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System
Model Name : HT-C460
Model Code : HT-C460/XAZ
Speaker PS-C460
Front PS-FC460
Center PS-CC460
Rear PS-RC460
Subwoofer PS-WC460
SERVICE Manual
1. Precaution
2. Product Specification
4. Troubleshooting
6. PCB Diagram
7. Schematic Diagram
HT-C460
Refer to the service manual in the GSPN (see the rear cover) for the more information.
GSPN (Global Service Partner Network)
Area Web Site
North America service.samsungportal.com
Latin America latin.samsungportal.com
CIS cis.samsungportal.com
Europe europe.samsungportal.com
China china.samsungportal.com
Asia asia.samsungportal.com
Mideast & Africa mea.samsungportal.com
1. Precaution
1-1 Safety Precautions............................................................................................ 1-1
1-2 Servicing Precautions.......................................................................................1-3
1-3 Precautions for Electrostatically Sensitive Devices (ESDs)..............................1-4
2. Product Specification
2-1 Product Feature................................................................................................ 2-1
2-2 Specifications....................................................................................................2-2
2-3 Specifications Analysis......................................................................................2-4
2-4 Accessories.......................................................................................................2-7
4. Troubleshooting
4-1 Checkpoints by Error Mode..............................................................................4-1
4-2 Measures to be taken when the Protection Circuit operates............................4-19
4-3 MICOM, MPEG Initialization & Update.............................................................4-20
4-4 Buyer-Region Code Setting Method.................................................................4-23
6. PCB Diagram
6-1 Wiring Diagram................................................................................................. 6-1
6-2 FRONT PCB Top............................................................................................... 6-2
6-3 FRONT PCB Bottom.........................................................................................6-4
6-4 KEY PCB Top....................................................................................................6-5
6-5 KEY PCB Bottom.............................................................................................. 6-6
6-6 MAIN PCB Top.................................................................................................. 6-8
6-7 MAIN PCB Bottom............................................................................................ 6-11
6-8 SMPS PCB Top................................................................................................. 6-12
6-9 SMPS PCB Bottom........................................................................................... 6-13
Contents
7. Schematic Diagram
7-1 Overall Block Diagram......................................................................................7-1
7-2 FRONT..............................................................................................................7-2
7-3 KEY...................................................................................................................7-3
7-4 MAIN.................................................................................................................7-4
7-5 MPEG...............................................................................................................7-5
7-6 MICOM..............................................................................................................7-6
7-7 AV I/O................................................................................................................7-7
7-8 AMP..................................................................................................................7-8
7-9 Audio AMP-1..................................................................................................... 7-9
7-10 Audio AMP-2..................................................................................................... 7-10
7-11 Audio AMP-3..................................................................................................... 7-11
7-12 SMPS................................................................................................................7-12
Precaution
1. Precaution
Follow these safety instructions while servicing the ESD to prevent damage and to protect against potential
hazards such as electrical shock and X-rays.
1. When reinstalling the chassis and its assemblies, be sure to restore all of the protective devices, including the
control knobs and the compartment covers.
2. Make sure that there are no cabinet openings through which people (particularly children) can make contact
with dangerous internal components.
current between a known ground and all exposed metal <Fig. 1-1 AC Leakage Test>
parts.
Known Grounds - Earth
Known Metal parts - screwheads, metal cabinets, etc.
If any of the exposed metallic parts has a return path <Fig. 1-2 Insulation Resistance Test>
to the chassis, the measured resistance should be
between 1 and 5.2 megohms. If there is no return path,
the measured resistance should be “infinite.” If the resistance is outside these limits, a shock hazard might
exist. See Fig. 1-2
6. Components, parts and wiring that appear to have overheated or that are otherwise damaged should be
replaced with parts that meet the original specifications. Always determine the cause of damage or overheating,
and correct any potential hazards
7. Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and
especially the AC and high voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring.
Do not change the spacing between components and the printed circuit board. Check the AC power cord for
damage. Make sure that no wires or components touch thermally hot parts.
9. Components that are critical for safety are indicated in the circuit diagram by shading, or . Use
replacement components that have the same ratings, especially for flame resistance and dielectric strength
specifications. A replacement part that does not have the same safety characteristics as the original might
create shock, fire or other hazards.
2. Always unplug the unit’s AC power cord from the AC power source before attempting to: (a) Remove or reinstall
any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in
parallel with an electrolytic capacitor.
3. Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes
used. The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such
elements to their original position.
4. After servicing, always check that the screws, components and wiring have been correctly reinstalled.
Make sure that the portion around the serviced part has not been damaged.
5. Check the insulation between the blades of the AC plug and accessible conductive parts (examples: metal
panels, input terminals and earphone jacks).
6. Insulation Checking Procedure: Disconnect the power cord from the AC source. Connect an insulation
resistance meter (500V) to the blades of the AC plug.
The insulation resistance between each blade of the AC plug and accessible conductive parts (see above)
should be greater than 1 megohm.
7. Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies)
unless all solid-state heat sinks are correctly installed.
8. Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive
lead; always remove the instrument’s ground lead last.
First read the “Safety Precautions” section of this manual. If some unforeseen circumstance
creates a conflict between the servicing and safety precautions, always follow the safety
precautions.
Some semiconductor (“solid state”) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs).
Examples include integrated circuits and some field-effect transistors. The following techniques will reduce the
occurrence of component damage caused by static electricity:
1. Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from
your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to
remove it prior to applying power--this is an electric shock precaution.)
2. After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
accumulation of electrostatic charge.
3. Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.
5. Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static” (these
can accumulate sufficient electrical charge to damage ESDs).
6. Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam,
aluminum foil or other conductive materials.
7. Immediately before removing the protective material from the leads of a replacement ESD, touch the protective
material to the chassis or circuit assembly into which the device will be installed.
8. Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes
together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.
2. Product Specification
2-1 Product Feature
USB Host
- Instant Entertainment through USB
- Directly rip the music in our CD’s to your USB external device
- MTP type file is also ready for play
Playability
- Never fail, Play without trouble. Just press play and enjoy
- Rolling actuator technology adjusts the lens angle to the curved disc surface
- Defect Disc Recovery Solution can deliver a clear picture despite of scratches or other defects on the disc.
Touch Sensor
- Emotional values by using the touch sensor button
Portable Connection
- Easy Connectivity
- Walkman, ipod, MD etc. DRM Free
- Connect with any kinds of Portable Audio device
- Stereo Input in Front
2-2 Specifications
2-2-1 Specifications
Basic Specification
Weight 2.6 Kg
Dimensions 430 (W) x 60 (H) x 290 (D) mm
General
Operating Temperature Range +5°C ~ +35°C
Operating Humidity Range 10% to 75%
Signal/noise ratio 70 dB
FM Tuner Usable sensitivity 10 dB
Total harmonic distortion 0.5 %
Reading Speed: 3.49 ~ 4.06 m/sec.
DVD (Digital Versatile Disc) Approx. Play Time (Single Sided, Single Layer Disc):
135 min.
VIDEO 480i(576i)
OUTPUT Y: 1.0 Vp-p (75Ω load)
Component Video
Pr: 0.70 Vp-p (75Ω load)
Pb: 0.70 Vp-p (75Ω load)
VIDEO/
HDMI 1080p, 1080i, 720p, 480p(576p)
AUDIO
Front speaker output 141W x 2 (3Ω)
Center speaker output 141W (3Ω)
Rear speaker output 141W x 2 (3Ω)
Subwoofer output 145W (3Ω)
AMPLIFIER
Frequency range 20Hz ~ 20kHz
S/N Ratio 70dB
Channel separation 60dB
Input sensitivity (AUX) 400mV
Photo
Photo
Dolby ProLogic-IIX X X
DTS O O
Audio
Dolby Digital EX X X
Decoding
DTS ES Discrete 6.1 X X
DTS 96/24 X X
THX X X
DTS Neo 6 X X
Component X X
Composite X X
Video Inputs
S-Video X X
HDMI In X X
Component O O
Composite O O
Video Outputs HDMI Out O O
S-Video X X
SCART Adaptor O (only Europe) O (only Europe)
In X X
Line In O (AUX) O (AUX)
Audio in/out
Multi ch Out X X
Out X X
In (Digital In) O (*1) O (*1)
Optical jack
Out X X
In X X
Coaxial jack
Out X X
i-Link X X
Photo
2-4 Accessories
- Be careful to follow the disassembly sequence described in the manual. Otherwise, the product
may be damaged.
- Be sure to carefully read and understand the safety instructions before performing any work as
the IC chips on the PCB are vulnerable to static electricity.
