Gamma and Xray Detectors Rev1 200507 PDF

Detector User Manual
Gamma and X-ray

Detectors
PRINCETON GAMMA-TECH INSTRUMENTS, INC.
1026 Route 518 , Rocky Hill, NJ 08553 , Tel.: 609-924-7310 • Fax: 609-924-1729
http://www.pgt.com
PRINCETON GAMMA-TECH
Part No. 2061-0100

Rev. 1
Copyright © 2005 Princeton Gamma-Tech Instruments, Inc.
Reproduction or publication of the contents in any manner without the written permission of Princeton Gamma-Tech,
Inc. is prohibited.
Edited by Marie L. Kuszewski.
No liability with regard to improper operation of equipment or to the use of the information in this manual is assumed
by Princeton Gamma-Tech, Inc.
PGT Detector Systems User Manual
Table of Contents
Section 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
1.1.1 Available Detector Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
1.1.2 Choosing the Right Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
1.1.3 Special Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
Section 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.1 Cryostats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
2.2 Liquid Nitrogen Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
2.3 Instructions for Filling Dewars . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
2.3.1 Dipstick Cryostat Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
2.3.2 Elbow Dipstick Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
2.3.3 Unitary Cryostats (Bucket Dewars) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
2.3.4 MPS Cryostats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11
2.3.5 Gravity-Fed Portable Detectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12
2.4 Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
Section 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.1 Germanium Detectors with RG-11, RG-15 or 352 Preamplifiers . . . . . . . . . . . . 3-3
3.1.1 Needed Equipment and Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.1.2 Detector Cool-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.1.3 Cable Connections to the Preamplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3.2 Germanium Detectors with PO-12, PO-14 or TR-14 Preamplifiers . . . . . . . . . . 3-9
3.2.1 Needed Equipment and Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
3.2.2 Detector Cool-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
3.2.3 Cable Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
3.3 SpecificationMeasurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14
3.4 Manual Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15
i
User Manual PGT Detector Systems
Section 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1 Detector Theory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.1.1 Photon Interactions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
4.1.1.1 Photoelectric Effect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
4.1.1.2 Compton Scattering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
4.1.1.3 Pair Production . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.1.1.4 Linear Attenuation Coefficients. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
4.2 Spectral Performance Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
4.2.1 Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
4.2.2 Peak Shape and Energy Resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-9
4.2.3 Noise Contributions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10
4.2.4 Peak-to-Compton Ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10
4.2.5 Peak-to-Background Ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10
4.2.6 Timing Resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11
4.3 Other Detector Geometries . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12
4.3.1 Well Detectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12
4.3.2 Marinelli Beakers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-13
4.4 Other Factors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-13
4.4.1 Temperature Cyclability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-13
4.4.2 Window Thickness Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-15
4.4.3 Transmission/Absorption Nomogram . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-16
Section 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.1 Preamplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
5.1.1 Preamplifier Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
5.2 Preamplifier Layouts and Circuit Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12
5.2.1 Resistive Feedback Preamplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13
5.2.2 Replacement of Resistive Feedback Preamplifiers . . . . . . . . . . . . . . . . . 5-20
5.2.3 Replacement of In-Line Preamplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-21
5.2.4 Pulsed Optical Preamplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-23
5.2.5 Transistor Reset Preamplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-28
5.2.6 Replacement of PO and TR Preamplifiers . . . . . . . . . . . . . . . . . . . . . . . 5-36
ii
PGT Detector Systems User Manual
Section 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
6.1 Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
6.1.1 Liquid Nitrogen Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
6.1.2 Neutron Damage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
6.2 Fault Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5
6.2.1 Resistive Feedback Preamplifier Detectors . . . . . . . . . . . . . . . . . . . . . . . . 6-5
6.2.2 Pulsed Optical or Transistor Reset Detectors . . . . . . . . . . . . . . . . . . . . . . 6-9
Section 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1
7.1 HPGe Detector Warranty . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-3
7.2 Si(Li) Detector Warranty . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-4
7.3 Detector Repair Warranty . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-5
7.4 Packing Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-6
List of Tables
Table 1-1 PGT Gamma and X-ray Detectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4

Table 2-1 Dipstick Dewar/Cryostat Standard Configurations . . . . . . . . . . . . . . . . . . . 2-4
Table 2-2 Common Vacuum (Unitary) Cryostats . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
Table 2-3 Portable Unitary Cryostats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
Table 3-1 HV/Noise Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
Table 3-2 Standard Radioactive Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14
Table 3-3 Detector Resolution Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17
Table 4-1 Timing Resolution Figures for Germanium Detectors. . . . . . . . . . . . . . . . 4-11
Table 5-1 PGT Preamplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
Table 5-2 Maximum Energy Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6
Table 5-3 Resolution as a Function of Count Rate and Shaping Time . . . . . . . . . . . 5-8
Table 5-4 Effect of Count Rate on TR System Performance . . . . . . . . . . . . . . . . . . 5-11
Table 6-1 Troubleshooting Guide for 352, RG-11 and RG-15 Preamplifier Detectors 6-6
Table 6-2 Troubleshooting Guide for P O and TR Preamplifier Detectors . . . . . . . . . 6-9
iii
User Manual PGT Detector Systems
IMPORTANT
Please read the following information and the

accompanying safety precautions immediately
upon receipt of your detector.
Please notify your shipping/receiving personnel that all packaging must be thoroughly inspected before
signing any document presented by the delivery carrier. If damage is detected, notify the carrier and
PGT immediately. It is the customer’s responsibility to submit a claim; PGT will assist you in whatever
way it can. Take Polaroid pictures of damages to substantiate any claim that might be made by you or
on your behalf. Remember: examine carefully before you sign. This prudent procedure can save you
both time and bother.
Be sure to save the plastic protective endcap and packing box for use if the detector needs to be re-
turned to PGT Service at some future date. The boxes are custom fitted for the detector and are
expensive to replace.
CAUTION!!
THESE SYSTEMS INVOLVE THE USE OF HIGH VOLTAGES.
BE SURE YOUR SYSTEM IS PROPERLY GROUNDED AND
AVOID CONTACT WITH THE HIGH VOLTAGE CIRCUITS.
READ THE SAFETY PRECAUTIONS FOR HANDLING LIQUID

NITROGEN (page 7) BEFORE FILLING THE DEWAR.
CATASTROPHIC VACUUM FAILURE MAY LEAD TO OVER-

PRESSURIZATION AND BREAKAGE OF THE BERYLLIUM
WINDOW. BERYLLIUM IS EXTREMELY HAZARDOUS AND
MUST BE HANDLED WITH GREAT CARE. See page 14.
iv
Section 1
1
Introduction
Detector Options
Table 1-1: PGT Gamma and X-ray Detectors
Detector Energy Resolution Peak
Series Crystal Geometry Sizes
Crystal Range Shape
NIGC n-type high-purity P+

* 4 keV- 5.9 keV: 5-90% Peak:Compton
germanium N- type 10 Mev 675-1200 eV 30:1-90:1
HPGe 1.33 MeV:
Dead layer: coaxial 1.8-2.3 keV FWTM/FWHM
~0.3µm N+ 1.9-2.0
IGW p-type high purity 10 keV- 122 keV: 50-120 cm3

*
germanium 10 MeV 820-1300 eV
HPGe 1.33 MeV: Sample hole: FWTM/FWHM
Dead layer: coaxial well
P+
2.10-2.3 keV 10-14 mm diam. 1.9-2.0
0.5 mm external N+
40 mm depth
0.3 µm internal
IGC p-type high purity N+ * 40 keV- 122 keV: 5-100% Peak:Compton

germanium P- type 10 MeV 820-1200 eV 25:1-80:1
HPGe
1.33 MeV:
Dead layer: coaxial
P+ 1.8-2.3 keV FWTM/FWHM
~0.5 mm
1.9-2.0
NIGP n-type high purity * 3 keV- 5.9 keV: 200-3800 mm2

P+
germanium 1 MeV 200-470 eV
HPGe
semi-planar 122 keV: 15-35 mm thick FWTM/FWHM
Dead layer: N+ 505-650 eV <1.9
~0.3 µm
IGP p-type high-purity * 180 eV- 5.9 keV: 25-2000 mm2

P+
germanium HPGe 1 MeV 125-480 eV
N+ planar 122 keV:‘ 5-20 mm thick FWTM/FWHM
Dead layer:
480-750 eV <1.9
500 Å
Si(Li) Lithium-drifted P+ * 109 eV- 5.9 keV: 10-70 mm2

silicon lithium-drifted 60 keV 138-170 eV FWTM/FWHM
N+ silicon
planar 3.5 mm thick <1.9
Dead layer:
180 Å
* Incident Radiation p-type crystal

P+ layer (ion implantation or n-type crystal
metallization); thin
N+ layer (lithium diffusion); thick
Detector Type Window Options Preamp Options Preamp Types
High-purity germanium beryllium RG 11 resistive feedback External

aluminum RG 15 resistive feedback In-line
Vespel PO-14B pulsed optical
352 low power
TR 14 transistor reset
Lithium-drifted silicon beryllium PO-14B pulsed optical External

Omega In-line
ultrathin
windowless
1-2
PGT Detector Systems Detector Options
Princeton Gamma Tech high-purity germanium and lithium-drifted

silicon detectors for ionizing radiation are manufactured in a variety of
1.1: Introduction
configurations. These systems comprise a detecting crystal, FET,
preamplifier and amplifier, and high-voltage bias supply. The detector
and FET are maintained at liquid nitrogen temperature within a
cryostat/dewar system. Output is to a multi-channel analyzer (MCA) via
a spectroscopy amplifier.
The dewar serves as a reservoir of liquid nitrogen (LN2), while the

cryostat provides a path via the copper “cold finger” for heat transfer
from the detector element to the LN2 reservoir. Both dewar and cryostat
rely upon a vacuum to insulate cold inner parts from the room-
temperature outer surfaces. Vacuum feed-throughs in the cryostat
allow electrical connections to be made from the detector to the
preamplifier. Approximately 100 cc of a molecular sieve are normally
placed in contact with the cold finger to maintain a good vacuum
without active pumping. The molecular sieve is generally a pelletized
material with an extremely high surface-to-volume ratio which absorbs
great quantities of water vapor or other gas when cooled to LN2
temperature. The liquid nitrogen dewar can be replaced by the PGT
LAB COOLER where LN2 is unavailable or too costly. Other
mechanical coolers, such as stirling cycle engines, are available for
special applications.
1.1.1. Available Detector Types

Table 1-1 is a brief overview of the detector types available.
N-type Intrinsic Germanium Coaxial Detectors can measure
photons from below 10 keV to 10 MeV with high efficiency. They
are less sensitive to neutron damage than other coaxial detec-
tors because they operate with a negative bias. Electrons are the
main charge carriers, and these are not as easily trapped by the
damage centers as are holes.
P-type Intrinsic Germanium Coaxial Detectors have an energy
range of 40 keV to 10 MeV and are suitable for a wide variety of
applications, including portable systems. They have a long ser-
vice life and can be stored warm for extended periods.
P-type Intrinsic Germanium Coaxial Well Detectors, because
they surround the analyte, are useful in measuring low activity
radiation.
N-type Intrinsic Germanium Semiplanar Detectors offer lower
noise and, consequently, better resolution at low-to-moderate
energies than any other detector geometry. They are used in
lung monitor arrays.
1-3
Detector Options PGT Detector Systems
P-type Intrinsic Germanium Planar Detectors are rugged in

construction and can deliver clean spectra with high efficiency.
Their maximum efficiency in the lower energy ranges makes
them ideal for spectroscopy of transuranic materials and mixed
gamma and X-ray samples.
Lithium-drifted Silicon Planar Detectors are used mainly for X-
ray spectroscopy. Their efficiency for photons with energies
above 30 keV drops rapidly and is 1% at 100 keV.
1.1.2. Choosing the Right Detector

There are several factors to be considered in selecting a detector for a
particular application:
1.1.2.1. Energy Range

The effective range of the different types of detectors is shown in Table
1-1. For energies below about 20 keV, Si(Li) detectors are normally the
best choice. Planar detectors are preferable to N-type coaxial detectors
for energies up to 200 keV because of their better energy resolution
and lower sensitivity to high-energy background. They are also more
cost effective for this energy range.
1.1.2.2. Efficiency
The size of the detector should be optimal. A detector that is too big not
only wastes money, but may also create problems due to high count
rates. An undersized detector may be cheaper in price, but expensive
in time.
1.1.2.3. Energy Resolution

This parameter is particularly important if two neighboring lines must be
resolved. There is no value, however, in buying a super-high-resolution
detector if the rest of the electronic system cannot achieve the same
resolution. One common limitation is the number of channels per keV
available in the multichannel analyzer. For example, if only 4000 chan-
nels are available for a 2 MeV energy range (i.e., 2 channels per keV),
there will be virtually no noticeable difference between a 2.2 keV
FWHM detector and a 1.7 keV FWHM detector, which has a much high-
er cost.
1.1.2.4. Other Parameters

The Peak-to-Compton ratio is sometimes more important than the en-
ergy resolution or the efficiency. For lower energies, the peak-to-back-
ground ratio is a more important consideration because the Compton
effect is small compared with scattering and window and edge effects.
Other parameters, including detector area, window thickness, timing
resolution, microphonics, and geometric considerations, can all be im-
portant in selecting the optimal detector system. Possible exposure to
fast neutrons may warrant the use of an N-type detector.
1-4
PGT Detector Systems Detector Options
1.1.3. Special Options

There are several options available to deal with special requirements.
1.1.3.1. “Quiet Ones” Ultra-Low Microphonics

Microphonics refers to any noise caused by mechanical vibrations that
impacts spectral resolution. Within detector cryostats, noise can be in-
troduced by the mechanical vibration of internal components relative to
surfaces at different potentials. Such oscillations may be from the bub-
bling of liquid nitrogen, from the vibration of other equipment in contact
with the cryostat, or from environmental noise. A change of capacitance
between the FET gate and high voltage of only 5 ×10-7 picofarad is suf-
ficient to generate a microphonic signal equivalent to that of a 10 keV
X ray.
Microphonic deterioration of signals will appear on the MCA as a broad-

ened peak or, in severe cases, as a phantom peak or a double peak.
PGT has developed an ultra-low microphonics system, THE QUIET

ONES, with a Microphonic Rating (MR) of <0.1 at 90 db over the range
100 Hz-10 kHz. MR is a measure of the increase in noise level at the
detector end cap due to acoustic noise.
PGT QUIET ONES are available with P- and N-type germanium coaxial
detectors which use the RG-11B Preamplifier in any of the standard
PGT cryostat configurations. In this application, the preamplifier layout
is similar to that for in-line preamplifiers (see Fig. 5-6).They are of par-
ticular use for low-activity measurements, where well-defined peaks
are needed, for high resolution analysis of complex spectra with multi-
ple isotopes, for environmental analysis with portable or truck-installed
detectors, and for nuclear plants and other industrial sites where vibra-
tions from heavy machinery are a problem.
1.1.3.2. Low Background Systems

Low-activity gamma analysis is affected both by background radiation
and by activity from naturally occurring trace elements in the materials
used to manufacture the systems. Sources include trace thorium in the
cryostat molecular sieve and thorium, uranium, and potassium in the
preamplifier circuit boards and components. These problems are ad-
dressed by specially designed NPR low background detectors (see Ta-
ble 2-3) used in conjunction with a lead shielding chamber. Internal
tungsten shielding of the electronic components in the endcap is also
available. Additionally, PGT offers the following choices of materials:
oxygen-free high conductivity copper (OFHC) endcap; ultra-low back-
ground aluminum endcap; OFHC mounting cup, pedestal components,
and coldfinger; low background beryllium and Vespel plastic entrance
windows for N-type detectors; Vespel plastic well inserts; and activated
charcoal getter.
1-5
Detector Options PGT Detector Systems
1-6
Section 2
Cryostat Configurations 2
Safety Precautions
Liquid Nitrogen Fill Procedures
PGT Detector Systems Cryostats/Safety Precautions
2.1: Cryostats
The basic cryostat configurations are shown on the following pages,
Tables 2-1 through 2-3, and the preamplifiers are described in detail in
Section 5. PGT will manufacture a system for your particular needs.
The Data Sheet included with your detector system specifies the com-
ponents and their performance characteristics. Please keep this with
your records; it is needed during set-up of your system to verify opera-
tion and in case of problems in the future.
After you have identified your system components, go to page 2-7 for
safety precautions for handling liquid nitrogen and directions for filling
the dewar and cooling the system. Then proceed to the set-up instruc-
tions in Section 3 for your particular preamplifier.
2-3
Cryostats/Safety Precautions PGT Detector Systems
Table 2-1: Dipstick Dewar/Cryostat Standard Configurations
fill tube
overflow LN2 fill tube
Insulation &
molecular sieve
Standard Dewar Offset Dewar

(cut-away)
32 liter capacity
Vertical Dipstick (SD)
end Coaxial Germanium Endcap Planar Germanium Endcap

cap Si(Li) Endcap
diameter: 76 mm (3”) diameter: 51 mm (2”) diameter: 30 mm (1-1/8”)
length: 92 mm (3-5/8”) std. detector size: ≤100 mm2 length: 152 mm (6”)
preamp 203 mm (8”) crystal size: 12.5-50 mm2
diameter: 57 mm (2-1/4”)
detector size: 200-500 mm2
fill tube diameter: 51 mm (2”)
diameter: 67mm (2-5/8”) length: 102 mm (4”)
detector size: 1000 mm2 crystal size: 100 mm2
diameter: 81 mm (3-3/16”) 200 mm2
Standard Dewar detector size: 1500-2000 mm2
Coaxial In-line (SDIL) 90° Coaxial In-line (EDIL)
end
cap Coaxial Germanium Endcap
in-line end diameter: 74 mm (2-15/16”)
in-line preamp cap
pre- length: 114 mm (4-1/2”)
amp larger endcaps available for large crystals
fill tube
fill tube Standard Dewar
Standard Dewar
Elbow Dipstick (ED)
preamp Coaxial Ge Endcap Planar Ge Endcap Planar Si(Li) Endcap

diameter: 76 mm (3”) diameter: 57 mm (2-1/4”) diameter: 30 mm (1-1/8”)
endcap
length: 92 mm (3-5/8”) detector size: ≤100mm2 length 152 mm (6”)
203 mm (8”) 200-500 mm2 crystal size: 12.5 - 50 mm2
1000 mm2
diameter 51 mm (2”)
diameter: 76 mm (3”) length: 102 mm (4”)
fill tube detector size: 1500-2000 mm2 crystal size: 100 mm2
200 mm2
Standard Dewar
Anti-Compton Dipstick (ACD or ACD-DN)
preamp endcap Coaxial Ge endcap

diameter: 76 mm (3”)
length: 457 mm (18”) std. or as specified
fill tube
Standard or Offset Dewar
2-4
Table 2-2: Unitary Cryostats
Coaxial Downlooking (DT) and Horizontal (HT) Cryostats
Coaxial Ge Endcap Dewar volumes

7.5 liter (DT only)
length: 92 mm (3-5/8”) 15 liter
203 mm (8”) 30 liter
preamp
endcap
preamp
end
cap
Planar Down-looking (DT) and Horizontal (HT)Cryostats
Planar Ge Endcap Si(Li) Endcap Dewar volumes

diameter: 57 mm (2-1/4”) diameter: 30 mm (1-1/2”) 7.5 liter
detector size: ≤100 mm2 length: 152 mm (6”)
2
15 liter
200-500 mm2 crystal size: 10, 30, 60 mm 30 liter
preamp
detector size: 1000 mm2
For EDS systems:
endcap diameter: 76 mm (3”) diameter: 30 mm (1-1/2”)
detector size: 1500-2000 mm2 length: 280-356 mm
(11-14” or as specified)
crystal size: 10, 30, 60 mm2
preamp
endcap
Low Background Cryostat (NPR)
Coaxial Ge Endcap Planar Ge Endcap Dewar volumes

detector size: ≤100 mm2
diameter: 76 mm (3”) 15 liter
preamp end length: 203 mm (8”) 30 liter
cap diameter: 57 mm (2-1/4”)
detector size: 200-500 mm 2
detector size: 1000 mm2
406 mm (16”) std. diameter: 81 mm (3-3/16”)
or as specified detector size:1500-2000 mm2
Swivel Head Low Background (SNPR) or Cryoflex Cryostats
endcap
preamp Coaxial Ge Endcap Dewar volumes
diameter: 76 mm (3”) 15 liter
endcap length: 203 mm (8”) 30 liter
preamp
92 mm (3-5/8”) (Cryoflex only)
406 mm (16”) std.

or as specified 305 mm (23”) std.
or as specified
2-5
Table 2-3: Portable Unitary Cryostats
Multipurpose Portable (MPS) Portable Gravity-Fed (GF) Cryostats
Coaxial Ge Endcap Coaxial Ge Endcap

preamp* diameter: 74 mm (2-15/16”)
diameter: 76 mm (3”) preamp* length: 117 mm (4-5/8”)
length: 92 mm (3-7/8 “)
203 mm (8”) optional
endcap endcap
Planar Ge Endcap
diameter: 51 mm (2”) *in-line or standard preamp Dewar volumes
*in-line or standard preamp detector size: ≤100 mm2
1.5 liters
diameter: 57 mm (2-1/4”) 3 liters
detector size: 200-500 mm2 5 liters
diameter: 67 mm (2-5/8”) 7.5 liters
detector size: 1000 mm2 with 30-liter &
diameter: 81 mm (3-3/16”) 50-liter gravity feed dewar
detector size: 1500-2000 mm2
Dewar volumes
1.5 liters
3 liters
5 liters
7.5 liters
with 50-liter LN2 pressured fill dewar
In-Vivo Lung Monitor (DTIL)

preamp Semi-Planar Ge Endcap
diameter: 50.5 mm (2”)
length: 20 mm (0.8”)
endcap detector size: 2000 mm2
Dewar sizes:
variable, per customer specifications
2-6
2.2: Liquid
Nitrogen
Precautions
Liquid nitrogen (LN2) is safely used every day in laboratories and fac-
tories around the world. However, proper procedures must be followed
to prevent injury to person or damage to the detector system. Knowl-
edge of the hazards involved is a prerequisite to safety.
The use of LN2 poses three potential hazards: build-up of high pres-
sures, damage to materials due to the extremely low temperatures, and
personal injury. The compression ratio of nitrogen is 1:692. Therefore,
the expansion from liquid to gas can result in the build up of high pres-
sures as the LN2 warms up if the container does not have adequate
venting or pressure relief provisions. Some materials become brittle
and fracture when exposed to liquid-nitrogen temperatures (77°K). For
advice when selecting materials for use in storing and transferring LN2,
contact your liquid nitrogen supplier.
In addition to personal injury resulting from exposure to a high-pressure

gas, contact with liquid nitrogen may cause burns similar to those from
high-temperature contact. Eyes are especially vulnerable to this haz-
ard. Personnel should avoid wearing anything capable of trapping or
holding spilled LN2 close to the flesh. An impervious apron or coat, cuff-
less trousers, and high-topped shoes are recommended. Wear safety
glasses with side shields or, better yet, full-face protection. Remove all
watches, rings, bracelets, or other jewelry. Insulated gloves should be
used to handle containers or cold metal parts; they should be impervi-
ous and sufficiently large to be easily slipped off in case of a spill.
Although nitrogen gas is non-toxic, it can cause asphyxiation by dis-

placing air. TRANSFER LN2 ONLY IN A WELL-VENTILATED AREA!
Vent storage containers to an area with good air circulation or to the
outside to avoid build-up of nitrogen gas in the work area.
Piping or transfer lines should always be constructed so as to avoid

trapping LN2 in the line. Evaporation of the trapped liquid may result in
high pressures and even possible explosive rupture of the line. If it is
not possible to empty all lines, install safety relief valves and rupture
disks.
When ordering liquid nitrogen from your supplier, be sure to specify that
the dewar be pressurized only with dry nitrogen gas.
2-7
2.3: Instructions
for Filling It is absolutely necessary to prevent the electronics and the outside of
Dewars the cryostat from becoming excessively cold. Avoid spilling LN2 on
these components and vent cold gas away from the system being filled.
Although the detector may be filled with LN 2 while it is still strapped in
its shipping pallet, all insulating packing materials, especially foam,
must be removed first to prevent damage to the system. Damage can
also occur any time a cold detector is packed in thermally insulating
materials. Always keep such materials away from the detector. Follow
these instructions to prevent damage to vacuum seals or to system
electronics due to excessive chilling.
2.3.1. Dipstick Cryostat Models

