The History and Theme of BEL

Bharat Electronics Limited (IAST: Bhārat Electronics

limiṭeḍ) (BEL) is an Indian state-owned aerospace and
defence company with about nine factories, and several
regional offices in India.
It is owned by the Indian Government and primarily
manufactures advanced electronic products for the Indian
Armed Forces. BEL is one of nine PSUs under
the Ministry of Defence of India. It has been
granted Navratna status by the Government of India.
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 History
Starting with the manufacture of a few communication equipment
in 1956, BEL started producing receiving valves in 1961,
germanium semiconductors in 1962 and radio transmitters for AIR
in 1964.

 In 1966, BEL set up a radar manufacturing facility for the army

and in-house R&D. In 1967, BEL began manufacturing
transmitting tubes, silicon devices and integrated circuits. The
PCB manufacturing facility was established in 1968.
 In 1970, BEL started making black & white TV picture tubes, X-
ray tubes and microwave tubes. In 1971, BEL set up facilities
for the manufacture of integrated circuits and hybrid micro
circuits. 1972, BEL established manufacturing facilities for TV
transmitters for Doordarshan. In 1973, BEL began
manufacturing frigate radars for the navy.
Under the government's policy of decentralisation and due to
strategic reasons, BEL set up new units at different location
across the country. The second unit of BEL was set up at
Ghaziabad in 1974 to manufacture radars and Tropo
communication equipment for the Indian Air Force. The third unit
was established at Pune in 1979 to manufacture image converter
and image intensifier tubes.

 In 1980, the first overseas office of BEL was set up in New

York for the procurement of components and materials.
 In 1981, a manufacturing facility for magnesium manganese
dioxide batteries was set up at Pune. The Space Electronic
Division was set up at Bangalore to support the satellite
programmes in 1982. That year, BEL achieved a turnover of
Rs. 1 billion (US$21 million).

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  In 1983, the Andhra Scientific Company (ASCO) was taken
over by BEL converted it to its fourth manufacturing unit at
Machilipatnam. In 1985, the fifth unit was set up in Chennai
for supply of tank electronics, with proximity to HVF, Avadi.
The sixth unit was set up at Panchkula the same year to
manufacture military communication equipment.
 In 1986, BEL set up three units. Its seventh unit was set up
at Kotdwara to manufacture switching equipment, the eighth
unit to manufacture TV glass shell at Taloja (Navi Mumbai)
and the ninth unit at Hyderabad to manufacture electronic
warfare equipment.
 In 1987, a separate Naval Equipment Division was set up at
Bangalore to give greater focus to naval projects. The first
Central Research Laboratory was established at Bangalore
in 1988 to focus on futuristic research and development.
 In 1989, BEL started manufacturing telecom switching and
transmission systems and also the set up the Mass
Manufacturing Facility in Bangalore and the manufacture of
the first batch of 75,000 electronic voting machines.
The agreement for setting up BEL's first joint venture company,
BE DELFT, with M/s Delft of Holland, was signed in 1990. This
later became a subsidiary of BEL with the exit of the foreign
partner and has been renamed BEL Optronic Devices Limited.
The second Central Research Laboratory was established at
Ghaziabad in 1992. The first disinvestment (20%) and listing of
the company's shares in the Bangalore and Mumbai Stock
Exchanges took place in same year-1992.

 In 1996, BEL achieved ₹10 billion (US$215 million) turnover.

 In 1997, GE BEL, the second joint venture company with M/s
GE, USA, was formed as also the third JVC with M/s Multitone,
UK, BEL Multitone. The same year, the US imposed supply
restrictions on BEL.