- In order to assemble reverse the order of disassembly.
8 1) Disassemble complete.
4. Troubleshooting
4-1 Checkpoints by Error Mode
No power detected
(Stand by LED off)
No
FR1 is OK? Change fuse
Yes
No No
CON3 Pin 12, 13, 14 is 5.4V? ICFB5401 Pin 1 is 2.5V Change SMPS.
4-1-2 No Sound
No Sound
1
Check JA5 input signals. Yes Check speakers.
(1khz signal) (speaker change)
2
Check AIC4, AIC19 input signals Yes Replace AMP IC.
(AC54, AC55, AC56, (AIC4, AIC19)
AC1, AC2, AC3)
3
Check MPEG DAC output Yes Check DAC output signal lines
(1.7v offset) (pin 83, 84, 85, 88, 89, 90 between IC10 and AIC4 and
of IC10 ES8398) AIC19
No
1/16W
33KOHM
R500
1/16W
4.7KOHM
R516
3.3KOHM
1/16W
C313
10UF
CN12
18KOHM
1/16W
B CE
Troubleshooting
16V
R501
10OHM
8
7
6
5
R476
R478
100OHM 1W
1/16W
1/16W
47KOHM
1
C307
C330
1UF
16V
2
IN1+IN2-
VEE IN2+
OUT2
OUT1 VCC
IC35
S4560
+12V
IN1-
A_GND
5267-02A
33KOHM
A_GND
1/16W
2
3
4
FAN_CHK
R502
D30 D34
A_GND
R514
27OHM
1/16W
47KOHM
1/2W
R515
1SS355-TE-17 1SS355-TE-17
R503
80V 80V
15KOHM
1/16W
R485 A_GND R504 C320
LHPC10
50V
1/16W
LHPC12
1NF
10KOHM
50V
1/16W
100PF
4.7KOHM
1/16W
LHPR15
LHPR11
1/16W A_GND
4.7KOHM
HM 7.5KOHM
LHPR8 1/16W
VAA+5V
LHPC5
10UF
680PF
50V
25V
LHPC9
5
6
7
8
IC32
VEE IN2+
IN1+IN2-
OUT2
OUT1 VCC
A_GND
S4560
A_GND
IN1-
4
3
2
1
1
VSS-5V
22UF
6.3V 33OHM 220UH
1/16W LHPC11 LHPR18 LHPL2
4.7KOHM 4.7KOHM
LHPR10 LHPR14 1/16W
LHPC13
10KOHM
50V
1/16W
100PF
LHPR17
1/16W
1/16W 1/16W
1.8KOHM 7.5KOHM
LHPR9 LHPR12
LHPC7
LHPR5
680PF
50V
A_GND
1NF
50V
LHPC8
A_GND
1/16W
AR20 100OHM PWM_C_P
1/16W
AR21
AR22
100OHM
1/16W
100OHM
PWM_SW_P
AMP, page 7-8
PWM_RL_P
1/16W
AR23 100OHM PWM_RR_P
1/16W
AR24 100OHM PWM_FL_P
1/16W
AR25 100OHM PWM_FR_P
1
1
ACON1
<Fig. 4-1>
IC11
AIC4 AIC19
2
CN1
IC7
CN2
ACON1
2
AIC19
2
CN5
<Fig. 4-3>
IC11
3
IC36
3
IC10
AIC4
CN4
<Fig. 4-4>
IC7
Troubleshooting
1
Check if VDAC output is No Check if VDD of 3.3V No Check if the pin 7, 8
measured at the pin 77 of is measured at the pin 82, of IC23 are 3.3V.
IC10 ES8398 78, 72 of IC10
Yes
Yes Refer to wave pattern
image of Fig. 4-5.
Replace the IC10 IC Replace the IC23 IC.
Check Video switch.
Yes
Yes
2 No
Check if composite video output is Check the JA1 connectivity
measured at the JA1. and replace.
IC11
IC36
1
IC10
AIC4
CN4
CN1
<Fig. 4-5>
15
IC7
4-8 Samsung Electronics
CN2
Troubleshooting
IC11
IC36
<Fig. 4-6>
IC10
Troubleshooting
1/2/3
Check if YDAC,CADC
and UDAC output is measured No Check if VDD of 3.3V is No Check if the pin 7, 8 of
at the pin 76, 80 and 81 of measured at the pin 82, 78, IC23 are 3.3V.