These are described in Table 2-1: Dipstick Dewar/Cryostat Configura-
tions.
The dipstick enters the dewar through a white Teflon fill collar which is
both insulator and shock mount. The Teflon fill collar contains a stain-
less steel tube which is used for filling and gas venting. A Teflon tube
extends down into the dewar neck. In filling, the liquid nitrogen enters
through the extended steel tube and the opposite channel serves as an
exhaust vent. Fig. 2-1 shows a dipstick cryostat connected to a PGT au-
tomatic fill system.
Prepare for filling the dewar by connecting the supply hose to the fill
tube and an exhaust hose (optional) to the vent tube in the Teflon collar.
The exhaust hose should be approximately six (6) feet of plastic tubing
or flexible stainless steel which carries the cold gas and liquid overflow
away from the cryostat and electronics. The connection to the liquid ni-
trogen supply hose can be made by a short length of plastic tube, but a
flexible metal hose with a Swagelok fitting is preferable, since the cold
will eventually crack the plastic. The liquid nitrogen can be supplied un-
der pressure from a supply dewar that was correctly pressurized by the
LN2 vendor or from a supply dewar correctly pressurized by the user
from a dry nitrogen pressurization outlet. Recommended pressure is
10-15 psi. A metal funnel can also be used if the dewar can be gravity
fed.
2-8
fill collar
LN2 fill tube
overflow
Swagelok fitting
Overhead view
Standard Dewar
LN2 Source
Vent valve
Pressure build-up Halo ring
regulator
Pressure build-
up valve
Pressure gauge
Solenoid
power line Evacuation valve &
bursting disk
LN2 level gauge
Transfer line Hub

Solenoid LN2 withdrawal
and fill valve
Fig. 2-1 Filling a dipstick dewar or large bucket dewar with a fill collar, using the PGT Auto-Fill supply
dewar (above). The optional Kadel 92008 withdrawal device is shown below.
Hose barb
Pipe plug
Vent valve
Withdrawal valve
Pipe
plug
0-30# pressure valve

Clamp
Clamp knob 30 psi valve
10# relief valve 10 psi valve
2-9
2.3.1.1. Alternative Withdrawal Device

The Kadel 92008 Withdrawal device, also shown in Fig. 2-1, can also
be used to dispense LN2 from an appropriate container, such as the
Kadel Model No. KD31 LN2 bucket. The maximum operating pressure
is 30 psi with a recommended pressure of 10 psi. Typical operating pro-
cedures are the following:
Step 1. To fill/refill the dewar, open the vent valve to allow any
pressurized gas to escape. After venting and when the
pressure gauge reads zero (0), loosen the quick clamp
and remove the upper flange of the withdrawal device by
pulling it straight up out of the dewar. The fill hose from the
bulk tank may then be inserted through the opening in the
lower flange, and transfer may begin.
Step 2. When the dewar is full, remove the transfer hose and re-
place the upper flange and quick clamp. Close both the
withdrawal valve and the vent valve if they are not already
closed. Evaporating gases within the dewar will self-pres-
surize the vessel to a satisfactory working pressure deter-
mined by a relief valve (typically 10 psi). An external inert
gas source may be used to pressurize the vessel through
the vent valve, but caution should be exercised to main-
tain the internal pressure below that specified above.
Step 3. After pressurization, open the withdrawal valve to dis-

pense the liquid.
2.3.2. Elbow Dipstick Models

The ED is similar to the dipstick system shown in Fig. 2-1, but with the
cold finger bent away from the center of the dewar neck and the endcap
and electronics away from the dewar. A simple liquid nitrogen fill sys-
tem can be made using a funnel and a short length of plastic tubing at-
tached to the fill tube. Liquid nitrogen is then poured continuously into
the funnel until it overflows the exhaust tube line. Care must be exer-
cised not to spill LN2 on the cryostat, endcap, or electronics sections of
the detector system.
2.3.3. Unitary Cryostats (Bucket Dewars)

These are illustrated in Table 2-3: Common Vacuum (Unitary) Cry-
ostats.
Remove the dewar fill cap, insert a large metal funnel, and carefully
pour in the liquid nitrogen from the top. Take care that LN2 is not spilled
on the cryostat. If the cold liquid contacts a flange which contains a vac-
uum seal, it is possible that the seal may be breached. Use of the large
funnel will help avoid such damage.
2-10
2.3.4. MPS Cryostats

These portable models (Table 2-3: Portable Cryostats) can be filled ei-
ther manually or with a PGT pressurized filling system.
For manual filling, you need a special fill funnel, a small dewar or ther-
mos, and a rubber stopper. Follow this procedure:
Step 1. Screw the fill funnel onto the front fill hole.
Step 2. Fill the funnel with LN2.
Step 3. Place the rubber stopper (or other suitable stopper) over
the funnel so that the boiling of the liquid nitrogen pressur-
izes the funnel and forces the LN2 into the dewar.
CAUTION: pressurized LN2 may squirt on body or

clothing.
Step 4. When the funnel is empty, refill it with LN2.
Step 5. Repeat Steps 3 and 4 until the dewar is filled. It should

take about 10 funnels-full of LN2 and about 10 minutes to
fill the dewar.
Step 6. When the dewar is full, LN2 will start to shoot out of the
vent hole. At this point, stop filling. After waiting the rec-
ommended time for cooling the detector, refill the dewar to
top it off. Unscrew the fill funnel and operate the detector.
The steps in filling an MPS cryostat with a PGT liquid nitrogen filling
system or its equivalent are as follows:
Step 1. Place the MPS cryostat in a horizontal position, if possi-

ble.
Step 2. Screw the Swagelok fitting onto the front fill hole.* Use Te-
flon tape for a better seal.
Step 3. Connect the fill hose to the Swagelok fitting. Tighten light-
ly with a wrench.
Step 4. Fill the MPS cryostat until liquid nitrogen comes out of the
vent hole. NOTE: Keep the pressure under 20 psi.
When refilling the MPS cryostat, make sure to wait until

there is a solid flow of liquid nitrogen from the vent open-
ing. When the filling pressure is high, splashes of liquid ni-
trogen will be seen at the early stages of refilling. Do not

stop filling until you see a continuous flow of LN2 from the
vent opening.
Pressurized LN2 may squirt on body or clothing.
Step 5. Top off the MPS cryostat after a few hours of cooling. Re-
fill at smaller intervals than the specified holding time (16
hours for most cryostats).
*To fill an MPS cryostat in a vertical position (endcap up or down), use

the top hole for the fill and the lower hole for the vent.
2-11
Valve handle
Valve stem
LN2
Bayonet
Valve Knurled knob
preamp
endcap
Fig. 2-2 Gravity-fed portable detector with

“mother dewar.”
2.3.5. Gravity-Fed Portable Detectors

Gravity-fed portable dewars are connected to the “mother dewar” as
shown in Fig. 2-2.
Step 1. Unscrew the knurled knob on the back end of the detector
dewar and remove the plastic rod.
Step 2. Carefully insert the bayonet extending from the mother

dewar into the portable dewar and hand tighten the
knurled knob. Be sure to support the detector until the
knob is tight.
Step 3. Open the valve handle at the top of the mother dewar. To
verify that the pressure relief valve is operating and that
LN2 is flowing freely, open the brass plunger just below
the knurled knob for approximately 1 second. You will also
see water vapor at the top of the mother dewar where ni-
trogen gas is escaping.
2-12
Step 4. When the dewar is filled and the detector cooled, it can be
removed from the mother dewar. Close the valve handle
at the top of the mother dewar. Be sure to support the de-
tector while unscrewing the knob. Carefully lower the
detector. LN2 may splash from the full dewar! Replace
the plastic tube and tighten down the knob securely.
Generally the detector should remain on the mother dewar

until it is completely cooled down for the specified time.
This is always the case for first-time use. By storing the
detector this way, it will always be ready when needed.
Cooled detectors may be refilled or topped off and re-
moved as needed.
CAUTION: Incomplete Detector Cool Down
If cool-down is halted for any reason before the detector is completely

cold (see the label on the instrument for recommended cooling time),
or if it has begun to warm up for any reason, the detector must be al-
lowed to warm up completely to room temperature (i.e., fully cycled) be-
fore the cool down process is started again.
The reason for this lies in how warm-up occurs: The molecular sieve
material in the dewar and cold finger begins to outgas at the early stag-
es of warm-up. These impurities will condense on the crystal, which is
still cold. If the system is cooled down at that stage, these impurities on
the crystal will cause system performance to degrade significantly. By
allowing the system to warm up completely, the impurities will eventu-
ally volatilize off the crystal, and the system can then be recooled.
This applies also to mechanically cooled systems.
2-13
2.4: Safety
Precautions
Your detector system uses high voltage (up to 5000V) to bias the de-
tector element. The standard PGT bias supplies made for use with pho-
ton detectors are capable of delivering only very low current. Your de-
tector system, however, has a high voltage filter with capacitors capa-
High Voltage ble of delivering dangerously high current for a brief time while being
discharged (even if the bias supply has been disconnected). As a gen-
eral rule, you should never open the electronics shield or module boxes
except when following the explicit instructions of an authorized PGT
representative.
If your detector cryostat is equipped with a beryllium or Vespel window,

accidental rupture of the window will severely damage the system. Thin
Be and Vespel windows, such as those found on Si(Li) and intrinsic ger-
Beryllium Windows manium planar detectors, are especially fragile and can sometimes be
ruptured by just a light touch. The thicker Be windows used on N-type
germanium coaxial detectors are somewhat tougher, but still relatively
fragile. Avoid trouble by never allowing anything to touch a Be or
Vespel window.
If a Be window does rupture under normal circumstances, it will implode

and personnel will usually not be exposed to flying fragments and pos-
sible injury. Avoid subsequent injury by not handling any fragments of
beryllium with bare hands: Use tweezers, isolate the fragments, and
collect them with sticky tape. Store in a sealed container for proper dis-
posal. Beryllium is a highly toxic material.
If the cryostat develops a leak while cold and then warms up after the
molecular sieve has absorbed a large quantity of gas, significant inter-
nal pressure build-up is possible. A pressure-relieving device is incor-
Internal Pressure porated to prevent this. Nevertheless, if the cold cryostat shows evi-
dence of poor vacuum (e.g., an unusually cold cryostat or endcap,
Build-up moisture condensation or “sweating” or, in the extreme case, an out-
ward bulge to the end window on warm-up), place the original plastic
cover over the beryllium window. Cover any hole in the window with
tape and keep the detector cold. Disconnect the system from external
electronics. Do not warm up such a cryostat or take additional ac-
tion except on instruction from PGT.
Standard PGT well detector systems have an aluminum well in the end-
cap. Surrounded by the detector element, this well allows high efficien-
cy counting of a source which is placed inside it. To reduce attenuation
Well Detectors at lower energies, the aluminum well is relatively thin. Penetration of
this well would cause loss of vacuum, resulting in ice condensation on
the sensitive detector surfaces and electronic components. Therefore,
be careful not to insert sharp objects or force oversized samples into
the well. If reasonable care is exercised when placing samples in the
well, no problems should arise.
Spilling corrosive chemicals or solvents into the well must also be

avoided. To minimize the possibility of corrosion, the well should be
kept clean and dry at all times. It is recommended that a splash guard
assembly be used to minimize the risk of contaminating the well or end-
cap.
2-14
Section 3
3
System Set-up
Calibration
Voltmeter Oscilloscope
BIAS
Preamp TEST OUTPUT
(expanded)
VDC
1 preamp output
POWER 2 main amp output
1 2
TP Clipper
preamp preamp (see Fig. 3-2 on p. 3-6)
power output
output *T-connector locations

(SHV) amp
output
*
highvoltage *
to sensor
interlock input ribbon cable
in dewar
ADC
Multichannel Analyzer
... . .
ADC
PGT Model 326 Pulser
LN2 Level PGT Model 312, PGT Model
Controller 314 or 315 347 Amplifier
(optional) High Voltage
Power Supply
TP
RG15 or OUTPUT OUTPUT
352 in-line
Preamps
optional LED
BIAS TEST
POWER
Fig. 3-1 Test connections to the RG-11 or 352 preamplifier. The in-line RG-15 and 352 front
panel is illustrated below.
3-2
PGT Detector Systems Set Up/Calibration
3.1: Germanium
Detectors with
RG-11, RG-15
or 352
3.1.1. Needed Equipment and Precautions Preamplifiers
On receipt of the detector, examine the detector and the dewar care-
fully to determine if damage has occurred during shipment. If any dam-
age is observed, call the factory at once at (609) 924-7310, ext. 229.
Do not attempt to operate the unit.
If no damage is observed, continue to follow the operating instructions

after reading them through completely. The following equipment is
needed:
Nuclear Instruments Module (NIM) Bin
High voltage bias supply (PGT 315 or equivalent)
Main amplifier (PGT 347 or equivalent)
Multichannel analyzer (MCA)
Oscilloscope—at least 5 MHz with triggered sweep
Voltmeter—sensitivity of 30 kΩ/volt or higher
Complete cable set
IMPORTANT!!
Use a high voltage supply with maximum current of 1 mAmp be-
tween the output poles and between each pole and ground.
The low voltage supply for the preamplifiers should be separated

from the 220 V AC (or 110 V AC) supply line by a safety separation
transformer.
Applying bias to a warm detector will cause extensive damage to the

crystal and FET.
3.1.2. Detector Cool-down

Read “Instructions for Filling Dewars” on page 2-8. If an intrinsic
(hyperpure) germanium detector begins to warm up again, it must be
“temperature cycled”—allowed to warm up completely to room
temperature and then recooled. Allow for a warming time of at least 48
hours, before being recooled to LN2 temperature.
The cooling time, usually 8 hours, is printed on the label supplied with
the detector. This length of time must elapse between the initial contact
with LN2 and any application of the high voltage (HV). Overnight cool-
ing is recommended if time permits.
3-3
Set Up/Calibration PGT Detector Systems
3.1.3. Cable Connections to the Preamplifier

When the detector is cold, make the connections shown in Fig. 3-1.
First make sure that the high voltage supply is turned down com-
pletely to zero (0) and set to the correct polarity:
positive (+) IGC (P-type intrinsic germanium coaxial)
IGW (well detector)
negative (-) IGP (P-type intrinsic germanium semi-planar)
NIGC (N-type intrinsic germanium coaxial)
NIGP (N-type intrinsic germanium planar)
LS (lithium-drifted silicon planar)
Make certain, also, that the multiwire Amphenol connector for the
preamplifier power at the back of the main amplifier delivers the correct
voltages (see operator manual for the amplifier).
pin 1: ground pin 4: +12 V
pin 9: -12 V
pin 7: +24 V
pin 6: -24 V
3.1.3.1. Procedure
Remove all radioactive sources from near the detector. Then follow
these steps:
Step 1. Connect the 9-pin Amphenol power cable between the

preamplifier and the output at the back of the main ampli-
fier.
Step 2. Connect the output of the preamplifier (BNC to BNC) to

the input of the main amplifier. The input polarity of the
amplifier should be set as follows:
For IGP, NIGP, NIGC, LS : positive

For IGC, IGW : negative
Adjust the main amplifier settings:
Coarse gain : 100
Fine gain : 1
Shaping time : as recommended on spec
sheet
Pole zero : 1/2 way between min & max
Baseline restorer mode : Asym
Rate : Low or auto
Step 3. Connect the unipolar output of the main amplifier (BNC to

BNC) to an oscilloscope set at 2 msec/division, 500 mV/
division, DC coupled, and auto-trigger. At this point, the
output of the main amplifier should show a fairly uniform
white noise with a peak-to-peak amplitude of about 500-
1000 mV.
3-4
Step 4. Connect a high ohms/volt (>30 kΩ/V) voltmeter or multi-

meter between the Test Point (TP in Fig. 3-1, the small ny-
lon-rimmed jack in the lower right corner of the front panel
of the standard RG11 or 352 preamplifier) and ground or
between the two output BNCs on the in-line RG-15 or 352.
The ground side of the unused preamp BNC can be used.
Step 5. Again verify that the HV has been turned down completely
to 0 V and is at the correct polarity: (+) for IGC/IGW and
(-) for IGP/NIGC/NIGP/LS. Check the data sheet supplied
with the detector or the identification label on the cryostat.
WARNING!!
APPLYING SUDDEN REVERSE-POLARITY HIGH VOLTAGES TO
A DETECTOR CAN DESTROY THE FET INSIDE THE CRYOSTAT
AND POSSIBLY DAMAGE THE PREAMPLIFIER.
Connect the output of the HV unit (SHV to SHV) to the bias

input of the preamplifier. Turn on the high voltage.
Step 6. Turn the HV control to 100 V. When the TP voltage has re-
turned to a steady value, the peak-to-peak amplitude of
the noise on the oscilloscope should be considerably less
than before. Make a note of the TP voltage and the noise.
Step 7. Increase the HV in increments of 500 V until the recom-

mended operating voltage is reached (see data sheet or
identification plate). After each increment, note the final
steady TP voltage and the peak-to-peak noise value. It is
recommended that the oscilloscope gain (mV/ division) be
adjusted so that the noise covers between 1/2 and 1 divi-
sion (cm).
Step 8. The set of test points and noise values should be similar
to that shown in the following table, obtained for an IGC
whose recommended operating voltage is +3000V
Table 3-1: HV/Noise Values
SHV-> 0 100 500 1000 1500 2000 2500 3000

TP voltage -0.18 -0.2 -0.21 -0.21 -0.22 -0.22 -0.22 -0.22
Noise (mV) 500 250 100 60 40 20 15 15
Please note the following:
a) The TP value at the operating voltage should be within 0.5

V of the TP value seen at 100 V. The exact value for the
leakage current depends on the value of the feedback re-
sistor in the cryostat. In some planars, for example, a
3-5
change in Test Point value of 5 V should still indicate a

leakage current of <50 pA. The TP value should be that
shown on the Detector Specification Sheet.
b) The noise level usually reaches a minimum value (in the

preceding example, 15 mV) before the operating voltage
is reached. This value critically affects the resolution ob-
tained at low energies (5, 9, or 122 keV), but the exact re-
lationship between noise level and low energy resolution
depends upon the value of the feedback capacitor on the
cryostat. It is important, however, that the form of the
noise at the operating voltage be a uniform white noise.
Any discernible oscillation (particularly at 20 kHz) in the
noise output indicates a grounding problem, MCA noise,
HV oscillator noise, etc., which will cause deterioration in
the measured energy resolution later. In that case, con-
sult the appropriate Troubleshooting Section.
Clipper (Schottky clamp) circuit for adjusting P/Z:
to amplifier to scope
10 kΩ
IN914
white
noise
(A) (C)
(B)
undercompensated well-set P/Z: overcompensated
undershoot, sometimes long tail:
with overshoot: PGT 346/347 may have
small undershoot P/Z too far clockwise
P/Z too far counterclockwise
PGT 340 may have
small overshoot
Fig. 3-2 Main amplifier Pole Zero adjustment and related pulse shapes.
Step 9. Optimize the Pole Zero cancellation (P/Z) of the main am-
plifier by placing a ~10 µCi source, such as 60Co, some
10-30 cm in front of the detector. Observe the shape of
the resulting pulses on the oscilloscope after adjusting the
trigger status. Adjust the main amplifier Pole Zero poten-
tiometer so that the pulses return to the baseline in as
short a time as possible (see Fig. 3-2). The three pulse
shapes are interpreted as indicated.
3-6
(D) (D)
(E) (E)
(F) (F)
N-type Detectors
P-type Detectors
(D) correct
(E) undercompensated
P/Z too far counter clockwise
(F) overcompensated
P/Z too far clockwise
Fig. 3-3 Pulse shapes for the preamplifier P/Z adjustment.
Step 10. The Pole Zero of the preamplifier is normally preset be-
fore delivery. As a check, or when the preamplifier has
been changed for some reason, the P/Z can be adjusted
as follows:
Using the same source, activity, and distance as in Step

9, first set the main amplifier P/Z to give the best possible
shape. Then remove the source and set the DC level of
the preamplifier output to zero (0) using the oscilloscope
or voltmeter.
Check the preamp output on the scope at 0.5 msec/div, 10

mV/div with a 60Co source on the detector. If the reading
is not like (D) in Fig. 3-3, adjust or call PGT.
Adjust the DC level at 0 V slightly negative for IGC and

positive for IGP, NIGC, and IGP.
Step 11. You are now ready to measure the detector specifications
and determine resolution. Go to Section 3.3: on page 14.
3-7
Oscilloscope
BIAS OUTPUT
PO-12 TEST
PO-14 INHIBIT
TR-14 # 1 preamp output
POWER
2 main amp output
Preamps 1 2
(expanded)
preamp preamp
power output
output *T-connector locations

