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RADC-TR-89-281
In-House Report
November 1989
Gretchen A. Bivens
™„
^ 3 L ^ V U ^ - - W / ~ \ j 5 dkjLLXK
ANTHONY J FEDUCCIA
Chief, Reliability & Engineering Division
Directorate of Reliability and Compatibility
APPROVED:
\ s u ^ v ij<x4^r
JOHN J. BART
Technical Director
Directorate of Reliability and Compatibility
rn^p
JAMES W. HYDE III
Directorate of Plans and Programs
If your address has changed or if you wish to be removed from the RADC mailing list,
or if the addressee is no longer employed by your organization, please notify RADC
(RBES) Griffiss AFB NY 13^1-5700. This will assist us in maintaining a current
mailing list.
6a. NAME OF PERFORMING ORGANIZATION 6b. OFFICE SYMBOL 7a. NAME OF MONITORING ORGANIZATION
Rome Air Development Center (If applicable) Rome Air Development Center (RBES)
RBES
6c ADDRESS {City, State, and ZIP Code) 7b. ADDRESS (City, State, and ZIP Code)
8a. NAME OF FUNDING /SPONSORING 8b. OFFICE SYMBOL 9. PROCUREMENT INSTRUMENT IDENTIFICATION NUMBER
ORGANIZATION (If applicable)
Rome Air Development Center RBES N/A
8c ADDRESS (City, State, and ZIP Code) 10. SOURCE OF FUNDING NUMBERS
PROGRAM PROJECT TASK WORK UNIT
Griffiss AFB NY 13**1-5700 ELEMENT NO. NO. NO ACCESSION NO.
62702F 2338 02 2X
11. TITLE (Include Security Classification)
RELIABILITY ASSESSMENT USING FINITE ELEMENT TECHNIQUES
12. PERSONAL AUTHOR(S)
Gretchen A. Bivens
13a. TYjPE OF REPORT 13b. TIME COVERED 14. DATE OF REPORT (Year, Month, Day) 15. PAGE COUNT
-[ouse
Tn-Hor-- FROM .Ian 8 8 T O l u l 8 8 November 1989 76
16. SUPPLEMENTARY NOTATION
N/A
17. COSATI CODES 18. SUBJECT TERMS (Continue on reverse if necessary and identify by block number)
FIELD GROUP SUB-GROUP Reliability Prediction Techniques
1* 0* Finite Element Analysis Material Failure
20 13
19. ABSTRACT (Continue on reverie if necessary and identify by block number)
Finite element analysis (FEA) is a computer simulation technique that is used to predict the thermal
and mechanical response of a structure. Rome Air Development Center (RADC) has used FEA to
predict the response in various electronic assemblies. This particular study was concerned with the
reliability of surface mounted microwire boards. A FEA of this assembly was simulated and the results
used to estimate its useful l i f e . This report gives a detailed acccount of the factors to be considered
when performing a FEA and the procedure used to transfer the results to a reliability figure-of-merit.