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 In 1998, BEL set up its second overseas office at Singapore to
source components from South East Asia. In the same year
US and Europe imposed sanctions on BEL. The company was
able to overcome the effects of the sanctions and kept up the
promised deliveries to customers.
 In 2000, BEL reorganised its Bangalore unit into six Strategic
Business Units (SBUs). The R&D groups in Bangalore were
also restructured into Specific Core Groups and Product
Development Groups. The same year, BEL shares were listed
in the National Stock Exchange.
 In 2002, BEL became the first defence PSU to achieve
operational Mini Ratna Category I status. In 2003, the
company's turnover crossed the ₹25 billion mark (US$540
million). In 2005, BEL had a turnover of ₹32.20 billion (US$695
million). BEL achieved a turnover of ₹35.60 billion (US$767
million) in 2005–06.
 On May 12, 2010, Boeing announced that it received the Data
Link II communications technology for the Indian Navy’s P-
8I from Bharat Electronics Limited (BEL) in April, one month
ahead of schedule. BEL delivered the Indian-designed
communications system that will enable exchange of tactical
data and messages between Indian Navy aircraft, ships and
shore establishments. Boeing will install the system during P-8I
final assembly.
 In 2011, the Indian government-owned Bharat Electronic
Limited (BEL) showcased its entire range of C4ISR capabilities
including network centric warfare technologies developed in-
house at Aero India 2011. These include command and control
system, air space management multi sensor tracking, situation
simulator and tactical algorithm for air defence applications;
battlefield management system and an all-weather 24/7 coastal
surveillance system

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In addition, new products and technologies including software
defined radios, next generation bulk encryptor and high data
tactical radio were also on show. Airborne products displayed
included radar finger printing system, data link, digital flight control
computer and identification friend or foe. Also on display were the
complete range of optoelectronic equipment, including night vision
devices, digital handheld compass and an advanced land
navigation system.
BEL is the lead integrator of Akash, the Indian-made guided
missile air defence weapon system. Another major system is
weapon locating radar, the state-of-the-art passive, phased array
radar which has undergone successful user trials by the Indian
defence forces
Bharat Electronics Limited has its units in the following
cities of India.
 Bangalore (corporate head office and factory), Karnataka
 Chennai, Tamil Nadu
 Panchkula (Haryana)
 Kotdwara, (Uttarakhand)
 Ghaziabad, (Uttar Pradesh)
 Pune, Maharashtra
 Hyderabad, Telangana
 Navi Mumbai
 ANANTAPUR, Andhra Pradesh
 Machilipatnam, Andhra Pradesh
Liaison offices

 Agra
 New York City
 Singapore
 Hanoi, Vietnam
Regional offices
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 New Delhi
 Mumbai
 Calcutta
 Vizag

Subsidiaries
BEL Optronic Devices Ltd
BEL Optronic Devices Ltd. is a subsidiary company of BEL. It was
founded in 1990 with the aim of conducting research,
development and manufacture of image intensifier tubes and
associated high voltage power supply units for use in military,
security and commercial systems. The company is headquartered
in Pune and earned aggregated revenue of ₹516
million (US$7.2 million) during the fiscal year 2007

Recent development
Bharat Electronics is forming some joint ventures to achieve
technical excellence. Bharat Electronics Limited has set up a joint
venture with General Electric (GE) USA, for manufacturing high
voltage tanks and detector modules for computed
tomography (CT) scan systems and advanced level of X-ray
tubes. The company is in the process of joining with Bharat Heavy
Electricals Limited (BHEL) to set up a joint venture to make solar
photovoltaic components. BEL has signed a memorandum of
understanding with Indus Teqsite, Chennai, for the design and
development of digital subsystems for its equipment, test systems
for its radars, avionics and electronic warfare, and another with
the French company Thales International to set up a joint venture
for civilian and defence radar. BEL has signed a memorandum of
understanding with Textron Systems to provide nicro-observer
unattended ground sensor (UGS) systems to the Indian security
agencies.

