INGEPAC™ DA-CU

Control Unit

Data Sheet
ZY8932IMA01E– 31/03/2016
Total or partial reproduction of this publication by any means or
procedure is prohibited without previous express written
authorisation by Ingeteam Power Technology.

One of the primary goals of Ingeteam Power Technology is the Parque Tecnológico de Bizkaia
continuous improvement of its equipment; consequently, the Edificio 110
48170 Zamudio (Bizkaia)
information contained in this catalogue may be modified without
Tel +34-944 039 600
previous notice. Fax +34-944 039 679

For further information, please refer to the manual or contact us. http://www.ingeteam.com
 Contents Table

1 Introduction .................................................................................................4

2 Technical Features .....................................................................................8

3 Housing ......................................................................................................15

3.1 1/3 19” Housing .......................................................................................................................15

3.1.1 Front View ........................................................................................................................15
3.1.2 Rear View .........................................................................................................................17
3.2 DA2505 - 2/3 19” Housing .....................................................................................................18
3.2.1 Front View ........................................................................................................................18
3.2.2 Rear View .........................................................................................................................20
3.1 DA2609 - Compact Housing .................................................................................................21
3.1.1 Front View. .......................................................................................................................21
3.1.2 Rear View. ........................................................................................................................22

4 Communication Protocols ......................................................................23

4.1 Configuration points ..............................................................................................................23

5 Time Synchronization..............................................................................23

6 Logic Programming .................................................................................23

7 Configuration Software ...........................................................................24

8 Standards and Tests ................................................................................25

© 2014-2015 Ingeteam Power Technology, S.A. All rights reserved. ZY8932IMA01D

1 Introduction

INGEPAC™ DA-CU consists of a high-performing modular system designed for

electrical environments. Its main functions are as follows:

 Acts as a Remote Terminal Unit and collects information (alarms, statuses,

measurements, counters etc.) from different local devices using several
communication protocols, and sends it to different control centers, following
telecontrol standards.
 Receives commands and set points from different telecontrol centers and
sends them to the corresponding IEDs.
 Performs general logic operations, receiving the necessary information
from the IEDs at position level. These logic operations are developed using
IEC61131-3 compliant tools.
 Acts as a synchronization pattern for all the devices connected to the
communications network via the SNTP protocol.
 Offer both data concentrator and protocol converter features.
 Data acquisition: Several combinations of digital and analogue values
modules that allow to acquire all the substation general purposes
signalization not supplied by the bay units. Digital Inputs are dated with 3
ms accuracy.

© 2014-2015 Ingeteam Power Technology, S.A. All rights reserved. ZY8932IMA01D

 INGEPAC ™ DA-CU
1/3 19” Housing

INGEPAC DA - C U 0 A H C X F A X X X X -

MODEL
Control Unit RTU
8 DIGITAL INPUT Generic CU0
5 DIGITAL OUTPUT

EXTENDED FEATURES
Basic A

HOUSING
1/3 19" H

POWER SUPPLY
24/48 Vdc DI 24/48 Vdc A
12 Vdc DI 12 Vdc D

CPU INTEGRATED SERIAL PORT SP0

RS232 C

SERIAL PORT SP1

None X
RS232/RS485 C

CPU INTEGRATED ETHERNET PORT ETH1

RJ45 F

ETHERNET PORT ETH2

None X
RJ45 F

TERMINALS
Pin Type A

BOARD SELECTION
None XX
15 DI / 8 DO, 24/48 Vdc XC
24 DI / 16 DO (13 NO / 3NC), 24/48 Vdc XM BOARD1
8 DC (mA) 15 DI, 24/48 Vdc XN BOARD2
15 DI / 8 DO, 12 Vdc CC
24 DI / 16 DO (13 NO / 3NC), 12 Vdc CM
8 DC (mA) 15 DI, 12 Vdc CN