IC10 ES8398. 72 of IC10.
4/5/6
Check if output is measured No Check if VDD of 3.3V No Check 3.3V power lines
at the pin of 11,13 and 12 of is measured at the pin from IC23 to IC36.
IC36 THS7374. 10 of IC36.
2
1
IC11
IC36
IC10
2 2
1
AIC4
CN4
MAIN PCB Top, page 6-8
<Fig. 4-7>
CN1
C15
Troubleshooting
IC11
IC36
3
IC10
AIC4
CN4
MAIN PCB Top, page 6-8
<Fig. 4-8>
CN1
C15
Troubleshooting
IC11
5 4
IC36
5
<Fig. 4-9>
6 IC11
IC36
<Fig. 4-10>
Analog (Composite)
Video OK but HDMI
No
Check MPEG Ouput.
No
No
1 IC11
IC36
3
1
IC10
1
AIC4
MAIN PCB Top, page 6-8
CN4
<Fig. 4-11>
CN1
<Table 4-1>
GND
Micom initial
In no Disc condition, press ‘STOP’ button of Main Unit more than 5 seconds, VF Display will happen to INIT and M
int. Then Initialization complete.
Micom Update
1. Prepare or Make a DISC-CD or DVD or USB that contains “C550WWM.SSP’ file for update.
2. Play the USB, then “updating” will appear on the screen, then Power will go out after showing ‘complete’ on the
screen.
3. Press “Power” key and Press ‘Stop’ button of the remote control more than 5 seconds in No Disc.
3. Press “Enter”.
4. Check product information: “SW ver” on TV Display and “Micom SW Ver” on Front ASS’y VFD.
2. Play the DISC or USB, then ‘Updating’ will appear on the screen, then Power will go out and on.
3. Then DISC-TRAY will open, then remove the DISC or USB, making the Unit as ‘NO DISC’ state.
4. Press ‘STOP’ button of Main Unit for more than 5 seconds, Display Indicator shows ‘INITIALIZE’ then Power
goes out.
4-4-1 The inserting method of Region Code after replacing the Main PBA
[Reference]
- When replacing the Main PBA and System Micom should be inserted the region code.
- The set is not working properly if you don't insert the region code.
- The region code is inserted by the remote control.
4. When you see “TEST” on VFD, Insert number “4”, “6” to start
Region Code setting mode.
TEST
Option Table
<Table 4-2>
6. After step (5), you can see “15 USA” on the VFD.
It means that currently System Micom program is installed by USA
specification. 15 USA
[Tip]
In case of System Micom and EEPROM problem, you can apply to this.
For example, during Updating program of System Micom, if Updating fail is happened, it is impossible to turn on
the system from stand-by status.
The system will keep the stand-by status continuously, and the touch-key function will never work.
In this case, you have to change System Micom, and set up the Buyer Region code again.
In case of EEPROM, you don't need to care about it.
After set-up the Region code, System Micom will store the information of the region code to EEPROM
automatically.