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BEL designs, develops and manufactures a range of products in
the following fields:

 Electronic voting machines

 Voter-verified paper audit trail
 Traffic signals
 Radars
 BEL Weapon Locating Radar
 BEL Battle Field Surveillance Radar
 Indian Doppler Radar
 Samyukta Electronic Warfare System
 Central acquisition radar (3D-CAR)
 Reporter Radar
 Telecommunications
 Sound and vision broadcasting
 Opto-electronics
 Information technology
 Semiconductors
 Missiles
 Akash (missile)
 Sonars
 Composite Communication System (CCS)
 Fire-control system
 Radar
 Electronic warfare systems
 Samyukta electronic warfare system
 F-INSAS
 Simulators
 Tank electronics
 Combined day sight for Arjun MBT
 Defence communications
 Data Link II communications system for the Indian Navy's P-
8I

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  Combat management system for Indian Navy
 Solar systems
 Naval systems
 ADC&RS
 IACCS
 A low-cost tablet PC being used in the Socio-economic Caste
Census 2011
 Biometrics Capturing for Nation Population Register
 Encrypters for the Ministry of Home Affairs
 IFF (Identify Friend or Foe) secondary radar
 VHF radio
 IEMC (Internal Environment Monitoring & Control) [earlier
called SSMC]
Some products are manufactured by Bharat Electronics Ltd. with
help of ToT (Transfer of Technology).

pic 1

Scale Model of BEL Weapon Locating Radar

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The Swathi Weapon Locating Radar (WLR) is a
mobile artillery locating phased array radar developed by
India.[3] This counter-battery radar is designed to detect and track
incoming artillery and rocket fire to determine the point of origin
for Counter-battery fire.
The WLR has been jointly developed
by DRDO's Bangalore based laboratory, LRDE and
the Government owned Bharat Electronics Limited (BEL). The
sub-systems have been fabricated by BEL based on the DRDO
designs and delivered to LRDE for integration.
Specification :

Performance

 Range:
 >81 mm Mortars: 2–20 km
 >105 mm Guns: 2–30 km
 Unguided Rockets: 4–40 km
 Elevation Coverage: -5 to 75°
 Azimuth Coverage: +/- 45° mean settable bearing
 Slewability: +/- 135° within 30 seconds.
 Targets Tracking: 7 simultaneously (maximum)
 Firing angles: Both High & Low
 Aspect Angles: 0-180°

Technical Specifications[edit]

 Instrumented Range: 50 km
 Frequency Band: C band
 Probability of:
 Detection: 0.9
−6
 False Alarm: 10
 Weapon Locations: 99 stored (maximum)
 Digital Map Storage: 100 x 100 km

36
Environmental Specifications[edit]

 Operating temperature: -20 to +55°C

 Storage Temperature: -40 to +70°C
 Damp Heat: 95% RH at 40°C
 Operational Altitude: Up to 16,000 feet (4,900 m)

BEL Battle Field Surveillance Radar

Battle Surveillance Radar (BFSR-SR)

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The PJT-531 Battle Field Surveillance Radar – Short
Range (BFSR-SR) is a man portable 2D short-range battlefield
and perimeter surveillance radar developed by the Indian Defence
Research and Development Organisation (DRDO). The BFSR
has been designed by DRDO's Bangalore-based laboratory,
the Electronics and Radar Development Establishment (LRDE)
and is being manufactured by Bharat Electronics Limited (BEL).
BFSR has found use in the Indian border areas, especially along
the Line of Control (LoC) in Jammu and Kashmir to prevent
infiltration. Over 1100 units are in use by the Indian Army. Foreign
Countries have also placed orders for the BFSR.
Over 1,400 BFSRs are now being used by the Army against
moving surface targets. A BFSR radar that offers foliage
penetration is under development

Development

In the aftermath of the Kargil War, and with the heightened

levels of infiltration, the Indian Army started looking at electronic
sensors to augment the surveillance capabilities. One of the
technologies identified was a small, surveillance radar, and the
Army projected its requirements to LRDE shortly after. Sanction
was given to DRDO to develop an indigenous radar. In the
meantime, some Battle Field Surveillance radars (SR) were
imported from Israel at a cost of ₹ 800 million, pending completion
of the project. This accompanied a large-scale induction of high
tech equipment for the Indian Armed Forces.

