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Optimization of the Polishing Parameters for the Glass

Substrate of STN-LCD
a a
Chi-Hsiang Lien & Y. H. Guu
a
Department of Mechanical Engineering , National United University , Miaoli, Taiwan,
Republic of China (ROC)
Published online: 04 Nov 2008.

To cite this article: Chi-Hsiang Lien & Y. H. Guu (2008) Optimization of the Polishing Parameters for the Glass Substrate of
STN-LCD, Materials and Manufacturing Processes, 23:8, 838-843, DOI: 10.1080/10426910802384839

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 Materials and Manufacturing Processes, 23: 838–843, 2008
Copyright © Taylor & Francis Group, LLC
ISSN: 1042-6914 print/1532-2475 online
DOI: 10.1080/10426910802384839

Optimization of the Polishing Parameters

for the Glass Substrate of STN-LCD
Chi-Hsiang Lien and Y. H. Guu

Department of Mechanical Engineering, National United University, Miaoli, Taiwan, Republic of China (ROC)

The optimal control parameters for the polishing of the glass substrate of super-twisted nematic-liquid crystal display (STN-LCD) were explored.
The Taguchi technique was used to formulate the experimental layout. The surface characteristics caused by the polishing process were analyzed
with atomic force microscopy (AFM). The signal-to-noise (S/N) ratio and analysis of variance (ANOVA) were employed to determine the optimal
levels and the order of significance of the identified critical parameters affecting quality. A confirmation test under the optimal process parameters
was carried out to verify the effectiveness of the Taguchi technique. The results indicated that, for the surface finish, the platen speed was the
most significant parameter followed by down pressure, oscillation speed, and time. The optimum combination of process parameters for excellent
surface roughness in the polishing experiment were: platen speed, 40 rpm; down pressure, 4.9 kPa; oscillation speed, 4 rpm; time, 10 min.
Downloaded by [University Of Pittsburgh] at 05:39 14 November 2014

Keywords Analysis of variance (ANOVA); Atomic force microscopy (AFM); Cerium oxide; Confirmation test; Down pressure; Glass substrate;
Nanomorphology; Orthogonal array; Platen speed; Polishing process; S/N ratio; Soda Lime glass; STN-LCD; Surface roughness; Taguchi method.

1. Introduction damage free surface, an excellent experimental design is

Glass substrates have become important in the super-
twisted nematic-liquid crystal display (STN-LCD) panel
industry because of its high resistance to chemical agents,
low shrinkage rate, and superior thermal durability. STN-
LCD panels are widely employed in consumer electronics,
like mobile phones, Personal Digital Assistant (PDA), and
other products [1, 2]. With an increasing demand for high-
resolution STN-LCD, glass substrates for STN-LCD panels
require an ultra surface quality. The polishing process has
tremendous potential since it can be used to finish hard,
brittle glass substrates with extremely smooth surfaces as
well as remove damaged layers [3, 4]. Earlier investigations
have studied the peculiarities of polished glass. Kasai et al.
[5] have polished optical glass for a good surface finish
and studied the microdefects on the workpiece. Rädlein
and Frischat [6] looked into the nanostructure of the
polished glass specimen using atomic force microscopy
(AFM). Sabia et al. [7–9] experimented with using a cerium
oxide abrasive to polish the glass substrates to create a
high surface quality. Wu et al. [10, 11] investigated the
correlation between the processing variables of polishing
and the surface quality of the glass substrate. Bulsara et al.
[12] established a model to estimate rise in temperature of
the work surface when polishing Soda Lime glass. From the
literature, it is evident that the Taguchi method has not been
used often to study the polishing of the glass substrate of
STN-LCD. Previous investigations [13–17] have reported
on many successful applications of the Taguchi technique,
which has been proven to be an efficient, systematic
approach to achieve optimal product quality and leading
cost reduction. To obtain the polishing substrate with a
Received January 29, 2008; Accepted April 12, 2008
Address correspondence to Y. H. Guu, Department of Mechanical
Engineering, National United University, Miaoli 360, Taiwan, Republic
of China (ROC); E-mail: yhorng@nuu.edu.tw
838
crucial in selecting the appropriate control parameters. In
this article, the Taguchi experimental design was used to
study the effects of the process parameters on the surface
roughness of the glass substrate and to search for the
optimal combination of control parameters. Furthermore,
the analysis of variance (ANOVA) was used to identify the
significance of process parameters. Finally, a confirmation
experiment was performed to verify the optimal parameters.
2. Experimental procedures
2.1. Material
The specimen used in this study was the commercial
Soda Lime glass which is widely used in STN-LCD.
The glass specimen was 420 mm × 320 mm × 1.1 mm. Its
chemical composition was SiO2 (70–73 wt%), Na2 O and
K2 O (13–15 wt%), CaO (7–12 wt%). Table 1 lists the
physical properties.
2.2. Taguchi Experimental Design
Taguchi method has been widely used for design of
experiments in industries and R&D sections to determine
the optimal processing parameters. The optimal parameters
obtained from this technique were insensitive to the
variation of environmental conditions and other noise
factors [18]. In this study, an L9 orthogonal array of the
Taguchi design was employed to investigate the relationship
between surface roughness and polishing parameters. The
critical control parameters that have been selected for this
study were machining time (min), down pressure (kPa),
platen speed (rpm), and oscillation speed (rpm). Table 2
presents different control parameters and their levels. It is
noted that a total of four control parameters with three levels
were considered for optimal analysis. Table 3 shows the
standard L9 orthogonal array. The orthogonal array design
for polishing process parameters is shown in Table 4.
 OPTIMIZATION OF THE POLISHING PARAMETERS 839