(SHV) amp
output
*
high voltage *
interlock input ribbon cable
to sensor
in dewar
ADC
Multichannel Analyzer
... . .
ADC
Pulser
PGT Model 326
LN2 Level PGT Model 312, PGT Model
314 or 315 347 Amplifier
Controller
(optional) High Voltage
Power Supply
# NOTE: The BNC connection
from the preamplifier inhibit is
either to the “preamp inhibit” at the back of the amp
or to the anticoincidence connection
at the front of the ADC unit.
PO and TR
in-line models
Output inhibit on PO and TR amps
optional LED
HV Test
Fig. 3-4 Connections for pulsed optical and transistor reset preamplifiers; in-line preamp
front panel is illustrated below.
3-8
3.2: Germanium
Detectors with
PO-12, PO-14
or TR-14
3.2.1. Needed Equipment and Precautions Preamplifiers
On receipt of the detector, examine the detector and the dewar care-
fully to determine if damage has occurred during shipment. If any dam-
age is observed, call the factory at once at (609) 924-7310. Do not at-
tempt to operate the unit.
If no damage is observed, continue to follow the operating instructions

after reading them through completely. The following equipment is
needed:
Nuclear Instruments Module (NIM) Bin
High voltage bias supply (PGT 315 or equivalent)
Main amplifier (PGT 347 or equivalent)
Multichannel analyzer (MCA)
Oscilloscope—at least 5 MHz with triggered sweep
Complete cable set
IMPORTANT!!
Use a high voltage supply with maximum current of 1 mAmp be-
tween the output poles and between each pole and ground.
The low voltage supply for the preamplifiers should be separated

from the 220 V AC (or 110 V AC) supply line by a safety separation
transformer.
Applying bias to a warm detector will cause extensive damage to the

crystal and FET.
3.2.2. Detector Cool-down

Read “Instructions for Filling Dewars” on page 2-8. If an intrinsic
(hyperpure) germanium detector begins to warm up again, it must be
“temperature cycled”—allowed to warm up completely to room
temperature and then recooled. Allow for a warming time of at least 48
hours, before being recooled to LN2 temperature.
The cooling time, usually 8 hours, is printed on the label supplied with
the detector. This length of time must elapse between the initial contact
with LN2 and any application of the high voltage (HV). Overnight cool-
ing is recommended if time permits.
3-9
3.2.3. Cable Connections

When the detector is cold, make the connections shown in Fig. 3-4.
First make sure that the high voltage supply is turned down com-
pletely to zero (0) and set to the correct polarity:
positive (+) IGC (P-type intrinsic germanium coaxial)
IGW (well detector)
negative (-) IGP (P-type intrinsic germanium semi-planar)
NIGC (N-type intrinsic germanium coaxial)
NIGP (N-type intrinsic germanium planar)
LS (lithium-drifted silicon planar)
Make certain, also, that the multiwire Amphenol connector for the
preamplifier power at the back of the main amplifier delivers the correct
voltages (see operator manual for the amplifier).
pin 1: ground pin 4: +12 V
pin 9: -12 V
pin 6: -24 V
pin 7: +24 V
3.2.3.1. Procedure
Remove all radioactive sources from near the detector. Then follow
these steps:
Step 1. Connect the 9-pin Amphenol power cable between the

preamplifier and the output at the back of the main ampli-
fier. PGT preamplifier power cable connections are com-
patible with PGT, Canberra, and Ortec amplifiers and with
those Tennelec amplifiers with a preamplifier power sock-
et marked “other” on their rear panels. In case of doubt,
never connect until compatibility has been verified. PGT
amplifier power cable connections are indicated in Fig. 3-4.
Step 2. Connect the preamplifier output to the input of the main

amplifier (BNC to BNC). Connect the bias cable to the HV
bias supply (SHV to SHV). Be certain that the bias voltage
is zero and the polarity is as shown above.
Step 3. Adjust the main amplifier settings:

Coarse gain : 100
Fine gain : 1
Shaping time : 6-12 µsec, as recommended
on spec sheet
Pole zero : fully counterclockwise (out)
Baseline restorer mode : Asym
Rate : Low or Auto
Analyzer ADC input : DC coupled
Output polarity/range : see analyzer manual
3-10
Step 4. Connect the unipolar output of the main amplifier (BNC to

BNC) to an oscilloscope set at 2 msec/division, 1V/divi-
sion, DC coupled, and auto-trigger.
Step 5. With the preamplifier power on but no detector bias, the

output of the preamplifier should be at -10 V and there
should be no noise.
Step 6. FOR NEGATIVE BIAS DETECTORS ONLY!! Apply a

small (50-100 V) negative bias to the detector. The output
of the preamplifier should now oscillate between approxi-
mately -2 V and +1.5 V for a PO-12B preamp or -3 V and
+3 V for PO-14B or TR-14B preamps in a “sawtooth”
waveform (fast fall and long rise corresponding to the DC
level increase and reset). The frequency of these oscilla-
tions is high when the bias is applied, but should decrease
to a few resets per second after less than one minute:
For NIGC, NIGP, IGP, LS
For IGC
initial within 1 minute
If the frequency of the oscillations is much more than 10

resets per second, or if there are no oscillations and the
DC level at the output of the preamplifier goes all the way
to about +10 V after several seconds, then the detector
has developed a high leakage current and should be re-
turned to PGT for repair.
If there are no oscillations, but the DC level is not approx-

imately +10 V, something else is wrong. Check the power
voltages to the preamplifier or look for an open circuit on
the HV line. Do not increase bias further until the problem
is traced and solved.
Step 7. Raise the detector bias in steps of 100 V, observing the

output of the preamplifier with the oscilloscope. When the
operating bias has been reached, the frequency of the re-
sets should slowly settle to a few per second (see the De-
tector Specification Sheet).
Step 8. Connect the output of the preamplifier to the input of the

main amplifier and observe the unipolar output of the main
amplifier with the oscilloscope. Use a long (approximately
6-10 µsec) shaping time constant. The pole zero (P/Z) ad-
justing potentiometer should be turned all the way out
(usually counterclockwise). Input polarity should be posi-
tive for NIGC, NIGP, IGP, and LS and negative for IGC.
The noise at the output of the main amplifier should be
3-11
2 0.1 0.2 0.3 millisec 2 0.1 0.2 0.3 millisec 0.1 0.2 0.3 millisec
2
volts volts volts

2 2 2
4 4 4
6 6 6
8 8 8
10 10 10
12 12 12
Long overshoot: Short over- or Properly

undershoot: adjusted
P/Z not fully
counterclockwise Adjust LED current
potentiometer
in preamp
Fig. 3-5 Optical reset pulses at main amplifier output.
free of oscillations and other irregularities. The fast fall

segments of the sawtooth waveform at the output of the
preamplifier should show up as large (10 V amplitude)
negative signals at the output of the main amplifier. These
pulses (referred to as “reset pulses”) should be about 0.5
msec wide and the base line should recover completely
after about 0.2 msec. (see Fig. 3-5). Long “after effects” of
these negative pulses usually indicate improper setting of
the P/Z adjustment or poor base line restoration perfor-
0.1 0.2 0.3 millisec mance of the main amplifier. In this case, another amplifi-
er, such as the PGT 347, should be used.
4 inhibit signal
5V Step 9. Measure the frequency of the reset pulses at the output of
2 the main amplifier. It should be equal to or slower than the
volts
value shown on the Detector Data Sheet. Higher frequen-
cy indicates high leakage current, and the spectrometer
2
may have to be returned for repair. This measurement
4 should be performed with no source near the detector and
reset signal after the detector has been under bias for at least 15 min-
6
utes. A very unstable rate of reset pulses usually indicates
8
an unstable HV bias supply.
10
Step 10. Check the inhibit signal duration (Fig. 3-6). It is set at the
12
factory for the amplifier shaping time constant indicated
on the Data Sheet, but may need to be readjusted if an-
Fig. 3-6 Inhibit signal.
other time constant is used.
3-12
Step 11. The spectrometer is now ready for a resolution test. Con-
nect the inhibit output of the preamplifier to the anticoinci- CAREFUL!!
dence input of the MCA or to the “preamp reset” input of
the amplifier. Remove the endcap plastic cover and place THE BERYLLIUM OR VESPEL
an appropriate radioactive source in front of the detector. WINDOW IN FRONT OF THE
DETECTOR IS EXTREMELY
THIN AND SHOULD NEVER
BE TOUCHED!
Note: When operating near or above 100 keV, it is recom-
mended that the gain of the preamplifier be decreased so
as to reduce by half the number of reset pulses. It might,
however, cause a slight deterioration in energy resolution
at low gain energies, depending on the main amplifier
used. Gain can be lowered for the PO-14B and TR-14B
systems by “jumpering” R 18 (voltage divider). See the ap-
propriate preamplifier layout in Section 5.
Measure the resolution as described in the following sec-

tions.
3-13
3.3: Specification
For planar detectors (IGP), the specifications are usually the resolu-
Measurements tions at 5.9 keV (55 Fe) or 6.4 keV (57Co) and 122 keV (57Co). For co-
axial detectors (IGC, NIGC), the specifications normally include the
resolutions at 122 keV (57Co) and 1332 keV (60Co).
It is recommended that the detector first be optimized as described in

the preceding sections and the gain of the main amplifier adjusted so
that the calibration of the multichannel analyzer is as follows:
For measurement at 6 keV: 5-20 eV/ch
122 keV: 60 eV/ch
1332 keV: 150-200 eV/ch
In general, the Full Width at Half Maximum (FWHM) should be at least

10 channels and, for statistical accuracy, there should be at least 3000
counts in the central channel of the peak whose resolution is to be mea-
sured.
The main amplifier P/Z adjustment and resolution measurement should

be made at the main amplifier shaping time indicated in the Specifica-
tion Data Sheet.
If there is some difficulty in attaining the specified resolutions when the

Test Point voltage and noise level seem normal, it is suggested that the
resolution measurements be tried at an operating voltage 100-200 V
higher or lower than that recommended. Another possibility is to adjust
the main amplifier shaping time by 1-2 µs lower or higher than that
shown on the Specification Data Sheet, remembering to adjust the
main amp P/Z each time.
Table 3-2 lists the standard radioactive sources for testing the perfor-
mance of germanium detectors:
Table 3-2: Standard Radioactive Sources
Isotope Half Life γ ray Energy (keV)

55
Fe 2.7 years 5.9 *
241
Am 433 years 59.5*, 26.3*, X rays
109
Cd 453 days 22.1* X-ray doublet, 88.0*
153
Gd 242 days 97.5*, 41.5, 40.9
152
Eu 12.7 years 121.8*, 344.3, 40.1, 39.5
57
Co 270 days 122.1*, 136.5
137
Cs 30.1 years 661.6 *
22
Na 2.60 years 1274.5*
60
Co 5.24 years 1173.2, 1332.5*†
208
Tl (1.91 years) 2614.5* (228Th source)
*γ and X rays recommended for energy resolution measurements.

†This line is preferred for coaxial detector specifications.
3-14
3.4: Manual
Calibration
In calibrating the detector manually, it is necessary to estimate the Full
Width at Half Maximum (FWHM). Spectrum collection should continue
for 5—10 minutes until at least 3000 counts have accumulated in the
channel corresponding to the center of the peak in order to avoid errors
associated with the counting statistics. Refer to your analyzer manual
for autocalibration of your system. The following is a schematic descrip-
tion for manually calibrating the detector.
∆E
P = peak count E1
P FWHM
= half maximum
2
count
E2
Channels
C1 ∆C C2
∆E E2 - E1
Calibration: = eV/ch
∆C C2 - C1
Fig. 3-7 Energy calibration schematic.
Fig. 3-7 is a schematic diagram of a spectrum showing the maximum

peak count P for the channel C1, corresponding to energy E1, at the cen-
ter of the peak. P/2 is the midpoint between the baseline and the maxi-
mum in that channel, and FWHM is the peak width at P/2. The FWHM is
usually not an exact integral number of channels. However, as shown
in the following diagram, the peak width can be estimated by a linear
interpolation of the counts in the channels immediately above and be-
low the endpoints of the FWHM line.
3-15
P = peak count
δ1= A-H
A C A-B
FWHM H = P/2
δ2= C - H
C-D
B
D
δ1 δ2
(X1 -1) X1 X2 (X2+1) Channels
FWHM = (X2 - X1 + δ1 + δ2)

channels
Fig. 3-8 Determination of FWHM by linear interpolation.
As seen in Fig. 3-8, the FWHM is the number of channels from channel
X1 to channel X2 plus two partial channels δ1 and δ2 as determined by
proportionality.
Multiply the FWHM by the energy calibration (in eV/ch or keV/ch) to de-
termine the resolution of the detector for the appropriate energy. Com-
pare this value with that shown on the Data sheet supplied with the de-
tector.
For example, if P = 3600, H = 1800; the counts measured in the chan-

nels around the endpoints of the FWHM line are
channel X1 A = 2000 channel X 1-1 B = 1000
channel X2 C = 2300 channel X 2+1 D = 800
2000 – 1800
Then, δ 1 = ------------------------------ = 0.2
2000 – 1000
2300 – 1800
and δ 2 = ------------------------------ = 0.33
2300 – 800
∴FWHM = X 2 – X 1 + δ 1 + δ 2 = 6.53channels
The Full Width at Tenth Maximum (FWTM) can be estimated in a sim-

ilar way by using one-tenth of the peak height (P/10) instead of P/2 in
the above calculation.
3-16
It should be noted that most peaks are Gaussian curves, and the use
of simple linear interpolation will produce an estimate for the FWHM
which can be significantly greater than the true value, especially when
the peak contains a very small number of channels. Similarly, if the cen-
ter of the peak lies between two channels, then the maximum count P
can be significantly smaller than the true peak height, leading to a slight
over-estimation of the FWHM. In general, to avoid such errors use the
calibrations listed in the following table.
Table 3-3: Detector Resolution Parameters
Approx. (eV/ch)
Peak Energy Position of Peak in
Detector Source Needed to Measure
keV MCA (channel no.)
Resolution
55
Si(Li) Fe 5.9 ~1000 6
small planar
55
large planar Fe 5.9 ~400 15(a)
N-type coaxial
57
planar, Co 122 ~2500 50
coaxial
60
large planar, Co 1332 ~7500(b) 200
coaxial
(a)
With large planars and N-type coaxial detectors, the two peaks (5.9 and 6.4 keV) are not re-
solved. It is possible to measure the energy calibration using the 6.4 and 14.4 keV peaks from a
57
Co source, measured separately.
(b)
For multichannel analyzers with only 4K channel display, it is usually possible to use an 8K
ADC conversion gain, together with a 4K digital offset, to obtain the necessary calibration for
60
Co. Analyzers with less than 4K channels are not recommended.
Measurement of detector characteristics is discussed in more detail in

Section 4.
3-17
3-18
Section 4
Detector Theory
4
Parameters
PGT Detector Systems Detector Parameters
4.1: Detector
Theory
High-purity germanium and lithium-drifted silicon (Si(Li)) crystals can P+

be fabricated into diodes capable of withstanding high reverse-bias N+
voltage with low current (<0.1 nAmp) at cryogenic temperatures for use
in detection and high-resolution spectroscopy of gamma and X rays.
The detectors can be brought to room temperature and then re-cooled Ge or Si(Li) Planar
without degradation (i.e., they are temperature cyclable). High-purity
(intrinsic) germanium has a nonzero concentration of residual impuri-
ties; depletion starts at one contact and extends to the other only after P+
a sufficient voltage has been applied. The operating voltage must ex-
ceed this depletion voltage for full spectrometer efficiency.
N+
PGT Germanium (planar and some coaxial, such as IGC and IGW) and
Si(Li) Detectors are made from p-type material with a lithium-diffusion Ge Semi-Planar (NIGP)
N+ contact layer, typically 0.5 mm thick, and a thin P+ contact created
by ion implant or metallization. Germanium, with its higher atomic num-
ber and larger photon absorption cross-section, is suited to the detec-
tion of higher energy photons, but remains useful at energies as low as
3 keV. Silicon detectors are useful for incident energies as low as 1 keV
P+
(180 eV in the windowless mode) and have less background attribut- N+
able to higher energy photon scattering and to escape peaks.
Ge Coaxial Well (IGW)
N-type detectors (such as NIGC and NIGP) are made of n-type material
with an implanted outer P+ contact layer, typically 0.3 µm thick, and a
diffused center contact. These are sometimes referred to as “reverse P+
electrode” detectors.
The basic crystal geometries are shown at the right.

N+
When a photon interacts with the detector crystal, an induced current
pulse results, which is integrated by a charge-sensitive preamplifier to Ge Coaxial (NIGC)
produce a voltage pulse with height proportional to the incident photon
energy. In practice, not all pulses produced by a mono-energetic gam- N+
ma source will have the same amplitude. A line-broadening occurs due
to statistical fluctuations and electronic noise. Also, some of the elec-
tron-hole pairs are trapped and do not reach the detector contacts, thus
producing smaller signals which cause “tailing” on the low energy side P+
of the peak. Additionally, many of the interacting gamma rays are not P-type Ge Coaxial (IGC)
completely absorbed in the detector, but are inelastically scattered and
escape. This type of interaction yields a low energy Compton back- Incident Radiation
ground. Finally, some gamma rays reach the detector only after having P+ layer (ion implantation
been scattered by some material surrounding the detector or by the or metallization); thin
“dead” layer in the detector itself. These rays will also yield smaller N+ layer (lithium
diffusion); thick
pulses. p-type crystal
n-type crystal
4-3
Detector Parameters PGT Detector Systems
4.1.1. Photon Interactions

There are three primary processes in which incident photons give up
all or part of their energy in single events: the photoelectric effect,
Compton scattering, and pair production.
4.1.1.1. Photoelectric Effect

In a photoelectric event, the entire photon energy is absorbed by a
bound atomic electron which is ejected with a kinetic energy equal to
the photon energy less the binding energy of the electron. The cross-
section for the process increases with atomic number (~Z4 to Z5) and
decreases rapidly with increasing photon energy (~E-3). The residual
ion may emit an X ray or Auger electron. The low-energy X ray is almost
invariably absorbed in a second photoelectric event before it can es-
cape from the crystal. As a result, the total photon energy appears as
electron kinetic energy. Thus, a monoenergetic gamma ray gives rise
to a monoenergetic peak in the charge distribution corresponding to the
incident photon energy.
4.1.1.2. Compton Scattering

In this process, the photon is scattered by an electron with a partial en-
ergy loss which is dependent upon the angle of scattering. The kinetic
energy imparted to the electron is between zero and an upper value re-
lated to the energy of the photon. Between these limits, the scattering
results in a continuous electron energy distribution, the Compton con-
tinuum. The cross-section for this process is proportional to the atomic
number of the scattering material and somewhat less energy-depen-
dent than the photoelectric effect.
Compton effect:
E’
E
E θ E ′ = ------------------------------------------------------
1 + E ( 1 – cos θ ) ⁄ 511
E
T CE = -------------------------------
1 + 511 ⁄ 2E
E = energy of incident photon (keV)

E’ = energy of scattered photon (keV)
T= kinetic energy of the scattered electron
θ = scattering angle
CE = Compton edge, T when θ = 180°
The maximum energy in the Compton continuum is called the Compton

Edge (CE). It is the maximum energy imparted to the scattered electron
and occurs when the scattering angle is 180°. Events in which the CE
energy is exceeded are normally photoelectric events.
4-4
4.1.1.3. Pair Production

Unlike the photoelectric effect and Compton scattering, which are pos-
sible at all energies, pair production has an energetic threshold equal
to the combined positron-electron rest mass (1.022 MeV). Above this
threshold, the cross-section for the event increases rapidly with Z 2 of
the absorbing material up to a point, beyond which it decreases be-
cause of screening effects. The entire photon energy (E) is converted
to the kinetic energy of the positron-electron pair (i.e., E - 1.022 MeV)
plus the rest mass of the pair. The positron is annihilated by an atomic
electron, producing two 0.511 MeV photons emitted at 180° to each
other, of which none, one, or both may escape. The spectral distribu-
tion, then, includes a full energy peak (FEP), a single escape peak
(SEP), and a double escape peak (DEP).
The relative importance of these three processes in germanium and sil-

icon with respect to energy of the incident photon is shown in Fig. 4-1
10
PE
Linear absorbance coefficients (cm4)
PE = photoelectric effect
C = Compton scattering
1 PP = pair production
10-1 Germanium
Silicon
PP
10-2
10-3
10-2 10-1 1 10 102
Energy (MeV)
Fig. 4-1 Linear absorption coefficients for Ge and

Si as a function of gamma ray energy.
In all these absorption processes, one or more energetic electrons re-

sult, and these in turn lose their energy largely through Coulomb inter-
actions along the path of the electron in the absorber material. The prin-
cipal effect of gamma ray interaction with matter is thus ionization. In
semiconductor materials this is shown by the creation of a large number
of electron-hole pairs, in direct proportion to the energy of the incident
photon. The average energy necessary to create such an electron-hole
pair is 3.0 eV in germanium and 3.76 eV in silicon at 77°K and 3.6 eV
in silicon at room temperature.
4-5
Fig. 4-2 shows the pulse height spectral distribution for monoenergetic
gamma rays incident on a large coaxial germanium crystal, with the
contributions of the various events labelled. The full energy peak is the
sum of photoelectric events, totally absorbed multiply scattered Comp-
ton events, and totally absorbed pair events.
104 FEP (E0)

θ - Compton scattering angle
FEP - full energy peak

SEP - single escape peak 180° scatter
= FEP - 511 keV from inactive material
DEP - double escape peak 103
DEP
= FEP - 1022 keV θ = 180°
SEP
Counts
102
θ < 90° from active volume θ > 90° from active volume
θ > 90° from inactive volume θ < 90° from inactive volume
0 500 1000
Eγ (keV)
Fig. 4-2 Spectral distribution of a monoenergetic gamma ray (1.4 MeV)
incident on coaxial germanium.
4.1.1.4. Linear Attenuation Coefficients

