S98736

Maintenance manuals

LENOVO

1
 Catalogue
1. Teardown guidance ....................................................................................................................... 3
2. The main board layout is introduced........................................................................................... 10
2.1 The mainboard positive figure .......................................................................................... 10
2.2 Main board on the back of the figure ................................................................................ 11
2.3 Motherboard, figure a PDF document............................................................................... 11
2.4 The main board schematic PDF document........................................................................ 11
3.Failure analysis flow chart ........................................................................................................... 12
3.1 Don't start up ..................................................................................................................... 12
3.2 Touch screen failure .......................................................................................................... 13
3.3 charge fault ........................................................................................................................ 14
3.4 The receiver malfunction .................................................................................................. 15
3.5 The horn fault .................................................................................................................... 16
3.6 LCD display failure ........................................................................................................... 17
3.7 The key fault ..................................................................................................................... 18
3.8 Mobile communication failures ........................................................................................ 19
3.9 MIC fault ........................................................................................................................... 20
3.10 Camera malfunction ........................................................................................................ 21
3.11 Vibration fault ................................................................................................................. 23
3.12 SIM card not to identify .................................................................................................. 24
3.13 SD card can't identify ...................................................................................................... 25
3.14 FM fault .......................................................................................................................... 26
3.15 Bluetooth/WLAN fault.................................................................................................... 27
4.Note .............................................................................................................................................. 28

2
1. Teardown guidance
Dismantling machine tools：Screwdriver（Cross）、tweezers、crowbar

3
a. Disassemble battery cover
According to the arrow remove the battery cove。

b. Disassemble battery
According to the battery clasp hands direction, remove the battery。

4
c. Motherboard screw down the
Unscrew the 10 screws (screw bit:cross) in the red circle according to the
following figure；Tamper label position 5、9。

d. Disassemble antenna bracket and speaker bracket

Disassemble the back bracket from the front shell,ensure don’t damage the
buttons on the front shell inside the red cycle。

5
e. Dismantle the speaker holder
Disassemble the speaker bracket from the front shell,ensure don’t damage
the speaker pins and the components on the main FPC and sub board。

f. Disassemble the connectors

Disassemble the side key FPC connector, TP FPC connector, main FPC, the rear
camera connector。

6
g. Disassemble the mainboard
Disassemble the mainboard from the front shell，due to the coaxial cable
connector and motor,pls pay attention to the separation of the mainboard。

h. Disassemble sub board

Disassemble the coaxial cable and sub FPC from the sub board ,and then remove
the sub board from the front shell with the tweezers, pay attention to the adhesive
paste on the back side of the sub board。

7
i. Dismantle the receiver, rubber mat and labels
Disassemble USB rubber 、host lable and the receiver from the front shell by
using tweezers。

j. Disassemble TP-LCM module

Mobile phone in the heating stage, the temperature: 90 ℃, time: 10 minutes,
and then placed in a fixture on the TP removal and LCM, pay attention to the LCM
FPC and TP FPC。

8
k. Pictures after disassemble

9
2. The main board layout is
introduced
2.1 The mainboard positive figure

10
2.2 Main board on the back of the figure

2.3 Motherboard, figure a PDF document

98736_1_13_201
701171125.pdf

2.4 The main board schematic PDF document

98736_1_13_201
701161704.pdf

11
3.Failure analysis flow chart
3.1 Don't start up

按开机键，用外部电源供电，观察其电流
变化

电流较小，开机电流在 电流正常， 开机电流在 上电或开机大电流，在

10mA以下 20mA左右. 100mA以上

检查19.2M晶振是否有正 检查VBAT链路或PMIC
输出链路是否有器件漏
常输出
电，观察电流变化，逐
一排除
No 检查PMIC供电输出,
VREG_S1_1P15,VREG_S2_1P15,VREG
_S3_1P15,VREG_S4_1P15
重焊或更换19.2M晶振；
No 重焊或更换PMIC

Ok
Ok

检测CPU焊接是否良好 No 重焊或者更换CPU

Ok

重新下载 No 重焊或者更换Flash

重焊或更换PMIC
Ok

Ok 结束

12
3.2 Touch screen failure

Touch screen bad

Check whether
Replace the touch
the touch screen NO
screen
is good

OK

Welding or replace
Check the touch
NO the touch screen
screen connector
connector

OK

Heavy welding or
Check the CPU NO
change the CPU

OK

END

13
3.3 charge fault

Can't charge

Check whether
Replace the
the charger has a NO
charger
5 v output

OK

Check whether Heavy welding

there is VBUS 5 NO or replace the
v charging port

OK

Check whether PMIC

the PMIC welding NO rewelding or
is good replaced

End

14
3.4 The receiver malfunction

Can't hear each other's voice

Check the receiver are in

No Replace the receiver
good condition

Ok
Check the phone contact to
Check whether the working ground impedance, to the
No
current is normal abnormal impedance signal
device in ruled out one by one
Ok

