, P.O.
87 Helwan, 11421, Egypt
c
Chemical & Electro-processing department , mineral technology division, Central Metallurgical R&D
Institute, P.O. 87 Helwan, 11421, Egypt
d
Mechanical Department, Faculty of Industrial Education, Beni-Suef University, Egypt
heat dissipation and catalyst support, the cells need to be open
Abstract— Copper foam was prepared using copper powder and small. The metal matrix may be Cu, Fe, Ti or Ni based
and epoxy resin with sodium bicarbonate as a foaming agent by alloy, these metals have much higher melting point than Al.
powder metallurgy technique. Copper powder was prepared by
Solid route manufacturing technologies are then often
water atomization technique; it was mixed with 12.5, 25 and 50 wt.
% epoxy resin, then sintered at 600 ⁰C and 800 ⁰C in an argon adopted [5]. For instance, in automotive industries, aluminum
atmosphere for one hour. Microstructure was estimated by both foam material has been applied to increase fuel efficiency due
optical and FE-SEM which indicated the homogeneous to its weight reduction. It is also utilized in automotive
distribution of irregular shape pores all over copper matrix. Phase structure to absorb impact during a car accident. Other
structure was investigated by XRD that gives only peaks applications of metal foam, e.g. copper foam, have been also
corresponding to copper metal in all samples. Density and
porosity were measured by Archimedes principle, which indicated developed, such as thermal pipe, heater plate, and cooling fins
that sample containing 25 wt. % epoxy resin Cu foam sample has [3-5]. Requirements for using bare electrodes in
the highest relative porosity at 800 oC. Compressive strength for electrochemical analysis with strong catalytic activity in the
samples sintered at the 800 oC indicated that sample containing reduction of ions and good stability under the test conditions.
50 wt. % epoxy has the lowest compressive strength value. The After screening several cathode materials, various
three copper foam samples have been tested as an electrode for
investigators have converged to identify copper [6 – 8] or its
electro analysis processes, zinc oxide thin film has been
successfully prepared by electrode position onto copper foam alloys, especially Cu-Ni [9, 10], as the most suitable ones.
substrates using zinc nitrate, aqueous solution at room Open cell foams are manufactured via foundry or powder
temperature, and the deposition was conducted using the cyclic metallurgy technique in which metal powders are the most
voltammeteric technique. The effect of substrate type on the widely used. These methods have a good control over the cell
deposition and dissolution currents was fully analyzed. Also, it has shape, cell size and porosity distribution. Some investigators
good effect on the corrosion behavior of the copper foam samples.
The results showed that sample containing of 25 wt. % epoxy at have used the Sintering and Dissolution Process (SDP) to
800 O C resin is the most suitable one for these purposes.. manufacture the metal based foams [4, 5], and recently, the
Lost Carbonate Sintering (LCS) process became the subject
Keywords — Copper foam, Powder metallurgy, Polymers, of some research in this area [6]. Copper foam is a popular
Epoxy resin, Porosity, Foaming materials, Electrochemical metallic foam which characterized by excellent ductility as
deposition; Corrosion resistance. well as good thermal and electrical conductivities. Therefore,
they are very attractive for potential in industrial applications
I. INTRODUCTION
such as porous electrodes in rechargeable batteries, fuel cells,
Metal foams are a new class of materials with low density
heat exchangers, catalytic substrates for chemical reactions
and novel physical (thermal and electrical), mechanical and
and filtration applications. For such applications, the pore
acoustic properties. They offer potential for lightweight
structure is considered a key factor for the sustainable design
structures, for energy absorption and thermal management. It
of high performance porous components and should therefore
possesses unique characteristics such as low density, high
exhibit a high degree of porosity uniformity and controllable
stiffness in conjunction with very low specific weight and
porosity distribution [1-4]. The Fabrication of porous copper
high gas permeability combined with high thermal
by unidirectional solidification under hydrogen and its
conductivity [1- 4]. In the last decades, there was a
properties were investigated by Nakajima et al. [10].
considerable interest metal foams that have recently
Recently, LCS process was used for manufacturing open cell
increased, due to the process developments promising a better
copper foams [5, 6].
quality of the foamed material [3]. For functional
The aim of this research is to investigate of manufacture
applications, such as sound absorption, thermal insulation,

