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Confidential
MEW Confidential

Characteristics Evaluation Report

Halogen-free
Printed Circuit Board material series

Glass Epoxy Multi-layer material

L a m i n a t e ：R-1566
P r e p r e g ：R-1551
Jun 18, 2002
Matsushita Electric Works, Ltd.
Electronic Materials Division
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Contents
Ｃｏｎｔｅｎｔｓ MEW Confidential

■ Need for HF material and its definition P 3

■ Features P 4
■ Heat resistance P 5～7
Hygroscopic solder heat resistance,
Reflow heat resistance
Heat resistance
■ Physical characteristics P 8～9
Internal layer’s peel strength
Evolved gas analysis
■ Electric characteristics P 10～14
Dielectric characteristics
CAF resistance
Reliability of plated through hole
■ Processability P 15～17
Drilling processability
Punching quality
Molding condition
■ General characteristics, Specifications P 18～22
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1. Need for halogen-free material
and its definition
MEW Confidential

Need for
Glass Epoxy
Multi-layer material
Reliability
Environmental equivalent to or
measure①
better than FR-4
Achievement of
94V-0 by halogen-
free & antimony-
free measures Environmental measure② Processability
Measure by lead-free soldering equivalent to FR-4
(Improvement of heat resistance)
◆Definition of “halogen-free
By Japan Printed Circuit Association (JPCA-ES-01-1999)
Percentage content of halogen compound
Definition by Our halogen-free epoxy
Japan Printed Circuit Association R-1566
Chlorine(Cl) Not more than 0.09 wt% 0.037 wt%
Bromine (Br) Not more than 0.09 wt% Not yet detected
* Method of measurement: Ion chromatography
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2. Features of halogen-free
Glass Epoxy Multi-layer material MEW Confidential

Achievement of UL94V-0 by
halogen-free & antimony-free measures
①Measure by lead-free soldering
②Excellent heat resistance (T-288).
③Excellent internal layer’s peel strength.
④ Excellent tracking resistance. (CTI 500V)
⑤Zero (0) emission of harmful gas, such as aniline, etc.
⑥Punching quality is equivalent to our standard FR-4.
⑦Secondary laminate’s molding conditions, such as
molding time, molding temperature, molding
pressure, etc. are equivalent to our standard FR-4.
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3-（1） solder heat resistance
after water absorption MEW Confidential

Equivalent to standard FR-4

■Evaluation result ■Evaluation sample
H alogen-free epoxy
C ondition O ur standard FR -4
R -1566
Cu：18μm
Therm al Floating for 10 seconds N o blister after N o blister after
shock at 260℃ 10 cycles 10 cycles PP：0.2㎜
test Core
Floating for 10 seconds N o blister after N o blister after ：0.2㎜
material 35/35μ
at 288℃ 10 cycles 10 cycles
PP：0.2㎜
N o blister after N o blister after Cu：18μm
Floating Floating at 260℃
300 secon 300 secon
test
N o blister after N o blister after
Floating at 288℃
300 secon 300 secon Internal layer’s
treatment
D ipping D -X /100 + 260℃, N o blister after N o blister after : B/O
test D ipping for 30 4 hr 4 hr
Internal layer’s
pattern
: Grid pattern
at the remaining
The above data are our actual values and not assured values.
copper ratio of 50%
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3-（2） Reflow heat resistance

MEW Confidential

Equivalent to standard FR-4

■Evaluation result
Halogen-free epoxy
Treatment condition for multi-layer Our standard FR-4
（R-1566/R-1551）
〔C-96/40/90 + reflow (280℃）〕 ×1 No blister No blister

〔C-96/40/90 + reflow (280℃）〕 ×3 No blister No blister

The above data are our actual values and not assured values.

■Test condition
・Reflow temperature condition: Peak temperature: 280oC (70 seconds at not less than 220oC)
・Treatment condition: C-96/40/90 + reflow
・Test sample (4-layer plate)
External layer’s copper foil: 18 μm
Prepreg: 7628 type
Core material: 0.2mm 35/35 μm (B/O)
Prepreg: 7628 type
(External layer’s copper foil etching)
Size: 80 mm x 160 mm
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3-（3） Heat resistance

MEW Confidential

Better than A-company’s halogen-free material

and standard FR-4
■Evaluation sample Board thickness: 1.6 mm Copper foil: 18/18 μm
Halogen-free epoxy A-company’s
Our standard FR-4
R-1566 halogen-free FR-4

