LITERATURE REVIEW

Minseok Ha, Samuel Graham, 2012, in this study conduct a thermal analysis of high
power LED packages implementing chip-on-board (COB) architecture combined with
power electronic substrate focusing on heat spreading effect. An analytical thermal
resistance model is presented for the LED array and validated by comparing it with
finite element analysis (FEA) results. In this study, the thermal resistance of high
power LEDs implementing COB architecture was analyzed by FEA and analytical
analysis. The thermal resistance of LED-array largely depends on the pitch, which is
the distance between two adjacent LED-chips, as well as other parameters that
mentioned previously. The design shows that LED-chips placed evenly on the heat
sink have the lowest thermal resistance and it increases gradually as the pitch
decreases The analytical solution derived in this study can provide simple and easy
way to find the response with respect to the change of each design parameter.

Heinle, C, Drummer D., 2010, shows in their work, adding thermally conductive
fillers to polymers the thermal conductivity can be raised significantly. Thermal
conductive polymers (TC-plastics) open up a vast range of options to set up
novel concepts of polymer technological system solutions in the area of
mechatronics. Heating experiment of cooling ribs show the potential in thermal
management of mechatronic parts with TC- polymers in comparison with widely used
reference materials copper and aluminum. The results demonstrate that especially for
certain thermal boundary conditions comparable performance between these two
material grades can be measured. The investigations have shown that, under specific
thermal boundary conditions, thermally conductive plastics have a high potential for
cooling mechatronic systems. In the area of low to average dissipated energy, if
linked to minor degrees of convective cooling, polymers’ cooling performance is
almost identical to that of metal materials (aluminum or copper). It is thus possible to
remove the energy usually dissipated by LEDs, i.e. approx. 0.5 to up to approx. 5
watts, by means of TC-polymer cooling elements. Additional potential may be
expected from using ceramic fillers. These materials’ heat conductivities are similar to
those of the TC- polymers presented; they are electrically insulating.

Chen Jie, at el, 2013 in this study, to solve the heat dissipation problem of LED
(light-emitting diode) down light, CFD thermal simulation software was used to

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establish LED down light dissipation model. Material’s thermal conductivity,
thermal resistance, thermal emissive values, heat load forms and other factors
were all taken in considered, and then numerical simulation combined with
laboratory measurement methods was used to analysis the lamp’s dissipation.
Based on this method, focused on the dissipation effect with different LED
quantities and LED ring distances, and then optimized light source layout of
current LED down light products. After experimental verification, LED working
temperatures were more ideal after the light source layout optimized, and it can
improve the LED lamp lifetime effectively, this result also has important practice
significance in the future LED down light design process.

LiuYi-bing, 2012, in this paper, using APDL language to generate the analysis file
the LED lamp heat sink of finite element model is established. The length, width and
numbers of the heat sink fins being design variables; the maximum junction
temperature of LED being the objective function, the mathematical model is set up
and optimized using ANSYS thermal analysis software. The results show that the
longer the length of heat sink fins, the lower the maximum junction temperature of the
chip; the wider the fins width, the higher the maximum chip junction temperature;
with the increasing of the numbers of fins, the maximum junction temperature will go
down; but when reaching a certain value, the junction temperature will slowly
increase again. Under the conditions of the LED chip junction temperature not
exceeding 60 ℃, the heat sink structure optimized values were: fin length is
62.5mm, fin width is1mm, the number of fins is 20. Using the ANSYS thermal
analysis software, this paper exhibits 60W LED illumination lamps and lanterns in
array distribution, carries on the thermal analysis and optimizes the heat sink structure.
The conclusion has been drawn as following: Heat sink fin length shows approximate
linear relationship with the maximum junction temperature, that is to say, the longer
the heat sink fins, the lower the maximum junction temperature. The heat sink wing
piece width assumes the approximate parabola relations with the maximum
junction temperature.

Zeng Dehuai, Liu Yuan, at el , 2012, based their work on heat removal in packaged
high-power light-emitting diode (LED) chips is critical to device performance and
reliability. Thermal performance of LEDs is important in that lowered junction

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temperatures extend the LED’s lifetime at a given photometric flux. Optionally,
lower thermal resistance can enable increased brightness operation without
exceeding the maximum allowable junction temperature for a given lifetime. The
goal of this study is to improve the thermal characteristics of high-power LED
package by using phase change heat sink. The heat-release characteristics of high-
power LED package are analyzed and a novel phase change heat sink with 3D
integral-fin boiling structures for high-power LED is developed. Two different fin
structures were obtained in grooves formed with chopping-ploughing-extrusion
compound forming technology and observed by scanning electron microscope
(SEM). By the excellent heat dissipating ability of phase change heat sink, the
junction temperature of LED with the phase change heat sink was lower than the one
with a copper rod. In order to reduce the thermal resistance, a novel high-power LED
package phase change heat sink is analyzed and 3D integral fin boiling
structures for high-power LED is developed. 3D integral fin on inside surface of
red copper tube with diameter of 30 mm and wall thickness of 2 mm is achieved by
chopping-ploughing-extrusion compound processing.

Jingsong Li, at el, 2011, review the thermal properties of graphene and multilayer
graphene, and discuss graphene’s applications in thermal management of advanced
electronics and optoelectronics. A special attention is paid to the use of the liquid-
phase-exfoliated graphene and multilayer graphene as the fillers in the thermal
interface materials. It has been demonstrated that addition of an optimized
mixture of graphene and multilayer graphene to the composites with different
matrix materials produces the record-high enhancement of the effective thermal
conductivity at the small filler loading fraction (f r 10 vol%). The thermal
conductivity enhancement due to the presence of graphene in the composites has been
observed for a range of matrix materials used by industry. The hybrid composites
where graphene is utilized together with metallic micro- and nanoparticles allow one
to tune both the thermal and electrical conductivity of these materials. Theoretical
considerations indicate that the graphene- based thermal interface materials can
outperform those with carbon nanotubes, metal nanoparticles and other fillers owing
graphene’s geometry, mechanical flexibility and lower Kapitza resistance at the
graphene–base material interface.