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Performance
Range

 Detection Range:

Crawling man: 700 m

 Walking man: 3 km (1.9 mi)
 Group of people: 7 km (4.3 mi)
 Light vehicle: 10 km (6.2 mi)
 Heavy vehicle: 14 km (8.7 mi)
 Range accuracy: 20m rms
 Range resolution: 50 m
 Speed: 0.9 m/s to 90 km/h

Azimuth & elevation

 Elevation Coverage: -40 to +15° (remotely settable)

 Azimuth sector scan: 30 to 180°
 Azimuth accuracy: 0.5° rms
 Azimuth resolution: better than 4°
 Track while Scan: 50 targets

Technical Specifications

 Instrumented Range: 18 km (11 mi)

 Frequency Band: J band, 21 frequencies
 Transmitter Type: Solid state
 Receiver Type: Super heterodyne
 Antenna Type: Micro-strip Patch array

Operation

 Modes of operation: Surveillance and tracking

 Target Identification: Using Doppler tones
 Rotation Rate: Low, Medium, High

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Display

 Control & display unit: Customized, portable, IBM PC, compatible

with Windows NT operating system
 Display type: 10.4" LCD colour
 Display modes: PPI or B-scope
 External interface: RS232C, LAN

Power & Reliability

 Weight: 30 kg (excluding accessories)

 Power supply: 24 V DC nominal
 Power consumption: 80 W
 Operating temperature: -20 to +55 °C
 MTBF: 1500 hrs
 Operational Altitude: Up to 16,000 feet (4,900 m)

After that meeting , they conducts an safty class and

personality devolopment classes .
After that all they divided all students into different sections
like production section,PA(production assurance) section,finace
section……. .
They aloted me into production section .There are many
different sub sections in production like
1. thermal imagers
2. o ring section
3. leak cheaking…..etc.

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41
Block 1:Receipt of SO/WBS element from MKTG.
Block 2: They check is BOM existing.(if there Is no BOM is
existing they prepare BOM)
Block 3:Seek management approval morality.
Block 4:Run MRP with morality.
Block 5:Raise PR’S SCR’S as per MRP.
Block 6:Launch production order for ¼ components.
Block 7:Are rejections more than morality(If they are
present higher than specified value take
necessary remedial action & Re-launch).
Block 8:Launch to assy’s along production order.
Block 9:Prepare goods receipt for production order as
per 1-Note/advice note received from PA dept & inform
MKTG and stores dept.

42
43
Block 1:the first step is PC& KMS.
Block 2:checking for input docs(if they are not ok it will
Go back to PC & KMS for necessary correction).
Block 3:Assembling of sub-assembles ande integration of
sub-assy into modules.
Block 4:sensor testing by PA(if it is not ok they again go
For block 3).
Block 5:integration of main assembly(if it not ok it go to
For block 3).
Block 6:main assy testing by PA(if it is not ok they again
go For block 3).
Block 7:Leak &purking(if it is not ok they again go For
block 3).
Block 8:E.S.S. & vibration(if it is not ok they again go For
block 3).
Block 9:performance check by PA(if it is not ok they again
go for block3).
Block 10: review of rotating cards &NC’S,it is cnnecting
3,4,6,7,8,9 blocks.

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“In the machilipatnam BEL is making night vision
binoculers for indien army.”
The different types of binoculers are:
1. Mk II
2. LRF(laser range finder)
3. TAB
4. T72.
5. EOTS.

MK II:The MK II is an old version of the LRF.the MKII is

will only consisting of the Night vision & day vision.The
range is also low then compare to LRF.
It will only consisting night vision with a low value.
LRF:Mainly the LRF is consisting the day vision with
distance finder.
The LRF is internally consisting
OG&DDC,FPGA,DSP,DMC,CCD, power supply,mother
board.
The programe for the LRF is dumping FPGA,DSP.it will be
run the total LRF instrument.
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TAB:It is the advanced version of the LRF.The TAB is also
having Day vision &night vision with a distance finder but
the TAB also consisting of an external extender.It will be
increase distance day vision.
T72:The T72 is an russian model but the T72 is upgraded
& modified by the BEL.it is totally changed with higher
upgrades.
The T72 is using in T72 tanker in army.The T72 is using
power from tanker.The T72 is also consisting of the an
external display placed in inside T72 tank.It is will
consisting night vision and day vision.
Note: The T72 instrument get the name by the T72
tanker.