T001
W391
W391
M0081
M0014
M0081
D001A
W390 W391
HDM01
P001A
T001A
W391
W391
FD17 FL06
MF01A
W391
ES04
FD12
5-1 This Document can not be used without Samsung’s authorization. Samsung Electronics
Exploded View & Part List
Part List
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Exploded View & Part List
Center Speaker
Front Front
Speaker (R) Speaker (L)
VIDEO
OUT
DIGITAL
HDMI OUT
AUDIO IN
OPTICAL
COM
AUX IN
Rear Rear
Speaker (R) Speaker (L)
Subwoofer
Part List
Front Speaker
PS-C460,PS-FRCC460,XEF BUYER,SATELLITE SPK
Center Speaker AH96-00547J 1 SA
SYSTEM
Rear Speaker
5-3 This Document can not be used without Samsung’s authorization. Samsung Electronics
Exploded View & Part List
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Exploded View & Part List
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Exploded View & Part List
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Exploded View & Part List
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Exploded View & Part List
T001
W391
W391
M0081
M0014
M0081
D001A
W390 W391
HDM01
P001A
T001A
W391
W391
FD17 FL06
MF01A
W391
ES04
FD12
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Exploded View & Part List
Part List
Samsung Electronics This Document can not be used without Samsung’s authorization. 5-2
Exploded View & Part List
Center Speaker
Front Front
Speaker (R) Speaker (L)
VIDEO
OUT
DIGITAL
HDMI OUT
AUDIO IN
OPTICAL
COM
AUX IN
Rear Rear
Speaker (R) Speaker (L)
Subwoofer
Part List
Front Speaker
PS-C460,PS-FRCC460,XEF BUYER,SATELLITE SPK
Center Speaker AH96-00547J 1 SA
SYSTEM
Rear Speaker
5-3 This Document can not be used without Samsung’s authorization. Samsung Electronics
Exploded View & Part List
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Exploded View & Part List
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Exploded View & Part List
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Exploded View & Part List
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PCB Diagram
6. PCB Diagram
6-1 Wiring Diagram
8)CN5:15P CON3:15P
6)CN1: 23P CONN WIRE
SMT CON
DECK
#1 pin start
5)CN2: 9P position
DIP CON
DECK 2) CN9 : 32P FFC DIP STR
1
150MM
FRONT PCB
60MM
4)CN1:7P SMD
CONN STR TOUCH PANEL
1
1 2
KIC2
UIC2
U1
FCON1
KCW2
MICW1
1 FCON1 2 U1
MAIN-FRONT Connector FRONT-KEY Connector
FCON1
KCW2
MICW1
IC1
CN1
1 CN1
FRONT-KEY Connector
TP6
TP4 TP3
TP6
TP2
TP5
TP3
IC11 TP1
IC36
TP4
TP5
5
TP7
ACON1
IC10 TP6
IC21
AIC4 AIC19
CN4 TP1
1
CN1
CN5
4
IC15
IC7 CN2
CN9 3
2
Pin No. Signal Pin No. Signal Pin No. Signal Pin No. Signal Pin No. Signal Pin No. Signal
TP1 TP6
TP2 TP7
TP3
TP4
TP5
IC1
IC20
IC2
IC35
AIC16
IC3
IC16
IC8 AIC22
CON1
CON2 CON3
7. Schematic Diagram
7-1 Overall Block Diagram
The loader reads disc data and it goes through SERVO part in MPEG ic(ES8393). The data from loader will be
decoded by MPEG processing and Video data and Audio data will go out.
A- VIDEO
Pick-up / Loader
EEPROM
The firmware of MPEG ic is programmed to FLASH.
24C08
Flash SDRAM
12L128168A
When MPEG is boot up, the data from FLASH is dumpped to SDRAM.
1매 AT26DF161
I2C EEPROM will save back-up information from MPEG ic.
THS7374
The video data goes out in two different ways. Analog video data is going out to composite and component jack via
FSA2257
SERVO
VIDEO
ANALOG VIDEO
DIGITAL VIDEO
buffer ic(THS7374), and HDMI video data goes to HDMI jack directly.
Motor
I2S The Audio data is going out to Power AMP block. The amp block will process the audio data from MPEG ic and the
Driver ADC HDMI sound goes throgh speakers.
AM5766
DSP ES8398
DIR/ PWM
PWM 6CH
AUX2, AUX1, ipod, Tuner and mic data will go through ADC block in MPEG ic. The data from ADC will do the same
AUX2
USB (DAC) Power AMP processing like SERVO.
4560
AUX1
USB data from USB device and SPDIF data from optical jack also do the same things.
i-Pod IRS2053 F
TUNER
4066
TUENR I2C 4WIRE L Audio Micom(LC87C5N) is the HOST controller of the system.
F
MIC SA2011
EEPROM
I2C
UART IRF6645 R
It will control MPEG ic, CEC micom, VFD, Touch key ic, tuner pack, and wireless module.