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 ISSN: 2277-3754
ISO 9001:2008 Certified
International Journal of Engineering and Innovative Technology (IJEIT)
Volume 7, Issue 2, August 2017
copper foams by using polymeric materials for working electrode, platinum as a counter electrode (1 cm2)
electrochemical analysis application and to understand the and silver / silver chloride (Ag/AgCl) (+220 mV vs. normal
effect of epoxy resin on performance copper foam electrode hydrogen electrode as a reference electrode (HANNA
in an electrochemical cell, corrosion rate and mechanical Instruments, Italy). The electrolyte is 0.05 M KNO3, and 0.1
behavior of copper foam products. M Zn (NO3) 2y, and the analytical grade reagents worked at
room temperature. The working and counter electrodes were
II. MATERIALS & METHODOLOGY mounted parallel to each other at a distance of 0.5 cm a part,
In this study the copper powder fabricated by a water without stirring. All substrates were cleaned by an ultrasonic
atomization method with particle size 150 µm and 99% purity bath with deionized water followed by rinsing in an ethanol
was mixed with an epoxy resin by three percent 12.5, 25 and bath. Copper substrate samples were etched for 15 sec. With
50 wt. % in the presence of 1wt.% foaming agent . A dilute hydrochloric acid to eliminate the oxide layer. Prior to
dispersing agent of 1wt.% was also added for improving the the film deposition, the copper substrate was polished with
wettability and dispersity of Cu particles with the polymeric emery paper, followed by an etching process in dilute
material. They are mixed with each others at room hydrochloric acid for 30 s and rinsing in distilled water. This
temperature with rotation speed of 50 RPM, then sintered at preparation method provides chemically clean and smooth
two different temperatures 600 & 800oC under argon surface, which is important for the cyclic voltammetry
studies. Cyclic voltammetry curves were measured by
atmosphere to prevent the oxidation process. The density was
sweeping from 1000 to -2000 mV vs and Ag/AgCl electrode
estimated by Archimedes principle, in which the actual
at a selected potential was sweeped by a rate of 10 mV s-1.
density of the prepared samples was determined according to
The voltammetric response was obtained from a
ASTM D1217 standard, using water as a floating liquid high-performance 20 V/1A potentiostate/galvanostate, Volta
according to MPIF standard 42, 1998. The sintered specimens Lab 21 PGP 201 model, coupled to a computer to record
were weighed in air and in distilled water after its capsulation current and potentials. The resulting deposited ZnO film on a
with paraffin wax to prevent entering of water in the pores, copper electrode was rinsed thoroughly with water, ethyl
then their densities (D) were calculated according to the alcohol then dried under vacuum in a desiccator for one hour.
following equation:-
D = Wa / (Wa - Ww) III. RESULTS AND DISCUSSIONS
Where, Wa and Ww are the masses of the sample in air and A. Densification and Porosity Measurements
water respectively. The relative density of the composite is The relative porosity of Cu-foam samples sintered at 600
the ratio of the measured sintered density (actual density) to and 800 ⁰C are given in figure (1). There are two phenomena
the theoretical one. The degree of porosity of the sintered the higher porosity percent of samples sintered at 800 ⁰C than
compacts was calculated according to the following those sintered at 600 ⁰C, which may be due to the suitable
equation:- sintering temperature, for complete decomposition of the
Porosity% = (Dth-Do)/Dth%
polymeric material with a foaming agent that gives a large
Where, Dth is the theoretical density of the sintered sample
number of pores. The second phenomena are the higher
and Do is the actual density. The phase constituent of the
porosity percent of sample containing 50 wt. % epoxy resin,
sintered specimens was achieved by x-ray diffraction analysis
using x-ray diffractometer model x, pert PRO which may be attributed to the suitable epoxy resin percent
PANALYTICAL with Cu kα radiation (λ=0. 15406 nm). The with 1 wt%. Foaming agent at 800 oC sintering temperature.
sintered samples were ground successively with 600, 800, While 1 wt. The % foaming agent is not sufficient for 12.5 and
1000, 1200, 2000 and 3000 grit SiC papers. Then, the 50 wt. % epoxy resin. So, 25 wt% epoxy resin with 1 wt%.
specimens were polished with 3 micrometer alumina paste Foaming agent added for copper powder and sintered at 800
using a machine model "Buhlertm". The microstructure of the OC is the most suitable parameters that give the highest.
polished samples was investigated by Field emission scanning
electron microscope (FE-SEM), model (FE-SEM;
QUANTAFEG250, Holland) equipped with energy
dispersive X-ray (EDX) spectrometers, and secondary
electron (SE) and backscattered electron (BSE) detectors for
the determination of particle size, morphology and chemical
composition. Compression strength testing of the
investigated samples was also measured using uniaxial
SHIMADZU universal testing machine UH-F500KN. The
area of the specimen is (65.86 mm2) and the applied
cross-head speed is 2mm/min. The test was conducted at
room temperature. Copper foam can be used as an electrode in
electrochemical cells, this is achieved by immersing the Cu
foam in an electrolyte in which a conventional three-electrode Fig. (1) The density and porosity of the Cu foam with 12.5, 25
cell was used with different copper sheets (1 cm2) as a and 50 wt. % epoxy resin sintered at 600 and 800 ⁰C.