Oven heat No blister after No blister after No blister after

resistance 60 minutes at 245℃ 60 minutes at 235℃ 60 minutes at 240℃

T-260
Not less than 14min 13min
IPC-TM-650 120 min
T-288
22min 1min 1min
IPC-TM-650

The above data are our actual values and not assured values.
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4-（1） Iner layer’s peeling strength

MEW Confidential

Not less than 3 times as strong as A-company’s

halogen-free material (Black oxide treatment, MD treatment)
Black oxide treatment MD treatment
1.4 1.4
(MacDiarmid multi-bond) ■Evaluation sample
1.2 1.2
Measurement point of

（KN/m）
1.0 1.0
internal layer’s peeling
（KN/m）

0.8 0.8

0.6 0.6 PP：0.2㎜

0.4 0.4

0.2 0.2
Core ：0.2㎜
material 35/35μm
0.0 0.0
Halogen-free A-company’s Our standard Halogen-free A-company’s Our standard
epoxy halogen-free epoxy halogen-free PP：0.2㎜
FR-4 FR-4
R-1566 FR-4 R-1566 FR-4

CZ treatment (Mec company) Reduction treatment ■Internal layer treatment

1.2 1.2

1.0 1.0
（KN/m）

Black oxide treatment

（KN/m）

0.8 0.8

0.6 0.6 MD treatment

0.4 0.4
CZ treatment
0.2 0.2
Reduction treatment
0.0 0.0
Halogen-free A-company’s Our standard Halogen-free A-company’s Our standard
epoxy halogen-free FR-4 epoxy halogen-free FR-4
R-1566 FR-4 R-1566 FR-4

The above data are our actual values and not assured values.
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4-（2） Evolved gas analysis

MEW Confidential

Zero (0) emission of highly poisonous aniline

■Evaluation result (Detection graph) ■ Analysis method
Halogen-free epoxy
for multi-layer Head space GCMS analysis
Heat up 4 g of test material in
a sealed container for 120
minutes at 130oC, and analyze
the amount of evolved gas
by using GCMS.

What is aniline?
A-company’s ＣＡＳ Ｎｏ62-53-3
Aniline ■Classification of risk and harmful effect
halogen-free material
Classification title: Acute poisonous substances,
other poisonous substances
Harmful effect: Acrid to eyes. May also affect semen
and form hemoglobin. The harmful
effect may be increased by the use
of alcohol drinks.
Environmental effect: Beware of the affect on
fish and crustaceans, and
never release aniline into
the environment.

The above data are our actual values and not assured values.
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5-（1） Dielectric characteristics ①

MEW Confidential

■Frequency dependence (Room temperature)

Dk 1MHz～1.8GHz Dk 1GHz～10GHz
5.5 5.0
R-1566
5.0 R-1566
4.8
4.5
4.5
4.0 Standard FR-4
3.5
Standard FR-4 4.3

3.0 4.0
1
1M H z
500 1000
1000M H ｚ
1800
1800M H ｚ
（MHz） 0 1 2 3 4 5 6 8 10 （GHz）

Df Df
0.03 0.03
Standard FR-4
Standard FR-4
0.02 0.02

0.01 0.01
R-1566
R-1566
0.00 0.00
1
1M H z
500 1000
1000M H ｚ
1800
1800M H ｚ
（MHz） 0 1 2 3 4 5 6 8 10 （GHz）
Method of measurement: Volumetric method Method of measurement: Stripline resonator method
(Impedance/material analyzer method) (According to IPC TM-650 2.5.5.5)
(According to IPC TM-650 2.5.5.9)
The above data are our actual values and not assured values.
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5-（1） Dielectric characteristics ②

MEW Confidential

■Dielectric characteristics by the volume of resin (Halogen-free material R1566)

Dk Df
5.5 0.030

5.0
45％
0.020
4.5
εr tanδ
55％
70％
4.0
70％ 0.010
55％ 45％
3.5

3.0 0.000
0
1 500 1000
1000 1800 01 500 1000 1500 1800
Measurement frequency (MHz) Measurement frequency (MHz)

Method of measurement: Volumetric method

(Impedance/material analyzer method)
(According to IPC TM-650 2.5.5.9)
The above data are our actual values and not assured values.
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5-（1） Dielectric characteristics ③

MEW Confidential

■Temperature dependence ■Humidity dependence

1.8GHz Treatment at 60oC
Dk 1.8GHz Dk and the humidity of 90%
5.3 R-1566
5.0
R-1566 5.0