See the end of this chapter for graphs of the linear attenuation coeffi-
cients of silicon, beryllium, and germanium as a function of energy.
There is also a nomogram on page 4-16 for determining the transmis-
sion/absorption of gamma rays for a given linear attenuation coefficient
and crystal thickness.
4.2: Spectral
Performance
Parameters
The most important parameters characterizing a radiation detector are
efficiency, energy resolution, and peak-to-Compton ratio. The following
discussion of these items is based on the ANSI/IEEE Standards 645-
1977 and 325-1986. Please consult also ANSI Standard N42.14-1978
and the ANSI/IEEE Standards 680-1978, 300-1982, 759-1984B, 1131-
1987, 301-1988, and their updates, as well as any other ANSI/IEEE
standards which may relate to your applications. NIST Standard Refer-
ence Material (SRM) Standards and US Regulatory Guides for fluores-
cence applications also contain valuable information.
4-6
4.2.1. Efficiency
The counting efficiency of a detector is a function of the active volume
and shape (geometry) of the detector crystal, the source/detector ge-
ometry, and interactions in the materials in the immediate vicinity of the
detector. The tests described in ANSI/IEEE 325-1986 call for a spectral
peak at least 6 channels wide at half-maximum, with the total number
of counts within the FWHM of at least 50,000.
4.2.1.1. Absolute Counting Efficiency

To determine the absolute counting efficiency (Ea), a spectrum is ob-
tained with a calibrated 60Co source (usually a few µCi). The center of
the source is placed 25.0 cm from the center of the front of the endcap.
The net number of counts (A) in the full energy peak at 1332.5 keV is
determined by integration and background subtraction. The absolute
counting efficiency is then given as
Ea = A ⁄ Ns
where Ns is the total number of such photons emitted by the source dur-
ing the live counting time.
4.2.1.2. Relative Counting Efficiency

The efficiency (Erel) of a coaxial, well, or large planar germanium detec-
tor relative to that of a 3×3 in. (76×76 mm) NaI(Tl) scintillation crystal,
again at a 25.0 cm source-to-detector distance, is defined as
E
rel
= A ⁄ ANaI
where A = area net (counts) under the 1.33 MeV peak

ANaI = 1.2 ×10-3Ns
Ns = Is× live accumulation time
Is = source intensity
Since the 60Co source used decays at a rate of about 1.1% per month,
the source intensity Is depends on the age of the source, i.e., time
elapsed since it was itself calibrated. This is determined from the fol-
lowing formula:
Is = I0 e-0.693∆t/T
where Is = present source intensity

I0 = original source intensity
∆t = time (in years) since source calibration
T = half life of 60Co (5.271 years)
4-7
100
20% N-type
70
Ge absorption edge
50
30
20
20% P-type
10
Intrinsic Detector Efficiency (percent)
7
Beryllium
window
5 thickness
2 5 10 20
(mils)
3
0.7
30
0.5
0.3
0.2
Detector 15
Thickness 13
(mm)
5 7 10
0.1
1 2 3 5 7 10 20 30 50 70 100 200 300 500 700 1000 2000 3000
Photon Energy (keV)
Fig. 4-3 Intrinsic Detector Efficiency for various crystal thicknesses and types, determined for a
point source approximately 25 cm. from the crystal face.
4.2.1.3. Intrinsic Counting Efficiency

The intrinsic counting efficiency takes into consideration just those
photon events actually reaching the detector window. Thus, while Ns in
the equation for absolute counting efficiency is the total number of pho-
tons emitted in all directions by a point source, intrinsic efficiency (Eint)
relates to just the number of photons in the conic section corresponding
to the active area of the detector. This is given by the following equa-
tion:
2
A A4 π r
E = ------------------------------------- = ----------------------
int
N s ( area ⁄ 4 π r 2 ) N s ( area )
where “area” is the active area of the detector crystal and r is the dis-
tance from the source.
4-8
4.2.1.4. Efficiency and Detector Thickness

Fig. 4-3 shows some representative intrinsic photopeak efficiencies for
planar germanium detectors of different crystal thicknesses and for a
typical coaxial germanium detector. The curves on the left illustrate the
percent-transmission for beryllium windows of different thicknesses.
The “Efficiency” value reported in the Detector Specification Sheet is
the intrinsic counting efficiency.
4.2.2. Peak Shape and Energy Resolution

Semiconductor detector systems are characterized by their superior
energy resolution, by which they are able to distinguish between gam-
ma rays and X rays with energies only slightly different from each other.
The energy resolution for PGT coaxial germanium and well detectors
(and sometimes large planars) is defined as the Full Width at Half Max-
imum (FWHM) for the full energy peak of the 1.33 MeV line of 60Co, ex-
pressed in keV and measured under the same conditions as the effi-
ciency measurement described in Section 4.2.1. The system calibration
should be about 0.2 keV/channel.
To determine spectral energy resolution, both the main peak at 1.33

MeV and the second peak at 1.17 MeV must be located in the spectrum
ˆ and X
and their centers X ˆ determined for the energy calibration.
1 2
For other types of detectors, see Table 3-3, “Detector Resolution Pa-
rameters,” on page 3-17.
4.2.2.1. Peak Location

The interpolated fractional channel number X ˆ corresponding to the
maximum of the monoenergetic spectral peak is determined from the
number of counts per channel less background (NX - BX) as a function
of channel number (X). At X ˆ , the count equivalent to one-half peak
height is determined, and the procedure given in “Manual Calibration”
on page 3-15 is then used to calculate FWHM.
4.2.2.2. Energy Resolution

From the energy and location of the main peak being measured, E 1 and
ˆ , and of the second peak, E and X
X ˆ , the FWHM in energy units is
1 2 2
given as
E1 – E2
∆ E s = ------------------∆ N s
Xˆ –X ˆ
1 2
where ∆Es is the total spectral energy resolution at energy E 1 and ∆Ns
is the number of channels in the peak at FWHM.
4-9
4.2.2.3. Peak Shape

In a similar fashion, from the number of counts at one-tenth and one-
fiftieth peak height the Full Width at Tenth Max (FWTM) and Full Width
at Fiftieth Max (FWFM) can be calculated. The ratio of FWTM, and op-
tionally of FWFM, to FWHM is a measure of “peak shape.” For a very
good detector, FWTM/FWHM ≤ 1.9, while FWFM/FWHM ≤2.65.
4.2.3. Noise Contributions

The contribution of electrical noise to the spectral linewidth (i.e., energy
resolution) can be determined by measuring ∆ET, the FWHM of a puls-
er-generated peak, along with ∆Es. Then the contribution of all factors
other than electrical noise to the spectral linewidth is
2 2 1⁄2
∆ E0 = ( ∆ Es – ∆ ET )
If the count rate for data acquisition is sufficiently low, ∆E 0 is primarily

due to the detector charge generation and collection processes. The
above relationship can be used to estimate the resolution at other en-
ergies from the resolution determined at 1.33 MeV, for example.
4.2.4. Peak-to-Compton Ratio

Compton scattering is the most important interaction in a germanium
detector crystal for gamma rays with energies between 150 keV and 7
MeV. The peak-to-Compton ratio is defined as the ratio of the peak
height for the 1.33 MeV gamma ray of 60Co to the average height of the
Compton continuum over the energy range 1.040-1.096 MeV. These
values are obtained under the same conditions as the energy resolu-
tion measurements.
In general, a detector with a higher peak-to-Compton ratio will have

higher line-to-background ratios and better counting statistics for com-
plex spectra. The value depends on detector geometry, mount and
cryostat configuration, detector efficiency and detector resolution. It in-
creases with detector active volume and decreases with the FWHM.
For ultimate detection sensitivity, the Compton continuum can be di-
minished by using a Compton suppression device.
4.2.5. Peak-to-Background Ratio

The peak-to-background ratio (P/B) is most commonly used to mea-
sure window and edge effects on Si(Li) and planar Ge detectors. For
such systems, it is defined as the ratio of the counts in the top channel
of the 5.9 keV peak to the average background counts between 400eV
and 4000 eV, using an 55Fe source (Fig. 4-4). It can also be defined for
different sources and energies.
4-10
Background
drawn at 100× for clarity
FWHM
Si(Li):
138 eV
small planar IG:
down to 125 eV
Si(Li) P/B IG P/B

1500-10,000:1 200-10,000:1
5.9 keV
Fig. 4-4 Peak-to-background (P/B) ratio in a spectrum of 55Fe with Si(Li)

and germanium (IG) detectors.
PGT Si(Li) detectors have P/B ratios from 1500:1 to 10,000:1, depend-
ing on window material, with a typical value of 8000:1. For IG detectors,
P/B ranges from 200:1 to 10,000:1, with 1000:1 typical, depending on
the window material.
4.2.6. Timing Resolution

Timing resolution in germanium detectors is strongly influenced by the
internal electrical fields in the detector. The usual method for establish-
ing the timing resolution is based on a coincidence system detecting,
for example, the two 511 keV gamma rays of a 22Na annihilation
source. A start signal from a high speed plastic detector and a stop sig-
nal from the Ge detector being tested are required. The distribution of
the time difference between start and stop, measured with a time-to-am-
plitude converter, gives the timing resolution of the system. The mea-
suring equipment is of critical importance: high quality timing filter am-
plifiers and amplitude and risetime-corrected constant-fraction discrim-
inators are needed. Timing resolution of other energies can be
measured by using cascading γ rays or coincidence between γ and X
rays.
Some typical timing resolution figures for different germanium detector

geometries, determined for 511 keV γ rays against a plastic scintillator,
are shown in Table 4-1.
Table 4-1: Timing Resolution Figures for Germanium Detectors
Large Planar Large True Coax

Small Planar Large Closed End
Small True Coax Small Closed End
FWHM 1-3 ns 2-6 ns 4-10 ns 6-15 ns
FWTM 2-8 ns 5-20 ns 10-30 ns 15-50 ns
4-11
4.3: Other
Detector
Geometries Two special detector geometries are designed for samples that are ei-
ther very small or very large: A well detector has a reentrant cavity in
the endcap and is used for very small samples. A Marinelli beaker is an
inverted well beaker that fits over the endcap. It is used for larger sam-
ples of low activity.
4.3.1. Well Detectors

Efficiency measurements for a well-type coaxial germanium detector
are made with an approximate point source of 60Co (<2.0 mm maxi-
mum dimension) located 1.0 cm above the bottom of the endcap well.
In such a system, the source is virtually surrounded by active germani-
um. This results in relatively high absolute efficiency and also in a much
greater fraction of coincident gamma rays that are summed. Each
count in the sum peak corresponds to the simultaneous detection of
two γ rays. Thus, for one of two coincident lines, the number of detect-
ed photons is equal to the counts in the full energy peak (A) plus the
number of counts in the sum peak (As).
The effect of coincidence summing in a well detector is especially im-

portant in specifying efficiency, since the ratio A s/A increases as the
absolute detector efficiency increases. Accidental coincidences are
minimized by controlling count rate and amplifier shaping and by the
use of pulse pile-up rejection.
For 60Co, the 1332.5 keV line is coincident with the 1173.2 keV line.
The sum peak is therefore at 2505.7 keV. The in-well efficiency (W) is
then
A + As
W 60 = --------------- where A = area of the 1332.5 keV peak
Co N s As = area of the 2505.7 keV sum peak
Ns = total number of 1332.5 keV photons
emitted by the source during the live time
NOTE: PGT also determines the absolute efficiency (Ea) of the 40 keV
line of 129I to give a measure of the absorption of the sample hole ma-
terial and the detector internal dead layer:
A 40keV
W 129 = ------------------ where A40 keV = area of the 40 keV peak
I Ns Ns = total number of 40 keV photons
emitted by the source during the
live time
PGT well detectors have a “hole through” geometry, rather than a

closed-end coaxial configuration. This allows a rear center contact to
be used, which results in much lower susceptibility to environmental
noise and vibration and, therefore, much improved resolution. This is
achieved with a loss of less than 7 percentage points in absolute effi-
ciency for a 14 mm sample hole at 40 keV and of 0.3 percentage points
for a 14 mm sample hole at 133 MeV in a 120 cm3 detector.
4-12
Marinelli beaker
end
cap
Centering support
dewar
Fig. 4-5 Marinelli beaker.
4.3.2. Marinelli Beakers

A standard Marinelli reentrant (inverted well) beaker (Fig. 4-5) is used
with large-volume, low-activity samples.
Two beaker sizes are standard: 450 mL for detectors of diameter ≤76.5
mm and 1000 mL for larger detectors. These are filled (to ±2 mL of the
stated volume) with a solid or liquid carrier containing uniformly
dispersed radioactive material. The source is either a certified MBSS
(Marinelli Beaker Standard Source) or calibrated MBSS.
The absolute full-energy peak efficiency M of such a detector system is

then defined as
A where A = number of events counted in the full-

M = ------ energy peak in the live counting time
Ns
Ns = number of g rays of energy E originating in the
MBSS in that same live time interval
The most widely used line for specifying efficiency and resolution is the
1332 keV γ ray of 60Co; for low energies, the 88 keV γ ray of 109Cd is
preferred.
4.4: Other
Factors
4.4.1. Temperature Cyclability

PGT intrinsic germanium and Si(Li) detectors (but not lithium-drifted
germanium) are temperature cyclable. They may be warmed to room
temperature and recooled to liquid nitrogen temperature without loss of
performance for the entire warranty period. (Note, however, that once
a detector has begun to warm up, it must be brought completely to room
temperature before recooling.)
Intrinsic Ge and Si(Li) detectors can be stored indefinitely at room tem-

perature.
4-13
4.4.1.1. Annealable Detectors

The performance of a germanium detector degrades when subject to a
flux of neutrons or other heavy particles. This degradation causes peak
broadening and “tailing” on the low-energy side of the peaks. Noise and
leakage current normally remain unchanged. Cycling the detector to
room temperature enhances the effects of neutron damage.
Neutron damage, especially in N-type intrinsic germanium detectors,

can be repaired by heating the detector to temperatures above 100°C.
Typical annealing times are 0.5 hour at 200°C, 2 hours at 150°C, or 6
hours at 120°C, but these may vary for different detectors and different
types of damage.
During the heating cycle, outgassed vapors may contaminate the de-
tector. If this happens, the detector must be returned to the factory for
reprocessing. To minimize the possibility of detector contamination,
lower temperatures with correspondingly longer annealing times
should be used. Pumping the cryostat during the heat cycle is also
highly recommended. A high vacuum system with an LN2 cold trap is
best, although a mechanical vacuum pump which can produce an ulti-
mate vacuum of better than 20 microns may be suitable. The LN2 cold
trap is absolutely necessary to prevent backstreaming of oil.
After the recommended heating time, the detector is allowed to cool,

usually for about 2 hours, and then disconnected from the vacuum
pump. It must then be cooled down for the recommended period before
testing. If the repair is incomplete, the procedure may be repeated at a
slightly higher temperature.
Note: after several years, the molecular sieve in the cryostat may be
loaded to the point that a positive pressure is generated in the cryostat
when it is warmed above room temperature. It is then necessary to
pump the cryostat during the whole procedure.
PGT offers an optional Neutron Radiation Damage Kit as an add-on to

the detector system. This allows you to repair most N-type intrinsic ger-
manium coaxial detectors in your own lab. The kit includes a cryostat
with a special vacuum valve, temperature controller and heater. For
vertical or horizontal dipstick systems, heat is applied to the cryostat by
electrical tape wrapped around the cold finger and the lower 12 inches
of the cryostat. For a unitary vacuum system, as in the portable cry-
ostats, a heating tube is used to warm dry nitrogen gas as it is pumped
in through the nitrogen fill port.
In-factory service is also available for more complete damage repair

and reprocessing, if necessary.
4-14
100
90 Beryllium Aluminum Copper

0.013 mm 0.5 mm 0.5 mm
80
0.03 mm 1.0 mm
1.0 mm
70
0.15 mm 2.0 mm
60 0.55 mm
% Transmission
50
40
30
20
10
0
1 2 5 10 20 50 100 200
Energy (keV)
Fig. 4-6 Energy transmission for different entrance windows.
4.4.2. Window Thickness Index

The thickness index of the detector window (detector crystal dead-lay-
er, cryostat mount and endcap) can be reported in terms of the ratio of
peak areas for the four energies 31, 54, 80, and 161 keV emitted by
133
Ba. The ratio of peak areas for the 22 and 88 keV lines of 109Cd may
also be used. For thin windows, the thickness index is based on X-ray
fluorescence of a standard glass (SRM 477 from NIST) with an 55Fe
source.
Fig. 4-6 shows the percent transmission for beryllium, aluminum, and
copper entrance windows of various thicknesses.
4-15
4.4.3. Transmission/Absorption Nomogram

The nomogram on the facing page can be used with the graphs of the
linear attenuation coefficients to determine the transmission/absorption
of gamma rays for a given crystal thickness. It is based on the following
formulas:
(for transmitted γ rays)

---- = e –µ d
I
I
0
( I0 – I )
---------------- = ( 1 – e –µ d ) (for absorbed γ rays)
I0
where I is the intensity of transmitted radiation

I0 is the incident radiation
µ is the total attenuation coefficient (cm-1)
d is the thickness of the crystal (cm)
To use the nomogram:
Step 1. Find the value of the attenuation coefficient (µ) for the se-
lected energy from the curve labelled “Total” in the graph
of the chosen crystal material.
Step 2. Mark this value on the left-hand scale of the nomogram.
Step 3. Mark the thickness of the absorber (d) on the right-hand

nomogram scale.
Step 4. Draw a straight line connecting these two points and read
off the transmission/absorption value where the connect-
ing line intersects the center line of the nomogram.
For example, at 0.2 MeV, a 2-cm. Ge crystal has a total linear attenu-
ation coefficient of 1. The line connecting 1 on the left scale to 2 on the
right scale crosses the center line at 0.90 absorption (0.10 transmis-
sion), as shown by the dotted line on the nomogram.
4-16
Transmission/Absorption Nomogram
100 100
Transmission Absorption
50 50
20 20
10 10
5 5
0.001 0.999
2 0.01 0.99 2
0.05 0.95
0.10 0.90
0.20 0.80
Linear attenuation coefficients (cm-1)
1 0.30 0.70 1
0.40 0.60
0.50 0.50 Crystal length (cm)
0.60 0.40
.5 0.70 0.30 .5
0.80 0.20
0.85 0.15
0.90 0.10
.2 0.95 0.05
0.96 0.04 .2
0.97 0.03
0.98 0.02
.1 0.99 0.01 .1
0.995 0.005
.05 .05
0.999 0.001
.02 .02
.01 .01
4-17
Silicon
1000
500
200
100
50
20
10
Linear Attenuation Coefficients (cm-1)
Total
1
0.5
Compton
0.2
0.1
0.005
Photoelectric Pair Production

0.002
0.001
0.01 0.02 0.05 0.1 0.2 0.5 1 2 5 10
Energy (MeV)
4-18
Germanium
1000
500
200
100
50
20
10
Total
2
0.5
Compton
0.2
0.1
0.05
Pair
Photoelectric Production
0.02
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1 2 5 10
Energy (MeV)
4-19
Beryllium
100
50
20
10
2
Total
1
0.5
0.2
Compton
0.1
0.05
0.02
Photoelectric
0.01
0.005
0.002
0.001
1 2 5 10 20 50 100 200 500 1000
Energy (MeV)
4-20
Section 5
Preamplifiers 5
Resistive Feedback
Lower-Power
Pulsed Optical
Transistor Reset
Table 5-1: PGT PREAMPLIFIERS
RG-11 or
352 PO-14B TR
RG-15
Charge Sensitivity (nominal) 100 100 50 50

mV/MeV
Input Open Loop Gain >20,000 >20,000 >20,000 >20,000
Input Pulse Polarity +/- +/- +/- +/-
Output Impedance 93Ω 93Ω 50Ω 50Ω
Maximum Cable Length (m) 30 6 30 30
Integral Nonlinearity <0.05% <0.05% <0.05% <0.05%
Decay Time Constant 100 µsec 200 µsec -- --
Energy Rate Product (MeV/sec) 50,000 20,000 200,000 800,000
Isolation (VDC) >5,000 >5,000 >5,000 >5,000
Connectors
Input Hard wired Hard wired Hard wired Hard wired
Detector Bias SHV SHV SHV SHV
Timing Output BNC BNC -*- -*-
Signal Output BNC BNC BNC BNC
Test Pulse BNC BNC BNC BNC
Power 9-Pin Amphenol 9-Pin Amphenol 9-Pin Amphenol 9-Pin Amphenol
Nominal Current Usage at

24V 37 mA -- 24 mA 27.5 mA †
12V 6.4 mA 10.4 mA 18 mA 20.0 mA †
-24V 14.8 mA -- 10 mA 20.8 mA †
-12V 3.8 mA 3.7 mA 1.6 mA 1.6 mA †
†
*Available as an option (BNC unless otherwise specified) Negative TR-14B
PGT Detector Systems Preamplifiers
5.1: Preamplifiers
Absorption of a photon by the detector produces a small charge accu-

mulation at the input of the preamplifier, which is then converted into a
measurable electrical signal by the first stage of amplification. The am-
plitude of the output pulse is proportional to the total charge accumulat-
ed in the detector crystal during absorption of each photon. The
detector/preamplifier combination is of paramount importance in deter-
mining the operating characteristics of a system. There are three pri-
mary preamplifier types offered by PGT: Resistive feedback, Pulsed-
optical reset, and Transistor reset. Table 5-1 gives a summary of their
operating characteristics.
The PGT RG-11 B/C or RG-15 Resistive Feedback Preamplifier is the

type most commonly used for gamma ray counting between 5 keV and
10 MeV. It maintains a closed loop first stage amplification by means of
negative feedback through a high-value resistor and a selected low-
noise FET. These components are mounted close to the crystal in the
cryostat and maintained at liquid nitrogen temperature to minimize the
noise and microphonics contribution to system performance.
The PGT 352 Low Power Preamplifier is a resistive feedback model

designed for portable detector applications. Its power requirement of
<250 mW and operating voltage of ±12 VDC minimize drain from the
battery pack on the MCA.
See Sec. 5.2.1 for description, layouts, and circuit diagrams of the re-
sistive feedback preamps.
The PGT PO-14B (and PO-12) Pulsed Optical Feedback Preamplifiers

replace the feedback resistor with light pulses to reset the preamp out-
put. Performance is close to that of an idealized charge-sensitive
preamplifier. These preamplifiers are ideal for very low noise applica-
tions, e.g., the measurement of soft gamma and X rays with Si(Li) or
small-to-medium intrinsic germanium planar detectors.
The PGT TR-14 (N and P) Transistor Reset Preamplifiers are designed

for high energy rate applications (with a maximum >800,000 MeV/sec).
In this type of preamplifier, the charge accumulating on the feedback
capacitor is periodically discharged through a suitably located transis-
tor. They can be used with both P- and N-type germanium detectors.
Detailed descriptions, layouts, and circuit diagrams for the pulsed-opti-

cal preamps are given in Sec.5.2.4 and for the transistor-reset preamps
in Sec. 5.2.5.
5-3
Preamplifiers PGT Detector Systems
at low count rates at high count rates:
Energy rate limit
reset
decay time time
Resistive feedback preamp Pulsed-reset preamp