Table 1.—Physical properties of the Table 4.—Experimental layout using Taguchi L9 orthogonal array design for
Soda Lime glass. polishing process parameters.

Density (kg/m3 ) 2498 Experimental Time Down pressure Platen speed Oscillation
Young’s modulus (GPa) 7.5 no. (min) (kPa) (rpm) speed (rpm)
Poisson’s ratio 0.22
Vickers hardness (HV) 630 1 5
0 4
9 40 3
Thermal conductivity (W/m
C) 0.76 2 5
0 9
8 50 4
3 5
0 12
7 60 5
4 7
5 4
9 50 5
5 7
5 9
8 60 3
Table 2.—Control parameters and their levels. 6 7
5 12
7 40 4
7 10
0 4
9 60 4
Control 8 10
0 9
8 40 5
parameters Symbols Level 1 Level 2 Level 3 9 10
0 12
7 50 3

Time (min) A 5
0 7
5 10
0

Pressure (kPa) B 4
9 9
8 12
7
Platen speed (rpm) C 40 50 60
Oscillation speed (rpm) D 3 4 5 head, and a vibration isolation system, was used to measure
the sample properties with nanometer-scale resolution. The
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measurements were performed with the contact model in air

2.3. Experimental Setup using a Si probe. The radius of the tip was approximately
The experiments were performed on a single-side 10 nm. All samples were examined in scanning areas of
polisher, model type CLCD-800 (Chong Gu Machinery 20 m × 20 m. Three measurements were taken for each
Co. Ltd., Korea). The experimental setup for the polishing specimen. The maximum surface roughness, Rmax , of the
process is shown in Fig. 1. The polishing machine consisted polished specimen was defined as the difference between
of an oscillating upper platen with a back pad to hold the the maximum and minimal values of the Z coordinate on the
glass substrate, a rotating lower platform with a polishing measured surface. Hence, the maximum surface roughness,
pad, a slurry transportation apparatus, a pressure control Rmax , in the specimen is represented as
unit for exerting a downward pressure, and a control unit
for setting process parameters. Rmax = Zmax − Zmin  (1)
The polishing action was performed through the relative
movement between the oscillating upper platen and the
rotating lower platform. This process created a smooth
surface with no surface damage. The slurry was applied by
two control tubes at a flow rate of 5.38 l/min. The back and
polishing pads, model type BP-202 and FX8L produced by
Fujibo, were used to polish the substrate. The abrasive used
was cerium oxide (CeO2 ) (Grace Derwey Co. Ltd.). The
slurry had a 5.0 wt% abrasive concentration with particle
size in the range of 0.5–1.2 m. Its pH was fixed at 6.28.