RESERVED
RESERVED -
 INGEPAC ™ DA-CU
2/3 19” Housing

INGEPAC DA - C U 0 A I C X F A -

MODEL
Control Unit RTU
8 DIGITAL INPUT Generic CU0
5 DIGITAL OUTPUT

EXTENDED FEATURES
Basic A

HOUSING
2/3 19" I

POWER SUPPLY
24/48 Vdc DI 24/48 Vdc A
12 Vdc DI 12 Vdc D

CPU INTEGRATED SERIAL PORT SP0

RS232 C

SERIAL PORT SP1

None X
RS232/RS485 C

CPU INTEGRATED ETHERNET PORT ETH1

RJ45 F

ETHERNET PORT ETH2

None X
RJ45 F

TERMINALS
Pin Type A

BOARD SELECTION
None XX
15 DI / 8 DO 24 / 48 Vdc XC BOARD1
24 DI / 16 DO (13 NO / 3NC), 24/48 Vdc XM BOARD2
8 DC (mA) 15 DI, 24/48 Vdc XN BOARD3
15 DI / 8 DO, 12 Vdc CC BOARD4
24 DI / 16 DO (13 NO / 3NC), 12 Vdc CM
8 DC (mA) 15 DI, 12 Vdc CN

RESERVED
RESERVED -
 INGEPAC ™ DA-CU
Compact Housing

INGEPAC DA - C U 0 A G C X F A X X X X X X -

MODEL
Control Unit RTU
8 DIGITAL INPUT
5 DIGITAL OUTPUT Generic CU0

EXTENDED FEATURES
Basic A

HOUSING
Compact G

POWER SUPPLY
24/48 Vdc DI 24/48 Vdc A
12 Vdc DI 12 Vdc D

CPU INTEGRATED SERIAL PORT SP0

RS232 C

SERIAL PORT SP1

None X
RS232/RS485 C

CPU INTEGRATED ETHERNET PORT ETH1

RJ45 F

ETHERNET PORT ETH2

None X
RJ45 F

TERMINALS
Pin Type A

BOARD SELECTION
None XX
15 DI / 16 DO, 24/48 Vdc XT
8 DC (mA) 15 DI, 24/48 Vdc XN BOARD1
15 DI / 16 DO, 12 Vdc CT
8 DC (mA) 15 DI, 12 Vdc CN

RESERVED
RESERVED -
 2 Technical Features

ENVIRONMENTAL CONDITIONS
Operating temperature -40 to +65 ºC
Storage temperature -40 to +85 ºC
Relative humidity Up to 95% without condensation

POWER SUPPLY 24/48 Vdc 12 Vdc

DC operating range 18 – 60 Vdc 9.5 – 15.6 Vdc
Output power 5 W + 0.5 W per active relay 5 W + 0.5 W per active relay
Max Output power 20 W 20 W

CPU FEATURES
Number of CPU modules 1
Microprocessor ARM-Cortex A-8
RAM memory 256 MB
Storage memory 128 MB
NVRAM memory 512 KB
Number of USB 2.0 port 1
Logic programming IEC 61131-3 with10 ms cycle time
Time synchronization SNTP

CPU ETHERNET COMMUNICATIONS

Number of Ethernet controllers 2
Connectors 2 RJ45
Connector type RJ45 female
Cable type UTP Cat 5
Maximum cable length 100 m
Insulation 1 kV
Speed 10/100 Mbps

CPU SERIAL COMMUNICATIONS

Number of serial ports 2
Serial Port type SP0 RS-232 and SP1 RS-232/RS-485 (software selectable)
Connector type Female RJ45
Cable type UTP Cat 5
Insulation 1 kV
Cable length 100 m max
Speed Up to 115200 bps
 Table 1. DA-CU serial ports’ pinout

Pin SP0 SP1

RS232 RS232 RS485
1 CD
2 RX RX D-
3 TX TX D+
4 DTR
5 GND GND GND
6 DSR-
7 RTS RTS
8 CTS CTS
9

CPU INTEGRATED DIGITAL INPUT 24/48 Vdc 12 Vdc

Number of inputs 8 8
Voltage levels 19-160 Vdc TBT
Inactive below: 13 Vdc TBT
Burden <3 mA TBT

CPU INTEGRATED DIGITAL OUTPUT 24/48 Vdc 12 Vdc

Number of outputs 5 5
Carry (Permanent) 5 A at 25 ºC TBT
Make (1 s.) 30 A TBT
Operating time 8 ms TBT
Trip or close capacity (L/R = 40 ms) 1,5 A TBT
With resistive load 2A TBT
 Fig. 2.1 INGEPAC™ DA-CU connection diagram