Long recovery after each event Short reset after many events
Fig. 5-1 Decay/Reset patterns for resistive feedback (left) and pulsed-reset preamplifiers (right).
5.1.1. Preamplifier Characteristics

Parameters used to characterize a preamplifier include its maximum
count rate for a given energy range, its maximum energy rate product,
and its decay time or reset time. In essence, these values all relate to
how well the preamplifier can accurately record each separate photon-
induced event in the detector. The decay/reset time describes how
quickly the charge induced in the capacitor can be discharged. In the
resistive feedback preamplifiers, this is determined by the decay time
constant of the RC feedback loop, which is typically on the order of 1
msec. As shown in Fig. 5-1, recovery occurs after each event (indicated
by the dashed curved line). With the pulsed optical (PO) reset, the reset
time is approximately 15 µsec, while in the transistor (TR) reset, the
time is 6-10 µsec. Furthermore, reset does not occur until many events
have been recorded.
The contribution of reset time to system dead time is very short. In

pulsed-reset systems, preamplifier dead time coincides with the reset
time, and the maximum energy rate is primarily limited by the collection
time per event. Maximum energy rates in excess of 1000 GeV/sec are
common in reset type preamplifiers. In the resistive feedback preamps,
events can be processed even during the decay time of previous
events, as shown schematically for high count rates in Fig. 5-1. How-
ever, as they pile up on one another, the output level increases until it
reaches the maximum of the preamplifier dynamic range (23.3V for the
RG-11B and ~10V for the 352). If the energy rate is too high, the
preamplifier is paralyzed and will shut down. The maximum energy rate
is typically limited to 80 GeV/sec, as described in Sec. 5.1.1.1.
Further, if the time between events is less than 1.5× the peaking time
of the main amplifier, regardless of the type of preamplifier, the pulses
pile up and cannot be processed. Main amplifier and ADC (analog-to-
digital converter) dead times are the major contributors to system dead
time.
5-4
5.1.1.1. Maximum Count Rate Determination

In a dc-coupled charge-sensitive preamplifier, there is a maximum val-
ue for the energy rate product (energy × count rate), above which the
preamplifier will shut off, as shown also in Fig. 5-1. As this maximum
energy rate product is approached, the detector system may exhibit se-
vere resolution degradation and peak shifts. For a given preamp, then,
the maximum count rate can be determined by dividing the measured
maximum energy rate by the mean energy of the spectrum produced in
the detector.
1Q – 19
--------------- × ( 1.6 × 10 Coulomb ⁄ Q ) × Mev ⁄ sec = I D
2.98ev
# of charge carriers charge per charge carrier rate at which current

per energy absorbed energy is induced in
absorbed detector
ID × R f = V TP
detector feedback test-point
current resistor voltage
ER max = count rate × E spectrum

energy rate mean energy
at max VTP of spectrum
These relationships are more easily seen in the following example for
a detector with a resistive-feedback preamplifier: In a germanium crys-
tal there is one charge carrier produced for every 2.98 ev of energy de-
posited in the crystal. At 1.6 × 10-19 coulomb per charge carrier, 1 MeV
of energy falling on the detector produces a charge of 0.53 × 10-13 cou-
lombs. Thus, if 1 GeV/sec is detected, the current generated is 0.053
nAmps. This current flowing through a 10GΩ feedback resistor raises
the voltage at the preamplifier test point by 0.53V. As the energy rate
is increased to 44 GeV/sec, the test point voltage increases to >23.3 V,
at which point the preamplifier shuts down. Therefore, for this example,
44 GeV/sec is the maximum energy rate (ERmax) that the detector/
preamp assembly can handle. The maximum count rate is determined
by dividing this value by the mean energy of the spectrum. In this par-
ticular system, the maximum count rate for 57Co would thus be approx-
imately 440,000 counts/sec.
For a coaxial detector, the feedback resistor value, cold, is typically 5-

10 GΩ. The average 7.5 GΩ resistor gives a maximum energy rate of
60 GeV/sec. For the 60Co spectrum with a mean energy of 0.8 MeV, the
maximum count rate is 70,000 counts/sec.
It should be noted that the count rates are those observed in the total
spectrum. Once the maximum energy rate of a given system is known,
count rates for other spectra can be calculated. For example, in the sys-
tem above with a maximum energy rate of 60 GeV/sec, the maximum
total count rate for 137Cs (662 keV line) with a mean energy of ≈0.5
MeV is 120,000 counts/sec.
5-5
Using a lower value feedback resistor can yield a higher maximum en-
ergy rate, but with a loss in resolution. For high count rates and high
energies, the use of a transistor reset preamp is much better.
Count rate is also limited by the pulse-pair resolving time, which is a

function of the amplifier-selected peaking time. This is a particularly im-
portant consideration when long time constants are used with a pulsed
optical preamp in order to maximize energy resolution. A good rule of
thumb to use with PGT preamplifiers is that the maximum count rate is
1.6× the energy rate product (in MeV).
Table 5-2 gives some representative maximum energy rate products

for various PGT Preamp/Detector systems.
Table 5-2: Maximum Energy Rate Products
Max. energy rate

Detector Preamp
(GeV/sec)
IGC/NIGC RG-11/15 70
NIGC PO-14 250
IGP RG-11/15 6
(<500 mm2)
IGP RG-11/15 12
(>500 mm2)
IGP PO-14 200

(<500 mm2)
IGC/NIGC/IGP TR-14 400 standard

1000
Si(Li) PO14B 200
5.1.1.2. High Count Rate Systems

The operation of a resistive feedback preamplifier is limited by the de-
cay time for discharging the capacitor and the maximum test point volt-
age, both of which are functions of the resistor size. To increase the
energy rate product for a system, this resistor feedback system is re-
placed by a pulsed-reset system, which is much faster. The resetting
may be either by pulsed light feedback to the FET structure by a light-
emitting diode or by a transistor switch.
The main amplifier shaping time may have to be decreased at higher

count rates. Energy resolution at shorter shaping time becomes worse,
however, because of increasing noise attributed to the FET component
of the preamp and the detector capacitance. At longer shaping time the
system noise will again increase, particularly with resistive feedback
preamps. This is not a problem with the pulsed-optical preamps which
no longer have this resistor.
5-6
NTot = Total electronic noise

Np = Parallel noise
NTot2 Ns = Series noise
Nopt
Noise2
1/ ƒ
Ns 2
Np 2
Topt
1.0 10 100
Pulse Processing Time (µsec)
Fig. 5-2 Electronic noise contributions as a function of pulse

processing time in a resistive feedback preamplifier.
5.1.1.3. Noise Effects

System electronic noise is primarily due to the electronics associated
with the FET and the detector itself. There are three noise components:
Parallel noise from detector leakage current and all resistors which are
electrically in parallel with the detector, including the bias resistor and
the preamp feedback resistor; series noise from total input capacitance,
gain, and resistors between the detector and preamp; and 1/ƒ noise.
The value of the parallel and series noise contributions is a function of
the pulse processing time, which is the time needed by the main ampli-
fier to completely process a pulse from the preamp, ~ 5 × the Gaussian
shaping time, τ. Parallel noise (Np) is proportional to τ , series noise
(Ns) to 1 ⁄ ( τ ) , and 1/ƒ noise is independent of τ.
Fig. 5-2 shows how the parallel and series noise contributions, and the
total noise, in a resistive feedback preamplifier vary with the pulse pro-
cessing time. Minimum electronic noise (Nopt) occurs at Topt, when
these two components are equal. The 1/ƒ contribution, indicated by the
dashed line, does not change the shape or position of the minimum on
the time axis, but only its height (noise value). The variation of detector
resolution with pulse processing time essentially coincides with the
curve for NTot2.
Decreasing the shaping time to 0.5 Topt can double the count rate ca-
pability of a system while increasing the noise, and therefore resolution,
only about 12%.
The optimum shaping time (Topt ) for a given germanium detector sys-
tem is typically around 4 µsec Gaussian shaping time, corresponding
to approximately 10 µsec pulse processing time. (See also Table 5-3.)
5-7
Table 5-3: Resolution as a Function of Count Rate and Shaping Time

(% increase in FWHM)
Shaping time (µsecond)

Count Rate
Source/line
(counts/sec)
4 µs 2 µs 1 µs 0.5 µs
60
Co 1 000 0 1 4 8
(1332 keV) 10 000 5 4 5 8
20 000 9 6 7 9
50 000 17 12 10 11
100 000 20 18 15 14
57
Co 1 000 0 5 15 30
(122 keV) 10 000 5 8 16 30
20 000 9 10 18 31
50 000 17 16 22 34
100 000 20 23 28 38
55
Fe 1 000 0 10 30 60
(5.9 keV) 10 000 5 13 31 60
20 000 9 15 34 62
50 000 17 22 38 65
100 000 20 28 44 70
These figures are meant as a general guide and assume the use of a suitable main
amplifier, pile-up rejector, and multichannel analyzer.
5-8
10
N2 = Quadratic sum of
parallel and series noise
Np = Parallel noise
Ns = Series noise
Noise2
N2
Ns2
Np 2
Topt
0.1
1.0 10 100
Pulse Processing Time (µsec)
Fig. 5-3 Noise contributions in pulsed-reset preamplifiers.
5.1.1.4. Noise in PO and TR Systems

Np is negligible in pulsed-optical preamps and small with transistor-re-
set preamps. This reduces Nopt and shifts the Topt to longer pulse pro-
cessing time, as shown in Fig. 5-3. Therefore, a longer time constant is
often used with pulsed reset preamps without loss of resolution. More-
over, because Np2 is also smaller, the resolution degradation at short
time constants is less than is the case for resistive feedback preamps.
For a given shaping time, high count rates can lead to the possibility of
pulse pile-up in which pulses arrive at the multichannel analyzer (MCA)
almost simultaneously. The MCA treats such a double pulse as a single
pulse of greater amplitude (and therefore, energy). This leads to distor-
tion in the spectrum: extra high-energy counts, fewer counts in the pho-
topeak, and increase in the FWHM for the full energy peak. This
spectrum degradation becomes significant when the product of input
count rate and pulse processing time exceeds 0.5, and it is a dominant
factor when this value is >1.
Decreasing the pulse processing time of the main amplifier by decreas-

ing the peaking time reduces the spectrum distortion, but with a loss in
resolution. A pile-up rejector can also be used if it is compatible with
the MCA.
5-9
4 µsec Gaussian shaping
Fig. 5-4 Effect of shaping time on peak shape.
5.1.1.5. Ballistic Deficit

As noted above, the optimum shaping time for these systems at a count
rate of 30,000 counts per second is typically 4 µsec, corresponding to
a peaking time of 8 µsec. However, it is often necessary to operate at
higher count rates, for which shorter shaping times and faster process-
ing are required. When a large-volume coaxial crystal is used for its
higher efficiency at higher energies, some charges are produced in
weaker, less uniform field regions. These charges are not collected as
rapidly (i.e., they have slow rise times). If the charge collection time in
the detector is long compared with the peaking time of the electronics,
these pulses will fall short of full energy value. The result is a broaden-
ing and low-energy tailing of the spectrum lines. This effect is the “bal-
listic deficit” illustrated in Fig. 5-4. While the ballistic deficit is not part
of the system noise, it also contributes to the system peak width. The
combined effects of noise and ballistic deficit is shown in Fig. 5-5.
5-10
Ns 2
R2
R2
Noise2
Noise2
Np 2
FWTM
FWTM
BD2
BD2
Ns2 Np 2
Topt Topt
100 1.0 100

1.0
Pulse Processing Time (µsec) Np = Parallel noise Pulse Processing Time (µsec)
(a) Ns = Series noise (b)
BD = Ballistic deficit
R = Resolution
Fig. 5-5 Combined effect of noise components and ballistic deficit on system resolution.
If the ballistic deficit is small, the effect on resolution is minimal, as

shown in Fig. 5-5(a). When the ballistic deficit and the parallel noise be-
come dominant, the effect on resolution becomes pronounced (Fig. 5-
5(b)). To compensate for this problem, a gated integrator amplifier
(GIA) system is used. This amplifier has variable shaping times con-
trolled by the rise time of the pulses from the detector, and it operates
at a basic short time constant of 0.25 µsec. Maximum energy-rate
products for these systems are limited by the amplifier and ADC, rather
than by the preamplifier itself. Sample data for such a system are
shown in Table 5-4.
Table 5-4: Effect of Count Rate on TR System

Performance
60 60
Co Source Co Peak Resolution Peak Centroid
(counts/second) (keV) (keV)
10 000 2.13 1331.82

50 000 2.15 1331.89
100 000 2.18 1331.95
200 000 2.21 1332.02
300 000 2.23 1332.14
400 000 2.27 1332.22
500 000 2.29 1332.22
600 000 2.27 1332.42
Data obtained with a PGT N-type coaxial Ge detector (16.5% efficiency,

1.73 keV resolution), PGT TR Preamplifier, and a Gated Integrator
Amplifier at 0.25 µsec time constant.
5-11
5.2: Preamplifier
Layouts and
Circuit
Diagrams
Layouts of the standard Models RG-11 B/C, RG-15, and 352 are shown
in Fig. 5-6 on page 5-13, and their circuit diagrams and component lay-
outs follow. Directions for replacing the preamplifier are also included.
The RG-11 B/C is commonly used for gamma counting between 5 keV
and 10 MeV. It has a standard energy rate product of 50,000 MeV/sec,
but can be modified to increase this value.
The Model 352 Lower-Power Preamplifier is designed for portable de-

tector systems. Its power requirement of <250 mW and operating volt-
age of +/- 12 V minimize the drain on the MCA battery pack.
The Pulsed Optical Preamplifiers PO-12 and PO-14B use an LED to re-
set the storage capacitor. Their performance is close to that of an ideal
charge-sensitive preamp, and they are particularly suited for such low-
noise applications as the measurement of soft gamma or X rays with
Si(Li) and small-to-medium intrinsic germanium detectors. Energy res-
olution remains optimized, almost independently of count rate, up to
the performance limit of the main amplifier. The PO-14B has a maxi-
mum energy rate product of 250,000 MeV/sec. An internal delay (up to
120 µsec) after the reset threshold is reached prevents loss of the trig-
ger event and thereby avoids preferential loss of high energy pulses.
Fig. 5-7 on page 5-23 shows the layouts of the PO-12 and PO-14B
Preamplifiers. with their circuit diagrams, component layouts, and re-
placement procedures on the following pages.
The Transistor Reset Preamplifiers, TR-14N and TR-14Pdischarge the

storage capacitor through a transistor switch. The N and P series differ
only in polarities and are designed for use with the corresponding N-
and P-type detectors. Energy reset is approximately 400 MeV, the
amount of charge stored during a reset cycle. Reset time is 6-10 µsec.
This translates to a dead time of <2% at 800,000 counts/sec for 60Co.
Again, an internal delay of approximately 120 µsec before actual reset
prevents preferential loss of high energy pulses.The upper count rate
and resolution of systems with these preamplifiers are limited primarily
by the capabilities of the gated integrator amplifier (GIA) and the ADC
units. While the very high energy rate product (exceeding 800,000
MeV/sec) of the TR preamplifiers makes them the preamp of choice for
high energy/count rate applications, they are very useful for all systems
and can be employed with both N- and P-type detectors.
Layouts of the Transistor Reset Preamplifiers are shown in Fig. 5-8 on

page 5-28, and their circuit diagrams, component layouts, and replace-
ment procedures follow.
5-12
5.2.1. Resistive Feedback Preamplifiers

violet
black yellow
Feedthrough Connections (rear panel):
red white
HV Feedthrough
green
HV HV HV
.002 .002
µF µF
Teflon mounting post TEST TEST Teflon GROUND DRAIN

post
GROUND (white) GROUND (white) (black, yellow) (violet)
(black, yellow) DRAIN (black, yellow) DRAIN
(violet) (violet) TEST
2GΩ (white)
2 GΩ VFET VFET
IFET
P/Z P/Z
FEEDBACK FEEDBACK FEEDBACK
DC (red) DC (red) (red)
IFET IFET
HV HV HV
Test Bias Output Test Bias Output Test Bias Output
RG 11 Preamplifier RG 15 or 352 In-line Preamplifier 352 Low Power Preamplifier
TP
BIAS Output Output
TEST OUTPUT
POWER
Front Panel
(RG-11 or 352 external)
Bias Test
+12 V
5 4 3 2 1
Front Panel
(RG-15 or 352 in-line)
9 6
-12 V 8 7
+24 V -24 V
thermistor output (352 only) Fig. 5-6 Layout of Models RG-11, RG-15 and 352
Preamplifiers.
9-pin Amphenol (expanded)
5-13
RG-11B Circuit Diagram
5-14
TP1 TEST
WHITE WHITE
TEST J3 BNC
R7
R33
Preamplifiers
JACK TEST
POINT J6
R34
RED TP4 5 CURRENT
FB SENSE
L2 RED
DETECTOR 7 +24V
+
CR1 R6 C12
R25
R4 Q2 R22
Q8 P1
1 GND 9 PIN SUB-D
C13
R5 MALE
Q9
+
R8 L3
C4 ORANGE
4 +12V
+
* * R9 C14
C9 R26
R35
+
C17
FRONT
Q5 R20 PANEL
VIOLET R18
TP2 *R13 Q10 Q11
Q3
Q1 D J4
R31
3 2 R11 R24 R27
1 C8 C10 Q6 Q7
4 TP3
* OUTPUT
S Q4
YELLOW R12 R15 R28 BNC
+
R19 C15
+
C7 R32
R16 * C11 R23 J5
C6 R17 Q13
Q12
R21 C18
R10
+
CR2
R29
L4 VIOLET
X-TAL 9 -12V
C16
+
R30
L5 BLUE
6 -24V
C20
+
(STANDOFF)
GREEN HV For room temp. FET use this configuration J2
(OPTION A)
BIAS
R1 SHV
*
For cold FET use this configuration
C1
*Selected (OPTION B)
For component specifications, see RG-11 Component Layout (page 5-15).

PGT Detector Systems
PROPRIETARY INFORMATION: This document contains information considered proprietary to PRINCETON GAMMA-TECH, INC., and is issued for maintenance purposes only. Reproduction of all or any part is strictly
prohibited without the written consent of PRINCETON GAMMA-TECH, INC., 1200 State Road, Princeton, NJ 08540
RG-11B Component Layout
J3
(solder side) white
To TP1 TEST BNC
(solder side)
DETECTOR To TP4 R33
J6 JACK TEST POINT
TEST To TP1
(white) R34 5 CURRENT SENSE
C12
C4
L2 red
C9
R5
CR1
L3 7 +24V
DRAIN To TP2
R22
(violet) orange
R6
R8
4
R35
R7 R25 +12V FRONT
R26
C8
PANEL
C14
R13
SOURCE To TP3 C17
(yellow) TP1 Q5 Q2
R4
R20
TP2 Q8 Q9 Q10 Q11
GND Q3 TP4
R9
To TP3 J4
R11
(black) C13
R32
R27
C15
C10
FEEDBACK
R28
To TP4 Q7
R18
Q4 Q6 R24 R31
(red)
TP3 J5
R16
R17
THERMISTOR
(orange) To Pin 8 Q12 Q13
(amphenol) R12
1 GND
R30
HV
R23
C18
C6
(green)
R29
C11
R10
C7
R15 violet
R21
CR2
C1 R19 9 -12V
ARCO L4
C16
blue
C20
L5 6 -24V
R1 BIAS SHV
J2
Components
DIODES RESISTORS (all are 1/8W, 5%, unless otherwise specified;

CR1 IN914 values in ohms)
CR2 IN5312 R1 2G, 1/2W
R4,R19 2K
TRANSISTORS R5,R11 15K
Q1 Selected FET R6,R20,R25,R26,R29 100
Q2,Q5,Q9,Q12,Q13 2N5087 R7 47
Q3 2N4401 R8 680
Q4 2N4403 R9 22K
Q6,Q7,Q8,Q10,Q11 2N5088 R10,R30 6.8K
R12 5K
INDUCTORS R13,R16 Selected
L2-5 330 µH R15 100K
R17 (coaxial detector) 27K
CAPACITORS (all in µf, unless otherwise specified) R17 (planar detector) 47K
C1 .002, 5KV for IG detectors R18 47K
.002, 3KV for Si(Li) R22 3.3K
C4,C7,C9,C11,C12, R23,R24 1K
C16,C17,C18,C20 2.2, 35V KM R27,R28 4.7
C6 .001, 1KV CD R21 3.3K,1/4W
C8 220 pf, 500 V DM R31,R32 93.1,1/4W,1%
(or as selected) R33,R34 100K,1/4W
C10 2200 pf,500V DM R35 1K,1/4W,1%
C13 .022, 25V CD
C14 33 pf, 500V DM
C15 5 pf, 500V DM
5-15
RG-15 Circuit Diagram
5-16
TP1 TEST
WHITE WHITE
TEST J3 BNC
R7
R33
Preamplifiers
JACK TEST
POINT J6
R34
RED TP4 5 CURRENT
FB SENSE
L2 RED
DETECTOR 7 +24V
+
CR1 R6 C12
R25
R4 Q2 R22
Q8 P1
1 GND 9 PIN SUB-D
C13
R5 MALE
Q9
+
R8 L3
C4 ORANGE
4 +12V
+
* * R9 C14
C9 R26
R35
+
C17
FRONT
Q5 R20 PANEL
VIOLET R18
TP2 *R13 Q10 Q11
Q3
Q1 D J4
R31
3 2 R11 R24 R27
1 C8 C10 Q6 Q7
4 TP3
* OUTPUT
S Q4
YELLOW R12 R15 R28 BNC
+
R19 C15
+
C7 R32
R16 * C11 R23 J5
C6 R17 Q13
Q12
R21 C18
R10
+
CR2
R29
L4 VIOLET
X-TAL 9 -12V
C16
+
R30
L5 BLUE
6 -24V
C20
+
(STANDOFF)
GREEN HV For room temp... FET use this configuration J2
(OPTION A)
BIAS
R1 SHV
*
For cold FET use this configuration
*Selected (OPTION B)
For component specifications, see RG-15 Component Layout (page 5-17).