UNCLASSIFIED
UNCLASSIFIED
UNCLASSIFIED
TABLE OF CONTENTS
1.0 INTRODUCTION 3
6.0 CONCLUSIONS 63
7.0 REFERENCES 66
i l l
LIST OF ILLUSTRATIONS
IV
33 Microwire/PTH FEM 44
34 Modified Microwire/PTH FEM (20 Mil Via) 45
35 Modified Microwire/PTH FEM (10 Mil Via) 45
36 Stress Contours for S-Lead FEM 50
37 Stress Contours for Leadless FEM 53
38 Stress Contours for Gull-Wing FEM 55
39 Stress Contours for Microwire/PTH (20 Mil Via) FEM 58
40 Stress Contours for Microwire/PTH (10 Mil Via) FEM 59
v
0.0 EXECUTIVE SUMMARY
finite element analysis. Are the materials relatively well known and the
proper material properties available for this analysis? Are the boundary
an analysis is feasible and if so, what the best approach to performing the
1
preliminary modeling which were performed in this investigation are docu-
The results of the FEA were plotted on either the Coffin-Manson curve
for copper or for solder, depending on the material being analyzed. The
estimated life allows the design and reliability engineer to locate areas
program. This reduces the overall cost of the program and allows the
2
1.0 INTRODUCTION
RADC has used finite element analysis (FEA) as a way to assess the
values were taken from the FEA results and compared with the strength of
nique was needed to transfer the numerical results from the FEA to a
measure of useful life for the system being analyzed. This report docu-
electronic assemblies through the use of FEA and a transfer of FEA results
assembly analyzed. The first area was the solder connection between a
surface mounted device and its connecting board. Current use of these
devices has shown that these connections tend to fail soon after the system
has been installed. Three different lead designs were evaluated, the S-
lead, leadless, and gull-wing designs. The second area of concern was the
interface connection between the microwire and the PTH. Microwire layer-
layers in a surface mounted board. The connection with the PTH is critical
engineer determines the best way to develop the finite element model. A
3
file which describes the materials used, the boundary conditions, and the
input conditions is created. This data file is read by the finite element
simulation code and a thermal analysis performed. From this analysis, the
strain range for the material of concern is obtained. Once the strain
to estimate the number of thermal cycles this material would survive before
failure.
4
2.0 RELIABILITY CONCERNS IN ELECTRONIC ASSEMBLIES
useless to the overall system. This is very critical when the system is a
new mounting techniques and large packaging densities which have led to
shows typical surface mounted packages for four different lead designs.
Factors which have been shown to effect the solder connection failure
include the lead design, package size, board material and heat removal.
rials which reduce the board's horizontal expansion were used. This reduc-
tion has caused an increase in the board's vertical expansion which has led
5
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boards which have a reduced vertical height of the board and thus a reduc-
sulated in a resin to form the microwire boards. PTHs, known as vias, are
then laser drilled and the insulating material and encapsulating resin
plated with copper and the interconnect between the PTH and the microwire
reliability concern.
Surface Pad
PLATED INTERCONNECTION
assumed that adequate heat transfer and low package thermal resistance
zations and contractors have shown that this is not sufficient criteria for
fatigue; that is, as these devices and connecting boards expand and con-
tract, the interconnects between them are forced to expand and contract as
does not take very much expansion to cause a significant amount of strain
to occur. Once the device and board return to the original state, so does
interconnects, solder and copper, tend to fail rapidly even when exposed to
9
3.0 STUDY METHOD
bility of new microcircuit packaging designs. Over the past five years,
arsenide, wafer scale integration, and surface mounted devices. The find-
ings in these evaluations have had excellent correlation with the results
conditions.
microwire boards, finite element models (FEMs) were generated and a tem-
perature change was simulated. FEMs are geometrical models which repre-
sent the actual physical system. The FEM is defined by two physical
10
A node is a grid point located in space. In this study, the models
were created in three dimensions and, therefore, each node was defined by
defined by a material index number and a set of nodes. Each index number
has specific material properties associated with it. The properties can be
ments. Two types of 3-D elements were utilized (Figure 5 ) . The first type
was identified by eight corner nodes. These elements are usually rectan-
gular in shape, but do not have to be. This type of element uses linear
equations to define the lines connecting the nodes. The second type of
element is defined by eight corner nodes and twelve midside nodes. This
type uses parabolic equations to define the lines connecting the nodes.
elements significantly increases the complexity of the model and the simu-
lation.