MODULE: 15 DI AND 8 DO XC 24/48 Vdc CC 12 Vdc

Output power TBT TBT
Digital inputs
Number of inputs 15 TBT
Voltage levels 19-160 Vdc TBR TBT
Inactive below: 13 Vdc TBR TBT
Burden <3 mA TBT
Digital output
Number of outputs 8 TBT
Carry (Permanent) 5 A at 25 ºC TBT
Make (1 s.) 30 A TBT
Operating time 8 ms TBT
Trip or close capacity (L/R = 40 ms) 1,5 A TBT
With resistive load 2A TBT
 Fig. 2.2 15 DI AND 8 DO MODULE connection diagram

MODULE: 24 DI AND 16 DO (3NC) XM 24/48 Vdc CM 12 Vdc

Output power TBT TBT
Digital inputs
Number of inputs 24 24
Voltage levels 19-160 Vdc TBR TBT
Inactive below: 13 Vdc TBR TBT
Burden <3 mA TBT
Digital outputs
Number of outputs 16 (3NC) 16 (3NC)
Carry (Permanent) 5 A at 25 ºC TBT
Make (1 s.) 30 A TBT
Operating time 8 ms TBT
Trip or close capacity (L/R = 40 ms) 1,5 A TBT
With resistive load 2A TBT
 Fig. 2.3 24 DI AND 16 DO MODULE connection diagram

MODULE: 15 DI AND16 DO XT 24/48 Vdc CT 12 Vdc

Output power TBT TBT
Digital inputs
Number of inputs 15 TBT
Voltage levels 19-160 VdcTBT TBT
Inactive below: 13 VdcTBT TBT
Burden <3 mA TBT
Digital output
Number of outputs 16 TBT
Carry (Permanent) 5 A at 25 ºC TBT
Make (1 s.) 30 A TBT
Operating time 8 ms TBT
Trip or close capacity (L/R = 40 ms) 1,5 A TBT
With resistive load 2A TBT
 Fig. 2.4 15 DI AND 16 DO MODULE connection diagram

MODULE: 8 DC / 13 DI XN 24/48 Vdc CN 12 Vdc

Output power
Digital inputs
Number of inputs 15 15
Voltage levels 19-160 Vdc TBT TBT
Inactive below: 13 VdcTBT TBT
Burden <3 mA TBT
Analog
Number of inputs 8
Resolution 15 bits + 1 sign bit
Input impedance 50 kΩ (tensión) / 66,5Ω (corriente)
Isolation (for 1 minute) 2000 Vrms
Precisión (25⁰C) 0.05%
Measurement range (±10%) Voltage: Current:
±25 mA
±10 V
±20 mA
±5
±10 mA
±1 V
±5 mA

Continuous load without destruction Voltage: Current:

40 V / 0.5 mA 40 mA
Fig. 2.5 MODULE: 8 DC / 15 DI Connection diagram (TBR)
3 Housing

3.1 1/3 19” Housing

3.1.1 Front View

Fig. 3.1 1/3 19” Front View

 Element
1 USB
2 SP 0
3 Status LED
4 Status and configurable LEDs
5 I / O Leds

Fig. 3.2 Status and confgiurable LEDs

3.1.2 Rear View

Fig. 3.3 1/3 19” Rear View

Element
1 ETH 1
2 ETH 2
3 SP 1
4 Status LED
5 Power LED
 3.2 DA2505 - 2/3 19” Housing

3.2.1 Front View

Fig. 3.4 2/3 19” Front View

 Element
1 USB
2 SP 0
3 Status LED
4 Status and configurable LEDs
5 I / O LEDs

Fig. 3.5 Status and confgiurable LEDs

3.2.2 Rear View

Fig. 3.6 2/3 19” Rear View

Element
1 ETH 1
2 ETH 2
3 SP 1
4 Status LED
5 Power LED
 3.1 DA2609 - Compact Housing

3.1.1 Front View.

Fig. 3.7 Compact Front View

Element
1 ETH 1
2 ETH 2
3 Status and configurable LEDs
4 SP 0
5 SP 1
6 USB
7 Power LED
8 Status LED
9 I / O LEDs
 Fig. 3.8 Status and confgiurable LEDs

3.1.2 Rear View.

Fig. 3.9 Compact Rear View

 4 Communication Protocols

INGEPAC™ DA-CU can work with the following communication standards and protocols:

Protocol Master (or Client) Slave (or Server)

IEC 61850 X X
IEC 60870–5–101 X X
IEC 60870–5–104 X X
DNP3 TCP and Serial X X
MODBUS TCP and RTU X X
Procome X

4.1 Configuration points

INGEPAC™ DA-CU have been proven with the following maximum recommended
configurations.