RG-15 Component Layout
CR1
C12 C9 red
DETECTOR C4 L2 7 +24V
+
R5
orange
+ + L3 4 +12V
TEST BNC
R6
To TP1 black
R35
(white) R7 R8 R25 1 GND
R22
C8
R13
C14
R26
DRAIN TP2 Q5 Q2
To TP2 R4
(violet) Q8 Q9 Q10 Q11
TP1 FRONT
R20
Q3 R33 PANEL
R11
R9
SOURCE R34 C13 C17
To TP3 R32
(yellow)
R27
C15
TP4
C10
R28
Q4 Q6 Q7 R24 R31
GND To TP3 TP3
R18
(black)
R17
C18
R16
FEEDBACK To TP4 R12
R30
Q12 Q13
R21
R23
(red)
HV
R29
C6
To SHV
C11
R10
(green) C7
connector R15
CR2
R19 violet
L4 9 -12V
C20 blue
C16 L5 6 -24V
+ +
to test point to PI Pin 5
Components

CR1 IN914 values in ohms)
CR2 IN5312 R4,R19 2K
R5,R11 15K
TRANSISTORS R6,R20,R25,R26,R29 100
Q1 Selected FET R7 47
Q2,Q5,Q9,Q12,Q13 2N5087 R8 680
Q3 2N4401 R9 22K
Q4 2N4403 R10,R30 6.8K
Q6,Q7,Q8,Q10,Q11 2N5088 R12 5K
R13,R16 Selected
INDUCTORS R15 100K
L2-5 330 µH R17 (coaxial detector) 27K
R17 (planar detector) 47K
CAPACITORS (all in µf, unless otherwise specified) R18 47K
C4,C7,C9,C11,C12, R22 3.3K
C16,C17,C18,C20 2.2, 35V KM R23,R24 1K
C6 .001, 1KV CD R27,R28 4.7
C8 220 pf, 500 V DM R21 3.3K,1/4W
(or as selected) R31,R32 93.1,1/8W,1%
C10 2200 pf,500V DM R33,R34 100K,1/4W
C13 .022, 25V CD R35 1K,1/4W,1%
C14 33 pf, 500V DM
C15 5 pf, 500V DM
5-17
Model 352 Low Power ±12 V Preamplifier Circuit Diagram
5-18
Preamplifiers
TRIMPOT. R4
L2
C8 R13
+
+12 V
+
R14 PIN 4
R11 R8 C4
R9
R21
Q4 Q3 C6 A ONLY = Negative Bias Detectors
+
Q5 B ONLY = Positive Bias Detectors
C12
R5 R3 Positive Bias
B B
+
R10 Q2
+
R17 C9
TEST
C1 R1
TP 3 C2
TP 1 OUTPUT 1
D Q1
+
C R19
R12 C7 +
OUTPUT 2
.5 pf A A
Negative Bias
INPUT C5
TP 4 R20
+
2 GΩ 2 GΩ .5 pf R16 TEST POINT
E Q6 G
TP2 GROUND
+
L1 PIN 1
R15 C10 R6 R2
R7
-12 V
PIN 9
C3
+
GE(LI) HV FILTER
F R18
BIAS
C11
C, D, E, F, G are connections at the feedthrough.
For component specifications, see Model 352 Lower Power Preamplifier Component Layout (page 5-19).
Model 352 Lower Power Preamplifier
C4
DETECTOR
C8
C7
R12
Orange
L2
R11
C6
+12 V POWER
R14
TEST
R8
pin 4
R9
To TP3
R5
(white)
R4
R21
R13
DRAIN To TP1 Q5 Q4 Q2
(violet) Q3 OUTPUT GND
R3
TP1
C9
SOURCE C12
To TP2 TP2 C2
(yellow) TP4 R20 TEST POINT
C5
GND White
To TP2 OUTPUT 1
(black)
R6
TP3 Q6 Q1 Black POWER GND pin 1
R1
Yellow
FEEDBACK TEST
To TP4
(red) C1
R7
R15
R10
R2
C10
R17
R16
C3
HV C11 L1
(green) R19 OUTPUT 2
Violet
-12 V POWER
pin 9
R18 BIAS
Components
TRANSISTORS RESISTORS (all are 1/8 W, 5%, unless otherwise specified;

Q1,Q5,Q6 2N5088 values in ohms)
Q2,Q3,Q4 2N5087 R2,R5 6.8K
R3,R6,R17 100
INDUCTORS R4,R8,R11,R15 27K
L1,L2 330 mH R7 5.6K
R9 2.7K
CAPACITORS (all in mf, unless otherwise specified) R10,R14 1K
C1 150, 15V R12 33K
C2-C10 8.2, 15V R16 82K
C11 .002, 5KV for IG detectors R1,R19 93.1, 1%
.002, 3KV for Si(Li) R13 220, 1/4W
C12 100 pf CD R18 2G, 1/2W
R20 100K, 1/4W
R21 1.0K, 1/4W or
1.2K, as determined
5-19
5.2.2. Replacement of Resistive Feedback Preamplifiers

The following steps are to be followed if an externally mounted pream-
plifier needs to be replaced. In all cases, call PGT for specific instruc-
tions.
5.2.2.1. Removal of Old Preamp

Step 1. Turn off the detector bias and wait for at least 5 minutes.
Step 2. Disconnect all cables.
Step 3. Remove the preamplifier cover by unscrewing the 4 flat-

head screws and pulling off the cover.
Step 4. There are 6 connectors from the cryostat feedthroughs to

the preamplifier. A green wire connects the HV
feedthrough with the HV line. Red, black, violet, yellow,
and white wires go from the 7-pin feedthrough to the des-
ignated test pins in the preamplifier end (refer to Fig. 5-6).
Unsolder these wires at the preamplifier end and the green
wire at the HV mounting post (Teflon insulator in board).
Note: always use a heat sink on the capacitor when sol-

dering and unsoldering at the HV mounting post.
Step 5. Remove the old preamplifier from the cryostat by unscrew-

ing the two socket-head 5-40 screws.
Step 6. Remove the saddle-block from the old preamplifier by un-

screwing the two socket-head 4-40 screws.
NOTE: In some cases, such as Elbow (ED) cryostats, the

saddle block and bottom plate of the preamplifier are
screwed onto the collar, separate from the preamp. They
do not need to be removed. Unscrew the four socket-head
4-40×7/16" screws that are holding the preamplifier to the
bottom plate. Check to make sure that the new preamp
has proper mounting holes for attachment to the cryostat.
5.2.2.2. Mounting the New Preamp

Step 1. Screw the saddle block onto the new preamplifier.
Step 2. Screw the preamplifier onto the cryostat.
Step 3. Resolder the wires: the green wire to the HV post, and the
red, black, violet, yellow, and white wires to the pins on the
preamplifier (again, see Fig. 5-6 and be sure to use a heat
sink on the capacitor).
5-20
5.2.2.3. Optimization
Step 1. Be sure the detector is properly cooled!! Then connect the
preamplifier power, HV. and signal cables, as shown in
Section 3.1.3. Connect an oscilloscope to the output of the
main amplifier and observe the high noise level.
Step 2. Raise the bias to the recommended operating level. The

noise at the output of the main amplifier should go down
to about 15-30 mV peak-to-gain (main amplifier coarse
gain set at 100, full fine gain, 4 µsec shaping time con-
stant).
Step 3. Turn the FET current and FET voltage potentiometers

(Fig. 5-6) to obtain the minimum noise.
Step 4. Place a 60Co source next to the detector and turn the pole
zero (P/Z) potentiometers on the preamplifier and on the
main amplifier to obtain the right pulse shape (see Fig. 3-
2 and Fig. 3-3).
Step 5. Turn the DC output potentiometer (Fig. 5-6) to obtain zero

(0) DC voltage at the output of the preamplifier.
5.2.3. Replacement of In-Line Preamplifiers

Step 1. Turn off the detector bias and wait for at least 5 minutes.

head screws and pulling off the cover.
Step 4. Unsolder the red, black, violet, yellow and white wires at
the preamplifier end and the green wire at the HV mount-
ing post (Teflon insulator in board).
Note: always use a heat sink on the capacitor when sol-

dering and unsoldering at the HV mounting post.
Step 5. Remove the old preamp from the cryostat by unscrewing

the two socket-head 4-40×3/8" screws in the mounting
blocks that are attached to the preamp.
Step 6. Remove the two socket-head 4-40×1/2" screws in the

connector plate for the BNC and SHV.
Step 7. Remove the two mounting blocks from the old preamp by
removing the two 4-40×5/16" flat-head phillips screws.
5-21
5.2.3.1. Mounting the New Preamplifier

Step 1. Screw the mounting blocks onto the new preamplifier, as
they were on the old. Make sure they are parallel with
each other so that they line up with the mounting holes in
the flange.
Step 2. Remove the screws in the connector plate of the new

preamplifier.
Step 3. Align the mounting block holes with the mounting holes in
the flange. Make sure the wires of the preamp are on the
opposite side of the SHV connector. Screw in the socket-
head 4-40×3/8" screws.
Step 4. Screw in the socket-head 4-40×1/2" screws to mount the

two connector plates together.
Step 5. Resolder the green HV wire to the SHV connector. Resol-

der the red, black, violet, yellow and white wires to the
specified pins on the preamplifier.
Step 6. Optimize the system as described in Sec. 5.2.2.3.
5-22
5.2.4. Pulsed Optical Preamplifiers
Feedthrough Connections (rear panel): violet

violet
black yellow
black yellow
red blue
HV Feedthrough red white
green HV Feedthrough
green
Feedback (red) Feedback (red)

Ground (black) Source (blue)
Drain (violet) Drain (violet)
LED (yellow) Ground (IG:black; Si:blue)
Test (white) LED (yellow)
HV HV
IFET IFET
Teflon Gain
2 GΩ mounting 2 GΩ
posts
Feedback
(red)
100M VFET 100M
VFET
ILED Inhibit Inhibit ILED
HV HV
Test Bias Output Inhibit Test Bias Output Inhibit
PO-12 Preamplifier PO-14B Preamplifier
current
sense +12 V
BIAS OUTPUT
TEST 5 4 3 2 1
INHIBIT
PO-12
POWER -12 V 9 8 7 6
+24 V
current
Front Panel sense +12 V
thermistor output (optional) 5 4 3 2 1
9 8 7 6
PO-14B
-12 V +24 V -24 V

Fig. 5-7 Layouts for Pulsed Optical Preamplifiers.
5-23
PO-14B Circuit Diagram
5-24
CRI R9 +18V VOUT Q1 VIN J1
R2 Amphenol
+ 1 3
17-20090
R1 C3
Preamplifiers
3 + R10 C2 2
2 R4 R5 R6 C1 R8
R3 R7 J2 SIGNAL +24V
1 OUTPUT 7
R11
Q2 +
C7
+ C4 CR3
VOUT Q3
VIN 4 +12V
3
R12 R13 CR2 Q4 Q5 +5V 1 GND
2
1
C6 +
R47† C5 R14 C9
Q6 R19 R20
CR4 C8
R15
R18 15
CR5 14
R21 14
1 7 R16 R17 3 8 2 E2 Q 13 13 11
CR6 7 10 8
D 2 Q8 Q9 3 E1 E3
12 E3
2 Q7 R22 1 4 1 C10 7 9
FET 6 R24 2 120µS
XTAL S + 1 Q10 3 - 4
CR8 5
R23 CLR Q
3 C11 C12
R26 R28 CR7 R31 +
LED- R25 5 6
R30 C13 2
+ 3
R32 E3
R29 E3 4
R33 1
VOUT
C15 C16 -18V

+ Q11 VIN
+ 3 2 R34 J3
9 5
1 E2 Q INHIBIT
10 INH
11 CLR 12
C17 Q
30-
† * R36 300µS INH
R36 3
2 R37
7 6
FBK C20 LEAKAGE
1 R39 5
1 R38 CURRENT
(20µS Min)
* For 2X gain, remove jumper. 3 MONITOR
R40 2
+5V 9 -12V
2 6 -24V
LED+ 1 3
J1
R41 R42
J5
BIAS
C22 R43
THC C21 R44
J4 TEST
R45 R46
†
COMPONENTS FOR CIRCUIT OPTIONS (for special applications; normally omitted)
R36: Gain potentiometer option to fine-tune gain. This might be used in detector arrays where matched gains are required. This pot. (typically 5K) then replaces the 2.7K.
R47 replaced with inductor L1 for Si(Li) detectors.
For the component specifications, see the PO-14B Component Layout (page 5-25).
PO-14B Component Layout
Output BNC (J2)
Inhibit BNC (J3)

DETECTOR
C1
*
C3
Q1 R34 red
C2
CR1 TP7 +24V pin 7 (J1)
C5
+LED R9 green
To TP1
C4
Leakage current
R5
8
R8
7
CR3
R1
(yellow) Q2 R37 *
R4
C7
C6 monitor pin 5 (J1)
C20
R2
R10
R12
CR2 orange
GND R41 R38 E3 +12V pin 4 (J1) *
R11
To TP2
R14
(black)
8
Q4 Q5 black
*
R13
Q8 Q3 Ground pin 1 (J1)
Q6
R6
R7
DRAIN To TP3 R3 CR5 R39
R15 E2
14
(violet)
1
CR4
C9
CR6 R16
L1 or R47 CR7 C10
SOURCE R24 R19
To TP4 R40 Q10 Q7
(blue) R18
R21
R29
R25
16
C8
1
R36
1
Q9
8
FEEDBACK
R31
CR8
To TP5 E1
R28
R20
R23
(red) *
R30
violet -12V pin 9 (J1)
C12
R42
R26
HV R17
R44
5
To SHV
4
(green) connector R22 blue *
R45
C11
C15 -24V pin 6 (J1)
C13 R32
THERMOCOUPLE To TP6
R33
C21 C22
C16
C17
(orange) Q11 R46 Test BNC (J4)
THERMISTER R43 Bias SHV (J5)

(orange) To Pin 8
amphenol cut off pin
FEEDBACK† *J1 Power Connection

(orange) To TP7
†
for transistor reset only
to BNC
J4
P.C. bd.
comp. side
Components
CR1-8 IN914 values in ohms)
R1 680
IC’s R2,R11 47
E1 LM311N R3,R13,R14,R26,R41 100
E2 74LS123 R4,R5,R6,R7,R17,R22,R37 10K
E3 74LS00 R8,R29,R30 1K
R12 15K
TRANSISTORS R15,R16 4.7
Q1 MC78L18CP R18 4.7K
Q2,Q4,Q5,Q7,Q9 2N4403 R19 3.9K
Q3 MC78L05 R20 47K
Q6,Q10 2N4401 R21 470
Q8 LM394 R23 33K
Q11 MC79L18CP R24 5K
R25 22K
CAPACITORS (all in µf, unless otherwise specified R28,R44 2.2K
C1,C15 47, 20V R36,R40 2.7K
C2,C4,C7,C12,C16 4.7, 25V R38 6.8K
C3,C17 1.0, 50V R39 100K
C5,C10 330 pf R45 10K
C6 33 pf R9 100, 1/4W
C8 .005, 50V R10,R31 470, 1/4W
C9,C13 8.2, 15V R32,R33 220, 1/4W
C20 .01, 25V R34,R46 47, 1/4W
C21,C22 .002, 3kV R35 1K, 1/4W, 1%
R42 2G, 1/2W
INDUCTOR (for PO preamp, Si(Li) only) R43 100M, 1/4W, 10%
L1 56mH R47 (for TR preamp, Si(Li)) 1K
or (for IG applications) 1K or 1.2K, 1/4W
5-25
PO-12B and PO-12B8 Pulsed Optical Preamplifier Circuit Diagram
5-26
Preamplifiers
R1
R3 7 +24V
+ R32
CR1 R6 R7 C3
R15
C1 4 +12V
R2 R4 Q2 +5V
CR3 5
Leakage Current
R16 Monitor
R5 + C4
C2 + + 9 -12V
CR2 C12 R22 C14
Q5 R24
1 Ground
R35 R17 4 11
DET. Q1 C8 +
* C11 9 9 8
* E1 * R25
Q3 R34 10 E2
CR7 R10 3 2
Q6 Q7 6 INHIBIT
13 11
2 3
R14 E2
C9 C13 R31
C15 R26 1 E2 12
4 6
Q4
+ R9 + E2 Q10
LED
* C5 C6 R13 R18 5 CR5
R8
* R27
Q8 R20 R21
Q9
R19 R28
C10 CR4 R30
CR6
R11 R12 + R29
C7
+ R33 OUTPUT
NOTES: All components designated by are “Selected.” Portion within dotted lines is in cryostat.
PO12B: R18 is used; R34 is not used.
*
PO12B8: R18 is replaced by jumper; R34 is 3.9K, 1/8W.
Please see the PO-12B and PO-12B8 Pulsed Optical Preamplifier Component Layout (page 5-27) for the list of components.
PO-12B and PO-12B8 Pulsed Optical Preamplifier Component Layout
white
OUTPUT BNC
C12 red
C3
DETECTOR +24V PI -Pin 7
orange
R32 +12V PI-Pin 4
R7
CR1
TEST R16
C4
TP1
CR2
To TP1
(white) R30 GND To BNC LUGS
R15 C55
R6
(OUTPUT, INHIBIT)
CR3
Q5 Q7
R10
Q6
R29
LED C11 R27
To T2 TP2
R35
(yellow) R4 Q3
R14
Q2 C8 Q10 R24
CR6
C9
DRAIN
R20
To TP3 R28 C14
(violet) Q4 R26
TP3 To INHIBIT BNC
*
14
1
R13
14
R34
1
C5
R5
GND To TP4
R31
C6
(black) R9 E1 E2
CR7
TP4
R8
R17 UA
Q8 Q9 74HOO
C15
FEEDBACK To TP5 710PC PI-Pin 5
(red) TP5
GND PI-Pin 1
TP R18 TP
*
7
R2 To TEST BNC
7
THERMISTOR
8
To Pin 8
R3
(orange) R22
R21
R19
R11
R23 R25
HV C10
C2
C13
(green) To SHV C1 R12
connector CR4 violet
C7
R33 -12V PI-Pin 9
R1 To BIAS BNC
* PO-12B: R18 “Selected”
R34 not used
PO-12B8: R18 replaced with jumper
R34 3.9K, 1/8W
Components
DIODES RESISTORS (all are 1/8W, 1% unless otherwise specified;

CR1,CR2,CR5,CR6,CR7 IN914 values in ohms)
CR3 IN5235B (6.8V) R2 2G
CR4 IN5232B (5.6V) R4 2K
R5,R7,R28 15K
TRANSISTORS R6 100
Q1 Selected FET R8 2.2K
Q2,Q5,Q10 2N5087 R9 5K
Q3,Q6,Q7 2N4401 R10 6.8K
Q4,Q8,Q9 2N4403 R11 3.3K
R12,R15 47
IC’s R13,R14 4.7
E1 µ710C +5V Pin 14 R17,R22 3.9K
E2 MC3000C GND Pin 7{ R18 (PO-12B only) Selected
or SN7400N R19 3.01K
R21 27K
CAPACITORS (all in µf) R23 5.6K
C1,C2 .002, 3KV R24 2/7K
C3,C4,C6,C7,C10,C11 2.2, 35V, KM R26 10K
C5,C9 .001, 1KV, CD R27 100K
C8 Selected R29 22K
C12 100, 25V R30 1K
C13,C14 4.7, 25V, KM R1 100M, 1/4W
C15 .022, 25V, CD R3 47, 1/4W
R16 10, 1/4W
R20 49.9, 1%
R31 47, 1/4W
R32,R33 330, 1/4W
R34 ( PO-12B8 only) 3.9K
R35 1K, 1/4W,1%
5-27
5.2.5. Transistor Reset Preamplifiers
violet
black yellow
HV Feedthrough red white (10Ω resistor)
green
blue green (emitter)
(base)
Feedback (red) Feedback (red)

Source (yellow) Source (yellow)
Resistor (10Ω) Drain (violet) Resistor (10Ω) Drain (violet)
Ground (black) (white) Ground (black)
(white)
HV HV
red blue
IFET IFET
green
+18V Q IN Gain -18V Q IN orange
Gain
black black
GND Feedback GND +5V green
Feedback -18V blue red
(orange) B E (orange) B E +18V
FB orange FB orange
green
green
Ground blue
Ground blue
VFET (black) VFET (black)
ILED Inhibit ILED
Inhibit
(orange) (orange)
HV HV
Test Bias Output Inhibit Test Bias Output Inhibit
TR-14B (Positive) Preamplifier TR-14B (Negative) Preamplifier

based on PO-14B board based on PO-14B board
current
sense +12 V
BIAS OUTPUT
TEST INHIBIT thermistor output 5 4 3 2 1
(optional)
POWER 9 8 7 6
-12 V +24 V -24 V

Front Panel
Fig. 5-8 Layouts for Transistor Reset Preamplifiers.
5-28
TR-14B Transistor Reset Preamplifier Circuit Diagram
CRI R9 +18V VOUT VIN J1
R2 Q1 Amphenol
+ 1 3
17-20090
R1 C3
TR Negative 3 + R10 2
2 C1 C2 7
R3 R4 R5 R6 R7 R8 J2 SIGNAL +24V
1 OUTPUT
TP3 TP4 R11
+5V +18V Q2 +
C7
C4 R7 TP5 + CR3
VOUT VIN 4 +12V
C4 3
R2 R4 FB R12 R13 +5V 1 Q3 1
CR2 Q4 Q5 GND
2
D1 TP6 C6† +
E + R14
C5 Q6 C9
+ R47 R19 C8 R20
CR4
*
C1 R6 R15
B R18 15
TR CR5 14
+ TP7 1 7 R17 2 R21 14
R16 3 8 E2 Q 13 13 11
C3 CR6 10 8
D 2 Q8 3 E1 7 E3
JP1 Q9 12
E3
TP8 2 Q7 R22 1 4 1 C10 9
FET 6 R24 2 120µS 7
GND S +
TP2 Q1 Q2 1 Q10 3 - 4
R1 R5 CR8 5
R23 CLR Q
3 C11 C12
R26 R28 CR7 R31 +
LED- 6
+ R25 C13 2 5
Q IN R30 + 3
C2 R32 E3
R29 E3 4
D2 R33 1
R3 VOUT
C15 C16 -18V VIN