EOTS:it is using in now a days.it will consisting night

vision,day vision and lsaer range finder.

46
 LRF

(laser range finder)

 The LRF is consisting of these parts:
 OG,DDC,FPGA,DSP,DMC,CCD,LRF,Power
supply,Mother board,IPS.
 The data is dumping in FPGA & DSP it will run the
total instrument.
 OG:It will be placed at left side in the instrument,it is
the night vision of LRF.
 LRF is find distence between enemy and solder.
 Day vision range is 12KM & night vision is 16KM.
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 TAB
 The TAB is same like LRF,but it is the advanced
version of LRF.
 But it will consisting of an external extender to day
vision,it will increases range of the day sight.
 It will consisting of same parts like LRF.
 OG & DDC:it is having a 12V moter it will be very
useful for changing night vision range.
 FPGA & DSP:it will be contaning the program
software,it will run the whole instrument.
 DMC & CCD:it will be an light dependent sensor,it
will change night vision & Day vision automatically.
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 EOTS
 The TAB&LRF are having same body.
 But there is small diffrence it is the inner parts
having small changes.
 The day vision&night vision ranges are high.
 In now a days it is using in army.

49
MKII
 The MKII is an old version.
 It will not having LRF and it will having low range
night vision&day vision.
 It is working with an 14.6v li-ion battery.

50
 Alignment procedure of CDR day sight of T727

HEAD ASSY

WEDGE ASSY

OG HOLDER

MIRROR ELBOW

ELBOW ASSY
EYE PIECE
RETIVLE LENS HOLDER
HOLDER

DLOPTER LENS
HOLDER

OCTAGONAL
51
MIRROR
 SOLDRING
Soldering is the process of fixing one or more
components as one by one by dissolving and running a
solder in the joint is called as soldering. The solder metal
has a lower melting temperature than the working piece.
The soldering process can be applied in electrical and
electronic projects, plumbing, etc. Soldering process is
done in various electrical and electronics projects to
combine the components with the roots of the printed
circuit board. The circuit performance and working
depends on the perfect soldering, It needs talent and
working on the good soldering techniques will help you to
make an excellent working circuit. Here this article
explains the methods of soldering which require
Soldering Lead, Soldering Iron, and Flux along with
a printed circuit board and layout diagram of the circuit.

Different Methods of Soldering

The methods of soldering process can be classified into two,
namely soft soldering and hard soldering.

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 Different Methods of Soldering

Soft Soldering

Soft soldering is a process for fitting very minute compound

parts possessing low liquefying temperature, which have been
broken during the procedure of soldering is performed at high
temperature. In this process, a tin-lead alloy is used as space
filler metal. The liquefying temperature of the space filler alloy
must not be less than 400oC / 752oF. A gas torch is used as
a heat source, for the procedure. Some of the examples of
this kind of soldering metals include: tin-zinc for bonding
aluminum, tin-lead for general usage; zinc-aluminum for
aluminum, cadmium-silver for power at high temperature;
lead-silver for strength higher than room temperature,

53
weakening confrontation, tin-silver & tin-bismuth for electrical
products.

Hard Soldering

In this type of soldering a solid solder unites two elements of

metals by spreading out into the holes of the component that
are unlocked due to high temperature. The space filler metal
grips higher temperature more than 450oC/840oF. It
comprises of two elements: Silver soldering and Brazing.

Silver Soldering

It is an unsoiled method supportive to fabricate small

components, carrying out abnormal maintenance and built-up
tools. It makes use of an alloy containing silver as a space
filler metal. Though silver provides a free running individuality,
yet silver soldering is not suggested for space filling, and thus,
different flux is recommended for accurate silver soldering.

Braze Soldering

This type of soldering is a procedure for connecting two

terminals of the base metals by forming liquid metallic space
filler, which runs by the attraction of a vessel through the
54
joints and cools down to give a solid union through diffusion
and atomic magnetism. It produces a very strong joint. It
makes use of a brass metal as a space filler agent.