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B. XRD Measurement 1. Optical Microscopic Studies
The phase structure of copper foam specimens with 12.5, Figures (5 and 6) show the optical micrographs of 12.5, 25
25 and 50 wt. % epoxy resin are estimated by X-ray and 50 wt.% epoxy resin samples sintered at 600 oC and 800
diffraction. Figure (2) represents the XRD pattern which oC respectively . The results indicated the appearance of two
indicated that only peaks corresponding to copper metal were types of pores, open pores and closed nearly rounded pores.
observed in all samples sintered at both 600& 800 Oz. This Samples sintered at 800 oC have connected and irregular
may be due to the complete dissociation of the epoxy resin to pores, this may be due to the higher sintering temperature,
carbon dioxide gas and water vapor during the sintering which causes the complete dissociation of the epoxy resin and
process. foaming agent, also give the chance for connection of the
pores with each others. Also cell wall is dense and only micro
pores or voids can be seen and the pores are not uniaxial. The
pores are distributed in a nearly homogeneous manner all over
the copper matrix, in which copper matrix is well sintered
around the pores while samples sintered at 600 oC has a
separate and connected pore, as the temperature is not
sufficient for complete sinterability and connection of pores
[11].

Fig. (2) XRD pattern of sintered Cu foam

C. Photographic Investigations
Figure (3) and (4) show the photo images of copper foam
with 12.5, 25 and 50 wt.% epoxy resin samples sintered at 600
& 800 0C respectively. The samples are in the shape of a
rectangle or cubic form. The porous structure is clear in all FIG (5) METALLOGRAPHIC CROSS SECTION OF (A)12.5 WT.% , (B)
25WT.%, (C) 50 WT.% EPOXY RESIN COPPER FOAM SAMPLES
samples and distributed in a homogeneous manner.
SINTERED AT 600 0C.

FIG (6) METALLOGRAPHIC CROSS SECTION OF (A)12.5 WT.% , (B)

Fig. (3) The photo images of (a)12.5 wt.% , (b) 25wt.%,50 wt.% 25WT.%, (C) 50 WT.% EPOXY RESIN COPPER FOAM SAMPLES
Epoxy resin copper foam samples sintered at 600 0C. SINTERED AT 800 0C.

2 Scanning Electron Microscopic Investigation

Fig. (4) The photo images of (a)12.5 wt.% , (b) 25wt.%,50 wt.%
Epoxy resin copper foam samples sintered at 800 0C.
D. Microstructure Investigations
Microstructure of copper foam was examined by both
optical (OM) & field emission scanning electron microscopes
(FE-SEM).
Figure (7) represents the microstructure of 25wt. %
epoxy resin sample sintered at 800 oC at magnifications 70X,
100X and 250X. There are some variations in both pore size
and particle size of copper, the pore size ranges from 20 µm to
200 µm. The particles of copper matrix are well sintered
around these pores, although interparticle pores are shown.
Also higher cell wall porosity and more interconnected pores
are observed. This may be attributed to the suitable added
epoxy resin percent and foaming agent to copper powder as
they are a main factor in formation pore and shape. It is clear
that sample containing 25wt. % epoxy has the most
homogenous pore distribution in the Cu matrix. There are
regular distribution of the pores which related to the