11
Figure 6: Typical One-Quarter Geometry-
ditions. The FEMs developed in this study represent one quarter of the
12
When choosing the temperature cycling range, many factors were con-
sidered. The most important was the environment that the microwire assem-
blies were experiencing in the field. The second was the temperature at
which the assemblies are manufactured. This value was considered the
stress free temperature of the assembly. All of the models were cycled
twice, once from the stress free temperature to the maximum temperature
(high temperature cycle) and once from the stress free temperature to the
minimum temperature (low temperature cycle). The output strain from each
strain.
cedure is used. First, the maximum Von-Mises stress in the ductile mate-
greater than the yield stress, then the elastic strain and the plastic
the elastic stress divided by the modulus of elasticity. The strain in the
mates the strain and the actual strain is assumed to be in between these
two values. Figure 8 shows how the first approach estimates the plastic
region into the plastic region. The second approach takes twice the
13
plastic strain that is estimated in the first approach and adds this to the
ELASTIC
A DEFORMATION
CO
CO
LU
CL
I-
co
STRAIN
14
STRAIN
Figure 8: Bounded Plastic Region
strains for the two temperature cycles. This total strain value is trans-
Curve for the specific material. This curve is generated from the Coffin-
15
A± = JIL <2Nf) + €f ( 2 N f ) c
ELASTIC PLASTIC
STRAIN STRAIN
16
values for the copper and solder are listed in Figure 9. These values were
inserted into the model and the corresponding curves were generated,
Figures 10 and 11. Each figure has two lines and one curve. The lines
represent the elastic strain component and the plastic strain component
and the curve represents the combined strain. In order to determine the
number of cycles to failure for a given strain, the total strain value for
this copper or solder is plotted onto the corresponding curve and the
17
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("!/"!) NIVUiS 1V101
19
H.O FINITE ELEMENT MODELING
When the engineer performing the FEA has an extensive knowledge in the
area being analyzed, assumptions about the geometry, materials, and bound-
ary and input conditions can be made. This is not always the case. An
engineer may be given the basic information and asked to investigate the
These models are simple and are analyzed in a short time period compared to
assumptions that simplify the model, the time spent performing the anal-
ysis is reduced. Since most systems are too complex to be modeled in exact
in a timely manner.
errors can result from several different factors including elements that
are too large, are improperly formed, and have unusual geometries. Simple
models representing the general shape of the complex geometry can indicate
to the engineer whether the model's basic design will have problems before
the more complex model is developed. The finite element model of the
20
4.1 MODELING OF COMPLIANT CONNECTIONS
system was modeled. This is referred to as the system model. The deflec-
tions resulting from a thermal analysis of this model were then inputted
into a model representing the compliant connection. Because the system has
system was modeled. The compliant connection did not have symmetrical
During the generation of the system model, it became apparent that the
model had too many elements for RADC's computer capabilities. To reduce
the large number of elements, the eight layers of microwire board were
into the system model. Only the top layer of the microwire board was
comparison was made between the deflections along the top surface of the
board for the board-alone model and for the system model. The results
showed that the differences in the deflections were negligible and, there-
dure was used. The figures given will represent the generation of the S-
21
lead system model. The S-lead package was a .45 x .55 inch package with 32
package and board and the S-lead was generated (Figure 12a). This model
was then extended in the third dimension (Figure 12b). Now a second two-
first set. This set represented the same configuration as the first set
and the nodes along the left side were taken from the original set of
elements (Figure 12c). This second set of elements was then extended in
the third dimension in the direction opposite to the first set of elements
the second set of elements was redefined to conform with the first set of
elements.
22
Figure 12: S-Lead System FEM Generation
23
The remaining package and board elements were generated (Figure 13),
thus completing the superelement model. Because there was a small number
of leads, the overall model was meshed so that the node points corresponded
to the location of the leads. The elements representing the air spaces in
between the leads were then deleted. The final finite element model is
shown in Figure 14. The proper boundary conditions and temperature condi-
tions were inputted into the data file and the analysis executed.
14
Figure 14: S-Lead System FEM
25
Since the l e a d l e s s chip c a r r i e r (LCC) was a l s o a .45 x .55 inch
model was generated u s i n g the same procedure as used f o r the S-lead system.
1
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-
27
Figure 17: Leadless System FEM
28
Due to t h e l a r g e package s i z e and t h e l a r g e number of l e a d s , t h e model
and 20.