Required Tools for Soldering

The required tools for soldering includes soldering iron, solder
flux, soldering paste, etc.

Required Tools for Soldering

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Soldering Iron

Here, soldering iron is the required primary thing, which is

used as a heat source for liquefying solder. And 15W to
30W soldering guns are good for the majority of
electronics or PCB (printed circuit board) job. For
soldering heavy components and cable, you require to
spend on an iron of advanced wattage approx 40W or a
larger solder gun. The major difference between a gun
and an iron is that an iron seems like a pencil and
comprises of a pin-point heat supply for precise job,
whereas a gun is like a gun in shape with a high wattage
point excited by running electrical current simple through
it.

A soldering iron device is used for soldering electronic

components by hands. It sends heat to make softer the
solder so that it can sprint into the breaks among two work
terminals. Soldering irons are often brought into engaging
in recreation for setting up, protect, and incomplete
fabrication work in assembling the components.

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Solder Flux

A flux is a chemical purifying agent. In soldering metals,

flux provides three functions: it eliminates rust from the
components to be soldered; it closes air out as a result ending
extra rust, and by making easy mix improves dripping
individuality of the fluid solder.

Soldering Paste

Soldering cream is employed to connect the leads of

included chip packages to connection ends in the circuit
blueprint on a PCB.

Step by Step Soldering Process

The fundamental step by step procedure of soldering is
executed by the following steps

 Start with the small components to the taller components and

connecting wires
 Place the element into the PCB, making sure it goes in the
correct way around
 Twist the leads a little to secure the part.
 Make sure the soldering iron has warmed up and if required,
use the moist sponge to clean the tip.

57
 Place the soldering iron on the component of the pad and feed
the solder’s end onto the board.

Step by Step Soldering Process

 Take away the solder and the soldering iron from the board.
 Leave the terminal to cool for a few seconds.
 Using a couple of cutters neat the excess component terminal

58
 If you make a mistake while heat up the joint with the iron,
place the solder tip of your solder extractor and push the
button.
Soldering Tips
Soldering is the process that requires practicing the
most. Soldering tips must assist you to become successful
in your endeavor, and if anything goes wrong, you can
stop practicing it, and get ready to do some serious tasks.

59
Soldering Tips

Use Heat Sinks: Heat sinks are an essential for the

connecting wires of sensitive apparatus namely transistors
and integrated circuits. If you do not have a clip on this, then
a pair of pliers is a superb choice.
Clean the Iron Tip Neat: A clean iron tip indicates the
conductivity of an improved heat and also a better joint.
Make use of a wet piece of sponge to clean the tip among
joint. Keep the tip of solder well tinned.
Check the Joints: When complex circuits are being
collected it is an excellent practice to confirm joints after
soldering them.
Solder Tiny Parts Initially: Solder jumper terminals,
diodes, resistors and all other small parts previous to
moving ahead to connect bigger parts such as
capacitors and transistors. This makes assembling much
easier.
Connect Sensitive Components at the End: Put in CMOS,
MOSFETs, ICs and other inactive sensitive parts at the
end to avoid damaging them while connecting the other
components.

60
Use Sufficient Ventilation: Avoid breathing the smoke
formed and make sure that the region you are operating in
has plenty ventilation to put a stop to increase of toxic
smoke.
Different Types of Printed Circuit Board

The acronym of the printed circuit board is PCB, it is a self

contained board with interconnected electrical and electronic
components found in various devices ranges from beepers to
pagers, radios, radar and computer systems. The circuits are
produced by a slight layer of conducting material deposited on
the outside of an insulating board called as the substrate.
Separate components are located on the surface of the
substrate & soldered to the connected circuits. The
construction of the PCB can be done in three ways, namely
single sided, double sided and multi layered.The components
on a PCB are connected electrically to the circuits by two
different methods such as hole technology and surface
mount. In hole technology, every component consists of thin
leads, which are pressed through tiny holes in the substrate &
soldered to connection boards in the circuits on the reverse
side.In surface mount technology, J-shaped or L-shaped
terminals on every component get in touch with the PCB
directly. A solder paste includes a glue, solder and flux are
applied at the contact point to grip the components in position
until the solder is liquefied.