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 ISSN: 2277-3754
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International Journal of Engineering and Innovative Technology (IJEIT)
Volume 7, Issue 2, August 2017
homogenization between Cu powder, epoxy resin and the according to the following scheme [12]
foaming agent during the mixing process that play an
important role in this process, as these pores are attributed to
the decomposition and evaporation of polymeric material
during the sintering process.
Fig (7) Scanning electron micrographs of 25 wt. % epoxy
resin copper foam samples sintered 800 0C at (a) 70 X (b) 100 X
(c) 250 X .
E. Compression Strength
The compression strength of a foaming material depends
greatly on the density; also pore distribution, size and shape.
Figure (8) shows the experimental stress–strain curves for
copper foam with 12.5, 25 and 50 wt.% epoxy resin samples
sintered at 800 0C. All curves display one behavior for all
samples illustrated as follows; in this first step at the
beginning of the load the specimens deformed elastically and
bending occurs only, in this section the pore remained
unharmed. The second step copper foam 50 wt. % epoxy
sample has the lowest compressive strength value due to the
high porosity percent created by the epoxy and foaming
materials percent in which the pore are considered a weak
point for crack initiation and propagation [11].
Fig. (8) Compressive stress–strain curves for Cu foam 12.5, 25,
50 wt.% epoxy resin sintered at 800 ⁰C.
F. Copper Foam as an Electrode for ZnO Film Formation
Porous copper foam can be used, as an electrode for
electrochemical deposition of metals, by immersing in an
electrolytic solution of an electrochemical cell. In this work
Cu-foam electrode was used in cyclic Voltammetry of ZnO
film deposition by immersing in Zinc nitrate solution, based
on the reduction of nitrate at the copper foam electrode,
raising the local pH and causing precipitation of the
hydroxide phase and subsequent dehydration to the oxide,
4
NO3- + H2O + 2 e- = NO2- + 2 OH- (E0 = - 0.24 V vs. SCE) (1)
Zn2++2OH-=Zn(OH)2(S) (2)
Zn (OH) 2 (S) = ZnO + H2O (3)
The overall expression of the reaction is:
Zn2+ + NO3- + 2 e- = ZnO + NO2- (E0 = - 0.246 V vs. SCE) (4)
The cathodic electrode position of ZnO thin film from nitrate
solution is thought to proceed via the reduction of nitrate ions
according to equation (1). The as-generated hydroxide ions
would react with Zn2+ ions to form Zn(OH)2 according to
equation (2). Subsequently, Zn(OH)2 is spontaneously
dehydrated into ZnO equation )3). During the electrode
position of ZnO films, nitrate ions are used as oxygen
precursor.
1 Copper Foam Samples Sintered at 600 oC
Figure (9) shows four typical cyclic voltammograms
recorded with four different copper electrodes in a bath
containing 0.05 M Zn (NO3)2 + 0.05 M KNO3. Curve
(standard) displays the cyclic voltammogram recorded in the
deposition solution of ZnO on solid, non porous copper
substrate which is prepared from water atomized copper
powder that compacted under 700 MPa pressure, then
sintered in a vacuum furnace at 900 oC for 1 hour. This
sample was used as a reference sample for the comparison
with the three copper foam samples, in this curve, ZnO begins
to deposited at potential -100 mV (Ag/AgCl), and cathode
potential of -1.2 V vs. Ag/AgCl a steep increase of the
cathodic current takes place up to 13 mA cm-2 which
corresponding to nitrate ions reduction and hydrogen gas
evolution but observed anodic current is 20 mA cm-2
associated with anode potential 20 mV and is likely due to
oxygen evolution [12, 13]. The rate of ZnO electrode position
reaction and rate of anodic reaction are directly proportional
to the recorded deposition current value in the
voltammogram.
Curve (S1) which represents the cyclic voltamogram of Cu
– 12.5 wt% epoxy sample. It displays the cyclic
voltammogram recorded in the deposition solution of ZnO on
porous copper substrate sintered at 600 0C. ZnO deposition
begins at cathodic deposition potential -300 mV higher than
that of standard non porous Cu. Also at the cathode potential
of -1.5 V a week increase of the cathodic current takes place
up to 5 mA cm-2 that corresponding to hydrogen gas
evolution [12]. In the anodic reverse direction, the observed
oxygen evolution current of standard non porous Cu is 2 mA
cm-2 and started at anodic potential 500 V [13]. Also the
deposition potential is higher than that of standard non porous
Cu by -300 mV and the deposition current is lower by 8
mAcm-2. In additions, the anodic potential is higher by 480
mV and the anodic current is lower than that of curve 1
(standard non porous Cu) by 18 mAcm-2. Similar behavior
was observed with the fourth curve (S3), which displays the
cyclic voltammogram of ZnO on porous copper substrate.
The deposition potential of curve S3 is higher than that of
curve by -400 mV while the deposition current is lower than
 ISSN: 2277-3754
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that of curve 1 by 11 mAcm-2. Also the anodic potential of S2 curve displays the cyclic voltammogram for the
curve S3 is higher than that of curve 1 by 580 mV and the deposition solution of ZnO on porous copper substrate
anodic current is lower by 19 mAcm-2. contains 25 wt.% epoxy resin. In this curve, ZnO deposition
begins at cathodic deposition potential -300 mV higher than
that of standard non porous Cu. Also at the cathode potential
of -500 mV, in which a small increase of the cathodic current
takes place up to 7 mA cm-2 which corresponding to
hydrogen gas evolution [12]. In the anodic reverse direction,
the observed oxygen evolution current is 3 mA cm-2 and
started at anodic potential of 500 mV [13].
The deposition potential of curve S2 is higher than that of
curve 1 by - 200 mV and the deposition current is lower by 6
mAcm-2, while the anodic potential is higher by 500 mV and
the anodic current is lower by 17 mAcm-2. All these resulte
indicated that 25 wt.% epoxy resin porous copper sample
Curve (S1) is the best in its electrochemical deposition
behavior.