N>
29
Figure 19: Gull-Wing System Supereleraent Model
30
Figure 20: Gull-Wing System FEM
31
4.1.2 BOARD MODEL
21). This model contained node points on its horizontal axis which corres-
ponded to the locations on the board where the leads connected to the
board. The dimensions of this model were the same as the largest package,
the gull-wing package. A thermal analysis of the board model was simulated
Y RX- 20
FEMs were generated for the S-lead, leadless solder joint and gull-
ing lead. The leaded models contained the lead and solder elements and
32
the solder joint model contained only solder elements. Each model has a
region representing the lead's contact with the edge of the package and a
region representing the lead's contact with the top surface of the board.
Deflections from the system models were inputted along these regions and a
static analysis simulated. The resulting stress values in the solder were
lead and the attached solder was created. Eight noded 2-D elements were
used in order to obtain the circular geometry, Figure 22a. This model was
then extended into the third dimension and 20 noded, 3-D elements were
generated, Figure 22b. This model was then meshed and the final model is
33
y
RX= eg
X R2= 0
34
The generation of the leadless solder joint was a more complex
representing the x-y, x-z and y-z planes were used as guides in the genera-
tion process, Figures 24, 25, and 26. This model represents a j o i n t used
tions and, therefore, the solder curves into the package. The segment
representing the solder base was simple to generate since the x-z plane i s
The base elements were meshed and then the f i l l e t nodes and elements were
35
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Figure 26: Solder Joint: Y-Z Plane
37
y RX= ea
I -~x RY= - 3 0
RZ= 0
38
The g u l l - w i n g model was a l s o simple t o g e n e r a t e . A 2-D model was
39
4.2 MODELING OF COMPLEX CIRCULAR GEOMETRIES
outlining the general shape of the system. Normally the different elements
triangular, etc. In the system that was analyzed, however, there were not
only quadralateral elements were used. Because these elements have corner
It was obvious that the creation of this model would be complex and
used. The first model created was a wire within a block (Figure 30). An
analysis was simulated and no problems occurred. This model was then
meshed in all three directions and elements were removed from the center
area (Figure 31). Once again, the simulation indicated no problems with
this basic design. From this model, it was obvious that only one quarter
of the system would need to be modeled for the ideal case where the wire
passed directly through the center of the hole. Generation of the actual
40
Figure 30: Wire Within A Block
41
Using the proper dimensions for the system, another 2-D superelement
model using eight noded elements was created (Figure 32a). This model was
meshed and a finer model generated (Figure 32b). This finer model was then
ated. This model was then meshed (Figure 32c) and the materials were
and the second represented the a i r elements within the PTH (Figure 32d).
along the cavity surface were reshaped into a c i r c u l a r hole (Figure 33).
any e x i s t i n g surfaces.