2.4. Polishing Surface Measurement

To determine the surface roughness of the glass substrate
of the STN-LCD, the surface profiles of the specimens
were measured by AFM. The AFM, produced by NT-MDT
including Solver P47H main units, a SMENA measuring

Table 3.—Taguchi L9 orthogonal array design.

Parameters

Experimental no. A B C D
1 1 1 1 1
2 1 2 2 2
3 1 3 3 3
4 2 1 2 3
5 2 2 3 1
6 2 3 1 2
7 3 1 3 2
8 3 2 1 3
9 3 3 2 1 Figure 1.—Schematic representation of polishing process.
 840 C.-H. LIEN AND Y. H. GUU

Table 5.—Experimental results and the S/N ratios of surface roughness.

Roughness (nm)
Average roughness S/N ratio
Experimental no. Ra1 Ra2 Ra3 (nm) (dB)

1 1.41 1.80 2.32 1.84 −5
49

2 2.05 2.76 1.91 2.24 −7
12
3 3.32 5.52 4.17 4.34 −12
93
4 1.55 2.18 2.02 1.92 −5
73
5 4.46 4.97 5.08 4.84 −13
70
6 1.52 2.10 1.09 1.57 −4
21
7 2.08 2.42 2.70 2.40 −7
65
8 2.48 2.04 1.94 2.15 −6
71
9 1.90 2.49 2.30 2.23 −7
02


R2a1 + R2a2 + R2a3
where S/N ratio = −10 × log

3

where Zmax and Zmin represent the peak and the valley of
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the specimen, respectively. The average surface roughness,

Ra , of the specimen was calculated from the AFM surface Figure 2.—Average S/N ratio by factor lever for surface roughness.
topographic data according to Eq. (2)

1 K  L values of each trial run, the optimum conditions for each of

Ra = Zxi  yj  (2) the parameter, A, B, C, and D can be determined. Figure 2
KL i=1 j=1 shows the effect of the different input parameters on the S/N
ratio of the surface roughness. From the S/N ratio response
where Zxi  yj  denotes the height value of a surface point graphs, A3B1C1D2 was found to be the optimal parametric
xi  yj  relative to the mean plane; K and L represent the setting for surface roughness.
number of measurement points in an analyzed area.
3.2. Analysis of Variance (ANOVA)
3. Results and discussion The analysis of variance (ANOVA) was done to identify
3.1. Analysis of S/N Ratio the effect of each parameter on the surface characteristics
of the polished substrate. In this study, the formulas of
In quality engineering, the S/N (signal to noise) ratio ANOVA are expressed as shown below [19, 20]
is used to estimate the level of system performance. The
S/N ratio is denoted by  with a unit of dB. For a finish  m 2
polishing, better surface finish is required. The S/N ratio of 
m
1 
SST = i2 −  (4)
the smaller better quality polished substrate is expressed as i=1 m i=1 i
[19, 20]  m 2
k
sj 2 1 
 SSfactor = −  (5)
1 n
k m i=1 i
 = −10 × log y  i = 1 2 3