Function Points Measures Commnads

IEC 61850 Client 750 600 35
IEC 60870–5–101 3000 1000 1000
IEC 60870–5–104 3000 1000 1000
DNP
MODBUS
Procome

5 Time Synchronization

The equipment can be synchronised using the following methods:

Protocol Master Slave Precision

SNTP X X TBT
IEC 60870- 5-101 X X TBT
IEC 60870–5–104 X X TBT
DNP3 X X TBT

6 Logic Programming

Logic editing in the INGEPAC™ DA-CU equipment complies with the directives defined by the
IEC61131-3 standard. It is possible to program in the following languages:

 Structured text (ST).

 Function Block Diagram (FBD).
7 Configuration Software

INGEPAC™ DA-CU is fully configurated with the engineering software INGESYS™ eFS.
INGESYS™ eFS is a powerful, native IEC61850 framework, specifically developed by
INGETEAM to support the IEC61850 standards and derived standards simply and intuitively.
INGESYS™ eFS facilitates engineering tasks in automation systems, covering all the concepts
associated with the following:

 Protection functions.
 Control functions.
 Telecontrol functions.
 Measurements.
 Architectural design and electrical diagrams.
 Definition of operational concepts.
 Transfer of information and configurations.
 Integration of other communication protocols.
 Regulatory configuration files.
 Etc.

INGEPAC™ DA-CU stores information about system events and commands. This information
can be audited with INGESYS™ eFS.
8 Standards and Tests

Electromagnetic
Emissions
Conducted radio-electric emissions IEC 60255-25 (2000) Class B
measurement in DC power supply
EN 55022 (2006)
terminals.
IEC 60255-25 (2000) Class A
Radiated radio-electric emissions
EN 55022 (2006)
measurements.
EN 55011 (2007)
Insulation
Dielectric strength measurement IEC 60255-5 (2000) 2 kVac
Insulation resistance measurement IEC 60255-5 (2000) 500 Vdc, >100 Mohm
Isolation measurement with voltage +5 kV
IEC 60255-5 (2000)
pulses.
Immunity
Electrostatic discharges IEC 61000-4-2 (2001) Level 4, +8 kV/+15 kV
Radiofrequency electromagnetic field IEC 61000-4-3 (2006) Level 3. 10 V/m
Fast transient bursts IEC 61000-4-4 (2004) Level 4, +4 kV, 5KHz
CM: +4 kV
PS: +2 kV
Surges or shockwaves IEC 61000-4-5 (2006)
I/O
DM: +2 kV

Radiofrequency-induced signals Level 3, 10 Vrms

(conducted disturbance)
Electromagnetic field at industrial
frequency (50 Hz)
Pulsed magnetic fields
Dampened magnetic field
Damped wave
Ripple
Dips, variations and no-voltages
Low frequency signals immunity
IEC 61000-4-6 (2007)
Level 5, 100 A/m 1000 A/m 1s
IEC 61000-4-8 (2001)
IEC 61000-4-9 (2001) 1000 A/m
IEC 61000-4-10 (2001) Level 5, 100 A/m
IEC 61000-4-18 (2001) Level 3, +2.5 kV / +1 kV
IEC 61000-4-17 (2001) 15%
IEC 61000-4-29 (2000) 560 ms
IEC 60255-11 (1979)
MC: 300 Vrms
IEC 60255-22-7 (2003)
MD: 150 Vrms

Climatic
Cold test IEC 60068-2-1 (1994) -40°C, 16 h
Dry heat test IEC 60068-2-2 (1994) 85°C, 16 h
Temperature variation test IEC 60068-2-14 (1994) -25ºC / 70ºC
Continuous humidity heat test IEC 60068-2-78 (1994) 40ºC+2ºC, 93% 4 days

Mechanical
Vibration test (sinusoidal) IEC 60255-21-1 (1998) Class I
5-200 Hz
Vibration random EN 60068-2-64 (2008)
ASD 1 m2/s3
Shock and bump IEC 60255-21-2 (1998) Class I
Seismic
Seismic tests IEC 60255-21-3 (1993) Class 1
Drop ETSI EN 300 019-2-2 (1999)
IP30
IP protection grade: UNE EN 20 324 (1993)
Frontal IP32
www.ingeteam.com