occurred. This was due to improper meshing by the preprocessor program and
the board so well that zero deflection could be considered along the top of
Once these elements were expanded, the location of the midside nodes had to
for the 20 mil via, PTH. This model was modified to represent a 10 mil via,
PTH. The 10 mil via FEM i s displayed in Figure 35. The second model was
42
(a) (b)
(e)
Figure 32: Microwire/PTH FEM Generation
43
\
Y RX= 20
X RY= 39
<Z RZ= 0
44
w*m^^' ;\ •<****
45
analyzed and the results were used to estimate a useful life of the micro-
The resulting deflections from the three system models showed that the lead
design had a negligible effect on the expansion of the package and the
Only a FEM of the package and a FEM of the board would be generated and two
separate analyses on the model performed. Since both the package and the
dual lead models. An assessment of the effect package size has on the
tion. The results showed that the board material away from the region of
concern had negligible stress and that the stresses in the region of
46
concern had l i t t l e variance between the two different models. This i n d i -
cates that a much simpler model representing only a small segment in the
would also be beneficial in the modeling of a wire that was off center
47
5.0 TRANSFER OF FINITE ELEMENT RESULTS
forms a finite element analysis and compares the resulting stresses to the
yield stresses for the different materials. What can be done when the load
is not static, but varies with time? The specific problem dealt with in
nique was needed to transfer the results of the FEA to a value of merit
The method used followed a simple procedure. First, a FEM was gener-
ated. Static analyses were simulated for the temperature change of stress
(low temperature cycle). The resulting maximum Von-Mises stress value for
the material of concern was obtained. In this study, the two materials of
concern were the ductile materials, copper and solder. The strain range
for this cyclic condition was calculated by adding the individual strains
for the low temperature and the high temperature cycles. These strains had
to include both the elastic strain and the plastic strain. Since the exact
analysis, a range for this strain was determined and it was assumed that
the actual plastic strain was in between these two values (see section 3.0
48
Once the strain range value was obtained, this value was plotted onto
failure for the particular temperature range that was used (minimum tem-
to failure were obtained for each analysis. One presented the low plastic
strain and the other the high plastic strain. The resulting range of the
of the component. This procedure will now be applied to the FEM developed
in section 4.0.
The high and low temperature cycle Von-Mises stress contours in the S-
lead connection are displayed in Figure 36. The overall maximum stress
does not occur in the solder material, but in the lead material. This
stress value is well below the yield point for the lead material. The
49
STRESS COtlTOURS
UdM-rirSES STRESS
VIEW : 1.67E"92
RANGE : 7.62E*03
S9S.S
429.4
14.99
Er«c-ms(VDrsPLAY
T RX- SB
R r - -3e
sLx
RZ- e
STRESS COtlTOURS
UON-MISES STRESS
VIEW ;• 4.67E>91
RBMGE : S.85E<-83
S20.9
f H 456.4
391.8
327.3
26E.8
198.2
4.668
EMRC-NISfVDISPLflY
Y RX- ae
J y RY- -38
50
High Temperature Cycle
The overall total strain for high and low temperature cycles for the
These overall strain values were plotted on the elastic plus plastic
line of the Coffin-Manson curve for solder (Figure 11) and the following
51
5.2 LEADLESS CONNECTION
ments. Figure 37 displays the high and low temperature cycle Von-Mises
stress contours for this analysis. The solder's maximum linear stress and
These values are both beyond solder's yield stress of 3,200 psi. The
52
mess commas
ISH-HISES STOESS
WEU : S.96E<«
Z.3««M
S.9H
QWC-MISIVDISPLAY
Y HX- 39
* ^ RZ- 8
UJN-MTSES STHESS
WEU : 7.77E<K
7.7ae»«
231.5
77. m
Er«c-rilS(vtiKPLfiY
L R f -38
The overall total strain for high and low temperature cycles for the
These overall strain values were plotted on the elastic plus plastic
line of the Coffin-Manson curve for solder (Figure 11) and the following
The high and low temperature cycle Von-Mises stress contours in the
gull-wing connection are displayed in Figure 38. Once again, the overall
maximum linear stress does not occur in the solder, but in the lead
material and this stress value is well below the yield point for this
54
STRESS cartTWjRS
UOfl-IIISES STRESS
VIEU : 3.s«»ee
RflMGE : 1.37E*64
_ - 136.7
HL 121.S
yi 196.3
••
_ 91.12
75.94
•
60.78
15.58
mprj
38. IB
15.21
^5'
3E-82
:r«c-riisfi''DrsPLPY
Y RX—168
STRESS CONTOURS
UOtl-rllSES STRESS
V1EU 7.7iE*ee
RAf«E 3.2SE»84
ip,j„.i ¥ 1 HF;' -
n
_ - 32S.2
289.1
ii 253.8
••
— 216.9
189.7
••
144.6
1E8.S
72.34
i * -^
36.21
8E-92
erac-msiVDrsPLflY
Y RX--168
x
(b) High Temperature Cycle
sX 2 R»Y"
z- ise
55
STIMULATION MAXIMJM LINEAR STRESS PLASTIC STRESS
Only the low temperature cycle value is beyond solder's yield stress
of 3,200 p s i . The elastic strain, the estimated plastic strain, and the
The overall total strain for high and low temperature cycles for the
gull-wing connection i s :
56
Method 1 .0025 + .0039 = .0064 in/in
for solder (Figure 11) and the following number of cycles to failure range
displays the Von-Mises Stress contours for the 20 mil via model and Figure
40 displays the contours for the 10 mil via model. The majority of the
board has very little stress with the high stresses occurring in the plated
copper and the copper microwire. The highest stresses occurred at the
plated barrel where the pad contacts the board. These values were not used
in this analysis because that area was not the area of reliability concern.