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Angie Fan1, Richard Bonner1, at el, 2012, In this paper describes a recent
development effort that integrates a planar thermosyphon into a printed circuit board
(PCB) for LED devices. The planar thermosyphon/PCB uses a dielectric fluid as the
heat pipe working fluid, achieving significantly improved heat spreading
performances over conventional PCBs. Analytical modeling showed a more than 50%
thermal resistance reduction from typical metal core PCBs. A low temperature
electroplating technique was also investigated to fabricate wick structures onto PCB
surfaces to enhance the boiling heat transfer performance of the dielectric fluids. Test
results showed that a boiling heat transfer coefficient of 20,000W/m2-K can be
achieved with the 3M Novec fluid. In this paper, the preliminary study on heat
transfer enhancement by using the PCB planar thermosyphon in single LED assembly
was reported. Future development efforts will verify the design in practical
applications, address manufacturing issues and improve the cost efficiency. The
feasibility of a novel PCB based planar thermosyphon concept for high power LED
cooling was demonstrated through numerical simulation and experimental study. This
PHS PCB was made of a FR-4 PCB lid and a copper chamber, and used a
dielectric working fluid. Although an initial permeation test showed the dielectric
fluid permeated through the PCB wall, standard copper cladding solved the PCB
permeation issue. Wick structures were applied to the evaporator of the
thermosyphon to achieve the desired boiling heat transfer performance.

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Xiang-you Lu, at el ,2011, improve the thermal characteristics of high power LED
(light-emitting diode) package using a flat heat pipe (FHP). The heat-release
characteristics of high power LED package are analyzed and a novel flat heat pipe (FHP)
cooling device for high power LED is developed. The thermal capabilities, including
startup performance, temperature uniformity and thermal resistance of high power LED
package with flat heat pipe heat sink have been investigated experimentally. The
obtained results indicate that the junction temperature of LED is about 52 1C for the
input power of 3 W, and correspondingly the total thermal resistance of LED system
is 8.8 K/W. The impact of the different filling rates and inclination angles of the heat
pipe to the heat transfer performance of the heat pipe should be evaluated before such a
structure of heat pipe cooling system is used to cool high power LED system. A novel flat
heat pipe cooling device for high power LED is developed and the heat-release
characteristics of high power LED package are analyzed. The thermal capabilities,
including startup performance, temperature uniformity and thermal resistance of high
power LED package with flat heat pipe heat sink, have been investigated
experimentally. The obtained results indicate that the junction temperature of LED is
about 52 1C for the input power of 3 W, and correspondingly the total thermal resistance
of LED system is 8.8 K/W. The impact of the different filling rates and inclination angles
of the heat pipe to the heat transfer performance of the heat pipe should be
evaluated before such a structure of heat pipe cooling system is used to cool high
power LED system.

Ugo Lafont.at el, 2012, in this review we will first briefly expose the state of the art on
inorganic semiconductor based LED research and development, trends and challenges
that lead to an increase of lighting efficiency. In a second part the different failure mode
occurring for SSL devices have been compiled highlighting what are the main
mechanism influencing and limiting LED reliability. Strong from this knowledge, in the
last part, self-healing concepts will be proposed to further improve LED’s reliability.
Led’s have a very bright future as they already offer a high en- ergy-light conversion
efficiency and a wide range of strategies to improve their properties well beyond their
current level. Despite the extensive efforts made to improve packaging and thermal
management, LEDs’ reliability in high power devices is still an issue that slows down the

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market penetration. The heat generated due to the presence of non-radiative charge
recombination at the die level is the main cause of LED failure resulting in the
decrease of luminous efficacy or in the worst case in the death of the device. Their
potential for multiple healing, the ease for processing and the availability of external
stimuli to trigger the healing are the clear advantages Reversible adhesion can also
be achieved by a ‘‘bricks and mortar’’ approach where a soft flowable thermo- plastic is
included in a hard thermoset. All these approaches are thermally triggered and the
thermal healing response can be tuned playing with the chemistry of the chosen system.
Thus it is virtually possible to create reversible adhesive that can be activated from
room temperature to 190 C. The implementation of conductive species in the thermally
induced reversible adhesives could al- low electrical triggering of the self-repairing
process.

Khan M.F. Shahil , Alexander A. Balandin 2012, review the thermal properties of
graphene and multilayer graphene, and discuss graphene’s applications in thermal
management of advanced electronics and optoelectronics. A special attention is paid to
the use of the liquid-phase-exfoliated graphene and multilayer graphene as the fillers
in the thermal interface materials. It has been demonstrated that addition of an
optimized mixture of graphene and multilayer graphene to the composites with
different matrix materials produces the record-high enhancement of the effective
thermal conductivity at the small filler loading fraction (f r 10 vol%). The thermal
conductivity enhancement due to the presence of graphene in the composites has been
observed for a range of matrix materials used by industry. The hybrid composites
where graphene is utilized together with metallic micro- and nanoparticles allow one to
tune both the thermal and electrical conductivity of these materials. Theoretical
considerations indicate that the graphene- based thermal interface materials can
outperform those with carbon nanotubes, metal nanoparticles and other fillers owing to
graphene’s geometry, mechanical flexibility and lower Kapitza resistance at the
graphene–base material interface.

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