61
 Types of PCBs

Different Types of Printed Circuit

Boards
PCBs have copper tracks to connect the holes where the
various components are located They are specially designed
for each and every circuit and build construction very easy.
Though, making the PCB necessitates special tools. The
different types of printed circuit boards mainly include the
following

 Single Sided PCBs

 Double Sided PCBs
 Multilayer PCBs
 Rigid PCBs
 Flex PCBs
 Rigid-Flex PCBs
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Single Sided PCBs
This single sided printed circuit board includes just one layer
of base material or substrate. One end of the substrate is
coated with a thin layer of metal, usually copper because it is
a good electrical conductor. Generally, a protecting solder
mask be seated on the peak of the copper layer, and a last
silkscreen coat may be applied to the top to mark elements of
the board.

Single Sided PCBs

This PCB consists of various circuits and electronic

components on the only single side. This kind of module works
most excellent for easy electronics, and beginners often
o
design and build this type of board first. These boards tend to

63
cost less to mass-produce
produce than other types of boards. But
although this low cost, they’re used rarely because of their
intrinsic design limitations.

Double Sided PCBs

This type of PCBs is much more familiar than single-sided
single
boards. Both sides of the board’s substrate include metal
conductive layers, and elements attach to both sides as well.
Holes in the PCB let circuits on a single side to attach to
circuits on the other sside.

Double Sided PCBs

These kind of circuit boards used to connect the circuits on

every side using one of two techniques: through-hole
through &
surface mount technology. Through
Through-hole
hole technology engages
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feeding small wires, called as leads through the holes
& soldering every end to the suitable component.
Surface mount technology is different from through-hole
technology, it does not utilize wires. In its place, many little
leads get soldered straight onto the board. Surface mount
technology permits many circuits to be complete in a lesser
space on a board, meaning the board can execute more
functions, typically at a lesser weight and at faster speeds
than through-hole boards let.

Multilayer PCBs
These PCBs further enlarges the density and complexity of
PCB designs by adding extra layers beyond the top & bottom
layers seen in a configuration of double sided. With the
accessibility of over many layers in multilayer printed circuit
board configurations, multilayer PCBs let designers to make
very thick and highly compound designs.

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 Multilayer PCBs

The extra layers used in this design are power planes, which
both provide the supply to the circuit with power and also
decrease the levels of electromagnetic interference which are
emitted by designs. Lower EMI levels are attained by placing
signal levels in the mi
middle of power planes.

Rigid PCBs
In addition to having different numbers of layers & sides,
Printed circuit boards can also come in changing inflexibilities.
Most customers usually think of inflexible PCBs when they
image a circuit board. Rigid printed circuit boards use a solid,
rigid substrate material like fiberglass that remains the board
from twisting. A motherboard within the tower of a computer is
the best example of an inflexible PCB.
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 Rigid PCBs

Flex PCBs
Generally,
ly, the substrate in a flexible board is a flexible plastic.
This fundamental material permits the board to fit into forms
that inflexible boards cannot & to turn or shift during use
without harmful the circuits on the printed circuit board.
Though flex boards
ards tend to charge more to intend and create
than rigid PCBs, they come with a number of advantages. For
instance, they can restore heavy or bulky wiring in superior
gear like satellites, where weight & space matter. Flex boards
can also come in three for
formats,
mats, namely single sided, double-
double
sided or multilayer formats.

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 Flex PCBs

Rigid-Flex
Flex PCBs
Rigid flex boards merge technology from both flexible and
rigid circuit boards. An easy rigid
rigid-flex boards comprises of a
rigid circuit board that joints to a flex circuit board. These
boards can be more compound if design requests demand.

Thus, this is all about different types of printed circuit boards,

which includes Sided PCBs, Double Sided PCBs, Multilayer
Multilaye
PCBs, Rigid PCBs, Flex PCBs, Rigid
Rigid-Flex
Flex PCBs, etc.

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Rigid
Rigid-Flex PCBs

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