Fig (9) Four typical cyclic voltammograms recorded with

copper samples electrodes sintered at 600oC in a bath
containing 0.05 M Zn (NO3)2 + 0.05 M KNO3.
Curve S2 displays the cyclic voltammogram of 25 wt%
epoxy resin copper foam sample recorded for ZnO film
deposition on porous copper substrate. The voltammogram
showed a behavior better than curve 1 in both cathodic and
anodic directions which indicated that this samples is the best
in both deposition and dissolution conditions. In which the
deposition potential is lower than that of curve 1 by -40 mV
and the deposition current is higher by 5 mAcm-2., while the
anodic potential is lower by 5 mV and the anodic current is
higher by 4 mAcm-2. So, these results sample.
This can be explained by the porosity of this sample which
gives high surface area that is more catalytic for the electro
chemical deposition [13]. Figure (9) showed that 25wt.% Fig (10) Four typical cyclic voltammograms recorded with
copper samples electrodes sintered at 800oC in a bath
epoxy resin Cu foam sample (curve S2) is the best in its
containing 0.05 M Zn(NO3)2 + 0.05 M KNO3.
electrochemical deposition behavior .
2 Copper Foam Samples Sintered at 800 oC. G. Corrosion Behavior of Copper Foam
Figure (10) shows four typical cyclic voltammograms The corrosion behavior of different copper foam samples
recorded with four different copper foam electrodes sintered prepared at 600 0C in 0.1M ZnNO3 + 0.05 M KNO3 bath is
at 800oC in a bath containing 0.05 M Zn(NO3)2 + 0.05 M observed in Figure (11). The results showed that, the
KNO3. As in figure (9) curve 1 displays the cyclic corrosion rate of non porous copper sample in bath containing
voltammogram recorded in the deposition solution of ZnO on 0.1 MZnNO3 + 0.05 M KNO3 is about 1.062 mm/Y at a
non-porous copper substrate. corrosion current of 0.0908 mA cm-2.
Curve S1 displays the cyclic voltammogram recorded in S1 and S3 samples that contains 12.5 wt.% and 50wt.%
the deposition solution of ZnO on porous copper substrate epoxy resin showed a higher corrosion rate 1040 and 932
sample S1 (12.5 wt.% epoxy resin sample sintered at 800 oC mm/Y respectively with respect to the non porous one copper
). The voltammogram showed better behavior than curve 1 in sample and a higher corrosion current of about 88.92 and 79
both cathodic and anodic directions which indicated that mm/Y with respect to the non porous one. For S2 sample that
copper substrate which is copper foam with 12.5 wt.% epoxy contains 25 wt.% epoxy, the corrosion rate in nitrate bath was
resin sample is the best in electrochemical deposition and about 13.68 mm/Y while the corrosion current was 1.14 mA
dissolution process. The deposition potential of curve S1 is cm-2. So S2 is the best in its electrochemical corrosion
lower than that of curve 1 (standard non porous Cu) by -70 behavior with respect to the other samples. This my be
mV while the deposition current is higher by 8 mAcm-2 and attributed to the higher density and lower porosity of the
the anodic potential is lower by 20 mV and the anodic current samples in which as the porosity increases the surface area
is higher by 4 mAcm-2. increases and the catalytic behavior increases which stimulate