Check on the receiver signal

device for virtual welding or No Heavy welding these devices
welding

Ok

Check whether there is the

No Welding or replace the PMIC
receiver signal output

Ok

END

15
3.5 The horn fault

播放音乐没有声音

No
Ok

检查喇叭BOX、喇叭pad 清洗喇叭pad点及更换喇
NO
点 叭BOX

OK

检查喇叭触点对地阻
检查工作电流是否正常 No 抗，对阻抗异常信号的
器件进行逐一排除

Ok

检查喇叭链路上的器件
No 重焊或者更换这些器件
是否良好

Ok

检查PMIC输出的信号
No 重焊或者更换PMIC
VPH_PWR是否良好

Ok

检查CPU输出的信号
SPK_I2C_SCL\SPK_I2C_S No 重焊或者更换CPU
DA是否良好

结束

16
3.6 LCD display failure

LCD显示不良或者无显示

检查LCD接口的情况 No 重焊或者更换LCD接口

Ok

检查EMI filter的焊接情况 No 重焊或者更换EMI filter

Ok

检查LCD是否良好 No 更换LCD

Ok

重焊或者更换LCD输出
检查LCD信号的连通性 No 信号链路的器件；
重焊或者更换CPU
Ok

检查LCD供电输出 No 重焊或者更换PMIC

Ok

结束

17
3.7 The key fault

按键不良

检查按键PFC与连接器相互之间是否有断
路、短路、脏污等不良现象

Ok
No

检查对应的按键信号的连通性及输入 对链路电路故障进行排
No
信号是否正常 除

No
更换侧键FPC及连接器

重焊或者更换PMIC及
CPU

结束

18
3.8 Mobile communication failures

不能下载升级或者USB无功
能

No
Ok

检查USB接口焊接是否完
NO 重焊或者更换USB接口
好

OK

重焊或者更换链路器件
检查VBUS供电是否正常 No
及PMIC

Ok

检查DP,DM信号的连通性 No 重焊或者更换CPU

Ok

结束

19
3.9 MIC fault

Call the other party can't

hear his own voice

Ok

Check whether the working

No Replace the Main FPC
current is normal

OK

Check whether the MIC Heavy welding or

signal device on the link No replacement of these
welding is good devices

Ok

Check the MIC input signal PMIC rewelding or

No
is normal replaced

OK

Check whether the MIC PMIC rewelding or

No
input signal is high level replaced

Ok

Check whether MIC signal Heavy welding or

device on the link again No replacement of these
good welding devices

END

20
3.10 Camera malfunction

3.10.1 The main camera malfunction

The main camera

malfunction

Test the cameras are Replace the

NO
in good condition main camera

OK

Heavy welding
Check the camera
NO or replace the
connector
main camera

OK

Check the main

EMI rewelding
camera EMI are in NO
or replaced
good condition

Ok

Check whether the

PMIC rewelding
power supply is NO
or replaced
normal

OK

Heavy welding
Check the output
NO or change the
signal is normal
CPU

END

21
3.10.2 Before the camera malfunction

摄像头故障

测试摄像头是否
NO 更换摄像头
良好

OK

检查摄像头连接 重焊或者更换
NO
器 摄像头

OK

检查主摄像头 重焊或者更换
NO
EMI是否良好 摄像头EMI

ok

检查摄像头供电 重焊或者更换
NO
是否良好 PMIC

OK

检查CPU是否良 重焊或者更换
NO
好 CPU

结束

22
3.11 Vibration fault

振动不良

检查马达FPC的pad与主 重新安装或更换马达
NO
板pad是否接触良好 FPC、清洗主板pad

OK

检查马达器件是否良好 NO 更换马达

OK

检查马达供电是否良
NO 重焊及更换PMIC
好

结束

23
3.12 SIM card not to identify

不能识别SIM卡

检查SIM卡座连接器
的PIN脚是否正常，SIM卡 NO 重焊或者更换SIM卡座
焊接是否良好

OK

找出SIM信号链路上的
检查SIM卡外围电
NO 器件是否有空焊或者
路是否工作正常
不良，并排除故障

OK

检查VSIM电压
NO 重焊或者更换PMIC
是否正常

OK

检查SIM卡信号电 重焊或更换SIM信号链
NO
路是否工作正常 路上的不良器件及CPU

结束

24
3.13 SD card can't identify

不识别SD卡

检查SD卡座连接器
的PIN脚是否正常，SD卡 NO 重焊或者更换SD卡座
焊接是否良好

OK

找出SD信号链路上的
检查SD卡外围电
NO 器件是否有空焊或者
路是否工作正常
不良，并排除故障

OK

检查VSD电压
NO 重焊或者更换PMIC
是否正常

OK

检查SD卡信号电 重焊或更换SD信号链
NO
路是否工作正常 路上的不良器件及CPU

结束

25
3.14 FM fault

FM不良

FM无信号或者
耳机无音 NO 检查耳机座
信号不良

检查FM天线链路器
检测耳机是否插入
件是否良好，并排 NO 重新插入耳机
耳机接口中
除故障

OK OK

重焊或者更换 检查FM_ANT 器件 重焊或者更换

NO
U3605 焊接是否良好 不良器件

结束

26
3.15 Bluetooth/WLAN fault

Bluetooth
fault

Bluetooth Bluetooth is
can't open not connected

Check whether
U5001 Reassemble
the bluetooth
rewelding or NO the bluetooth
antenna is
replaced antenna
installed

OK

Check whether the Heavy welding

bluetooth antenna or replace
NO
device on the link the bad
is good device

END

27
4.Note
4.1 Replace the CPU machine
use MTK flash tool erase download software with signature, DA DA files
you need to use the signature, the DA files can be confirmed with tool
colleagues。

4.2 Replace the Flash machine

use MTK Flash tool erase downloaded signed software, need to select
the corresponding DA files and auth, these two files can be confirmed with
tool colleagues。

28