CEC
SPDIF 24C08
Optic IN M80F0316
LC87C5N
D+/D- IRS2053 C
I2C
USB T
I2S EEPROM
S
WIRELESS
24C08 IRF6645 W
I2C SPI
I2C
NTS1124N
IRS2053 R
L
R
IRF6645 R
VFD
Touch key
Samsung Electronics This Document can not be used without Samsung’s authorization. 7-1
Schematic Diagram
7-2 FRONT
VFD_N22.7V
VFD
VFD_P26.1V
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
F+
F+
P1
P2
P3
P4
P5
2G
P6
P7
3G
P8
P9
4G
5G
6G
7G
1G
F-
F-
POWER REMC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
V_3 V_30
MLVS-0603-E08
V_4 V_29
TP27
UESD6
TP29 V_5 V_28
50V
+12V TP18 TP31 TP28 V_6 V_27
V_26
V_7
FCON1 ST5V ST5V 1/10W V_8
V_25
REM_EYE 10UF V_9 V_24
47OHM
UC2
32 DGND FR7 1 MGND1 50V V_10 V_23
1/10W
31 OUT UC1 V_11 V_22
MIC_SIG 0OHM
UC4
30 FD1 2 V_21
V_12
100NF
V_20
50V
29 VCC
V_13 UC3
50V
100NF
BUZZER V_19 50V
28 3 MGND2
FC1
MIC_MUTE V_14
27 GND 10UF
0.05OHM FC2 V_15
26TP23 TP21 FBD2 V_16
2500MA 100UF GP1UA281RK
25 TP22 TP19
MIC_SENS 16V V_17
50V
47NF
24 V_18
23 TP25
D_N DGND
22 D_P DGND DGND
21 DGND
REMC
20 DGND
19 TEST
18 0.05OHM
17 TP13
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P2
P3
P4
P5
G2
P6
P7
G3
P8
P9
G4
G5
G6
G7
G1
FBD1 2500MA
P1
TP14
16 TP12
15 TP11
14 KEY_RESET
13 KEY_INT DGND
12 KEY_SDA
11 KEY_SCL
10
9 TP8
8 0.05OHM
D5V
7 FBD3 2500MA
6 VFD_CE
5 VFD_DO
P21
P20
4
G1
G2
G3
G4
G5
G6
G7
VFD_CLK
3 VFD_N22.7V DGND
2 VFD_P26.1V
1 N_VP_30V
100NF
UC43
50V
TP1
TP1TP2
TP2TP3
TP3TP4
TP4 T
TP5
P5T
TP6
P6T
TP7
P7 ST5V
U1
44
43
42
41
40
39
38
37
36
35
34
1
2 1/10W
VSS
VDD
GR1
GR2
GR3
GR4
SG24/GR5
SG23/GR6
SG22/GR7
SG21/GR8
SG20/GR9
KEY_RESET UR1 10KOHM
3 TEST 1 33
4 1/10W LED1 P19
5 KEY_INT UR2 10KOHM 2 SG19/GR10 32 P18 N_VP_30V
10UF KEY_SCL 3
LED2 SG18/GR11
31
6 10V KEY_SDA 4
LED3 SG17/GR12
30 P17
7 C5 1/10W LED4 VEE
UR5 82KOHM 5 29
6
OSC UIC2 SG16/KS16
28 P16
1/10W DOUT SG15/KS15 P15
10022HS-07A00 UR6 10KOHM 7 DIN PT6315A SG14/KS14
27 P14
DGND 8 26
TLZ5V1B
1/10W
FR21
5.1V
P13
FZD2
CLK SG13/KS13
9 25
1/10W
UR7
22KOHM
VFD_DO 100OHM STB SG12/KS12 P12
1/10W 10 K1 SG11/KS11
24 P11
VFD_CLK
UR8 100OHM 11 K2
SG10/KS10 23 P10 DGND
1/10W
SG1/KS1
SG2/KS2
SG3/KS3
SG4/KS4
SG5/KS5
SG6/KS6
SG7/KS7
SG8/KS8
SG9/KS9
UR9 100OHM
VFD_CE
VSS
VDD
FR22
1/10W
VFD_N22.7V
120OHM
12
13
14
15
16
17
18
19
20
21
22
50V
100NF
UC29
UC30
50V
10UF
ST5V
100UF
16V
UD9 UC13
0OHM
1/10W
UESD1
P1
P2
P3
P4
P5
P6
P7
P8
P9
50V D5V
MLVS-0603-E08
IC2
1 IN OUT
6
510KOHM
2 GND ILIM
5
3 4
100NF
1/10W
EN /FAULT
16V 100NF
16V
DGND
22UF
UC5