The maximum linear stress found in the copper wire/PTH interface is listed
57
STRESS CCMTEURS
I W I - t l l S E S STRESS
UICU i 1.816-66
BOHSE :• < t t c «
= .,,,,] < • . • ; * . • ? •
^__. «.63
18.33
6.198
et-ae
EJ-FC -MISa'D ISPLBY
|y RX- 2»
I X RY> 38
\Z RZ- 9
STUESS corrrouo
WM-ruses STRESS
UICU i 3.07C-4C
*nnsE ! 3 5BE-aa
*W- 37.83
3E-88
ETRC -rt KB-'O I3T.BY
RX- 2*
RY- 38
^ RZ- 8
58
srwcs* cawnws
UIEO I 1 . * « - «
WM6E : 4.USE-**
6C-W
2E-W
t- KZ- «
STRESS COITtMB
icn-mses STBESS
BAItSC s S.27E-81
SE-W
iiiis;::;.. SE-BS
grKC-nisn-'Dia'Lflr
k
UK- 2»
RT- 3»
RZ- «
met or exceeded this value, the elastic strain is the elastic stress
bel ow:
10 mil v i a i s :
60
METHOD OVERALL STRAIN
t h e r e f o r e , t h e r e was no p l a s t i c s t r a i n .
t h e 20 mil via i s :
61
METHOD OVERALL STRAIN
These overall strain values were plotted on the plastic plus elastic
Coffin-Manson curve for copper (Figure 11) and the following number of
62
6.0 CONCLUSIONS
Several Finite Element Analyses (FEA) were performed and the results
used to estimate the useful life of the various connections. For the
surface mounted lead connections, the results indicated that the leadless
problems occurred (less than 260 cycles). The S-lead and gull-wing leads,
however, showed very good survival rates. It was estimated that the S-lead
would survive between 11,500 and 60,000 thermal cycles and that the gull-
wing lead would survive between 600,000 and 2,000,000 thermal cycles. This
indicates that the two leaded designs will have superior reliability per-
formance.
Hole (PTH) connection indicate that, under ideal conditions, this connec-
tion will survive a minimum of 110,000 thermal cycles. These results must
analysis of nonideal configurations was not performed. There are two types
first type is where the wire does not pass straight through the PTH (180
the ideal condition. An analysis under these conditions would predict the
63
In addition to the reliability assessments, conclusions can be made
about the finite element modeling and how this process can be improved.
analyze this connection. This alternate model would have reduced the
the time needed to generate a model of the nonideal case where the
these values should have been. This indicates that instead of using
width of the leads (25 mils) were essentially constant. These results
indicated that the leads could have been modeled in two dimensions
64
4. A comparison of the FEA results for the three different
and board deflections for the three models. This occurrence implies
that the lead type has little effect on the package and board deflec-
could be generated and used for the analysis of many different lead
types.
reliability. There are several areas in this analysis, in both the finite
element modeling and the transfer of results, that deserve further inves-
of the material once it goes beyond the linear range. There is some
65
7.0 REFERENCES
1. Sandor, Bela I., "Fundamentals of Cyclic Stress and Strain", The University of
Wisconsin Press, 1972.
66
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