 n
2
(3) j=1
n i=1 i
SSe = SST − SSA + SSB + SSC + SSD  (6)
where n is the total number of experiments, yi denotes the DOFfactor = k − 1 (7)
value of surface roughness for the ith measurement. Table 5
shows the experimental results for the surface roughness as DOFtotal = m − 1 (8)
well as the corresponding S/N ratios using Eq. (3). Table 6 SSfactor
was the table of response extracted from Table 5. This table Vfactor = (9)
DOFfactor
also shows that the best levels for the control parameters
were A3, B1, C1, and D2 because of their high S/N ratios. V
Ffactor = factor (10)
Based on the level response analysis using the average Verror
SS − DOFfactor × Verror
Pfactor = factor  (11)
Table 6.—The S/N ratios of control parameters and their comparisons. SST
Parameters Time Down pressure Platen speed Oscillation speed where SST is the total sum of squares, m is the number of
Level 1 −8
51 −6
29 −5
47 −8
74 experiments in the orthogonal array, and i is the mean S/N
Level 2 −7
88 −9
18 −6
63 −6
33 ratio of the ith experiment. SSfactor is the sum of squares
Level 3 −7
13 −8
05 −11
43 −8
46 due to the individual control factor, j is the level number
Max–min 1
38 2
89 5
96 2
13 of the factor, k represents the repetition of each level of
Rank 4 2 1 3
the factor, sj is the sum of the S/N ratios involving the
 OPTIMIZATION OF THE POLISHING PARAMETERS 841

factor and level j. SSe is the sum of the squares of error. Table 8.—Results of prediction and confirmation.
SSA  SSB  SSC , and SSD denote the sum of the squares of the
control parameters A, B, C, and D, respectively. DOFfactor is S/N ratio (dB) Ra (nm)
the degree of freedom for each control factor. DOFtotal is the Predicted Confirmation test Predicted Confirmation test
total degree of freedom. Vfactor is the variance of the factor,
Verror is the variance of the error. Ffactor is the F ratio of the Initial design −5
49 −5
49 1.88 1.84
(A1B1C1D1)
factor. Pfactor represents the percentage of the contribution Optimal design −1
69 −1
42 1.21 1.20
of each individual factor. (A3B1C1D2)
The ANOVA analysis was carried out using Eqs.(3)–(11), Improvement 3
80 4
07
and the resulting data have been summarized in Table 7. of S/N ratio
From the ANOVA table, it is clear that the platen speed Improvement 0.67 0.64
of Ra
had maximum value of variance. Hence, the platen speed
had the most influence on the quality. The error variance
in this case was very small (1.44), which indicated that
the effect of uncontrolled and unknown parameters on the where m is the number of experiments in the orthogonal
variation was negligible. The F values of the platen speed, array, i is the S/N ratio of the measure data at the ith test,
down pressure, and oscillation speed were of 95%, 75%, and p is the mean S/N ratio of the predicted parameter levels,
75% confidence. Therefore, the platen speed had a relatively and Nf is the number of the control parameters that affect
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strong impact on the surface roughness; whilst the down
pressure and oscillation speed had smaller impact. This is
because of the fact that the greater the F -test value of the
control factor, the greater its effect on the quality is [21].
Table 7 further shows that the contributions by percentage
of the platen speed, down pressure, and oscillation speed to
surface roughness were 66.37, 11.45, and 8.76, respectively.
Therefore, the largest contribution to the total sum of
squares was the platen speed followed by the down pressure
and then the oscillation speed. Referring to the ANOVA
table, it is clear that the percentage contribution due to error
was 13.42, which was lower than 15% as reported by Phadke
et al. [22, 23] confirming that the selected parameters for
this study were appropriate and that no important parameters
were omitted.
3.3. Confirmation Tests
To verify the optimal combination parameters, it was
necessary to perform a confirmation test. For the polishing
of the glass substrate of the STN-LCD, the predicted S/N
ratio (predicted ) was calculated from the relationship as
follows [21]
   m 