56KOHM
UR11
1/10W
16V
220NF
UC7
UC6
16V
UR10
KIC2 KARAOKE OPTION
UC8
BUZZER
DETOUT
VCC
OUT
GND
IN-
IN
NC
CBE2240BP
BUZZER1
7
6
5
4
3
2
1
BZR1
+12V
1/10W
10KOHM
DGND
KR20 KC22
1/10W
KR6 330OHM
CN3
2.2KOHM 16V 6
1/10W 5
1/10W 1UF
USB
KR25
1/10W
KR7
4.7KOHM
330OHM 4
1/10W 100UF 2
KC28
KR8 DGND
KC1
50V
100NF
100PF
KC8 8 USB
25V
DGND
100NF
MLVS-0603-E08
K4 K3 K1
BC1A
BC1
MIC OPTION 1
UESD2
KR19 1
KR10
KR11
MGND1
1/10W
KC10
KC21
10KOHM
50V
KCW2
KR4
50V
10NF
1/10W D_N 2
10V
10UF
MIC_SENS 100OHM D_P
3
2.2KOHM 16V 4
25V
10UF
4 4
1/10W
1MOHM
1/10W
1KOHM
MR1
1/10W 1UF 3 3 CN4 MGND2
MICW1
KR12
KR26
6
1/10W
4.7KOHM
DGND 2 2
1 1 5 UAS21-4K5J0A
4
1/8W
330OHM
K2 2
KC27
3 DGND
B4B-PH-K 7 DGND
50V
22NF
DGND 8
9
1
MIC_SIG DGND
KQ1 KR2 DGND
E
B KQ3
E
1/10W
47KOHM
C
KTD1304
KR3
4.7KOHM
B
4.7KOHM
1/10W
1/10W
KR1
MLVS-0603-E08
MLVS-0603-E08
UESD4
50V
UESD3
220PF
MC1
50V
50V
DGND
220PF
50V
MC2
C
MIC_MUTE B KQ2 DGND
E DTC124EK
DGND
DGND
7-2 This Document can not be used without Samsung’s authorization. Samsung Electronics
Schematic Diagram
7-3 KEY
POWER ST5V
100NF CLOSE TO IC
16V
C2 100NF 1/10W R5 249KOHM
16V
C3 1/10W R6 160KOHM
1/10W R7 160KOHM
DGND
DGND
NRESET
INTRP
R10
FSKIP FSKIP 560OHM
40
39
38
37
36
35
34
33
32
31
R11
PLAY PLAY 560OHM IC1
STOP R12
STOP 560OHM
VDD
VSS
TS00
TS12
R_OSC
R_ST1
R_ST2
INTRP
RESETN
AVDD18
RSKIP R13 1 TS01 TS13 30
RSKIP 560OHM 2 29
TS02 TS14
R14 3 TS03 TS15 28
FUNC FUNC 560OHM 4 27
TS04 TS16
OPEN OPEN R15 5 TS05
MGND1 TS17 26
560OHM 6 25
TXD
RXD
RXD TXD
POWER R16 7 TS06 TS18 24
PWR 560OHM 8 23
TS07 TS19
VOL+ R17 9 TS08 TS20 22
VOL+ 560OHM 10 21
TS09 TS21
VOL- R18
I2C_SDA
I2C_SCK
DVDD18
VOL- 560OHM
TS10
TS11
INTR
TEST
TS23
TS22
NC
11
12
13
14
15
16
17
18
19
20
100NF
16V
DGND
DGND
TEST
1/10W
INTB/TDO
C4
I2C_SDA/TMS I2C_SCK/TCK
CLOSE TO IC
DGND
R9 10KOHM
ST5V
ST5V
1/10W ST5V
0OHM
R1 4.7KOHM 1/10W
R2 4.7KOHM 1/10W
1/10W
R8
D1
R3 10KOHM
50V
MLVS-0603-E08
SDA S
SCLK
CLK INT
INT TEST NRST
TEST
DGND
7
6 I2C_SDA/TMS
52492-2720
5 I2C_SCK/TCK
4 INTB/TDO
3 TEST
2 NRESET
1
C1 100NF
1/10W
2KOHM
16V
D2
MLVS-0603-E08 D3
MLVS-0603-E08 D4
MLVS-0603-E08 D5
D6
CN1
50V
50V
50V
50V
50V
MLVS-0603-E08
MLVS-0603-E08
R4
GND
DGND
Samsung Electronics This Document can not be used without Samsung’s authorization. 7-3
Schematic Diagram
7-4 MAIN
POWER
AUDIO
7-4 This Document can not be used without Samsung’s authorization. Samsung Electronics
Schematic Diagram
7-5 MPEG
POWER
AUDIO
TP2
TP2
TP6
TP5