-18V + + Q11
3 2
TP1 R34 J3
1 9 5
E2 Q INHIBIT
10
INH
11 CLR Q 12
† C17
R36 3 30-
R36 300µS INH
2
*
R37 7 6
.002 FBK 1 C20
R39 5 LEAKAGE
1 R38 CURRENT
2GΩ * For 2X gain, remove jumper. (20µS Min)
R40 3 MONITOR
2
R45 +5V 9 -12V
2 6
Q IN 3
-24V
1
R42
J1
R41
J5
BIAS
C22 R43
THC C21 R44 J4
TEST
R46
†
Value of this capacitor to be determined at time of assembly.
*
denotes special component inside cryostat.
For component specifications, see TR-14B Component Layouts (page 5-31).
5-29
Preamplifiers
TR-14B Transistor Reset Preamplifier Circuit Diagram
5-30
CRI R9 +18V VOUT VIN J1
R2 Q1 Amphenol
+ 1 3
17-20090
R1 C2 C3
3 + R10 2
TR Positive 2 R4 R5 R6 C1 R8
7
R3 R7 J2 SIGNAL +24V
Preamplifiers
1 OUTPUT
R11
TP3 TP4 Q2 +
C7
JP2 -18V + CR3
VOUT VIN 4 +12V
C4 3
C4 R7 TP5 R12 R13 CR2 +5V 1 Q3 1
Q4 Q5 GND
R2 R4 FB 2
-5V D1 TP6 C6†
+ +
E R47 R14 C9
D3 C5 Q6 R19
C1 C8 R20
CR4
*
R6 R15 R18
+ 15
B TR CR5 14
+ 1 7 R17 2 R21 14
TP7 R16 3 8 E2 Q 13 13 11
C3 CR6 10 8
D 2 Q8 3 E1 7 E3
Q9 12
E3
TP8 2 Q7 R22 1 4 1 C10 9
FET 6 R24 2 120µS 7
GND S +
TP2 Q1 Q2 1 Q10 3 - 4
R1 R5 CR8 3 5
R23 CLR Q
C11 C12
XTAL R26 R28 CR7 R31 +
LED- R25 6
+ C13 2 5
Q IN JP1 R30 + 3
+3 C2 R32 E3
R29 E3 4
D2 R33 1
0
R3 VOUT
+18V -18V
C15 C16 VIN
+ + Q11
3 2
TP1 1 9 5
R34 J3
E2 Q INHIBIT
10
INH
† 11 CLR Q 12
R36 C17
30-
3
R36 300µS INH
2 * R37 7 6
C .002 FBK 1 C20
R39 5 LEAKAGE
1 R38 CURRENT
2GΩ * For 2X gain, remove jumper. (20µS Min)
R40 3 MONITOR
2
R45 +5V 9 -12V
2 6
Q IN 3
-24V
1
R42
J1
R41
J5
BIAS
C22 R43
THC C21 R44 J4
TEST
R46
†
Value of this capacitor to be determined at time of assembly.
* denotes special component inside cryostat.
For Component specifications, see TR-14B Transistor Reset Preamplifier Component Layouts (page 5-31).
TR-14B Transistor Reset Preamplifier Component Layouts

TR Positive TR Negative
TP3 TP4 -18V TP3 TP4
+5V +18V
blue green red
TP2 orange JP2
R2 orange orange TP5
Q IN TP5 TP2 orange R2
R1 Feedback Feedback
Q IN R1
Q1 JP1 Q1
C4
D1
R4
R7
D1
C4
R4
D3
R7
JP1
R6
Q2
C1
Q2
R6
TP1 red
TP1 blue
C1
+18V
-18V
D2
green TP6
D2
Emitter green TP6
Emitter
C3
R5
R3
C2
blue TP7
R5
R3
blue
C2
TP7
C3
Base Base
black
TP8 Ground TP8 black
Ground
Components
TR Positive Components TR Negative Ccomponents
DIODES RESISTORS DIODES RESISTORS

D1 IN4148 R1 2.7K D1 IN4148 R1 2.7K
D2 IN4157 R2 3.9K D2 IN4157 R2 100
D3 IN5231 R3,R6 47K R3,R6 47K
‘ R4 270K TRANSISTORS R4 270K
TRANSISTORS R5,R7 10K Q1,Q2 2N4401 R5 3.3K
Q1,Q2 2N4403 R7 10K
CAPACITORS
CAPACITORS C1,C2,C3 15, 10V
C1,C2,C3 15, 10V C4 22 pf
C4 22 pf
Main Circuit Board Components

CR1-8 IN914 values in ohms)
R1 680
IC’s R2,R11 47
E1 LM311N R3,R13,R14,R26,R41 100
E2 74LS123 R4,R5,R6,R7,R17,R22,R37 10K
E3 74LS00 R8,R29,R30,R47 1K
R12 15K
TRANSISTORS R15,R16 4.7
Q1 MC78L18CP R18 4.7K
Q2,Q4,Q5,Q7,Q9 2N4403 R19 3.9K
Q3 MC78L05 R20 47K
Q6,Q10 2N4401 R21 470
Q8 LM394 R23 33K
Q11 MC79L18CP R24 5K
R25 22K
CAPACITORS (all in µf, unless otherwise specified R28,R44 2.2K
C1,C15 47, 20V R36,R40 2.7K
C2,C4,C5,C7,C12,C16 4.7, 25V R38 6.8K
C3,C17 1.0, 50V R39 100K
C10 330 pf R45 10K
C6 To be determined R9 100, 1/4W
C8 .001 R10,R31 470, 1/4W
C9,C13 8.2, 15V R32,R33 220, 1/4W
C20 .01, 25V R34,R46 47, 1/4W
C21,C22 .002, 3kV R42 2G, 1/2W
R43 100M, 1/4W, 10%
5-31
TR-1 Transistor Reset Preamplifier Circuit Diagram
5-32
Preamplifiers
TP8
THERMISTOR
Thermistor
R1 R2
HV-OUT HV_IN
C1 C2 TP1 TP2
‘IDS’
GND GND FET
CURRENT
ADJUST
L1 R6 Q1 R8 R9
1 3
+12 V
CW
2
C3
C4
GND D7 D1
R7 C10
GND
TP3 GND
VDRAIN + 7
3 GND
+ U1
R14
6 OPAMP_OUT
AD829 PREAMP_OUT
LOW OUTPUT IMP.
2 5
- ‘VDS’ 1
- 4 FET R13
VOLTAGE GAIN
ADJUST CW
ADJUST CW 1 ‘GAIN’
C5 2 R16
2 R11
C6
GND 3
GND 3
D2
+ R15
C7
R12
TP5 GND
FEEDBACK GND
TP6 -12 V
VSUBSTRATE R19
R17 CW 1 R18
2 D3
TP7 C8 C9 ‘SUB’
FET
GND + + 3 SUBSTRATE
ADJUST
GND
(Continued)
R23 +12 V
C13 C14 +5 V
R30
GND U3
R25 R24
7 RC R31 U4
C15 5
6 Q & U4
R29 C 12 I1 &
+ 8 9 11 9 I1
U2 A 13 O1 8
2 + 10 B I2 10 O1
12 I2
5 Q2 11 CLR QN
6
LM311
OPAMP_OUT R21 C16
3 1
- - 4 GND U4
&
R22 -12 V +5 V 4 I1
O1 6
GND 5 I2
D4 D5 C11 C12
U4
GND 1 &
I1 3
R27 R26 2 I2 O1 NC1
1
CW GND
2 R28
‘RAIL’
LOWER RESET
THRESHOLD 3
ADJUST
GND R36 Q5 R39
+5 V
U3
D6 15
C17 RC R40
R35 R37 13
14 INHIBIT
C Q
1
A
2 4
GND B NC2
3 QN
CLR
R32 R38
Q3
+5 V
R34
Q4 +12 V
Q6
IN OUT
OPAMP_OUT R33
GND
TP4 C22
RESET C18 C19 C20 C21
-12 V
C23
C20 for U3
5-33
Preamplifiers
C21 for U4
5-34
(Continued)
Preamplifiers
J1
12 11
HV_IN
1 6 Q7
+24 V
2 7
IN OUT -12 V
THERMISTOR 3 8
4 9
GND
5 10
+
INHIBIT 20 19 C24
17 16
PREAMP_OUT
GND GND Q8
124 V
IN OUT -12 V
GND
C25
+
GND
TR-1 Transistor Reset Preamplifier Component Layout
DRAIN R13 R6 C3
TP3 TP2 TP1 R9
R15
yellow D6
Q1
L1 R26
R16
OUT
C23 R8
TP5 C6 GAIN C21
FDBK
R11 IDS R14

orange
C4
D7
C22
VDS
R7
GND
Q3 Q6
D1
R32
C18
Q5
TP10
RST
red
D2 R28
INH
U1 D5 R21 U4
C7
RAIL
Q4
TP8 R33 R35
R23
D4
TH
R12
R38
+24 V
R34 R27 R36 C13
C5
TP7
C8
R37 C20
R39
GND
black R19
-24 V
C9
U2 C24
C17
R18
TP6
R25
SUB
R17 SUB
GND
blue
Q7
Q2 C25
R1 U3 C16
C19
C11
TH
D3
C12 Q8
R29
R30
R24
C14
C15
C1 C2 R22 R31
R40 C10
Concord Teflon Terminal Pins
Components
DIODES INDUCTOR
D1, D4-7 1N914 L1 56mH
D2 1N5234
D3 1N5239 RESISTORS (values in ohms)
R1 2G
IC’s R2 100M
U1 AD829 R6,R8,R22,R23 100
U2 LM311 R7,R18,R26,R29,R38 10K
U3 74LS123 R9 33
U4 74HCT00 R11, R28 5K
R12 1.8K
TRANSISTORS R13, R27 2.2K
Q1, Q3, Q5 2N4403 R14, R40 75
Q2 BS170 R15 2.7K
Q4 2N4401 R16 20K
Q6 78L05 R17 100K
Q7 7812 R19 1K
Q8 79L12 R21 3.9K
R24, R33, R39 39K
CAPACITORS R25 12K
C1,C2, C23 2.2 nf R30 15K
C3 4.7µf R31 470
C4, C5, C11, C13, C20, C21 220 nf R32, R35 5.6K
C6, C22 47 pf R34, R36 8.2K
C7, C8, C9, C10, C12, C14, C19 8.2 µf R37 22K
C15 5 nf
C16 330 pf
C17 10 nf
C18, C24, C25 2.2µf
5-35
5.2.6. Replacement of PO and TR Preamplifiers

If it is necessary to replace a pulsed-optical or transistor-reset pream-
plifier, call PGT for specific instructions. The following is a guide to the
procedure.
5.2.6.1. Removal of the Old Preamplifier

Step 1. Turn off detector bias and wait at least 5 minutes.

head screws and pulling the cover off.
Step 4. There are six connections from the cryostat freedthrough

to the preamplifier. A green wire connects the HV
feedthrough with the HV line. Red, black, purple, yellow
and white wires go from the 7-pin feedthrough to special
pins on the preamplifier in that order (see Fig. 5-7 or Fig.
5-8, as appropriate). Unsolder these wires at the pream-
plifier end.
Step 5. Remove the old preamp from the cryostat by unscrewing

the two socket-head 5-40 screws, using the wrench pro-
vided.
Step 6. Remove the saddle block from the old preamplifier by un-
screwing the two socket-head 4-40 screws, using the
same wrench.
NOTE: In some cases, for example, with elbow (ED) cry-

ostats, the saddle block is not screwed only the preampli-
fier. In such a case, the bottom plate of the preamplifier
has to be changed.
5.2.6.2. Mounting the New Preamplifier

Step 1. Screw the saddle block onto the new preamplifier.
Step 2. Screw the preamplifier onto the cryostat.
Step 3. Resolder the wires: the green wire to the HV post and the
red, black, violet, yellow and white to the pins on the
preamplifier in that order. (Again, see the appropriate Fig.
5-7 or Fig. 5-8 for your system.)
NOTE: To maintain the smallest noise possible, the set-

ting of the FET-current-adjust potentiometer can be opti-
mized. This can be done only while the preamp cover is
off.
5-36
CAUTION: Optimization must be done with the HV on.

Use an insulated screw driver to adjust the FET to avoid
accidentally shorting the HV. Serious damage to the
preamplifier could result. Use low power high voltage sup-
plies to prevent dangerous electric shock.
Another approach is to set the FET-current-adjust poten-

tiometer to the same position as in the old preamp.
Step 4. Replace the cover on the preamplifier and fasten the

screws.
5-37
5-38
Section 6
6
Troubleshooting
PGT Detector Systems Troubleshooting
6.1: Maintenance
All PGT high-purity (intrinsic) germanium and lithium-drifted silicon de-

tectors may be cycled between room temperature and liquid nitrogen
temperature as needed. Temperature cyclability is warranted for a pe-
riod of one year.
For a system in frequent use, however, a regular filling schedule should

be followed and unscheduled warm-ups avoided. This procedure re-
duces the probability that a high-voltage bias might accidentally be ap-
plied to a detector which is not fully cold, thus causing serious damage.
It also ensures that the detector is always stabilized and ready for use.
Regular filling will also make any unusual increase in liquid nitrogen use
readily apparent. An excessive LN2 loss rate may be indicative of a vac-
uum problem in the cryostat or dewar.
It is normal for the cryostat to be cold and wet when in an open area at
low temperature and high humidity. However, the condensed water
should soon evaporate when the cryostat is brought to normal ambient
temperature (20°C). A cold, wet cryostat at room temperature may in-
dicate a vacuum leak. If that is the case, DO NOT TRY TO OPERATE
THE DETECTOR. CONTACT PGT.
6.1.1. Liquid Nitrogen Monitor

Protection against accidental detector warm up can be provided by use
of an LN2 level sensor and/or leakage current monitor, which are avail-
able with their compatible high-voltage bias supplies (e.g., PGT 315LN
for Ge detectors and PGT 316LN for Si(Li) and small-to-medium Ge
planars). These devices activate an alarm and high voltage shut-off if
the LN2 in the dewar drops below a safe level (1/4 full). After the high
voltage has been shut off automatically in this way, the bias supply
switch should be turned off until the dewar has been filled with LN2 and
the system completely cooled according to the recommended proce-
dures.
6.1.2. Neutron Damage

PGT N-type Ge detectors can withstand neutron flux to a much greater
degree than can conventional P-type coaxial detectors, and they are
the detectors most commonly used for high energy work. However, a
sustained high flux of fast neutrons or high energy charged particles will
result in neutron damage, even in N-type detectors.
Neutron damage results in low-side tailing on higher energy peaks as

a result of charge carrier trapping by traps created in the crystal. The
first indication of neutron damage is noticeable degradation of resolu-
tion above 1 MeV, with little degradation below 200 keV. The system
noise, as indicated by the FWHM of a precision pulse-generated peak,
will be unchanged by neutron damage.
6-3
Troubleshooting PGT Detector Systems
log Counts
Energy (MeV)
Fig. 6-1 Tailing (indicated by arrows) on the low-energy side of

1.17 MeV and 1.33 MeV photopeaks due to radiation damage.
To delay repair and get significant additional use from an N-type detec-
tor which shows evidence of neutron damage, observe the following
precautions:
1. Never warm up an N-type detector to room temperature if

it shows signs of neutron damage or if it may have been ex-
posed to fast neutrons. Warming up a neutron-damaged
detector will result in significant resolution degradation.
2. Once the neutron damage process has started, switching

the bias voltage off and on again shows a temporary dra-
matic deterioration of the energy resolution. This poor per-
formance can be improved by simply keeping the detector
on bias for a few hours with a weak (1-10 µCi) gamma ray
source (such as 137Cs or 60Co) facing the endcap.
When unacceptable degradation has occurred, PGT can repair the de-
tector promptly. An annealing kit is also available (see “Annealable De-
tectors” on page 4-14.
6-4
6.2: Fault
Diagnosis
Each PGT detector is guaranteed to meet all of the ordered perfor-
mance specifications. If there appears to be a problem with the system,
use the following troubleshooting procedures to identify and eliminate
the problem.
It is important to determine accurately where the problem lies, since this

can make the difference between correcting the difficulty in the field or
having to return the detector to PGT for repair.
The following pages describe various faults, their possible causes, and
some remedial steps to take.
As a first step, always thoroughly check the main amplifier, cables, and
multichannel analyzer (MCA) independently of the detector in which a
fault is suspected. If possible, do this with another detector or with a
pulser unit.
Refer to the proper set-up instructions in Section 3 for your particular

preamp:
“Germanium Detectors with RG-11, RG-15 or 352 Preamplifi-
ers” on page 3-3
“Germanium Detectors with PO-12, PO-14 or TR-14 Preampli-
fiers” on page 3-9
6.2.1. Resistive Feedback Preamplifier Detectors

Connect the preamplifier output to the input of the main amplifier and
the pulse generator output to the test input of the preamplifier. Connect
an oscilloscope and a pulse height analyzer to the unipolar output of the
main amplifier. Connect a voltmeter between the test point and ground.
Then check performance.
If the problem is poor gamma resolution, use an oscilloscope (20 mV/

cm vertical gain) to observe the output with no radioactive source
present. Some nuclear pulses will still be seen. It is not abnormal to
have occasional negative spikes or overload pulses followed by nega-
tive excursions. Carefully observe the nature of any other pulses or os-
cillations. The resolution obtained from a pulse generator spectrum is
used as a measure of the noise of the system. A knowledge of the sys-
tem resolution at both lower and higher energies is also required. Res-
olution should be measured with 0.2 keV/channel at 1.33 MeV and with
~0.06 keV/channel at 122 keV for best results. After making these ob-
servations and measurements, consult the troubleshooting guide.
IMPORTANT: Before making any resistance measurements on the

preamplifier or cryostat, always turn the high voltage to zero. Wait 5
minutes, and then remove both the HV cable (SHV) and the power ca-
ble (Amphenol).
For symptoms involving “poor resolution” or “peak shifts,” testing

should generally be carried out with no HV or preamp power unless oth-
erwise specified.
6-5
Table 6-1: Troubleshooting Guide for 352, RG-11 and RG-15 Preamplifier Detectors
Symptoms Probable Cause Suggested Action

1. Pulse height analyzer Pulse height analyzer Use an oscilloscope to examine the signal going to the ADC.
(MCA) does not register any not receiving any If no pulses are present, see items 3-6 below.
counts. pulses.
MCA controls improp- If pulses are present at the input, see the MCA manual and
erly set. Possible check the control settings. Be sure that the amplifier output
improper amplifier set- is positive. You may be misled if the oscilloscope is acciden-
ting. tally set to “invert.”
2. MCA registers Pulses corresponding Use an oscilloscope to examine the signal which is going to
background counts, but no to spectral peaks have the MCA. Adjust the amplifier gain to achieve pulse heights
peaks are visible. voltage heights out- within the input range of the MCA. (Make sure that you know
side the range of the this range, which may change with MCA settings, e.g., digital
pulse height analyzer. offset or conversion gain.)
3. No amplifier output for Amplifier not receiving Check preamplifier output with the oscilloscope set on 50
gamma ray source or pulse pulses. mV/cm vertical gain. If no output, see items 4 and 5.
generator.
Amplifier faulty or Check amplifier settings and connections. Consult the ampli-
maladjusted; faulty fier manual. Replace the amplifier, if necessary. Replace
cables. cable set or check for continuity, including preamp power
cables.
4. No preamplifier output at Excessive detector Decrease detector bias in steps of 100 V until output pulses
recommended bias leakage current bias- are obtained. If the detector does not perform properly at a
voltages. ing off the preamplifier lower bias and the following results are observed, contact
input stage. PGT:
RG-11 or RG-15: Test point normal with zero HV, but
+24 V at higher HV
5. No preamplifier output at Power failure. Correct power supply or cable problems.

any detector bias voltage; RG-11 or RG-15: Noise level will be high (1000 mV) and
the base line is virtually flat. test point does not swing when HV is increased.
Blown input FET or Contact PGT if any of the following is true:

short inside cryostat. With no HV applied, RG-11 or RG-15 test point is ±24 V.
Amplifier output noise with 100× gain is <5 mV.
With no HV applied and the power cable removed, FET

source-drain resistance is not 20-40 ohms.
For IGC (or older model Li-drifted Ge coaxials),

resistance from the HV feedthrough to ground is not
infinity in both directions.
For IGP, NIGC and Si(Li) only, with no HV applied and

preamplifier power removed, the resistance from the HV
vacuum feedthrough to ground is infinity in both directions
and, with preamplifier power reconnected, a test pulse
input results in no pulse at the preamplifier output.
6-6

Preamplifier failure. For RG-11 or RG-15 ONLY:
After checking voltage from the Amphenol power cable,
turn down the HV to zero and apply preamp power. If the
voltage across the FET source-drain is 0, ±12, or ±24 V,
REPLACE THE PREAMPLIFIER.
(Instructions in Secs. 5.2.2. and 5.2.2.)
Other checks:
IGC TP voltage: +23.3 V = blown FET
-23.3 V = high LC
-23.3 V @ 0 V bias = RF shorted
0 V @ all bias = RF shorted,
TP not connected, or
FB not connected, or
no PA power
IGP, NIGP, or NIGC: same, but with opposite polarities.
6. Poor gamma ray resolu- Microphonics Place the system dewar on a foam pad if vibrations through
tion. High noise (pulser res- the floor are a problem. Arrange other suitable shock mount-
olution). 100-10000 Hz base ing. Try using a shorter time constant. If a shorter time con-
oscillations can be easily stant is used, do not forget to readjust the P/Z.
induced or made much
worse by nearby noise or by
tapping the cryostat lightly.
Such oscillations persist in
response to normal room
noise and vibrations. Oscil-
lations may disappear if HV
or MCA is disconnected.
7. Poor gamma ray resolu- Faulty voltage bias Turn HV to zero (0), wait 5 mins., then thoroughly clean (with
tion and high noise; spark- supply or cable. ethanol) the HV parts in the preamp. Resolder HV joints if
ing/highvoltage noise; Humidity on HV line in any sharp points are evident. Avoid humid atmosphere.
negative pulses; test point or preamp. Breakdown of Check HV supply unit and cable. Call PGT if problem per-
reset rate unstable. filter capacitor or HV sists.
feedthrough.
8. Poor gamma ray resolu- Power line noise, RF Eliminate AC power line noise by isolation or filtration. Check
tion and high noise; 20 kHz pickup, ground loop ground connections in preamplifier; avoid grounding cryo-
oscillation at main amplifier stat/dewar; loop HV cable through ferrite ring; ground MCA
output which may disappear to NIM chassis.
if HV or MCA is discon-
nected.
9. Poor gamma ray resolu- Breakdown across the Be sure that the bias voltage is not more than specified.
tion and high noise. A very surface of the detector Reduce detector bias in steps of 100 V until base line
ragged base line with one or or an insulator returns to normal. If the system meets all performance
more of the following types requirements, it may be usable at the lower bias. If not, con-
of anomalous pulses: tact PGT. In addition, lower shaping time may be used.
positive spikes,
negative spikes,
square-shaped positive
and negative pulses
6-7