Nf
1 m
1 
predicted = p − i +  
p=1 m i=1 m i=1 i
the quality characteristics. Furthermore, the predicted value
of Ra of the specimen was then obtained by substituting
the result of Eq. (12) into Eq. (3). Table 8 shows the
comparison of the predicted value and the experimental
data. The surface roughness of the confirmation tests was
obtained by calculating the average of fifteen readings
measured at various locations on the five specimens. It was
found that the predicted values were in good agreement with
the experimental results and that the optimal combination
of polishing parameters satisfied the real requirements for
the polishing of the glass substrate of the STN-LCD.
3.4. Surface Morphology
Surface morphology plays an important part in
understanding the characteristics of polished surfaces. In
order to evaluate the surface topography of the glass
substrate of the STN-LCD, an AFM was used to study
the surface nanomorphology of the specimen. Figure 3
shows the surface nanostructure of the glass substrate before
polishing. The darker contrast corresponds to the lower
areas of the surface, and the brighter corresponds to the
higher. As can be seen from the figure, the nonpolishing
surface exhibited deeper valleys and ridge-rich surfaces.
The maximum height identified within the observed area
(12) was 328.51 nm (i.e., Rmax = 328
51 nm). Figures 4(a)
and (b) display the nanomorphologies of the polished

Table 7.—ANOVA results of polishing parameters for surface roughness.

Control
parameters SS DOF V Test F F P (%) Significant

Time 2
88 2 1
44

Down pressure 12
72 2 6
36 4
41 3.0b 11
45 ∗∗
Platen speed 59
91 2 29
96 20
78 19.0a 66
37 ∗∗∗
Oscillation 10
41 2 5
21 3
61 3.0b 8
76 ∗∗
speed
Error 0
0 0
Pooled error 2
88 2 1
44 13
42
Total 85
93 8 100
∗∗∗
Most significant parameter.
∗∗
Significant parameter.
a
95% confidence level, F0
0522 = 19
0. Figure 3.—The three-dimensional AFM images of the glass substrate of
b
75% confidence level, F0
2522 = 3
0. STN-LCD before polishing.
 842
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Figure 4.—The surface nanomorphologies of the glass substrate of the STN-
LCD conducted with process parameters (a) A2B2C3D1; (b) A2B3C1D2;
(c) A3B1C1D2.
surfaces conducted at process parameters A2B2C3D1 and
A2B3C1D2, which were taken from the worst and the best
of the Taguchi L9 orthogonal array, respectively. It reveals
that the machined surfaces exhibited shallower valleys and
lower ridges. The values of maximum surface roughness
within the observed area were 111.04 nm and 29.7 nm,
respectively. Figure 4(c) shows the surface nanomorphology
of the polished surface which was conducted with the
optimal combination parameters (A3B1C1D2) taken from
the analysis of the S/N ratio. The surface had minor
hillocks and valleys. The height of valley-to-peak within
the observed area was 22.67 nm (i.e., Rmax = 22
67 nm). A
comparison between the AFM images of before and after
polishing (Figs. 3 and 4) revealed that polishing can indeed
reduce the height of the peak-to-valley from 328.51 nm to
22.67 nm. Figure 5 shows the dependence of the average
C.-H. LIEN AND Y. H. GUU
Figure 5.—The average surface roughness for the different parameter levels.
surface roughness and the polishing parameters. The
average surface roughness varied from 1.25 nm to 25.2 nm.
The results demonstrated that the polishing process using
cerium oxide improved the surface roughness significantly.
Previous work has observed a similar phenomenon [24].
Since the surface finish of the glass substrate is related to
the quality of products, the optimal combination parameters
(A3B1C1D2) are recommended for polishing the glass
substrate.
4. Conclusions
This study investigated the optimization of the polishing
process for the glass substrate of STN-LCD. The following
conclusions were reached from the experimental results
under different combination of process parameters:
1. In polishing the glass substrate of the STN-LCD, the
best surface finish was obtained with the parametric
combination A3B1C1D2.
2. The ranking of the polishing parameters from the most
to the least influential was the platen speed followed by
the down pressure, the oscillation speed, and then time.
3. The optimized quality was reproduced with the optimal
combination of the polishing parameters. The process of
polishing glass substrate using cerium oxide improved
the surface roughness significantly.
4. The confirmation tests indicated that the predicted
surface roughness was consistent with the actual surface
roughness. The parameter design of the Taguchi method
provides an efficient methodology for the optimization
of polishing parameters.
Acknowledgment
This research was sponsored by the National Science
Council, Taiwan, ROC, under contract no. NSC 95-2815-
C-239-006-E.
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