4.8

4.5 4.0 Standard FR-4

4.3 Standard FR-4
4.0 3.0
0 20 40 60 80 （℃） 0hr 300hr 500hr 1000hr

Df Df
0.03 0.03

Standard FR-4 Standard FR-4

0.02 0.02

0.01 0.01

R-1566 R-1566
0.00 0.00
0 20 40 60 80 （℃） 0hr 300hr 500hr 1000hr
Method of measurement: Volumetric method Method of measurement: Volumetric method
(Impedance/material analyzer method) (Impedance/material analyzer method)
(According to IPC TM-650 2.5.5.9) (According to IPC TM-650 2.5.5.9)
The above data are our actual values and not assured values.
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5-（2） CAF resistance

MEW Confidential

Achievement of 2000 hours with the application of 50V DC

at 85℃ and the relative humidity of 85%
■Evaluation result ■Evaluation sample
0.4㎜
1.E+14
Insulation resistance value (Ω)

0.8㎜
R-1566 （#7628×4
0.3㎜
1.E+13

Distance between
1.E+12 hole walls : 0.3 ㎜
Standard FR-4 Hole diameter : 0.4 ㎜
Board thickness: 0.8 ㎜
1.E+11
■Treatment condition

1.E+10 Applies 50 V DC
0 50 100 200 300 400 500 1000 1500 2000 for 1 minute at 85℃
Treatment time (h) and the relative
humidity of 85%.
The above data are our actual values and not assured values.
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5-（3） Through hole reliability

MEW Confidential

Not less than twice as good as standard FR-4

■Evaluation result ■Evaluation sample
0.7㎜

160cycles
160 1.6㎜
（#7629×8）
0.57㎜

120

80 70cycles
■Treatment condition

40 20℃（Water） 10秒

0 260℃（Oil） 10秒
Halogen-free epoxy Our standard
R-1566 FR-4

The above data are our actual values and not assured values.
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6-（1） Drilling processability

MEW Confidential

Equivalent to standard FR-4

■Evaluation result ■Evaluation sample
Cu：18μm
2.2m /m in PP：0.1㎜
Feed speed 2.6m /m in 3.0m /m in
[S tandard] Core ：0.2㎜ （7628×
Standard Standard Standard material 18/18μm
B ase m aterial to be used R -1566 FR -4 R -1566 FR -4 R -1566 FR -4 PP：0.1㎜
Core ：0.2㎜ （7628×
A ccuracy of material 18/18μm
hole location Average+3σ 50 48 47 46 46 46 PP：0.1㎜
Cu：18μm
*1 (μm ) Maximum 60 57 60 60 58 60
■Test condition
H ole w all roughness Average 11.0 11.1 10.9 12.0 10.8 11.1 D rill to be u se d 　U n io n to o l
E 8 4 3 D iam e te r:0 .2 5 m m ,
L e n gth :4 .1 m m
(45o bias) (μm ) Maximum 20.0 25.0 22.5 25.0 20.0 22.5 N u m be r o f ro tatio n 　1 2 1 krpm
N u m be r o f pu n c h in g 　3 0 0 0 h o le s
S tac kable
W ear-out ratio of drill bit (%) 60 57 55 50 49 47 n u m be r o f sh e e t
　3 sh e e ts
F e e d spe e d 　2 .2 m / m in （1 8 .3 μm / re v）
　2 .6 m / m in （2 1 .7 μm / re v）
*1 The amount of deviation of a hole on a third substrate from the set position 　3 .0 m / m in （2 5 .0 μm / re v）
U ppe r bo ard 　L E 3 0 0
L o w e r bo ard 　B akin g bo ard
S te p drillin g 　N il

The above data are our actual values and not assured values. B u sh diam e te r 　φ3 .1 7 5 ㎜
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6-（2） Punching processability

MEW Confidential

Better than A-company’s halogen-free material

and equivalent to standard FR-4
Halogen-free epoxy A-company’s
Our standard FR-4
R-1566 halogen-free FR-4

Surface
photograph
Punching
quality

1.6 mm
at normal
temperatures
Cross
-sectional
photograph

Length
of crack
0.7 mm 1.3 mm 0.7 mm
The above data are our actual values and not assured values.
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6-（3） Example of molding condition

MEW Confidential

The molding condition is equivalent to our standard FR-4.