TP3 TP4
TP3 TP5
TP4 TP6
Samsung Electronics This Document can not be used without Samsung’s authorization. 7-5
Schematic Diagram
7-6 MICOM
POWER
AUDIO
7-6 This Document can not be used without Samsung’s authorization. Samsung Electronics
Schematic Diagram
7-7 AV I/O
POWER TP6
TP3
AUDIO TP5
TP4
TP6
TP5
TP4
TP3
TP4
TP5
TP6
Samsung Electronics This Document can not be used without Samsung’s authorization. 7-7
Schematic Diagram
7-8 AMP
POWER
AUDIO
FAN_SD
+12V
R464
0OHM
1/16W
+12V
1/16W
33KOHM
R500
1/16W
C R468 4.7KOHM
Q29 B
2SC1008-Y E
4.7KOHM
1/16W
R465
R516
3.3KOHM
1/16W
C313
10UF
CN12
18KOHM
1/16W
B CE
16V
R501
10OHM
C305
10UF
10UF
8
7
6
5
R476
R478
1W
100OHM
1/16W
1/16W
47KOHM
16V
16V
1
C307
C330
1UF
16V
2
IN1+IN2-
VEE IN2+
OUT2
OUT1 VCC
IC35
A_GND
S4560
D5V +12V
IN1-
A_GND
5267-02A
0.01OHM
33KOHM
L45 5000MA A_GND
1/16W
FAN_CHK
2
3
4
1
R502
JA4
C257
10UF 1 D30 D34
1
VCC A_GND
R514
10V
27OHM
1/16W
47KOHM
1/2W
R515
2 2
GND 1SS355-TE-17 1SS355-TE-17
1/16W
R503
80V 80V
15KOHM
1/16W
SPDIF_IN
R340 470OHM 3 3
VOUT
LTDL-RX16S01B
DGND
R485 A_GND R504 C320
DTP2
DTP3
DTP1
LHPR13
LHPC10
LHPC12
50V
1/16W
1NF
10KOHM
50V
1/16W
100PF
4.7KOHM
1/16W
LHPR15
LHPR11
10UF 1/16W 1/16W A_GND
4.7KOHM
16V 1.8KOHM 7.5KOHM
LHPC1 LHPR4 LHPR8 1/16W
LINE_O_R
VAA+5V
LHPC5
LHPR3
10UF
10KOHM
680PF
50V
1/16W
25V
LHPC9
5
6
7
8
IC32
VEE IN2+
IN1+IN2-
OUT2
OUT1 VCC
A_GND
S4560
A_GND
IN1-
4
3
2
1
VSS-5V
22UF
6.3V 33OHM 220UH
1/16W LHPC11 LHPR18 LHPL2
4.7KOHM 4.7KOHM
LHPR10 LHPR14 1/16W
LHPC13
10KOHM
TP1
50V
1/16W
100PF
LHPR17
1/16W
10UF 1/16W 1/16W
16V 1.8KOHM 7.5KOHM
LHPC2 LHPR9 LHPR12
LINE_O_L
LHPC7
LHPR5
680PF
50V
10KOHM
1/10W
A_GND
1NF
50V
LHPC8
A_GND
TP1
1/16W
AR20 100OHM
PWM1_R PWM_C_P
1/16W
AR21 100OHM
PWM1_L PWM_SW_P
1/16W
AR22 100OHM
PWM2_R PWM_RL_P
1/16W
AR23 100OHM
PWM2_L PWM_RR_P
1/16W
AR24 100OHM
PWM3_R PWM_FL_P
1/16W
AR25 100OHM
PWM3_L PWM_FR_P
7-8 This Document can not be used without Samsung’s authorization. Samsung Electronics
Schematic Diagram
POWER
AUDIO
Samsung Electronics This Document can not be used without Samsung’s authorization. 7-9
Schematic Diagram
POWER
AUDIO
TP1
TP1
7-10 This Document can not be used without Samsung’s authorization. Samsung Electronics
Schematic Diagram
POWER
AUDIO
TP1
TP1
Samsung Electronics This Document can not be used without Samsung’s authorization. 7-11
Schematic Diagram
7-12 SMPS
7-12 This Document can not be used without Samsung’s authorization. Samsung Electronics