10. Poor gamma ray resolu- Excess detector leak- Same as for Item 9.
tion. No unusual pulses, but age current.
a wide base line and higher Be sure that the specified bias is used. Check HV bias sup-
noise. Insufficient bias volt- ply for proper connections and operation. Try another bias
age. supply. Check the bias supply manual.
11. Poor gamma ray resolu- Neutron (or similar If the detector is warmed up, the resolution will get much
tion at 1.33 MeV or higher radiation) damage worse. DO NOT WARM UP THE DETECTOR. Neutron dam-
energy. Normal noise as age can be repaired. Call PGT.
measured by pulse genera-
tor resolution. Resolution at
122 keV or lower energy is
much less degraded than at
higher energy.
12. Low- or high-energy tail- Incorrect P/Z cancella- See appropriate section on detector installation and optimi-
ing and poor resolution. tion zation.
13. Wandering peaks or Unstable electronics Check each electronic component for proper operation.
multiple peaks observed. (especially main ampli- Repair or replace faulty units. Check all cables and connec-
fier) tors (including panel connectors) for intermittent signal or
ground connections.
14. High loss rate of liquid Degradation of cryo- Measure LN2 loss rate by weighing (0.807 kg/liter). For an
nitrogen. Excessively cold stat vacuum accurate measurement, the dewar must not be moved dur-
cryostat with moisture con- ing the 2 hrs. before the initial measurement until after the
densation; increase in leak- final measurement. The normal LN2 loss rate depends on
age current. cryostat/dewar configuration. For most systems, a loss rate
of >2 liters/day is excessive. For a dipstick system, the dewar
loss rate may be subtracted from the system loss rate (which
should not be >1.5 liters/day).
15. High loss rate of liquid Degradation of dewar Check system loss rate as in item #14. If cryostat is a dip-
nitrogen. Excessively cold vacuum stick model, place it in another dewar and measure the
dewar with moisture conden- dewar loss rate alone. Place a stopper in the white Teflon
sation. Cryostat temperature collar and measure the loss by weighing (as in item #14). A
normal. 32-liter dewar with a collar assembly should have a loss rate
<0.7 liter/day.
Note: Instructions for replacing resistive feedback preamplifiers are given in Secs. 5.2.2. and 5.2.3.
6-8
6.2.2. Pulsed Optical or Transistor Reset Detectors

Set up the test system as described for “Germanium Detectors with PO-
12, PO-14 or TR-14 Preamplifiers” on page 3-9.
Instructions for replacing the preamplifiers are given in Sec. 5.2.6.
Table 6-2: Troubleshooting Guide for Pulsed Optical and Transistor Reset Preamplifier
Detectors

1. Pulse height analyzer Pulse height analyzer Use an oscilloscope to examine the signal going to the ADC.
(MCA) does not register any not receiving any If no pulses are present, see items 3-6 below.
counts. pulses.
MCA controls improp- If pulses are present at the input, see the MCA manual and
erly set. Possible check the control settings. Be sure that the amplifier output
improper amplifier set- is positive. You may be misled if the oscilloscope is acciden-
ting. tally set to “invert.”
2. MCA registers Pulses corresponding Use an oscilloscope to examine the signal which is going to
background counts, but no to spectral peaks have the MCA. Adjust the amplifier gain to achieve pulse heights
peaks are visible. voltage heights out- within the input range of the MCA. (Make sure that you know
side the range of the this range, which may change with MCA settings, e.g., digital
pulse height analyzer. offset or conversion gain.)
3. No amplifier output for Amplifier not receiving Check preamplifier output with the oscilloscope set on 2V/
gamma ray source or pulse pulses. cm vertical gain. Observe reset at 50 mV/cm. Observe steps
generator. on ramp. If no output, see items 4 and 5.
Amplifier faulty or Check amplifier settings and connections. Consult the ampli-
maladjusted; faulty fier manual. Replace the amplifier, if necessary. Replace
cables. cable set or check for continuity, including preamp power
cables.
4. No preamplifier output at Excessive detector Decrease detector bias in steps of 100 V until output pulses
recommended bias leakage current bias- are obtained. If the detector does not perform properly at a
voltages. ing off the preamplifier lower bias and the following results are observed, contact
No reset output. input stage. PGT:
(dc level positive for N-type PO-12 or PO-14: Reset normal at 50-100 V HV, but
and planar detectors; extremely fast if HV is increased and the DC level
negative for P-types) reaches +12 V. Test pulse gives signal at zero HV.
5. No preamplifier output at Power failure. Correct power supply or cable problems.

any detector bias voltage; PO-12 or PO-14: DC output of preamp for all HV levels is
the base line is virtually flat. at -10 V for N-type and planar detectors and at +10 V
for P-types. Check the HV unit and cables; turn the
HV to zero, disconnect power to the preamp, wait,
and then resolder voltage joints in the preamp if
broken.
6-9
Detectors

Blown input FET or Contact PGT if any of the following is true:
short inside cryostat. PO-12 or PO-14 output is 0 or -10 V for N-type and planar
detectors or 0 or +10 V for P-types, even when bias is
applied (100 V is sufficient for test purposes).
or
PO-12 or PO-14 output is +10 V for N-type and planar
detectors or -10 V for P-types, with no HV applied, even
when the HV supply has been turned off for several
minutes.
With no HV applied and the power cable removed, FET

source-drain resistance is not 20-40 ohms.
Preamplifier failure. For PO-12, PO-14, or TR-14, CALL PGT.

Also see replacement instructions in Sec. 5.2.6.
6. Poor gamma ray resolu- Microphonics Place the system dewar on a foam pad if vibrations through
tion. High noise (pulser res- the floor are a problem. Arrange other suitable shock mount-
olution). 100-10000 Hz base ing. Try using a shorter time constant. Try the high restorer
oscillations observed on the mode, if available.
amplifier can be easily
induced or made much
worse by nearby noise or by
tapping the cryostat lightly.
Such oscillations persist in
response to normal room
noise and vibrations. Oscil-
lations may disappear if HV
or MCA is disconnected.
7. Poor gamma ray resolu- Faulty voltage bias Turn HV to zero (0), wait 5 mins., then thoroughly clean (with
tion and high noise; spark- supply or cable. ethanol) the HV parts in the preamp. Resolder HV joints if
ing/highvoltage noise; Humidity on HV line in any sharp points are evident. Avoid humid atmosphere.
negative pulses; test point or preamp. Breakdown of Check HV supply unit and cable. Call PGT if problem per-
reset rate unstable. filter capacitor or HV sists.
feedthrough.
8. Poor gamma ray resolu- Power line noise, RF Eliminate AC power line noise by isolation or filtration. Check
tion and high noise; 20 kHz pickup, ground loop ground connections in preamplifier; avoid grounding cryo-
oscillation at main amplifier stat/dewar; loop HV cable through ferrite ring; ground MCA
output which may disappear to NIM chassis.
if HV or MCA is discon-
nected.
9. Poor gamma ray resolu- Breakdown across the Be sure that the bias voltage is not more than specified.
tion and high noise. A very surface of the detector Reduce detector bias in steps of 100 V until base line
ragged base line with one or or an insulator returns to normal. If the system meets all performance
more of the following types requirements, it may be usable at the lower bias. If not, con-
of anomalous pulses tact PGT. In addition, lower shaping time may be used.
observed on the amplifier:
positive spikes,
negative spikes,
square-shaped positive
and negative pulses
6-10
Detectors

10. Poor gamma ray resolu- Excess detector leak- Same as for Item 9.
tion. No unusual pulses, but age current.
a wide base line and higher Be sure that the specified bias is used. Check HV bias sup-
noise observed on the Insufficient bias volt- ply for proper connections and operation. Try another bias
amplifier. age. supply. Check the bias supply manual.
11. Poor gamma ray resolu- Neutron (or similar If the detector is warmed up, the resolution will get much
tion at 1.33 MeV or higher radiation) damage worse. DO NOT WARM UP THE DETECTOR. Neutron dam-
energy. Normal noise as age can be repaired. Call PGT.
measured by pulse genera-
tor resolution. Resolution at
122 keV or lower energy is
much less degraded than at
higher energy.
12. Low- or high-energy tail- Incorrect P/Z cancella- See appropriate section on detector installation and optimi-
ing and poor resolution. tion zation.
13. Wandering peaks or Unstable electronics Check each electronic component for proper operation.
multiple peaks observed. (especially switches on Repair or replace faulty units. Check all cables and connec-
the main amplifier) tors (including panel connectors) for intermittent signal or
ground connections.
14. High loss rate of liquid Degradation of cryo- Measure LN2 loss rate by weighing (0.807 kg/liter). For an
nitrogen. Excessively cold stat vacuum accurate measurement, the dewar must not be moved from
cryostat with moisture con- 2 hrs. before the initial measurement until after the final mea-
densation; increase in leak- surement. The normal LN2 loss rate depends on cryostat/
age current. dewar configuration. For most systems, a loss rate of
>2 liters/day is excessive. For a dipstick system, the dewar
loss rate may be subtracted from the system loss rate (which
should not be >1.5 liters/day).
15. High loss rate of liquid Degradation of dewar Check system loss rate as in item #14. If cryostat is a dip-
nitrogen. Excessively cold vacuum stick model, place it in another dewar and measure the
dewar with moisture conden- dewar loss rate alone. Place a stopper in the white Teflon
sation. Cryostat temperature collar and measure the loss by weighing (as in item #14). A
normal. 32-liter dewar with a collar assembly should have a loss rate
<0.7 liter/day.
6-11
6-12
Section 7
Warranties
Return Instructions 7
PGT Detector Systems Warranty
7.1: HPGe
Detector
Warranty
Princeton Gamma-Tech, Inc. guarantees that its HPGe (Intrinsic Ger-
manium) Detectors are free from all defects in materials and workman-
ship and they will not fail in service for a period of one year after
delivery, provided they are properly cared for.
It is the responsibility of the user of this instrument to be certain that it

is not mistreated physically. Mechanical shock can cause internal dam-
age. Intrinsic germanium detectors requiring beryllium entrance win-
dows are delivered with a protective cover for the end cap. The
beryllium window is very fragile, and its accidental breakage is not cov-
ered by this warranty.
This warranty expressly covers any damage or deterioration that may

be caused by warm-ups or by temperature cycling of the detector. PGT
guarantees that the detector will not fail to meet its published specifica-
tions due to repeated or prolonged warm-up to room temperature dur-
ing its warranty period.
The detector should be inspected immediately after delivery to ensure

that no shipping damage has occurred. The packing method should be
carefully noted and all packing materials saved for possible future use,
in case factory service is required. The dewar should be filled with
liquid nitrogen immediately in order to determine if the integrity of the
detector and cryostat has been maintained. The cooling time for each
detector is stated on the special label attached to the unit. Bias voltage
should NOT be applied to the detector until this length of time has fully
transpired.
If shipping damage has occurred, either visible or concealed within the

cryostat, please notify the carrier immediately, and request a “Dam-
aged Shipment Inspection.” Save the shipping container, packaging
and other documentation to support your claim. PGT must be notified
of shipping damage via telephone, fax, telex, or cable. If a damaged
shipment must be returned for repair, please await PGT authorization
and instructions, and follow them carefully.
7-3
Warranty PGT Detector Systems
7.2: Si(Li) Detector

Warranty
Princeton Gamma Tech, Inc. guarantees that its Lithium-Drifted Silicon

[Si(Li)] detectors are free from all defects in materials and workmanship
and will not fail in service for a period of one year after delivery,
provided they are properly cared for.
It is the responsibility of the user of this instrument to be certain that it

is not mistreated physically. Mechanical shock can cause internal
damage. Si(Li) Detectors with beryllium or thin film entrance windows
are delivered with protective covers for the end cap. These beryllium
and thin-film windows are very fragile and their accidental breakage is
not covered by this warranty.
This warranty expressly covers any damage or deterioration that may

be caused by warm-ups or by temperature cycling of the detector. PGT
guarantees that the detector will not fail to meet its published
specifications due to repeated or prolonged warm-ups to room
temperature during its warranty period.
The detector should be inspected immediately after delivery to ensure

that no shipping damage has occurred. The packing method should be
carefully noted and all packing materials saved for possible future use,
in case factory service is required. The dewar should be filled with liquid
nitrogen immediately in order to determine if the integrity of the detector
and cryostat has been maintained. The cooling time for each detector
is stated on the special label attached to the unit. Bias voltage should
NOT be applied to the detector until this length of time has fully
transpired.
If shipping damage has occurred, either visible or concealed within the

cryostat, please notify the carrier immediately, and request a
“Damaged Shipment Inspection.” Save the shipping container,
packaging and other documentation to support your claim. PGT must
be notified of shipping damage via telephone, fax, telex, or cable. If a
damaged shipment must be returned for repair, please await PGT
authorization and instructions, and follow them carefully.
7-4
7.3: Detector
Repair
Warranty
Princeton Gamma-Tech guarantees that the specific repairs done on
the HPGe detectors will not fail in service for 90 days, provided the de-
tectors are stored properly, are kept at all times at liquid nitrogen tem-
peratures, with bias applied, and are not subjected to doses of fast neutrons
or other damaging radiation. It is the customers responsibility to monitor the
LN 2 level continuously.
Detectors which fail under warranty should be returned by airfreight

prepaid, and PGT is to be notified in advance of the airline routing and
the airbill number. Shipments must be made on Monday or Tuesday to
avoid weekend delays in transit.
When the detector is first received, please note carefully the packing
method and save the packing materials for possible future use. The
shipping containers are specifically designed to protect the crystal from
damage due to rough handling.
Non-Warranty Repair Policy

The service repair charge for germ anium and silicon detectors includes
all needed minor electrical and mechanica l parts. If any significant re-
placement parts are required, a quotation will be tendered for approval
before any additional work is carried out. Examples of significant parts
include certain selected FETs, preamplifier body, internal or external
cryostat subassemblies, and dewars. Replacement crystals are quoted
on an individual basis.
Transportation of detectors to and from PGT for repairs will be charged

to the account of the detector owner.
There is a 90-day warranty on the specific repairs made. Transporta-

tion costs for warranty repairs will be borne one way by PGT.
Princeton Gamma-Tech also offers an extended repair warranty pro-

gram. Please contact PGT for details.
7-5
7.4: Packing
Instructions
If for any reason it becomes necessary to return a photon detector sys-
tem for repair or replacement, please note the following instructions
and precautions regarding shipment.
1. Contact PGT Nuclear Repair Department at (609) 924-7310 for

specific instructions and authorization for returning the detector.
2. Proper packing. A detector “return kit” must be utilized for return

shipment. This kit contains the necessary instructions and material
to ensure proper packing. If you are unfamiliar with packing a de-
tector, or do not have a return kit, please contact PGT for assis-
tance. Poor packing could result in shipment damage that would not
be covered under the PGT warranty or the freight forwarder’s insur-
ance policy.
Shipment coordination and communication . Detectors should be

returned through the freight forwarder PREPAID. For non-warranty
repairs, the reshipment charges from PGT will be collect. For war-
ranty repairs, reshipment charges from the factory will be paid by
PGT. Should a detector system returned to PGT be found to be op-
erating within specifications, the customer will be charged an in-
spection fee and be responsible for freight charges to and from the
factory, whether in warranty or out of warranty. Weekend delays in
transit should be avoided. Therefore, an early weekday shipment is
recomended. PGT must be notified of specific details of the re-
turning shipment, i.e., freight forwarder, airbill number, date of ship-
ment, etc., at the time of shipment to ensure attention upon receipt
at the factory.
Although temperature-cyclable detectors can obviously be shipped
at room temperature without LN , it is not recommended for those
2
detectors which have been, or may have been, subjected to neu-
tron damage. Consult PGT for further instructions.
The instructions and precautions stated here are to ensure proper at-
tention in handling shipment of an expensive radiation detector. Do not
be apprehensive because of these precautions; detectors are success-
fully shipped all over the world when proper care is exercised.
7-6
The shipping address is
PGT, Inc.
Attn: Nuclear Repair

1026 Route 518
Rocky Hill, NJ 08553
When in doubt regarding any of the foregoing instructions, please con-

tact PGT for assistance.
7-7
7-8
PGT Detector Systems Index
Index
Numerics resolution
352 preamplifier, see preamplifiers count rate effects 5-11
resistive feedback selection criteria 1-3
temperature cyclability 4-13
A types 4-3
annealable detectors 4-14
E
B efficiency 4-6, 4-12
beryllium window energy resolution 4-9
precautions 2-14
rupture 2-14 F
Full Width at Half Maximum, see FWHM
C FWHM
circuit diagrams 5-14–5-31 determination 3-16
Compton scattering 4-4
counting efficiency 4-7 I
internal pressure build-up 2-14
D intrinsic germanium 4-3
detector
cool down 3-3, 3-9 L
incomplete cool-down 2-13 liquid nitrogen
partial warm up 2-13 filling bucket dewars 2-10
detector calibration filling dipstick dewars 2-8
manual 3-15 filling portable cryostats 2-11
detector specifications gravity-fed portables 2-12
measurement 3-14 safety precautions 2-7
resolution 3-17 liquid nitrogen monitor 6-3
detectors low background systems 1-5
annealing 4-14
crystal geometries 4-3 M
performance parameters main amplifier
efficiency 4-6 pole zero cancellation 3-6
energy resolution 4-9 reset pulses 3-12
noise contributions 4-10 shaping time 5-6
peak-to-background ratio 4-10 Marinelli reentrant beaker
peak-to-Compton ratio 4-10 efficiency 4-13
timing resolution 4-11 maximum energy rate 5-5
photon interactions 4-4 MCA, see multichannel analyzer
i
Index PGT Detector Systems
microphonics 1-5 RG-15 circuit diagram 5-16

multichannel analyzer component layout 5-17
calibration 3-14
S
N shaping time
negative bias detectors ballistic deficit 5-10
preamp output 3-11 effect on resolution 5-7
neutron flux damage 6-3
noise 4-10 T
timing resolution 4-11
P TR-14B circuit diagrams 5-29, 5-30
pair production 4-5 Tr-14B circuit diagrams
photoelectric effect 4-4 component layouts 5-31
photon interactions 4-4
Compton scattering 4-4 U
pair production 4-5 ultra-low microphonics system 1-5
photoelectric effect 4-4
PO-12 circuit diagram 5-26 V
component layout 5-27 Vespel window
PO-14B circuit diagram 5-24 precautions 2-14
component layout 5-25, 5-35
Preamp model 352 W
circuit diagram 5-18 well detectors
component layout 5-19 efficiency 4-12
preamplifiers penetration 2-14
maximum count rate 5-5
noise effects 5-6
performance parameters 5-3
pulsed optical & transistor reset 3-9
cable connections 3-10
circuit diagrams 5-24–5-31
replacement 5-36
reset time 5-12
set-up procedures 3-10
pulsed optical and transistor reset
reset time 5-4
resistive feedback 5-20
cable connections 3-4
circuit diagrams 5-14–5-19
maximum energy rate 5-5
pole zero 3-7
reset time 5-4
set-up procedure 3-4
system optimization 5-21
R
replacement 5-20
resolution
count rate 5-11
RG-11 circuit diagram 5-14
component layout 5-15
RG-11 preamplifier, see preamplifiers
resistive feedback
ii

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Detector User Manual

Gamma and X-ray

PRINCETON GAMMA-TECH INSTRUMENTS, INC.

Part No. 2061-0100

Edited by Marie L. Kuszewski.

Table 1-1 PGT Gamma and X-ray Detectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4

Please read the following information and the

READ THE SAFETY PRECAUTIONS FOR HANDLING LIQUID

CATASTROPHIC VACUUM FAILURE MAY LEAD TO OVER-

NIGC n-type high-purity P+

IGW p-type high purity 10 keV- 122 keV: 50-120 cm3

IGC p-type high purity N+ * 40 keV- 122 keV: 5-100% Peak:Compton

NIGP n-type high purity * 3 keV- 5.9 keV: 200-3800 mm2

IGP p-type high-purity * 180 eV- 5.9 keV: 25-2000 mm2

Si(Li) Lithium-drifted P+ * 109 eV- 5.9 keV: 10-70 mm2

* Incident Radiation p-type crystal

Detector Type Window Options Preamp Options Preamp Types

High-purity germanium beryllium RG 11 resistive feedback External

Lithium-drifted silicon beryllium PO-14B pulsed optical External

Princeton Gamma Tech high-purity germanium and lithium-drifted

The dewar serves as a reservoir of liquid nitrogen (LN2), while the

1.1.1. Available Detector Types

P-type Intrinsic Germanium Planar Detectors are rugged in

1.1.2. Choosing the Right Detector

1.1.2.1. Energy Range

1.1.2.3. Energy Resolution

1.1.2.4. Other Parameters

1.1.3. Special Options

1.1.3.1. “Quiet Ones” Ultra-Low Microphonics

Microphonic deterioration of signals will appear on the MCA as a broad-

PGT has developed an ultra-low microphonics system, THE QUIET

1.1.3.2. Low Background Systems

Table 2-1: Dipstick Dewar/Cryostat Standard Configurations

Standard Dewar Offset Dewar

Vertical Dipstick (SD)

end Coaxial Germanium Endcap Planar Germanium Endcap

Coaxial In-line (SDIL) 90° Coaxial In-line (EDIL)

fill tube Standard Dewar

Elbow Dipstick (ED)

preamp Coaxial Ge Endcap Planar Ge Endcap Planar Si(Li) Endcap

Anti-Compton Dipstick (ACD or ACD-DN)

preamp endcap Coaxial Ge endcap

Standard or Offset Dewar

Table 2-2: Unitary Cryostats

Coaxial Downlooking (DT) and Horizontal (HT) Cryostats

Coaxial Ge Endcap Dewar volumes

Planar Down-looking (DT) and Horizontal (HT)Cryostats

Planar Ge Endcap Si(Li) Endcap Dewar volumes

Low Background Cryostat (NPR)

Coaxial Ge Endcap Planar Ge Endcap Dewar volumes

Swivel Head Low Background (SNPR) or Cryoflex Cryostats

406 mm (16”) std.

Table 2-3: Portable Unitary Cryostats

Multipurpose Portable (MPS) Portable Gravity-Fed (GF) Cryostats

Coaxial Ge Endcap Coaxial Ge Endcap

In-Vivo Lung Monitor (DTIL)

In addition to personal injury resulting from exposure to a high-pressure

Although nitrogen gas is non-toxic, it can cause asphyxiation by dis-

Piping or transfer lines should always be constructed so as to avoid

2.3.1. Dipstick Cryostat Models

LN2 level gauge

Transfer line Hub

0-30# pressure valve