200
Platen temperature (170 to 180℃)
180
↑
Product temperature
(Not less than 50 minutes
Temperature (℃)

130 at 160℃)
← Temperature increase speed
100 (1.5 to 2.5℃ per minute)

Molding pressure 30kgf/cm2

(2.9MPa)

20 ↑10kgf/cm2 20～30minute
(1.0MPa)
30 60
Molding time (Minute)
4-layer board
Board thickness 1.6 mm
Vacuum max. 100torr(13.3kPa) Number of sheets of
stage internal molding :10Boards
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7-（1） Standard characteristics ①

MEW Confidential

Physical characteristics ①
Item Condition Halogen-free epoxy Our standard FR-4
R-1566
TMA 145 140
Tg（℃） DSC 148 140
DMA 180 155
Coefficient of X Dilatometric 10～ 14 10～14
thermal expansion Y method 12～ 16 12～16
（CTE） Z α1 TMA 40 65
×10-6/℃ α2 method 180 270
Modulus of flexural Vertical 2400 2300
25℃
（kN/cm2） Horizontal 2200 2100
Poisson’s ratio 50℃ 0.2 0.2
Thermal conductivity(w/m℃) 25℃ 0.62 0.38
Specific heat(J/kg℃) 950 920

The above data are our actual values and not assured values.
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7-（1） Standard characteristics ②

MEW Confidential

Physical characteristics ②

Halogen-free epoxy
Item Condition
R-1566
Our standard FR-4
Peel strength External layer Normal 25℃ 1.47 1.57
（kN/m） （18μm） condition 180℃ 0.60 0.41
Flame resistance UL94 94V-0 94V-0
Dimensional variation ratio E-1.0/170 Vertical -0.0215 -0.0140
(0.8 mm) Horizontal -0.0231 -0.0193
Water absorption rate（1.6mm） E-24/50+D-24/23 0.06 0.06
Ultraviolet permeability 350nm 0.58 26.97
(0.2 mm) 420nm 22.54 42.19

The above data are our actual values and not assured values.
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7-（1） Standard characteristics ③

MEW Confidential

Electric characteristics
Halogen-free epoxy
Item Condition R-1566
Our standard FR-4
Dk　* 1MHz 4.95 4.57
（
1MHz） 1GHz 4.70 4.20
Df　* 1MHz 0.014 0.020
（
1MHz） 1GHz 0.011 0.015
Volume resistance Normal condition 5 × 107 5 × 10
7

Surface resistance Normal condition 5 × 108 5 × 10

8

Insulation resistance Normal condition 1 × 108 1 × 10

8

Flatwise dielectric
Normal condition 64 70
strength(kV/㎜)
Edgewise dielectric
Normal condition 49 52
strength(kV/㎜)
Tracking resistance
IEC method 500 200
CTI value
* The thickness of a test piece is 0.2 mm.

The above data are our actual values and not assured values.
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7-（2） Specifications ①
MEW Confidential

Copper-clad laminate: R-1566

Nominal thickness Copper foil Structure (Glass cloth) Thickness tolerance
（㎜）　　　*1 （㎜）
0.06 1080×1 ±0.02
0.1 2116×1 ±0.03
7628×1（K type）
0.2 ±0.04
2116×2
0.3 12μm 1501×1 ±0.05
0.4 18μm 7628×2 ±0.06
7628×2
0.5 35μm ±0.07
2116×1
0.6 70μm 7628×3 ±0.08
0.8 7628×4 ±0.09
1.0 7628×5（Copper foil of 35μm） ±0.11
1.2 7628×6（Copper foil of 35μm） ±0.11
1.6 7628×8（Copper foil of 35μm） ±0.13

* The values of less than 0.8 mm do not include the thickness of copper foil,
and those of not less than 0.8 mm show the total thickness including the thickness of copper foil.
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7-（2） Specifications ②
MEW Confidential

Prepreg: R-1551
N om inal Style of P repreg P roperties　
R esin V olatile
thickness glass cloth C lassificat G eltim e R esin fl
content content
（
㎜） (Suffix) （％） （％） （秒）*1 （％）
N ot
0.06 1080 GG 71±5 m ore than 135±45 43±7
0.85

0.10 2116 GG 55±3 135±45 33±7

N ot
0.15 1501 GG 54±3 m ore than 135±45 33±7
0.70

0.2 7628 GG 53±3 110±45 33±7

* 1 When measured at 170oC.