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 ISSN: 2277-3754
ISO 9001:2008 Certified
International Journal of Engineering and Innovative Technology (IJEIT)
Volume 7, Issue 2, August 2017
the corrosion [14]. While, as the sample becomes more dense foam with 12.5 % wt. epoxy resin in nitrate bath was about
this resists the corrosion.
Fig. (11) Corrosion behavior of copper samples prepared at
600 0C.
Figure (12) represents the corrosion rate of copper foam
samples prepared at 800 0C in the same a bath containing 0.1
M ZnNO3 and 0.05 M KNO3 . It was about 1.062 mm/Y
while the corrosion current was 0.0908 mA cm-2. S1 and S3
samples showed a higher corrosion rate of 1040 and 932
mm/Y with respect to the non porous sample, also a higher
corrosion current of about 88.92 and 79 mm/Y respectively.
For S2 sample the corrosion rate was about 13.68 mm/Y
while the corrosion current was 1.14 mA cm-2.
The results showed that S2 sample sintered at 800 0C is the
nearest on to the non porous sample in its electrochemical
corrosion behavior. While, S1 sample is the worst one.
Fig. (12) Corrosion behavior of copper samples prepared at 800
0C.
Fig. (12) showed that, the corrosion rate of copper sample
(non porous) sintered at 800 0C in 0.1 M ZnNO3 + 0.05 M
KNO3 bath is about 1.062 mm/Y while the corrosion current
was 0.0908 mA cm-2. Samples 1 and 3 showed a higher
corrosion rate of 120 and 67 mm/Y with respect to
non-porous sample. Also, a higher corrosion current of about
1412 and 790 mm/Y with respect to non porous sample,
respectively.
The corrosion rate of (Sample number 1) which is the Cu-
2.535 mm/Y while the corrosion current was 0.21 mA cm-2.
Porous sample number 1 sintered at 800 0C is the nearest and
best porous sample in its electrochemical corrosion behavior
with respect to other samples. While, sample number 2
showed the worst one.
Copper foams are characterized by excellent ductility as
well as good thermal and electrical conductivities this gives it
the facilities to use as, pours electrodes, a catalectic substrate
for chemical reactions and filtrations applications also the
pores structure is considered a mean factor for a uniform
distribution of pours which plays a big role in all the above
applications.
IV. CONCLUSION
In the present work, Copper foam are fabricated using
copper powder with Polymeric materials by powder
technology technique to be used as an electrode in
electrochemical cell analysis, have been prepared in three
electrodes from mixed with 12.5, 25 and 50 wt. % epoxy resin
with copper powder, Cu foam specimens were divided based
on the sintering temperature at 600 and 800 oC. Based on the
mechanical, physical and performance of electrode in
electrochemical cell of the investigated electrodes specimens,
the following remarks can be highlighted:
• After Cu foam sintered have been complete dissociation
of the epoxy resin to carbon dioxide gas and water vapor
and homogeneous distribution of irregular shape pores all
over copper matrix.
• Increase addition of epoxy resin from 12.5 to 50 wt. %
and sintering temperature from 600 to 800 leads to a relative
porosity increase.
• Positive effect of the 25 wt. % epoxy resin porous copper
sample is the best in its electrochemical deposition and
corrosion rate behavior and it is the most suitable one for
these purposes.
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